Photoresist Use in Semiconductor Manufacturing [electronic resource] /
Organisation for Economic Co-operation and Development.
Organisation for Economic Co-operation and DevelopmentContributor
Organisation for Economic Co-operation and DevelopmentContent Provider
Paris : OECD Publishing,
2014.
This OECD Emission Scenario Document (ESD) provides information on the sources, use patterns, and potential release pathways of chemicals used in the semiconductor manufacturing industry. The document presents standard approaches for estimating environmental releases of and occupational exposures to additives and components used in photoresist formulations.  
Explanatory Notes 7 -Purpose and background 7 -How to use this document 7 -Coverage and Methodology 8 -How this document was developed 9 1.  Industry Summary and Background 16 -1.1 Introduction to Semiconductors 16 -1.2 Manufacture of Semiconductors 16 -1.3 Overview of Photoresists 18 -1.4 Overview of the Semiconductor Manufacturing Industry 19 2 Process Description 20 -2.1 Photolithography 22 -2.2 Etching 26 -2.3 Chemicals Used in Photolithography and Etching Process Steps 28 -2.4 Routine Equipment Cleaning and Maintenance 29 -2.5 Transfer of the Wafer Between Process Steps and Potential Nonroutine Releases / Exposures 30 3. Overall Approach and General Facility Estimates 31 -3.1 Introduction to the General Facility Estimates 31 -3.2 Daily Use Rate of Photoresist (Qphoto_day) 32 -3.3 Number of Days of Photoresist Application (TIMEapply_days) 34 -3.4 Daily Use Rate of Chemical of Interest (Qchem_day) 34 -3.5 Number of Sites (Nsites) 35 -3.6 Annual Number of Photoresist Containers Emptied per Facility (Ncont_site_yr) 37 4 Environmental Release Assessments 39 -4.1 Control Technologies 40 -4.2 Container Residues Released to Water, Incineration, or Landfill (Release 1) 40 -4.3 Equipment Cleaning Residues Released to Incineration or Landfill (Release 2) 42 -4.4 Excess Photoresist (Spin-off) Released to Incineration (Release 3) 43 -4.5 Residual Photoresist Contained in Waste Developer Solution Released to Water (Release 4) 44 -4.6 Residual Photoresist Contained in Waste Etching and Stripping Solutions Released to Water (Release 5) 44 5 Occupational Exposure Assessments 46 -5.1 Personal Protective Equipment  47 -5.2 Number of Workers Exposed Per Site 48 -5.3 Dermal Exposure to Liquid Photoresist During Change-out of Empty Photoresist Containers (Exposure A) 51 -5.4 Dermal Exposure to Liquid Photoresist During Cleaning/Handling Empty Photoresist Containers (Exposure B) 52 -5.5 Dermal Exposure to Residual Photoresist During Routine Equipment Cleaning/Maintenance (Exposure C) 53 -5.6. Dermal Exposure to Liquid Photoresist During change-out of Excess (Spun-off) Phtoresist Collections Containers (Exposure D) 54 -5.7. Dermal Exposure to Residual Photoresist during Change-out of Waste Solvent Collection Containter (Exposure E) 55 -5.8 Dermal Exposure to Photoresist Coating the Wafer During Non-routine Transfer of Contaminated Wafers 57 6. Sample Calculations 58 -6.1. General Facility Estimates 58 -6.2 Release Assessments 59 -6.3 Occupational Exposure Assessments 61 7. Data Gaps/Uncertainties and Future Work 64 8. References 66 Appendix A. Estimation Equation Summary and Default Parameter Values 69 Appendix B. Background Information and Equations/Defaults for the Standard EPS Environmental Release and Worker Exposure Models 75      
This OECD Emission Scenario Document (ESD) provides information on the sources, use patterns, and potential release pathways of chemicals used in the semiconductor manufacturing industry. The document presents standard approaches for estimating environmental releases of and occupational exposures to additives and components used in photoresist formulations.  
Bibliographic Level Mode of Issuance: Monograph
Environment
Electrical & Computer Engineering
Engineering & Applied Sciences
Electrical Engineering