Transactions on Engineering Technologies [electronic resource] : Special Volume of the World Congress on Engineering 2013 /
Yang, Gi-Chul.editor.
Ao, Sio-Iong.editor.
Gelman, Len.editor.
This book contains revised and extended research articles written by prominent researchers participating in the international conference on Advances in Engineering Technologies and Physical Science (London, U.K., 3-5 July, 2013).  Topics covered include mechanical engineering, bioengineering, internet engineering, image engineering, wireless networks, knowledge engineering, manufacturing engineering, and industrial applications. The book offers state of art of tremendous advances in engineering technologies and physical science and applications, and also serves as an excellent reference work for researchers and graduate students working with/on engineering technologies and physical science.
Description based upon print version of record.
""Preface""; ""Contents""; ""1 Viscous Fingering of Reversible Reactive Flows in Porous Media""; ""Abstract""; ""1â€?Introduction""; ""2â€?Mathematical Model""; ""2.1 Physical Problem""; ""2.2 Governing Equations""; ""2.3 Numerical Techniques""; ""3â€?Result""; ""3.1 Numerical Code Validation""; ""3.2 Concentration ISO-Surfaces Contours""; ""3.2.1 Effects of the Chemical Reaction""; ""3.2.2 Stable or Neutrally Stable Initial Interface (Rb le 0)""; ""3.2.3 Unstable Initial Interface (Rb greaterthan 0)""; ""4â€?Conclusion""; ""Acknowledgements""; ""References""
""2 Prediction of Thermal Deformation for a Ball Screw System Under Composite Operating Conditions""""Abstract""; ""1â€?Introduction""; ""2â€?Description of Ball Screw System""; ""3â€?Computational Analysis""; ""4â€?Experimental Measurements""; ""5â€?Results and Discussion""; ""6â€?Conclusions""; ""Acknowledgment""; ""References""; ""3 Shear Strength and Fracture Surface Studies of Ball Grid Array (BGA) Flexible Surface-Mount Electronics Packaging Under Isothermal Ageing""; ""Abstract""; ""1â€?Introduction""; ""2â€?Materials and Methods""; ""3â€?Results and Discussion""
""3.1 Effect of Isothermal Ageing on the Shear Strengths of BGA Solder Joints""""3.2 Effect of Ageing Temperature on Shear Strengths of BGA Solder Joints""; ""3.3 Study of Solder Ball Shear Fractures""; ""4â€?Conclusion""; ""References""; ""4 Optimum Parameters for Machining Metal Matrix Composite""; ""Abstract""; ""1â€?Introduction""; ""2â€?Machine Test and Set-up""; ""3â€?Results and Discussion""; ""4â€?Conclusion and Future Work""; ""References""; ""5 Base Isolation Testing Via a Versatile Machine Characterized by Robust Tracking""; ""Abstract""; ""1â€?Introduction""
""2â€?The Earthquake Simulator""""3â€?Nominal Model Derivation""; ""4â€?Sliding Mode Control""; ""5â€?Simulation and Experimental Results""; ""6â€?Conclusion""; ""References""; ""6 Active Vibration Isolation Via Nonlinear Velocity Time-Delayed Feedback""; ""Abstract""; ""1â€?Introduction""; ""2â€?Multi-scale Analysis""; ""3â€?Local Stability Analysis""; ""4â€?Stable Feedback Parameter Combinations""; ""5â€?Some Simple Illustrations on Transmissibility""; ""6â€?Conclusions""; ""References""; ""7 Project of Mechanical VVA Systems for Motorcycle Engines""; ""Abstract""; ""1â€?Introduction""
""2â€?A New Mechanical VVA System""""3â€?Mathematical Model""; ""4â€?Results of the Preliminary System""; ""5â€?3 and 4 Elements VVA Systems""; ""6â€?The Problem of Accelerations""; ""7â€?4 Elements VVA System Design and Performance""; ""8â€?Test Bench""; ""9â€?Conclusion and Future Work""; ""References""; ""8 Performance Evaluation of the Valveless Micropump with Piezoelectric Actuator""; ""Abstract""; ""1â€?Introduction""; ""2â€?Design""; ""3â€?Fabrication""; ""3.1 Piezoelectric Actuator""; ""3.2 Chamber and Vibration Plate""; ""3.3 Assembly""; ""4â€?Experimental Apparatus""
""5â€?Theoretical Analysis""
Includes bibliographical references and indexes.
This book contains revised and extended research articles written by prominent researchers participating in the international conference on Advances in Engineering Technologies and Physical Science (London, U.K., 3-5 July, 2013).  Topics covered include mechanical engineering, bioengineering, internet engineering, image engineering, wireless networks, knowledge engineering, manufacturing engineering, and industrial applications. The book offers state of art of tremendous advances in engineering technologies and physical science and applications, and also serves as an excellent reference work for researchers and graduate students working with/on engineering technologies and physical science.
Electrical engineering.
Computer organization.
Engineering.
Mathematical models.
Communications Engineering, Networks.
Computer Systems Organization and Communication Networks.
Engineering, general.
Mathematical Modeling and Industrial Mathematics.