Thermal Properties Of Epoxy Based Adhesive Reinforced With

The thermal property of epoxy as the binder in the Carbon Fiber (CF) composites, especially thermal conductivity is important to achieve the advance technology and to improve the performance of materials. Multiscale modeling including molecular dynamic (MD) modeling and micromechanical modeling is used to study the properties of neat Cycloaliphatic Epoxies (CE) and Graphene nanoplatelet (GNP)/CE with and without covalent functionalization. The thermal properties (glass-transition temperature, thermal expansion coefficient, and thermal conductivity) and mechanical properties of CE system are investigated by MD modeling using OPLS-All Atom force field. A unique crosslinking technique is developed to achieve the cured CE models which has the complex curing mechanism. The thermal conductivity and elastic modulus of CF/CE models are further calculated by using micromechanical modeling. The results are validated with the experiments which are in good agreement. GNP/CE nanocomposites models are established by MD with four different levels of GNP dispersion, namely, 1, 2, 3, and 4 layer(s) of graphene. The thermal conductivities of GNP/CE nanocomposites models are determined by Equilibrium MD (EMD) method. The thermal conductivities are randomized by arithmetic average and varied GNP volume fractions using micromechanics. The resultant thermal conductivities increase with the GNP volume fraction and the better dispersion which compared well with experiments. The 1-layered GNP/CE (perfectly dispersed) model gives the highest thermal conductivity. The covalently functionalized GNP (fGNP)/CE models are created by functionalizing carboxyl groups onto the single-layered GNP surfaces by MD modeling. The similar method for the pristine GNP/CE models is applied to obtain the effective thermal conductivities fGNP/CE composites. The predicted values suggest that the thermal conductivity decreases with increased functionalization on GNP due to the GNP defect. However, the thermal conductivities of fGNP/CE models are higher than the thermal conductivities of 2, 3, and 4-layer GNP/CE models which the experiment found that the functionalization improves the dispersion. The coefficients of linear thermal expansion (CLTE) of GNP/EPON862 system are studied with the similar work flow which the results show the improvement of CLTE regarding to GNP dispersion. Finally, the GNP aspect ratio is included to improve the micromechanical modeling for thermal conductivity. Mechanical, Morphological and Thermal Properties of Epoxy/multiwall Carbon Nanotube Nanocomposites This book contains 16 chapters. In the first part, there are 8 chapters describing new materials and analytic methods. These materials include chapters on gold nanoparticles and Sol-Gel metal oxides, nanocomposites with carbon nanotubes, methods of evaluation by depth sensing, and other methods. The second part contains 3 chapters featuring new materials with unique properties including optical non-linearities, new materials based on pulp fibers, and the properties of nano-filled polymers. The last part contains 5 chapters with applications of new materials for medical devices, anodes for lithium batteries, electroceramics, phase change materials and matrix active nanoparticles. Nanocomposites and Polymers with Analytical Methods In this study, recycled copper filled epoxy composites were characterized based on its mechanical, electrical and thermal properties. The effects of different particle sizes of recycled copper were filled with epoxy to investigate the effect of mechanical, electrical and thermal properties. Testing such as morphology, mechanical testing, coefficient of thermal expansion determination, thermogravimetric analysis and electrical conductivity measurement were done to study the properties of the composites. The particle size of recycled copper was determined by using particle size analysis. X-ray diffraction (XRD) analysis was performed in order to analyse the element of the recycled copper. Flexural test was carried out to investigate the flexural properties: flexural strength and flexural modulus of epoxy composites. Besides that, Vickers hardness and density testing were performed to study the physical properties of epoxy composites. Furthermore, coefficient of thermal expansion (CTE) analysis was carried out to investigate the thermal property of epoxy composites. The electrical property was performed in order to measure the electrical conductivity of epoxy composites.