Laminate integration platforms for millimeter-wave RoF photodiode modules

This thesis investigates the potential offered by cost-effective printed circuit technology (PCT) for the packaging of mm-wave photodiode (PD) modules, as an alternative to the commonly used integration approaches based on thin/ thick-films or co-fired ceramics. We will therefore analyze the limitations imposed by this technology, focusing on the loss mechanisms and the theoretical frequency limits due to the material properties of the laminates and the RF circuitry concepts, as well as limitations imposed by the resolution and tolerances achievable in the printed circuit board (PCB) manufacturing processes. For the RF circuitry design, we will investigate characteristics and performances of traditional planar transmission lines (PTL), in particular microstrips and grounded coplanar waveguides (GCPW), and innovative substrate integrated waveguides (SIW). We will show that via holes play a fundamental role in the RF circuitry design, as they ultimately decide the highest possible frequency, independently of other parameters like conductor and dielectric loss, or etching inaccuracies. In fact, it is found that they are vital to guarantee a correct functioning of both GCPW and SIW, by avoiding board resonances and interferences between different lines. We will show that the current PCB via-hole technology allows the development of circuits working up to at least the upper limit of the W-band. As conventional microstrips are subject to higher radiation in the mm-wave region, GCPWs will be preferred for practical applications, also by virtue of their other practical advantages, such as easily accessible ground planes, increased design freedom, and extended impedance range. We will thus introduce the first concept of mm-wave PD modules with rectangular waveguide (WR) output for E-band Radio-over-Fiber (RoF) applications based on PCT integration boards. A particular feature of the proposed integration approach, is that a photonic transmitter can conveniently be assembled without any mechanical modifications of the WR, using standard off-the-shelf WR components, therefore simplifying the assembly process and reducing the cost of the module. We will also show that the availability of laminates with low moisture absorption as dielectric carrier furthermore opens up the possibility to develop quasi-hermetic packages without the need of dedicated radomes to seal the WR opening. The developed PD module will be used in mm-wave RoF demonstrators in order to prove the suitability of our approach for the development of commercial communication systems: We will be able to show a successful, error-free, 1-Gb/s, wireless connectivity in the 70-GHz communication band, with a power penalty limited to 1.5 dB. We will also present several additional prototypes, which include dedicated, on-board, biasing circuits, to allow integration of in-house-developed PDs and commercial amplifiers, and other solutions to reduce the loss of the signal power. In order to overcome the shortcomings of microstrips and GCPWs, such as unwanted radiation and increased power dissipation due to high current densities, we will then introduce for the first time the PCB SIW in the packaging of mm-wave photonic transmitters. The properties and advantages of this innovative transmission line in terms of low loss and high integration will be investigated and assessed, showing that its unique configuration allows a superior control of radiation and interferences, and drastically reduces losses. This suggests its use in all mm-wave systems where long on-board interconnects are required. A new integration approach for the development of quasi-hermetic PD modules with in-package antennas based on PCB SIW will thus be presented, focusing in particular on non-directive data distribution systems. It will be shown that compact, low-loss, and quasi-hermetic packaging solutions can conveniently be designed making use of the PCB SIW. We will furthermore introduce innovative GCPW-to-SIW transitions necessary for the integration of PDs on SIW platforms. Theoretically predicted performances will be compared with experimentally determined performances for a specifically optimized 60-GHz band GCPW-to-SIW transition. Also, the design and optimization of mm-wave antennas for indoor 60 GHz RoF systems will be presented, testing their performance against PCB manufacture inaccuracies. Finally, we will show an example of a fully characterized integration platform for PD modules, confirming the suitability of PCB SIW for the development of future, low-loss, and cost-effective photonic RoF transmitters.