Position: Senior BSP Engineer (IRC107982)
Company: GlobalLogic
Experience required: 3y
English level: intermediate

By constantly evolving to meet the rapidly changing industry requirements, our Client is producing high-quality products that enhance comfort and safety for drivers globally. The Company is responsible for designing and manufacturing its products for multiple automotive OEMs worldwide, including leaders in the automotive industry.

Within the project team, you will participate in the design and development of the innovative Head-Up display for the major OEM vendor. Within your project assignments, you will have a chance to get familiar and contribute to building the art solution's state using cutting-edge technologies used in the automotive industry.

**Requirements**

- 3+ years of experience in SW engineering
- Experience in Qualcomm S820A/SDA8155/SDA6155
- Experience in QCM little kernel and bootloaders
- Experience in OP-TEE and/or QTEE will be a major plus
- 3+ years of overall experience in Linux OS
- 3+ years of experience in Linux kernel
- Experience in Device Tree development
- Experience in Yocto meta-layers and receipts
- Experience in development for embedded systems
- Upper-Intermediate English or above

**Responsibilities**

- Bring-up Linux BSP on custom board
- Configuring Yocto to provide all required drivers, services, and tool required for the project
- Bug fixing and fine-tuning Development custom distro using Yocto meta-layers
- Integration 3rd party services
- Development project documentation using ASPICE templates