High-Throughput Monolithic 3D Multi-bit Vertical 2TnF Ferroelectric Gain Cells for Computing-in-Memory to Accelerate Attention Mechanism in Transformer
Year: 2025
Type: article
Topic: Ferroelectric and Negative Capacitance Devices
Authors and affiliations:
raw_author_name: Mingcheng Shi
raw_affiliation_strings: Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University,School of Integrated Circuits,Beijing,China
raw_author_name: Yi Ding
raw_affiliation_strings: Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University,School of Integrated Circuits,Beijing,China
raw_author_name: Yuyan Wang
raw_affiliation_strings: Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University,School of Integrated Circuits,Beijing,China
raw_author_name: Bowen Shen
raw_affiliation_strings: Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University,School of Integrated Circuits,Beijing,China
raw_author_name: Benjamin Yang
raw_affiliation_strings: Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University,School of Integrated Circuits,Beijing,China
raw_author_name: Ruofei Hu
raw_affiliation_strings: Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University,School of Integrated Circuits,Beijing,China
raw_author_name: Yiming Zhou
raw_affiliation_strings: Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University,School of Integrated Circuits,Beijing,China
raw_author_name: Jiaming Li
raw_affiliation_strings: Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University,School of Integrated Circuits,Beijing,China
raw_author_name: Wen Sun
raw_affiliation_strings: Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University,School of Integrated Circuits,Beijing,China
raw_author_name: Yuankun Li
raw_affiliation_strings: Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University,School of Integrated Circuits,Beijing,China
raw_author_name: Eunhye Baek
raw_affiliation_strings: Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University,School of Integrated Circuits,Beijing,China
raw_author_name: Heyi Huang
raw_affiliation_strings: Institute of Microelectronics of the CAS,State Key Laboratory of Fabrication Technologies for Integrated Circuits,Beijing,China
raw_author_name: Qingtian Zhang
raw_affiliation_strings: Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University,School of Integrated Circuits,Beijing,China
raw_author_name: Bin Gao
raw_affiliation_strings: Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University,School of Integrated Circuits,Beijing,China
raw_author_name: He Qian
raw_affiliation_strings: Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University,School of Integrated Circuits,Beijing,China
raw_author_name: Jianshi Tang
raw_affiliation_strings: Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University,School of Integrated Circuits,Beijing,China
raw_author_name: Huaqiang Wu
raw_affiliation_strings: Beijing Advanced Innovation Center for Integrated Circuits, Tsinghua University,School of Integrated Circuits,Beijing,China