Wafer-Scale Low-Power 2D CFET Logic Enabled by Single-Crystal Dielectrics: Experimental Demonstration and 1-nm-Node Projection
Year: 2025
Type: article
Topic: Semiconductor materials and devices
Authors and affiliations:
raw_author_name: Ni Yang
raw_affiliation_strings: Nexstrom Pte. Ltd.,Singapore,Singapore
raw_author_name: Yu-Cheng Lu
raw_affiliation_strings: National Taiwan University,Graduate School of Advanced Technology,Taipei,Taiwan
raw_author_name: Ji Zhang
raw_affiliation_strings: University of New South Wales,School of Materials Science and Engineering,Sydney,Australia
raw_author_name: Zeheng Wang
raw_affiliation_strings: CSIRO,Manufacturing,Australia
raw_author_name: Yu-Ming Chang
raw_affiliation_strings: Nexstrom Pte. Ltd.,Singapore,Singapore
raw_author_name: Fangyuan Zheng
raw_affiliation_strings: University of Hong Kong,Department of Mechanical Engineering,Hong Kong,China
raw_author_name: Lingqi Li
raw_affiliation_strings: National University of Singapore,Department of Electrical and Computer Engineering,Singapore,Singapore
Nexstrom Pte. Ltd.,Singapore,Singapore
raw_author_name: Haomin Liu
raw_affiliation_strings: National University of Singapore,Department of Materials Science and Engineering,Singapore,Singapore
raw_author_name: Lin-Yun Huang
raw_affiliation_strings: Nexstrom Pte. Ltd.,Singapore,Singapore
raw_author_name: Chenyang Li
raw_affiliation_strings: Nexstrom Pte. Ltd.,Singapore,Singapore
raw_author_name: Chengdong Yao
raw_affiliation_strings: Nexstrom Pte. Ltd.,Singapore,Singapore
raw_author_name: Pengfei Yang
raw_affiliation_strings: University of Hong Kong,Department of Mechanical Engineering,Hong Kong,China
raw_author_name: Wanying Li
raw_affiliation_strings: University of Hong Kong,Department of Mechanical Engineering,Hong Kong,China
raw_author_name: Wanqing Meng
raw_affiliation_strings: National University of Singapore,Department of Materials Science and Engineering,Singapore,Singapore
raw_author_name: Pak San Yip
raw_affiliation_strings: University of Hong Kong,Department of Mechanical Engineering,Hong Kong,China
raw_author_name: Dong-Keun Ki
raw_affiliation_strings: University of Hong Kong,Department of Physics,Hong Kong,China
raw_author_name: Kah-Wee Ang
raw_affiliation_strings: National University of Singapore,Department of Electrical and Computer Engineering,Singapore,Singapore
raw_author_name: Geng-Chiau Liang
raw_affiliation_strings: National Yang-Ming Chiao Tung University,Industry Academia Innovation School,Hsinchu,Taiwan
raw_author_name: Yi Wan
raw_affiliation_strings: National University of Singapore,Department of Materials Science and Engineering,Singapore,Singapore
raw_author_name: Sean Li
raw_affiliation_strings: University of New South Wales,School of Materials Science and Engineering,Sydney,Australia
raw_author_name: Vita Pi-Ho Hu
raw_affiliation_strings: National Taiwan University,Graduate School of Advanced Technology,Taipei,Taiwan
raw_author_name: Jing-Kai Huang
raw_affiliation_strings: Nexstrom Pte. Ltd.,Singapore,Singapore
raw_author_name: Lain-Jong Li
raw_affiliation_strings: National University of Singapore,Department of Electrical and Computer Engineering,Singapore,Singapore
Nexstrom Pte. Ltd.,Singapore,Singapore