Unveiling the Myths of Co‐Deposition of Hole Conductors and Perovskite Layers
Year: 2025
Type: article
Language: en
Topic: Perovskite Materials and Applications
Authors and affiliations:
raw_author_name: Xi Yang
raw_affiliation_strings: Department of Electrical and Electronic Engineering The Hong Kong Polytechnic University Hung Hom, Kowloon Hong Kong 999077 China
School of Electronic Science and Technology Eastern Institute of Technology  Ningbo 315200 China
Department of Electrical and Electronic Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong, 999077 China
School of Electronic Science and Technology, Eastern Institute of Technology, Ningbo, 315200 China
raw_author_name: Kaifeng Jing
raw_affiliation_strings: Department of Electrical and Electronic Engineering The Hong Kong Polytechnic University Hung Hom, Kowloon Hong Kong 999077 China
Department of Electrical and Electronic Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong, 999077 China
raw_author_name: Hengyu Zhang
raw_affiliation_strings: State Key Laboratory of Silicon and Advanced Semiconductor Materials &amp; School of Materials Science and Engineering Zhejiang University  Hangzhou 310027 China
State Key Laboratory of Silicon and Advanced Semiconductor Materials &amp; School of Materials Science and Engineering Zhejiang University Hangzhou 310027 China
raw_author_name: Qianyi Li
raw_affiliation_strings: Department of Electrical and Electronic Engineering The Hong Kong Polytechnic University Hung Hom, Kowloon Hong Kong 999077 China
Department of Electrical and Electronic Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong, 999077 China
raw_author_name: Dongyang Li
raw_affiliation_strings: Department of Electrical and Electronic Engineering The Hong Kong Polytechnic University Hung Hom, Kowloon Hong Kong 999077 China
Department of Electrical and Electronic Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong, 999077 China
raw_author_name: Patrick W. K. Fong
raw_affiliation_strings: Department of Electrical and Electronic Engineering The Hong Kong Polytechnic University Hung Hom, Kowloon Hong Kong 999077 China
Department of Electrical and Electronic Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong, 999077 China
raw_author_name: Zhenyi Ni
raw_affiliation_strings: State Key Laboratory of Silicon and Advanced Semiconductor Materials &amp; School of Materials Science and Engineering Zhejiang University  Hangzhou 310027 China
State Key Laboratory of Silicon and Advanced Semiconductor Materials &amp; School of Materials Science and Engineering Zhejiang University Hangzhou 310027 China
raw_author_name: Zi Jing Wong
raw_affiliation_strings: School of Electronic Science and Technology Eastern Institute of Technology  Ningbo 315200 China
School of Electronic Science and Technology, Eastern Institute of Technology, Ningbo, 315200 China
raw_author_name: Gang Li
raw_affiliation_strings: Department of Electrical and Electronic Engineering The Hong Kong Polytechnic University Hung Hom, Kowloon Hong Kong 999077 China
Photonic Research Institute (PRI) Research Institute of Smart Energy (RISE) Research Institute for Advanced Manufacturing (RIAM) The Hong Kong Polytechnic University  Hung Hom Hong Kong Kowloon 999077 China
Department of Electrical and Electronic Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong, 999077 China
raw_author_name: Guang Yang
raw_affiliation_strings: Department of Electrical and Electronic Engineering The Hong Kong Polytechnic University Hung Hom, Kowloon Hong Kong 999077 China
Photonic Research Institute (PRI) Research Institute of Smart Energy (RISE) Research Institute for Advanced Manufacturing (RIAM) The Hong Kong Polytechnic University  Hung Hom Hong Kong Kowloon 999077 China
Photonic Research Institute (PRI), Research Institute of Smart Energy (RISE), Research Institute for Advanced Manufacturing (RIAM), The Hong Kong Polytechnic University, Hung Hom, Hong Kong, Kowloon, 999077 China