Thermal Interference Analysis and Compensation for Monolithic Integrated Thermopile Infrared Sensors
Year: 2025
Type: article
Topic: Transition Metal Oxide Nanomaterials
Authors and affiliations:
raw_author_name: Jiagen Cheng
raw_affiliation_strings: School of Electronic Information and the Smart Microsensors and Microsystems Engineering Research Center, Ministry of Education, Hangzhou Dianzi University, Hangzhou, China
Smart Microsensor and Microsystem Engineering Research Center of Ministry of Education, School of Electronic Information, Hangzhou Dianzi University, Hangzhou, China
raw_author_name: Wanli Jiang
raw_affiliation_strings: Shanghai Ye Ying Microelectronics Technology Company Ltd., Xuhui, Shanghai, China
Shanghai Ye Ying Microelectronics Technology Co., Ltd, 5th Floor, Building 16, No. 481 Guiping Road, Xuhui District, Shanghai, China
raw_author_name: Chenxi Yue
raw_affiliation_strings: School of Electronic Information and the Smart Microsensors and Microsystems Engineering Research Center, Ministry of Education, Hangzhou Dianzi University, Hangzhou, China
Smart Microsensor and Microsystem Engineering Research Center of Ministry of Education, School of Electronic Information, Hangzhou Dianzi University, Hangzhou, China
raw_author_name: Weihuang Yang
raw_affiliation_strings: School of Electronic Information and the Smart Microsensors and Microsystems Engineering Research Center, Ministry of Education, Hangzhou Dianzi University, Hangzhou, China
Smart Microsensor and Microsystem Engineering Research Center of Ministry of Education, School of Electronic Information, Hangzhou Dianzi University, Hangzhou, China
raw_author_name: Yu Gao
raw_affiliation_strings: School of Electronic Information and the Smart Microsensors and Microsystems Engineering Research Center, Ministry of Education, Hangzhou Dianzi University, Hangzhou, China
Smart Microsensor and Microsystem Engineering Research Center of Ministry of Education, School of Electronic Information, Hangzhou Dianzi University, Hangzhou, China
raw_author_name: Chaoran Liu
raw_affiliation_strings: School of Electronic Information and the Smart Microsensors and Microsystems Engineering Research Center, Ministry of Education, Hangzhou Dianzi University, Hangzhou, China
Smart Microsensor and Microsystem Engineering Research Center of Ministry of Education, School of Electronic Information, Hangzhou Dianzi University, Hangzhou, China
raw_author_name: Dehui Xu
raw_affiliation_strings: Shanghai Ye Ying Microelectronics Technology Company Ltd., Xuhui, Shanghai, China
Shanghai Ye Ying Microelectronics Technology Co., Ltd, 5th Floor, Building 16, No. 481 Guiping Road, Xuhui District, Shanghai, China
raw_author_name: Wanghuai Xu
raw_affiliation_strings: Department of Mechanical Engineering, Hong Kong Polytechnic University, Hong Kong, China
Department of Mechanical Engineering, Hong Kong Polytechnic University, No. 11 Yuk Choi Road, HONG KONG, China
raw_author_name: Linxi Dong
raw_affiliation_strings: School of Electronic Information and the Smart Microsensors and Microsystems Engineering Research Center, Ministry of Education, Hangzhou Dianzi University, Hangzhou, China
Smart Microsensor and Microsystem Engineering Research Center of Ministry of Education, School of Electronic Information, Hangzhou Dianzi University, Hangzhou, China