Reusable and High‐Precision Soft Templates for High‐Fidelity Microscale Patterning of Terahertz Metasurface and Beyond
Year: 2025
Type: article
Language: en
Topic: Metamaterials and Metasurfaces Applications
Authors and affiliations:
raw_author_name: Junxiao Liu
raw_affiliation_strings: School of Electronic Science and Engineering, and Engineering Center of Integrated Optoelectronic &amp; Radio Meta‐chips University of Electronic Science and Technology of China  Chengdu 611731 China
School of Electronic Science and Engineering, and Engineering Center of Integrated Optoelectronic &amp; Radio Meta‐chips University of Electronic Science and Technology of China Chengdu 611731 China
raw_author_name: Yuanpeng Li
raw_affiliation_strings: Institute of Electronic Engineering China Academy of Engineering Physics  Mianyang 621000 China
School of Electronic Science and Engineering, and Engineering Center of Integrated Optoelectronic &amp; Radio Meta‐chips University of Electronic Science and Technology of China  Chengdu 611731 China
Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang, 621000 China
raw_author_name: Yuanpeng Li
raw_affiliation_strings: Institute of Electronic Engineering China Academy of Engineering Physics  Mianyang 621000 China
School of Electronic Science and Engineering, and Engineering Center of Integrated Optoelectronic &amp; Radio Meta‐chips University of Electronic Science and Technology of China  Chengdu 611731 China
School of Electronic Science and Engineering, and Engineering Center of Integrated Optoelectronic &amp; Radio Meta‐chips University of Electronic Science and Technology of China Chengdu 611731 China
raw_author_name: Yuanpei Li
raw_affiliation_strings: Institute of Electronic Engineering China Academy of Engineering Physics  Mianyang 621000 China
School of Electronic Science and Engineering, and Engineering Center of Integrated Optoelectronic &amp; Radio Meta‐chips University of Electronic Science and Technology of China  Chengdu 611731 China
School of Electronic Science and Engineering, and Engineering Center of Integrated Optoelectronic &amp; Radio Meta‐chips University of Electronic Science and Technology of China Chengdu 611731 China
raw_author_name: Yuanpei Li
raw_affiliation_strings: Institute of Electronic Engineering China Academy of Engineering Physics  Mianyang 621000 China
School of Electronic Science and Engineering, and Engineering Center of Integrated Optoelectronic &amp; Radio Meta‐chips University of Electronic Science and Technology of China  Chengdu 611731 China
School of Electronic Science and Engineering, and Engineering Center of Integrated Optoelectronic &amp; Radio Meta‐chips University of Electronic Science and Technology of China Chengdu 611731 China
raw_author_name: Yunxin Tan
raw_affiliation_strings: School of Electronic Science and Engineering, and Engineering Center of Integrated Optoelectronic &amp; Radio Meta‐chips University of Electronic Science and Technology of China  Chengdu 611731 China
Analysis and Testing Center, University of Electronic Science and Technology of China, Chengdu, 611731 China
raw_author_name: Qiye Wen
raw_affiliation_strings: School of Electronic Science and Engineering, and Engineering Center of Integrated Optoelectronic &amp; Radio Meta‐chips University of Electronic Science and Technology of China  Chengdu 611731 China
School of Electronic Science and Engineering, and Engineering Center of Integrated Optoelectronic &amp; Radio Meta‐chips University of Electronic Science and Technology of China Chengdu 611731 China
raw_author_name: Tingchuan Zhou
raw_affiliation_strings: Analysis and Testing Center University of Electronic Science and Technology of China  Chengdu 611731 China
raw_author_name: Tianlong Wen
raw_affiliation_strings: School of Electronic Science and Engineering, and Engineering Center of Integrated Optoelectronic &amp; Radio Meta‐chips University of Electronic Science and Technology of China  Chengdu 611731 China