Dynamic-Depleted Transistor Empowering Logic-in-Coding Computing
Year: 2025
Type: article
Language: en
Topic: Ferroelectric and Negative Capacitance Devices
Authors and affiliations:
raw_author_name: Hang Zhao
raw_affiliation_strings: Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials
Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies
University of Science and Technology Beijing
raw_author_name: Wenhui Tang
raw_affiliation_strings: Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials
Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies
University of Science and Technology Beijing
Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing 100083, China
raw_author_name: Xiaofu Wei
raw_affiliation_strings: Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials
Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies
University of Science and Technology Beijing
Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing 100083, China
raw_author_name: Li Gao
raw_affiliation_strings: Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials
Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies
University of Science and Technology Beijing
raw_author_name: Mengyu Hong
raw_affiliation_strings: Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials
Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies
University of Science and Technology Beijing
Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies, University of Science and Technology Beijing, Beijing 100083, China
raw_author_name: Huihui Yu
raw_affiliation_strings: Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials
Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies
University of Science and Technology Beijing
raw_author_name: Qinghua Zhang
raw_affiliation_strings: Beijing National Laboratory for Condensed Matter Physics
Collaborative Innovation Center of Quantum Matter
Institute of Physics, Chinese Academy of Sciences
Collaborative Innovation Center of Quantum Matter, Beijing 100871, China
Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China
raw_author_name: Lin Gu
raw_affiliation_strings: Beijing National Laboratory for Condensed Matter Physics
Collaborative Innovation Center of Quantum Matter
Institute of Physics, Chinese Academy of Sciences
Collaborative Innovation Center of Quantum Matter, Beijing 100871, China
Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China
raw_author_name: Zhihong Cao
raw_affiliation_strings: Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials
Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies
University of Science and Technology Beijing
raw_author_name: Xiankun Zhang
raw_affiliation_strings: Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials
Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies
University of Science and Technology Beijing
Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing 100083, China
raw_author_name: Zheng Zhang
raw_affiliation_strings: Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials
Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies
University of Science and Technology Beijing
Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing 100083, China
raw_author_name: Yue Zhang
raw_affiliation_strings: Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials
Future Chip Materials & Technology Innovation Center, School of Future Technology, School of Materials Science and Engineering, Beijing Key Laboratory for Advanced Energy Materials and Technologies
University of Science and Technology Beijing
Academy for Advanced Interdisciplinary Science and Technology, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips Ministry of Education, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing 100083, China