HfSe2(1-X)Te2X alloy channel transistor with semimetal HfTe2 contact electrodes
Year: 2025
Type: article
Language: en
Topic: 2D Materials and Applications
Authors and affiliations:
raw_author_name: Yuxiang Wang
raw_affiliation_strings: Shenzhen R&D Center of Huazhong University of Science and Technology 2 , Shenzhen 518000,
State Key Laboratory of Material Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology 1 , Wuhan 430074,
raw_author_name: Boyuan Di
raw_affiliation_strings: Shenzhen R&D Center of Huazhong University of Science and Technology 2 , Shenzhen 518000,
State Key Laboratory of Material Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology 1 , Wuhan 430074,
raw_author_name: Yijia Jiang
raw_affiliation_strings: Shenzhen R&D Center of Huazhong University of Science and Technology 2 , Shenzhen 518000,
State Key Laboratory of Material Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology 1 , Wuhan 430074,
raw_author_name: Jie Yu
raw_affiliation_strings: Shenzhen R&D Center of Huazhong University of Science and Technology 2 , Shenzhen 518000,
State Key Laboratory of Material Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology 1 , Wuhan 430074,
raw_author_name: Shiwan Zou
raw_affiliation_strings: Shenzhen R&D Center of Huazhong University of Science and Technology 2 , Shenzhen 518000,
State Key Laboratory of Material Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology 1 , Wuhan 430074,
raw_author_name: Liqiang Chen
raw_affiliation_strings: Shenzhen R&D Center of Huazhong University of Science and Technology 2 , Shenzhen 518000,
State Key Laboratory of Material Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology 1 , Wuhan 430074,
raw_author_name: Shijie Liu
raw_affiliation_strings: Shenzhen R&D Center of Huazhong University of Science and Technology 2 , Shenzhen 518000,
State Key Laboratory of Material Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology 1 , Wuhan 430074,
raw_author_name: Ziyi Dong
raw_affiliation_strings: Shenzhen R&D Center of Huazhong University of Science and Technology 2 , Shenzhen 518000,
State Key Laboratory of Material Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology 1 , Wuhan 430074,
raw_author_name: Jintian Li
raw_affiliation_strings: Shenzhen R&D Center of Huazhong University of Science and Technology 2 , Shenzhen 518000,
State Key Laboratory of Material Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology 1 , Wuhan 430074,
raw_author_name: Haixin Chang
raw_affiliation_strings: Shenzhen R&D Center of Huazhong University of Science and Technology 2 , Shenzhen 518000,
State Key Laboratory of Material Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology 1 , Wuhan 430074,
raw_author_name: Wenfeng Zhang
raw_affiliation_strings: Shenzhen R&D Center of Huazhong University of Science and Technology 2 , Shenzhen 518000,
State Key Laboratory of Material Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology 1 , Wuhan 430074,