Giant Electrostrain in Lead-Free BiFeO <sub>3</sub> –BaTiO <sub>3</sub> Ceramics via High-Entropy Design
Year: 2025
Type: article
Language: en
Topic: Ferroelectric and Piezoelectric Materials
Authors and affiliations:
raw_author_name: Minghai Yao
raw_affiliation_strings: Guangdong HUST Industrial Technology Research Institute, Guangdong Provincial Key Laboratory of Manufacturing Equipment Digitization
Huazhong University of Science and Technology
State Key Laboratory of Material Processing and Die & Mold Technology, School of Materials Science and Engineering
State Key Laboratory of Material Processing and Die & Mold Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, 430074 Wuhan, China
raw_author_name: Bo Li
raw_affiliation_strings: College of Electrical, Energy and Power Engineering
Yangzhou University
College of Electrical, Energy and Power Engineering, Yangzhou University, 225000 Yangzhou, China
raw_author_name: Hanxiao Gao
raw_affiliation_strings: Guangdong HUST Industrial Technology Research Institute, Guangdong Provincial Key Laboratory of Manufacturing Equipment Digitization
Huazhong University of Science and Technology
State Key Laboratory of Material Processing and Die & Mold Technology, School of Materials Science and Engineering
State Key Laboratory of Material Processing and Die & Mold Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, 430074 Wuhan, China
raw_author_name: Gengguang Luo
raw_affiliation_strings: Huazhong University of Science and Technology
School of Integrated Circuits
School of Integrated Circuits, Huazhong University of Science and Technology, 430074 Wuhan, China
raw_author_name: Lulu Liu
raw_affiliation_strings: Huazhong University of Science and Technology
School of Integrated Circuits
School of Integrated Circuits, Huazhong University of Science and Technology, 430074 Wuhan, China
raw_author_name: Hangyao Wu
raw_affiliation_strings: Guangdong HUST Industrial Technology Research Institute, Guangdong Provincial Key Laboratory of Manufacturing Equipment Digitization
Huazhong University of Science and Technology
State Key Laboratory of Material Processing and Die & Mold Technology, School of Materials Science and Engineering
State Key Laboratory of Material Processing and Die & Mold Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, 430074 Wuhan, China
Guangdong HUST Industrial Technology Research Institute, Guangdong Provincial Key Laboratory of Manufacturing Equipment Digitization, 523000 Dongguan, China
raw_author_name: Ze Yuan
raw_affiliation_strings: Guangdong HUST Industrial Technology Research Institute, Guangdong Provincial Key Laboratory of Manufacturing Equipment Digitization
Huazhong University of Science and Technology
State Key Laboratory of Material Processing and Die & Mold Technology, School of Materials Science and Engineering
Guangdong HUST Industrial Technology Research Institute, Guangdong Provincial Key Laboratory of Manufacturing Equipment Digitization, 523000 Dongguan, China
State Key Laboratory of Material Processing and Die & Mold Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, 430074 Wuhan, China
raw_author_name: Jiahong Li
raw_affiliation_strings: Guangdong HUST Industrial Technology Research Institute, Guangdong Provincial Key Laboratory of Manufacturing Equipment Digitization
Huazhong University of Science and Technology
State Key Laboratory of Material Processing and Die & Mold Technology, School of Materials Science and Engineering
Guangdong HUST Industrial Technology Research Institute, Guangdong Provincial Key Laboratory of Manufacturing Equipment Digitization, 523000 Dongguan, China
State Key Laboratory of Material Processing and Die & Mold Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, 430074 Wuhan, China
raw_author_name: Shenglin Jiang
raw_affiliation_strings: Huazhong University of Science and Technology
School of Integrated Circuits
School of Integrated Circuits, Huazhong University of Science and Technology, 430074 Wuhan, China
raw_author_name: Guangzu Zhang
raw_affiliation_strings: Huazhong University of Science and Technology
School of Integrated Circuits
School of Integrated Circuits, Huazhong University of Science and Technology, 430074 Wuhan, China
raw_author_name: Haibo Zhang
raw_affiliation_strings: Guangdong HUST Industrial Technology Research Institute, Guangdong Provincial Key Laboratory of Manufacturing Equipment Digitization
Huazhong University of Science and Technology
State Key Laboratory of Material Processing and Die & Mold Technology, School of Materials Science and Engineering
Guangdong HUST Industrial Technology Research Institute, Guangdong Provincial Key Laboratory of Manufacturing Equipment Digitization, 523000 Dongguan, China
State Key Laboratory of Material Processing and Die & Mold Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, 430074 Wuhan, China
raw_author_name: Yang Liu
raw_affiliation_strings: Guangdong HUST Industrial Technology Research Institute, Guangdong Provincial Key Laboratory of Manufacturing Equipment Digitization
Huazhong University of Science and Technology
State Key Laboratory of Material Processing and Die & Mold Technology, School of Materials Science and Engineering
Guangdong HUST Industrial Technology Research Institute, Guangdong Provincial Key Laboratory of Manufacturing Equipment Digitization, 523000 Dongguan, China
State Key Laboratory of Material Processing and Die & Mold Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, 430074 Wuhan, China