Output and transfer characteristics prediction of GaN HEMT via neural-network-based compact model parameters extraction
Year: 2025
Type: article
Language: en
Topic: GaN-based semiconductor devices and materials
Authors and affiliations:
raw_author_name: Jing Chen
raw_affiliation_strings: College of Integrated Circuit Science and Engineering, Nanjing University of Posts and Telecommunications, and also with the National & Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing 210023, China
College of Integrated Circuit Science and Engineering, Nanjing University of Posts and Telecommunications, and also with the National & Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing, 210023, China
raw_author_name: Haiwei Tan
raw_affiliation_strings: College of Integrated Circuit Science and Engineering, Nanjing University of Posts and Telecommunications, and also with the National & Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing 210023, China
College of Integrated Circuit Science and Engineering, Nanjing University of Posts and Telecommunications, and also with the National & Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing, 210023, China
raw_author_name: Yuxuan Dai
raw_affiliation_strings: College of Integrated Circuit Science and Engineering, Nanjing University of Posts and Telecommunications, and also with the National & Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing 210023, China
College of Integrated Circuit Science and Engineering, Nanjing University of Posts and Telecommunications, and also with the National & Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing, 210023, China
raw_author_name: Man Li
raw_affiliation_strings: College of Integrated Circuit Science and Engineering, Nanjing University of Posts and Telecommunications, and also with the National & Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing 210023, China
College of Integrated Circuit Science and Engineering, Nanjing University of Posts and Telecommunications, and also with the National & Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing, 210023, China
raw_author_name: Kemeng Yang
raw_affiliation_strings: College of Integrated Circuit Science and Engineering, Nanjing University of Posts and Telecommunications, and also with the National & Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing 210023, China
College of Integrated Circuit Science and Engineering, Nanjing University of Posts and Telecommunications, and also with the National & Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing, 210023, China
raw_author_name: Jiafei Yao
raw_affiliation_strings: College of Integrated Circuit Science and Engineering, Nanjing University of Posts and Telecommunications, and also with the National & Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing 210023, China
College of Integrated Circuit Science and Engineering, Nanjing University of Posts and Telecommunications, and also with the National & Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing, 210023, China
raw_author_name: Jun Zhang
raw_affiliation_strings: College of Integrated Circuit Science and Engineering, Nanjing University of Posts and Telecommunications, and also with the National & Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing 210023, China
College of Integrated Circuit Science and Engineering, Nanjing University of Posts and Telecommunications, and also with the National & Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing, 210023, China
raw_author_name: Yufeng Guo
raw_affiliation_strings: College of Integrated Circuit Science and Engineering, Nanjing University of Posts and Telecommunications, and also with the National & Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing 210023, China
College of Integrated Circuit Science and Engineering, Nanjing University of Posts and Telecommunications, and also with the National & Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing, 210023, China