Enhanced thermal stability of Cu-silylphosphido complexes via NHC ligation.
Khalili Najafabadi, Bahareh; Corrigan, John F.; Dalton transactions (Cambridge, England : 2003) 44 (2015) 14235–14241; doi:10.1039/c5dt02040a

data_7035850
_publ_section_title
;
 Enhanced thermal stability of Cu-silylphosphido complexes via NHC
 ligation.
;
_journal_issue                   32
_journal_name_full
'Dalton transactions (Cambridge, England : 2003)'
_journal_page_first              14235
_journal_page_last               14241
_journal_paper_doi               10.1039/c5dt02040a
_journal_volume                  44
_journal_year                    2015
_chemical_formula_sum            'C32 H54 Cu N4 P Si2'
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_space_group_name_Hall           '-P 1'
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_audit_update_record
;
2015-06-30 deposited with the CCDC.
2015-07-07 downloaded from the CCDC.
;
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'w=1/[\s^2^(Fo^2^)+(0.2000P)^2^] where P=(Fo^2^+2Fc^2^)/3'
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'Adding full bibliography for 7035850--7035853.cif.'
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