Kushalkhemka/embedding-cve-nvd-dataset huggingface dataset:
CVE ID: CVE-2019-13982 State: PUBLISHED Published: 2019-07-19T14:17:51 Last Updated: 2024-08-05T00:05:44.143Z Vendors: n/a Products: n/a Problem Types: n/a Description: interfaces/markdown/input.vue in Directus 7 Application before 7.7.0 does not sanitize Markdown text before rendering a preview. Additional Analyst Notes: - CVE Program Container: References: - https://github.com/directus/app/commit/f010b49eef1526fe0882078bb4a07688e8cc92c1
CVE ID: CVE-2019-13983 State: PUBLISHED Published: 2019-07-19T14:17:42 Last Updated: 2024-08-05T00:05:44.139Z Vendors: n/a Products: n/a Problem Types: n/a Description: Directus 7 API before 2.2.2 has insufficient anti-automation, as demonstrated by lack of a CAPTCHA in core/Directus/Services/AuthService.php and endpoints/Auth.php. Additional Analyst Notes: - CVE Program Container: References: - https://github.com/directus/api/issues/991 - https://github.com/directus/api/projects/43
CVE ID: CVE-2019-13984 State: PUBLISHED Published: 2019-07-19T14:17:32 Last Updated: 2024-08-05T00:05:44.146Z Vendors: n/a Products: n/a Problem Types: n/a Description: Directus 7 API before 2.3.0 does not validate uploaded files. Regardless of the file extension or MIME type, there is a direct link to each uploaded file, accessible by unauthenticated users, as demonstrated by the EICAR Anti-Virus Test File. Additional Analyst Notes: - CVE Program Container: References: - https://github.com/directus/api/issues/981 - https://github.com/directus/api/projects/44
CVE ID: CVE-2019-13988 State: PUBLISHED Published: 2022-12-26T00:00:00.000Z Last Updated: 2025-04-14T16:46:56.847Z Vendors: n/a Products: n/a Problem Types: n/a Description: Sierra Wireless MGOS before 3.15.2 and 4.x before 4.3 allows attackers to read log files via a Direct Request (aka Forced Browsing). Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.sierrawireless.com/company/security/ - https://source.sierrawireless.com/-/media/support_downloads/security-bulletins/pdf/swi-psa-2020-006---mgos-security-update.ashx
CVE ID: CVE-2019-13989 State: PUBLISHED Published: 2019-07-19T19:40:18 Last Updated: 2024-08-05T00:05:44.145Z Vendors: n/a Products: n/a Problem Types: n/a Description: dpic 2019.06.20 has a Stack-based Buffer Overflow in the wfloat() function in main.c. Additional Analyst Notes: - CVE Program Container: References: - https://gitlab.com/aplevich/dpic/issues/4
CVE ID: CVE-2019-13990 State: PUBLISHED Published: 2019-07-26T00:00:00 Last Updated: 2024-10-15T18:22:20.316Z Vendors: n/a Products: n/a Problem Types: n/a Description: initDocumentParser in xml/XMLSchedulingDataProcessor.java in Terracotta Quartz Scheduler through 2.3.0 allows XXE attacks via a job description. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://lists.apache.org/thread.html/e493e718a50f21201e05e82d42a8796b4046e83f0d286b90e58e0629%40%3Cdev.tomee.apache.org%3E - https://lists.apache.org/thread.html/1870324fea41ea68cff2fd1bf6ee2747432dc1d9d22a22cc681e0ec3%40%3Cdev.tomee.apache.org%3E - https://lists.apache.org/thread.html/6b6e3480b
68cff2fd1bf6ee2747432dc1d9d22a22cc681e0ec3%40%3Cdev.tomee.apache.org%3E - https://lists.apache.org/thread.html/6b6e3480b19856365fb5eef03aa0915a4679de4b019a1e975502d949%40%3Cdev.tomee.apache.org%3E - https://lists.apache.org/thread.html/f74b170d3d58d7a24db1afd3908bb0ab58a3900e16e73275674cdfaf%40%3Ccommits.tomee.apache.org%3E - https://lists.apache.org/thread.html/172d405e556e2f1204be126bb3eb28c5115af91bcc1651b4e870bb82%40%3Cdev.tomee.apache.org%3E - https://www.oracle.com/security-alerts/cpuapr2020.html - https://www.oracle.com/security-alerts/cpujul2020.html - https://github.com/quartz-scheduler/quartz/issues/467 - https://lists.apache.org/thread.html/re9b56ac1934d7bf16afc83eac1c39c98c1b20b4
b.com/quartz-scheduler/quartz/issues/467 - https://lists.apache.org/thread.html/re9b56ac1934d7bf16afc83eac1c39c98c1b20b4b15891dce923bf8aa%40%3Ccommits.tomee.apache.org%3E - https://lists.apache.org/thread.html/r3a6884e8d819f32cde8c07b98934de3e80467859880f784950bf44cf%40%3Ccommits.tomee.apache.org%3E - https://lists.apache.org/thread.html/r21df13c8bd2c2eae4b9661aae814c4a2a814d1f7875c765b8b115c9a%40%3Ccommits.tomee.apache.org%3E - https://www.oracle.com/security-alerts/cpuoct2020.html - https://www.oracle.com/security-alerts/cpujan2021.html - https://www.oracle.com//security-alerts/cpujul2021.html - https://www.oracle.com/security-alerts/cpuoct2021.html - https://security.netapp.com/advisory/n
alerts/cpujul2021.html - https://www.oracle.com/security-alerts/cpuoct2021.html - https://security.netapp.com/advisory/ntap-20221028-0002/ - https://confluence.atlassian.com/security/ssot-117-cve-2019-13990-xxe-xml-external-entity-injection-vulnerability-in-jira-service-management-data-center-and-jira-service-management-server-1295385959.html
CVE ID: CVE-2019-13991 State: PUBLISHED Published: 2019-07-19T20:39:23 Last Updated: 2024-08-05T00:05:44.098Z Vendors: n/a Products: n/a Problem Types: n/a Description: Embedded systems based on Arduino before Rev3 allow remote attackers to send data to LEDs (directly connected to GPIO pins) via a laser, because of LED photosensitivity. Additional Analyst Notes: - CVE Program Container: References: - https://arxiv.org/abs/1907.00479
CVE ID: CVE-2019-13992 State: PUBLISHED Published: 2020-09-08T09:31:28 Last Updated: 2024-08-05T00:05:44.164Z Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking Problem Types: Buffer Copy Without Checking Size of Input in kernel Description: u'Out of bound memory access if stack push and pop operation are performed without doing a bound check on stack top' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectiv
on stack top' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in Bitra, IPQ6018, IPQ8074, MDM9205, Nicobar, QCA8081, QCN7605, QCS404, QCS405, QCS605, QCS610, Rennell, SA415M, SA6155P, Saipan, SC7180, SC8180X, SDA845, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/august-2020-bulletin
CVE ID: CVE-2019-13993 State: REJECTED Published: 2021-12-20T22:43:31 Last Updated: 2021-12-20T22:43:31 Description: No description available.
CVE ID: CVE-2019-13994 State: PUBLISHED Published: 2020-09-08T09:31:28 Last Updated: 2024-08-05T00:05:44.087Z Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Problem Types: Integer Overflow or Wraparound Issue in Trustzone Description: u'Lack of check that the current received data fragment size of a particular packet that are read from shared memory are less than the actual packet size can lead to memory corruption and potential inform
that are read from shared memory are less than the actual packet size can lead to memory corruption and potential information leakage' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, Bitra, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS4
8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA6155P, Saipan, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/august-2020-bulletin
CVE ID: CVE-2019-13995 State: PUBLISHED Published: 2020-09-08T09:31:28 Last Updated: 2024-08-05T00:05:44.210Z Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Problem Types: Integer Overflow or Wraparound Issue in Trustzone Description: u'Lack of integer overflow check for addition of fragment size and remaining size that are read from shared memory can lead to memory corruption and potential information leakage' in Snapdragon Auto, Snap
at are read from shared memory can lead to memory corruption and potential information leakage' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, Bitra, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, Renn
0, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA6155P, Saipan, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/august-2020-bulletin
CVE ID: CVE-2019-13996 State: REJECTED Published: 2021-12-20T22:43:32 Last Updated: 2021-12-20T22:43:32 Description: No description available.
CVE ID: CVE-2019-13997 State: REJECTED Published: 2021-12-20T22:43:32 Last Updated: 2021-12-20T22:43:32 Description: No description available.
CVE ID: CVE-2019-13998 State: PUBLISHED Published: 2020-09-08T09:31:29 Last Updated: 2024-08-05T00:05:44.161Z Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Problem Types: Integer Overflow or Wraparound Issue in Qualcomm IPC Description: u'Lack of check that the TX FIFO write and read indices that are read from shared RAM are less than the FIFO size results into memory corruption and potential information leakage' in Snapdragon Auto, S
RAM are less than the FIFO size results into memory corruption and potential information leakage' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, Bitra, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, R
8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA515M, SA6155P, Saipan, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/august-2020-bulletin
CVE ID: CVE-2019-13999 State: PUBLISHED Published: 2020-09-08T09:31:29 Last Updated: 2024-08-05T00:05:44.146Z Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Problem Types: Integer Overflow or Wraparound in Qualcomm IPC Description: u'Lack of check for integer overflow for round up and addition operations result into memory corruption and potential information leakage' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Sna
emory corruption and potential information leakage' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, IPQ6018, IPQ8074, Kamorta, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA515M, SA6155P, SC7180, SC8180X, SDA6
CA8081, QCM2150, QCN7605, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SA415M, SA515M, SA6155P, SC7180, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/august-2020-bulletin
CVE ID: CVE-2019-14000 State: PUBLISHED Published: 2020-03-05T08:56:10 Last Updated: 2024-08-05T00:05:44.113Z Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Problem Types: Information Exposure Issue in Qualcomm IPC Description: Lack of check that the RX FIFO write index that is read from shared RAM is less than the FIFO size results into memory corruption and potential information leakage in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Sna
ential information leakage in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, IPQ6018, IPQ8074, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCS404, QCS405, QCS605, QM215, Rennell, SA6155P, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24
0, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/march-2020-bulletin
CVE ID: CVE-2019-14001 State: PUBLISHED Published: 2020-04-16T10:46:08 Last Updated: 2024-08-05T00:05:44.187Z Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Problem Types: Cryptographic Issue in HLOS Description: Wrong public key usage from existing oem_keystore for hash generation in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096AU, MDM9206, MDM9207C, MDM9607, MDM9650, MSM8905, MSM8909W, MSM8917, MSM8953, MSM8996AU, QM215, SDM429, SDM429W, SDM439,
AU, MDM9206, MDM9207C, MDM9607, MDM9650, MSM8905, MSM8909W, MSM8917, MSM8953, MSM8996AU, QM215, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDX20 Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/april-2020-bulletin
CVE ID: CVE-2019-14002 State: PUBLISHED Published: 2020-02-07T05:00:36 Last Updated: 2024-08-05T00:05:44.111Z Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables Problem Types: Improper Access Control Issue in Telephony Description: APKs without proper permission may bind to CallEnhancementService and can lead to unauthorized access to call status in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in APQ8053, APQ8096AU, APQ8098, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, Nicobar,
on Wearables in APQ8053, APQ8096AU, APQ8098, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, Nicobar, QCA6574AU, QCS605, QM215, SA6155P, SDA660, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM845, SM6150, SM8150, SM8250, SXR2130 Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/january-2020-bulletin
CVE ID: CVE-2019-14003 State: PUBLISHED Published: 2020-01-21T06:30:51 Last Updated: 2024-08-05T00:05:44.146Z Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Problem Types: Improper Input Validation in Video Description: Null pointer exception can happen while parsing invalid MKV clip where cue information is parsed before segment information in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Mu
nnectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8064, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8939, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCS605, QM215, Rennell, SA6155P, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/january-2020-bulletin
CVE ID: CVE-2019-14004 State: PUBLISHED Published: 2020-01-21T06:30:51 Last Updated: 2024-08-05T00:05:44.195Z Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Problem Types: Improper Input Validation in Video Description: Buffer overflow occurs while processing invalid MKV clip, which has invalid EBML size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009,
napdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8064, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8939, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCS605, QM215, Rennell, SA6155P, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/january-2020-bulletin
CVE ID: CVE-2019-14005 State: PUBLISHED Published: 2020-01-21T06:30:52 Last Updated: 2024-08-05T00:05:44.141Z Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Problem Types: Buffer Copy Without Checking Size of Input in Video Description: Buffer overflow occur while playing the clip which is nonstandard due to lack of check of size duration in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music
ctivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8064, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8939, MSM8940, MSM8953, MSM8996, MSM8996AU, Nicobar, QCS605, QM215, Rennell, SA6155P, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SM6150, SM7150, SM8150, SM8250, SXR2130 Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/january-2020-bulletin
CVE ID: CVE-2019-14006 State: PUBLISHED Published: 2020-01-21T06:30:52 Last Updated: 2024-08-05T00:05:44.205Z Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Problem Types: Improper Input Validation in Video Description: Buffer overflow occur while playing the clip which is nonstandard due to lack of offset length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearabl
Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8064, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8939, MSM8940, MSM8953, MSM8996, MSM8996AU, Nicobar, QCS605, QM215, Rennell, SA6155P, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SM6150, SM7150, SM8150, SM8250, SXR2130 Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/january-2020-bulletin