Kushalkhemka/embedding-cve-nvd-dataset huggingface dataset:
CVE ID: CVE-2023-21618 State: PUBLISHED Published: 2023-06-15T00:00:00.000Z Last Updated: 2025-03-05T18:57:33.507Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:N/UI:R/S:U/C:H/I:H/A:H) Vendors: Adobe Products: Substance3D - Designer Problem Types: CWE-824 Description: Adobe Substance 3D Designer version 12.4.1 (and earlier) is affected by an Access of Uninitialized Pointer vulnerability that could result in arbitrary code execution in the context of the current user. Exploitation of this issue requires user interaction in that a victim must open a malicious file. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://helpx.adobe.com/security/produc
l Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://helpx.adobe.com/security/products/substance3d_designer/apsb23-39.html
CVE ID: CVE-2023-21619 State: PUBLISHED Published: 2023-02-17T00:00:00 Last Updated: 2024-08-02T09:44:01.643Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:N/UI:R/S:U/C:H/I:H/A:H) Vendors: Adobe Products: FrameMaker Problem Types: CWE-787 Description: FrameMaker 2020 Update 4 (and earlier), 2022 (and earlier) are affected by an out-of-bounds write vulnerability that could result in arbitrary code execution in the context of the current user. Exploitation of this issue requires user interaction in that a victim must open a malicious file. Additional Analyst Notes: - CVE Program Container: References: - https://helpx.adobe.com/security/products/framemaker/apsb23-06.html
CVE ID: CVE-2023-21620 State: PUBLISHED Published: 2023-02-17T00:00:00 Last Updated: 2024-08-02T09:44:01.867Z Severity: MEDIUM (CVSS 5.5 CVSS:3.1/AV:L/AC:L/PR:N/UI:R/S:U/C:H/I:N/A:N) Vendors: Adobe Products: FrameMaker Problem Types: CWE-125 Description: FrameMaker 2020 Update 4 (and earlier), 2022 (and earlier) are affected by an out-of-bounds read vulnerability that could lead to disclosure of sensitive memory. An attacker could leverage this vulnerability to bypass mitigations such as ASLR. Exploitation of this issue requires user interaction in that a victim must open a malicious file. Additional Analyst Notes: - CVE Program Container: References: - https://helpx.adobe.com/security/produ
malicious file. Additional Analyst Notes: - CVE Program Container: References: - https://helpx.adobe.com/security/products/framemaker/apsb23-06.html
CVE ID: CVE-2023-21621 State: PUBLISHED Published: 2023-02-17T00:00:00 Last Updated: 2024-08-02T09:44:01.532Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:N/UI:R/S:U/C:H/I:H/A:H) Vendors: Adobe Products: FrameMaker Problem Types: CWE-20 Description: FrameMaker 2020 Update 4 (and earlier), 2022 (and earlier) are affected by an Improper Input Validation vulnerability that could result in arbitrary code execution in the context of the current user. Exploitation of this issue requires user interaction in that a victim must open a malicious file. Additional Analyst Notes: - CVE Program Container: References: - https://helpx.adobe.com/security/products/framemaker/apsb23-06.html
CVE ID: CVE-2023-21622 State: PUBLISHED Published: 2023-02-17T00:00:00 Last Updated: 2024-08-02T09:44:01.720Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:N/UI:R/S:U/C:H/I:H/A:H) Vendors: Adobe Products: FrameMaker Problem Types: CWE-787 Description: FrameMaker 2020 Update 4 (and earlier), 2022 (and earlier) are affected by an out-of-bounds write vulnerability that could result in arbitrary code execution in the context of the current user. Exploitation of this issue requires user interaction in that a victim must open a malicious file. Additional Analyst Notes: - CVE Program Container: References: - https://helpx.adobe.com/security/products/framemaker/apsb23-06.html
CVE ID: CVE-2023-21624 State: PUBLISHED Published: 2023-07-04T04:46:28.239Z Last Updated: 2024-08-02T09:44:01.427Z Severity: MEDIUM (CVSS 6.2 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:N) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-200 Description: Information disclosure in DSP Services while loading dynamic module. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/july-2023-bulletin
CVE ID: CVE-2023-21625 State: PUBLISHED Published: 2023-08-08T09:14:49.382Z Last Updated: 2024-08-02T09:44:01.408Z Severity: HIGH (CVSS 8.2 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Information disclosure in Network Services due to buffer over-read while the device receives DNS response. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin
CVE ID: CVE-2023-21626 State: PUBLISHED Published: 2023-08-08T09:14:50.487Z Last Updated: 2024-10-24T18:59:08.395Z Severity: HIGH (CVSS 7.1 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:N) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-320 Description: Cryptographic issue in HLOS due to improper authentication while performing key velocity checks using more than one key. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin
CVE ID: CVE-2023-21627 State: PUBLISHED Published: 2023-08-08T09:14:51.673Z Last Updated: 2024-08-02T09:44:01.539Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-20 Description: Memory corruption in Trusted Execution Environment while calling service API with invalid address. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin
CVE ID: CVE-2023-21628 State: PUBLISHED Published: 2023-06-06T07:39:07.103Z Last Updated: 2024-08-02T09:44:01.610Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-119 Description: Memory corruption in WLAN HAL while processing WMI-UTF command or FTM TLV1 command. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/june-2023-bulletin
CVE ID: CVE-2023-21629 State: PUBLISHED Published: 2023-07-04T04:46:29.370Z Last Updated: 2024-08-02T09:44:01.621Z Severity: MEDIUM (CVSS 6.8 CVSS:3.1/AV:P/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-415 Description: Memory Corruption in Modem due to double free while parsing the PKCS15 sim files. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/july-2023-bulletin
CVE ID: CVE-2023-21630 State: PUBLISHED Published: 2023-04-04T04:46:56.850Z Last Updated: 2024-08-02T09:44:01.876Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-191 Description: Memory Corruption in Multimedia Framework due to integer overflow when synx bind is called along with synx signal. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/april-2023-bulletin
CVE ID: CVE-2023-21631 State: PUBLISHED Published: 2023-07-04T04:46:30.354Z Last Updated: 2024-12-05T16:58:47.340Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:H/A:N) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-20 Description: Weak Configuration due to improper input validation in Modem while processing LTE security mode command message received from network. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/july-2023-bulletin
CVE ID: CVE-2023-21632 State: PUBLISHED Published: 2023-06-06T07:39:08.718Z Last Updated: 2024-08-02T09:44:01.939Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-121 Description: Memory corruption in Automotive GPU while querying a gsl memory node. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/june-2023-bulletin
CVE ID: CVE-2023-21633 State: PUBLISHED Published: 2023-07-04T04:46:31.355Z Last Updated: 2024-08-02T09:44:01.718Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-119 Description: Memory Corruption in Linux while processing QcRilRequestImsRegisterMultiIdentityMessage request. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/july-2023-bulletin
CVE ID: CVE-2023-21634 State: PUBLISHED Published: 2023-12-05T03:03:43.564Z Last Updated: 2024-08-02T09:44:02.075Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-119 Description: Memory Corruption in Radio Interface Layer while sending an SMS or writing an SMS to SIM. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin
CVE ID: CVE-2023-21635 State: PUBLISHED Published: 2023-07-04T04:46:32.404Z Last Updated: 2024-08-02T09:44:02.018Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Memory Corruption in Data Network Stack & Connectivity when sim gets detected on telephony. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/july-2023-bulletin
CVE ID: CVE-2023-21636 State: PUBLISHED Published: 2023-09-05T06:23:53.035Z Last Updated: 2024-08-02T09:44:02.259Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-129 Description: Memory Corruption due to improper validation of array index in Linux while updating adn record. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/september-2023-bulletin
CVE ID: CVE-2023-21637 State: PUBLISHED Published: 2023-07-04T04:46:33.409Z Last Updated: 2024-08-02T09:44:01.889Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-119 Description: Memory corruption in Linux while calling system configuration APIs. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/july-2023-bulletin
CVE ID: CVE-2023-21638 State: PUBLISHED Published: 2023-07-04T04:46:34.325Z Last Updated: 2024-08-02T09:44:02.079Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-704 Description: Memory corruption in Video while calling APIs with different instance ID than the one received in initialization. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/july-2023-bulletin
CVE ID: CVE-2023-21639 State: PUBLISHED Published: 2023-07-04T04:46:35.233Z Last Updated: 2024-08-02T09:44:01.890Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Memory corruption in Audio while processing sva_model_serializer using memory size passed by HIDL client. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/july-2023-bulletin
CVE ID: CVE-2023-21640 State: PUBLISHED Published: 2023-07-04T04:46:36.134Z Last Updated: 2024-11-26T18:56:23.022Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Memory corruption in Linux when the file upload API is called with parameters having large buffer. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/july-2023-bulletin
CVE ID: CVE-2023-21641 State: PUBLISHED Published: 2023-07-04T04:46:37.040Z Last Updated: 2024-10-24T19:31:06.405Z Severity: MEDIUM (CVSS 6.6 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:L/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-264 Description: An app with non-privileged access can change global system brightness and cause undesired system behavior. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/july-2023-bulletin
CVE ID: CVE-2023-21642 State: PUBLISHED Published: 2023-05-02T05:08:55.702Z Last Updated: 2024-08-02T09:44:02.066Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-284 Description: Memory corruption in HAB Memory management due to broad system privileges via physical address. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin
CVE ID: CVE-2023-21643 State: PUBLISHED Published: 2023-08-08T09:14:52.787Z Last Updated: 2024-08-02T09:44:01.901Z Severity: CRITICAL (CVSS 9.1 CVSS:3.1/AV:N/AC:L/PR:L/UI:N/S:C/C:L/I:H/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-822 Description: Memory corruption due to untrusted pointer dereference in automotive during system call. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin
CVE ID: CVE-2023-21644 State: PUBLISHED Published: 2023-09-05T06:23:54.197Z Last Updated: 2024-09-06T14:34:19.416Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-680 Description: Memory corruption in RIL due to Integer Overflow while triggering qcril_uim_request_apdu request. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/september-2023-bulletin
CVE ID: CVE-2023-21646 State: PUBLISHED Published: 2023-09-05T06:23:55.261Z Last Updated: 2024-08-02T09:44:02.064Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-617 Description: Transient DOS in Modem while processing invalid System Information Block 1. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/september-2023-bulletin
CVE ID: CVE-2023-21647 State: PUBLISHED Published: 2023-08-08T09:14:53.821Z Last Updated: 2024-08-02T09:44:02.013Z Severity: MEDIUM (CVSS 6.5 CVSS:3.1/AV:N/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:N) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-20 Description: Information disclosure in Bluetooth when an GATT packet is received due to improper input validation. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin
CVE ID: CVE-2023-21648 State: PUBLISHED Published: 2023-08-08T09:14:54.780Z Last Updated: 2024-08-02T09:44:01.873Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-680 Description: Memory corruption in RIL while trying to send apdu packet. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin
CVE ID: CVE-2023-21649 State: PUBLISHED Published: 2023-08-08T09:14:55.873Z Last Updated: 2024-08-02T09:44:02.040Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Memory corruption in WLAN while running doDriverCmd for an unspecific command. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin
CVE ID: CVE-2023-21650 State: PUBLISHED Published: 2023-08-08T09:14:57.016Z Last Updated: 2024-08-02T09:44:01.859Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-129 Description: Memory Corruption in GPS HLOS Driver when injectFdclData receives data with invalid data length. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin
CVE ID: CVE-2023-21651 State: PUBLISHED Published: 2023-08-08T09:14:58.131Z Last Updated: 2024-10-22T21:05:05.459Z Severity: CRITICAL (CVSS 9.3 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-704 Description: Memory Corruption in Core due to incorrect type conversion or cast in secure_io_read/write function in TEE. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin
CVE ID: CVE-2023-21652 State: PUBLISHED Published: 2023-08-08T09:14:59.131Z Last Updated: 2024-10-11T17:49:22.790Z Severity: HIGH (CVSS 7.7 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:N) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-320 Description: Cryptographic issue in HLOS as derived keys used to encrypt/decrypt information is present on stack after use. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin
CVE ID: CVE-2023-21653 State: PUBLISHED Published: 2023-09-05T06:23:56.700Z Last Updated: 2024-08-02T09:44:01.946Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-617 Description: Transient DOS in Modem while processing RRC reconfiguration message. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/september-2023-bulletin
CVE ID: CVE-2023-21654 State: PUBLISHED Published: 2023-09-05T06:23:58.153Z Last Updated: 2024-08-02T09:44:02.461Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-119 Description: Memory corruption in Audio during playback session with audio effects enabled. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/september-2023-bulletin
CVE ID: CVE-2023-21655 State: PUBLISHED Published: 2023-09-05T06:23:59.310Z Last Updated: 2024-08-02T09:44:02.168Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-190 Description: Memory corruption in Audio while validating and mapping metadata. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/september-2023-bulletin
CVE ID: CVE-2023-21656 State: PUBLISHED Published: 2023-06-06T07:39:10.242Z Last Updated: 2024-08-02T09:44:02.156Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-20 Description: Memory corruption in WLAN HOST while receiving an WMI event from firmware. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/june-2023-bulletin
CVE ID: CVE-2023-21657 State: PUBLISHED Published: 2023-06-06T07:39:11.763Z Last Updated: 2024-08-02T09:44:01.917Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-20 Description: Memoru corruption in Audio when ADSP sends input during record use case. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/june-2023-bulletin
CVE ID: CVE-2023-21658 State: PUBLISHED Published: 2023-06-06T07:39:13.326Z Last Updated: 2024-08-02T09:44:02.174Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Transient DOS in WLAN Firmware while processing the received beacon or probe response frame. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/june-2023-bulletin
CVE ID: CVE-2023-21659 State: PUBLISHED Published: 2023-06-06T07:39:15.032Z Last Updated: 2024-08-02T09:44:02.109Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Transient DOS in WLAN Firmware while processing frames with missing header fields. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/june-2023-bulletin
CVE ID: CVE-2023-21660 State: PUBLISHED Published: 2023-06-06T07:39:16.722Z Last Updated: 2024-08-02T09:44:01.930Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Transient DOS in WLAN Firmware while parsing FT Information Elements. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/june-2023-bulletin
CVE ID: CVE-2023-21661 State: PUBLISHED Published: 2023-06-06T07:39:18.288Z Last Updated: 2024-08-02T09:44:02.162Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Transient DOS while parsing WLAN beacon or probe-response frame. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/june-2023-bulletin
CVE ID: CVE-2023-21662 State: PUBLISHED Published: 2023-09-05T06:24:00.471Z Last Updated: 2025-02-27T21:02:56.010Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Memory corruption in Core Platform while printing the response buffer in log. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/september-2023-bulletin
CVE ID: CVE-2023-21663 State: PUBLISHED Published: 2023-09-05T06:24:01.860Z Last Updated: 2024-08-02T09:44:02.190Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-119 Description: Memory Corruption while accessing metadata in Display. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/september-2023-bulletin