Kushalkhemka/embedding-cve-nvd-dataset huggingface dataset:
CVE ID: CVE-2025-21434 State: PUBLISHED Published: 2025-04-07T10:16:00.794Z Last Updated: 2025-04-07T14:48:58.277Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Transient DOS may occur while parsing EHT operation IE or EHT capability IE. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2025-bulletin.html
CVE ID: CVE-2025-21435 State: PUBLISHED Published: 2025-04-07T10:16:02.146Z Last Updated: 2025-04-07T14:37:48.732Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Transient DOS may occur while parsing extended IE in beacon. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2025-bulletin.html
CVE ID: CVE-2025-21436 State: PUBLISHED Published: 2025-04-07T10:16:03.513Z Last Updated: 2025-04-08T03:56:04.288Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-416 Description: Memory corruption may occur while initiating two IOCTL calls simultaneously to create processes from two different threads. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2025-bulletin.html
CVE ID: CVE-2025-21437 State: PUBLISHED Published: 2025-04-07T10:16:04.807Z Last Updated: 2025-04-08T03:56:02.644Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-416 Description: Memory corruption while processing memory map or unmap IOCTL operations simultaneously. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2025-bulletin.html
CVE ID: CVE-2025-21438 State: PUBLISHED Published: 2025-04-07T10:16:06.109Z Last Updated: 2025-04-08T03:56:01.001Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-125 Description: Memory corruption while IOCTL call is invoked from user-space to read board data. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2025-bulletin.html
CVE ID: CVE-2025-21439 State: PUBLISHED Published: 2025-04-07T10:16:07.416Z Last Updated: 2025-04-08T03:55:59.260Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-787 Description: Memory corruption may occur while reading board data via IOCTL call when the WLAN driver copies the content to the provided output buffer. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2025-bulletin.html
CVE ID: CVE-2025-21440 State: PUBLISHED Published: 2025-04-07T10:16:08.714Z Last Updated: 2025-04-08T03:55:57.795Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-787 Description: Memory corruption when IOCTL call is invoked from user-space to write board data to WLAN driver. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2025-bulletin.html
CVE ID: CVE-2025-21441 State: PUBLISHED Published: 2025-04-07T10:16:10.116Z Last Updated: 2025-04-08T03:55:56.383Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-787 Description: Memory corruption when IOCTL call is invoked from user-space to write board data to WLAN driver. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2025-bulletin.html
CVE ID: CVE-2025-21442 State: PUBLISHED Published: 2025-04-07T10:16:11.331Z Last Updated: 2025-04-08T03:55:55.007Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-680 Description: Memory corruption while transmitting packet mapping information with invalid header payload size. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2025-bulletin.html
CVE ID: CVE-2025-21443 State: PUBLISHED Published: 2025-04-07T10:16:12.644Z Last Updated: 2025-04-08T03:55:53.531Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Memory corruption while processing message content in eAVB. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2025-bulletin.html
CVE ID: CVE-2025-21444 State: PUBLISHED Published: 2025-07-08T12:48:54.255Z Last Updated: 2025-07-10T03:55:28.581Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Memory corruption while copying the result to the transmission queue in EMAC. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/july-2025-bulletin.html
CVE ID: CVE-2025-21445 State: PUBLISHED Published: 2025-07-08T12:48:55.613Z Last Updated: 2025-07-08T14:57:19.549Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Memory corruption while copying the result to the transmission queue which is shared between the virtual machine and the host. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/july-2025-bulletin.html
CVE ID: CVE-2025-21446 State: PUBLISHED Published: 2025-07-08T12:48:57.211Z Last Updated: 2025-07-08T14:44:26.389Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Transient DOS may occur when processing vendor-specific information elements while parsing a WLAN frame for BTM requests. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/july-2025-bulletin.html
CVE ID: CVE-2025-21447 State: PUBLISHED Published: 2025-04-07T10:16:13.948Z Last Updated: 2025-04-08T03:55:52.104Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-129 Description: Memory corruption may occur while processing device IO control call for session control. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2025-bulletin.html
CVE ID: CVE-2025-21448 State: PUBLISHED Published: 2025-04-07T10:16:15.565Z Last Updated: 2025-04-07T14:03:06.045Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Transient DOS may occur while parsing SSID in action frames. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2025-bulletin.html
CVE ID: CVE-2025-21449 State: PUBLISHED Published: 2025-07-08T12:48:58.639Z Last Updated: 2025-07-08T14:27:43.328Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Transient DOS may occur while processing malformed length field in SSID IEs. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/july-2025-bulletin.html
CVE ID: CVE-2025-21450 State: PUBLISHED Published: 2025-07-08T12:49:00.452Z Last Updated: 2025-07-08T14:22:55.070Z Severity: CRITICAL (CVSS 9.1 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:N) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-287 Description: Cryptographic issue occurs due to use of insecure connection method while downloading. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/july-2025-bulletin.html
CVE ID: CVE-2025-21452 State: PUBLISHED Published: 2025-08-06T07:25:47.024Z Last Updated: 2025-08-06T19:24:47.242Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-617 Description: Transient DOS while processing a random-access response (RAR) with an invalid PDU length on LTE network. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/august-2025-bulletin.html
CVE ID: CVE-2025-21453 State: PUBLISHED Published: 2025-05-06T08:32:26.299Z Last Updated: 2025-05-07T03:55:28.462Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-416 Description: Memory corruption while processing a data structure, when an iterator is accessed after it has been removed, potential failures occur. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/may-2025-bulletin.html
CVE ID: CVE-2025-21454 State: PUBLISHED Published: 2025-07-08T12:49:01.843Z Last Updated: 2025-07-08T14:21:54.016Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Transient DOS while processing received beacon frame. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/july-2025-bulletin.html
CVE ID: CVE-2025-21455 State: PUBLISHED Published: 2025-08-06T07:25:48.160Z Last Updated: 2025-08-07T03:55:11.505Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-367 Description: Memory corruption while submitting blob data to kernel space though IOCTL. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/august-2025-bulletin.html
CVE ID: CVE-2025-21456 State: PUBLISHED Published: 2025-08-06T07:25:49.259Z Last Updated: 2025-08-07T03:55:13.267Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-416 Description: Memory corruption while processing IOCTL command when multiple threads are called to map/unmap buffer concurrently. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/august-2025-bulletin.html
CVE ID: CVE-2025-21457 State: PUBLISHED Published: 2025-08-06T07:25:50.337Z Last Updated: 2025-08-06T14:37:52.448Z Severity: MEDIUM (CVSS 6.1 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Information disclosure while opening a fastrpc session when domain is not sanitized. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/august-2025-bulletin.html
CVE ID: CVE-2025-21458 State: PUBLISHED Published: 2025-08-06T07:25:51.371Z Last Updated: 2025-08-07T03:55:14.419Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-416 Description: Memory corruption when IOCTL interface is called to map and unmap buffers simultaneously. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/august-2025-bulletin.html
CVE ID: CVE-2025-21459 State: PUBLISHED Published: 2025-05-06T08:32:27.901Z Last Updated: 2025-05-06T15:38:26.887Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Transient DOS while parsing per STA profile in ML IE. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/may-2025-bulletin.html
CVE ID: CVE-2025-21460 State: PUBLISHED Published: 2025-05-06T08:32:29.215Z Last Updated: 2025-05-07T03:55:27.164Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-20 Description: Memory corruption while processing a message, when the buffer is controlled by a Guest VM, the value can be changed continuously. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/may-2025-bulletin.html
CVE ID: CVE-2025-21461 State: PUBLISHED Published: 2025-08-06T07:25:52.424Z Last Updated: 2025-08-07T03:55:15.667Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-787 Description: Memory corruption when programming registers through virtual CDM. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/august-2025-bulletin.html
CVE ID: CVE-2025-21462 State: PUBLISHED Published: 2025-05-06T08:32:30.406Z Last Updated: 2025-05-07T03:55:25.816Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-787 Description: Memory corruption while processing an IOCTL request, when buffer significantly exceeds the command argument limit. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/may-2025-bulletin.html
CVE ID: CVE-2025-21463 State: PUBLISHED Published: 2025-06-03T05:52:58.605Z Last Updated: 2025-06-03T15:10:22.762Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Transient DOS while processing the EHT operation IE in the received beacon frame. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/june-2025-bulletin.html
CVE ID: CVE-2025-21464 State: PUBLISHED Published: 2025-08-06T07:25:53.752Z Last Updated: 2025-08-06T19:25:57.162Z Severity: MEDIUM (CVSS 6.5 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:C/C:H/I:N/A:N) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-125 Description: Information disclosure while reading data from an image using specified offset and size parameters. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/august-2025-bulletin.html
CVE ID: CVE-2025-21465 State: PUBLISHED Published: 2025-08-06T07:25:55.226Z Last Updated: 2025-08-06T19:26:20.064Z Severity: MEDIUM (CVSS 6.5 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:C/C:H/I:N/A:N) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-125 Description: Information disclosure while processing the hash segment in an MBN file. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/august-2025-bulletin.html
CVE ID: CVE-2025-21466 State: PUBLISHED Published: 2025-07-08T12:49:03.352Z Last Updated: 2025-07-08T14:19:32.111Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-416 Description: Memory corruption while processing a private escape command in an event trigger. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/july-2025-bulletin.html
CVE ID: CVE-2025-21467 State: PUBLISHED Published: 2025-05-06T08:32:31.645Z Last Updated: 2025-05-07T03:55:24.497Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-787 Description: Memory corruption while reading the FW response from the shared queue. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/may-2025-bulletin.html
CVE ID: CVE-2025-21468 State: PUBLISHED Published: 2025-05-06T08:32:32.919Z Last Updated: 2025-05-07T03:55:23.108Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-787 Description: Memory corruption while reading response from FW, when buffer size is changed by FW while driver is using this size to write null character at the end of buffer. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/may-2025-bulletin.html
CVE ID: CVE-2025-21469 State: PUBLISHED Published: 2025-05-06T08:32:34.158Z Last Updated: 2025-05-07T03:55:21.807Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-284 Description: Memory corruption while processing image encoding, when input buffer length is 0 in IOCTL call. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/may-2025-bulletin.html
CVE ID: CVE-2025-21470 State: PUBLISHED Published: 2025-05-06T08:32:35.388Z Last Updated: 2025-05-07T03:55:20.455Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-284 Description: Memory corruption while processing image encoding, when configuration is NULL in IOCTL parameter. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/may-2025-bulletin.html
CVE ID: CVE-2025-21472 State: PUBLISHED Published: 2025-08-06T07:25:56.503Z Last Updated: 2025-08-06T19:26:42.457Z Severity: MEDIUM (CVSS 5.5 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:N) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-489 Description: Information disclosure while capturing logs as eSE debug messages are logged. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/august-2025-bulletin.html
CVE ID: CVE-2025-21473 State: PUBLISHED Published: 2025-08-06T07:25:57.550Z Last Updated: 2025-08-07T03:55:16.792Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-367 Description: Memory corruption when using Virtual cdm (Camera Data Mover) to write registers. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/august-2025-bulletin.html
CVE ID: CVE-2025-21474 State: PUBLISHED Published: 2025-08-06T07:25:58.545Z Last Updated: 2025-08-06T15:37:56.863Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-416 Description: Memory corruption while processing commands from A2dp sink command queue. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/august-2025-bulletin.html
CVE ID: CVE-2025-21475 State: PUBLISHED Published: 2025-05-06T08:32:36.585Z Last Updated: 2025-05-07T03:55:18.738Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Memory corruption while processing escape code, when DisplayId is passed with large unsigned value. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/may-2025-bulletin.html
CVE ID: CVE-2025-21476 State: PUBLISHED Published: 2025-09-24T15:33:26.225Z Last Updated: 2025-09-25T03:55:45.888Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Memory corruption when passing parameters to the Trusted Virtual Machine during the handshake. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/september-2025-bulletin.html
CVE ID: CVE-2025-21477 State: PUBLISHED Published: 2025-08-06T07:25:59.590Z Last Updated: 2025-08-06T15:37:42.751Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-20 Description: Transient DOS while processing CCCH data when NW sends data with invalid length. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/august-2025-bulletin.html
CVE ID: CVE-2025-21479 State: PUBLISHED Published: 2025-06-03T06:42:42.042Z Last Updated: 2025-10-21T22:55:13.311Z Severity: HIGH (CVSS 8.6 CVSS:3.1/AV:L/AC:L/PR:N/UI:R/S:C/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-863 Description: Memory corruption due to unauthorized command execution in GPU micronode while executing specific sequence of commands. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/june-2025-bulletin.html
CVE ID: CVE-2025-21480 State: PUBLISHED Published: 2025-06-03T05:53:00.920Z Last Updated: 2025-10-21T22:55:13.677Z Severity: HIGH (CVSS 8.6 CVSS:3.1/AV:L/AC:L/PR:N/UI:R/S:C/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-863 Description: Memory corruption due to unauthorized command execution in GPU micronode while executing specific sequence of commands. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/june-2025-bulletin.html
CVE ID: CVE-2025-21481 State: PUBLISHED Published: 2025-09-24T15:33:27.834Z Last Updated: 2025-09-25T03:55:35.516Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Memory corruption while performing private key encryption in trusted application. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/september-2025-bulletin.html
CVE ID: CVE-2025-21482 State: PUBLISHED Published: 2025-09-24T15:33:29.640Z Last Updated: 2025-09-25T15:49:30.589Z Severity: HIGH (CVSS 7.1 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:N) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-310 Description: Cryptographic issue while performing RSA PKCS padding decoding. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/september-2025-bulletin.html
CVE ID: CVE-2025-21483 State: PUBLISHED Published: 2025-09-24T15:33:31.586Z Last Updated: 2025-09-25T15:49:25.223Z Severity: CRITICAL (CVSS 9.8 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-119 Description: Memory corruption when the UE receives an RTP packet from the network, during the reassembly of NALUs. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/september-2025-bulletin.html