Kushalkhemka/embedding-cve-nvd-dataset huggingface dataset:
CVE ID: CVE-2022-33237 State: PUBLISHED Published: 2022-11-15T00:00:00.000Z Last Updated: 2025-04-22T15:49:08.644Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Problem Types: Buffer over-read in WLAN Description: Transient DOS due to buffer over-read in WLAN firmware while processing PPE threshold. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, S
read in WLAN firmware while processing PPE threshold. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/november-2022-bulletin
CVE ID: CVE-2022-33238 State: PUBLISHED Published: 2022-12-13T00:00:00.000Z Last Updated: 2025-04-22T13:50:17.708Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Problem Types: Loop with unreachable exit condition in WLAN Description: Transient DOS due to loop with unreachable exit condition in WLAN while processing an incoming FTM frames. in Snapdra
n: Transient DOS due to loop with unreachable exit condition in WLAN while processing an incoming FTM frames. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/december-2022-bulletin
CVE ID: CVE-2022-33239 State: PUBLISHED Published: 2022-11-15T00:00:00.000Z Last Updated: 2025-04-22T15:48:59.953Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Problem Types: Loop with unreachable exit condition in WLAN Description: Transient DOS due to loop with unreachable exit condition in WLAN firmware while parsing IPV6 extension header. in Snapdragon Auto, S
due to loop with unreachable exit condition in WLAN firmware while parsing IPV6 extension header. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/november-2022-bulletin
CVE ID: CVE-2022-33240 State: PUBLISHED Published: 2023-06-06T07:38:41.164Z Last Updated: 2024-08-03T08:01:20.417Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-704 Description: Memory corruption in Audio due to incorrect type cast during audio use-cases. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/june-2023-bulletin
CVE ID: CVE-2022-33242 State: PUBLISHED Published: 2023-03-07T04:43:24.507Z Last Updated: 2024-08-03T08:01:20.548Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-287 Description: Memory corruption due to improper authentication in Qualcomm IPC while loading unsigned lib in audio PD. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/march-2023-bulletin
CVE ID: CVE-2022-33243 State: PUBLISHED Published: 2023-02-09T06:58:35.212Z Last Updated: 2024-08-03T08:01:20.540Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-284 Description: Memory corruption due to improper access control in Qualcomm IPC. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2023-bulletin
CVE ID: CVE-2022-33244 State: PUBLISHED Published: 2023-03-07T04:43:26.388Z Last Updated: 2024-08-03T08:01:20.203Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-617 Description: Transient DOS due to reachable assertion in modem during MIB reception and SIB timeout Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/march-2023-bulletin
CVE ID: CVE-2022-33245 State: PUBLISHED Published: 2023-03-07T04:43:28.096Z Last Updated: 2024-08-03T08:01:20.518Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-416 Description: Memory corruption in WLAN due to use after free Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/march-2023-bulletin
CVE ID: CVE-2022-33246 State: PUBLISHED Published: 2023-02-09T06:58:36.845Z Last Updated: 2024-08-03T08:01:20.473Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-823 Description: Memory corruption in Audio due to use of out-of-range pointer offset while Initiating a voice call session from user space with invalid session id. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2023-bulletin
CVE ID: CVE-2022-33248 State: PUBLISHED Published: 2023-02-09T06:58:38.401Z Last Updated: 2024-08-03T08:01:20.500Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-680 Description: Memory corruption in User Identity Module due to integer overflow to buffer overflow when a segement is received via qmi http. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2023-bulletin
CVE ID: CVE-2022-33250 State: PUBLISHED Published: 2023-03-07T04:43:29.759Z Last Updated: 2024-08-03T08:01:20.506Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-617 Description: Transient DOS due to reachable assertion in modem when network repeatedly sent invalid message container for NR to LTE handover. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/march-2023-bulletin
CVE ID: CVE-2022-33251 State: PUBLISHED Published: 2023-06-06T07:38:42.631Z Last Updated: 2024-08-03T08:01:20.486Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-617 Description: Transient DOS due to reachable assertion in Modem because of invalid network configuration. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/june-2023-bulletin
CVE ID: CVE-2022-33252 State: PUBLISHED Published: 2023-01-06T05:02:16.318Z Last Updated: 2025-04-09T19:48:49.837Z Severity: HIGH (CVSS 8.2 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: n/a Description: Information disclosure due to buffer over-read in WLAN while handling IBSS beacons frame. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/january-2023-bulletin
CVE ID: CVE-2022-33253 State: PUBLISHED Published: 2023-01-06T05:02:17.616Z Last Updated: 2025-04-09T19:48:06.690Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: n/a Description: Transient DOS due to buffer over-read in WLAN while parsing corrupted NAN frames. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/january-2023-bulletin
CVE ID: CVE-2022-33254 State: PUBLISHED Published: 2023-03-07T04:43:31.525Z Last Updated: 2024-08-03T08:01:20.568Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-617 Description: Transient DOS due to reachable assertion in Modem while processing SIB1 Message. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/march-2023-bulletin
CVE ID: CVE-2022-33255 State: PUBLISHED Published: 2023-01-06T05:02:18.976Z Last Updated: 2025-04-09T15:11:25.194Z Severity: HIGH (CVSS 8.2 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: n/a Description: Information disclosure due to buffer over-read in Bluetooth HOST while processing GetFolderItems and GetItemAttribute Cmds from peer device. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/january-2023-bulletin
CVE ID: CVE-2022-33256 State: PUBLISHED Published: 2023-03-07T04:43:33.154Z Last Updated: 2025-03-05T21:05:34.098Z Severity: CRITICAL (CVSS 9.8 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-129 Description: Memory corruption due to improper validation of array index in Multi-mode call processor. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/march-2023-bulletin
CVE ID: CVE-2022-33257 State: PUBLISHED Published: 2023-03-07T04:43:34.866Z Last Updated: 2024-08-03T08:01:20.420Z Severity: CRITICAL (CVSS 9.3 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-367 Description: Memory corruption in Core due to time-of-check time-of-use race condition during dump collection in trust zone. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/march-2023-bulletin
CVE ID: CVE-2022-33258 State: PUBLISHED Published: 2023-04-04T04:46:30.687Z Last Updated: 2024-08-03T08:01:20.522Z Severity: HIGH (CVSS 8.2 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Information disclosure due to buffer over-read in modem while reading configuration parameters. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/april-2023-bulletin
CVE ID: CVE-2022-33259 State: PUBLISHED Published: 2023-04-04T04:46:32.158Z Last Updated: 2024-08-03T08:01:20.536Z Severity: CRITICAL (CVSS 9.8 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Memory corruption due to buffer copy without checking the size of input in modem while decoding raw SMS received. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/april-2023-bulletin
CVE ID: CVE-2022-33260 State: PUBLISHED Published: 2023-03-07T04:43:36.709Z Last Updated: 2024-08-03T08:01:20.534Z Severity: MEDIUM (CVSS 5.9 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:L/I:L/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-121 Description: Memory corruption due to stack based buffer overflow in core while sending command from USB of large size. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/march-2023-bulletin
CVE ID: CVE-2022-33263 State: PUBLISHED Published: 2023-06-06T07:38:44.153Z Last Updated: 2025-01-07T19:34:31.441Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-416 Description: Memory corruption due to use after free in Core when multiple DCI clients register and deregister. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/june-2023-bulletin
CVE ID: CVE-2022-33264 State: PUBLISHED Published: 2023-06-06T07:38:45.938Z Last Updated: 2024-08-03T08:01:20.589Z Severity: HIGH (CVSS 7.9 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:C/C:L/I:L/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-121 Description: Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/june-2023-bulletin
CVE ID: CVE-2022-33265 State: PUBLISHED Published: 2023-01-06T05:02:20.338Z Last Updated: 2025-04-09T15:10:16.192Z Severity: HIGH (CVSS 7.3 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:L/I:L/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: n/a Description: Memory corruption due to information exposure in Powerline Communication Firmware while sending different MMEs from a single, unassociated device. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/january-2023-bulletin
CVE ID: CVE-2022-33266 State: PUBLISHED Published: 2023-01-06T05:02:21.689Z Last Updated: 2025-04-09T19:47:38.935Z Severity: MEDIUM (CVSS 5.9 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:L/I:L/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: n/a Description: Memory corruption in Audio due to integer overflow to buffer overflow while music playback of clips like amr,evrc,qcelp with modified content. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/january-2023-bulletin
CVE ID: CVE-2022-33267 State: PUBLISHED Published: 2023-06-06T07:38:47.589Z Last Updated: 2024-08-03T08:01:20.524Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-119 Description: Memory corruption in Linux while sending DRM request. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/june-2023-bulletin
CVE ID: CVE-2022-33268 State: PUBLISHED Published: 2022-12-13T00:00:00.000Z Last Updated: 2025-04-22T13:45:51.511Z Severity: HIGH (CVSS 8.2 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Problem Types: Buffer over-read in Bluetooth HOST Description: Information disclosure due to buffer over-read in Bluetooth HOST while pairing and connecting A2DP. in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Addi
apdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/december-2022-bulletin
CVE ID: CVE-2022-33269 State: PUBLISHED Published: 2023-04-04T04:46:33.644Z Last Updated: 2024-08-03T08:01:20.416Z Severity: CRITICAL (CVSS 9.3 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-190 Description: Memory corruption due to integer overflow or wraparound in Core while DDR memory assignment. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/april-2023-bulletin
CVE ID: CVE-2022-33270 State: PUBLISHED Published: 2023-04-04T04:46:34.926Z Last Updated: 2024-08-03T08:01:20.521Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-367 Description: Transient DOS due to time-of-check time-of-use race condition in Modem while processing RRC Reconfiguration message. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/april-2023-bulletin
CVE ID: CVE-2022-33271 State: PUBLISHED Published: 2023-02-09T06:58:40.259Z Last Updated: 2024-08-03T08:01:20.493Z Severity: HIGH (CVSS 8.2 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Information disclosure due to buffer over-read in WLAN while parsing NMF frame. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2023-bulletin
CVE ID: CVE-2022-33272 State: PUBLISHED Published: 2023-03-07T04:43:38.621Z Last Updated: 2024-08-03T08:01:20.483Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-617 Description: Transient DOS in modem due to reachable assertion. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/march-2023-bulletin
CVE ID: CVE-2022-33273 State: PUBLISHED Published: 2023-05-02T07:30:11.814Z Last Updated: 2024-08-03T08:01:20.474Z Severity: HIGH (CVSS 7.3 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:C/C:H/I:N/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Information disclosure due to buffer over-read in Trusted Execution Environment while QRKS report generation. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin
CVE ID: CVE-2022-33274 State: PUBLISHED Published: 2023-01-06T05:02:22.986Z Last Updated: 2025-04-09T19:47:05.556Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: n/a Description: Memory corruption in android core due to improper validation of array index while returning feature ids after license authentication. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/january-2023-bulletin
CVE ID: CVE-2022-33275 State: PUBLISHED Published: 2023-09-05T06:23:48.279Z Last Updated: 2025-02-27T21:03:13.315Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-129 Description: Memory corruption due to improper validation of array index in WLAN HAL when received lm_itemNum is out of range. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/september-2023-bulletin
CVE ID: CVE-2022-33276 State: PUBLISHED Published: 2023-01-06T05:02:24.356Z Last Updated: 2025-04-09T19:39:14.634Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: n/a Description: Memory corruption due to buffer copy without checking size of input in modem while receiving WMI_REQUEST_STATS_CMDID command. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/january-2023-bulletin
CVE ID: CVE-2022-33277 State: PUBLISHED Published: 2023-02-09T06:58:41.756Z Last Updated: 2024-08-03T08:01:20.528Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Memory corruption in modem due to buffer copy without checking size of input while receiving WMI command. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2023-bulletin
CVE ID: CVE-2022-33278 State: PUBLISHED Published: 2023-03-07T04:43:40.561Z Last Updated: 2024-08-03T08:01:20.527Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Memory corruption due to buffer copy without checking the size of input in HLOS when input message size is larger than the buffer capacity. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/march-2023-bulletin
CVE ID: CVE-2022-33279 State: PUBLISHED Published: 2023-02-09T06:58:43.369Z Last Updated: 2024-08-03T08:01:20.532Z Severity: CRITICAL (CVSS 9.8 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-121 Description: Memory corruption due to stack based buffer overflow in WLAN having invalid WNM frame length. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2023-bulletin
CVE ID: CVE-2022-33280 State: PUBLISHED Published: 2023-02-09T06:58:44.865Z Last Updated: 2024-08-03T08:01:20.478Z Severity: HIGH (CVSS 7.3 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:L/I:L/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-824 Description: Memory corruption due to access of uninitialized pointer in Bluetooth HOST while processing the AVRCP packet. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2023-bulletin
CVE ID: CVE-2022-33281 State: PUBLISHED Published: 2023-05-02T05:08:44.233Z Last Updated: 2024-08-03T08:01:20.538Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-129 Description: Memory corruption due to improper validation of array index in computer vision while testing EVA kernel without sending any frames. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin