Kushalkhemka/embedding-cve-nvd-dataset huggingface dataset:
CVE ID: CVE-2023-33049 State: PUBLISHED Published: 2024-02-06T05:46:59.078Z Last Updated: 2025-06-17T21:29:26.093Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-401 Description: Transient DOS in Multi-Mode Call Processor due to UE failure because of heap leakage. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2024-bulletin
CVE ID: CVE-2023-33053 State: PUBLISHED Published: 2023-12-05T03:04:08.622Z Last Updated: 2024-12-02T17:10:40.389Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-129 Description: Memory corruption in Kernel while parsing metadata. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin
CVE ID: CVE-2023-33054 State: PUBLISHED Published: 2023-12-05T03:04:09.667Z Last Updated: 2024-08-02T15:32:46.540Z Severity: CRITICAL (CVSS 9.1 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:N) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-287 Description: Cryptographic issue in GPS HLOS Driver while downloading Qualcomm GNSS assistance data. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin
CVE ID: CVE-2023-33055 State: PUBLISHED Published: 2023-11-07T05:26:50.923Z Last Updated: 2025-02-05T18:06:14.313Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Memory Corruption in Audio while invoking callback function in driver from ADSP. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/november-2023-bulletin
CVE ID: CVE-2023-33056 State: PUBLISHED Published: 2023-11-07T05:26:52.887Z Last Updated: 2024-08-02T15:32:46.617Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-476 Description: Transient DOS in WLAN Firmware when firmware receives beacon including T2LM IE. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/november-2023-bulletin
CVE ID: CVE-2023-33057 State: PUBLISHED Published: 2024-02-06T05:47:00.378Z Last Updated: 2025-05-07T20:06:57.138Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-20 Description: Transient DOS in Multi-Mode Call Processor while processing UE policy container. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2024-bulletin
CVE ID: CVE-2023-33058 State: PUBLISHED Published: 2024-02-06T05:47:01.669Z Last Updated: 2024-08-02T15:32:46.679Z Severity: HIGH (CVSS 8.2 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Information disclosure in Modem while processing SIB5. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2024-bulletin
CVE ID: CVE-2023-33059 State: PUBLISHED Published: 2023-11-07T05:26:54.139Z Last Updated: 2025-02-05T18:05:47.592Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-191 Description: Memory corruption in Audio while processing the VOC packet data from ADSP. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/november-2023-bulletin
CVE ID: CVE-2023-33060 State: PUBLISHED Published: 2024-02-06T05:47:02.978Z Last Updated: 2024-08-02T15:32:46.754Z Severity: HIGH (CVSS 7.1 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Transient DOS in Core when DDR memory check is called while DDR is not initialized. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2024-bulletin
CVE ID: CVE-2023-33061 State: PUBLISHED Published: 2023-11-07T05:26:55.389Z Last Updated: 2024-08-02T15:32:46.694Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Transient DOS in WLAN Firmware while parsing WLAN beacon or probe-response frame. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/november-2023-bulletin
CVE ID: CVE-2023-33062 State: PUBLISHED Published: 2024-01-02T05:38:36.201Z Last Updated: 2025-06-17T20:19:53.666Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Transient DOS in WLAN Firmware while parsing a BTM request. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/january-2024-bulletin
CVE ID: CVE-2023-33063 State: PUBLISHED Published: 2023-12-05T03:04:10.949Z Last Updated: 2025-10-21T23:05:31.211Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-416 Description: Memory corruption in DSP Services during a remote call from HLOS to DSP. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin
CVE ID: CVE-2023-33064 State: PUBLISHED Published: 2024-02-06T05:47:04.325Z Last Updated: 2024-08-02T15:32:46.652Z Severity: MEDIUM (CVSS 5.5 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Transient DOS in Audio when invoking callback function of ASM driver. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2024-bulletin
CVE ID: CVE-2023-33065 State: PUBLISHED Published: 2024-02-06T05:47:05.662Z Last Updated: 2024-08-06T19:02:32.580Z Severity: MEDIUM (CVSS 6.1 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Information disclosure in Audio while accessing AVCS services from ADSP payload. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2024-bulletin
CVE ID: CVE-2023-33066 State: PUBLISHED Published: 2024-03-04T10:48:31.460Z Last Updated: 2024-08-05T13:34:54.895Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-823 Description: Memory corruption in Audio while processing RT proxy port register driver. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/march-2024-bulletin
CVE ID: CVE-2023-33067 State: PUBLISHED Published: 2024-02-06T05:47:06.974Z Last Updated: 2024-08-02T15:32:46.744Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-823 Description: Memory corruption in Audio while calling START command on host voice PCM multiple times for the same RX or TX tap points. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2024-bulletin
CVE ID: CVE-2023-33068 State: PUBLISHED Published: 2024-02-06T05:47:08.274Z Last Updated: 2025-05-09T16:30:15.436Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Memory corruption in Audio while processing IIR config data from AFE calibration block. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2024-bulletin
CVE ID: CVE-2023-33069 State: PUBLISHED Published: 2024-02-06T05:47:09.632Z Last Updated: 2024-11-07T21:03:22.273Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Memory corruption in Audio while processing the calibration data returned from ACDB loader. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2024-bulletin
CVE ID: CVE-2023-33070 State: PUBLISHED Published: 2023-12-05T03:04:12.248Z Last Updated: 2025-05-29T13:31:38.841Z Severity: HIGH (CVSS 7.1 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-287 Description: Transient DOS in Automotive OS due to improper authentication to the secure IO calls. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin
CVE ID: CVE-2023-33071 State: PUBLISHED Published: 2023-12-05T03:04:13.352Z Last Updated: 2024-08-02T15:32:46.570Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-284 Description: Memory corruption in Automotive OS whenever untrusted apps try to access HAb for graphics functionalities. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin
CVE ID: CVE-2023-33072 State: PUBLISHED Published: 2024-02-06T05:47:11.221Z Last Updated: 2025-05-15T19:45:11.041Z Severity: CRITICAL (CVSS 9.3 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Memory corruption in Core while processing control functions. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2024-bulletin
CVE ID: CVE-2023-33074 State: PUBLISHED Published: 2023-11-07T05:26:56.441Z Last Updated: 2025-02-05T18:05:21.889Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-416 Description: Memory corruption in Audio when SSR event is triggered after music playback is stopped. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/november-2023-bulletin
CVE ID: CVE-2023-33076 State: PUBLISHED Published: 2024-02-06T05:47:12.814Z Last Updated: 2025-06-17T21:29:26.231Z Severity: MEDIUM (CVSS 5.9 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:L/I:L/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-16 Description: Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2024-bulletin
CVE ID: CVE-2023-33077 State: PUBLISHED Published: 2024-02-06T05:47:14.125Z Last Updated: 2024-08-22T20:47:27.087Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Memory corruption in HLOS while converting from authorization token to HIDL vector. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2024-bulletin
CVE ID: CVE-2023-33078 State: PUBLISHED Published: 2024-03-04T10:48:33.112Z Last Updated: 2024-08-02T15:32:46.612Z Severity: MEDIUM (CVSS 5.1 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:N/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Information Disclosure while processing IOCTL request in FastRPC. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/march-2024-bulletin
CVE ID: CVE-2023-33079 State: PUBLISHED Published: 2023-12-05T03:04:14.409Z Last Updated: 2024-08-02T15:32:46.570Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-823 Description: Memory corruption in Audio while running invalid audio recording from ADSP. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin
CVE ID: CVE-2023-33080 State: PUBLISHED Published: 2023-12-05T03:04:15.707Z Last Updated: 2024-10-10T19:36:42.225Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin
CVE ID: CVE-2023-33081 State: PUBLISHED Published: 2023-12-05T03:04:16.996Z Last Updated: 2024-08-02T15:32:46.729Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Transient DOS while converting TWT (Target Wake Time) frame parameters in the OTA broadcast. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin
CVE ID: CVE-2023-33082 State: PUBLISHED Published: 2023-12-05T03:04:18.133Z Last Updated: 2024-08-02T15:32:46.947Z Severity: CRITICAL (CVSS 9.8 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Memory corruption while sending an Assoc Request having BTM Query or BTM Response containing MBO IE. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin
CVE ID: CVE-2023-33083 State: PUBLISHED Published: 2023-12-05T03:04:19.198Z Last Updated: 2024-12-02T17:09:59.561Z Severity: CRITICAL (CVSS 9.8 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Memory corruption in WLAN Host while processing RRM beacon on the AP. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin
CVE ID: CVE-2023-33084 State: PUBLISHED Published: 2024-03-04T10:48:34.598Z Last Updated: 2024-08-12T18:20:59.700Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-401 Description: Transient DOS while processing IE fragments from server during DTLS handshake. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/march-2024-bulletin
CVE ID: CVE-2023-33085 State: PUBLISHED Published: 2024-01-02T05:38:37.667Z Last Updated: 2025-06-03T14:46:18.862Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Memory corruption in wearables while processing data from AON. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/january-2024-bulletin
CVE ID: CVE-2023-33086 State: PUBLISHED Published: 2024-03-04T10:48:35.955Z Last Updated: 2024-08-26T20:49:49.690Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-401 Description: Transient DOS while processing multiple IKEV2 Informational Request to device from IPSEC server with different identifiers. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/march-2024-bulletin
CVE ID: CVE-2023-33087 State: PUBLISHED Published: 2023-12-05T03:04:20.279Z Last Updated: 2024-08-02T15:32:46.731Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Memory corruption in Core while processing RX intent request. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin
CVE ID: CVE-2023-33088 State: PUBLISHED Published: 2023-12-05T03:04:21.594Z Last Updated: 2024-08-02T15:32:46.624Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-476 Description: Memory corruption when processing cmd parameters while parsing vdev. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin
CVE ID: CVE-2023-33089 State: PUBLISHED Published: 2023-12-05T03:04:23.127Z Last Updated: 2024-08-02T15:32:47.014Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-476 Description: Transient DOS when processing a NULL buffer while parsing WLAN vdev. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin
CVE ID: CVE-2023-33090 State: PUBLISHED Published: 2024-03-04T10:48:37.330Z Last Updated: 2024-08-02T15:32:46.628Z Severity: MEDIUM (CVSS 5.5 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Transient DOS while processing channel information for speaker protection v2 module in ADSP. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/march-2024-bulletin
CVE ID: CVE-2023-33092 State: PUBLISHED Published: 2023-12-05T03:04:24.232Z Last Updated: 2025-05-29T13:30:41.840Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Memory corruption while processing pin reply in Bluetooth, when pin code received from APP layer is greater than expected size. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin
CVE ID: CVE-2023-33094 State: PUBLISHED Published: 2024-01-02T05:38:38.853Z Last Updated: 2025-04-17T18:49:26.434Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-416 Description: Memory corruption while running VK synchronization with KASAN enabled. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/january-2024-bulletin
CVE ID: CVE-2023-33095 State: PUBLISHED Published: 2024-03-04T10:48:38.728Z Last Updated: 2024-08-02T15:32:46.639Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-617 Description: Transient DOS while processing multiple payload container type with incorrect container length received in DL NAS transport OTA in NR. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/march-2024-bulletin
CVE ID: CVE-2023-33096 State: PUBLISHED Published: 2024-03-04T10:48:40.079Z Last Updated: 2024-08-12T18:20:49.915Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-617 Description: Transient DOS while processing DL NAS Transport message, as specified in 3GPP 24.501 v16. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/march-2024-bulletin
CVE ID: CVE-2023-33097 State: PUBLISHED Published: 2023-12-05T03:04:25.294Z Last Updated: 2024-08-02T15:32:46.643Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Transient DOS in WLAN Firmware while processing a FTMR frame. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin
CVE ID: CVE-2023-33098 State: PUBLISHED Published: 2023-12-05T03:04:26.582Z Last Updated: 2024-08-02T15:32:46.683Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Transient DOS while parsing WPA IES, when it is passed with length more than expected size. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin
CVE ID: CVE-2023-33099 State: PUBLISHED Published: 2024-04-01T15:05:52.859Z Last Updated: 2024-08-02T15:32:46.647Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-20 Description: Transient DOS while processing SMS container of non-standard size received in DL NAS transport in NR. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2024-bulletin.html
CVE ID: CVE-2023-33100 State: PUBLISHED Published: 2024-04-01T15:05:54.175Z Last Updated: 2024-08-02T15:32:46.711Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-20 Description: Transient DOS while processing DL NAS Transport message when message ID is not defined in the 3GPP specification. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2024-bulletin.html
CVE ID: CVE-2023-33101 State: PUBLISHED Published: 2024-04-01T15:05:55.416Z Last Updated: 2024-08-02T15:32:46.752Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-704 Description: Transient DOS while processing DL NAS TRANSPORT message with payload length 0. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/april-2024-bulletin.html
CVE ID: CVE-2023-33103 State: PUBLISHED Published: 2024-03-04T10:48:41.447Z Last Updated: 2024-08-02T15:32:46.745Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-20 Description: Transient DOS while processing CAG info IE received from NW. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/march-2024-bulletin