Kushalkhemka/embedding-cve-nvd-dataset huggingface dataset:
CVE ID: CVE-2022-25719 State: PUBLISHED Published: 2022-10-19T00:00:00.000Z Last Updated: 2025-05-09T14:37:04.108Z Severity: HIGH (CVSS 8.2 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Problem Types: Buffer Over-read in WLAN Description: Information disclosure in WLAN due to improper length check while processing authentication handshake in Snapdragon Auto, Snapdragon Connectivity, Snapdragon
improper length check while processing authentication handshake in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/october-2022-bulletin
CVE ID: CVE-2022-25720 State: PUBLISHED Published: 2022-10-19T00:00:00.000Z Last Updated: 2025-05-09T14:36:02.779Z Severity: CRITICAL (CVSS 9.8 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Problem Types: Improper Validation of Array Index in WLAN Description: Memory corruption in WLAN due to out of bound array access during connect/roaming in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics
during connect/roaming in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/october-2022-bulletin
CVE ID: CVE-2022-25721 State: PUBLISHED Published: 2023-01-06T05:02:08.324Z Last Updated: 2025-04-09T20:18:59.817Z Severity: MEDIUM (CVSS 6.7 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: n/a Description: Memory corruption in video driver due to type confusion error during video playback Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/january-2023-bulletin
CVE ID: CVE-2022-25722 State: PUBLISHED Published: 2023-01-06T05:02:09.721Z Last Updated: 2025-04-09T20:17:08.832Z Severity: MEDIUM (CVSS 6 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:N) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: n/a Description: Information exposure in DSP services due to improper handling of freeing memory Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/january-2023-bulletin
CVE ID: CVE-2022-25723 State: PUBLISHED Published: 2022-10-17T00:00:00.000Z Last Updated: 2025-05-13T20:06:07.768Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Mobile Problem Types: Use-After-Free in Multimedia Frameworks Description: Memory corruption in multimedia due to use after free during callback registration failure in Snapdragon Mobile Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/october-2022-bulletin
CVE ID: CVE-2022-25724 State: PUBLISHED Published: 2022-11-15T00:00:00.000Z Last Updated: 2025-04-22T15:50:12.191Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Problem Types: Buffer Copy Without Checking Size of Input in Graphics Description: Memory corruption in graphics due to buffer overflow while validating the user address in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mo
gon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/november-2022-bulletin
CVE ID: CVE-2022-25725 State: PUBLISHED Published: 2023-01-06T05:02:11.067Z Last Updated: 2025-04-09T20:15:31.248Z Severity: MEDIUM (CVSS 6.2 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: n/a Description: Denial of service in MODEM due to improper pointer handling Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/january-2023-bulletin
CVE ID: CVE-2022-25726 State: PUBLISHED Published: 2023-04-04T04:46:12.603Z Last Updated: 2024-08-03T04:49:42.739Z Severity: HIGH (CVSS 8.2 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Information disclosure in modem data due to array out of bound access while handling the incoming DNS response packet Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/april-2023-bulletin
CVE ID: CVE-2022-25727 State: PUBLISHED Published: 2022-11-15T00:00:00.000Z Last Updated: 2025-04-22T15:50:04.596Z Severity: CRITICAL (CVSS 9.8 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music Problem Types: Use of Out-of-range Pointer Offset in MODEM Description: Memory Corruption in modem due to improper length check while copying into memory in Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/november-2022-b
iner: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/november-2022-bulletin
CVE ID: CVE-2022-25728 State: PUBLISHED Published: 2023-02-09T06:58:16.659Z Last Updated: 2024-08-03T04:49:42.786Z Severity: HIGH (CVSS 8.2 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Information disclosure in modem due to buffer over-read while processing response from DNS server Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2023-bulletin
CVE ID: CVE-2022-25729 State: PUBLISHED Published: 2023-02-09T06:58:17.825Z Last Updated: 2024-08-03T04:49:42.812Z Severity: CRITICAL (CVSS 9.8 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-20 Description: Memory corruption in modem due to improper length check while copying into memory Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2023-bulletin
CVE ID: CVE-2022-25730 State: PUBLISHED Published: 2023-04-04T04:46:13.925Z Last Updated: 2024-08-03T04:49:42.831Z Severity: HIGH (CVSS 8.2 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Information disclosure in modem due to improper check of IP type while processing DNS server query Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/april-2023-bulletin
CVE ID: CVE-2022-25731 State: PUBLISHED Published: 2023-04-04T04:46:15.237Z Last Updated: 2024-08-03T04:49:43.141Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:N) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-131 Description: Information disclosure in modem due to buffer over-read while processing packets from DNS server Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/april-2023-bulletin
CVE ID: CVE-2022-25732 State: PUBLISHED Published: 2023-02-09T06:58:18.950Z Last Updated: 2024-08-03T04:49:43.218Z Severity: HIGH (CVSS 8.2 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Information disclosure in modem due to buffer over read in dns client due to missing length check Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2023-bulletin
CVE ID: CVE-2022-25733 State: PUBLISHED Published: 2023-02-09T06:58:20.099Z Last Updated: 2024-08-03T04:49:42.822Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-476 Description: Denial of service in modem due to null pointer dereference while processing DNS packets Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2023-bulletin
CVE ID: CVE-2022-25734 State: PUBLISHED Published: 2023-02-09T06:58:21.261Z Last Updated: 2025-03-24T18:30:11.636Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-835 Description: Denial of service in modem due to missing null check while processing IP packets with padding Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2023-bulletin
CVE ID: CVE-2022-25735 State: PUBLISHED Published: 2023-02-09T06:58:22.577Z Last Updated: 2024-08-03T04:49:43.211Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-476 Description: Denial of service in modem due to missing null check while processing TCP or UDP packets from server Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2023-bulletin
CVE ID: CVE-2022-25736 State: PUBLISHED Published: 2022-10-19T00:00:00.000Z Last Updated: 2025-05-09T14:34:56.898Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Problem Types: Buffer Over-read in WLAN Description: Denial of service in WLAN due to out-of-bound read happens while processing VHT action frame in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectiv
out-of-bound read happens while processing VHT action frame in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/october-2022-bulletin
CVE ID: CVE-2022-25737 State: PUBLISHED Published: 2023-04-04T04:46:16.687Z Last Updated: 2024-08-03T04:49:43.201Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:N) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-457 Description: Information disclosure in modem due to missing NULL check while reading packets received from local network Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/april-2023-bulletin
CVE ID: CVE-2022-25738 State: PUBLISHED Published: 2023-02-09T06:58:23.939Z Last Updated: 2024-08-03T04:49:43.123Z Severity: HIGH (CVSS 8.2 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Information disclosure in modem due to buffer over-red while performing checksum of packet received Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/february-2023-bulletin
CVE ID: CVE-2022-25739 State: PUBLISHED Published: 2023-04-04T04:46:17.961Z Last Updated: 2024-08-03T04:49:43.196Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-476 Description: Denial of service in modem due to missing null check while processing the ipv6 packet received during ECM call Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/april-2023-bulletin
CVE ID: CVE-2022-25740 State: PUBLISHED Published: 2023-04-04T04:46:19.314Z Last Updated: 2024-08-03T04:49:43.186Z Severity: CRITICAL (CVSS 9.8 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Memory corruption in modem due to buffer overwrite while building an IPv6 multicast address based on the MAC address of the iface Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/april-2023-bulletin
CVE ID: CVE-2022-25741 State: PUBLISHED Published: 2022-11-15T00:00:00.000Z Last Updated: 2025-04-22T15:49:50.224Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables Problem Types: NULL Pointer Dereference in WLAN Description: Denial of service in WLAN due to potential null pointer dereference while accessing the memory location in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables Addi
napdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/november-2022-bulletin
CVE ID: CVE-2022-25742 State: PUBLISHED Published: 2022-11-15T00:00:00.000Z Last Updated: 2025-04-22T15:49:41.388Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music Problem Types: Loop with Unreachable Exit Condition in MODEM Description: Denial of service in modem due to infinite loop while parsing IGMPv2 packet from server in Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/november-20
ontainer: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/november-2022-bulletin
CVE ID: CVE-2022-25743 State: PUBLISHED Published: 2022-11-15T00:00:00.000Z Last Updated: 2025-04-22T15:49:34.134Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Problem Types: Use-After-Free in Graphics Description: Memory corruption in graphics due to use-after-free while importing graphics buffer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music,
napdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/november-2022-bulletin - http://packetstormsecurity.com/files/172663/Qualcomm-Adreno-KGSL-Unchecked-Cast-Type-Confusion.html
CVE ID: CVE-2022-25745 State: PUBLISHED Published: 2023-04-04T04:46:20.679Z Last Updated: 2024-08-03T04:49:42.803Z Severity: CRITICAL (CVSS 9.8 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-670 Description: Memory corruption in modem due to improper input validation while handling the incoming CoAP message Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/april-2023-bulletin
CVE ID: CVE-2022-25746 State: PUBLISHED Published: 2023-01-06T05:02:12.421Z Last Updated: 2025-04-09T19:53:24.186Z Severity: HIGH (CVSS 8.1 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:C/C:L/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: n/a Description: Memory corruption in kernel due to missing checks when updating the access rights of a memextent mapping. Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/january-2023-bulletin
CVE ID: CVE-2022-25747 State: PUBLISHED Published: 2023-04-04T04:46:21.972Z Last Updated: 2025-02-11T14:22:45.962Z Severity: HIGH (CVSS 8.2 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Information disclosure in modem due to improper input validation during parsing of upcoming CoAP message Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/april-2023-bulletin
CVE ID: CVE-2022-25748 State: PUBLISHED Published: 2022-10-19T00:00:00.000Z Last Updated: 2025-04-22T15:51:34.419Z Severity: CRITICAL (CVSS 9.8 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Problem Types: Integer Overflow to Buffer Overflow in WLAN Description: Memory corruption in WLAN due to integer overflow to buffer overflow while parsing GTK frames. in Snapdragon Auto,
tion: Memory corruption in WLAN due to integer overflow to buffer overflow while parsing GTK frames. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/october-2022-bulletin
CVE ID: CVE-2022-25749 State: PUBLISHED Published: 2022-10-19T00:00:00.000Z Last Updated: 2025-04-22T15:51:26.911Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Problem Types: Buffer Over-read in WLAN Description: Transient Denial-of-Service in WLAN due to buffer over-read while parsing MDNS frames. in Snapdragon Auto, Snapdragon Compute, Snapdragon
of-Service in WLAN due to buffer over-read while parsing MDNS frames. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/october-2022-bulletin
CVE ID: CVE-2022-25750 State: PUBLISHED Published: 2022-10-17T00:00:00.000Z Last Updated: 2025-05-13T20:05:06.328Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Mobile Problem Types: Double Free in BTHOST Description: Memory corruption in BTHOST due to double free while music playback and calls over bluetooth headset in Snapdragon Mobile Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/october-2022-bulletin
CVE ID: CVE-2022-25751 State: PUBLISHED Published: 2022-04-12T09:07:43 Last Updated: 2024-08-03T04:49:43.841Z Vendors: Siemens Products: SCALANCE X302-7 EEC (230V), SCALANCE X302-7 EEC (230V, coated), SCALANCE X302-7 EEC (24V), SCALANCE X302-7 EEC (24V, coated), SCALANCE X302-7 EEC (2x 230V), SCALANCE X302-7 EEC (2x 230V, coated), SCALANCE X302-7 EEC (2x 24V), SCALANCE X302-7 EEC (2x 24V, coated), SCALANCE X304-2FE, SCALANCE X306-1LD FE, SCALANCE X307-2 EEC (230V), SCALANCE X307-2 EEC (230V, coated), SCALANCE X307-2 EEC (24V), SCALANCE X307-2 EEC (24V, coated), SCALANCE X307-2 EEC (2x 230V), SCALANCE X307-2 EEC (2x 230V, coated), SCALANCE X307-2 EEC (2x 24V), SCALANCE X307-2 EEC (2x 24V, coa
7-2 EEC (2x 230V), SCALANCE X307-2 EEC (2x 230V, coated), SCALANCE X307-2 EEC (2x 24V), SCALANCE X307-2 EEC (2x 24V, coated), SCALANCE X307-3, SCALANCE X307-3LD, SCALANCE X308-2, SCALANCE X308-2LD, SCALANCE X308-2LH, SCALANCE X308-2LH+, SCALANCE X308-2M, SCALANCE X308-2M PoE, SCALANCE X308-2M TS, SCALANCE X310, SCALANCE X310FE, SCALANCE X320-1 FE, SCALANCE X320-1-2LD FE, SCALANCE X408-2, SCALANCE XR324-12M (230V, ports on front), SCALANCE XR324-12M (230V, ports on rear), SCALANCE XR324-12M (24V, ports on front), SCALANCE XR324-12M (24V, ports on rear), SCALANCE XR324-12M TS (24V), SCALANCE XR324-4M EEC (100-240VAC/60-250VDC, ports on front), SCALANCE XR324-4M EEC (100-240VAC/60-250VDC, ports
(24V), SCALANCE XR324-4M EEC (100-240VAC/60-250VDC, ports on front), SCALANCE XR324-4M EEC (100-240VAC/60-250VDC, ports on rear), SCALANCE XR324-4M EEC (24V, ports on front), SCALANCE XR324-4M EEC (24V, ports on rear), SCALANCE XR324-4M EEC (2x 100-240VAC/60-250VDC, ports on front), SCALANCE XR324-4M EEC (2x 100-240VAC/60-250VDC, ports on rear), SCALANCE XR324-4M EEC (2x 24V, ports on front), SCALANCE XR324-4M EEC (2x 24V, ports on rear), SCALANCE XR324-4M PoE (230V, ports on front), SCALANCE XR324-4M PoE (230V, ports on rear), SCALANCE XR324-4M PoE (24V, ports on front), SCALANCE XR324-4M PoE (24V, ports on rear), SCALANCE XR324-4M PoE TS (24V, ports on front), SIPLUS NET SCALANCE X308-2 P