Kushalkhemka/embedding-cve-nvd-dataset huggingface dataset:
CVE ID: CVE-2017-18299 State: PUBLISHED Published: 2018-10-23T13:00:00 Last Updated: 2024-08-05T21:20:50.537Z Vendors: Qualcomm, Inc. Products: Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear Problem Types: Improper Access Control in Core Description: Improper translation table consolidation logic leads to resource exhaustion and QSEE error in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in version MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660 Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bullet
dditional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins - http://www.securitytracker.com/id/1041432 - https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components
CVE ID: CVE-2017-18300 State: PUBLISHED Published: 2018-10-23T13:00:00 Last Updated: 2024-08-05T21:20:50.349Z Vendors: Qualcomm, Inc. Products: Snapdragon Mobile, Snapdragon Wear Problem Types: Information Exposure in Trust Zone Description: Secure display content could be accessed by third party trusted application after creating a fault in other trusted applications in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835, SDA660. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins - http://www.securitytracker.com/id/1041432 - https://source.android.com/security/bulletin
ny/product-security/bulletins - http://www.securitytracker.com/id/1041432 - https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components
CVE ID: CVE-2017-18301 State: PUBLISHED Published: 2018-09-20T13:00:00 Last Updated: 2024-08-05T21:20:51.126Z Vendors: n/a Products: n/a Problem Types: n/a Description: In Small Cell SoC and Snapdragon (Automobile, Mobile, Wear) in version FSM9055, FSM9955, MDM9607, MDM9640, MDM9650, MSM8909W, SD 425, SD 427, SD 430, SD 435, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDM630, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, providing the NULL argument of ICE regulator while processing create key IOCTL results in system restart. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins - http://www.secu
es: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins - http://www.securitytracker.com/id/1041432 - https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components
CVE ID: CVE-2017-18302 State: PUBLISHED Published: 2018-09-20T13:00:00 Last Updated: 2024-08-05T21:20:51.029Z Vendors: Qualcomm, Inc. Products: Snapdragon Automobile, Snapdragon Mobile Problem Types: TOCTOU Vulnerabilities in Ontario Driver Description: In Snapdragon (Automobile ,Mobile) in version MSM8996AU, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, a crafted HLOS client can modify the structure in memory passed to a QSEE application between the time of check and the time of use, resulting in arbitrary writes to TZ kernel memory regions. Additional Analyst Notes: - CVE
of check and the time of use, resulting in arbitrary writes to TZ kernel memory regions. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins - http://www.securitytracker.com/id/1041432 - https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components
CVE ID: CVE-2017-18303 State: PUBLISHED Published: 2018-10-23T13:00:00 Last Updated: 2024-08-05T21:20:51.126Z Vendors: Qualcomm, Inc. Products: Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear Problem Types: Buffer Copy Without Checking Size of Input in Sensors Description: While processing the sensors registry configuration file, if inputs are not validated a buffer overflow will occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MMDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SDA660, SDX20. Additional Analyst Notes:
/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SDA660, SDX20. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins - http://www.securitytracker.com/id/1041432 - https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components
CVE ID: CVE-2017-18304 State: PUBLISHED Published: 2018-10-23T13:00:00 Last Updated: 2024-08-05T21:20:51.174Z Vendors: Qualcomm, Inc. Products: Small Cell SoC, Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear Problem Types: Buffer Over-read in Power Description: Insufficient memory allocation in boot due to incorrect size being passed could result in out of bounds access in Small Cell SoC, Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in version FSM9055, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660 and SDX20 Additional Analyst
450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660 and SDX20 Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins - http://www.securitytracker.com/id/1041432 - https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components
CVE ID: CVE-2017-18305 State: PUBLISHED Published: 2018-10-23T13:00:00 Last Updated: 2024-08-05T21:20:50.932Z Vendors: Qualcomm, Inc. Products: Snapdragon Mobile, Snapdragon Wear Problem Types: Improper Access Control in Core Description: XBL sec mem dump system call allows complete control of EL3 by unlocking all XPUs if enable fuse is not blown in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins - http://www.securitytracker.com/id/1041432 - https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-so
- http://www.securitytracker.com/id/1041432 - https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components
CVE ID: CVE-2017-18306 State: PUBLISHED Published: 2024-11-26T13:56:21.839Z Last Updated: 2024-11-26T15:57:56.603Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-200 Description: Information disclosure due to uninitialized variable. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/may-2018-bulletin.html
CVE ID: CVE-2017-18307 State: PUBLISHED Published: 2024-11-26T13:56:23.036Z Last Updated: 2024-11-26T15:57:56.866Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-200 Description: Information disclosure possible while audio playback. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/may-2018-bulletin.html
CVE ID: CVE-2017-18308 State: PUBLISHED Published: 2018-10-26T13:00:00 Last Updated: 2024-08-05T21:20:49.839Z Vendors: Qualcomm, Inc. Products: Snapdragon Mobile, Snapdragon Wear Problem Types: Improper Access Control in Core Services Description: Modem segments are unlocked after authentication, leaving modem segments open to all in Snapdragon Mobile, Snapdragon Wear in version MDM9607, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 430 Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins - http://www.securitytracker.com/id/1041432
CVE ID: CVE-2017-18309 State: PUBLISHED Published: 2018-10-26T13:00:00 Last Updated: 2024-08-05T21:20:50.535Z Vendors: Qualcomm, Inc. Products: Snapdragon Mobile Problem Types: Improper Validation of Array Index in G-Link Description: A micro-core of QMP transportation may cause a macro-core to read from or write to arbitrary memory in Snapdragon Mobile in version SD 845, SD 850. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins - http://www.securitytracker.com/id/1041432
CVE ID: CVE-2017-18310 State: PUBLISHED Published: 2018-10-26T13:00:00 Last Updated: 2024-08-05T21:20:49.958Z Vendors: Qualcomm, Inc. Products: Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear Problem Types: Improper Access Control in TZ Description: ClientEnv exposes services 0-32 to HLOS in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016 Additional Analyst Notes: - CVE Program Container: References: - ht
30, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016 Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins - http://www.securitytracker.com/id/1041432
CVE ID: CVE-2017-18311 State: PUBLISHED Published: 2018-10-26T13:00:00 Last Updated: 2024-08-05T21:20:51.170Z Vendors: Qualcomm, Inc. Products: Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear Problem Types: Improper access control of unused configuration xPU ports Description: XPU Master privilege escalation is possible due to improper access control of unused configuration xPU ports where unused configuration ports are open in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD
996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins
CVE ID: CVE-2017-18312 State: PUBLISHED Published: 2018-10-23T13:00:00 Last Updated: 2024-08-05T21:20:50.619Z Vendors: Qualcomm, Inc. Products: Snapdragon Automobile, Snapdragon Mobile Problem Types: Improper Authorization in SafeSwitch Services Description: While accessing SafeSwitch services, third party can manipulate a given device and perform unauthorized operation due to lack of checking of same state transitions in Snapdragon Automobile, Snapdragon Mobile in version MSM8996AU, SD 410/12, SD 617, SD 650/52, SD 810, SD 820, SD 820A Additional Analyst Notes: - CVE Program Container: References: - https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components -
am Container: References: - https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components - https://www.qualcomm.com/company/product-security/bulletins
CVE ID: CVE-2017-18313 State: PUBLISHED Published: 2018-10-23T13:00:00 Last Updated: 2024-08-05T21:20:49.924Z Vendors: Qualcomm, Inc. Products: Snapdragon Mobile, Snapdragon Wear Problem Types: Improper Access Control in WLAN Description: Under certain mode of operations, HLOS may be able get direct or indirect access through DXE channels to tamper with the authenticated WCNSS firmware stored in DDR because DXE-accessible memory is located within the authenticated image in Snapdragon Mobile and Snapdragon Wear in version MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617. Additional Analyst Notes: - CVE Program Container: References: - https://source.android.com/security/bul
SD 415, SD 617. Additional Analyst Notes: - CVE Program Container: References: - https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components - https://www.qualcomm.com/company/product-security/bulletins
CVE ID: CVE-2017-18314 State: PUBLISHED Published: 2018-09-20T13:00:00 Last Updated: 2024-08-05T21:20:50.354Z Vendors: Qualcomm, Inc. Products: Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear Problem Types: Improper Access Control in Core Description: In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ
, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ. Additional Analyst Notes: - CVE Program Container: References: - https://source.android.com/security/bulletin/2018-09-01#qualcomm-closed-source-components - https://www.qualcomm.com/company/product-security/bulletins
CVE ID: CVE-2017-18315 State: PUBLISHED Published: 2018-11-28T15:00:00 Last Updated: 2024-08-05T21:20:50.285Z Vendors: Qualcomm, Inc. Products: Snapdragon Mobile Problem Types: Buffer Over-read in Core Services Description: Buffer over-read vulnerabilities in an older version of ASN.1 parser in Snapdragon Mobile in versions SD 600. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins - http://www.securityfocus.com/bid/105838
CVE ID: CVE-2017-18316 State: PUBLISHED Published: 2018-11-28T15:00:00 Last Updated: 2024-08-05T21:20:50.333Z Vendors: Qualcomm, Inc. Products: Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear Problem Types: Improper Access Control in Biometrics Description: Secure application can access QSEE kernel memory through Ontario kernel driver in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDA845, SDX24, SXR1130. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-securi
XR1130. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins - http://www.securityfocus.com/bid/105838
CVE ID: CVE-2017-18317 State: PUBLISHED Published: 2018-11-28T15:00:00 Last Updated: 2024-08-05T21:20:50.923Z Vendors: Qualcomm, Inc. Products: Snapdragon Automobile, Snapdragon Mobile Problem Types: Improper Input Validation in SafeSwitch Description: Restrictions related to the modem (sim lock, sim kill) can be bypassed by manipulating the system to issue a deactivation flow sequence in Snapdragon Automobile, Snapdragon Mobile in versions MSM8996AU,SD 410/12,SD 820,SD 820A. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins - http://www.securityfocus.com/bid/105838
CVE ID: CVE-2017-18318 State: PUBLISHED Published: 2018-11-28T15:00:00 Last Updated: 2024-08-05T21:20:50.375Z Vendors: Qualcomm, Inc. Products: Snapdragon Automobile, Snapdragon Mobile Problem Types: Improper Input Validation in Broadcast Services Description: Missing validation check on CRL issuer name in Snapdragon Automobile, Snapdragon Mobile in versions MSM8996AU, SD 410/12, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins - http://www.securityfocus.com/bid/105838
CVE ID: CVE-2017-18319 State: PUBLISHED Published: 2019-01-03T15:00:00 Last Updated: 2024-08-05T21:20:50.528Z Vendors: Qualcomm, Inc. Products: Snapdragon Mobile, Snapdragon Wear Problem Types: Key Management Errors in Modem Description: Information leak in UIM API debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/
016. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins - http://www.securityfocus.com/bid/106128
CVE ID: CVE-2017-18320 State: PUBLISHED Published: 2019-01-03T15:00:00 Last Updated: 2024-08-05T21:20:50.721Z Vendors: Qualcomm, Inc. Products: Snapdragon Automobile, Snapdragon Mobile Problem Types: Improper Input Validation in TZ Description: QSEE unload attempt on a 3rd party TEE without previously loading results in a data abort in snapdragon automobile and snapdragon mobile in versions MSM8996AU, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016, SXR1130. Additional Analyst Notes: - CVE Program C
835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016, SXR1130. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins - http://www.securityfocus.com/bid/106128
CVE ID: CVE-2017-18321 State: PUBLISHED Published: 2019-01-03T15:00:00 Last Updated: 2024-08-05T21:20:50.639Z Vendors: Qualcomm, Inc. Products: Snapdragon Mobile Problem Types: Information Exposure in LTE Description: Security keys used by the terminal and NW for a session could be leaked in snapdragon mobile in versions MDM9650, MDM9655, SD 835, SDA660. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins - http://www.securityfocus.com/bid/106128
CVE ID: CVE-2017-18322 State: PUBLISHED Published: 2019-01-03T15:00:00 Last Updated: 2024-08-05T21:20:50.234Z Vendors: Qualcomm, Inc. Products: Snapdragon Mobile, Snapdragon Wear Problem Types: Information Exposure in WCDMA Description: Cryptographic key material leaked in WCDMA debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/co
, Snapdragon_High_Med_2016. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins - http://www.securityfocus.com/bid/106128
CVE ID: CVE-2017-18323 State: PUBLISHED Published: 2019-01-03T15:00:00 Last Updated: 2024-08-05T21:20:50.535Z Vendors: Qualcomm, Inc. Products: Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear Problem Types: Key Management Errors in Modem Description: Cryptographic key material leaked in TDSCDMA RRC debug messages in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130. Additional Analyst
650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins - http://www.securityfocus.com/bid/106128
CVE ID: CVE-2017-18324 State: PUBLISHED Published: 2019-01-03T15:00:00 Last Updated: 2024-08-05T21:20:50.552Z Vendors: Qualcomm, Inc. Products: Snapdragon Mobile, Snapdragon Wear Problem Types: Information Exposure in GERAN Description: Cryptographic key material leaked in debug messages - GERAN in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SD 855, SDX24, Snapdragon_High_Med_2016. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcom
5, SDX24, Snapdragon_High_Med_2016. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins - http://www.securityfocus.com/bid/106128
CVE ID: CVE-2017-18325 State: REJECTED Published: 2019-08-30T15:16:45 Last Updated: 2019-08-30T15:16:45 Description: No description available.
CVE ID: CVE-2017-18326 State: PUBLISHED Published: 2019-01-03T15:00:00 Last Updated: 2024-08-05T21:20:49.895Z Vendors: Qualcomm, Inc. Products: Snapdragon Mobile, Snapdragon Wear Problem Types: Information Exposure in Modem Description: Cryptographic keys are printed in modem debug messages in snapdragon mobile and snapdragon wear in versions MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD 650/52, SD 800, SD 810, SD 820, SD 835, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016. Additional Analyst Notes: - CVE Program Container: References: - https:/
A660, SDM630, SDM660, Snapdragon_High_Med_2016. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins - http://www.securityfocus.com/bid/106128
CVE ID: CVE-2017-18327 State: PUBLISHED Published: 2019-01-03T15:00:00 Last Updated: 2024-08-05T21:20:50.730Z Vendors: Qualcomm, Inc. Products: Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear Problem Types: Information Exposure in WCDMA Description: Security keys are logged when any WCDMA call is configured or reconfigured in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130. Additional Analyst Notes: - CVE Program Container: Refer
820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins - http://www.securityfocus.com/bid/106128
CVE ID: CVE-2017-18328 State: PUBLISHED Published: 2019-01-03T15:00:00 Last Updated: 2024-08-05T21:20:50.489Z Vendors: Qualcomm, Inc. Products: Snapdragon Mobile, Snapdragon Wear Problem Types: Use After Free in UTILS Description: Use after free in QSH client rule processing in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 820, SD 835, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016. Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins - http://www.securityfocus.c
rogram Container: References: - https://www.qualcomm.com/company/product-security/bulletins - http://www.securityfocus.com/bid/106128