Kushalkhemka/embedding-cve-nvd-dataset huggingface dataset:
to, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/may-2022-bulletin
CVE ID: CVE-2022-22074 State: PUBLISHED Published: 2022-09-16T05:25:43 Last Updated: 2024-08-03T03:00:55.352Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Problem Types: Integer Overflow to Buffer Overflow in Audio Description: Memory Corruption during wma file playback due to integer overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Sna
ragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin
CVE ID: CVE-2022-22075 State: PUBLISHED Published: 2023-03-07T04:43:13.349Z Last Updated: 2024-08-03T03:00:55.225Z Severity: MEDIUM (CVSS 6.2 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:N) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-200 Description: Information Disclosure in Graphics during GPU context switch. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/march-2023-bulletin
CVE ID: CVE-2022-22076 State: PUBLISHED Published: 2023-06-06T07:38:33.401Z Last Updated: 2024-08-03T03:00:55.353Z Severity: HIGH (CVSS 7.1 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:H/I:N/A:N) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-310 Description: information disclosure due to cryptographic issue in Core during RPMB read request. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/june-2023-bulletin
CVE ID: CVE-2022-22077 State: PUBLISHED Published: 2022-10-12T00:00:00.000Z Last Updated: 2025-05-15T18:41:55.597Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Mobile Problem Types: Use-After-Free in Graphics Description: Memory corruption in graphics due to use-after-free in graphics dispatcher logic in Snapdragon Mobile Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/october-2022-bulletin
CVE ID: CVE-2022-22078 State: PUBLISHED Published: 2022-10-12T00:00:00.000Z Last Updated: 2025-05-15T15:11:02.192Z Severity: MEDIUM (CVSS 4.6 CVSS:3.1/AV:P/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables Problem Types: Integer Overflow or Wraparound issues in BOOT Description: Denial of service in BOOT when partition size for a particular partition is requested due to integer overflow when blocks are calculated in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial I
ulated in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/october-2022-bulletin
CVE ID: CVE-2022-22079 State: PUBLISHED Published: 2023-01-06T04:42:09.399Z Last Updated: 2025-04-09T19:59:08.568Z Severity: MEDIUM (CVSS 4.6 CVSS:3.1/AV:P/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: n/a Description: Denial of service while processing fastboot flash command on mmc due to buffer over read Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/january-2023-bulletin
CVE ID: CVE-2022-22080 State: PUBLISHED Published: 2022-09-02T11:31:09 Last Updated: 2024-08-03T03:00:55.193Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music Problem Types: Use of Out-of-range Pointer Offset in Audio Description: Improper validation of backend id in PCM routing process can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music Additio
on Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/august-2022-bulletin
CVE ID: CVE-2022-22081 State: PUBLISHED Published: 2022-09-16T05:25:44 Last Updated: 2024-08-03T03:00:55.231Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables Problem Types: Buffer Over-read in Audio Description: Memory corruption in audio module due to integer overflow in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin
CVE ID: CVE-2022-22082 State: PUBLISHED Published: 2022-06-14T09:40:49 Last Updated: 2024-08-03T03:00:55.217Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Problem Types: Memory Corruption in Video Description: Memory corruption due to possible buffer overflow while parsing DSF header with corrupted channel count in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon
agon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/june-2022-bulletin
CVE ID: CVE-2022-22083 State: PUBLISHED Published: 2022-06-14T09:40:51 Last Updated: 2024-08-03T03:00:55.224Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Problem Types: Buffer Over-read in Video Description: Denial of service due to memory corruption while extracting ape header from clips in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdra
n Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/june-2022-bulletin
CVE ID: CVE-2022-22084 State: PUBLISHED Published: 2022-06-14T09:40:52 Last Updated: 2024-08-03T03:00:55.238Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Problem Types: Stack-based Buffer Overflow in Video Description: Memory corruption when extracting qcp audio file due to lack of check on data length in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice &
ute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/june-2022-bulletin
CVE ID: CVE-2022-22085 State: PUBLISHED Published: 2022-06-14T09:40:54 Last Updated: 2024-08-03T03:00:55.343Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Problem Types: Use of Out-of-range Pointer Offset in Video Description: Memory corruption in video due to buffer overflow while reading the dts file in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & M
te, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/june-2022-bulletin
CVE ID: CVE-2022-22086 State: PUBLISHED Published: 2022-06-14T09:40:55 Last Updated: 2024-08-03T03:00:55.216Z Severity: HIGH (CVSS 7.3 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:L/I:L/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Problem Types: Double Free in Video Description: Memory corruption in video due to double free while parsing 3gp clip with invalid meta data atoms in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Mus
, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/june-2022-bulletin
CVE ID: CVE-2022-22087 State: PUBLISHED Published: 2022-06-14T09:40:57 Last Updated: 2024-08-03T03:00:55.208Z Severity: HIGH (CVSS 7.3 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:L/I:L/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Problem Types: Buffer Copy Without Checking Size of Input in Video Description: memory corruption in video due to buffer overflow while parsing mkv clip with no codechecker in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobi
n Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/june-2022-bulletin
CVE ID: CVE-2022-22088 State: PUBLISHED Published: 2023-01-06T04:42:10.711Z Last Updated: 2025-04-09T19:58:36.726Z Severity: CRITICAL (CVSS 9.8 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: n/a Description: Memory corruption in Bluetooth HOST due to buffer overflow while parsing the command response received from remote Additional Analyst Notes: - CVE Program Container: - CISA ADP Vulnrichment: References: - https://www.qualcomm.com/company/product-security/bulletins/january-2023-bulletin
CVE ID: CVE-2022-22089 State: PUBLISHED Published: 2022-09-16T05:25:44 Last Updated: 2024-08-03T03:00:55.231Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables Problem Types: Integer Overflow or Wraparound in Audio Description: Memory corruption in audio while playing record due to improper list handling in two threads in Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin
CVE ID: CVE-2022-22090 State: PUBLISHED Published: 2022-06-14T09:40:58 Last Updated: 2024-08-03T03:00:55.203Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile Problem Types: Use After Free in Audio Description: Memory corruption in audio due to use after free while managing buffers from internal cache in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/june-2022-bulletin
CVE ID: CVE-2022-22091 State: PUBLISHED Published: 2022-09-16T05:25:45 Last Updated: 2024-08-03T03:00:55.239Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables Problem Types: Improper Authorization in LTE Description: Improper authorization of a replayed LTE security mode command can lead to a denial of service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables Additional Analyst No
ivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin
CVE ID: CVE-2022-22092 State: PUBLISHED Published: 2022-09-16T05:25:46 Last Updated: 2024-08-03T03:00:55.239Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile Problem Types: Use After Free in Kernel Description: Memory corruption in kernel due to use after free issue in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin
CVE ID: CVE-2022-22093 State: PUBLISHED Published: 2022-09-16T05:25:47 Last Updated: 2024-08-03T03:00:55.369Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile Problem Types: Time-of-check Time-of-use (TOCTOU) Race Condition in Kernel Description: Memory corruption or temporary denial of service due to improper handling of concurrent hypervisor operations to attach or detach IRQs from virtual interrupt sources in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile Additional Analyst Notes: - CVE Program Containe
, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin
CVE ID: CVE-2022-22094 State: PUBLISHED Published: 2022-09-16T05:25:48 Last Updated: 2024-08-03T03:00:55.366Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile Problem Types: Time-of-check Time-of-use (TOCTOU) Race Condition in Kernel Description: memory corruption in Kernel due to race condition while getting mapping reference in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/septemb
nalyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin
CVE ID: CVE-2022-22095 State: PUBLISHED Published: 2022-09-16T05:25:49 Last Updated: 2024-08-03T03:00:55.230Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile Problem Types: Use After Free in Synx Driver Description: Memory corruption in synx driver due to use-after-free condition in the synx driver due to accessing object handles without acquiring lock in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product
pdragon Mobile Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin
CVE ID: CVE-2022-22096 State: PUBLISHED Published: 2022-09-02T11:31:09 Last Updated: 2024-08-03T03:00:55.210Z Severity: CRITICAL (CVSS 9.8 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Connectivity, Snapdragon Mobile Problem Types: Stack-based Buffer Overflow in Bluetooth HOST Description: Memory corruption in Bluetooth HOST due to stack-based buffer overflow when when extracting data using command length parameter in Snapdragon Connectivity, Snapdragon Mobile Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/july-2022-bulletin
CVE ID: CVE-2022-22097 State: PUBLISHED Published: 2022-09-02T11:31:10 Last Updated: 2024-08-03T03:00:55.377Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Consumer IOT Problem Types: Use-after-free in Automotive Multimedia Description: Memory corruption in graphic driver due to use after free while calling multiple threads application to driver. in Snapdragon Consumer IOT Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/july-2022-bulletin
CVE ID: CVE-2022-22098 State: PUBLISHED Published: 2022-09-02T11:31:11 Last Updated: 2024-08-03T03:00:55.212Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto Problem Types: Untrusted Pointer Dereference in Automotive Multimedia Description: Memory corruption in multimedia driver due to untrusted pointer dereference while reading data from socket in Snapdragon Auto Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/july-2022-bulletin
CVE ID: CVE-2022-22099 State: PUBLISHED Published: 2022-09-02T11:31:12 Last Updated: 2024-08-03T03:00:55.367Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto Problem Types: Improper Validation of Array Index in Automotive Multimedia Description: Memory corruption in multimedia due to improper validation of array index in Snapdragon Auto Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/august-2022-bulletin
CVE ID: CVE-2022-22100 State: PUBLISHED Published: 2022-09-02T11:31:13 Last Updated: 2024-08-03T03:00:55.268Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto Problem Types: Improper Restriction of Operations within the Bounds of a Memory Buffer in Automotive Multimedia Description: Memory corruption in multimedia due to improper check on received export descriptors in Snapdragon Auto Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/july-2022-bulletin
CVE ID: CVE-2022-22101 State: PUBLISHED Published: 2022-09-02T11:31:14 Last Updated: 2024-08-03T03:00:55.247Z Severity: MEDIUM (CVSS 6.2 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto Problem Types: Uncontrolled Resource Consumption in Automotive Multimedia Description: Denial of service in multimedia due to uncontrolled resource consumption while parsing an incoming HAB message in Snapdragon Auto Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/july-2022-bulletin
CVE ID: CVE-2022-22102 State: PUBLISHED Published: 2022-09-02T11:31:15 Last Updated: 2024-08-03T03:00:55.248Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto Problem Types: Incorrect Type Conversion or Cast in Automotive Multimedia Description: Memory corruption in multimedia due to incorrect type conversion while adding data in Snapdragon Auto Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/july-2022-bulletin
CVE ID: CVE-2022-22103 State: PUBLISHED Published: 2022-06-14T09:41:00 Last Updated: 2024-08-03T03:00:55.249Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto Problem Types: Double Free in Automotive Multimedia Description: Memory corruption in multimedia driver due to double free while processing data from user in Snapdragon Auto Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/june-2022-bulletin
CVE ID: CVE-2022-22104 State: PUBLISHED Published: 2022-09-02T11:31:15 Last Updated: 2024-08-03T03:00:55.371Z Severity: HIGH (CVSS 8.4 CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Auto Problem Types: Use of Out-of-range Pointer Offset in Automotive Multimedia Description: Memory corruption in multimedia due to improper check on the messages received. in Snapdragon Auto Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/july-2022-bulletin
CVE ID: CVE-2022-22105 State: PUBLISHED Published: 2022-09-16T05:25:50 Last Updated: 2024-08-03T03:00:55.365Z Severity: CRITICAL (CVSS 9.4 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Mobile, Snapdragon Voice & Music Problem Types: Integer Overflow or Wraparound in Automotive Connectivity Description: Memory corruption in bluetooth due to integer overflow while processing HFP-UNIT profile in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Mobile, Snapdragon Voice & Music Additional Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/septem
Analyst Notes: - CVE Program Container: References: - https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin