Kushalkhemka/embedding-cve-nvd-dataset huggingface dataset:
CVE ID: CVE-2024-53010 State: PUBLISHED Published: 2025-06-03T05:52:46.186Z Last Updated: 2025-06-03T13:34:12.254Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-284 Description: Memory corruption may occur while attaching VM when the HLOS retains access to VM. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/june-2025-bulletin.html
CVE ID: CVE-2024-53011 State: PUBLISHED Published: 2025-03-03T10:07:32.565Z Last Updated: 2025-03-05T04:55:43.805Z Severity: HIGH (CVSS 7.9 CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:C/C:H/I:H/A:N) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-264 Description: Information disclosure may occur due to improper permission and access controls to Video Analytics engine. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/march-2025-bulletin.html
CVE ID: CVE-2024-53012 State: PUBLISHED Published: 2025-03-03T10:07:33.651Z Last Updated: 2025-03-05T04:55:29.779Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-20 Description: Memory corruption may occur due to improper input validation in clock device. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/march-2025-bulletin.html
CVE ID: CVE-2024-53013 State: PUBLISHED Published: 2025-06-03T05:52:47.377Z Last Updated: 2025-06-03T13:33:38.949Z Severity: MEDIUM (CVSS 6.6 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:L/I:H/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Memory corruption may occur while processing voice call registration with user. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/june-2025-bulletin.html
CVE ID: CVE-2024-53014 State: PUBLISHED Published: 2025-03-03T10:07:34.984Z Last Updated: 2025-03-05T04:55:17.205Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-129 Description: Memory corruption may occur while validating ports and channels in Audio driver. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/march-2025-bulletin.html
CVE ID: CVE-2024-53015 State: PUBLISHED Published: 2025-06-03T05:52:48.537Z Last Updated: 2025-06-03T13:37:42.828Z Severity: MEDIUM (CVSS 6.6 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:L/I:H/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-416 Description: Memory corruption while processing IOCTL command to handle buffers associated with a session. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/june-2025-bulletin.html
CVE ID: CVE-2024-53016 State: PUBLISHED Published: 2025-06-03T05:52:49.688Z Last Updated: 2025-06-03T13:32:37.862Z Severity: MEDIUM (CVSS 6.6 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:L/I:H/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-367 Description: Memory corruption while processing I2C settings in Camera driver. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/june-2025-bulletin.html
CVE ID: CVE-2024-53017 State: PUBLISHED Published: 2025-06-03T05:52:50.844Z Last Updated: 2025-06-03T13:32:03.256Z Severity: MEDIUM (CVSS 6.6 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:L/I:H/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-823 Description: Memory corruption while handling test pattern generator IOCTL command. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/june-2025-bulletin.html
CVE ID: CVE-2024-53018 State: PUBLISHED Published: 2025-06-03T05:52:52.029Z Last Updated: 2025-06-03T13:31:27.718Z Severity: MEDIUM (CVSS 6.6 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:L/I:H/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-367 Description: Memory corruption may occur while processing the OIS packet parser. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/june-2025-bulletin.html
CVE ID: CVE-2024-53019 State: PUBLISHED Published: 2025-06-03T05:52:53.147Z Last Updated: 2025-06-03T13:30:43.914Z Severity: HIGH (CVSS 8.2 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Information disclosure may occur while decoding the RTP packet with improper header length for number of contributing sources. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/june-2025-bulletin.html
CVE ID: CVE-2024-53020 State: PUBLISHED Published: 2025-06-03T05:52:54.550Z Last Updated: 2025-06-03T14:49:32.785Z Severity: HIGH (CVSS 8.2 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Information disclosure may occur while decoding the RTP packet with invalid header extension from network. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/june-2025-bulletin.html
CVE ID: CVE-2024-53021 State: PUBLISHED Published: 2025-06-03T05:52:55.940Z Last Updated: 2025-06-03T15:10:54.652Z Severity: HIGH (CVSS 8.2 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Information disclosure may occur while processing goodbye RTCP packet from network. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/june-2025-bulletin.html
CVE ID: CVE-2024-53022 State: PUBLISHED Published: 2025-03-03T10:07:36.347Z Last Updated: 2025-03-05T04:55:31.123Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-20 Description: Memory corruption may occur during communication between primary and guest VM. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/march-2025-bulletin.html
CVE ID: CVE-2024-53023 State: PUBLISHED Published: 2025-03-03T10:07:37.488Z Last Updated: 2025-03-05T04:55:18.639Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-416 Description: Memory corruption may occur while accessing a variable during extended back to back tests. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/march-2025-bulletin.html
CVE ID: CVE-2024-53024 State: PUBLISHED Published: 2025-03-03T10:07:38.609Z Last Updated: 2025-03-05T04:55:19.993Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-476 Description: Memory corruption in display driver while detaching a device. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/march-2025-bulletin.html
CVE ID: CVE-2024-53025 State: PUBLISHED Published: 2025-03-03T10:07:39.782Z Last Updated: 2025-03-03T13:05:57.573Z Severity: MEDIUM (CVSS 5.5 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-190 Description: Transient DOS can occur while processing UCI command. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/march-2025-bulletin.html
CVE ID: CVE-2024-53026 State: PUBLISHED Published: 2025-06-03T05:52:57.455Z Last Updated: 2025-06-03T15:11:13.353Z Severity: HIGH (CVSS 8.2 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:L) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-126 Description: Information disclosure when an invalid RTCP packet is received during a VoLTE/VoWiFi IMS call. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/june-2025-bulletin.html
CVE ID: CVE-2024-53027 State: PUBLISHED Published: 2025-03-03T10:07:40.914Z Last Updated: 2025-03-03T13:05:06.738Z Severity: HIGH (CVSS 7.5 CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-120 Description: Transient DOS may occur while processing the country IE. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/march-2025-bulletin.html
CVE ID: CVE-2024-53028 State: PUBLISHED Published: 2025-03-03T10:07:42.051Z Last Updated: 2025-03-05T04:55:32.485Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-367 Description: Memory corruption may occur while processing message from frontend during allocation. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/march-2025-bulletin.html
CVE ID: CVE-2024-53029 State: PUBLISHED Published: 2025-03-03T10:07:43.190Z Last Updated: 2025-03-05T04:55:33.800Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-20 Description: Memory corruption while reading a value from a buffer controlled by the Guest Virtual Machine. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/march-2025-bulletin.html
CVE ID: CVE-2024-53030 State: PUBLISHED Published: 2025-03-03T10:07:44.376Z Last Updated: 2025-03-05T04:55:39.519Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-20 Description: Memory corruption while processing input message passed from FE driver. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/march-2025-bulletin.html
CVE ID: CVE-2024-53031 State: PUBLISHED Published: 2025-03-03T10:07:45.524Z Last Updated: 2025-03-05T04:55:40.910Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-20 Description: Memory corruption while reading a type value from a buffer controlled by the Guest Virtual Machine. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/march-2025-bulletin.html
CVE ID: CVE-2024-53032 State: PUBLISHED Published: 2025-03-03T10:07:46.637Z Last Updated: 2025-03-05T04:55:42.438Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-367 Description: Memory corruption may occur in keyboard virtual device due to guest VM interaction. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/march-2025-bulletin.html
CVE ID: CVE-2024-53033 State: PUBLISHED Published: 2025-03-03T10:07:47.750Z Last Updated: 2025-03-05T04:55:45.235Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-822 Description: Memory corruption while doing Escape call when user provides valid kernel address in the place of valid user buffer address. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/march-2025-bulletin.html
CVE ID: CVE-2024-53034 State: PUBLISHED Published: 2025-03-03T10:07:48.882Z Last Updated: 2025-03-05T04:55:46.730Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H) Vendors: Qualcomm, Inc. Products: Snapdragon Problem Types: CWE-822 Description: Memory corruption occurs during an Escape call if an invalid Kernel Mode CPU event and sync object handle are passed with the DriverKnownEscape flag reset. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://docs.qualcomm.com/product/publicresources/securitybulletin/march-2025-bulletin.html
CVE ID: CVE-2024-53041 State: PUBLISHED Published: 2024-12-10T13:54:12.113Z Last Updated: 2024-12-10T17:17:19.652Z Severity: HIGH (CVSS 7.8 CVSS:3.1/AV:L/AC:L/PR:N/UI:R/S:U/C:H/I:H/A:H) Vendors: Siemens Products: Teamcenter Visualization V14.2, Teamcenter Visualization V14.3, Teamcenter Visualization V2312, Tecnomatix Plant Simulation V2302, Tecnomatix Plant Simulation V2404 Problem Types: CWE-121 Description: A vulnerability has been identified in Teamcenter Visualization V14.2 (All versions < V14.2.0.14), Teamcenter Visualization V14.3 (All versions < V14.3.0.12), Teamcenter Visualization V2312 (All versions < V2312.0008), Tecnomatix Plant Simulation V2302 (All versions < V2302.0016), Tecn
ter Visualization V2312 (All versions < V2312.0008), Tecnomatix Plant Simulation V2302 (All versions < V2302.0016), Tecnomatix Plant Simulation V2404 (All versions < V2404.0005). The affected applications contain a stack based overflow vulnerability while parsing specially crafted WRL files. This could allow an attacker to execute code in the context of the current process. (ZDI-CAN-25000) Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://cert-portal.siemens.com/productcert/html/ssa-583523.html - https://cert-portal.siemens.com/productcert/html/ssa-645131.html
CVE ID: CVE-2024-53042 State: PUBLISHED Published: 2024-11-19T17:19:30.854Z Last Updated: 2025-11-03T22:28:44.629Z Vendors: Linux Products: Linux Description: In the Linux kernel, the following vulnerability has been resolved: ipv4: ip_tunnel: Fix suspicious RCU usage warning in ip_tunnel_init_flow() There are code paths from which the function is called without holding the RCU read lock, resulting in a suspicious RCU usage warning [1]. Fix by using l3mdev_master_upper_ifindex_by_index() which will acquire the RCU read lock before calling l3mdev_master_upper_ifindex_by_index_rcu(). [1] WARNING: suspicious RCU usage 6.12.0-rc3-custom-gac8f72681cf2 #141 Not tainted ----------------------------
x_rcu(). [1] WARNING: suspicious RCU usage 6.12.0-rc3-custom-gac8f72681cf2 #141 Not tainted ----------------------------- net/core/dev.c:876 RCU-list traversed in non-reader section!! other info that might help us debug this: rcu_scheduler_active = 2, debug_locks = 1 1 lock held by ip/361: #0: ffffffff86fc7cb0 (rtnl_mutex){+.+.}-{3:3}, at: rtnetlink_rcv_msg+0x377/0xf60 stack backtrace: CPU: 3 UID: 0 PID: 361 Comm: ip Not tainted 6.12.0-rc3-custom-gac8f72681cf2 #141 Hardware name: Bochs Bochs, BIOS Bochs 01/01/2011 Call Trace: <TASK> dump_stack_lvl+0xba/0x110 lockdep_rcu_suspicious.cold+0x4f/0xd6 dev_get_by_index_rcu+0x1d3/0x210 l3mdev_master_upper_ifindex_by_index_rcu+0x2b/0xf0 ip_tunnel_bin
picious.cold+0x4f/0xd6 dev_get_by_index_rcu+0x1d3/0x210 l3mdev_master_upper_ifindex_by_index_rcu+0x2b/0xf0 ip_tunnel_bind_dev+0x72f/0xa00 ip_tunnel_newlink+0x368/0x7a0 ipgre_newlink+0x14c/0x170 __rtnl_newlink+0x1173/0x19c0 rtnl_newlink+0x6c/0xa0 rtnetlink_rcv_msg+0x3cc/0xf60 netlink_rcv_skb+0x171/0x450 netlink_unicast+0x539/0x7f0 netlink_sendmsg+0x8c1/0xd80 ____sys_sendmsg+0x8f9/0xc20 ___sys_sendmsg+0x197/0x1e0 __sys_sendmsg+0x122/0x1f0 do_syscall_64+0xbb/0x1d0 entry_SYSCALL_64_after_hwframe+0x77/0x7f Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://git.kernel.org/stable/c/e2742758c9c85c84e077ede5f916479f724e11c2 - https://git.kernel.org/stabl
r: References: - https://git.kernel.org/stable/c/e2742758c9c85c84e077ede5f916479f724e11c2 - https://git.kernel.org/stable/c/5edcb3fdb12c3d46a6e79eeeec27d925b80fc168 - https://git.kernel.org/stable/c/72c0f482e39c87317ebf67661e28c8d86c93e870 - https://git.kernel.org/stable/c/699b48fc31727792edf2cab3829586ae6ba649e2 - https://git.kernel.org/stable/c/6dfaa458fe923211c766238a224e0a3c0522935c - https://git.kernel.org/stable/c/ad4a3ca6a8e886f6491910a3ae5d53595e40597d
CVE ID: CVE-2024-53043 State: PUBLISHED Published: 2024-11-19T17:19:31.497Z Last Updated: 2025-11-03T22:28:46.103Z Vendors: Linux Products: Linux Description: In the Linux kernel, the following vulnerability has been resolved: mctp i2c: handle NULL header address daddr can be NULL if there is no neighbour table entry present, in that case the tx packet should be dropped. saddr will usually be set by MCTP core, but check for NULL in case a packet is transmitted by a different protocol. Additional Analyst Notes: - CISA ADP Vulnrichment: - CVE Program Container: References: - https://git.kernel.org/stable/c/4707893315802a0917231b94cb20cbe50ccbfe03 - https://git.kernel.org/stable/c/8e886e44397ba
https://git.kernel.org/stable/c/4707893315802a0917231b94cb20cbe50ccbfe03 - https://git.kernel.org/stable/c/8e886e44397ba89f6e8da8471386112b4f5b67b7 - https://git.kernel.org/stable/c/8c222adadc1612e4f097688875962a28e3f5ab44 - https://git.kernel.org/stable/c/01e215975fd80af81b5b79f009d49ddd35976c13
CVE ID: CVE-2024-53044 State: PUBLISHED Published: 2024-11-19T17:19:32.095Z Last Updated: 2025-10-01T20:17:19.316Z Vendors: Linux Products: Linux Description: In the Linux kernel, the following vulnerability has been resolved: net/sched: sch_api: fix xa_insert() error path in tcf_block_get_ext() This command: $ tc qdisc replace dev eth0 ingress_block 1 egress_block 1 clsact Error: block dev insert failed: -EBUSY. fails because user space requests the same block index to be set for both ingress and egress. [ side note, I don't think it even failed prior to commit 913b47d3424e ("net/sched: Introduce tc block netdev tracking infra"), because this is a command from an old set of notes of mine wh
e ("net/sched: Introduce tc block netdev tracking infra"), because this is a command from an old set of notes of mine which used to work, but alas, I did not scientifically bisect this ] The problem is not that it fails, but rather, that the second time around, it fails differently (and irrecoverably): $ tc qdisc replace dev eth0 ingress_block 1 egress_block 1 clsact Error: dsa_core: Flow block cb is busy. [ another note: the extack is added by me for illustration purposes. the context of the problem is that clsact_init() obtains the same &q->ingress_block pointer as &q->egress_block, and since we call tcf_block_get_ext() on both of them, "dev" will be added to the block->ports xarray twice,
ress_block, and since we call tcf_block_get_ext() on both of them, "dev" will be added to the block->ports xarray twice, thus failing the operation: once through the ingress block pointer, and once again through the egress block pointer. the problem itself is that when xa_insert() fails, we have emitted a FLOW_BLOCK_BIND command through ndo_setup_tc(), but the offload never sees a corresponding FLOW_BLOCK_UNBIND. ] Even correcting the bad user input, we still cannot recover: $ tc qdisc replace dev swp3 ingress_block 1 egress_block 2 clsact Error: dsa_core: Flow block cb is busy. Basically the only way to recover is to reboot the system, or unbind and rebind the net device driver. To fix the
busy. Basically the only way to recover is to reboot the system, or unbind and rebind the net device driver. To fix the bug, we need to fill the correct error teardown path which was missed during code movement, and call tcf_block_offload_unbind() when xa_insert() fails. [ last note, fundamentally I blame the label naming convention in tcf_block_get_ext() for the bug. The labels should be named after what they do, not after the error path that jumps to them. This way, it is obviously wrong that two labels pointing to the same code mean something is wrong, and checking the code correctness at the goto site is also easier ] Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https
ode correctness at the goto site is also easier ] Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://git.kernel.org/stable/c/8966eb69a143b1c032365fe84f2815f3c46f2590 - https://git.kernel.org/stable/c/a13e690191eafc154b3f60afe9ce35aa9b9128b4
CVE ID: CVE-2024-53045 State: PUBLISHED Published: 2024-11-19T17:19:32.718Z Last Updated: 2025-10-01T20:17:19.178Z Vendors: Linux Products: Linux Description: In the Linux kernel, the following vulnerability has been resolved: ASoC: dapm: fix bounds checker error in dapm_widget_list_create The widgets array in the snd_soc_dapm_widget_list has a __counted_by attribute attached to it, which points to the num_widgets variable. This attribute is used in bounds checking, and if it is not set before the array is filled, then the bounds sanitizer will issue a warning or a kernel panic if CONFIG_UBSAN_TRAP is set. This patch sets the size of the widgets list calculated with list_for_each as the init
anic if CONFIG_UBSAN_TRAP is set. This patch sets the size of the widgets list calculated with list_for_each as the initial value for num_widgets as it is used for allocating memory for the array. It is updated with the actual number of added elements after the array is filled. Additional Analyst Notes: - CISA ADP Vulnrichment: References: - https://git.kernel.org/stable/c/c549cb66e8de0ba1936fc97a59f0156741d3492a - https://git.kernel.org/stable/c/2ef9439f7a19fd3d43b288d38b1c6e55b668a4fe
CVE ID: CVE-2024-53046 State: PUBLISHED Published: 2024-11-19T17:19:33.348Z Last Updated: 2025-10-01T20:17:19.051Z Vendors: Linux Products: Linux Description: In the Linux kernel, the following vulnerability has been resolved: arm64: dts: imx8ulp: correct the flexspi compatible string The flexspi on imx8ulp only has 16 LUTs, and imx8mm flexspi has 32 LUTs, so correct the compatible string here, otherwise will meet below error: [ 1.119072] ------------[ cut here ]------------ [ 1.123926] WARNING: CPU: 0 PID: 1 at drivers/spi/spi-nxp-fspi.c:855 nxp_fspi_exec_op+0xb04/0xb64 [ 1.133239] Modules linked in: [ 1.136448] CPU: 0 UID: 0 PID: 1 Comm: swapper/0 Not tainted 6.11.0-rc6-next-20240902-00001
1.133239] Modules linked in: [ 1.136448] CPU: 0 UID: 0 PID: 1 Comm: swapper/0 Not tainted 6.11.0-rc6-next-20240902-00001-g131bf9439dd9 #69 [ 1.146821] Hardware name: NXP i.MX8ULP EVK (DT) [ 1.151647] pstate: 40000005 (nZcv daif -PAN -UAO -TCO -DIT -SSBS BTYPE=--) [ 1.158931] pc : nxp_fspi_exec_op+0xb04/0xb64 [ 1.163496] lr : nxp_fspi_exec_op+0xa34/0xb64 [ 1.168060] sp : ffff80008002b2a0 [ 1.171526] x29: ffff80008002b2d0 x28: 0000000000000000 x27: 0000000000000000 [ 1.179002] x26: ffff2eb645542580 x25: ffff800080610014 x24: ffff800080610000 [ 1.186480] x23: ffff2eb645548080 x22: 0000000000000006 x21: ffff2eb6455425e0 [ 1.193956] x20: 0000000000000000 x19: ffff80008002b5e0 x18: fffffffffffffff
x22: 0000000000000006 x21: ffff2eb6455425e0 [ 1.193956] x20: 0000000000000000 x19: ffff80008002b5e0 x18: ffffffffffffffff [ 1.201432] x17: ffff2eb644467508 x16: 0000000000000138 x15: 0000000000000002 [ 1.208907] x14: 0000000000000000 x13: ffff2eb6400d8080 x12: 00000000ffffff00 [ 1.216378] x11: 0000000000000000 x10: ffff2eb6400d8080 x9 : ffff2eb697adca80 [ 1.223850] x8 : ffff2eb697ad3cc0 x7 : 0000000100000000 x6 : 0000000000000001 [ 1.231324] x5 : 0000000000000000 x4 : 0000000000000000 x3 : 00000000000007a6 [ 1.238795] x2 : 0000000000000000 x1 : 00000000000001ce x0 : 00000000ffffff92 [ 1.246267] Call trace: [ 1.248824] nxp_fspi_exec_op+0xb04/0xb64 [ 1.253031] spi_mem_exec_op+0x3a0/0x430 [ 1.2