I want to know the answer to the following question:
What might the rapid diffusion of coating metal into tin solder leave in the surface coating?
All the background I'm provided with is that "Tin forms intermetallics such as Cu5Sn6 and Ag3Cu that dissolve into the Tin liquidus or solidus(@50C), stripping surface coating or leaving voids.". Is that enough to answer the question?
Answer: yes