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DUBLIN--(BUSINESS WIRE)--The "3D TSV and 2.5D Market - Growth, Trends, COVID-19 Impact, and Forecasts (2021 - 2026)" report has been added to ResearchAndMarkets.com's offering. The 3D TSV and 2.5D Market is expected to register a CAGR of 35.3% over the forecast period from 2021 to 2026. Companies Mentioned Key Market Trends Consumer Electronics is Expected to Hold Significant Share Asia-Pacific to Witness the Fastest Growth Rate Over the Forecast Period Key Topics Covered: 1 INTRODUCTION 1.1 Study Assumptions and Market Definitions 1.2 Scope of the Study 2 RESEARCH METHODOLOGY 3 EXECUTIVE SUMMARY 4 MARKET INSIGHTS 4.1 Market Overview (Covers the impact due to COVID-19) 4.2 Industry Attractiveness - Porter's Five Force Analysis 4.2.1 Bargaining Power of Suppliers 4.2.2 Bargaining Power of Consumers 4.2.3 Threat of New Entrants 4.2.4 Threat of Substitute Products 4.2.5 Intensity of Competitive Rivalry 4.3 Industry Value Chain Analysis 5 MARKET DYNAMICS 5.1 Market Drivers 5.1.1 Expanding Market for High Performance Computing Application 5.1.2 Expanding Scope of Data Centers and Memory Devices 5.2 Market Challenges 5.2.1 High Unit Cost of IC Packages 6 TECHNOLOGICAL SNAPSHOT 7 MARKET SEGMENTATION 7.1 By Packaging Type 7.2 By End-user Application 7.3 Geography 7.3.1 North America 7.3.2 Europe 7.3.3 Asia Pacific 7.3.4 Rest of the World 8 COMPETITIVE LANDSCAPE 8.1 Company Profiles 8.1.1 Taiwan Semiconductor Manufacturing Company Limited 8.1.2 Samsung Electronics Co. Ltd 8.1.3 Toshiba Corp. 8.1.4 Pure Storage Inc. 8.1.5 ASE Group 8.1.6 Amkor Technology, Inc. 8.1.7 United Microelectronics Corp. 8.1.8 STMicroelectronics NV 8.1.9 Broadcom Ltd 8.1.10 Intel Corporation 8.1.11 Jiangsu Changing Electronics Technology Co. Ltd 9 INVESTMENT ANALYSIS 10 FUTURE OF THE MARKET For more information about this report visit https://www.researchandmarkets.com/r/30r7do

Answer: Insights on the 3D TSV and 2.5D Global Market to 2026 - Featuring Samsung, Toshiba and Pure Storage Among Others - ResearchAndMarkets.com