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DUBLIN--(BUSINESS WIRE)--The "North America Advanced Packaging Market By Type, By End User, By Country, Industry Analysis and Forecast, 2020 - 2026" report has been added to ResearchAndMarkets.com's offering. The North America Advanced Packaging Market is expected to witness market growth of 11.6% CAGR during the forecast period (2020-2026). Manufacturing processes rely on the specifications that consumers will satisfy in order to guarantee the functionality of the finished product. Integrated circuits are designed to have all the electrical functions necessary and to fit into a particular range of packages. The bond pads on the chip are connected by wire bonding to the pins of the conventional package. Design rules for standard packages require bond pads to be located on the perimeter of the chip. In order to prevent two designs for the same chip, a redistribution layer is usually required to connect bumps to bond pads. The dual in-line package is an electronic component package with a rectangular housing and two parallel rows of electrical connectors. The package may be placed through a hole on a printed circuit board (PCB). More and more complex circuits required more signal and power supply lines. Eventually, microprocessors and related complex devices needed more leads than could be mounted on a DIP box, leading to the development of higher-density chip carriers. In addition, square and rectangular packages also made it easier for the printed-circuit traces to be routed under packages. Semiconductor packaging technology has advanced significantly and several thousand different types of semiconductor packages have been manufactured. Industries such as aerospace, healthcare, data centers and many other sectors are projected to be the main growth factors for the advanced semiconductor packaging industry in the coming years. In view of market apprehensions, several semiconductor companies around the world have developed different modes of operation to meet the requirements of the industry. Companies Profiled Key Topics Covered: Chapter 1. Market Scope & Methodology Chapter 2. Market Overview 2.1 Introduction 2.1.1 Overview 2.1.2 Executive Summary 2.1.3 Market Composition and Scenario 2.2 Key Factors Impacting the Market 2.2.1 Market Drivers 2.2.2 Market Restraints Chapter 3. Competition Analysis - Global 3.1 Cardinal Matrix 3.2 Recent Industry Wide Strategic Developments 3.2.1 Partnerships, Collaborations and Agreements 3.2.2 Product Launches and Product Expansions 3.2.3 Geographical Expansions 3.2.4 Mergers & Acquisitions 3.3 Top Winning Strategies 3.3.1 Key Leading Strategies: Percentage Distribution (2016-2020) 3.3.2 Key Strategic Move: (Partnerships, Collaborations, and Agreements : 2016, Jan - 2019, Dec) Leading Players Chapter 4. North America Advanced Packaging Market by Type 4.1 North America Advanced Packaging Flip-Chip Ball Grid Array Market by Country 4.2 North America Advanced Packaging Flip Chip CSP Market by Country 4.3 North America Advanced Packaging Wafer Level CSP Market by Country 4.4 North America Advanced Packaging 2.5D/3D Market by Country 4.5 North America Other Type Advanced Packaging Market by Country Chapter 5. North America Advanced Packaging Market by End User 5.1 North America Consumer Electronics Advanced Packaging Market by Country 5.2 North America Automotive Advanced Packaging Market by Country 5.3 North America Industrial Advanced Packaging Market by Country 5.4 North America Aerospace & Defense Advanced Packaging Market by Country 5.5 North America Healthcare & Life Sciences Advanced Packaging Market by Country 5.6 North America Others Advanced Packaging Market by Country Chapter 6. North America Advanced Packaging Market by Country Chapter 7. Company Profiles 7.1 Company Overview 7.1 Financial Analysis 7.2 Segmental and Regional Analysis 7.3 Research & Development Expense 7.4 Recent strategies and developments 7.4.1 Partnerships, Collaborations, and Agreements 7.4.2 Geographical Expansions 7.5 SWOT Analysis For more information about this report visit https://www.researchandmarkets.com/r/5xyhzn

Answer: North America Advanced Packaging Market, 2020-2026 - Focus on Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D Markets - ResearchAndMarkets.com