From: bdb%cs@hellgate.utah.edu (Beat Bruderlin)
Newsgroups: news.announce.conferences
Subject: CFP: SOLID MODELING '93
Date: 21 Aug 92 00:01:57 GMT
Expires: Tue, 1 Sep 1992 07:00:00 GMT
Organization: University of Utah


           *********************
           *  CALL FOR PAPERS  *
           *********************

 *****************************************
 *                                       *
 *          SOLID MODELING '93           *
 *                                       *
 *     SECOND ACM/IEEE SYMPOSIUM ON      *
 *    SOLID MODELING AND APPLICATIONS    *
 *                                       *
 *****************************************

Montreal, Canada, May 19-21, 1993

Co-sponsored by ACM/SIGGRAPH
In cooperation with the IEEE Computer Society


This symposium provides an international forum for the
exchange of recent research and practical results in all
areas and applications of solid modeling. The first symposium
in this series, held in June 1991, in Austin, Texas, brought
together the the most prominent researchers, key
practitioners, and numerous students in this rapidly growing
field. Emphasis is on the impact of solid modeling in design
and manufacturing, including such topics as

    * Geometric and topological domain
    * Representation conversion
    * Blends, sweeps, offsets
    * Algorithmic complexity
    * Geometric reasoning
    * Interference/clearance analysis
    * Hardware support
    * User interaction techniques
    * Feature-based modeling
    * Constraint-based design
    * Parametric design
    * Assembly modeling
    * Product modeling
    * Product data exchange
    * Manufacturing planning
    * Engineering analysis


Papers should be at most 6000 words in length, and should
present previously unpublished original results. Please
submit abstracts and papers to Mary Johnson at the address
listed below. The schedule for submissions is as follows:

September 1, 1992: Abstract due (150-300 words)
October 15, 1992:  Full papers due (6 copies)
January 7, 1993:   Notice of acceptance & reviewers' comments
February 7, 1993:  Final camera-ready papers due


To receive an advance program, or to obtain further
information, please contact

    ***************************************
    *  Mary Johnson                       *
    *  Design Research Center, CII 7015   *
    *  Rensselaer Polytechnic Institute   *
    *  Troy,  NY 12180-3590               *
    *                                     *
    *  Phone:   (518) 276-6751            *
    *  FAX:     (518) 276-2702            *
    *  E-mail:  mjohnson@rdrc.rpi.edu     *
    ***************************************


Conference Co-Chairs
--------------------
  Joshua Turner, Rensselaer
  Jarek Rossignac, IBM
  George Allen, EDS

Conference Coordinator
----------------------
  Mary Johnson, Rensselaer

Program Committee
-----------------
  David Anderson, Purdue University
  Peter Brown, NIST
  Beat Bruderlin, University of Utah
  Pere Brunet, Univ. Poli. Catalunya
  Alan de Pennington, University of Leeds
  David Gossard, MIT
  Mark Henderson, Arizona State University
  Christoph Hoffman, Purdue University
  Frederik Jansen, Delft University
  Fumihiko Kimura, University of Tokyo
  Kunwoo Lee, Seoul National University
  Martti Mantyla, Helsinki University
  James Miller, University of Kansas
  Michael Pratt, Cranfield
  Aristides Requicha, USC
  Wolfgang Strasser, Eberhard-Karls Univ.
  Robert Tilove, General Motors
  Tamas Varady, Hungarian Acad. Sciences
  Herbert Voelcker, Cornell
  Peter Wilson, Rensselaer
  Tony Woo, University of Michigan
  John Woodwark, Computer-Aided Design
  Michael Wozny, Rensselaer