From: janet@venus.ic.cmc.ca (Janet Tite)
Subject: NIM:  Submission Deadline - January 14, 1993
Organization: Canadian Microelectronics Corporation
Distribution: can
Date: Tue, 12 Jan 1993 15:59:00 GMT

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
CANADIAN MICROELECTRONICS CORPORATION/SOCIETE CANADIENNE DE MICRO-ELECTRONIQUE
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                                                      Please post or circulate


                        CMC - NEWS IN MICROELECTRONICS

                     Volume 5, Number 1, January 12, 1993
                  [Message #785 on the CMC.USER Bulletin Board]

           TODAY'S ISSUE:   Submission Deadline - January 14, 1993 
______________________________________________________________________________
^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^

January  14,    1993   is  the  next  submission  deadline  for  Requests  for
Manufacturing Resources (RFMRs).  If you are from a university licensed by CMC
for the CMOS4S technology  and  you  want the chance to guarantee space on the
March 1993 run, you should complete  and  return an RFMR form, appended below,
now.  You can  also  take  this  opportunity  to apply for space on subsequent
CMOS4S runs.  Applicants will receive our decision about all RFMR  submissions
by Friday, January 22, 1993 - whether the submission is for the March run or a
subsequent CMOS4S run.  All RFMRs will be acknowledged  by  e-mail  to confirm
receipt.  If  you do not receive e-mail confirmation within one working day of
mailing the RFMR to  CMC  then  please contact Lynda Moore:  telephone:  (613)
545-2914, fax:  (613) 548-8104, e-mail:  moore@cmc.ca.

If you miss the RFMR deadline you will still have a chance  to secure space on
the run by applying  for either Pay-for-Implementation (PFI) area or for space
in the Last Minute Club  (LMC).    Except  where  special circumstances apply,
applications  to  the  Last  Minute Club  will  be  queued  on  a  first-come,
first-serve basis.  PFI and LMC applications  should be submitted on a Request
for  Implementation  (RFI)  form  and will be accepted  any  time  up  to  and
including March 10, 1993. 

A full explanation of the RFMR,  Pay-for-Implementation  and  Last Minute Club
arrangements  can    be   found  in  ICI-041  "Allocation  of  Limited  Access
Manufacturing Resources -  CMOS4S".    This report includes a copy of the RFMR
form and is available electronically via AIM, AIM reference number RE0153. 

If you need any advice on the allocation arrangements  or on the completion of
the RFMR form please contact:

 		            Hsu Ho
                            Design Quality Engineer
                            Telephone:    (613) 545-2914 
                            E-mail:       vlsiic@cmc.ca

===============================================================================

                      Request For Manufacturing Resources
=====================================================================
C A N A D I A N  M I C R O L E C T R O N I C S  C O R P O R A T I O N
Queen's University  Rm 210A Carruthers Hall  Kingston Ontario  K7L 3N6
=====================================================================


SECTION I:  GENERAL INFORMATION
*******************************

Technology _____ (e.g. CA for CMOS4S)

Contact Person:
  Name  __________________________________________________
  Date  __________________
  Phone __________________
  FAX   __________________
  E-mail address _________________________________________

Project reference: ______________________

Requested Designs (the designs should correspond to one project):

      Design Name **         Dimensions              Target Run 
                       (design-scale microns)     (e.g. MPCYYNNTI)  


1.  ___________          ______ x ______           __________ 
2.  ___________          ______ x ______           __________
3.  ___________          ______ x ______           __________

  (add lines as needed)

  ** Names must be of the form ICAUUDDD for CMOS4S, where UU=univ code and 
     DDD=identifier (e.g. ICAMBTST)


List special requests, if known (e.g. special packaging or bonding 
instructions, extra chips or dice, etc.): 

      Design Name                       Special Requests

  1.  ___________     _______________________________________________________
  2.  ___________     _______________________________________________________
  3.  ___________     _______________________________________________________

  (add lines as needed)


Project Description [max. 10 lines]:
______________________________________________________________________________
______________________________________________________________________________
______________________________________________________________________________
______________________________________________________________________________
______________________________________________________________________________
______________________________________________________________________________
______________________________________________________________________________
______________________________________________________________________________
______________________________________________________________________________
______________________________________________________________________________

SECTION II:  ADDRESSING THE ALLOCATION CRITERIA
***********************************************


1.  Need for Implementation in this Technology
    

  a) Justify your need for implementation in this technology [max. 8 lines]:
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________

  b) Can some components of this project be manufactured in other technologies? 
     ____ Yes
        Which components [max. 3 lines]?
        ______________________________________________________________________
        ______________________________________________________________________
        ______________________________________________________________________
     ____ No
          Explain [max. 3 lines]?
        ______________________________________________________________________
        ______________________________________________________________________
        ______________________________________________________________________

  c) Describe the feasibility of the project, i.e. elaborate on the design
     methodology from functional specification to test plans. Make reference
     to specific tools/equipment where appropriate [max. 12 lines]:
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________

  d) Describe the detriment to the project if access to this technology is not 
     granted [max. 4 lines]:
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________

2.  Quality, Impact and Management of the Project


  a) What are the primary objectives of the project [max. 5 lines]?
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________

  b) Describe the contributions to be made by this project (e.g. to the
     advancement of the state-of-the-art in microelectronics, to research
     programs, etc.) [max. 5 lines]:
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________

  c) Are you collaborating with industry or other external agencies?
     ____ Yes
        Provide the following information for each organization:
         Organization                         Contact                 Support
                    
                                                                     

                                                                      


          (add lines as needed)

     ____ No

  d) Describe the research team (faculty, graduate students, and research 
     associates) for this project (primary investigators first):
       Name: ___________________________________________
       Position: _______________________________________
       Percentage of time committed to the project: ____%

       Name: ___________________________________________
       Position: _______________________________________
       Percentage of time committed to the project: ____%

       (add items as needed)
  
  e) Provide references for papers (conference or journal), produced by members
     of your research team within the last three years, that are most relevant
     to this project [max. 5 papers in total]:
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________

  f) Does this design contribute to a student's postgraduate degree program?
     ____ Yes
       Student: ______________________________________________________________
       Faculty Advisor(s): ___________________________________________________

       (add items as needed)

     ____ No
        Reason for fabricating this design [max. 3 lines]:
        ______________________________________________________________________
        ______________________________________________________________________
        ______________________________________________________________________

  g) Describe the support (e.g. funding, facilities) available for this 
     project [max. 5 lines]:
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________

  h) What is the total number of designs fabricated through CMC in the past 
     three years by the principal members of your research team? 
         0-3: ____      4-6: ____      > 6: ____ (check one)

  i) Were test reports returned to CMC for every design in (h)?
     ____ Yes
     ____ No
        Explain [max. 3 lines]:
        ______________________________________________________________________
        ______________________________________________________________________
        ______________________________________________________________________
    
  j) Provide any additional information you feel is relevant to the quality,
     impact, and/or management of the project (optional) [max. 5 lines]:
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________
     _________________________________________________________________________


>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>><<<<<<<<<<<<<<<<<<<<<<<<<<<<<< 
                      FOR CMC USE ONLY                                  
                                                                        
 Time $_______  Materials $_______  Handling $________  Total $ _______ 
                                                    Charge Code ________
>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>><<<<<<<<<<<<<<<<<<<<<<<<<<<<<<
                                                          Form RFMR1.0/911127

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CMC - NEWS  IN  MICROELECTRONICS is distributed electronically by the Canadian
Microelectronics  Corporation  for  information    exchange  between  Canadian
individuals  and groups working in  VLSI-related  fields.    Some  issues  are
available in printed form.

For further information contact Janet Tite     Internet:   vlsiic@cmc.ca
                                               FAX:        613/548-8104

~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
CANADIAN MICROELECTRONICS CORPORATION/SOCIETE CANADIENNE DE MICRO-ELECTRONIQUE
~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~

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