GreatNorthCollective/greatnorth-canada-federal-laws-text huggingface dataset:
Export Control List — 5503
5503 Anti-personnel mines as defined in section 2 of the Anti-Personnel Mines Convention Implementation Act . ( All destinations )
Export Control List — (1)
(1) In this item, development , production , software , spacecraft , technology and use have the same meaning as in the provision of the Guide entitled “Definitions of Terms Used in Groups 1 and 2”.
Export Control List — (2)
(2) Strategic goods and technology as follows: (a) goods and technology referred to in Group 1 of the Guide as follows, (i) global navigation satellite systems receiving equipment referred to in item 1-7.A.5. of the Guide, the associated software referred to in item 1-7.D. of the Guide, and the associated technology referred to in item 1-7.E. of the Guide ( All destinations other than the United States ), and (ii) propulsion and space-related equipment referred to in items 1-9.A.4. to 1-9.A.11. of the Guide, the associated software referred to in item 1-9.D. of the Guide, and the associated technology referred to in item 1-9.E. of the Guide; ( All destinations other than the United States ) (b) software that is specially designed or modified for the development or use of the goods or technology referred to in paragraphs (d) to (i); ( All destinations other than the United States ) (c) technology that is specially designed or modified for the development or production of the goods or technology referred to in paragraphs (d) to (i); ( All destinations other than the United States ) (d) payloads specially designed or modified for spacecraft, and specially designed components therefor, other than payloads or components that are referred to in Group 1 of the Guide; ( All destinations other than the United States ) (e) ground control stations for telemetry and tracking and control of space launch vehicles or spacecraft, and specially designed components therefor; ( All destinations other than the United States ) (f) chemiluminescent compounds specially designed or modified for military use, and specially designed components therefor; ( All destinations other than the United States ) (g) radiation-hardened microelectronic circuits that meet or exceed all of the following, and specially designed components therefor, namely: (i) a total dose of 5 × 10 5 Rads (SI), (ii) a dose rate upset of 5 × 10 8 Rads (SI)/sec, (iii) a neutron dose of 1 × 10 14 N/cm 2 , (iv) a single event upset of 1 × 10 -7 or less error/bit/day, and (v) single event latch-up free and having a dose rate latch-up of 5 × 10 8 Rads (SI)/sec or greater; ( All destinations other than the United States ) (h) nuclear weapons design and test equipment, namely: (i) any article, material, equipment or device which is specially designed or modified for use in the design, development or fabrication of nuclear weapons or nuclear explosive devices, (All destinations) (ii) any article, material, equipment or device which is specially designed or modified for use in the devising, carrying out or evaluating of nuclear weapons tests or other nuclear explosions; (All destinations) and (i) any other articles not specifically set out in paragraphs (a) to (h) or in Group 2 or Group 6 that are United States origin goods or technology, which have been determined under Parts 120 to 130 of Title 22 of the International Traffic in Arms Regulations of the Code of Federal Regulations (United States) as having substantial military applicability, and which have been specially designed or modified for military purposes. ( All destinations other than in the United States )
Export Control List — (a)
(a) goods and technology referred to in Group 1 of the Guide as follows, (i) global navigation satellite systems receiving equipment referred to in item 1-7.A.5. of the Guide, the associated software referred to in item 1-7.D. of the Guide, and the associated technology referred to in item 1-7.E. of the Guide ( All destinations other than the United States ), and (ii) propulsion and space-related equipment referred to in items 1-9.A.4. to 1-9.A.11. of the Guide, the associated software referred to in item 1-9.D. of the Guide, and the associated technology referred to in item 1-9.E. of the Guide; ( All destinations other than the United States )
Export Control List — (i)
(i) global navigation satellite systems receiving equipment referred to in item 1-7.A.5. of the Guide, the associated software referred to in item 1-7.D. of the Guide, and the associated technology referred to in item 1-7.E. of the Guide ( All destinations other than the United States ), and
Export Control List — (ii)
(ii) propulsion and space-related equipment referred to in items 1-9.A.4. to 1-9.A.11. of the Guide, the associated software referred to in item 1-9.D. of the Guide, and the associated technology referred to in item 1-9.E. of the Guide; ( All destinations other than the United States )
Export Control List — (b)
(b) software that is specially designed or modified for the development or use of the goods or technology referred to in paragraphs (d) to (i); ( All destinations other than the United States )
Export Control List — (c)
(c) technology that is specially designed or modified for the development or production of the goods or technology referred to in paragraphs (d) to (i); ( All destinations other than the United States )
Export Control List — (d)
(d) payloads specially designed or modified for spacecraft, and specially designed components therefor, other than payloads or components that are referred to in Group 1 of the Guide; ( All destinations other than the United States )
Export Control List — (e)
(e) ground control stations for telemetry and tracking and control of space launch vehicles or spacecraft, and specially designed components therefor; ( All destinations other than the United States )
Export Control List — (f)
(f) chemiluminescent compounds specially designed or modified for military use, and specially designed components therefor; ( All destinations other than the United States )
Export Control List — (g)
(g) radiation-hardened microelectronic circuits that meet or exceed all of the following, and specially designed components therefor, namely: (i) a total dose of 5 × 10 5 Rads (SI), (ii) a dose rate upset of 5 × 10 8 Rads (SI)/sec, (iii) a neutron dose of 1 × 10 14 N/cm 2 , (iv) a single event upset of 1 × 10 -7 or less error/bit/day, and (v) single event latch-up free and having a dose rate latch-up of 5 × 10 8 Rads (SI)/sec or greater; ( All destinations other than the United States )
Export Control List — (ii)
(ii) a dose rate upset of 5 × 10 8 Rads (SI)/sec,
Export Control List — (iii)
(iii) a neutron dose of 1 × 10 14 N/cm 2 ,
Export Control List — (iv)
(iv) a single event upset of 1 × 10 -7 or less error/bit/day, and
Export Control List — (v)
(v) single event latch-up free and having a dose rate latch-up of 5 × 10 8 Rads (SI)/sec or greater; ( All destinations other than the United States )
Export Control List — (h)
(h) nuclear weapons design and test equipment, namely: (i) any article, material, equipment or device which is specially designed or modified for use in the design, development or fabrication of nuclear weapons or nuclear explosive devices, (All destinations) (ii) any article, material, equipment or device which is specially designed or modified for use in the devising, carrying out or evaluating of nuclear weapons tests or other nuclear explosions; (All destinations) and
Export Control List — (i)
(i) any article, material, equipment or device which is specially designed or modified for use in the design, development or fabrication of nuclear weapons or nuclear explosive devices, (All destinations)
Export Control List — (ii)
(ii) any article, material, equipment or device which is specially designed or modified for use in the devising, carrying out or evaluating of nuclear weapons tests or other nuclear explosions; (All destinations) and
Export Control List — (i)
(i) any other articles not specifically set out in paragraphs (a) to (h) or in Group 2 or Group 6 that are United States origin goods or technology, which have been determined under Parts 120 to 130 of Title 22 of the International Traffic in Arms Regulations of the Code of Federal Regulations (United States) as having substantial military applicability, and which have been specially designed or modified for military purposes. ( All destinations other than in the United States )
Export Control List — (1)
(1) Goods and technology whether or not included elsewhere on the List if their properties and any information made known to the exporter by any intermediary or final consignee or from any other source would lead a reasonable person to suspect that they will be used (a) in the development, production, handling, operation, maintenance, storage, detection, identification or dissemination of (i) chemical or biological weapons, (ii) nuclear explosive or radiological dispersal devices, or (iii) materials or equipment that could be used in such weapons or devices; (b) in the development, production, handling, operation, maintenance or storage of (i) missiles or other systems capable of delivering chemical or biological weapons or nuclear explosive or radiological dispersal devices, or (ii) materials or equipment that could be used in such missiles or systems; or (c) in any facility used for any of the activities described in paragraphs (a) and (b).
Export Control List — (a)
(a) in the development, production, handling, operation, maintenance, storage, detection, identification or dissemination of (i) chemical or biological weapons, (ii) nuclear explosive or radiological dispersal devices, or (iii) materials or equipment that could be used in such weapons or devices;
Export Control List — (ii)
(ii) nuclear explosive or radiological dispersal devices, or
Export Control List — (iii)
(iii) materials or equipment that could be used in such weapons or devices;
Export Control List — (b)
(b) in the development, production, handling, operation, maintenance or storage of (i) missiles or other systems capable of delivering chemical or biological weapons or nuclear explosive or radiological dispersal devices, or (ii) materials or equipment that could be used in such missiles or systems; or
Export Control List — (i)
(i) missiles or other systems capable of delivering chemical or biological weapons or nuclear explosive or radiological dispersal devices, or
Export Control List — (ii)
(ii) materials or equipment that could be used in such missiles or systems; or
Export Control List — (c)
(c) in any facility used for any of the activities described in paragraphs (a) and (b).
Export Control List — (2)
(2) Goods and technology whether or not included elsewhere on the List if the Minister has determined, on the basis of their properties and any additional information relating to such matters as their intended end-use or the identity or conduct of their intermediary or final consignees, that they are likely to be used in the activities or facilities referred to in subitem (1).
Export Control List — (3)
(3) Subitem (1) applies to goods and technology intended for export to all destinations unless (a) they are intended for end-use in Argentina, Australia, Austria, Belgium, Bulgaria, the Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Ireland, Italy, Japan, Luxembourg, the Netherlands, New Zealand, Norway, Poland, Portugal, the Republic of Korea, Spain, Sweden, Switzerland, Turkey, Ukraine, the United Kingdom or the United States; (b) their intermediary consignees, if any, are located in those countries; and (c) their final consignee is located in one of those countries.
Export Control List — (a)
(a) they are intended for end-use in Argentina, Australia, Austria, Belgium, Bulgaria, the Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Ireland, Italy, Japan, Luxembourg, the Netherlands, New Zealand, Norway, Poland, Portugal, the Republic of Korea, Spain, Sweden, Switzerland, Turkey, Ukraine, the United Kingdom or the United States;
Export Control List — (b)
(b) their intermediary consignees, if any, are located in those countries; and
Export Control List — (c)
(c) their final consignee is located in one of those countries.
Export Control List — (4)
(4) Subitem (2) applies to goods and technology intended for export to all destinations.
Export Control List — (1)
(1) In this item, composite , development , electronic assembly , Gate-All-Around Field-Effect Transistor (GAAFET) , laser , matrix , production , software , substrate , substrate blanks , technology and use have the same meaning as in the Guide under the heading “Definitions of Terms Used in Groups 1 and 2”.
Export Control List — (2)
vation and measurement of the additive manufacturing process including the measurement of electromagnetic or thermal emissions from the melt pool. 2 In clause (C), coaxial configuration , also known as on-axis or inline configuration, means a configuration in which one or more sensors are mounted in an optical path shared by the laser consolidation source. 3 In clause (C), paraxial configuration means a configuration in which one or more sensors are mounted onto or integrated into the laser, electron beam, or electric arc consolidation source component. 4 In clause (C), for both coaxial configuration and paraxial configuration, the field of view of the sensors is fixed to the moving reference frame of the consolidation source and moves in the same scan trajectory throughout the build process. (vi) Extreme Ultraviolet (EUV) lithography masks and EUV lithography reticles, designed for integrated circuits, and having mask substrate blanks specified in paragraph 1-3.B.1.j of the Guide, NOTE Subparagraph (vi) also applies to masks and reticles with a mounted pellicle. (vii) pellicles specially designed for EUV lithography, and NOTE 1 In subparagraphs (vi) and (vii), pellicle means a membrane that is integrated with a frame and that is designed to protect a mask or reticle from particle contamination. 2 In subparagraphs (vi) and (vii), Extreme Ultraviolet means electromagnetic spectrum wavelengths greater than 5 nm and less than 124 nm. (viii) cryogenic wafer probing equipment designed to test devices at a temperature less than or equal to 4.5 K (-268.65°C), and to accommodate wafer diameters greater than or equal to 100 mm; (e) materials, other than those referred to in Group 1 of the Guide, as follows: (i) epitaxial materials consisting of a substrate having at least one epitaxially grown layer of any of the following: (A) silicon having an isotopic impurity of less than 0.08% of silicon isotopes other than silicon-28 or silicon-30, or (B) germanium having an isotopic impurity of less than 0.08% of germanium isotopes other than germanium-70, germanium-72, germanium-74, or germanium-76, (ii) fluorides, hydrides, or chlorides, of silicon or germanium, containing any of the following: (A) silicon having an isotopic impurity of less than 0.08% of silicon isotopes other than silicon-28 or silicon-30, or (B) germanium having an isotopic impurity of less than 0.08% of germanium isotopes other than germanium-70, germanium-72, germanium-74, or germanium-76, and (iii) silicon, silicon oxides, germanium or germanium oxides, containing any of the following: (A) silicon having an isotopic impurity of less than 0.08% of silicon isotopes other than silicon-28 or silicon-30, or (B) germanium having an isotopic impurity of less than 0.08% of germanium isotopes other than germanium-70, germanium-72, germanium-74, or germanium-76. NOTE Subparagraph (iii) includes substrates, lumps, ingots, boules and preforms of those materials.
Export Control List — (a)
(a) subject to the “General Software Note” in Group 1 of the Guide, software, other than that referred to in Group 1 of the Guide, as follows: (i) software specially designed or modified for the development or production of items specified in clause (c)(ii)(B) or (C), or any of subparagraphs (c)(iii) and (d)(iii), (iv) and (vi) to (viii), (ii) software specially designed for the use of items specified in subparagraph (d)(iii), (iii) software designed to extract Graphic Design System II (GDSII) or equivalent standard layout data and perform layer-to-layer alignment from Scanning Electron Microscope (SEM) images, and to generate multi-layer GDSII data or the circuit netlist, and NOTE In subparagraph (iii), Graphic Design System II (GDSII) means a database file format for the data exchange of integrated circuit artwork or integrated circuit layout artwork. (iv) software specially designed or modified for the development or production of items specified in subparagraph (d)(v);
Export Control List — (i)
(i) software specially designed or modified for the development or production of items specified in clause (c)(ii)(B) or (C), or any of subparagraphs (c)(iii) and (d)(iii), (iv) and (vi) to (viii),
Export Control List — (ii)
(ii) software specially designed for the use of items specified in subparagraph (d)(iii),
Export Control List — (iii)
(iii) software designed to extract Graphic Design System II (GDSII) or equivalent standard layout data and perform layer-to-layer alignment from Scanning Electron Microscope (SEM) images, and to generate multi-layer GDSII data or the circuit netlist, and NOTE In subparagraph (iii), Graphic Design System II (GDSII) means a database file format for the data exchange of integrated circuit artwork or integrated circuit layout artwork.
Export Control List — Export Control List
NOTE In subparagraph (iii), Graphic Design System II (GDSII) means a database file format for the data exchange of integrated circuit artwork or integrated circuit layout artwork.
Export Control List — Export Control List
In subparagraph (iii), Graphic Design System II (GDSII) means a database file format for the data exchange of integrated circuit artwork or integrated circuit layout artwork.
Export Control List — (iv)
(iv) software specially designed or modified for the development or production of items specified in subparagraph (d)(v);
Export Control List — (b)
(b) subject to the “General Technology Note” in Group 1 of the Guide, technology, other than that are referred to in Group 1 of the Guide, as follows: (i) technology specially designed or modified for the development or production of items specified in clause (c)(ii)(B) or (C), subparagraph (c)(iii) or (iv), any of subparagraphs (d)(iii) to (viii) or paragraph (e), (ii) technology specially designed or modified for the development or production of integrated circuits or of devices, using Gate-All-Around Field-Effect Transistor (GAAFET) structures, NOTE 1 Subparagraph (ii) includes process recipes. Process recipe means a set of conditions and parameters for a particular process step. 2 Subparagraph (ii) does not apply to technology used for tool qualification or maintenance. (iii) technology for the development or production of coating systems that are designed to protect ceramic matrix composite materials specified in item 1-1.C.7 of the Guide from corrosion, and to operate at temperatures exceeding 1,373.15 K (1,100℃), and NOTE In subparagraph (iii), coating system means a coating consisting of materials in one or more layers – for example, bond, interlayer, top coat – deposited on a substrate. (iv) technology for the development of software specified in subparagraph (a)(iv);
Export Control List — (i)
(i) technology specially designed or modified for the development or production of items specified in clause (c)(ii)(B) or (C), subparagraph (c)(iii) or (iv), any of subparagraphs (d)(iii) to (viii) or paragraph (e),
Export Control List — (ii)
(ii) technology specially designed or modified for the development or production of integrated circuits or of devices, using Gate-All-Around Field-Effect Transistor (GAAFET) structures, NOTE 1 Subparagraph (ii) includes process recipes. Process recipe means a set of conditions and parameters for a particular process step. 2 Subparagraph (ii) does not apply to technology used for tool qualification or maintenance.
Export Control List — 1
NOTE 1 Subparagraph (ii) includes process recipes. Process recipe means a set of conditions and parameters for a particular process step. 2 Subparagraph (ii) does not apply to technology used for tool qualification or maintenance.
Export Control List — 1
1 Subparagraph (ii) includes process recipes. Process recipe means a set of conditions and parameters for a particular process step.
Export Control List — 2
2 Subparagraph (ii) does not apply to technology used for tool qualification or maintenance.
Export Control List — (iii)
(iii) technology for the development or production of coating systems that are designed to protect ceramic matrix composite materials specified in item 1-1.C.7 of the Guide from corrosion, and to operate at temperatures exceeding 1,373.15 K (1,100℃), and NOTE In subparagraph (iii), coating system means a coating consisting of materials in one or more layers – for example, bond, interlayer, top coat – deposited on a substrate.
Export Control List — Export Control List
NOTE In subparagraph (iii), coating system means a coating consisting of materials in one or more layers – for example, bond, interlayer, top coat – deposited on a substrate.
Export Control List — Export Control List
In subparagraph (iii), coating system means a coating consisting of materials in one or more layers – for example, bond, interlayer, top coat – deposited on a substrate.
Export Control List — (iv)
(iv) technology for the development of software specified in subparagraph (a)(iv);
Export Control List — (c)
 as necessary. 8 In clause (A), connected means that two-qubit gate operations can be performed between any arbitrary pair of the available working physical qubits. This does not necessarily entail all-to-all connectivity. 9 In clause (A), working means that the physical qubit performs universal quantum computational work according to the system specifications for qubit operational fidelity. 10 In clause (A), C-NOT error means the average physical gate error for the nearest-neighbour two-physical qubit Controlled-NOT (C-NOT) gates. (iii) parametric signal amplifiers designed to operate at an ambient temperature below 1 K (-272.15 ℃) and at a frequency from 2 GHz to 15 GHz, and having a noise figure of less than 0.015 dB when operating at that temperature and frequency, NOTE In subparagraph (iii), parametric signal amplifier , or Quantum-Limited Amplifier (QLA), includes a Travelling Wave Parametric Amplifier (TWPA). (iv) cryogenic cooling systems and components, as follows: (A) systems rated to provide a cooling power of 600 µW or more at a temperature of 0.1 K (-273.05°C) or lower for more than 48 hours, and (B) two-stage pulse tube cryocoolers rated to maintain a temperature lower than 4 K (-269.15°C) and to provide a cooling power of 1.5 W or more at a temperature of 4.2 K (-268.95°C) or lower;
Export Control List — (i)
(i) Complementary Metal Oxide Semiconductor (CMOS) integrated circuits designed to operate at an ambient temperature equal to or less (better) than 4.5 K (-268.65°C), NOTE For the purposes of subparagraph (i), Complementary Metal Oxide Semiconductor (CMOS) integrated circuits can also be referred to as cryogenic CMOS or cryoCMOS.
Export Control List — Export Control List
NOTE For the purposes of subparagraph (i), Complementary Metal Oxide Semiconductor (CMOS) integrated circuits can also be referred to as cryogenic CMOS or cryoCMOS.
Export Control List — Export Control List
For the purposes of subparagraph (i), Complementary Metal Oxide Semiconductor (CMOS) integrated circuits can also be referred to as cryogenic CMOS or cryoCMOS.