Reference number : GC-2017-Q3-00477, amendment number : , agreement type : G, recipient legal name : Mayer, Michael (University of Waterloo), recipient country : CA, recipient province : nan, recipient city : Ontario, recipient postal code : nan, program name english : Engage Grants for universities, program name french : Subventions d'engagement partenarial pour les universités, program purpose english : For novel X-ray detectors, amorphous Selenium films are used on top of semiconductor substrates in_x000D_
combination with integrated circuits. Electrical connections to the Selenium layer are needed for operation._x000D_
Typically, fine wires are used. The requirements for joining of the fine wires to the Selenium include low_x000D_
temperature (room temperature ideally), no organic adhesive reacting with Selenium, and small size as the_x000D_
joints should not obstruct the X-ray images._x000D_
Microelectronic wire bonding is the main technology to interconnect to integrated circuits. Existing low_x000D_
temperature processes of wire bonding are suggested for this project. Wire bonds have 100 % metallic nature_x000D_
and are very small but do not stick to all surfaces. To facilitate wire bonding, the Selenium is coated with a thin_x000D_
Gold layer. However, as the Gold coating is thin and the Selenium layer quite soft, wire bonding often results_x000D_
in non-sticking failure. The bonds that stick might not be reliable in the long run._x000D_
The development of a consistent low temperature wire bonding process and its reliability evaluation is_x000D_
proposed in this project to achieve the electrical connection of bonding wire to Gold coated Selenium. This_x000D_
process will allow the development of miniaturized and high resolution X-ray detectors with sufficient pixels._x000D_
The project will adopt an improved design-of-experiment methods for the process development combined with_x000D_
reliability methods such as novel current stressing and real time resistance monitoring systems recently_x000D_
developed at the University of Waterloo. In contrast to other joining methods such as conductive adhesives and_x000D_
soldering, a successfully developed low temperature wire bonding process to Selenium will maximize the_x000D_
performance of the X-ray detector. The findings from the process development and reliability evaluation will_x000D_
add to the knowledge on wire bonding technology in general., program purpose french : For novel X-ray detectors, amorphous Selenium films are used on top of semiconductor substrates in_x000D_
combination with integrated circuits. Electrical connections to the Selenium layer are needed for operation._x000D_
Typically, fine wires are used. The requirements for joining of the fine wires to the Selenium include low_x000D_
temperature (room temperature ideally), no organic adhesive reacting with Selenium, and small size as the_x000D_
joints should not obstruct the X-ray images._x000D_
Microelectronic wire bonding is the main technology to interconnect to integrated circuits. Existing low_x000D_
temperature processes of wire bonding are suggested for this project. Wire bonds have 100 % metallic nature_x000D_
and are very small but do not stick to all surfaces. To facilitate wire bonding, the Selenium is coated with a thin_x000D_
Gold layer. However, as the Gold coating is thin and the Selenium layer quite soft, wire bonding often results_x000D_
in non-sticking failure. The bonds that stick might not be reliable in the long run._x000D_
The development of a consistent low temperature wire bonding process and its reliability evaluation is_x000D_
proposed in this project to achieve the electrical connection of bonding wire to Gold coated Selenium. This_x000D_
process will allow the development of miniaturized and high resolution X-ray detectors with sufficient pixels._x000D_
The project will adopt an improved design-of-experiment methods for the process development combined with_x000D_
reliability methods such as novel current stressing and real time resistance monitoring systems recently_x000D_
developed at the University of Waterloo. In contrast to other joining methods such as conductive adhesives and_x000D_
soldering, a successfully developed low temperature wire bonding process to Selenium will maximize the_x000D_
performance of the X-ray detector. The findings from the process development and reliability evaluation will_x000D_
add to the knowledge on wire bonding technology in general., agreement title english : Development of Wire Bonding Process and Reliability Evaluation for Gold coated Selenium, agreement title french : Development of Wire Bonding Process and Reliability Evaluation for Gold coated Selenium, agreement number : EGP, agreement value : 24613.0, agreement start date : 2017-12-13, agreement end date : nan, description english : nan, description french : nan, expected results english : nan, expected results french : nan, additional information english : Grant or Award spanning more than one fiscal year (2017-2018 to 2018-2019)., additional information french : Subvention ou bourse octroyée s'appliquant à plus d'un exercice financier (2017-2018 à 2018-2019)., owner organization : nserc-crsng, owner organization title : Natural Sciences and Engineering Research Council of Canada | Conseil de recherches en sciences naturelles et en génie du Canada