Reference number : GC-2017-Q4-00844, amendment number : , agreement type : G, recipient legal name : Jahazi, Mohammad (École de technologie supérieure), recipient country : CA, recipient province : nan, recipient city : Quebec|Québec, recipient postal code : nan, program name english : Engage Grants for universities, program name french : Subventions d'engagement partenarial pour les universités, program purpose english : Prior to the implementation of Restrictions on Hazardous Substances (RoHS) regulations in 2006, Sn-Pb alloys_x000D_
had been the predominant solder alloy in electronic industry due to their low cost, low melting temperature,_x000D_
excellent wettability and good reliability. Since 2006 there has been considerable debate and distress over what_x000D_
alloy would replace dependable Sn-Pb. A Pb-free alloy made up of tin, silver (3.0%) and copper (0.5%)_x000D_
(SAC305) emerged as the industry standard during the RoHS transition because of its reasonable performance,_x000D_
low melting point compared to other alloys under consideration and compatibility with existing materials and_x000D_
processes. However, in the ensuing decade, electronic devices have been introduced in a myriad of new_x000D_
applications. For example, in automotive applications, in addition to basic on/off switches, there are now_x000D_
autonomous brake control systems, electronically controlled shock absorbers, hybrid power control systems_x000D_
and LED lighting. With the increasing variety and density of electronic devices, their role to ensure the safety_x000D_
of the vehicle and occupants becomes very critical. Therefore, the challenge is to guarantee the performance_x000D_
and reliability of car electronics is greater than ever. For such applications the traditional SAC305 or similar_x000D_
alloys with poor creep resistance and unstable mechanical performance are not sufficiently reliable. When_x000D_
exposed to high service temperatures and thermal cycling, SAC305 undergoes significant microstructure_x000D_
change, specifically, the coarsening of Ag3Sn and Cu6Sn5 particles, which leads to degradation of mechanical_x000D_
properties and poor creep resistance. Therefore, the electronics industry needs a new solder alloy with better_x000D_
reliability than SAC alloys. To improve reliability of SAC alloys, alloying with Bi, Sb, In, Mn, Ni et al. has_x000D_
been studied and suggested by some researchers. In order to develop a reliable solder alloy for high temperature_x000D_
and demanding applications, further improvement of SAC-Bi alloy has been studied. In this project a new_x000D_
SAC-X solder alloy (X represents alloying additions Bi, Sb, Ni,...) with better reliability is introduced and_x000D_
studied. The main objective of this project is to study effects of thermal cycling on the microstructure evolution, program purpose french : Prior to the implementation of Restrictions on Hazardous Substances (RoHS) regulations in 2006, Sn-Pb alloys_x000D_
had been the predominant solder alloy in electronic industry due to their low cost, low melting temperature,_x000D_
excellent wettability and good reliability. Since 2006 there has been considerable debate and distress over what_x000D_
alloy would replace dependable Sn-Pb. A Pb-free alloy made up of tin, silver (3.0%) and copper (0.5%)_x000D_
(SAC305) emerged as the industry standard during the RoHS transition because of its reasonable performance,_x000D_
low melting point compared to other alloys under consideration and compatibility with existing materials and_x000D_
processes. However, in the ensuing decade, electronic devices have been introduced in a myriad of new_x000D_
applications. For example, in automotive applications, in addition to basic on/off switches, there are now_x000D_
autonomous brake control systems, electronically controlled shock absorbers, hybrid power control systems_x000D_
and LED lighting. With the increasing variety and density of electronic devices, their role to ensure the safety_x000D_
of the vehicle and occupants becomes very critical. Therefore, the challenge is to guarantee the performance_x000D_
and reliability of car electronics is greater than ever. For such applications the traditional SAC305 or similar_x000D_
alloys with poor creep resistance and unstable mechanical performance are not sufficiently reliable. When_x000D_
exposed to high service temperatures and thermal cycling, SAC305 undergoes significant microstructure_x000D_
change, specifically, the coarsening of Ag3Sn and Cu6Sn5 particles, which leads to degradation of mechanical_x000D_
properties and poor creep resistance. Therefore, the electronics industry needs a new solder alloy with better_x000D_
reliability than SAC alloys. To improve reliability of SAC alloys, alloying with Bi, Sb, In, Mn, Ni et al. has_x000D_
been studied and suggested by some researchers. In order to develop a reliable solder alloy for high temperature_x000D_
and demanding applications, further improvement of SAC-Bi alloy has been studied. In this project a new_x000D_
SAC-X solder alloy (X represents alloying additions Bi, Sb, Ni,...) with better reliability is introduced and_x000D_
studied. The main objective of this project is to study effects of thermal cycling on the microstructure evolution, agreement title english : MICROSTRUCTURE EVOLUTION AND CHARACTERIZATION OF NOVEL SOLDER ALLOYS FOR DEMANDING APPLICATIONS, agreement title french : MICROSTRUCTURE EVOLUTION AND CHARACTERIZATION OF NOVEL SOLDER ALLOYS FOR DEMANDING APPLICATIONS, agreement number : EGP, agreement value : 25000.0, agreement start date : 2018-03-07, agreement end date : nan, description english : nan, description french : nan, expected results english : nan, expected results french : nan, additional information english : Grant or Award spanning more than one fiscal year (2017-2018 to 2018-2019)., additional information french : Subvention ou bourse octroyée s'appliquant à plus d'un exercice financier (2017-2018 à 2018-2019)., owner organization : nserc-crsng, owner organization title : Natural Sciences and Engineering Research Council of Canada | Conseil de recherches en sciences naturelles et en génie du Canada