Reference number : GC-2017-Q1-00493, amendment number : , agreement type : G, recipient legal name : Danovitch, David (Université de Sherbrooke), recipient country : CA, recipient province : nan, recipient city : Quebec|Québec, recipient postal code : nan, program name english : Engage Grants for Universities, program name french : Subventions d'engagement partenarial pour les universités, program purpose english : The object of this research project is to initiate an assessment of Au stud bump flip chip attach of silicon_x000D_
photonic (SiP) chips for the packaging of photonics modules of interest to the industrial partner TeraXion._x000D_
Employing its scientific and industrial knowledge and expertise in 'flip-chip' type bonding technology prevalent_x000D_
in microelectronics packaging, the research team will strive to determine how such technology could be_x000D_
implemented seamlessly within the unique requirements of TeraXion's modules. The research activities will_x000D_
first comprise the development of a Au stud bump process for SiP chips, then an evaluation of available_x000D_
bonding approaches with the goal to assess their compatibility with TeraXion's requirements, followed by an_x000D_
optical test assessment to verify the effects of the bonding process on Teraxion's chip integrity. This will result_x000D_
in a first proof of principle of Au stud bump flip chip attach for SiP assembly in order to validate the potential_x000D_
to transition TeraXion's modules to flip chip technologies and evaluate the effectiveness of the bonding process_x000D_
and propose directions for future activity. The outcome of this project will be to provide TeraXion with an_x000D_
increased knowledge of flip chip-compatible bonding options and a path to more thoroughly evaluate the most_x000D_
promising interconnection options for the packaging of TeraXion photonics modules., program purpose french : The object of this research project is to initiate an assessment of Au stud bump flip chip attach of silicon_x000D_
photonic (SiP) chips for the packaging of photonics modules of interest to the industrial partner TeraXion._x000D_
Employing its scientific and industrial knowledge and expertise in 'flip-chip' type bonding technology prevalent_x000D_
in microelectronics packaging, the research team will strive to determine how such technology could be_x000D_
implemented seamlessly within the unique requirements of TeraXion's modules. The research activities will_x000D_
first comprise the development of a Au stud bump process for SiP chips, then an evaluation of available_x000D_
bonding approaches with the goal to assess their compatibility with TeraXion's requirements, followed by an_x000D_
optical test assessment to verify the effects of the bonding process on Teraxion's chip integrity. This will result_x000D_
in a first proof of principle of Au stud bump flip chip attach for SiP assembly in order to validate the potential_x000D_
to transition TeraXion's modules to flip chip technologies and evaluate the effectiveness of the bonding process_x000D_
and propose directions for future activity. The outcome of this project will be to provide TeraXion with an_x000D_
increased knowledge of flip chip-compatible bonding options and a path to more thoroughly evaluate the most_x000D_
promising interconnection options for the packaging of TeraXion photonics modules., agreement title english : Gold Stud Bump Flip chip Attach for Silicon Photonics Packaging, agreement title french : Gold Stud Bump Flip chip Attach for Silicon Photonics Packaging, agreement number : EGP, agreement value : 25000.0, agreement start date : 2017-06-14, agreement end date : nan, description english : nan, description french : nan, expected results english : nan, expected results french : nan, additional information english : Grant or Award spanning more than one fiscal year. (2017-2018 to 2018-2019), additional information french : Subvention ou bourse octroyée s'appliquant à plus d'un exercice financier. (2017-2018 à 2018-2019), owner organization : nserc-crsng, owner organization title : Natural Sciences and Engineering Research Council of Canada | Conseil de recherches en sciences naturelles et en génie du Canada