Reference number : GC-2017-Q2-00448, amendment number : , agreement type : G, recipient legal name : McNamara, Derek (University of Ottawa)|McNamara, Derek (Université d’Ottawa), recipient country : CA, recipient province : nan, recipient city : Ontario, recipient postal code : nan, program name english : Engage Grants for Universities, program name french : Subventions d'engagement partenarial pour les universités, program purpose english : Printed electronics (PE) differs from conventional subtractive (eg. etching) fabrication methods and is instead_x000D_
one of a number of methods to fabricate circuits/devices by additively depositing conducting or dielectric_x000D_
(insulating) material. These include traditional printing methods like flexography, and more recently developed_x000D_
techniques like aerosol-jet printing. PE methods offer lower fabrication costs and are suited to flexible_x000D_
substrates. They have not yet found widespread use at high wireless communications (RF) frequencies. The_x000D_
reason is this : RF circuits are usually comprised of conducting metallic patterns printed on dielectric_x000D_
substrates. Subtractive fabrication methods are suited to produce conducting tracks as single thick (relatively_x000D_
speaking) conducting layers. But no matter how thick the conductor is, the so-called electromagnetic skin effect_x000D_
results in the current flowing within a thin layer of the conductor. Thus the effective resistance (and hence_x000D_
unwanted power losses) is larger than it could be if the current could be made to spread over a larger cross_x000D_
section of the conducting track. How this can be achieved was in fact shown in 1951, namely that instead of a_x000D_
single conducting layer one should use laminated conductors comprised of very thin conducting layers_x000D_
separated by extremely thin dielectric material, of just the correct thicknesses. Electromagnetic field_x000D_
penetration of this laminated conductor can then be many skin depths thick and the currents will as a result_x000D_
flow over larger portions of the available conductor cross-sections. This results in greatly decreased power_x000D_
losses. But subtractive fabrication methods are not suited to making laminated conductor circuits. This research_x000D_
will use computational electromagnetics analysis to design laminated conductor circuits, and PE flexography to_x000D_
fabricate them in an effort to start making PE fabrication methods available for RF circuits. One possible_x000D_
application is by a Canadian company developing one of the world's first fully integrated advanced head_x000D_
protection solutions for security and military personnel., program purpose french : Printed electronics (PE) differs from conventional subtractive (eg. etching) fabrication methods and is instead_x000D_
one of a number of methods to fabricate circuits/devices by additively depositing conducting or dielectric_x000D_
(insulating) material. These include traditional printing methods like flexography, and more recently developed_x000D_
techniques like aerosol-jet printing. PE methods offer lower fabrication costs and are suited to flexible_x000D_
substrates. They have not yet found widespread use at high wireless communications (RF) frequencies. The_x000D_
reason is this : RF circuits are usually comprised of conducting metallic patterns printed on dielectric_x000D_
substrates. Subtractive fabrication methods are suited to produce conducting tracks as single thick (relatively_x000D_
speaking) conducting layers. But no matter how thick the conductor is, the so-called electromagnetic skin effect_x000D_
results in the current flowing within a thin layer of the conductor. Thus the effective resistance (and hence_x000D_
unwanted power losses) is larger than it could be if the current could be made to spread over a larger cross_x000D_
section of the conducting track. How this can be achieved was in fact shown in 1951, namely that instead of a_x000D_
single conducting layer one should use laminated conductors comprised of very thin conducting layers_x000D_
separated by extremely thin dielectric material, of just the correct thicknesses. Electromagnetic field_x000D_
penetration of this laminated conductor can then be many skin depths thick and the currents will as a result_x000D_
flow over larger portions of the available conductor cross-sections. This results in greatly decreased power_x000D_
losses. But subtractive fabrication methods are not suited to making laminated conductor circuits. This research_x000D_
will use computational electromagnetics analysis to design laminated conductor circuits, and PE flexography to_x000D_
fabricate them in an effort to start making PE fabrication methods available for RF circuits. One possible_x000D_
application is by a Canadian company developing one of the world's first fully integrated advanced head_x000D_
protection solutions for security and military personnel., agreement title english : Printed Electronics Fabrication of Laminated Conductors for Loss Reduction in RF Circuits, agreement title french : Printed Electronics Fabrication of Laminated Conductors for Loss Reduction in RF Circuits, agreement number : EGP, agreement value : 25000.0, agreement start date : 2017-08-23, agreement end date : nan, description english : nan, description french : nan, expected results english : nan, expected results french : nan, additional information english : Grant or Award spanning more than one fiscal year (2017-2018 to 2018-2019)., additional information french : Subvention ou bourse octroyée s'appliquant à plus d'un exercice financier (2017-2018 à 2018-2019)., owner organization : nserc-crsng, owner organization title : Natural Sciences and Engineering Research Council of Canada | Conseil de recherches en sciences naturelles et en génie du Canada