Reference number : GC-2017-Q4-01458, amendment number : , agreement type : G, recipient legal name : Pisana, Simone (York University)|Pisana, Simone (Université York), recipient country : CA, recipient province : nan, recipient city : Ontario, recipient postal code : nan, program name english : Engage Grants for universities, program name french : Subventions d'engagement partenarial pour les universités, program purpose english : Thermal management is a fundamental limiting factor in solid state lighting applications, affecting the device_x000D_
reliability and luminous efficacy. In high-power applications, the increased chip density exacerbates the need_x000D_
for efficient heat dissipation pathways. Chip-on-board (COB) approaches improved the state of the art by_x000D_
removing the need to individually package LED chips, while yielding better cooling efficiencies by providing a_x000D_
more intimate thermal contact between the chip and heat sink. However, in COB LED products the flat board_x000D_
design limits the heat spreading that can take place at the interface with heat sinks. A recessed heat sink_x000D_
carrying the COB is proposed as an approach to improve the heat spread within the heat sink, and thereby_x000D_
improve the cooling efficiency of the COB assembly. While the idea is attractive, the design trade-offs in terms_x000D_
of cooling capabilities, recess depth & shape and their impact on the luminous intensity spatial distribution are_x000D_
unknown. Additionally, the recessed heat sink material and relative placement of the phosphor may have an_x000D_
adverse effect on the color output of the light fixture. Systematic studies of heat sink-recessed COB designs can_x000D_
yield insights into these trade-offs and optimum operating points. The research can improve the adoption of_x000D_
high-power solid state lighting in industrial applications, with tremendous environmental benefits, as the_x000D_
increase in light output per watt consumed greatly reduces energy waste and green-house gas emission from_x000D_
non-renewable energy sources., program purpose french : Thermal management is a fundamental limiting factor in solid state lighting applications, affecting the device_x000D_
reliability and luminous efficacy. In high-power applications, the increased chip density exacerbates the need_x000D_
for efficient heat dissipation pathways. Chip-on-board (COB) approaches improved the state of the art by_x000D_
removing the need to individually package LED chips, while yielding better cooling efficiencies by providing a_x000D_
more intimate thermal contact between the chip and heat sink. However, in COB LED products the flat board_x000D_
design limits the heat spreading that can take place at the interface with heat sinks. A recessed heat sink_x000D_
carrying the COB is proposed as an approach to improve the heat spread within the heat sink, and thereby_x000D_
improve the cooling efficiency of the COB assembly. While the idea is attractive, the design trade-offs in terms_x000D_
of cooling capabilities, recess depth & shape and their impact on the luminous intensity spatial distribution are_x000D_
unknown. Additionally, the recessed heat sink material and relative placement of the phosphor may have an_x000D_
adverse effect on the color output of the light fixture. Systematic studies of heat sink-recessed COB designs can_x000D_
yield insights into these trade-offs and optimum operating points. The research can improve the adoption of_x000D_
high-power solid state lighting in industrial applications, with tremendous environmental benefits, as the_x000D_
increase in light output per watt consumed greatly reduces energy waste and green-house gas emission from_x000D_
non-renewable energy sources., agreement title english : Design and optimization of heat dissipation and illumination patterns in novel recessed chip-on-board designs for high-power LED lighting applications, agreement title french : Design and optimization of heat dissipation and illumination patterns in novel recessed chip-on-board designs for high-power LED lighting applications, agreement number : EGP, agreement value : 25000.0, agreement start date : 2018-03-07, agreement end date : nan, description english : nan, description french : nan, expected results english : nan, expected results french : nan, additional information english : Grant or Award spanning more than one fiscal year (2017-2018 to 2018-2019)., additional information french : Subvention ou bourse octroyée s'appliquant à plus d'un exercice financier (2017-2018 à 2018-2019)., owner organization : nserc-crsng, owner organization title : Natural Sciences and Engineering Research Council of Canada | Conseil de recherches en sciences naturelles et en génie du Canada