Before revision: Following advantages resulting in using glass frit bonding procedure:screen printing process applicable on thin, structured wafer no electrical potentials during bonding process necessary low tension due to low bonding temperature selective bonding based on structured intermediate glass layer bonding of rough wafer surfaces no outgassing after bonding, better chemical durability, higher strength compared to organic adhesives high reliability and stable hermetical sealing easier process compared to metallic or eutectic layerprocedures Overview The glass frit bond procedure is used for the encapsulation and mounting of components.
After revision: The procedural steps of glass frit bonding are divided into the following:Deposition of glass paste Burn out and firing (in order to form glass layer) Bonding process Cooling down Overview The glass frit bond procedure is used for the encapsulation and mounting of components.