Before revision: TSVs used by stacked DRAM-dice in combination with a High Bandwidth Memory (HBM) interface In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (via) that passes completely through thr!!!!
After revision: TSVs used by stacked DRAM-dice in combination with a High Bandwidth Memory (HBM) interface In electronic engineering, a -silicon via (TSV) or through-chip via is a vertical electrical connection (via) that passes completely through thr!!!!