Before revision: In a common version of non-destructive, mechanical delidding, one removes the IHS of an IC such as a computer processor using an oven to soften the solder (if present) between the IHS and the die(s) and using a knife to cut the adhesive in the periphery of the IHS, which joins the IHS with the processor package substrate, which is often a printed circuit board .
After revision: specializedoften only called a substrate or sometimes an interposerIn a common version of non-destructive, mechanical delidding, one removes the IHS of an IC such as a computer processor using an oven to soften the solder (if present) between the IHS and the die(s) and using a knife to cut the adhesive in the periphery of the IHS, which joins the IHS with the processor package substrate, which is often a printed circuit board .