Before revision: This includes defects such as black pad for PCBs with ENIG finishes or early failures due to excessive board flexure from depaneling or In-circuit test URL See also Failure of electronic components Ball grid array Solder Solder Fatigue Reference
After revision: surfaceThis includes defects such as black pad for PCBs with ENIG finishes or early failures due to excessive board flexure from depaneling or In-circuit test URL See also Failure of electronic components Ball grid array Solder Solder Fatigue Reference