Before revision: Lead frame of a SMD package Most kinds of integrated circuit packaging are made by placing the silicon chip on a lead frame ; then wire bonding the chip to the metal leads of that lead frame ; and then covering the chip with plastic.
After revision: Lead frame of a SMD package Most kinds of integrated circuit packaging are made by placing the silicon chip on a lead frame , wire bonding the chip to the metal leads of that lead frame , and covering the chip with plastic.