Before revision: As it becomes more difficult to manufacture ever smaller transistors, companies are using multi-chip modules , three-dimensional integrated circuits, package on package, High Bandwidth Memory and through-silicon vias with die stacking to increase performance and reduce size, without having to reduce the size of the transistors.
After revision: /chipletsAs it becomes more difficult to manufacture ever smaller transistors, companies are using multi-chip modules , three-dimensional integrated circuits, package on package, High Bandwidth Memory and through-silicon vias with die stacking to increase performance and reduce size, without having to reduce the size of the transistors.