Before revision: Most kinds of integrated circuit packaging—are made by placing the silicon chip on a lead frame; then wire bonding the chip to the metal leads of that lead frame; and then covering the chip with plastic.
After revision: Lead frame of a SMD packageMost kinds of integrated circuit packaging—are made by placing the silicon chip on a lead frame; then wire bonding the chip to the metal leads of that lead frame; and then covering the chip with plastic.