Before revision: In conventional technologies, a wafer is diced first, and then individual dies are packaged; package size is usually considerably larger than the die size.
After revision: Fan.out packaging is seen as a low cost advanced packaging alternative to packages that use silicon interposers, such as those seen in 2.5D and 3D URLIn conventional technologies, a wafer is diced first, and then individual dies are packaged; package size is usually considerably larger than the die size.