Before revision: 111-119 looked at the effect of manufacturing and design process variables on the fatigue life of microvias, including trace(conductor) thickness, layer or layers of the dielectric around the trace and in the microvia, via geometry, via wall angel , ductility coefficient of the conductor material, and strain concentration factor.
After revision: 111-119 looked at the effect of manufacturing and design process variables on the fatigue life of microvias, including trace(conductor) thickness, layer or layers of the dielectric around the trace and in the microvia, via geometry, via wall angle , ductility coefficient of the conductor material, and strain concentration factor.