Before revision: Testing While there are some wire bond pull and shear testing techniques ,MIL-STD-883: Test Method Standard for Microcircuits, Method 2011.7 Bond Strength (Destructive Bond Pull Test)MIL-STD-883: Test Method Standard for Microcircuits, Method 2023.5 Nondestructive Bond PullJESD22-B116: Wire Bond Shear Test Method these tend to be applicable for manufacturing quality rather than reliability.
After revision: such as MIL-STD-883, ASTM F459-13, and JESD22-B116Testing While there are some wire bond pull and shear testing techniques ,MIL-STD-883: Test Method Standard for Microcircuits, Method 2011.7 Bond Strength (Destructive Bond Pull Test)MIL-STD-883: Test Method Standard for Microcircuits, Method 2023.5 Nondestructive Bond PullJESD22-B116: Wire Bond Shear Test Method these tend to be applicable for manufacturing quality rather than reliability.