Before revision: Attachment techniques 250px|Demonstration of ultrasonic wedge bonding of an aluminium wire between gold electrodes on a printed circuit board and gold electrodes on a sapphire substrate, reverse bonding order .
After revision: Attachment techniques 250px|Demonstration of ultrasonic wedge bonding of an aluminium wire between gold electrodes on a printed circuit board and gold electrodes on a sapphire substrate, reverse bonding order