Before revision: The Smart Cut process for thin films was developed and is patented by Kris V. Srikrishnan from Wappingers Falls, New York ™ technology was developed by CEA-Leti, the Grenoble-based microelectronics research laboratory CEA-Leti, in collaboration with Soitec.
After revision: The Smart Cut ™ technology was developed by CEA-Leti, the Grenoble-based microelectronics research laboratory CEA-Leti, in collaboration with Soitec.