Before revision: jsdteskiiu wdhduyjsadgsajhdhsahy jowdhwhsdgahuy 354233 In the potting process, an electronic assembly is placed inside a mold (the "pot") which is then filled with an insulating liquid compound that hardens, permanently protecting the assembly.
After revision: In the potting process, an electronic assembly is placed inside a mold (the "pot") which is then filled with an insulating liquid compound that hardens, permanently protecting the assembly.