Before revision: 3 – 17, 2009 (1) filled with epoxy resin (b-stage) during a sequential lamination process step ; (2) filled with non-conductive or conductive material other than copper as a separate processing step ; (3) plated closed with electroplated copper ; (4) screen printed closed with a copper paste .
After revision: 3 – 17, 2009 Filled with epoxy resin (b-stage) during a sequential lamination process step Filled with non-conductive or conductive material other than copper as a separate processing step Plated closed with electroplated copper Screen printed closed with a copper paste