Before revision: HIPIMS is used for: adhesion enhancing pretreatment of the substrate prior to coating deposition (substrate etching) deposition of thin films with high microstructure density An extensive and significant overview of many aspects regarding HiPIMS was presented by several authors.
After revision: HIPIMS is used for: adhesion enhancing pretreatment of the substrate prior to coating deposition (substrate etching) deposition of thin films with high microstructure density