Before revision: Applications include contact holes (which are contacts to the underlying semiconductor substrate) or via holes (which are holes that are formed to provide an interconnect path between conductive layers in the layered semiconductor device), transistor gates for FinFET technology, or to otherwise remove portions of semiconductor layers where predominantly vertical sides are desired.
After revision: Applications include contact holes (which are contacts to the underlying semiconduct, substrate) or via holes (which are holes that are formed to provide an interconnect path between conductive layers in the layered semiconductor device), transistor gates for FinFET technology, or to otherwise remove portions of semiconductor layers where predominantly vertical sides are desired.