Before revision: Due to the wide variety of MEMS it is hard to be very specific as of what is tested the table below shows what is tested in general: Material Property Test Fabrication Test Device Level Metrology Residual Stress Doping Grain Size Fracture / Failure Mechanism Etching Parameters Surface Roughness Etch parameters (shape and dimension) Deposition methods High Resolution Cross Section Elastic Modulus Post Release Etching Micro Scale Crack Propagation Poisson's ratio Post release Drying (Stiction) Real-Time Performance settling time, amplitude of movement or resonance frequency Fracture Toughness Electrical properties Interfacial Strength Coefficient of Thermal Expansion Different technologies To test MEMS researchers came up with a wide variety of techniques which can display certain values.
After revision: Due to the wide variety of MEMS it is hard to be very specific as of what is tested the table below shows what is tested in general: Material Property Test Fabrication Test Device Level Metrology Residual Stress Doping Grain Size Fracture / Failure Mechanism Etching Parameters Surface Roughness Etch parameters (shape and dimension) Deposition methods High Resolution Cross Section Elastic Modulus Post Release Etching Micro Scale Crack Propagation Poisson's ratio Post release Drying (Stiction) Real-Time Performance settling time, amplitude of movement or resonance frequency Fracture Toughness Electrical properties Interfacial Strength Coefficient of Thermal Expansion Different technologies To test MEMS researchers came up with a wide variety of techniques that can display certain values.