Before revision: This provides several advantages over a traditional system on chip : Reusable IP (intellectual property): the same chiplet can be used in many different devices Heterogeneous integration: chiplets can be fabricated with different processes, materials, and nodes, each optimized for its particular function Known good die: chiplets can be tested before assembly, improving the yield of the final device Multiple chiplets working together in a single integrated circuit may be called a multi-chip module, hybrid IC, 2.5D IC, or an advanced package.
After revision: (SoC)This provides several advantages over a traditional system on chip : Reusable IP (intellectual property): the same chiplet can be used in many different devices Heterogeneous integration: chiplets can be fabricated with different processes, materials, and nodes, each optimized for its particular function Known good die: chiplets can be tested before assembly, improving the yield of the final device Multiple chiplets working together in a single integrated circuit may be called a multi-chip module, hybrid IC, 2.5D IC, or an advanced package.