Before revision: Diagnosis of head-in-pillow defects may require use of X-rays or EOTPR ( Electro-optical terahertz pulse reflectometry ), since the solder joints are hidden between the integrated circuit package and the printed circuit board.
After revision: Diagnosis of head-in-pillow defects may require use of X-rays or EOTPR ( Electro Optical Terahertz Pulse Reflectometry ), since the solder joints are hidden between the integrated circuit package and the printed circuit board.