Before revision: A wafer-level package attached to a printed-circuit board Wafer-level packaging (WLP) is a process where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced.
After revision: in integrated circuit manufacturingA wafer-level package attached to a printed-circuit board Wafer-level packaging (WLP) is a process where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced.