Before revision: Glass frit bonding , also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer.
After revision: + Technical specifications Materials Substrate: Si SiO2 Si2N4 Al Ti GlassIntermediate layer: Glass frit Temperature ≤ 450 °C Advantages simple process technology connection of different materials (different melting temperatures) connection of rough surfaces absence of voltage during bonding hermetic sealing buried feed through high bonding yield narrow bonding frames Drawbacks risk of mechanical stress caused by CTE mismatch risk of glass material flowing into structuresGlass frit bonding , also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer.