Before revision: We extend the two-dimension (2D) ePlace algorithm to a flat, analytic, mixed-size placement algorithm ePlace-3D , for three-dimension integrated circuits (3D-ICs) . Nonlinear optimizationis applied over the entire cuboid domain. Specifically, we develop (1) eDensity-3D: an electrostatics based 3D placement density function with globally uniform smoothness (2) a 3D numerical solution with improved spectral formulation (3) a 3D nonlinear pre conditioner for convergence acceleration (4) interleaved 2D-3D placement for quality and efficiency enhancement.
After revision: We extend the two-dimension (2D) ePlace algorithm to a flat, analytic, mixed-size placement algorithm ePlace-3D , for three-dimension integrated circuits (3D-ICs) using nonlinear optimization. Our contributions are (1) eDensity-3D: an electrostatics based 3D placement density function with globally uniform smoothness (2) a 3D numerical solution with improved spectral formulation (3) a 3D nonlinear pre conditioner for convergence acceleration (4) interleaved 2D-3D placement for quality and efficiency enhancement.