Before revision: History An important application for compliant bonding arose in the early 1960s, when techniques were developed for fabricating a “ beam leaded silicon integrated circuit “chip” consisting of pre-attached electroformed 0.005-inch thick gold leads or “beams” extending from the silicon chip (Figure 5).
After revision: History An important application for compliant bonding arose in the early 1960s, when techniques were developed for fabricating a beam leaded silicon integrated circuit “chip” consisting of pre-attached electroformed 0.005-inch thick gold leads or “beams” extending from the silicon chip (Figure 5).