Before revision: Thus the beam leaded “chip” eliminated the need to thermosonically bond wires directly onto metallized pads of the fragile silicon chip (as shown in Figure 6) The extended ends of the electroformed beams could then be permanently solid-state bonded to a matching metallized sunburst circuit which has been pre-deposted on a ceramic substrate appropriately packaged in a computer in the making.
After revision: Thus the beam leaded “chip” eliminated the need to thermosonically bond wires directly onto metallized pads of the fragile silicon chip (as shown in Figure 6) The extended ends of the electroformed beams could then be permanently solid-state bonded to a matching metallized sunburst circuit which has been pre-deposited on a ceramic substrate appropriately packaged in a computer in the making.