Before revision: In addition, it also provides the possibility to fabricate three-dimensional, robust structures enabling in combination with thick film technology the integration of passive, electronic components, such as capacitors, resistors, and inductors into a single device.
After revision: It also provides the possibility to fabricate three-dimensional, robust structures enabling in combination with thick film technology the integration of passive, electronic components, such as capacitors, resistors, and inductors into a single device.