Before revision:  We integrate all the features into our 3D-IC placement prototype ePlace-3D. Compared to the leading placers mPL6-3D and NTUplace3-3D , our algorithm produces 6.44\% and 37.15\% shorter wirelength, 9.11\% and 10.27\% fewer  vertical interconnects (VI) while runs 2.55x faster and 0.30x slower on average of all the ten IBM-PLACE circuits , respectively.
After revision:  Our placer outperforms the leading work mPL6-3D and NTUplace3-3D , our algorithm produces 6.44\% and 37.15\% shorter wirelength, 9.11\% and 10.27\% fewer vertical interconnects (VI) while runs 2.55x faster and 0.30x slower on average of all the ten IBM-PLACE circuits , respectively.