Before revision: Microvia voiding and its effect on thermomechanical reliability a cross-section view of a microvia with a void One challenge for high density interconnect board development, is to fabricate reliable microvias, especially for stacked microvias, without resulting in incomplete filling, dimples, or voids in the copper plating process.Y.
After revision: Microvia voiding a cross-section view of a microvia with a void One challenge for high density interconnect board development, is to fabricate reliable microvias, especially for stacked microvias, without resulting in incomplete filling, dimples, or voids in the copper plating process.Y.