Before revision: Classification upright=1.36|Visualizing via-first, via-middle and via-last TSVs Dictated by the manufacturing process, there exist three different types of TSVs: via-first TSVs are fabricated before the individual devices (transistors, capacitors, resistors, etc.)
After revision: Classification upright=1.36|Visualizing via-first, via-middle and via-last TSVs Dictated by the manufacturing process, there exist three different types of TSVs: via-first TSVs are fabricated before the individual component (transistors, capacitors, resistors, etc.)