Before revision: Testing While there are some wire bond pull and shear testing techniques,MIL-STD-883: Test Method Standard for Microcircuits, Method 2011.7 Bond Strength (Destructive Bond Pull Test)MIL-STD-883: Test Method Standard for Microcircuits, Method 2023.5 Nondestructive Bond PullASTM F459-13: Standard Test Methods for Measuring Pull Strength of Microelectronic Wire BondsJESD22-B116 : Wire Bond Shear Test Method these tend to be applicable for manufacturing quality rather than reliability.
After revision: Testing While there are some wire bond pull and shear testing techniques,MIL-STD-883: Test Method Standard for Microcircuits, Method 2011.7 Bond Strength (Destructive Bond Pull Test)MIL-STD-883: Test Method Standard for Microcircuits, Method 2023.5 Nondestructive Bond PullJESD22-B116 : Wire Bond Shear Test Method these tend to be applicable for manufacturing quality rather than reliability.