Before revision: If wire connections is the method of choice to form these connections, thermosonic bonding gold wires directly to the silicon chip has been the process most widely used because of its proven reliability as a result of the low bonding parameters of force, temperature and time needed to form the bond.
After revision: ,If wire connections is the method of choice to form these connections, thermosonic bonding gold wires directly to the silicon chip has been the process most widely used because of its proven reliability as a result of the low bonding parameters of force, temperature and time needed to form the bond.