Before revision: A 2.5D integrated circuit (2.5D IC) is an advanced packaging URL that combines multiple integrated circuit dies in a single package without stacking them into a three-dimensional integrated circuit (3D-IC) with through-silicon vias (TSVs).
After revision: A 2.5D integrated circuit (2.5D IC) is an advanced packaging technique that combines multiple integrated circuit dies in a single package without stacking them into a three-dimensional integrated circuit (3D-IC) with through-silicon vias (TSVs).