Before revision: 2.5D integration – an advanced integrated circuit packaging technology that bonds dies and/or chiplets onto an interposer for enclosure within a single package 3D integration – an advanced semiconductor technology that incorporates multiple layers of circuitry into a single chip, integrated both vertically and horizontally 3D-IC (also 3DIC or 3D IC) – Three-dimensional integrated circuit; an IC built with 3D integration advanced packaging – the aggregation and interconnection of components before traditional electronic packaging back end of line (BEoL) – wafer processing steps from the creation of metal interconnect layers through the final etch step that creates pad openings (see also front end of line, far back end of line, post-fab) BEoL – see back end of line bonding – any of several technologies that attach one electronic circuit or component to another; see wire bonding, thermocompression bonding, flip chip, hybrid bonding, etc.
After revision: 2.5D integration – an advanced integrated circuit packaging technology that bonds dies and/or chiplets onto an interposer for enclosure within a single package 3D integration – an advanced semiconductor technology that incorporates multiple layers of circuitry into a single chip, integrated both vertically and horizontally 3D-integrated circuit (also 3DIC or 3D IC) – Three-dimensional integrated circuit; an IC built with 3D integration advanced packaging – the aggregation and interconnection of components before traditional electronic packaging back end of line (BEoL) – wafer processing steps from the creation of metal interconnect layers through the final etching step that creates pad openings (see also front end of line, far back end of line, post-fab) BEoL – see back end of line bonding – any of several technologies that attach one electronic circuit or component to another; see wire bonding, thermocompression bonding, flip chip, hybrid bonding, etc.