Before revision: SiPs are like systems on a chip (SoCs) but less tightly integrated and not on a single semiconductor die.System-in-Package (SiP), a success story // AnySilicon, February 21, 2020 ]] Technology SiP dies can be stacked vertically or tiled horizontally, with techniques like chiplets or quilt packaging.
After revision: SIPs can be used either to reduce the size of a system, improve performance or to reduce URL The technology evolved from multi chip module (MCM) technology, the difference being that SiPs also useThree-dimensional integrated circuit|die stacking, which stacks several chips or dies on top of each URLSiPs are like systems on a chip (SoCs) but less tightly integrated and not on a single semiconductor die.System-in-Package (SiP), a success story // AnySilicon, February 21, 2020 ]] Technology SiP dies can be stacked vertically or tiled horizontally, with techniques like chiplets or quilt packaging.