Before revision: Inside a wire bonded BGA package; this package has an Nvidia GeForce 256 GPU Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication.
After revision: Inside a wire-bonded BGA package; this package has an Nvidia GeForce 256 GPU Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication.