Before revision: It takes the form of a laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with a pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate.Printed circuit URL by the insulating substrate, connecting wires and assembly welding electronic components of the pad, with a conductive line and insulating substrate of the dual role.
After revision: It takes the form of a laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with a pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate.Printed circuit board' by the insulating substrate, connecting wires and assembly welding electronic components of the pad, with a conductive line and insulating substrate of the dual role.