Data-Gouv-ML/pcri-informations-sur-les-projets-laureats huggingface dataset:
Automotive Tested High Voltage and Embedded Non-Volatile Integrated System on Chip platformemploying 3D Integration (ATHENIS_3D)

Framework: FP7 — Cooperation
Programme: Information and Communication Technologies
Destination: Alternative Paths to Components and Systems
Action type: Collaborative project
Countries involved: Austria,France,France,Germany,Austria,Italy,France,Netherlands,Austria
Call:  (FP7-ICT-2013-11, 2013)
Start date: 2013-11-01
End date: 2017-04-30
Duration (months): 42.0
Total project cost (EUR): 8996846.0
EU funding (EUR): 6000000.0
Participants: 11
Project status: CLOSED

Automotive represents 12% of the EU industrial GDP. 20% of the value of a car is already electronics and 10% of this are IC components. Minimizing costs and space for additional functionality requires further integration. The EU project ATHENIS has successfully addressed System-on-Chip (SoC) integration of CMOS, high voltage and embedded memory for harshest automotive conditions. Further cost reduction will require even higher levels of integration. Therefore ATHENIS_3D will provide the industry’s first 3D heterogeneous integration technology platform for harshest automotive conditions with Through Silicon Vias (TSV) and Wafer Level Packaging (WLP). A demonstrator car will prove the functionality of the 3D integrated electronics for an electrical machine with start/stop function and the industry’s first 3D/TSV/WLP DCDC converter with integrated inductor for the new 48V standard. Cost savings from integration and a 5x reduction of PCB area at improved reliability will be shown. For this purpose substantial technological barriers such as flipchip mounting of a 90nm CMOS FPGA on a 180nm HVCMOS Si interposer with Integrated Passive Devices (IPD), high density MRAM and magnetic sensors all meeting reliability requirements up to 200C application temperatures have to be mastered for the first time. This will be achieved by combining TSV and HV-CMOS technology from ams with CMOS and Cu-TSV technology from CEA-Leti, MRAM technology from Crocus and WLP technology from Besi. Platform scalability will be proven by flipchip packaging of 14nm CMOS samples on the interposer. New modules for TSVs, MRAM and Passives embedded in TSV technology will be developed to enable 200C applications. Valeo will provide system specifications, development and demo car evaluation. The other partners contribute to the TSV, WLP and IPD technology (FhG, CEA-Leti) and develop the required novel design, simulation, characterization and reliability methods (UNIPI,TUW, FhG, UNIFE, Active, MASER).

Keywords: automotive,electronics,ic components,system-on-chip,soc,through silicon vias,tsv,wafer level packaging,wlp,dcdc converter,mram,flipchip,cu-tsv
Open System for Energy Services (OS4ES)

Framework: FP7 — Cooperation
Programme: Information and Communication Technologies
Destination: ICT for a low carbon economy
Action type: Collaborative project
Countries involved: Germany,Germany,Greece,Spain,Netherlands,Germany,Switzerland,Croatia,Netherlands
Call:  (FP7-ICT-2013-11, 2013)
Start date: 2014-07-01
End date: 2017-10-31
Duration (months): 40.0
Total project cost (EUR): 4220166.0
EU funding (EUR): 2856267.0
Participants: 9
Project status: CLOSED

Today, mass presence of distributed energy resources (DERs) connected to the grid is often seen as having adverse effects on grid reliability and robustness. The apprehension is that it complicates or even compromises network management by distribution system operators (DSOs). The central aim of the Open System for Energy Services (OS4ES) project is to provide a solution that closes the current information, communication and cooperation gap between DERs and DSOs. To this end, the OS4ES project delivers an innovative Open Service System that enables dynamic DER-DSO cooperation. A Distributed Registry for DERs offers to involved actors the opportunity to reserve the aggregated flexibility of DERs (even forming dynamic Virtual Power Plants) as a grid management service in order to improve Smart Grid robustness and reliability. OS4ES will be based on standardized and interoperable communication interfaces, as well as generic interfaces among components producing, consuming or storing electrical energy. The OS4ES Open Service System includes laboratory and field tests under different service scenarios such as congestion management, energy trading, imbalance risk reduction and Volt/VAr optimization. To disseminate and exploit the results, an OS4ES Industrial User Group is established and standardisation proposals will be prepared.

Keywords: dso-der standardized and interoperable communication,smart grid management services,open service system and generic interfaces,distributed der registry,field testing
Compound Semiconductors for 3D integration (COMPOSE3)

Framework: FP7 — Cooperation
Programme: Information and Communication Technologies
Destination: Alternative Paths to Components and Systems
Action type: Collaborative project
Countries involved: Switzerland,France,France,United Kingdom,Ireland,Spain,Germany
Call:  (FP7-ICT-2013-11, 2013)
Start date: 2013-11-01
End date: 2017-04-30
Duration (months): 42.0
Total project cost (EUR): 4712343.0
EU funding (EUR): 3195303.0
Participants: 8
Project status: CLOSED

COMPOSE3 aims to develop 3D stacked circuits in the front end of line of Complementary Metal Oxide Semiconductor (CMOS) technology, based on high mobility channel materials. The final objective is a 3D stacked SRAM cell, designed with gates length taken from the 14nm technology node. This technology will provide a new paradigm shift in density scaling combined with a dramatic increase in the power efficiency of CMOS circuits. Our synergistic approach is based on the use of high mobility channel materials such as SiGe and InGaAs, utilized in fully depleted metal-oxide-semiconductor field effect transistor (MOSFET), for p and n channel MOSFETs respectively. The low processing temperatures (<600ºC) that can be used for high mobility channels are indeed advantageous for an intimate 3D stacking. COMPOSE3 also exploits the knowledge accumulated in Europe for the layer transfer of ultra-thin semiconductors. Wafer bonding and layer transfer is a critical process module that will be used to enable 3D stacking of high mobility channels. The overall objectives of COMPOSE3 will address the substrate, device and circuit issues. One objective will be to validate InGaAs layer transfer for implementation on 300mm wafers. Another objective will be to benchmark InGaAs nFETs with relevant contact dimensions against planar and non-planar Si based solutions at the 14nm node and beyond. The final objective will be to integrate, on 300mm wafers, monolithic 3D CMOS circuits with 14nm node gates based on n-type InGaAs devices on top of p-type (Si)Ge devices which are independently optimized. COMPOSE3 is extremely well aligned with the strategic agenda of the leading European IC manufacturer, and also exploits its innovation for the benefit of a European SME. It gathers the main European leaders in the advanced nanoelectronics R&D arena.

Keywords: cmos,high mobility channels,mosfet,layer transfer
Scalable ProactivE Event-Driven Decision making (SPEEDD)

Framework: FP7 — Cooperation
Programme: Information and Communication Technologies
Destination: Technologies for Digital Content and Languages
Action type: Collaborative project
Countries involved: Greece,Israel,Switzerland,United Kingdom,France,Portugal
Call:  (FP7-ICT-2013-11, 2013)
Start date: 2014-02-01
End date: 2017-01-31
Duration (months): 36.0
Total project cost (EUR): 4334779.0
EU funding (EUR): 3073916.0
Participants: 7
Project status: CLOSED

SPEEDD (Scalable ProactivE Event-Driven Decision making) will develop a system for proactive event-based decision-making: decisions will be triggered by forecasting events -whether they correspond to problems or opportunities- instead of reacting to them once they happen. The decisions and actions will be real-time, in the sense that they will be taken under tight time constraints, and require on-the-fly processing of “Big Data”, ie extremely large amounts of noisy data storming from different geographical locations as well as historical data. The effectiveness of the SPEEDD solution will be evaluated against concrete requirements in traffic management and credit card fraud detection. SPEEDD will contribute to the state of the art by: -Developing techniques for on-the-fly, low-latency, scalable, distributed monitoring and online distributed learning, given extremely large, geographically distributed, noisy event streams, and highly complex event patterns. -Developing novel methods for real-time event recognition and forecasting that are resilient to various types of uncertainty and supported by novel machine learning techniques for continuously improving recognition and forecasting accuracy. -Providing novel methods for event-based, real-time decision-making under uncertainty. -Developing techniques for real-time explanation and visualisation of Big Data. The expected outcome of SPEEDD includes: -Technology for real-time event recognition and forecasting under uncertainty. -Technology for event-based, real-time decision-making under uncertainty. -Visual analytics suite for real-time interaction with, and explanation of, Big Data, as well as proactive decision-making support. -A highly scalable proactive event-driven computing prototype integrating all SPEEDD components. The prototype will support a Human Factors validation by means of usability and effectiveness testing. -A suite of real-world demonstrations using live data in an operational environment.

Keywords: big data,scalability,event-driven,proactive computing,real-time optimisation,forecasting,uncertain and future events,visual analytics
Technology Enhanced Learning Leading to Unique Stories (TELL US)

Framework: FP7 — Cooperation
Programme: Information and Communication Technologies
Destination: ICT for Creativity and Learning
Action type: Coordination and support actions
Countries involved: France,France,Spain,Germany,United Kingdom,Sweden
Call:  (FP7-ICT-2013-11, 2013)
Start date: 2013-12-01
End date: 2015-12-31
Duration (months): 25.0
Total project cost (EUR): 929380.0
EU funding (EUR): 800000.0
Participants: 7
Project status: CLOSED

In many respects learning has been overtaken by the fundamental changes introduced by the information society and many Technology Enhanced Learning (TEL) innovations have yet to make their way into the classroom despite the fact that society is demanding change in what and how we learn. This is the problem that the TELL US project seeks to mitigate by challenging learning providers in the form of an EU contest where new innovative TEL services will be shown across Europe to: education professionals, purchasers, students, and the general public. TELL US will demonstrate the range and quality of TEL products in order to enhance take up scalability, and encourage learning and education through these mechanisms. The TELL US project will: • create regional contests using our network of EU countries/regions, • bring regional winners together to compete for a Europe-wide prize in a Grand Final, • Show through the contests approach how an already established or emerging TEL has been adopted and scaled-up in the formal leaning context. The TELL US consortium is uniquely placed to deliver this through its broad European reach and through the consortium members’ close working ties with TEL stakeholders including pedagogical and cognitive experts. Each partner is already engaged in activities with education professionals, TEL solution developers, providers, educators, procurers and learners. The key impacts of TELL US will be to create demand through the valorisation of the use of TEL in education to suppliers, purchasers, consumers and educators throughout Europe leading to: • A greater demand from schools and other formal educational institutes, • A greater awareness and openness of educators to the possibilities of TEL ideas, • A greater understanding of the products and solutions available to purchasers, • A larger scale of market for TEL products creating growth efficiency which in turn will lead to a larger, more efficient market for TEL solutions within Europe and establishing Europe as a leading region on a global market.

Keywords: the key impacts of the tell us projects will be to create demand through the valorisation of the use of ict in education to suppliers,purchasers,consumers and educators throughout europe
An efficient and effective platform for the cooperation of photonics clusters and the exploitation of European SMEs potential. (LIGHT JUMPS)

Framework: FP7 — Cooperation
Programme: Information and Communication Technologies
Destination: Alternative Paths to Components and Systems
Action type: Coordination and support actions
Countries involved: Italy,Germany,Germany,Belgium,Netherlands,Denmark,France,France,Belgium,Netherlands
Call:  (FP7-ICT-2013-11, 2013)
Start date: 2013-11-01
End date: 2015-10-31
Duration (months): 24.0
Total project cost (EUR): 1465915.0
EU funding (EUR): 1170000.0
Participants: 13
Project status: CLOSED

Photonics is a key innovation driver in many research and application areas like telecommunications, lighting, entertainment, laser-assisted manufacturing and sensors. Europe is a leading actor in the photonics sector, responsible of 20,3%, of the global production It is paramount to create a solid framework and virtual infrastructure, foster the competitiveness and global leadership of the EU photonic industry and contribute to the creation of growth and jobs in Europe, whilst raising, at the same time, the awareness of the importance of photonics by all stakeholders, including industry, academia and wider public. However, as of 2013, the picture of the EU photonics clusters is relatively negative, in particular: i) academia and industry face difficulties in networking efficiently; ii) there is inability and a lack of ambition in extending targets and cooperation; iii) important actors are missing in the value chain; iv) clusters’ roles and activities are still non-uniform and are fragmented at the regional and national levels. The Light Jumps project stems from the need to overcome present difficulties and the need to establish a coherent European framework for supporting industry to tap into and exploit the vast opportunities of photonic technologies in wide range of application areas. The Light Jumps project will connect photonic clusters, enabling technologies and stakeholders (research partners and SMEs), with clusters and stakeholders in specific application areas, as such bridging communities and help overcoming fragmentation. Light Jumps will build and “market-test” a unified and structured industry-driven classification scheme, knowledge framework, support methodologies, interlinked communities and web-based tools to harness the potential of EU companies.

Keywords: photonics,csa,coordination,regional clusters,national platforms,laser,sensors,telecommunications
Big data roadmap and cross-disciplinarY community for addressing socieTal Externalities (BYTE)

Framework: FP7 — Cooperation
Programme: Information and Communication Technologies
Destination: Technologies for Digital Content and Languages
Action type: Coordination and support actions
Countries involved: Belgium,Italy,Norway,Ireland,Austria,Netherlands,France,Germany,United Kingdom,Hungary
Call:  (FP7-ICT-2013-11, 2013)
Start date: 2014-03-01
End date: 2017-02-28
Duration (months): 36.0
Total project cost (EUR): 2775964.0
EU funding (EUR): 2252833.0
Participants: 13
Project status: CLOSED

The Big data roadmap and cross-disciplinarY community for addressing socieTal Externalities (BYTE) projectwill assist European science and industry in capturing the positive externalities and diminishing the negativeexternalities associated with big data in order to gain a greater share of the big data market by 2020.BYTE will accomplish this by leveraging the BYTE advisory board and additional network contacts to conduct aseries of big data case studies in actual big data practices across a range of disciplinary and industrial sectors togain an understanding of the economic, legal, social, ethical and political externalities that are in evidence.BYTE will supplement these case studies with a horizontal analysis that identifies how positive externalities canbe amplified and negative externalities can be diminished.BYTE moves beyond current practices to consider how big data will develop to the year 2020 using foresighttools to identify future practices, applications and positive and negative externalities. This will allow BYTE todevelop, in collaboration with expert stakeholders, a vision for big data in 2020 that includes meeting therelevant goals of the Digital Agenda for Europe. In collaboration with expert stakeholders, the consortium willthen devise a research and policy roadmap, that will provide incremental steps necessary to achieve the BYTEvision and guidelines to assist industry and scientists to address externalities in order to improve innovation andcompetitiveness.BYTE will culminate in the launch of the big data community, a sustainable, cross-disciplinary platform that willimplement the roadmap and assist stakeholders in identifying and meeting big data challenges. Furthermore,BYTE will disseminate project findings and recommendations and publicise the big data community to a largepopulation of stakeholders to encourage further innovation and economic competitiveness in Europe’sengagement with big data.

Keywords: big data,positive externality,negative externality,societal impact,innovation,big data community,big data network,big data innovation,big data roadmap
Large Area Solid State Intelligent Efficient luminaires (LASSIE-FP7)

Framework: FP7 — Cooperation
Programme: Information and Communication Technologies
Destination: Alternative Paths to Components and Systems
Action type: Collaborative project
Countries involved: Switzerland,Germany,Finland,Spain,Italy,Czechia
Call:  (FP7-ICT-2013-11, 2013)
Start date: 2014-01-01
End date: 2016-12-31
Duration (months): 36.0
Total project cost (EUR): 4373099.0
EU funding (EUR): 3150000.0
Participants: 9
Project status: CLOSED

According to a recent study, many solid-state lighting (SSL) products do not fulfill the claimed specifications and a deep market penetration of LED modules is at risk. The main problems are decreasing light intensity and varying light chromaticity due to aging and temperature, as well as poor uniformity of large-area luminaires and poor lighting quality. The main objective of the LASSIE-FP7 consortium is to implement large-area and low-cost intelligent SSL modules with high efficiency and high lighting quality, while assessing their environmental impact over the life cycle. LED-based point source luminaires have been already investigated, but market requirements for intelligent, large-area solid-state light sources have not been met yet. In order to achieve luminaires with high intensity, good uniformity and high color rendering performance, significant intelligence has to be added to the LEDs. By integrating light management structures combined with new color-changing coatings containing highly efficient and reliable organic fluorescent dyes with heat management solutions, LED chips and multispectral sensors for intelligent color-sensing feedback by means of an innovative R2R production technology compatible with flexible substrates, the LASSIE-FP7 consortium will achieve progresses beyond the state-of-the-art in terms of size (area and thickness), flexibility, efficiency, lighting quality, beam-shaping, lifetime, added intelligence, production and production/installation costs. Outcome of the project will be a unique integrated SSL module that will represent a break-through in the professional and architectural lighting sectors and an alternative to the OLED technology.

Keywords: light management,light coupling,light waveguide,hybrid light sources,colour-changing coatings,organic fluorescent dyes,intelligent lighting,large area,luminaires,leds.
Unifying Cloud and Carrier Networks (UNIFY)

Framework: FP7 — Cooperation
Programme: Information and Communication Technologies
Destination: Pervasive and Trusted Network and Service Infrastructures
Action type: Collaborative project
Countries involved: Hungary,Sweden,Germany,Germany,Spain,Greece,Italy,Italy,Belgium,Belgium,Germany
Call:  (FP7-ICT-2013-11, 2013)
Start date: 2013-11-01
End date: 2016-07-31
Duration (months): 33.0
Total project cost (EUR): 9370225.0
EU funding (EUR): 6551000.0
Participants: 17
Project status: CLOSED

Telecom providers struggle with low service flexibility, increasing complexity and related costs. Although cloud computing and networking have been two very active fields of research, there is currently little integration between the vast networking assets and data centres of telecom providers. UNIFY addresses this by considering the entire network, from home networks up to data centre, as a “unified production environment”. The unified approach will open up the potential of virtualization, programmability / automation to span across the whole infrastructure of the provider and guarantee an unprecedented level of agility for network operations and for deploying new, secure and quality of experience aware services, seamlessly instantiatable across the entire infrastructure. This will lead to a novel service-oriented carrier-grade platform for the Future Internet and brings virtualized services in the most efficient, secure and quality-aware way to the end-users.UNIFY focuses on enablers of such unified production environment and will develop an automated, dynamic service creation platform, leveraging a fine-granular service chaining architecture. A service abstraction model and a proper service creation language will enable the dynamic and automatic placement of networking, computing and storage components across the infrastructure. A global orchestrator, which novel optimization algorithms, ensures the optimal placement of the elementary service components across the entire infrastructure. New management technologies, based on experience from data centre and tightly integrated into the service orchestration architecture, will be developed and cope with the dynamicity of new services. The applicability of a universal network node based on commodity hardware will be evaluated in order to support both network functions and traditional data centre workloads, while the possible hardware acceleration that might be needed to support future workloads will be investigated.

Keywords: software defined networking,sdn,cloud computing,flexible service creation