Projet SiCPIC (Horizon Europe, appel à projets 2024)
Action : Doctoral Networks
Panel : Information Science and Engineering
Statut du projet : SIGNED

Photonic integrated circuit (PIC) technology is an enabling technology, deemed to address the challenges (high power consumption and large RC delay caused by the line width reduction) faced by microelectronic integrated circuits (IC). The demand for the technology is at an all-time high, and it is expected to experience a steadily accelerating adoption across markets. However, the potential of PIC is not fully demonstrated in the existing material platforms yet. Silicon carbide (SiC), an emerging wide band-gap semiconductor, is promising to advance PIC technology and accelerate its wide market adoption. The SiCPIC DN will: i) Break new ground in PIC technology by unlocking the unique optical properties of SiC leveraging the advancing of nanotechnology including thin film transfer and nanofabrication; and ii) Train 15 Doctoral Candidates (DCs) with out-of-the-box thinking and an entrepreneurial mindset in the field of PIC technologies as a specific expertise, and photonic and electronic integration (i.e. semiconductor) skills, and expertise in a broader perspective (i.e, covering a full chain of materials, devices and integration, and system applications). SiCPIC, therefore, creates a platform solution ensuring European leadership in next-generation PIC technologies and delivers skills which are key for the implementation of the EU Chips Act, and for wider European semiconductor autonomy.

Mots clés : photonics, silicon carbide, photonic integrated circuit

Participants :
- Neoplas control gmbh (Allemagne) — Partner, associated partner, Organismes privés (hors enseignement), subvention : 0.0 €
- Ignis photonyx a/s (Danemark) — Partner, associated partner, Organismes privés (hors enseignement), subvention : 0.0 €
- Plasma-therm europe (France) — Partner, associated partner, Organismes privés (hors enseignement), subvention : 0.0 €
- Université Grenoble Alpes (France) — Partner, associated partner, Enseignement supérieur ou secondaire, subvention : 0.0 €
- École polytechnique de Turin (Italie) — Partner, beneficiary, Enseignement supérieur ou secondaire, subvention : 563510.16 €
- Université Friedrich-Alexander d'Erlangen-Nuremberg (Allemagne) — Partner, beneficiary, Enseignement supérieur ou secondaire, subvention : 870816.96 €
- Istituto Nazionale di Ricerca Metrologica (Italie) — Partner, beneficiary, Recherche, subvention : 563510.16 €
- Swiss pic (Suisse) — Partner, associated partner, Recherche, subvention : 0.0 €
- Freiberg instruments gmbh (Allemagne) — Partner, associated partner, Organismes privés (hors enseignement), subvention : 0.0 €
- Spea (Italie) — Partner, associated partner, Organismes privés (hors enseignement), subvention : 0.0 €
- Université technique du Danemark (Danemark) — Coordinator, beneficiary, Enseignement supérieur ou secondaire, subvention : 1679450.4 €
- Genauigkeits maschinenbau nurnberg gmbh (Allemagne) — Partner, associated partner, Organismes privés (hors enseignement), subvention : 0.0 €
- Centre national de la recherche scientifique (France) — Partner, beneficiary, Recherche, subvention : 629338.32 €