RESEARCH OF CHARACTERISTICS OF CAPACITORS INTEGRATED INTO SILICON INTERPOSERS FOR 3D MICROWAVE MODULES
Journal: International Forum “Microelectronics – 2020”. Joung Scientists Scholarship “Microelectronics – 2020”. XIII International conference «Silicon – 2020». XII young scientists scholarship for silicon nanostructures and devices physics, material science, process and analysis
Year: 2020

This work is devoted to the analysis of the design solutions of capacitors integrated into transition boards based on silicon (interposer) for 3D microwave modules and the study of the electrophysical parameters of capacitors developed according to a promising topology based on a trench design.