Fusible alloy
Other alloys
(see also solder alloys)

Fusible alloy

Section Title: Other alloys
Table Section Text: (see also solder alloys)

Composition in weight-percent	Melting point	Eutectic?	Name or remark

Cs 73.71, K 22.14, Na 4.14	−78.2 °C	yes

Hg 91.5, Tl 8.5	−58 °C	yes	used in low readings thermometers

Hg 100	−38.8 °C	(yes)

Cs 77.0, K 23.0	−37.5 °C

K 76.7, Na 23.3	−12.7 °C	yes

K 78.0, Na 22.0	−11 °C	no	NaK

Ga 61, In 25, Sn 13, Zn 1	8.5 °C	yes

Ga 62.5, In 21.5, Sn 16.0	10.7 °C	yes	galinstan alloy

Ga 69.8, In 17.6, Sn 12.5	10.8 °C	no	galinstan alloy

Ga 68.5, In 21.5, Sn 10	11 °C	no	galinstan alloy

Ga 75.5, In 24.5	15.7 °C	yes

Cs 100	28.6 °C	(yes)

Ga 100	29.8 °C	(yes)

Rb 100	39.30 °C	(yes)

Bi 40.3, Pb 22.2, In 17.2, Sn 10.7, Cd 8.1, Tl 1.1	41.5 °C	yes

Bi 40.63, Pb 22.1, In 18.1, Sn 10.65, Cd 8.2	46.5 °C

Bi 44.7, Pb 22.6, In 19.1, Cd 5.3, Sn 8.3	47 °C	yes	Cerrolow 117. Used as a solder in low-temperature physics.

Bi 49, Pb 18, In 21, Sn 12	58 °C	ChipQuik desoldering alloy. Cerrolow 136.

Bi 32.5, In 51.0, Sn 16.5	60.5 °C	yes	Field's metal

K 100	63.5 °C	(yes)

Bi 50, Pb 26.7, Sn 13.3, Cd 10	70 °C	yes	Cerrobend. Used in low-temperature physics as a solder.

Bi 49.5, Pb 27.3, Sn 13.1, Cd 10.1	70.9 °C	yes	Lipowitz's alloy

Bi 50.0, Pb 25.0, Sn 12.5, Cd 12.5	71 °C	yes	Wood's metal

In 66.3, Bi 33.7	72	yes

Bi 42.5, Pb 37.7, Sn 11.3, Cd 8.5	74 °C	no	Cerrosafe

Bi 56, Sn 30, In 14	79-91 °C	no	ChipQuik desoldering alloy, lead-free

Bi 50, Pb 30, Sn 20, Impurities	92 °C	no	Lichtenberg's alloy, also called Onions' Fusible Alloy

Bi 52.5, Pb 32.0, Sn 15.5	95 °C	yes

Bi 52, Pb 32.0, Sn 16	96 °C	yes	Bi52. Good fatigue resistance combined with low melting point.

Bi 50.0, Pb 31.2, Sn 18.8	97 °C	no	Newton's metal

Na 100	97.8	(yes)

Bi 50.0, Pb 28.0, Sn 22.0	94–98 °C	no	Rose's metal

Bi 56.5, Pb 43.5	125 °C	yes

Bi 58, Sn 42	138 °C	yes	Bi58. Reasonable shear strength and fatigue properties.

Bi 57, Sn 43	139	yes

In 100	157 °C	(yes)	In99. Used for die attachment of some chips.

Li 100	180.5 °C	(yes)

Sn 62.3, Pb 37.7	183 °C	yes

Sn 63.0, Pb 37.0	183 °C	no	Eutectic solder. Sn63, ASTM63A, ASTM63B.

Sn 91.0, Zn 9.0	198 °C	yes	KappAloy9 Designed specifically for Aluminum-to-Aluminum and Aluminum-to-Copper soldering. It has good corrosion resistance and tensile strength.

Sn 92.0, Zn 8.0	199 °C	no	Tin foil

Sn 100	231.9 °C	(yes)	Sn99. Good strength, non-dulling. Use in food processing equipment, wire tinning, and alloying. Susceptible to tin pest.

Bi 100	271.5 °C	(yes)	Used as a non-superconducting solder in low-temperature physics. Does not wet metals well, forms a mechanically weak joint.

Tl 100	304 °C	(yes)

Cd 100	321.1 °C	(yes)

Pb 100	327.5 °C	(yes)

Zn 100	419.5 °C	(yes)	For soldering aluminium. Good wettability of aluminium, relatively good corrosion resistance.

Sentence(s)

Fusible alloy has a melting point of 183 °C.

final_sentence: Fusible alloy has a melting point of 183 °C.