Xbox 360 technical specifications
List of revisions

Xbox 360 technical specifications

Section Title: List of revisions
Table Section Text: None

Codename	CPU	GPU	eDRAM	HDMI	Power Supply	In Production	Date Released	Notes

Xenon	90 nm	90 nm	90 nm	No	203 W	No	November 2005	Original release. Console power consumption 198 W.

Zephyr	90 nm	90 nm	90 nm	Yes	203 W	No	April 2007	Introduced HDMI port. Improved GPU heatsink.

Falcon	65 nm	80 nm	80 nm	Yes	175 W	No	September 2007	Introduced 65 nm CPU, 80 nm GPU and 80 nm eDRAM. Power consumption lowered.

Opus	65 nm	90 nm	80 nm	No	175 W	No	July 2008	Available as a replacement for Xenon motherboards which have been sent in to Microsoft tech repair centers. Console power consumption 170.4 W.

Jasper	65 nm	65 nm	80 nm	Yes	150 W	No	September 2008	Introduced 65 nm GPU. Introduced on-board flash-based memory. Further reduced power consumption. Console power consumption 145.2 W.

Kronos (Jasper v2)	65 nm	65 nm	65 nm	Yes	150 W	No	September 2009	Introduced 65 nm eDRAM. Introduced new RF-module, new style GPU Kronos revision. Eliminated the E74 problem from earlier jasper models.

Trinity	45 nm (combined chip)	Yes	135 W	No	June 2010	Motherboard redesign used in the Xbox 360 Slim. Two versions: one with 4 GB on-board storage, one without.

Corona	45 nm (combined chip)	Yes	115 W	No	August 2011	No more HANA chip. Includes both Xbox 360 Slim and E versions.

Winchester	45 nm (combined chip)	Yes	115 W	No	August 2014	Corona motherboard revision named Winchester motherboard, patches Reset Glitch Hack. Released with 500GB console bundles

Sentence(s)

The Xbox 360 uses power supply with 203/175/150/130/115 W.

final_sentence: The Xbox 360 uses power supply with 203/175/150/130/115 W.