# Presentation: 045967

## CCD Packaging:Part 1: ConceptsPart 2: Cost and ScheduleJim Fast

## Packaging Issues from LBL meeting

- Structure glued to CCD surface must extend to edges of active area
- No air bubbles are allowed in the bonded region
- Charge migrates at boundaries due to stress
- May not be possible to flat field this effect out
- Need to match the total shrinkage of silicon over cool down
- Aluminum nitride hybrid shrinks a bit more than silicon
- Invar 36 foot shrinks a bit less than silicon
- Glue bond role is impossible to model – must prototype
- This is an ELECTRICAL issue (stress moves charge around), so we need real sensors and a readout system to really investigate the packaging issues
- There is only a 270micron gap between the active area and the guard ring structure for the bond pads – this is VERY tight
- Need to control glue run-out while ensuring no voids
- Bond and wedge interference with hybrid are a big concern
- See drawing later in talk

## CCD package –LBNL John Bercovitz

## CCD package –LBNL

- John Bercovitz

## CCD Package assembled

- CCD

- Aluminum Nitride

- Invar frame

- CRIC, Clocks

- Molybdenum frame

## Variations

- Connector

- Detector Assembly

- Thermal
- And
- Mechanical
- connection

- PC board

- Leads

- Coldplate
- Segment
- cutaway

- Coldplate
- Segment
- cutaway

## Package Components

- CCD

- Aluminum Nitride

- Invar frame

- CRIC, Clocks

- Molybdenum frame

- Glue

- Cold Plate segment

## Exploded View from Back

## Cutaway view, Back

**CCD**

**Aluminum Nitride Substrate**

**Invar Frame**

**Molybdenum Frame**

**Flexure Blades**

**Pins**

**Circuit Board**

- M2 -into Moly frame

- M3 -mounts to Coldplate

## Exploded view, Back

**CCD**

**Aluminum Nitride Substrate**

**Invar Frame**

**Molybdenum Frame**

**Flexure Blades**

**Pins**

**Circuit Board**

**Copper **

**Pogos**

**Pogo Pads**

## CTIO package concept – very preliminary and incomplete

- J. Fast

- CCD

- Wirebonds

- Invar Frame

- AlN Hybrid

## CTIO package concept – very preliminary and incomplete

- J. Fast

- CCD

- Wirebonds

- Invar Frame

- AlN Hybrid

- Edges of active area and guard ring

## Cost and Schedule Issues

- CRIC chip and CRIC board development and production
- Assumes 2 prototype cycles plus final order at 20 weeks each
- Must start development of board 2/13/04
- Must order first prototypes by 4/22/04 ($21K)
- Delivery of first prototypes September 2004
- Delivery of second prototypes July 2005 ($22K)
- Production boards and CRIC chips in 2006 ($152K)
- CCDs: packaging development and production
- Thinned mechanical silicon order in early February, in hand late May
- Obtain ~10 low grade but functioning CCDs by October 2004 ($56K)
- Study packaging electromechanical issues through early 2005
- Obtain ~10 engineering grade CCDs by July 2005 ($60K)
- Finish packaging studies by December 2005
- Production CCD procurement November 2005 ($342K)
- Test stands, tooling and mounting “foot” parts
- 5 test stands: one this year ($38K) and four in 2005 ($246K)
- Tooling and “foot” development in 2004 ($31K) and 2005 ($13K)
- Production tooling in 2006 ($12K)
- Production “foot” procurement in 2006 ($105K)
- Total M&S estimate of $1.1M