# Presentation: 268019

## NIST Nanofabrication Facility

## CNST Nanofab

*A state-of-the-art shared-use facility for the fabrication and measurement of nanostructures*

- 19,000 sq ft cleanroom (8,000 sq ft class 100)
- Advanced lithography and microscopy
- Talented staff to train users or operate the tools
- Makes available the expensive tools needed for nanotechnology
- Instrumentation both inside and outside the cleanroom
- Open to all users, NIST and worldwide

## The CNST Nanofab is well equipped and expandingSee cnst.nist.gov for details

**Notes:**
We have ...
Specialty Tools
Focused Ion Beam: Zeiss NVision 40 
Nano-Imprint Lithography Tool: Nanonex NX-2000 
E-beam Lithography System: Leica VB300 
Microwave Asher 
Focused Ion Beam: FEI Nova 600 Nanolab
  Lithography
E-beam Lithography System: Leica VB300 
Modified SEM E-beam Lithography: JEOL 6400 
Nano-Imprint Lithography Tool: Nanonex NX-2000 
MA6 Front and Back Contact Aligner: Suss Microtec 
MA8 Front Side Contact Aligner: Suss Microtec 
Spinners: Laurell Technologies Series WS-400/500 
Spinner: Brewer Science CEE Model 100CB Spinner/Hotplate
  Post Process
Microwave Asher 
Focused Ion Beam: Zeiss NVision 40
Wafer Dicing Saw-Disco Model 341
Wire Bonder: Kulicke and Soffa Model 4526
Critical Point Dryer
Focused Ion Beam: FEI Nova 600 Nanolab
  Furnaces
General Thermal Oxidation and Diffusion Furnace/Bank 2 
CMOS Thermal Oxidation and Diffusion Furnace/Bank 1 
Low Pressure Chemical Vapor Deposition (LPCVD) Furnace/Bank 3 
Rapid Thermal Annealer-Modular Process Technology 
PECVD-Unaxis 790
    Dry Etch
Deep RIE-Unaxis SHUTTLELINE DSEII 
Metal RIE-Unaxis 790 
Silicon RIE-Unaxis 790 
ICP Metal Etcher-Unaxis SHUTTLELINE ICP 
XeF2 Silicon Etch-Xactix Xetch e1 Series 
Microwave Asher
  Metal Deposition
E-beam Evaporator: Denton Infinity 22 
Thermal Evaporator: Denton Infinity 22 
Sputterer: Denton Discovery 22 
CVC Evaporator 
Myers Evaporator
  Wet Chemistry
Heated Wet Chemical Bench: 6-ft 
Heated Wet Chemical Bench: 8-ft 
Spin Rinse Dryers: Semitool PSC-101
  Inspection
Scanning Electron Microscope: Zeiss Ultra-60 FESEM 
Spectroscopic Ellipsometer: Woollam XLS-100 
Nanospec Reflectometer: Nanometrics 
Contact Profilometer: Dektak 6M 
Optical Microscope with Image Capture: Nikon 
Four-Point Probes (two units): Jandel RM2
Are adding...
Wafer bonder
Second sputterer
Laser writter
Afm
Plasma etcher for III-V
Kerr microscopy
ALD?

## CNST Nanofab tools

- State-of-the-art electron-beam lithography: features as small as 5 nm, across whole wafer
- Laser direct-write for mask making and rapid prototyping
- Contact aligners for photolithography
- Focused ion-beam tool for nanoscale milling and addition of material
- Nanoimprint lithography for replicating nanoscale features

- LPCVD furnaces for silicon nitride and poly-silicon
- PECVD for low temperature oxides and nitrides
- CMOS-clean or general use furnaces for oxidation and diffusion doping
- Rapid thermal annealing
- Sputter deposition, including dielectrics, metals, magnetic materials and multilayers
- Electron-beam and thermal evaporation
- Atomic layer deposition for molecular-scale, highly conformal coatings of metals and dielectrics.
- Parylene deposition tool for conformal, bio-compatible polymer coatings

**Lithography** – *to pattern your chip*

**Deposition, oxidation, and diffusion** – *to add dielectrics, dopants, metals *

## CNST Nanofab tools (cont.)

- Two inductively coupled plasma etchers for deep silicon etching and metal etching
- Two special purpose etchers allowing novel recipes for III-V materials and exotics
- Cryogenic and high temperature capability
- Xenon difluoride for sacrificial etching of silicon for MEMS applications
- Microwave ashing for resist stripping

- Field-emission scanning electron microscope (SEM) for high resolution imaging
- Tabletop SEM for rapid inspection
- Optical microscopes
- Spectroscopic ellipsometer for thin film thicknesses and optical properties
- Reflectometer for film thickness
- Profilometer for 2D profiling
- Atomic Force Microscope (AFM)
- Wafer curvature tool for measurement of stress
- Four point probe systems for electrical characterization

**Etching** *- to selectively remove material*

**Inspection and metrology *****– ****to see what you got*

**CNST Nanofab tools (cont.)**

## See this list and more at cnst.nist.gov

- Wafer Dicing Saw-Disco Model 341
- Wire Bonder: Kulicke and Soffa Model 4526
- Critical Point Dryer

**Post-processing** *- to finish up your devices*

**CNST Nanofab tools (cont.)**

## Using the CNST Nanofab

- The Nanofab is fee-based, shared-use
- Based on highly successful NNIN Nanocenter model
- No proposal needed; simple one-page description of work
- Open to all users
- NIST site access restrictions apply
- The Nanofab will train users in tool use
- Alternatively, the process can be performed by a process engineer at an additional cost
- Fees are based on operating costs
- Similar to the full cost recovery fees of the NNIN-NSF Nanocenters
- External users may apply to have a portion of their fee waived
- For research supportive of CNST goals
- Net charges similar to NNIN-NSF “academic” rates
- User can maintain IP rights under certain circumstances
- For information about use of the Nanofab
- Contact Dr. Tony Novembre, the Nanofab Facility Group Leader (novembre@nist.gov)
- Contact Dr. Alex Liddle if a joint research project is more appropriate (liddle@nist.gov)