# Presentation: 810981

## An AP210-based Repository for Collaborative Electronics Engineering

- Russell S. Peak
- Senior Researcher & Co-Director
- Engineering Information Systems Lab
- eislab.gatech.edu
- CALS Technology Center
- Georgia Institute of Technology
- January 18, 2000

*NASA STEP for Aerospace Workshop*
*Jet Propulsion Lab****  Pasadena CA*
*January 16-20, 2001*

- Copyright © 2001 by Georgia Tech Research Corporation, Atlanta, Georgia 30332-0415 USA.  All Rights Reserved.
- Permission to distribute at no charge and without changes is hereby granted provided this notice is included.

## Outline

- AP210-based Environment - JPL/NASA Phase 1
- Ancillary Information Problem
- Phase 1 Scope (work-in-progress)
- Collaboration
- Expected Benefits
- Other Potential AP210 Applications:
- Chip Package Design & Analysis - Shinko Phase 1,  2
- Phase 1 Accomplishments
- References & Nomenclature

## Development of AdvancedCollaborative Engineering Environments (CEEs)Phase 1: CEE-based PWB Stackup Design Tool

*This presentation overviews work-in-progress for Phase 1.*

## Problem:Insufficient Information Capture

- Problem:Insufficient Information Capture

**Existing Tools**

*Tool A**1*

*Tool A**n*

**Product Model**
- (e.g., AP210 + AP2xx + ...)

*...*

**“****dumb” ****information capture**
- (only human-sensible,
- I.e., not computer-sensible)

_**Legend**_

## Example PWA Ancillary Information

**Component Assembly**
**Instructions**

**Maximum Height**
**Restrictions**

**Stackup Notes**

**Conformal Coating**
**Restrictions**

- PWA = printed wiring assembly
- PWB = printed wiring board

## Example PWB Ancillary Information

**Outline Detail**

**Stackup Specs**

**Stackup Notes**

## Current Situation (typical)

- CAx tools of diverse disciplines
- Each focuses on information subset(some overlap)
- Much ancillary information
- Some captured as “dumb” notes & sketches in CAD
- Human-oriented, not computer-sensible
- Much not captured at all
- Lack of fine-grain explicit associativity
- Problems
- Manually intensive transformations
- Error-prone transcription / re-creation downstream
- Little knowledge capture

##              Target Situation (longer term) Collaborative Engineering Environment with Advanced Interoperability

**Domain Specific Analysis**

**Cross Domain Analysis**

**CAx  Applications and PDMs**

**PDM**
**Schema**

**Analysis**
**Schema**
**(AP209)**

**Repository Schema Generator**

**Requirements Design & Analysis**

**Data Viewer**

**System**
**Engineering**
**Schema**

**Catalog &**
**View**
**Schemas**

**Application Access/Translation Layer**

**Electrical**
**Schema**
**(AP210)**

**Mechanical**
**Schema**
**(AP203)**

**Documentation Facility**

**(UML)**

**Mfg.**
**Capabilities**
**(AP220)**

**(Text, XML, **
**SGML, etc.)**

**(STEP)**

**(STEP)**

**(STEP)**

**(STEP, XML)**

**(STEP)**

**Model Development and Interactive Environment**

**Request**
**Broker**
**Or**
**Remote**
**Access**
**Mech.**

**Objects**
**Entities,**
**Relations &**
**Attributes**

**Object Oriented or **
**Object Relational **
**DBMS**

**Data Views and PDM**

**Analysis**
**Agents**

**Negotiation/**
**Communications**
**Agents**

**Data Dictionary Facility**

**(Express)**

*Potential Standards-based Architecture (after G. Smith, Boeing)*

## Outline

- AP210-based Environment - JPL/NASA Phase 1
- Ancillary Information Problem
- Phase 1 Scope (work-in-progress)
- Background: ProAM/TIGER Projects, XAI
- Phase 1 Architectures
- Collaboration
- Expected Benefits
- Other Potential AP210 Applications:
- Chip Package Design & Analysis - Shinko Phase 1,  2
- Phase 1 Accomplishments
- References & Nomenclature

## Phase 1 ScopeWork-in-Progress

- Initial step towards vision
- Capture of representative ancillary information
- Focus: PWB stackup information
- Extend Georgia Tech stackup tool (from ProAM)
- STEP AP210 as information container structure
- Develop & demonstrate method
- Initial steps (Phase 1): file-oriented
- Use Metaphase as PDM capability
- Manage files: ECAD file, MCAD file, Gerber file, stackup tool file (AP210 subset), ...
- Next steps (Phase 1+, 2): Fine-grained interactive sharing (Accelis-type tools)

## STEP AP 210PWA/B Design Information

**Technology**

**Physical**

**Geometry**

-   Component Placement
-   Bare Board Geometry
-   Layout items
-   Layers non-planar,
-    conductive & non-conductive
-   Material product

-  Geometrically Bounded
-     2-D Shape
-   Wireframe with Topology
-   Advanced BREP Solids
-   Constructive Solid Geometry

-   Fabrication Design Rules
-   Product Design Rules

**Requirements**

-   Design
-   Allocation
-   Constraints
-   Interface

## ProAM Design-Analysis IntegrationElectronic Packaging Examples: PWA/B 

- ProAM Design-Analysis Integration*Electronic Packaging Examples: PWA/B *

**Analysis Modules (CBAMs) **
** ****of Diverse **_**Behavior**_** & *****Fidelity***** **

**Design Tools**

**Laminates DB**

**FEA*** **Ansys*

**General Math**
*Mathematica*

**Analyzable ****Product Model**

*XaiTools**PWA-B*

*XaiTools*
*PWA-B*

_**Solder Joint**_
_**Deformation**_*****

_**PTH**_
_**Deformation **_
_**& Fatigue**_******

***1D,***
***2D***

***1D,***
***2D,***
***3D***

**Modular, Reusable**
**Template Libraries**

**ECAD Tools*** *
*Mentor Graphics, *
*Accel**

**Analysis Tools**

_**PWB**_
_**Warpage**_

***1D,***
***2D***

**Materials DB**

**PWB Stackup Tool**
*XaiTools PWA-B*

- STEP AP210‡
- GenCAM**,
- PDIF*

- ‡ AP210 DIS WD1.7    * = Item not yet available in toolkit (all others have working examples)    ** = Item available via U-Engineer.com

*Completed*
*6/99*

## Overview of PWB Stackup Design

*Fabrication engineer *_*designs*_* PWB stackup details*

**Stackup Specs ***- PWA/B Designer*

**OR**

- 1 Oz. Cu

- 1 Oz. Cu

- 1 Oz. Cu

- 1 Oz. Cu

- 2 Oz. Cu

- 2 Oz. Cu

- 3 x 1080

- 3 x 1080

- 2 x 2116

- Design Alternative 1

**Stackup Design ***- PWB Fabricator*

- 3 X 106

- 3 X 106

- 1 Oz. Cu

- 1 Oz. Cu

- 1 Oz. Cu

- 2 Oz. Cu

- 2 Oz. Cu

- ...
- Design Alternative *n*

- 1 Oz. Cu

## Post-LaminationThickness Calculation

- Post-LaminationThickness Calculation

*Before:* Typical Manual Worksheet
*(as much as 1 hour engr. time)*

*After:* Tool-Aided Design (ProAM)

## Iterative Design & Analysis PWB Stackup Design & Warpage Analysis

- Iterative Design & Analysis PWB Stackup Design & Warpage Analysis

- Analyzable
- Product Model

- PWB Stackup Design Tool

- 2D Plane Strain Model

- Detailed FEA Check

- 1D Thermal Bending Model

- Layup
- Re-design

- PWB Warpage Modules

- Quick Formula-based Check

*(TIGER *
*extensions)*

## PWB Warpage Modulesa.k.a. CBAMs: COB-based analysis templates

- PWB Thermal Bending Model
- (1D formula-based)

- PWB Plane Strain Model
- (2D formula-based)

## X-Analysis Integration Techniques

- a. Multi-Representation Architecture (MRA)

- b. Explicit Design-Analysis Associativity

- c. Analysis Module Creation Methodology

## Collaborative Engineering Environment Initial Steps - Phase 1

*LKSoft*

- Collaborative Engineering Environment *Initial Steps* - *Phase 1*

**Design Tools**

**Laminates Library**

**Product Knowledge**
**Management System**

*Metaphase*

**ECAD Tools*** *
*Mentor Graphics, *
*Cadence*

**Materials Library**

**PWB Stackup Tool**
*XaiTools PWA-B*

- Native
- files

- AP210 file
-  CC24

*LKSoft*
*STEP s/w*

- JSDAI

*LKSoft, ...*

**Instance Browser/Editor**

*AP210 Viewer,*
*STEP-Book AP210,*
*SDAI-Edit, ...*

*Work-In-Progress*

- AP210 file
-  CCx1-xn

## Collaborative Engineering Environment Next Steps - Phase 1+,2

- Collaborative Engineering Environment* Next Steps - Phase 1+,2*

*Metaphase*

*Accelis*

- Standards-Based
- Coarse/Fine-Grained
- Interoperability

*Notes:*
- Accelis & Metaphase are SDRC products.

**Product Knowledge**
**Management System**

**Engineering**
**Middleware**

*LKSoft*

*LKSoft*

**Design Tools**

**Laminates Library**

**ECAD Tools*** *
*Mentor Graphics, Cadence*

**Materials Library**

**PWB Stackup Tool**
*XaiTools PWA-B*

*LKSoft*
*STEP s/w*

- JSDAI

*LKSoft, ...*

**Instance Browser/Editor**

*AP210 Viewer,*
*STEP-Book AP210,*
*SDAI-Edit, ...*

- J2EE-compliant
- Web Application Server

**Other Tools**

- AP210
- content

## Phase 1 View

*LKSoft, ...*

**Ancillary**
**Information**

**Added Tools**

*XaiTools**PWA-B*

*LKSoft, ...*

**Typical end-user tools **
- (for novices  experts)

**Instance population tools**
- (for experts)

**Existing Tools**

*Mentor**Graphics*

**Product Model**
- (AP210)

**“****dumb” ****information capture**
- (only human-sensible,
- I.e., not computer-sensible)

_**Legend**_

*AP210 Viewer,*
*STEP-Book AP210,*
*SDAI-Edit, ...*

**Instance Browser/Editor**

**PWB Stackup Tool**

**ECAD Tools**

## Collaboration

- JPL/NASA
- Primary stakeholder, end users, tool experts
- Georgia Tech
- Architecture/method, PWB stackup tool, XAI methods
- AP210 Implementers Forum
- Common interests & techniques
- Cooperative exchanges
- JPL/NASA suppliers
- Software vendors

## Expected Benefits: Phase 1

- STEP AP 210-based method
- Depth, extendibility
- Capture of ancillary information
- Representative tool: PWB stackup design
- Graphics, automation
- Tangible end user benefits
- Technique illustration
- “Better, faster, cheaper”
- Increased product model completeness
- Reduced downstream errors
- Increased automation
- Increased knowledge retention

## Outline

- AP210-based Environment - JPL/NASA Phase 1
- Ancillary Information Problem
- Phase 1 Scope (work-in-progress)
- Collaboration
- Expected Benefits
- Other Potential AP210 Applications:
- Chip Package Design & Analysis - Shinko Phase 1,  2
- Phase 1 Accomplishments
- References & Nomenclature

## Other Potential AP210 ApplicationsChip Package Design & Analysis

- Plastic Ball Grid Array (PBGA) Packages

- Quad Flat Packs (QFPs)

## Flexible High Diversity Design-Analysis Integration Electronic Packaging Examples: Chip Packages/Mounting  Shinko Electric Project: Phase 1 (completed 9/00)

- Flexible High Diversity Design-Analysis Integration *Electronic Packaging Examples: Chip Packages/Mounting ** Shinko Electric Project: Phase 1 (completed 9/00)*

**EBGA, PBGA, QFP**

**Analysis Modules (CBAMs) **
** ****of Diverse **_**Behavior**_** & *****Fidelity***** **

**FEA***Ansys*

**General Math**
*Mathematica*

**Analyzable ****Product Model**

*XaiTools*

*XaiTools*
*ChipPackage*

_**Thermal**_
_**Resistance**_

***3******D***

**Modular, Reusable**
**Template Libraries**

**Analysis Tools**

**Design Tools**

**PWB DB**

**Materials DB***

**Prelim/APM Design Tool**

*XaiTools ChipPackage*

_**Thermal**__**Stress**_

***Basic***
***3D*****

- ** = Demonstration module

**Basic**
**Documentation**
**Automation**

**Authoring***MS Excel*

## APM Design ToolPreliminary Design of Packages - PBGA Screens

- APM =
- analyzable product model

## COB-based Analysis Tools Typical Highly Automated Results

- FEA
- Temperature
- Distribution

- COB-based Analysis Tools Typical Highly Automated Results

- Thermal Resistance
- vs.
- Air Flow Velocity

- Auto-Created
- FEA Inputs
- (for Mesh Model)

- Analysis Module Tool with Results Summaries

- COB =
- constrained
- object

## Using Internet/Intranet-based Analysis SolversThick Client Architecture

- Using Internet/Intranet-based Analysis Solvers*Thick Client Architecture*

- Client PCs

*XaiTools*

- Thick Client

- Users

- Internet

*June’99-Present:*
- EIS Lab
-   - Regular internal use
- U-Engineer.com
-   - Demo usage:
-          - US
-          - Japan
*Nov.’00-Present:*
- Electronics Co.
-  - Began production usage
-    (dept. Intranet)
*Future:*
- Company Intranet
-     and/or
- U-Engineer.com
- (commercial)
-      - Other solvers

*Iona orbixdj*

*Mathematica*

*Ansys*

- Internet/Intranet

*XaiTools Ansys*
*Solver Server*

*XaiTools Ansys*
*Solver Server*

*XaiTools Math.*
*Solver Server*

- CORBA Daemon

*XaiTools Ansys*
*Solver Server*

- FEA Solvers

- Math Solvers

- CORBA Servers

- CORBA IIOP

- ...

- Engineering Service Bureau

- Host Machines

## Pilot & Initial Production Usage ResultsProduct Model-Driven Analysis

- Reduced FEA modeling time > 10:1 (days/hours  minutes)
- Reduced simulation cycle > 75%

- Enables greater analysis intensity  Better designs

*References*
- [1] Shinko 5/00 (in Koo, 2000)
- [2] Shinko evaluation 10/12/00

*VTMB = variable topology multi-body technique [Koo, 2000]*

## Phase 1 Summary - Shinko Project  (Phase 2 is underway and evaluating usage of AP210)

## For Further Information ...

- EIS Lab web site: _[http://eislab.gatech.edu/](http://eislab.gatech.edu/)_
- Publications, project overviews, tools, etc.
- See: Publications  DAI/XAI  Suggested Starting Points	X-Analysis Integration (XAI) Technology	_[http://eislab.gatech.edu/pubs/reports/](http://eislab.gatech.edu/pubs/reports/EL002/)__[EL002](http://eislab.gatech.edu/pubs/reports/EL002/)__[/](http://eislab.gatech.edu/pubs/reports/EL002/)_
*XaiTools*TM home page: _[http://eislab.gatech.edu/tools/XaiTools/](http://eislab.gatech.edu/tools/XaiTools/)_
- Pilot commercial ESB: _[http://www.u-engineer.com/](http://www.u-engineer.com/)_
- Internet-based self-serve analysis
- Analysis module catalog for electronic packaging
- Highly automated front-ends to general FEA & math tools

## Nomenclature