# Presentation: 513333

## Muon Collider Detector

***“******New Instrumentation Possibilities***

## MCD – Progress Since Snowmass96

**None**
**But an enormous amount of Detector R&D has been done**
**LHC**
**ILC**
**CLIC (really ILC’)**
**What is Most relevant to the MCD are developments for ILC detectors**
**Same physics, especially when we compare to CLIC**

## Major Issues

**Event Rates**
**Not really an issue, LHC detector/electronics developments can easily handle MC event rates**
**Backgrounds, radiation-damage effects are what need to addressed**

## Snowmass 96 Background Calculations

## Snowmass 96 Background Calculations II

**Longitudinal**

**Radial**

## Snowmass 96 Detector

## Snowmass 96 Detector II

**Central Magnet**
**2T**
******8 X 15 m**
**SVD**
**300 ********m cell**
**300 ********m thick**
**TPC Central Tracker**
**Cal**
**LAr**
**Scintillator Tiles**
**Muon**
**Cathode Strips/pads**

## Snowmass 96 Detector II

**Central Magnet**
**OK**
**CMS, 4T, 6X12.5m**
**MCD, 2T, 8X15m  (probably 4T is affordable)**
**SVD**
**Occupancy OK – 3% (******** 30 hits/cm****2****)**
**Radiation damage (n) – Marginally OK (conservative – Not OK) **
**1 Year lifetime (10****14**** n/cm****2****)**
**TPC**
**Probably would work even with 1996 technology**
**Calorimetry**
**Also Probably OK**
**Muon System**
**OK**

## Developments in last 10 Years

**Lets Look at ILC/CLIC**
**CLIC IR:**

****** ****6****o**

**Beamstrahlung (********B****) ******** 20%**

## CLIC Detector Performance Criteria/Goals

## Track Density at CLIC

**Snowmass 96 MCD = 30/cm****2 **** @ 10 cm**

## ILC RDR – Volume 4: Detectors

**325 Participating Institutions!**

## ILC RDR – Volume 4: Detectors

**No one has been able to determine how many contributors**

## ILC Detector R&D

**An enormous amount of work has been done over the last 10 years**
**Much is directly relevant to a MCD**
**What follows has been graciously supplied by Marcel Demarteau, the Fermilab ILC Detector R&D Leader**

## ILC Detector R&D

***Marcel Demarteau******Fermilab ***

***TWEPP07 – Prague, September 7, 2007***

## Some ILC Parameters 

- Some ILC Parameters

- Time structure
- five trains of 2625 bunches per second
- bunch separation is 369.2 ns  (LEP: 22 s)
- Readout options driven by physics
- Once per train; time stamping sets time resolution
- Once per bunch
- Duty cycle (1 ms of data – 199 ms idle) allows for “power pulsing”
- Switch power to quiescent mode during idle time
- Single IR with 14 mrad crossing angle
- Beam size: x = 640 nm, y = 6 nm

## Specification for an ILC Detector

- ILC detectors are precision detectors: fully reconstruct the final state over the full angular region
- Identify each and every particle, with high efficiency and high purity, over the full angular range
- Differentiate between Z’s and W’s in their hadronic decay
- Differentiate between b- and c-quarks
- Differentiate between b- and anti-b quark
- Although these requirements are common drivers for all experiments, they are non-negotiable requirements for the ILC  !

## The ILC Concept Detectors

- Requirements:

| Detector | Premise | Vertex Detector | Tracking | EM calorimeter | Hadron
calorimeter | Sole-noid | MuonSystem |
| --- | --- | --- | --- | --- | --- | --- | --- |
| LDC | PFA | 5-layer pixels  | TPC Gaseous | Silicon-Tungsten | Analog- scintillator  | 4 Tesla
 | Instrumented flux return |
| GLD | PFA | 6-layer fine pixel ccd | TPCGaseous | Scintillator-Tungsten | Digital/Analog Pb-scintillator | 3 Tesla | Instrumented flux return  |
| SiD | PFA | 5-layer silicon pixel | Silicon strips  | Silicon-Tungsten | Digital Steel - RPC  | 5 Tesla | Instrumented flux return |
| 4th | Dual Readout | 5-layer silicon pixel | TPCGaseous | 2/3-readouts Crystal | 2/3-readouts Tungsten-fiber  | 3.5 Tesla | Iron free dual solenoid |

- Impact parameter resolution:
- Momentum resolution:
- Jet energy resolution:

**GLD**

**LDC**

**SiD**

**4****th**** **

## Calorimetry

## Calorimetry

- Goal: (E)/E ~ 3-4%
- Ability to separate Z → qq from W → qq’
- Paradigms:
- Dual or Triple Readout
- Particle Flow Algorithm (PFA)
- Enabling Technologies:
- New generation of Photon Detectors
- Highly integrated microelectronics
- Strategies:
- Digital versus Analogue readout

**H1 **

**ATLAS**

**ALEPH**

**Goal for PFA-ILC**

******(E****jet****) (GeV) **

**E****jet**** ( GeV) **

*****

## Multiple Readout Calorimetry

- Dual-Readout: measure every shower twice
- Scintillation light: from all charged particles
- Čerenkov light: =1 particles, mainly EM
- By measuring separately both componentscan determine e/h fraction and correct the response (set e/h=1)
- Approaches:
- Scintillating and quartz fibers embedded in Cu (DREAM);
- no longitudinal segmentation
- Leadglass-Scintillator sampling
- Doped crystals

**DREAM****200 GeV ******

## Particle Flow Algorithm 

- The other paradigm to obtain better energy resolution: PFA
- PFA: Reconstruct momenta of individual particles in jet; avoid double counting
- Measure photons in the ECAL
- Measure charged particles in the tracking system
- Subtract calorimeter energy associated with charged hadrons
- Measure neutral hadrons in the HCAL (+ ECAL)
- PFA: a brilliant idea !
- Novelty is in reducing the role of the hadron calorimeter – and thus the hadron energy resolution – to the measurement of neutral hadrons only
- Implications for the calorimetry
- Granularity, longitudinal and transverse !
- Sampling of the hadron calorimeter
- Digital or analog readout

**Imaging calorimeter**

## Calorimeter Architectures

- One of the main drivers for imaging calorimeters is granularity
- Need to separate energy deposits from different particles

|  | Electromagnetic |  | Hadronic |  |
| --- | --- | --- | --- | --- |
| Active element | Analogue | Digital | Analogue | Digital |
| Silicon | kPIXSKIRoc
Cells ~0.5x0.5 cm2 | MAPS 

Cells ~50x50 m22 | Too expensive | Too expensive |
| Scintillator | PPD readout  | – | PPD readoutCells ~3x3cm2 | –  |
| Gas  | – | – | – | RPCGEMMicroMegas
Cells ~1x1 cm2 |

## Analogue Electromagnetic Calorimeter

- Silicon-Tungsten sampling calorimeter
- Total Si area (incl. endcaps) ~2000 m2
- Total number of channels up to 80×106
- Average dissipated power 1-4 μW/mm2
- LDC approach:
- Sensitive silicon layers are on PCBs
- 1x1cm2 pads, ~1.5m long × 30cm wide
- Pad readout digitized to ~16 bits by VFE ASIC
- SiD approach:
- 6” hexagonal wafers with 1024 13 mm2 pixels
- Readout with one ASIC, connected to readout cable

- Scintillator-Tungsten sampling calorimeter
- GLD approach:
- Tile and strip configuration
- WLS fiber readout with Photo-detector

## Digital Electromagnetic Calorimeter

- EM calorimeter based on Monolithic Active Pixel Sensors
- Intrinsic high granularity through wafer processing
- CMOS process cheaper than high resistivity pure silicon
- ECAL MAPS design
- Binary readout, threshold adjustment for each pixel
- Pixels 50μm×50μm, 4 diodes for Charge Collection
- With ~100 particles/mm2 in the shower core and 1% prob.  of double hit the pixel size should be ~40 μm×40 μm
- Prototype device with two types of readout
- Time Stamping with 13 bits (8192 bunches)
- Hit buffering for entire train, readout between trains
- Capability to mask individual pixels
- Total number of ECAL pixels around 8×1011: Terapixels

**50 ********m**

- Device being simulated
- Signal to Noise > 15 for 1.8 μm Diode Size
- Critical issue for Terapixel system

## Analogue Hadron Calorimeter

- Planes of scintillator and absorber:    GLD: z/x/T; LDC: tiles only

- Very high granularity
- 4x4cm2x5mm; 1x20cm2x5mm (GLD)
- 3x3 / 6x6 / 12x12 cm2 tiles (Calice)
- Each element read out separately
- Massive number of readout channels ~50M channels
- Photon detection of scintillator light
- Collection through WLS fiber
- Direct coupling of detector on scintillator
- Enabling technology: Geiger-mode Avalanche Photo Diodes

## Geiger-mode Avalanche Photo Diode

- The technology that enables this high granularity is Geiger-mode Avalanche Photo Diodes (MRS, MPPC, SiPM, PPD)
- Array of pixels connected to a single output
- Signal = Sum of all cells fired; binary device !
- If probability to hit a single cell < 1  Signal proportional to # photons
- Characteristics:
- Pros
- Very compact
- High PDE (15~20% for 1600 pix)
- Insensitive to magnetic field
- High gain (105~106)
- Operational at Vbias=70~80 V
- Good timing resolution
- Cons
- Thermal noise rate (100kHz~300kHz @ 0.5 pe)
- Response is non-linear due to limited number of pixels (saturation effect)
- Sensitive to temperature change
- Cross-talk and after-pulsing
- Vendors
- Hamamatsu, SensL, IRST, Mephi, Pulsar, CPTA/Photonique, Dubna/Mikron, Kotura, aPeak, ...

**1mm**

**1mm**

**IRST**

- 3x3x0.5 cm3 UNIPLAST1 mm WLS Kuraray fiber Y11(300)

## Digital Hadron Calorimetry

- Three technologies:
- Resistive Plate Chamber (RPC)
- Single gap
- Coated glass as resistive plates
- Avalanche mode
- Readout pads ~1x1 cm2
- Gas Electron Multiplier (GEM)
- Separate drift and amplif. gap
- Aiming at ~1x1cm2 readout
- Micro MEsh GAseous Structure
- Fine mesh separates 3mm drift and 0.1mm amplification gaps
- R&D
- Performance metrics
- MIP detection efficiency uniformity
- Readout multiplicity
- Noise rate, rate capability
- Gain experience in large scale and long-term operation and production
- Identify critical operational issues

**RPC**

**GEM Padboard**

## Tracking

## Tracking

- Goal:
- Superb momentum resolution
- Robust pattern recognition and good two track separation
- Tolerant to high machine background
- Paradigms:
- Silicon Tracking
- •superb position resolution
- •compact tracker
- Time Projection Chamber (TPC)
- many space points (~200)
- Two track resolution <2/5-10mm (r,)/(r,z)
- Enabling Technologies:
- Advances in Si processing
- Precision TPC readout

## TPC Tracking

- _ALICE TPC_
- p/p  1%, B=0.4T
- Material 3.5% X0 near  = 0
- MWPC readout, ~500k cathode pads, pad sizes 4x7.5, 6x10, 6x15 mm2
- hit resol. 800 ... 1250 m r, z

- _ILC TPC_
- p/p  0.1%, B=4T
- Material <3% X0 near  = 0<30%X0 endcap
- pads per endcap > 106, pad size about 1x6 mm2
- hit resol. 100, 500 m r, z @ 4T
- Readout
- GEM
- MicroMegas
- CMOS Pixels

## TPC Readout

- GEM

- MicroMegas

- Anode

- Anode

- two copper foils separated by polyimide
- uses 2 or more stages for safer operation
- high electric field inside the holes, in which multiplication takes place
- 50 m amplification region is displaced from the anode

- micromesh sustained by pillars
- amplification between mesh and pads/strip plane
- single stage
- 50 m amplification region includes the anode
- Now “Bulk Micromegas” can be obtained by lamination of a woven grid on an anode with a photo-imageable film
- The ILC-TPC resolution goal, ~100 μm for all tracks, appears feasible.

- MicroMegas, 2x6mm2 padsB=1T

## TPC CMOS Readout 

- Use bare CMOS chip as anode to directly collect signals from GEMs or Micromegas: MediPix chip
- Charge collection with granularity matching primary ionization cluster spread
- On-chip processing of signals
- Currently:
- 3rd coordinate (time) being added: TimePix chip
- Integration of GEM/Micromegas grid and CMOS sensor through wafer processing (InGrid)
- Prospects:
- Ionization cluster counting is possible to improve part. id. performance
- Potential for large improvements in pattern recognition and dE/dx
- “Digital Bubble Chamber”

**GEM foil integrated on chip**

## TPC R&D 

- Many prototype TPC’s built
- Interchangeable gas-amplification
- Wide range of studies:
- Gas and resolution studies
- Candidate gas amplification devices
- Direct comparison of triple-GEM and Bulk Micromegas
- Ion/electron transmission studies
- Ion feedback measurements
- Plan for large prototype TPC
- 60 cm drift length, 80 cm diameter
- Interchangeable gas-amplificationmodules designed to directly compare gas-amplification technologies
- Need for large bore high magnetic field!
- R&D synergistic with T2K
- T2K will have 3 TPCs
- 72 Micromegas modules
- Total area ~ 9 m2
- 124416 readout channels

**Cornell/Purdue small prototype**

**Large TPC**

**D=80cm**

## Silicon Tracker

- All silicon tracking, SiD
- “Power-pulsing” allows for gas cooling
- Hybrid-less design
- 100x100mm2 sensor from 6” wafer with 1840 (3679) readout (interm.) strips
- Integration of pitch adapter through 2nd metal layer in sensor for signal routing
- Sensor (1840 channels) read out with two asics (kPix)
- Power and clock routed over the sensor !
- Silicon as “ intermediate layers”
- Double-sided layers to act as tracker
- d-s silicon R&D actively being pursued in Korea
- Single-sided layers to “link” subdetectors
- Long-ladders with associated FE Asic

**SiD**

## Vertexing

## Vertexing

- Goal:
- Superb impact parameter resolution
- Minimal material budget: < 0.1%X0 / layer
- Equivalent to 100 m of Silicon
- Minimal power consumption (<50W)
- Ability to determine quark charge
- Tolerant to high machine background
- Paradigms:
- Readout during the train
- Readout in-between trains

## Silicon Technologies

## ILC Candidate Technologies

- CCD’s
- Column Parallel (UK)
- Fine Pixel (Japan)
- ISIS (UK)
- Split Column (SLAC)
- CMOS Active Pixels
- Mimosa series (Ires)
- INFN
- LDRD 1-3 (LBNL)
- CAP 1-4 (Hawaii)
- Chronopixel (Oregon/Yale)
- SOI
- American Semiconductor/FNAL
- LDRD-SOI (LBNL)
- CAP5 (Hawaii)
- OKI/KEK
- 3D
- VIP (FNAL)
- DEPFET (Munich)

**DEPFET**

**3D**

**CAPS4**

**MIIMOSA-n**

**LBL-LDRD3**

**ISIS**

**CPC2**

## Sensor Architectures

- An incomplete attempt at listing some of the current architectures design for ILC pixel detectors
- With apologies to all other technologies, I will only mention three: CP-CCD, Mimosa, 3D

|  | CMOS MAPS | CCD | DEPFET | SOI | 3D |
| --- | --- | --- | --- | --- | --- |
| Rolling Shutter | Mimosa 1-N
LDRD 1,2 | Normal CCD |  | LDRD-SOI |  |
| Column Parallel | Mimosa 8
LDRD3 | CP-CCDSC-CCD | DEPFET/ CURO |  |  |
| Pipelined Storage | Mimosa-12
CAP | ISIS |  | CAP-5 |  |
| Time Stamp | Chronopixel |  |  | ASI SBIR
 | VIP-1 |

## Column Parallel CCD

- CP-CCD: read out a vector instead of a matrix
- Readout time shortened by orders of magnitude
- But every column needs its own amplifier and ADC: readout chip
- Need to operate at 50 MHz to meet ILC readout rate spec.
- Driving of CP-CCD is a major challenge

- 2nd generation large area sensors : CPC2
- Devices with 2-level metal clock distribution
- 25 μm and 50 μm epi layers
- Reaches 45 MHz operation (designed for 50 MHz)
- Dedicated readout chip
- CPR2, bump bonded at VTT to CPC2
- Dedicated clock drive chip
- CPD1, requirement of 2 Vpk-pk at 50 MHz over 40 nF

**CPC2**

**CPR2**

## Mimosa

- Mimosa-16 being developed as beamline telescope for DESY (and Fermilab) testbeam:
- Column parallel readout
- 32 // columns of 128 pixels (pitch: 25 μm)
- ~11–16 μm epitaxy
- on-pixel CDS
- Final geometry:
- 1024 columns of 512 pixels, 20 μm pitch
- Expected hit resolution < 2.5 μm
- Sensitive area = 20.48 x 10.24 mm2
- pixels with integrated CDS
- sensor with integrated 4/5-bit ADC
- possibly zero-suppression
- Read-out speed
- default tr.o. = 512 lines / 5 MHz ~ 100 μs
- Possible variant
- 1280 columns of 640 pixels, 16 μm pitch with binary readout

## Vertical Integration – 3D 

- Vertical Integration – 3D

- A 3D device is a chip comprised of 2 or more layers of semiconductor devices which have been thinned, bonded, and interconnected to form a monolithic circuit
- Advantages of 3D
- Increased circuit density due to multiple tiers of electronics
- Fully active sensor area
- Independent control of substrate materials for each of the tiers
- Process optimization for each layer
- Ability to mate various technologies in a monolithic assembly

- Technology driven by industry
- Reduce R, L, C for higher speed
- Reduce chip I/O  pads
- Provide increased functionality
- Reduce interconnect power, crosstalk

- Critical issue are:
- Layer thinning to < 10 m
- Precision alignment (< 1 m)
- Bonding of the layers
- Through-wafer via formation

## VIP Chip

- 3D chip Vertical Integrated Pixel (VIP) chip submitted by Fermilab to DARPA funded MIT-LL 0.18 m 3D process
- Chips due to arrive in a couple of weeks; key features:
- Analog pulse height, sparse readout, high resolution time stamp, front-end power ~ 1875 W/mm2 (before cycling), 175 transistors in 20x20 μm2 pixel.

## Sensor Technology

- Device thinning is becoming very common
- CCD’s are regularly thinned to 20 m
**LBL has thinned over 15 Mimosa CMOS MAPS chips down to 40 ********m**
- Yield of functional chips ~90%
- Studies of charge collection and S/N before/after back-thinning
- Some evidence of small signal loss after thinning
- Sensors will be used in Fermilab beam telescope
- Fermilab has thinned BTeV Fpix chips/wafers to 15/20 m with ~75% yield
- Thinned Edgeless Sensors
- Sensors sensitive to the edge can be fabricated by a combination of trench etching, thinning, and laser annealing
- Fermilab producing a set of detectors thinned to 50-100 m at MIT-LL for beam and probe tests

- Detector Cross section near
- one detector edge

- Implant with
- laser annealing

- Trench on
- detector
- edge filled
- with poly
- and connected
- to bottom
- implant

- Diode implants

- Detector
- bias

- To other
- pixels

- 20 m

## Conclusions

**For the most part, currently available or developing technology will meet the performance criteria as stated in Snowmass 96 for**
**Muon System**
**Calorimetry**
**Central Tracking (r>20-50 cm) Non-Silicon**
**However, neutrons could still be a problem for readout electronics.  For a TPC option, for example, front-end electronics at the end planes would have to be shielded from low-energy neutrons (longitudinal fluence)**
**Inner Tracking (Vertexing) presents problems due to the large n fluence**

## Conclusions II

**Vertexing example: CMS Pixels (@ r=4.3cm)**
****** ****2 X 10****14 ****n for 5 years of running @10****34**** cm****-2****s****-1**
**Lifetime limit**
**Options**
**Thinner detectors**
**40 ********m vs. 300 (X8)**
**Amorphous Si**
**CVD Diamond detectors**
**~ X100 hardness over Si**
**LARP Detector R&D **
**Prototype Diamond detector system (pixel luminosity telescope (PLT) for CMS**

**NIEL**
**Non-Ionizing Energy Loss**

## Conclusions III

**Ongoing detector R&D (ILC, LARP) is addressing many detector issues for the MCD**
**First order of business - Need**
**Next iteration on interaction region design**
**Next iteration on collider ring design**
**May ameliorate some of the radiation background problems**
**The outcome of these design studies can then be used as input to a new round of radiation background studies for the MCD**
**Lead to directions for dedicated detector R&D for the MCD**