# Presentation: 753571

## Landscape/Goals for R&D

- Goal: Barrel+structure ready Summer/Fall 06 (run07)
- Goal: Endcaps ready Summer/Fall 07 (run08)
- RIKEN funds available 03, 04, 05
- DOE construction funds
- goal is FY05

- Craig Ogilvie

- Aug 2003

## R&D

- Much ongoing effort, supported by
-  RIKEN, LANL LDRD, ISU university funds, SUNY-SB funds
- R&D Priorities (FY03/FY04)
-  pixel pilot and signal bus
-  generic Si FEM (pixel, strip, endcap)
-  strip/SVX4 readout
-  ministrip PHX
- Later FY04 (when device better specified)
-  mechanical support/cooling

- Craig Ogilvie

- Aug 2003

## Si Strip Electronics 

- (PHX + ministrip),
- DOE funds FY03+FY04
- 1st round design finished by April-Jul ’04
- tested by Dec ’04
- (SVX4 + strip) system test, starts Sep ’03
- two options for 1st round of readout card
- RIKEN funds+DOE R&D funds early FY04
- keeps on schedule
- or wait till we decide between SVX4 and PHX
- Propose to group
- make decision on which strip technology April ’04
- limited knowledge of PHX by then, so if PHX is the decision
- fall-back is SVX4

- Craig Ogilvie

- Aug 2003

## R&D Funds: Proposal

| Item | JY03 | JY04 | FY03
BNL | FY03
DOE | FY04
DOE | FY05
DOE |
| --- | --- | --- | --- | --- | --- | --- |
| Pixel Pilot | 50 | 50 | 15 |  | 90 | 45 |
| Pixel Bus | 50 | 50 |  |  |  |  |
| Pixel FEM/DCM |  |  | 15 |  | 90 | 45 |
| Strip sensors | 60 |  |  |  |  |  |
| Strip ROC+FEM * | 300 | 100 |  |  | 125 |  |
| mini-strip ROC |  |  |  | 80 | 125 | 140 |
| mini-strip sensors |  |  |  |  | 15 | 15 |
| mini-strip pilot/assembly |  |  |  |  |  | 100 |
| mechanical/cooling |  |  |  |  | 200 | 150 |
| overhead |  |  | 4 | ? | 208 | 146 |
| Total | 460 | 200 | 34 | 80 | 853 | 641 |

- *Strip ROC, contingent on decision, total is $300K less than needed

- Craig Ogilvie

- Aug 2003

## Backup

- Craig Ogilvie

- Aug 2003

## PHX Schedule

- Design specifications completed 10/03
- Start design 12/03
- Submit prototype 7/04
- Prototype testing completed 12/04
- Redesign completed for engineering run 1/05
- Engineering run back 3/05

**Ray Yarema, FNAL, June 9th**

- Craig Ogilvie

- Aug 2003

## PHX Cost

- Chip design/testing – 2 man-years - $275K (includes all overhead costs)
- Prototype chip fabrication- $40K (small chip)
- Test board $5K
- Engineering run (10-12 wafers) $200K
- 9 Extra wafers using same masks - $45K
- Production wafer level testing –engineering, tech time, circuit board, probe card - $60K
- Contingency tbd

**Ray Yarema, FNAL, June 9th**

**20 wafers total**

- FY03-FY04 = 182K, FY04 =

- Craig Ogilvie

- Aug 2003

## Physics of Strip Decision

- Occupancy
- BNL strips 2nd layer ~ 10%, mini-strips much less
- “10%” needs to be checked (volunteer?)
- ramifications
- with projective geometry, 3-D hit is ambiguous
- stand-alone tracking difficult, but not the main plan
- projections from outer detectors (e.g. dch)
- more than one hit may associate with same track
- DCA ambiguous
- envelope calculation ? or requires tracking team ?
- 3-D position information better with mini-strips
- high-pt track rejection?
- use with endcap?
- Heat-load different => thickness? (volunteer?)

- Craig Ogilvie

- Aug 2003

## Other issues

- ambiguity may be a concern for proposals/reviewers
- unlikely to affect CD0?
- need to work on costs, WBS
- need mini-strip sensor expert (volunteer?)

- Craig Ogilvie

- Aug 2003