# Presentation: 834877

## PHENIX upgrades: view presented to DOE 

**Muon trigger upgrades, missing since not aimed towards DOE funding **

**PHENIX upgrades: view presented to DOE **

**R&D  $3.5M**
**Construction $16.6M **

- PHENIX

- D M Lee 6-17-2003

- PHENIX

- D M Lee 6-17-2003

## PHENIXInstitutional Responsibilities

- D M Lee 6-17-2003

| task | institution |
| --- | --- |
| mechanical support, cooling | HYTEC/LANL |
| integration, infrastructure | BNL |
| pixel hybrids, sensor/readout | LANL |
| pixel pilot | ISU |
| pixel assembly, ladder bus | LANL |
| pixel fem | SUNY-S/B |
| DCM’s | Columbia |

## Simulations Tasks endcap 

- 	Implementation of new geometry in PISA
- 	Continual update of geometry with evolving mechanical design
- 	Ministrip size determination -
- 	Detailed simulation of pp capability
- 	Detailed simulation of Au-Au capability
- 	Vertex tracking code
- 	Detailed track matching
- 	Integration with barrel and HPD/TPC
- 	Overall coordination -
- UNM, Doug Fields has expressed an interest in helping with the simulation and has a student.  He hasn’t defined the level of effort yet.  The simulations to date for the end caps have been done by Pat McGaughey and Dave Lee and the new geometry has been done by Hua Pei.  Some interest in simulations has been expressed by Pat,Gerd, and Dave.
- Mechanical Tasks  endcap and barrel
- 	Overall coordinaton  Lee
- 	Ladder prototyping cooling test  HYTEC
- 	Overall structure prototype  HYTEC
- 	Production liason  Lee, HYTEC
- 	Ladder assembly -
- 	Combined endcap/barrel assembly -
- 	Cooling system production
- 	Integration with PHENIX/HBD/TPC -
- Dave Lee has been working with a company, HYTEC, to do the mechanical design of the total support structure and cooling design for the barrel and endcap.  They produced a conceptual design based on their work on ATLAS that covered ladder structures, cooling, and the combined barrel and endcap support.

- D M Lee 6-17-2003

## Sensor Tasks  endcap

- 	Overall coordination -
- 	Ministrip Design
- 	Prototyping -
- 	Testing
- 	Testing with bump bonded frontend chip
- 	Bump bonding -
- 	Production liason
- Electronics  endcap
- 	Overall coordination  Kunde?
- 	Frontend ministrip chip design  Kunde
- 	Prototype Frontend chip  fermilab
- 	Testing frontend chip  Kunde, fermilab
- 	Production frontend chip  Kunde, fermilab
- 	Supporting chip design, pilot chip/chips
- 	Test supporting chip
- 	Slow control
- 	HV design -
- 	Readout cable design
- 	Power plant
- 	DCM liason to Chi
- Gerd Kunde has established a collaboration with Ray Yarema of  FERMILAB to design the frontend chip to bump bond to the sensors.  In addition all facilities at FERMILAB are available to us for Q/A, assembly testing, etc.
- Construction  where ?
- 	Coordinator
- Integration electrical and mechanical who?

- D M Lee 6-17-2003

## FermiLab Electronics Cost Estimate

- Chip design/testing – 2 man-years - $275K (includes all overhead costs)
- Prototype chip fabrication- $40K (small chip), or $80K (large chip)
- Test board $5K
- Engineering run (10-12 wafers) $200K
- 9 Extra wafers using same masks - $45K
- Production wafer level testing –engineering, tech time, circuit board, probe card - $60K
- Contingency??

- PHENIXBeginning cost basis

- D M Lee 6-17-2003

## Fermilab Electronics Schedule Estimate

- Design specifications completed 10/03
- Start design 12/03
- Submit prototype 7/04
- Prototype testing completed 12/04
- Redesign completed for engineering run 1/05
- Engineering run back 3/05

- PHENIX

- D M Lee 6-17-2003

- PHENIX

- D M Lee 6-17-2003

## PHENIXLANL Manpower Estimate

- Electronic Engineer – Fermilab – construction Budget – 2 FTE
- Electronic Integration Engineer – construction Budget - 0.5 FTE
- Tech – construction budget – 2 FTE
- Lab space, Q/A,Assembly
- Infrastructure – lab space, testing assembly, FNAL, HYTEC, LANL, BNL
- 			Institutionals
- LANL, ISU,Columbia,UofCol,UNM,NMSU?,Ecole Poly?, Saclay?, SUNY-SB,

- PHENIXLANL Manpower Estimate

- D M Lee 6-17-2003

## PHENIXInitial endcap cost estimate

**Construction Project 2 – EndCaps**		**DOE (k$)**
**Mechanical support and cooling (2 endcaps)****	****195**
**Hybrid pixel layers (2 encaps)**			**4766**
**Management**				**100**
**Total**					**5061**
**Overhead on DOE contribution **		**1257**
**50% contingency**				**2458**
**Total**					**8849**

- PHENIXInitial endcap cost estimate

- D M Lee 6-17-2003

## PHENIXPhysicist Manpower Estimate

- Barnes			20			20
- Brooks			75			25
- Burward-Hoy		100
- Kunde			40	                                40
- Lee			25			50
- Leitch			100
- Liu			75			25
- McGaughey		50		               	50
- Moss						20
- Silvermyr		100
- Sullivan			40	                               vanHecke			50			50

- PHENIXPhysicist Manpower Estimate

- D M Lee 6-17-2003