# Presentation: 820885

## BTeV Tracking SystemPixel Vertex Detector (WBS 1.2)Straw Tracker (WBS 1.6)Silicon Tracker (WBS 1.7)

_**Simon Kwan (WBS 1.2)**_
**Alan Hahn (WBS 1.6)**
**Luigi Moroni (WBS 1.7)**

## Overview

** ****Brief description of the BTeV tracking system **
** **Pixel vertex detector
-  Forward tracker (Straw & Silicon strips)
**Details of each sub-system**
- Project requirements & Description
- Project organization
- Cost, Schedule,  and Critical path
- Milestones
- Risk Assessment
- Responses to DOE CD-1 recommendations
**Presentations prepared for the breakout sessions**
**Conclusion**
**Glossary**

## Introduction

**Coverage**:
- Aperture 300 mr
- Momentum acceptance  3 - >100 GeV/c
**Tracking efficiency > 98%**
**Resolution for vertex detector:**
- Spatial : < 9 m
- Time: < 50 fs
**Vertex detector info available for use in L1 trigger**
**Angular resolution**:
- Better than 0.1 mr
**Momentum resolution**:
- 1% at 100 GeV/c
**Can handle huge data rate and survive high radiation dosage**

**Vertex Detector**
**Pixel Detector (WBS1.2)**
- Precise vertex detection and reasonable  momentum measurement capability
- Fast info available for use in L1 vertex trigger
**Forward Tracker**
**Straw (WBS1.6) and Silicon Strip (WBS1.7)**
- Precise momentum measurement, Ks/detection, project tracks into RICH, EMCAL, Muon chambers
- Combination of **Silicon strips **near the beam and **Straw Chambers  **at large radius

- Requirements

- Key features

## BTeV Detector

**30 Station**
**Pixel Detector**

##              Technical Description of Pixel Detector    WBS1.2

**Reasons for Pixel Detector:**
-  Superior signal to noise
-  Radiation Hard
-  Excellent spatial resolution:    <9 m for all tracks
-  Pattern recognition power
-  Very low occupancy

**Special features:**
-  Info used directly in the L1 trigger
-  Placed inside a dipole and gives standalone momentum measurement
-  Sitting close to beam and be retractable during beam refill -> needs vacuum system and rf shielding
-  30 stations with 23 million pixels
-   in total
-  Total length ~1.3m

##          Pixel Detector Properties & Performance   WBS1.2

| Property | Value |
| --- | --- |
| Pixel Size | 50 m x 400 m |
| Outer plane dimension | 10 cm x 10 cm |
| Central square hole (adjustable) | Nominal setting: 12 mm x 12 mm |
| Number of planes | 60 |
| Number of stations | 30 |
| Number of pixels | 23 million |
| Total Silicon active area | 0.5 m2 |
| Separation of stations | 4.25 cm |

**Primary-secondary vertex separation**
**Reconst - generated****.**** ******** = 138******

**proper**** (reconstructed)**** - ******** ****proper ****(generated)**** **
** ********= 46 fsec**

**B****s**** ******** D****s****  **********

## WBS 1.2.1: Sensor & Detector Hybridization 
Includes design, procurement and testing of sensor wafers, flip-chip mating of sensors to readout chips to get pixel modules
WBS 1.2.2: Electronics 
Includes pixel readout chips, data cables, PIFC, Feed-through Board (FTB), HV/LV power supplies and cables
WBS 1.2.3: Mechanical & Vacuum system 
Includes substrate, fixtures, vacuum vessel, position control system, cooling system, vacuum system, support structure,  and rf shield
WBS 1.2.4: System Integration 
Includes production HDI, pixel module assembly and testing, test-stands, station assembly, detector assembly, beam test, control &monitoring, fast interlocks, system test, system software
WBS 1.2.5: Project Management 

- Includes design, procurement and testing of sensor wafers, flip-chip mating of sensors to readout chips to get pixel modules
- WBS 1.2.2: Electronics
- Includes pixel readout chips, data cables, PIFC, Feed-through Board (FTB), HV/LV power supplies and cables
- WBS 1.2.3: Mechanical & Vacuum system
- Includes substrate, fixtures, vacuum vessel, position control system, cooling system, vacuum system, support structure,  and rf shield
- WBS 1.2.4: System Integration
- Includes production HDI, pixel module assembly and testing, test-stands, station assembly, detector assembly, beam test, control &monitoring, fast interlocks, system test, system software
- WBS 1.2.5: Project Management

**Pixel Components             WBS 1.2**

##                     Pixel Detector            WBS 1.2

- Pixel Sensor bump-bonded to Readout chip
- Fine segmentation
- 50 m x 400 m
- Large number of channels
- Electronics in the active tracking volume
- High power density (~ 3kW
- -> cooling system)
- Basic building block – Multichip Module (MCM)
- 4 types (4, 5, 6, and 8 chip array)
- Large number of HDI and flex cables
- Assemble modules on both sides of substrate to form pixel half plane; an x-measuring half-plane and a y-measuring half-plane form a half-station

***Si pixel  sensors***

***Pixel Readout chip***

##                             Pixel Half-Station               WBS1.2

**Carbon support half cylinder (~1.26m long)**

**Cu tabs brazed to SS tube- LN****2**** heat sink**

##                       Feed-through Board (FTB)               WBS1.2

- Signal path: ROC- HDI- PIFC- FTB- PDCB-trigger/DAQ system
- Board size: 17”x27.5”; more than 16 layers
- Full size FTB prototype will be delivered next month
- Key for mechanical and electrical tests
- FTB layout is very dense and can benefit from any possible simplification

- PIFC

- PGS

- HDI

## Pixel Detector Assembly

**Pixel Detector Assembly**

##                  Pixel Detector  Participants          WBS 1.2

**Fermilab:**** **J. A. Appel, D. C. Christian, S. Cihangir, J. Fast, R. Kutschke, S. Kwan, M. Marinelli, L. Uplegger, J. Andresen, M. Bowden, G. Cardoso,   H. Cease, C. Gingu,  J. Hoff,  A. Mekkaoui, M. Turqueti, R. Yarema, J. Howell,  C. Kendziora, M. Kozlovsky, M. Larwill, C.M. Lei, A. Shenai, M.L. Wong , S. Austin,  S.Jakubowski, R. Jones, G. Sellberg, M. Ruschman, J. Rausch, R. Sanders, E. Skup
**Frascati:**** **S. Bianco, F. Fabbri, M. Caponero, D. Colonna, A. Paolozzi
**Iowa:**** **C. Newsom, M. Divoky, J. Morgan** **
**Milano:**** **G. Alimonti, S. Magni, D. Menasce, L. Moroni, D. Pedrini,  S. Sala
**Syracuse:**** **M. Artuso, C. Boulahouache,  J.C. Wang
**Tennessee**** **T. Handler, R.Mitchell, S. Berridge
**Wayne State:**** **D. Cinabro, G. Bonvicini, A. Schreiner, A. Guiterrez, G. Gallay, S. LaPointe

- Physicist
- - Technical staff

##                       Pixel L2 & L3 Managers             WBS1.2 

- Base cost: $14.57M   (Material: $7.14M, Labor: $7.43M)

## Pixel Construction Cost              WBS 1.2

-  CD1 Review:  Base $15.5M    Total $21.65M (contingency ~ 40%)
-  Move DCB to WBS1.9 + new quotes (e.g. readout chips, TPG)  reduce base M&S by $900K
-  Increase labor and contingency (now 42.7%) following the CD1 reviewers’ remark

##            M&S Obligation Profile by Fiscal Year    WBS 1.2

## Labor Profile by Fiscal Year      WBS 1.2

**FY05**

**FY06**

**FY07**

**FY08**

**FY09**

**0**

**10**

**20**

**30**

**40**

**FTEs**

- 16.9

- 30.7

- 38.0

- 25.0

- 4.7

## Pixel Flow Diagram                     WBS1.2

## Detector need-by date: August 17, 2009
Scheduled completion date: August 6, 2008 giving a total float of 259  working days
Pixel Detector will be installed as one piece (vessel with stations inside)
Pixel Detector has many components but the critical path is the making the pixel modules, placing them on a substrate (half-plane and half-station), and assemble the half-stations into the two half-detectors. This is a sequence of production, assembly and testing steps. Because we have 1380 modules in total, the duration of the each sequence is long (10 months or more). To keep this tight schedule, 
A lot of staggering in the activities
Place the orders early (sensor, ROC, hybridization)
DOE CD1 Report: advance the critical component procurement in 2005
Multiple paths/vendors
Sustain the flow of parts and have more than one assembly/test line/shift
Engage qualified vendors early in QA and throughput discussion

- Scheduled completion date: August 6, 2008 giving a total float of **259**  working days
- Pixel Detector will be installed as one piece (vessel with stations inside)
- Pixel Detector has many components but the critical path is the making the pixel modules, placing them on a substrate (half-plane and half-station), and assemble the half-stations into the two half-detectors. This is a sequence of production, assembly and testing steps. Because we have 1380 modules in total, the duration of the each sequence is long (10 months or more). To keep this tight schedule,
- A lot of staggering in the activities
- Place the orders early (sensor, ROC, hybridization)
- DOE CD1 Report: advance the critical component procurement in 2005
- Multiple paths/vendors
- Sustain the flow of parts and have more than one assembly/test line/shift
- Engage qualified vendors early in QA and throughput discussion

- Critical Path Analysis            WBS 1.2

## Critical Path Gantt Chart                WBS1.2

##                            Key Milestones                WBS 1.2With Distributed Float               

| Milestone | Date |
| --- | --- |
| T2M-3: Contract awarded for production pixel sensors | Nov 9,  2005 |
| T2M-2:  Contract awarded for production pixel readout chips | Jan 24,  2006 |
| T1M-4: Contract awarded for production pixel detector hybridization | Jul 10, 2006 |
| T3M-13: Vacuum System designed & approved for construction | Jul 24, 2007 |
| T3M-14: Final pixel detector assembly started | Oct 12, 2007 |
| T3M-15 Pixel modules completed (assembly & testing) | Apr 11,  2008 |
| T1M-6: Pixel detector tested & ready to be shipped to C0 | May 9,  2009 |

- Need-by Date: August 17, 2009

##                        Pixel Detector Risk Analysis          WBS1.2

| Risks | Mitigation strategy |
| --- | --- |
| Bump bonding vendors not available or have unacceptable yield or throughput  | Identify more vendors. Keep close contact with LHC experiments and have information about their schedule and vendors |
| Cannot achieve the vacuum required due to gas load much bigger than expected and we don’t have enough space for larger pumps or cryopanels | Repeat outgassing test with a model which includes close to final components and full size FTB. Prototype the cryopumps  |
| Pixel temperature control, cooling, and vacuum system do not work as designed. | We have put in our plan a system demonstrator program that will happen early in the construction phase to study this and various failure modes. |

## Responses to CD1 recommendations      WBS1.2

- Develop more conservative schedule with significant more float (> 6 months)
**We have followed their recommendation. By moving a few procurements forward and move back the detector need-by date, we have achieved a float of about 1 year.**
- Evaluating options for relaxing the funding profile constraints to achieve a more conservative approach
**DONE. We have increased the funding for FY05 to move up the production of sensors and speed up the module development.**
- Evaluate schedule and performance impact of staging options
**While we believe that the experiment will work with an efficiency of about 60%  with say 1⁄2 of the pixel stations, to complete the installation of the other half of the pixel detector will lead to a long shutdown, estimated to be about 6 months or longer and with considerable risk to the forward tracking stations (which need to be removed first before the pixel vacuum vessel can be taken out). After careful consideration, we think that it’s better to assign resources to guarantee the completion of the pixel detector on schedule and not pursue the staging option.**

##                 Technical Description of Straw Tracker             WBS1.6

**Straws: chosen because of of small cell size (segmentation)**
**Uses Atlas design as basis**
**0.8% Xo per station**
**Tracking resolution: 150********m/view**
**Momentum resolution better than 1% over full momentum and angle range**

- Momentum resolution

## 1.6.1 - Straw Detectors (7 stations)
the physical Detector.
1.6.2 - Straw Electronics- 
includes front-end electronics, High and Low Voltage power supplies and cables.
1.6.3 - “Other” Mechanical Subsystems
Gas system, temperature control...
1.6.4 - Hardware and Software specific to Straw Detector
Test Stations with database connections
Fast Interlocks and Slow Controls
1.6.5 - Management

- 1.6.1 - Straw Detectors (7 stations)
- the physical Detector.
- 1.6.2 - Straw Electronics-
- includes front-end electronics, High and Low Voltage power supplies and cables.
- 1.6.3 - “Other” Mechanical Subsystems
- Gas system, temperature control...
- 1.6.4 - Hardware and Software specific to Straw Detector
- Test Stations with database connections
- Fast Interlocks and Slow Controls
- 1.6.5 - Management

- Straw Components             WBS 1.6

##                  Straw Detector  –  “half-view”             WBS1.6

- Assembled in groups of 48 straws - Modules

##                        Straw Detector Stations 1 & 2     WBS1.6

- 384 Straws/View
- 1152 Straws/station

- Station #1 U,V HalfView Frame.
- X View is simple rectangular shape

- Station 1 “Prototype” Frame

**                       ****Straw Detector Stations 1 & 2     WBS1.6**

**Notes:**
Station 1 and 2 are inside the magnet pole tips. We can’t simply rotate a square detector and clear the pole tips. This is one concept of how we might build that detector.

##                      Station 7 – View Outer Frame (One VIEW)  WBS1.6

-  Station 7 constructed of super-modules
-  Super-module attached at ends to Outer Frame
-  Outer Frame supports and aligns super-modules
-  Each Outer frame supported individually from above by connecting rods

- Outer frame

##       Straw MOX module – Silicon Support   WBS1.6

- New Straw module designed at Frascati to support the forward Silicon stations.  Replaces the 2 modules in X-view that surround the beam-pipe. Supported independently of Straw station

- Straws are embedded in rohacell so no tension needed to keep them straight. Module has carbon fiber shell.
- Carbon fiber disk is attached for Silicon support

**Notes:**
The micro-strip outer support structure. It is directly integrated in the nearby
X-view straw structure and provides support for the micro-strip stations and the straws
themselves. The central disk and the underlying strut have a radial slot to allow for 
assembly around the beam pipe.

##                     Straw Detector Participants          WBS 1.6

**Fermilab****: ****A.A. Hahn, P. Kasper****, H. Cease, J. Howell, J. Krider, A. Lee, D. Olis, T. Tope, W. Stuermer, C. Serritella, Z.Shi, D. Butler, B. Pritchard, Y. Orlov**
**Frascati:**** ****F. Bellucci,**** ****M. Bertani, L. Benussi, S. Bianco, M. A. Caponero, F. Fabbri, F. Felli, M. Giardoni, G. Mensitieri, A. La Monaca, E. Pace, M. Pallotta, A. Paolozzi, ****B. Ortenzi**
**Southern Methodist University:**** ****T. Coan, ****M. Hosack**
**University of Houston:**** ****K. Lau, B. Mayes, G. Xu****, ****S.Subramania, A. Daniel, M.Ispiryan**
**University of Virginia:**** ****M. Arenton, S. Conetti, B. Cox, A. Ledovskoy,**** ****M.Ronquest, D. Smith, D. Phillips****, H. Powell, W. Stephens **

- Physicist
- Grad Students
- - Technical staff

## Straw Organization                  WBS 1.6

**WBS 1.6**
**A. Hahn**

**1.6.3**Other Mech.SubsytemsD. Olis
- $733k

**1.6.2**Straw Electronics
- W. Stuermer$2.2M

**1.6.1**Straw DetectorsJ. Krider$6.0M

- Base cost: $10.0M (Material:$5.0M, Labor:$5.0M)

**1.6.4**Integration & TestingP.Kasper
- $204k

**1.6.5**ManagementD.Olis ME
- W.Stuermer EE
- J. Krider PE
- $923k

**FNAL Site ****A. Hahn**

**U Houston Site ****K.Lau**

**SMU Site ****T. Coan**

**UVa Site ****B. Cox**

**Frascati Site ****F. Fabbri**

## Straw Tracker Construction Cost         WBS 1.6

## M&S Obligation Profile by Fiscal Year    WBS 1.6

## Labor Profile by Fiscal Year      WBS 1.6

**FY05**

**FY06**

**FY07**

**FY08**

**FY09**

**FTEs**

**0**

**10**

**20**

**FY10**

**14.2**

- 17.9

- 32.9

- 26.0

- 28.6

- 4.2

- 1.3

**30**

## Description of Straw Project Flow       WBS 1.6

## WBS 1.6 Staged Gantt Chart

- installation

## Straw Stations ready for Installation
Critical path is primarily set by funding profile
FY05
Continue Design Work
Frames, Front End Electronics, TDC ASIC....
FY06
Start major procurements
Straws, Twisters, ASDQ’s,...
Start Anode, Straw, and Module Production Sites.
FY07
Start Half View Assembly Sites
Production of Front End Electronics
The current production scheme builds (S3,S4,S1,S2,S5) and (S6, S7) at two parallel Half View production sites.
 The production time scales are set by various assumptions on assembly lines (2/site) and a single shift. These assumptions ( # sites, # assembly lines, # shifts, and order of station production) could be changed.

- Critical path is primarily set by funding profile
- FY05
- Continue Design Work
- Frames, Front End Electronics, TDC ASIC....
- FY06
- Start major procurements
- Straws, Twisters, ASDQ’s,...
- Start Anode, Straw, and Module Production Sites.
- FY07
- Start Half View Assembly Sites
- Production of Front End Electronics
- The current production scheme builds (S3,S4,S1,S2,S5) and (S6, S7) at two parallel Half View production sites.
-  The production time scales are set by various assumptions on assembly lines (2/site) and a single shift. These assumptions ( # sites, # assembly lines, # shifts, and order of station production) could be changed.

- Critical Path Analysis            WBS 1.6

##        Straw Level 3 Milestones + WBS1.6

| WBS1.6 | Forward Straw Tracker | Date |
| --- | --- | --- |
| 1.6.7.4.1 | T3M-38:PO Awarded: Production ASDQ Chips * | October 10, 2005 |
| 1.6.7.4.2 | T3M-39:ASDQ Procurement completed | August 3, 2006 |
| 1.6.7.4.3 | T3M-40:Straw Preparation Site Functional | March 7, 2006 |
| 1.6.7.4.4 | T3M-41: Half-View Production/ Assembly Sites Functional | February 7, 2007 |
| 1.6.7.4.5 | T3M-42: Station 1 ready for Installation * | April 3, 2008 |
| 1.6.7.4.6 | T3M-43: Station 7 ready for Installation | August 26, 2008 |

- * Also a Level 2 Milestone

- + With distributed Float

## Select the straw material, straw diameter, and wire diameter within this year. Clear work plan should be provided.
We will acquire new Copperized Kapton Straws and subject them to radiation tests. We will also test 30 m Anode wire (currently use 25 m wire). We will set up a work plan.
Put Additional Effort into aging test
UH and UVa will test new straw materials (and anodes) and UH, UVa, and SMU have proposal to undertake Rad Damage test at IUCF.
Produce more prototypes (preferentially in all production sites) and test. They should be built with production components and tooling as much as possible
This is consistent with our Station 3 prototype effort
Move up production schedule by ~6 months
DONE
Strengthen management with a project engineer
Production engineer and site managers now added to the org. chart.

**We will acquire new Copperized Kapton Straws and subject them to radiation tests. We will also test 30 ********m Anode wire (currently use 25 ********m wire). We will set up a work plan.**
- Put Additional Effort into aging test
**UH and UVa will test new straw materials (and anodes) and UH, UVa, and SMU have proposal to undertake Rad Damage test at IUCF.**
- Produce more prototypes (preferentially in all production sites) and test. They should be built with production components and tooling as much as possible
**This is consistent with our Station 3 prototype effort**
- Move up production schedule by ~6 months
**DONE**
- Strengthen management with a project engineer
**Production engineer and site managers now added to the org. chart.**

**                ****Responses to CD1 recommendations      WBS1.6**

##                 Technical Description of Silicon Tracker    WBS1.7

**Silicon Strips: simple single sided p****+****/n design (CMS design)**
**7 stations**
**3 in dipole fringe field**
**3 before RICH **
**1 after RICH**
**Coverage from beam pipe to ****±****15.5cm from the beam**
**Each station has 3 planes of 320 ********m thick SMD with 100 ********m pitch**
**Each detector is 7.9 cm x 7.9 cm**
**Four detectors form one ladder with readout at both ends**
**New readout chip (FSSR) using 0.25********m CMOS; 1****st**** prototype tested**
**2****nd**** prototype submission planned for early next year**

## Sensors
Readout Chips
Electronics Packaging & DA
Hybrids, Flex’s, Junction Cards, Power Supplies, Cabling and DCB’s
Mechanics
Inner & Outer Supports 
Cooling
Ladder Assembly
System Integration & Testing
Detector Prototypes & Tests, Control & Monitor, Detector Specific Software

- Sensors
- Readout Chips
- Electronics Packaging & DA
- Hybrids, Flex’s, Junction Cards, Power Supplies, Cabling and DCB’s
- Mechanics
- Inner & Outer Supports
- Cooling
- Ladder Assembly
- System Integration & Testing
- Detector Prototypes & Tests, Control & Monitor, Detector Specific Software

- Silicon Strip Components             WBS 1.7

## Silicon Strip Detector Ladder         WBS1.7

- Sketch of a ladder support and the relative placing
- of silicon strip sensors, hybrid circuit, pig-tail fan-out
- and kapton flex cable.

##                   Silicon Strip Readout Electronics       WBS1.7

**Benefit from CDF RUN IIB experience**

##                Silicon Strip Detector  Half Plane Support   WBS1.7

-                Silicon Strip Detector  Half Plane Support   WBS1.7

**Notes:**
Sketch of the mechanical support of a micro-strip detector half-plane. It consists of a very light 
composite structure made of a sandwich of two thin carbon fiber layers with Rohacell inside. The 
two ladders of the half plane are attached on the opposite sides of this structure, one on front plane, 
the other on the back plane. A cooling duct runs through the structure and reaches the regions 
where the hybrid circuits are located and the heat load is concentrated

##                     Silicon Strip Stations                  WBS1.7

- 3 views:
- X: 0o (horizontal)
- U: 90o + 11.3o
- V: 90o – 11.3o

## Forward Tracker Station Assembly

**Notes:**
Assembly of the micro-strip planes on the outer support structure. The exploded
view shows the regular straw tubes in the proximity of the central gap, the micro-strip 
outer support, which contains the straws to fill the gap, and the two halves of the first 
micro-strip plane to be assembled on the central disk.

##                       Silicon Tracker  Participants      WBS 1.7

- Colorado University:  J.Cumalat, P.Rankin, Eric Erdos
- Fermilab: J. Andresen, G. Cardoso, C. Gingu, J. Hoff, M. Hrycyk, A. Mekkaoui, R. Yarema, J. Andresen, K. Knickerbocker,  A. Dyer
- Frascati: M. Caponero, D. Colonna, A. Paolozzi,  F. Fabbri,  S. Bianco
- Insubria University: P. Ratcliffe,  M. Rovere
- INFN Milano: G. Alimonti, M. Citterio, S. Magni, D. Menasce, L. Moroni, D. Pedrini, S. Sala,  S. Erba, P. D’Angelo, S. Latorre, M.Malatesta
- INFN Pavia: G.E. Cossali, P.F. Manfredi, M. Manghisoni, M. Marengo, L. Ratti, V. Re, M. Santini, V. Speziali , D. Di Pietro, G. Traversi , K. Fisher,  L. D'Angelo

- Physicist
- - Technical staff

## Silicon Tracker Organization             WBS 1.7

- WBS 1.7
- Forward Silicon Tracker
- L2 Manager
**L.Moroni**
- Deputy
**J.Cumalat**

- Sensors
**L3** Manager
**S.Sala**
- 1.7.1

- Electronics
**L3** Manager
**V.Re**
- 1.7.2

- Mechanics
**L3** Manager
**L.Moroni & J.Cumalat**
- 1.7.3

- System Integration & Testing
**L3** Manager
**D.Menasce**
- 1.7.4

- Cooling
**L3** Manager
**E.Cossali**
- 1.7.3.6

- Base cost: $7.5M   (Material: $3.7M, Labor: $3.8M)

##                   Silicon Tracker Construction Cost      WBS1.7

##                M&S Obligation Profile by Fiscal Year    WBS1.7

##                   Labor Profile by Fiscal Year      WBS 1.7

**FY05**

**FY06**

**FY07**

**FY08**

**FY09**

**25**

**FTEs**

**10**

**0**

**5**

**15**

**20**

- 10.4

- 26.7

- 16.8

- 19.4

- 2.2

## Description of Project Flow            WBS 1.7

- Prototyping

- Production

- Critical Path

##                         Gantt Chart for Strip Detector     WBS1.7

## Staged Installation
Stage 1: Stations 1, 2, 6, and 5 in FY09 shutdown
Stage 2: Rest of the stations in FY10 shutdown
The shortest Total Float in the Forward Silicon Strip project is 247 days (for FY09 shutdown)
i.e. any delay up to 12 months can be absorbed by our schedule without impacting the deadline for installation.
Stations that will be installed in FY10 will have a minimum float of 449 days.

- Stage 1: Stations 1, 2, 6, and 5 in FY09 shutdown
- Stage 2: Rest of the stations in FY10 shutdown
- The shortest Total Float in the Forward Silicon Strip project is 247 days (for FY09 shutdown)
- i.e. any delay up to 12 months can be absorbed by our schedule without impacting the deadline for installation.
- Stations that will be installed in FY10 will have a minimum float of 449 days.

-                  Critical Path Analysis            WBS 1.7
-             Without Distributed Float

##             Response to CD-1 Review Recommendations  WBS1.7

- From CD-1 Report:
- The silicon strip tracking detector was **found to be in good shape** at the CD-1 review. The positive news about **INFN funding** makes the schedule for the silicon strip tracker **even more robust. **
- Indeed all the funding constraints were removed from the schedule and the float went from 112 days up to 247 days.
- About 1 year delay can be safely absorbed!

##                    Summary for WBS 1.2, WBS 1.6,  and WBS 1.7              

- _WBS 1.2_
**Overview – D. Christian **
**Sensor & hybridization – S. Kwan**
**Electronics – G. Cardoso**
**Substrate & half-plane assembly – CM Lei**
**Vacuum system – H. Cease**
**Pixel Detector assembly – J. Fast**
**Test beam – C. Newsom**
**Cost and Schedule – S. Kwan**
- _WBS 1.7_
**Overview – L. Moroni **
**Readout chip – V. Re**
**Readout electronics – G. Cardoso**
**FBG sensors for BTeV Tracking Detectors – S. Bianco**
**Cost and Schedule – L. Moroni**

- _WBS 1.6_
**Activities at University of Houston (K.Lau)**
**Module 0X (S. Bianco)**
**Activities at SMU (T.Coan)**
**Activities at UVa (B.Cox)**
**Latest results from Straw Test Beam Run  (A.Ledovskoy)**
**Acoustic Method for Wire Tension Measurement (M. Hosack)**
**BTeV Straw Design and Prototyping Efforts (A.Hahn)**
**Straw Chamber Assembly (Y. Orlov)**
**BTeV Straw Detector Simulations (P.Kasper)**
**Straw Response to Lehman CD1 (A.Hahn)**

- More information on the Pixel (WBS 1.2), Straw (WBS 1.6) and
- Silicon Strip Tracker (WBS 1.7) is available in the breakout sessions.

## Conclusion

- The BTeV tracking system has three elements: Pixel vertex detector, forward silicon tracker, and forward straw detector
- For all three detectors:
- Baseline technical designs exist
- Organization structure established
- Detailed WBS leading to a base cost estimate and resource-loaded schedule for the construction of the baseline detector
- We are  ready to move on to the next phase of the project

## Backup Slides

##                      Pixel Glossary of Terms	                  WBS1.2

- HDI – High Density Interconnect
- PIFC – Pixel Interconnect Flex Cable
- FTB – Feed-through Board
- TPG – Thermal Pyrolytic Graphite
- PGS – Pyrolytic Graphite Sheet
- LN2 – Liquid Nitrogen
- LHe – Liquid Helium

##                 Straw Glossary of Terms            WBS 1.6

- Module : basic construction unit consisting of 48 straws
- Half-Views: Each Straw Station is made of 3 views (X, U, V). Each View is divided into two “Half-Views”, in order to install detector around an existing beam pipe. Each Half-View is an independent working detector.
- ASDQ chip – Amplfier, Shaper, Discriminator and Charge chip; designed by the Upenn group and used in CDF COT
- MOX – Module O (closest to the beam pipe) X view

##                 Silicon Strip Glossary of Terms            WBS 1.7

- FSSR: Fermilab Silicon Strip Readout Chip
- DCB: Data Combiner Board (note: Pixel and silicon strip will use the same type of DCB)
- DA: Data Acquisition
- FBG: Fiber Bragg Grating

##                            Key Milestones                WBS 1.2Without Distributed Float               

| Milestone | Date |
| --- | --- |
| T2M-3: Contract awarded for production pixel sensors | Aug 24,  2005 |
| T2M-2:  Contract awarded for production pixel readout chips | Nov 10, 2005 |
| T1M-4: Contract awarded for production pixel detector hybridization | Mar 21, 2006 |
| T3M-13: Vacuum System designed & approved for construction | May 14, 2007 |
| T3M-14: Final pixel detector assembly started | Mar 27, 2007 |
| T3M-15 Pixel modules completed (assembly & testing) | Nov 1,  2007 |
| T1M-6: Pixel detector tested & ready to be shipped to C0 | Aug 6,  2008 |

- Need-by Date: August 17, 2009
- Total Float: 259 days

## Schedule  Contingtency               WBS1.2

- Schedule contingency
- Placed before key milestones or activities on critical or near critical path
- Nominally zero duration
- Distribute float throughout the duration of the project
- Typically increase duration of activity by 20 to 30%.

## Critical Activities Gantt Chart                                 With Distributed Float                     WBS1.2

##                       Straw Risk Analysis              WBS1.6

| Risk Event | Mitigation |
| --- | --- |
| Major Construction Problems with Half View Production | The best strategy is to have a robust production prototype construction so that we can identify production problems before we actually enter production. A standby strategy is to have backup sites which could contribute to Half-View production once their original function is accomplished. For example, once the Straw Preparation Facility has finished, it could convert to a Half-View Assembly site. |
| Process to produce ASDQ chips is shutdown, by the time our budget profile allows us to place order. | We need to identify a source of funds that allows us to commit to a wafer run as early in the project as possible-while the current wafer process still exists. We could delay the packaging to later in the project timeline, when more funds become available. |

##        Straw Level 2&3 Milestones + WBS1.6

| WBS1.6 | Forward Straw Tracker | Date |
| --- | --- | --- |
| 1.6.7.4.1 | T3M-38:PO Awarded: Production ASDQ Chips * | October 10, 2005 |
| 1.6.7.4.2 | T3M-39:ASDQ Procurement completed | August 3, 2006 |
| 1.6.7.4.3 | T3M-40:Straw Preparation Site Functional | March 7, 2006 |
| 1.6.7.4.4 | T3M-41: Half-View Production/ Assembly Sites Functional | February 7, 2007 |
| 1.6.7.4.5 | T3M-42: Station 1 ready for Installation * | April 3, 2008 |
| 1.6.7.4.6 | T3M-43: Station 7 ready for Installation | June 12, 2008 |

- * Also a Level 2 Milestone

- + without Distributed Float

## Risk Analysis                           WBS 1.7

- Risks
- 0.25m CMOS process disappears before we go into production

- Mitigation
- Work with multiple vendors. Keep in close contact with vendors to understand their future plans.

##                  Key Milestones            WBS 1.7 

-             Without  Distributed Float

| Milestone | Date |
| --- | --- |
| T3M-44 Sensor accepted for full production | Jan 10, 2007 |
| T3M-45: Production sensors received and tested | Oct 18, 2007 |
| T3M-46: Readout IC approved for production | Aug 3, 2006 |
| T3M-48: Production ICs Received tested and thinned | Feb 8, 2007 |
| T3M-49: Hybrids approved for production | Nov 13, 2006 |
| T3M-50: Hybrids complete and tested | Jan 3, 2008 |
| T3M-51: Station support procurement complete | Oct 3, 2008 |
| T3M-52: Ladder production 100% Complete | Jul 8, 2008 |
| T3M-53: First FSIL station ready to be installed in C0 | Aug 27, 2008 |
| T3M-54: Last FSIL station ready to be installed in C0 | Sep 15, 2008 |