# Presentation: 596940

## Luminosity Monitor Progress Report

- A. Ratti
- April 27, 2006

## Introduction

- R&D activities
- Final Design
- Rad hardness tests
- Integration effort
- Budget and schedule

## FDR results

- Excellent review
- Highlighted several areas of possible improvement
- Endorsed basic design
- Recognized progress
- Recommended fast path to production
- Final report not available yet

## Testing at RHIC(H. Matis)

- RHIC run was suddenly restored
- Presented plan at RHIC APAX meeting in November
- Asked for 2 shifts of 3-4 hours each
- Need dedicated collisions
- Now setup in IR10, former PHOBOS area
- While ideal running condition is Au-Au, this run is p-p
- We’ll focus on backgrounds and on establishing operation of the device
- Infinuim scope we can watch from LBL
- Plan to use in parasitic mode while RHIC is running
- Plan to replace with lumi DAQ system

## Mechanical Design(K. Chow, W. Ghiorso)

- Ready for final prints and production
- Performed thermal and stress analysis
- Performed gas flow modeling through the chamber
- Completely revised the housing and fabrication
- Detector nearly identical to the prototype
- Fabrication process defined

## Case is designed to manage stress levels

- Max stress is <16kpsi (<110 MPa)

**K. Chow**

## Gas flow through ionization chamber

**4 gas inlet holes on support plate**

- Detail of ionization chamber without copper bar

- With support plate displaced in beam direction

- Chamber gas flow volume model

**120 holes in ground plane, 1 mm diameter each**

**INLET**

**K. Chow**

## Gas velocity in production chamber

- Darkest blue areas are equivalent to less than 0.017 liter per hour flow

- This face is at a cut plane through center of front gas volume

**K. Chow**

## For comparison: gas velocities in prototype chamber

- inlet

- Darkest blue areas are equivalent to less than 0.017 liter per hour flow

- outlets

- inlet

- outlets

- Prototype ionization chamber showing outline of 1/8 symmetric gas flow model

**K. Chow**

## Analytical calculations of thermal expansion

- Applied a uniform temperature increase of 40 deg C (25 deg C to 65 deg C)
- Differential expansion of copper filler bars to stainless steel case
- 0.0008 inch (0.021 mm)
- Expansion of copper support arm
- 0.013 inch (0.327 mm)

- Differential expansion of Macor ionization chamber housing and copper ground plane (largest dimension)
- 0.0011 inch (0.028 mm)
*All differential expansions are managed with strain relief systems and designed gaps*

- Ionization chamber with end face not shown

**K. Chow**

**Notes:**
Macor CTE = 0.93E-5 per deg C
Copper CTE = 1.64E-5 per deg C
SS304 CTE = 1.73E-5 per deg C
Mycalex1100 CTE = 1.048E-5 per deg C

## Thermal conditions during TAN bakeout

- Bakeout operation
- Heat up the beam tube to 200 deg C in 24 hours.
- Stay at 200 deg C for a minimum of 24 hours
- Ambient cooldown
- Bakeout performed in situ whenever beam tube exposed to atmospheric pressure
- Maximum temperature in absorber box is up to 300 deg C

- Details of the handling plan for LUMI are being formulated
- Analysis will be used to estimate temperature rise in LUMI
- Temperatures in LUMI should be monitored during bakeout (with thermocouples) to determine if it exceeds its allowable temperature
- LUMI should be (partially) pulled out of slot if it may overheat (pullout has radiation exposure implications)

- Temperatures after 20 hours

**FEA results**

- slots

**K. Chow**

## Electrical design(J.F. Beche, M. Monroy)

- Finalized front end and shaper design
- Defined DAQ configuration
- Implementing the DAB board and IBMS mezzaninzes
- System under evaluation at Berkeley
- Calculation shows it meets all lumi requirements
- Grounding scheme defined

## Electrical Connections

- Tri-axial Configuration
- Cable Tray

**PA**

- LUMI (Conformal Coating)

- TAN

- Preamplifier
- Box

- EARTH
- GROUND
- (Tunnel)

- INSTR.
- GROUND

- Shaping
- Amplifier

**SH**

- Isolation
- Amplifier

- EARTH
- GROUND
- (Counting
- Room)

**100K**

- Soft Connection
- (Safety)

- VME System

- “VME”
-  GROUND

## IBMS Mezzanine Board (1)

- Data from IBMS technical specifications document in EDMS (Jean-Jacques SAVIOZ)
- IBMS Mezzanine Board contains:
- Custom ASIC originally developed for the LHCb Preshower detector
- 14-bit digitizer (only 12 used).
- ASIC:
- Dual integrator + T/H circuit
- One integrator operates while other is in reset mode.
- Differential input.

## Shaper Board and DAB64x boards

- Slot0
- CPU

- Coincidence between both sides of IP

- Left side of IP

- Right side of IP

- BOBR
- Timing

## Radiation Damage to passive components

- Damage to passive components is mostly dominated by neutron scattering
- DPAs are a best way to measure the effects of radiation exposure
- While a DPA to first order is a DPA, neutron energy, flux, temperature changes can have a great impact on test results
- If an atom is displaced and quickly recombines, it could be no problem
- If this happens while an enormous amount of heat is dissipated, the material properties could easily change, the atom may not recombine...
- Using the DPA approach, we can use neutrons at several test facilities
- Still important to have relatively high energies

## Testing at CERN

- At the ISOLDE ion source with a 1.4 GeV p beam from CERN PS Booster
- ~10^13 protons per second
- Facility has robotic capabilities
- Have prepared two identical kits
- First kit will be exposed ~3 months
- Second kit will be exposed ~ 9 months
- After irradiation we will perform mechanical testing and metallurgical  investigations of the samples.
- Electrical components are in a bridge configuration for easy electrical measurements
- Setting up a MARS model to calculate DPAs in this configuration and compare with LHC projections

## Setup at ISOLDE’s source

**Our samples are mounted on the wall behind the source**

## Active Components in LUMI

- In general a level of ~100 krad/yr is tolerated by bipolar transistors
- Packaging front end electronics for fast replacement
- Dual channel to overcome random failures
- Recommend replacement after a given integrated dose
- 1-2 years at highest luminosity
- Earlier operation at lower luminosity will allow for a longer time before replacement
- Do we have a choice??

## LUMI Long Term Plans

- FY06
- Fabrication of first article
- Design of auxiliary hardware
- Device tests, electronics integration and performance qualification
- Deliver first unit to CERN - maybe delayed 1-2 months
- FY07
-      Fabricate balance of units and auxiliary hardware
-   Transfer to CERN
-   Installation support
-   Commissioning support
- FY08
- Post-commissioning and pre-operations support

## Integration effort at CERN

- ~8 FTE-months spent at CERN in integration activities
- Two integration meetings in January and March
- Including an integration workshop with all groups instrumenting TAN
- Opening a team account to support local expenses
- Planning more visits to further plans and follow through
- TS/LEA group now responsible to coordinate installation and documentation of TAN instrumentation area
- Generates 3D layout of the area
- Coordinates gas installation activities

## Current Budget

- New resource loaded schedule prepared for the review
- Confirms projections presented last year
- Current spending is ~$325k out of $935k allocated for FY
- Increased burn rate from ~$35k/mo to ~$70k/mo
- Plan to spend allocated FY06 budget
- Build first unit in the summer

## Budget Summary	

- Cost guidelines from task sheets:
- 	FY	04	05	 06             07
- Requested	203	 450   	1187         1143
- Received			 395	 935
- in $k

## Conclusions

- We’re on track to deliver a working system for the beginning of the LHC commissioning
- Schedule is now very tight
- We can no longer afford a delay due to reduced funding
- Very good progress towards the final system
- Successful final design review on April 24
- Key contributions from added group members
- System integration at CERN well underway
- Need to increase the presence at CERN in preparation for installation and commissioning
- (almost) ready for RHIC and Rad-hardness test
- (almost) ready to start final drawings and cutting metal