# Presentation: 087963

## Physics Division Plans

- Engineering Division - Mechanical
- Retreat
- June 26, 2001

## Overview

- Attempt to cover this decade
- ATLAS
- BaBar
- SNAP
- Linear Collider
- Other
- Caveats
- Not a complete look at all Phys. Div. Activities
- Uncertainties grow with time
- Talk reflects my opinions

## ATLAS(1)

- Now - 2006
- Lead role in mechanical structure for ATLAS pixel project
- Deliverables requiring composite structures and close electrical/mechanical integration built at LBNL or under contract to LBNL.
- Fabrication in Bldg. 77s, including(I hope) final assembly/test in new clean room in 77.
- CERN final assembly and installation
- ATLAS pixel upgrades(after initial running)
- Pixel system will be upgraded.
- Lower mass in structures/services is one of the goals. This requires development, starting(if possible) even before first collisions(eg in 2004 onwards) and should continue as long as there are good ideas.
- Production could even start before first collisions in 2006 if ideas are compelling. Need to be ready by 2008/2009.
- LBNL can be leader in this area(if we don’t get worn out building first detector).

## ATLAS(2)

- Major ATLAS upgrades
- LHC luminosity upgrade in long-range plan.
- LHC luminosity above 1034 requires both new ideas and replacement of entire ATLAS tracking system.
- Very likely this would mean expansion of pixel system to larger radii - bigger system - and new and larger silicon strip system.
- This would be very large effort(some hundreds of M$)
- Timescale obviously depends on LHC operation, physics...but installation by 2014 is a reasonable guess. Would require about 5 year development/production time, preceded by R&D(above 1034 is hard).

## ATLAS Pixel Detector

## ATLAS -> ME

- Design and FE modeling of composite structures
- Fabrication of composite structures
- Design validation for ultra-stable structures. Acquisition of TV holography system a significant step in improving LBNL capability. Should expand on this area(environmental chamber, coincident IR thermography, improved computing power,...)
- Optical and touch CMM will continue to be needed.
- Electrical/mechanical integration. This should mean joint modeling of electrical and mechanical properties(not currently done in any systematic way). This also includes the subject of cable design and modeling, custom design and sometimes fabrication of low mass cables.
- Clean room space and fabrication equipment(wire bonders, plasma cleaning, glue robots, ....)
- Innovations in stable, low mass structures and power, signal and cooling integration will be key to future involvement.

## BaBar(1)

- Middle 2002
- Remove the SVT so PEPII can have access to the beam pipe for modifications. Only moderate rework of the SVT.
- Need from engineering mechanical technician  and electrical coordinator help.
- Electrical coordinator a few man months from now to June 2002.  Full time for one man month June 2002.
-  Mechanical technician 20% now to Jan 2002.  Full time Jan to Aug. 2002.
- Middle 2004
- Remove the SVT bring to LBNL for refurbishing.  Manpower similar to above with the addition of two full time mechanical technicians for three months during the rework at LBNL
- In addition need to share the clean room in 77(assuming it exists).
- (Note may not have Fred Goozen at this time as he may retire.)

## BaBar(2)

- 2005+
- BaBar and PEPII upgrade path not entirely clear but increased luminosity will be key => replace SVT(radiation damage)
- LBNL would be natural location for design, fabrication, integration as before - lead role
- Need both design and technical support. Composite structures, electrical/mechanical integration,.....
- Even later - new machine(1036)?
- Silicon based detectors - larger scale, new techniques.
- Starts to look like hadron collider, but low mass structure even more important.

## BaBar -> ME

- Immediate(and critical) need over next few years is for technical support familiar with silicon systems or to become rapidly familiar with silicon systems.
- If warranted by physics need,  by mid-decade, LBNL would be natural site to lead replacement of SVT. This would require design, fabrication facilities, technical support....at least similar, probably larger, scale to existing SVT.

## SNAP(1)

- SNAP and related instrumentation
- CCD instrumentation, packaging and use
- SNAP project development
- Active projects
- Package development for backside illumination
- Molybdenum fabrication
- Alignment mechanism
- Glue/epoxy research
- Glue/epoxy application techniques
- SNAP-specific implementation of LBNL chicken feeder dewar
- Package existing devices to deliver to NOAO, SNIFS, ESI, ....
- 3D conceptual modeling

## SNAP(2)

- Near term projects
- Mechanical/thermal model of assemblies
- Measure material properties to feed model
- Performance measurements of prototypes to validate model
- Scale up the model to the full detector
- Incorporate test dewars into optical test system
- Build small focal plane containing 4 to 8 CCDs to use in a ground-based telescope.
- 3D conceptual modeling

## SNAP(3)

- Longer term
- Mass production
- CCD assembly parts
- CCD mechanical assembly
- Cryostats for mass production of CCDs
- Focal plane
- Base plate design and fabrication - no longer a flat plate, rather, it is highly faceted.
- Probable that we will have to design the shutter mechanism.
- Focal plane base plate attachment to passive cooling radiator
- Particle/thermal/light shield cone design.
- Mounting system for focal plane and shield
- Modeling of thermal/mechanical performance
- Integration and testing
- Test chamber (150 K)
- Mechanical survey of CCDs.
- Operational testing of entire CCD array.
**NB, integration of instruments with spacecraft is scheduled for mid-07**

## 3D conceptual modeling

## GigaCam Assembly

**Heat**
**Radiator**

**Particle/thermal/light**
**shield**

**CCDs**

**Base plates**

**Support**
**plate**

## Mosaic Packaging

**“****Plug and play”**
**Precision CCD modules, precision baseplate, and adequate clearances designed in.**
**Focal plane tolerance is ********25 ********m.**
**Final assembly can be *****xyz***** surveyed cold.**

**150 K plate attached**
**to space radiator.**

**Cable**

**Recent development, focal plane will now be curved requiring a faceted base plate.**

## CCD Packaging

**Support CCD**
**Connection to cold plate**
**Four-side abuttabe for dense mosaic.**
**Built-in mechanical precision – no shimming.**
**Access to bonding pads**
**Local electronics**
**Cable connector**
**Low mechanical stress in silicon from -150 C to +150 C.**
**Low background radiation materials**
**Low chemical reactivity with silicon**

**Prototypes are being assembled with dummy silicon that includes all steps including wire bonding.**
**Want to deliver functional packages to telescopes by the end of summer.**

## Cosmology/SNAP -> ME

## Linear Collider

- Linear Collider will likely be next focus of world-wide, accelerator-based HEP, following LHC.
- Location not known. Timescale for completion uncertain.
- LBNL detector development
- TPC improvements and related studies
- CCD vertex detector
- TPC
- Readout/gas studies
- Reduce structural mass(composites?)
- Integration of electronics(eg. in 0.25 micron processes) on endplanes -> electrical/mechanical issues, including reduced mass
- CCD
- Utilize SNAP “rad-hard” CCD technology
- Vertex detector similar to one built for SLD

## Other

- Cosmic Microwave Background instrumentation
- Effort to utilize “large-scale” HEP techniques for CMD instruments
- Cryogenic systems, superconducting detectors
- Underground laboratory
- Effort to push for US underground laboratory for dark matter searches, next generation solar neutrino experiments, detector for neutrino oscillation experiments from accelerator beams
- Cryogenic detectors, big detectors(large mass needed), low background...
- Neutrino beams/muon storage ring
- Big neutrino detectors. Need innovations...
- Astrophysical neutrinos
- ICECUBE.

## Implications

- Diverse effort, hard to give common theme
- ATLAS, BaBar, SNAP, LC possible commonalities
- Clean space.
- “Silicon” fabrication equipment
- FE structural/thermal modeling, verification via TVH, CMMs, IR
- Composite structures
- Combined electrical/mechanical design,modeling
- Other potential experiments have additional needs