# Presentation: 354400

## 2x2 module & stave layouts

## 2 options

- “Small chip”
- “Big chip”
- Boundary between “small” and “big” is determined by the 6” sensor wafer layout that must be compatible with bump bonding (will become clear later)
-  “Small” chip has also a more natural number of rows & columns, but this is probably a minor issue for chip design.

## Parameters

|  | # cols total | # rows total | # ganged rows | # long cols | Long col width |
| --- | --- | --- | --- | --- | --- |
| Small chip | 64 | 324 | 0 | 0 | 0 |
| Small 2x2 tile | 128 | 654 | 6 | 4 | 450um |
| Small active edge 
1x1  tile | 64 | 324 | 0 | 2 | 450um |
| big chip | 70 | 348 | 0 | 0 | 0 |
| big 2x2 tile | 140 | 702 | 6 | 4 | 450um |
| big active edge 
1x1  tile | 70 | 348 | 0 | 2 | 450um |

- Normal col. width x row height = 250um x 50um

## “Small” 4-chip module

- 34.8

- 34.8

- 37.5

- Active 32.8 x 32.8

- 10.0

- 15.0

- Flex pigtail (connector plugs into page)

- Pixel orientation

- Flex down to chip w-bonds

- 0.2

- (vertical inter-chip gap 0.1mm)

## “Big” 4-chip module

- 37.1

- 37.8

- 39.9

- Active 35.8 x 35.1

- 10.0

- 15.0

- Flex pigtail (connector plugs into page)

- Pixel orientation

- Flex down to chip w-bonds

- 0.2

- (vertical inter-chip gap 0.1mm)

## Loaded module

- 20 position connector would be used. Replace 10.22 dimension by 6.52

- glue

- chips

- sensor

- flex

- connector

- Reduced scale

- 1.0 mm

- stiffener

## “Small” module outer stave

- ...

- End of stave card serving 8 modules (half a stave) along Z
- Can serve one face only (top or bottom) => 4 cards per stave
- Or can be a wrap-around end of stave card and serve both faces => 2 cards per stave.
- This way identical staves (including bus cable) design can be used over a wide radial range:
- 4 cards/stave at lower radius and 2 wrap-around cards per stave at higher radius

- 34.8

- 26.8

- Module on back

- 986mm

- 38.4

## “Big” module outer stave

- ...

- End of stave card serving 7 modules (half a stave) along Z
- 		(or 8 modules for 1082mm active length)
- Can serve one face only (top or bottom) => 4 cards per stave
- Or can be a wrap-around end of stave card and serve both faces => 2 cards per stave.
- This way identical staves (including bus cable) design can be used over a wide radial range:
- 4 cards/stave at lower radius and 2 wrap-around cards per stave at higher radius

- 37.8

- 29.8

- Module on back

- 946mm

- 39.9

## “Small” sensor 6 inch wafer

- Active area = 7508 mm^2
- Sensor tiles shown with darker line
- Wafer scale flip chip compatible. Chips shown with lighter line.
- The name “small” 2x2 tile comes from the wafer layout.
- A slightly larger chip and therefore larger 2x2 tile is possible, but only 6 such “large” 2x2 tiles will fit on a 6” wafer.

## “Big” sensor 6 inch wafer

- Active area = 7539 mm^2
- Sensor tiles shown with darker line
- Wafer scale flip chip compatible. Chips shown with lighter line.
- OPTION to make 4 6-chip modules per wafer instead of 6 4-chip modules.

## “Small” single chip module

- Using same chip as 4-chip module (hence “small”)
- Active edge sensor
- 2-side abuttable format

- 16.4

- 16.2

- 16.2

- 18.7

- active

## “Big” single chip module

- Using same chip as 4-chip module (hence “small”)
- Active edge sensor
- 2-side abuttable format

- 17.9

- 17.7

- 17.4

- 19.9

- active