# Presentation: 492752

## Forward Vertex DetectorCost, Schedule, and Management Plan

-  Participating Institutions
-  Organizational plan
-  Cost Basis
-  R&D Costs
-  Cost
-  Schedule

## Participating and Interested Institutions

- LANL coordinate work to procure the silicon sensors, work with FNAL on the development of the PHX chip, with Columbia on development of the interface to PHENIX DAQ, and on the simulation effort with NMSU.   Los Alamos is currently leading the mechanical engineering and the integration effort for the barrel detector, VTX, and will continue those efforts for the FVTX.
- Columbia University
- Columbia University is an acknowledged expert on the PHENIX DAQ system  They will work on the interface between the PHX chip and the PHENIX DAQ.
- Iowa State University
- Iowa State University is currently working on management details with the barrel detector and working on an (funded) SBIR effort for the level one trigger capabilities of the FVTX.
- Charles University, Czech Technical University, Institute of Physics, Academy of Sciences,  Prague
- The Czech groups have been active in the development, testing, assembly, and commissioning of the ATLAS pixel sensors.   They will do the same for the FVTX effort and additionally participate in software development.
- New Mexico State University
- NMSU will work on comprehensive simulations for the FVTX effort and work on the sensor testing.
- University of New Mexico
- UNM has experience in testing, Q/A and a laboratory for characterization of sensors.  They are currently working on the barrel strip sensors and will do the same for the FVTX effort.  They may also work on the flex cables.
- Ecole Polytechnique, Saclay
- Ecole Polytech has contributed to the electronics and software for the muon system has expressed interest in doing the same for the FVTX.  Saclay will work on software.

- Participating and Interested Institutions

## Participating and Interested Institutions

- The Yonsei group has worked on electronics and software for the muon system and will do the same for the FVTX.
- Argonne National Laboratory
- Argonne National Laboratory is not a member of PHENIX but is considering joining to work on the spin physics program and the FVTX.  We will want them to manage and coordinate all activities at FNAL.

## Organizational Chart

## Cost Basis - Major Items 

- Mechanical structures – HYTEC estimate based on prior experience
- Sensors – Quotes from ON Semiconductor and CIS, Nov 2005
- PHX – FNAL estimate based on prior experience
- Electronics Interface – estimate based on prior experience with 		        Muon system
- Bump Bonding – BTev experience with pixel chip
- DCM,slow controls, etc – Muon system experience

## R&D Costs

- LANL LDRD-DR - $310k
-  _$1.2M/year for 3 years (FTE’s and M&S)_
-  Interface Module - $200k
-  Mechanics - $50k
-  HDI and flex cables $60k
- LANL Heavy Ion Program - $50k
-  Sensor design - $50k
- BNL	R&D funds - $495k
-  PHX design and Prototype  - $440k
-  Mechanics  -  $55k

## Contingency – Risk Analysis

| Risk Factor | Technical | Cost | Schedule | Design |
| --- | --- | --- | --- | --- |
| 0 | Not used | Not used | Not used | Detail design > 50% done |
| 1 | Existing design and off-the-shelf H/W | Off-the-shelf or catalog item | Not used | Not used |
| 2 | Minor modifications to an existing design | Vendor quote from  established drawings | No schedule impact on any other item | Not used |
| 3 | Extensive modifications to an existing design | Vendor quote with some design sketches | Not used | Not used |
| 4 | New design; nothing exotic | In-house estimate based on previous similar experience | Delays completion of non-critical subsystem item | Preliminary design >50% done; some analysis done |
| 6 | New design; different from established designs or existing technology | In-house estimate for item with minimal experience but related to existing capabilities | Not used | Not used |
| 8 | New design; requires some R&D but does not advance the state-of-the-art | In-house estimate for item with minimal experience and minimal in-house capability | Delays completion of critical path subsystem item | Conceptual design phase; some drawings; many sketches |
| 10 | New design of new technology; advances state-of-the-art | Top-down estimate from analogous programs | Not used | Not used |
| 15 | New design; well beyond current state-of-the-art | Engineering judgment | Not used | Concept only |

## FVTX Cost Estimate

## HYTEC Cost Estimate – VTX and FVTX

- FVTX

## Sensor Needs:

- FVTX Types 1 & 2 Silicon Wafer Layout

- Type 1	    192 ea
- Type 2        96 ea
- Wafer needs:
- 96 x 1.2/.6 = 192
- Cost:  $240k

## Sensor Needs:

- FVTX Type 3 Silicon Wafer Layout

- Type 3		384 ea
- Wafer Needs:
- 77 wafers x 1.2/.6  = 154
- Cost:		$192.5k

## FVTX Schedule Assumptions

-  Construction start – October 1, 2007 ( FY08)
-  LANL R&D start - January 2006
-  BNL R&D start – January 2006

## FVTX Schedule

## FVTX Schedule

## Summary

-  No exotic or state-of-the-art R&D necessary
-  LANL LDRD funds very important with BNL R&D funds
-  Will design bus and flex cables with conventional, widely   available line width
-  Bump bonding within existing industry standards
-  Management Plan is taking shape
-  Cost Basis is maturing
-  Construction Schedule points to FY 2011 as data run