# Presentation: 876262

## L0 Module Testing and Analog Cable

- What we built so far:
- No.3 First prototype with SVX4 (L1 hybrid)
- No.4 with irradiated sensor
- _No.5 Installed on the support structure_
- No.6 has 10 chip hybrid with two sensor – very good for systematic comparison in the cable and spacer studies.
- No.7 First prototype with L0 hybrid (with cut sensor)
- No.8 in progress (L0 hybrid with new chip and un-cut sensor)
- No.9 in progress (ditto)
***Characterization of single module is in good shape.***

- 4 or 10 chip hybrid

- L0 hybrid

## No.7 module with L0 hybrid

## Goal – L0 module

- Simultaneous read out of multiple modules on the support structure.
- No. 8 and 9 will go to the structure  B-sector because of the wider sensor.
- Two for A-sector, two for B-sector would be the ideal                     should we build two more for A-sector? But the cut sensor is not happy so far.
- Is it impossible to use the un-cut sensor for A-sector???
- Question: can we use the prototype hybrid support by UW???

## Goal – Analog Cable 

- Finalizing the analog cable design.
- >500 m space under the bottom cable.                                             Is there such thick Kapton?  foam material suggested by Jim.
- We still don’t understand the reason why we don’t see the non dependence of noise on the spacer                                                     I propose to have ~140 m thick spacer between each cable. (The original plan was 200 m thickness, but the effective dielectric constant can be lowered.)
- Electrically pre-laminated cable seems to be OK.                             we need to choose the solution.

## Spacer prototype

## Pre-laminated or not – Analog Cable

- Dyconex wants to (probably) use a 3M adhesive film (APAS 1592 ?) specially designed for adhering stiffener to flex circuits
- Liner: polyester, adhesive film contains polyolefin
- Radiation hardness is very questionable
- epoxy based adhesive would be much better in that respect
- company is not very keen to do this lamination job and a technical support/help from us (U Zurich) would probably become necessary
- prototype work on cable assembly at Sidet has made very good progress and there is no reason not to believe that it can be done very well at Sidet

- Quoted from Frank’s slide

## assembly at Dyconex would probably make only sense if they also produce the spacer (Kapton meshes)
we know that Compunetics is able to do nice kapton meshes with minimal material at very low cost
having in mind the costs for the few Dyconex Kapton meshes (the ones with the holes) we ordered, it seems unlikely that they will even come close to Compunetics’ price  

Consequence: Spacer from Compunetics.               Dyconex for only single cables (no lamination).
We are very close to finalize the analog cable design.

- we know that Compunetics is able to do nice kapton meshes with minimal material at very low cost
- having in mind the costs for the few Dyconex Kapton meshes (the ones with the holes) we ordered, it seems unlikely that they will even come close to Compunetics’ price
- Consequence: Spacer from Compunetics.               Dyconex for only single cables (no lamination).
- We are very close to finalize the analog cable design.

- Pre-laminated or not – Analog Cable

## Issues on Spacer

- The shape follows the analog cable. Only the difference is the length.
- The location, or how it should be glued on the cables.

- sensor

- ceramic spacer for bonding

- analog cable

- mesh spacer

- glue applied