# Presentation: 034321

## NASA Workmanship Standards Technical Committee Meeting

- July 21-23, 1998
- Stennis Space Center

## Over the last several years, the traditional role of the NASA Workmanship Standards Technical Committee has been structured as:

- Workmanship Standards Training

- Workmanship Standards Support and Maintenance

- Initiate or revise standards as appropriate based on needs of NASA community

- Respond to OMB Circular A119 by identifying  Non-Government  Standards that can replace existing NASA standards without compromising hardware reliability

- NASA Workmanship Standards Technical Committee Meeting, 7/21-23/98, at SSC

## Looking into the future, the NASA Workmanship Standards Technical Committee will reach out to the electronic manufacturing community (within and outside of the NASA supplier network) by providing a source of information for correcting problems encountered during hardware manufacture and/or use.

- The functional layout will now be:

- Workmanship Standards Training

- Workmanship Standards Support and Maintenance

- Initiate or revise standards as appropriate based on needs of NASA community

- Respond to OMB Circular A119 by identifying  Non-Government  Standards that can replace existing NASA standards without compromising hardware reliability

- NASA Manufacturing Technology Transfer Center

- Information/Technology Transfer

- Gather, and make available on the www, hardware repair techniques developed by various NASA organizations

- Research available non-destructive evaluation processes for emerging technologies and make conclusions/recommendations available on the www

- Research emerging part packaging or hardware manufacturing  technologies for reliability of finished product and make conclusions/recommendations available on the www

- Traditional

- Web Based

- NASA Workmanship Standards Technical Committee Meeting, 7/21-23/98, at SSC

## Workmanship Standards Support and Maintenance

- Initiate or revise standards as appropriate based on needs of NASA community

- Respond to OMB Circular A119 by identifying  Non-Government  Standards (NGS) that can replace existing NASA standards without compromising hardware reliability

- Traditional

- Web Based

- Traditional courses for NASA standards will
- continue at GSFC & JPL.  The theory portion of each class will be extracted from the student workbook and set up as a web based prerequisite.  Web based training could also be used retrain inspectors.

- The reality here is that we have probably generated our last
- new workmanship standard (fiber optics).  3J-1 and 3M will
- be reformatted and reissued as NASA-STD-8739.1&.2
- respectively.  Other revisions will be considered individually
- based on input from Standard Improvement Forms (there is one
- submitted against 3L).

- Participation continues on IPC & ESD
- committees.  Goal is to eventually
- replace all of our workmanship standards
- with NGS’s that the TC has reviewed
- and identified as suitable replacements.

- NASA Workmanship Standards Technical Committee Meeting, 7/21-23/98, at SSC

## Information/Technology Transfer

- Gather, and make available on the www, hardware repair techniques developed by various NASA organizations

- Research available non-destructive evaluation processes for emerging technologies and make conclusions/ recommendations available on the www.

- Research emerging part packaging or hardware manufacturing  technologies for reliability of finished product and make conclusions/recommendations available on the www

- Maintained in collaboration with the
- MSFC/PDI web site.

- NASA Workmanship Standards Technical Committee Meeting, 7/21-23/98, at SSC

## WHAT - There are emerging technologies (such as BGA) where visual inspection of the finished product will not be possible.  Techniques using laminar x-ray or acoustics are evolving, however they are expensive and/or not yet readily available to the industry.

- WHAT - There are emerging technologies (such as BGA) where visual inspection of the finished product will not be possible.  Techniques using laminar x-ray or acoustics are evolving, however they are expensive and/or not yet readily available to the industry.
- WHY - Product verification, based on control over processes and verified using techniques such as those referred to above, becomes increasingly important as part package styles become denser and access for inspection becomes impossible.
- HOW - As new techniques are developed at the various NASA Centers, they should be communicated to the TC and posted in the web site  to make them available for consideration by other organizations.

- NASA Workmanship Standards Technical Committee Meeting, 7/21-23/98, at SSC

## WHAT - Emerging part package styles such as Ball Grid Array, Flip Chip, Chip-on-Board, are increasingly getting designers’ attention because of their ability (usually) to compress large amounts of circuitry into smaller and smaller packages.

- WHAT - Emerging part package styles such as Ball Grid Array, Flip Chip, Chip-on-Board, are increasingly getting designers’ attention because of their ability (usually) to compress large amounts of circuitry into smaller and smaller packages.
- WHY - Several of these technologies come with certain disadvantages.  A good example is in BGA...the pads near the corners of the package undergo unusual stresses and the thermal profile can vary significantly in different areas under the part body during solder reflow.  This web site will try to ensure those who intend to use the technology understand the advantages and disadvantages of using it.
- HOW - Testing and/or data collection from existing projects will attempt to provide visitors to the web site with suggested techniques to make implementation of these newer technologies reliable in a space environment.

- NASA Workmanship Standards Technical Committee Meeting, 7/21-23/98, at SSC

## WHAT - NASA is on the leading edge of unique applications of technology encompassing electronics and materials technology.  Because of this, NASA is also a leader in developing unique repair processes.

- WHAT - NASA is on the leading edge of unique applications of technology encompassing electronics and materials technology.  Because of this, NASA is also a leader in developing unique repair processes.
- WHY:
- HOW - In addition to providing the necessary knowledge to resolve problems, the web site will include possible causes and suggestions for how to avoid the problem in future projects.

- 1) Because of the increasing use of unique designs and materials, repair processes must be developed carefully so that necessary hardware reliability levels are not compromised.
- 2) It’s not unusual for different organizations in NASA to unknowingly be working on similar experiments or technologies.  This web site can help get these organizations in touch with each other for the combined improvement of the entire process (their specific needs, and our goal of transferring the technology to whoever needs it).
- 3)  There are no easily accessible sources that provide this kind of information throughout the community.

- NASA Workmanship Standards Technical Committee Meeting, 7/21-23/98, at SSC

## Single Process Initiative (SPI)

- What standard(s) to use and not use???
- 	ANSI/J-STD-001B  or  IPC-A-610  or  Supplier Developed Procedures  or...
- Most SPI requests only address soldering.
- 	What about cabling?coating?ESD?
- How to ensure reliability to the projects who follow our advice?

- NASA Workmanship Standards Technical Committee Meeting, 7/21-23/98, at SSC

## Status of NASA Workmanship Standards NASA Technical Standards 8739 series

- NASA-STD-8739.3; Soldered Electrical Connections - current NASA hand soldering standard.  NASA TC has membership on IPC soldering committee for potential replacement.
- NASA-STD-8739.4; Crimping, Interconnecting Cables, Harness, and Wiring - current NASA cabling standard.  IPC recently surveyed its membership on the need for an IPC cabling standard.
- NASA-STD-8739.5; Fiber Optic Terminations, Cable Assemblies, and Installation - current NASA fiber optics standard.  No recent inquiries regarding an equivalent NGS.
- NASA-STD-8739.7; Electrostatic Discharge Control - current NASA ESD control standard.  Electrostatic Discharge Association NGS for ESD control is in final draft and could be released this winter.
- NAS 5300.4(3J-1); Workmanship Standard for Staking and Conformal Coating of Printed Wiring Boards and Electronic Assemblies - current NASA poly standard.  Will be reissued in fy99 as NASA-STD-8739.1.  There is no currently recognized high reliability NGS for polymer applications.
- NAS 5300.4(3M); Workmanship Standard for Surface Mount Technology - current NASA SMT standard.  Will be reissued in fy99 as NASA-STD-8739.2.  Is included in considerations regarding IPC J-STD-001.

- NASA Workmanship Standards Technical Committee Meeting, 7/21-23/98, at SSC

## http://www.hq.nasa.gov/office/codeq/qdoc.pdf

- NASA Standards NASA-STD-8739.3, .4, .5, and .7 are available electronically in PDF format at the NASA Headquarters Code Q web site at the address shown above.
- NASA Standards NAS 5300.4(3J-1) and (3M) will not be available electronically until after they are converted to NASA-STD-8739.* (planned as an early fy99 objective)

## (

- IPC-6011 & IPC-6012; used together form NASA’s current requirements for printed wiring boards.  There is a draft revision A to IPC-6012 just announced last month.  It has been requested for review...any reliability issues will be distributed to the TC for comment.  GSFC procurement specification S312-P-003B remains available as a supplement.
- IPC-2221 & IPC-2222 were recently released (2/98) to replace IPC-D-275.  Used together they form NASA’s current design requirements for printed wiring assemblies.

- NGS = VCS

- Non Government Standard  =  Voluntary Consensus Standard

- )

- NASA Workmanship Standards Technical Committee Meeting, 7/21-23/98, at SSC

## }

- Institute for Interconnecting and Packaging Electronic Circuits (IPC)

- ANSI/J-STD-001B Soldering Standard Task Group (5-22a)
- ANSI/J-STD-001B Training - Generic Program Task Group (5-22b)
- ANSI/J-STD-001B Training - Voluntary Certification Program Task Group (5-22bT)
- ANSI/J-STD-001B Handbook for Soldering Task Group (5-22f)
- Low Residue Soldering Process Technology Task Group (5-22d)
- Solvent Cleaning Task Group (5-31a)
- Cleaning Handbook Task Group (5-31d)

- Electrostatic Discharge Association

- WIP-2020; 1686 Conversion Committee

- C
- U
- R
- R
- E
- N
- T

- The IPC is strongly considering a cabling/harnessing document.
- Polymerics at our level continues to be evasive.
- Fiber optics standard still too new to have a clear picture of what’s out there

- Future partners needed:

- NASA Workmanship Standards Technical Committee Meeting, 7/21-23/98, at SSC