# Presentation: 468446

## Bolek Wyslouch
using transparencies by
 Gerrit Van Nieuwenhuizen and Heinz Pernegger

- using transparencies by
-  Gerrit Van Nieuwenhuizen and Heinz Pernegger

- Phobos Spectrometer “Arm One”

- 2nd Arm Review
- MIT, 1st of June 2000

- 6/1/2000

## Installing Arm 1

- 6/1/2000

## Assembled Arm 1

- 6/1/2000

## 9 Spectrometer Modules

**MOD1**

**MOD2**

**MOD6**

**M4T5**

**M5T5**

**M5T4**

**M4T4**

**M7T3**

**M7T2**

- 6/1/2000

## 5 Spectrometer Sensors

- 8 sensors  x  1536 ch.

- 18 sensors  x  500 ch.

- 21 sensors  x  256 ch.

- 28 sensors  x  512 ch.

- 66 sensors  x  256 ch

- 57896 channels/arm

**Type 1**

**Type 2**

**Type 3**

**Type 4**

**Type 5**

- 6/1/2000

## Sensor Production and R&D

- Miracle Techn. Co.

- NCU

- R

- R

- R

- R

- 6/1/2000

## Sensor Testing at 

- Sensor Testing at

**Clean Rooms**

**Probe Stations**

**Inspection stations**

- 6/1/2000

## Silicon Pad Sensor Technology

- Double Metal,
- Single sided,
- AC coupled,
- Polysilicon biased

- metal 1

- metal 2

- p+ Implant

- n+

- Polysilicon
- Drain Resistor

- bias bus

- signal lines

- vias

- 300um 5000kOhm nSi

- 0.2um ONO

- 1.2um ONO

- Thin ONO

- Thick ONO

- PN junction

- Polysilicon

- TestKeys

- 6/1/2000

## Sensor Testing

**Capacitance Scan**

**Pinhole Scan**

- Automatic
-   Probing

**Full Depletion Voltage**

- PN Testkey

- Log(bias)

- Log(Capacitance)

- Channel Number

- Channel Number

- 69 Volt

- 6/1/2000

## Information Management

- SensorTests

- Assembly

- ModuleTests

- 6/1/2000

## Statistics and Fractional Yields 1

**Full Depletion Voltage [V]**

**Leakage Current [uA]**

**PolySilicon Resistance [Mohm]**

**95%**

**85%**

**95%**

**Operational Range [V]**

**80%**

- 6/1/2000

## Statistics and Fractional Yields 2

**Non Func. Channels [%]**

**79%**

**Broken**** Signal Lines [%]**

**Shorted ****Channels**** [%]**

**Shorted ****Coupling**** Cap [%]**

**82%**

**98%**

**97%**

- 6/1/2000

## Placeholder

- 6/1/2000

## Spectrometer Sensor Yields

**(59 batches)**

- Miracle Techn. Co.

**Sensors**

**Sensors Tested**

- 262/427=62%

**984**

**573**

**262**

**Sensors**

**Sensors**

**427**

- 6/1/2000

## Parts
Silicon
Preamplifier chips (commercial)
Ceramic Hybrids (MIT electronics facility, EF)

Gluing (HIG & EF)
Bonding (EF)
Testing (HIG, some EF)

- Silicon
- Preamplifier chips (commercial)
- Ceramic Hybrids (MIT electronics facility, EF)
- Gluing (HIG & EF)
- Bonding (EF)
- Testing (HIG, some EF)

- Module Assembly

- 6/1/2000

## Overview of Assembly and Test

- Test of
- - VA chips
- - flex cables
- - hybrids

- SMD/conn  to hybrid

- Chip to
- hybrid

- Hybrid
- bonding

- Test of MS

- MS rework

- Sensor
- pool

- Module
- gluing

- Module
- bonding

- (fast) Module
- function test

**Module**
**SOURCE  test**

**Module**
**calibration**

**SURVEY**
**measurement**

- Module
- rework

-  backpl.
- contact

**Mounting on frames**

- 6/1/2000

## A summary of  Module Tests

- Calibration test
- verify basic functionality
- determine the gain of the module
- find dead or substandard channels
- Acceptance criteria = less than 5% dead channels
- dead = gain less than 80% of normal gain
- noisy = noise larger than 3 times average noise

- Test with 90Sr source:
- verify sensor function
- verify signal
- measure signal/noise distribution
- Acceptance criteria = peak signal/noise > 10

- 6/1/2000

## Our Modules MOD2 (2 installed)~2000 channels

- Substandard ch. 	percentage/module    peak S/N

- Our Modules MOD2 (2 installed)~2000 channels

- 6/1/2000

## The module peak signal-to-noise

- All modules S/N better than 10
- Average S/N = 16:1

- 6/1/2000

## The number of defect channels(mainly pinholes, very few broken lines or bonding shorts)

- In All modules: broken channels better than 5%
- Average number of substandard channels = 1%

- %

- The number of defect channels(mainly pinholes, very few broken lines or bonding shorts)

- 6/1/2000

## Placeholder

- 6/1/2000

## Conclusions

- The quality of produced modules is excellent
- For 2nd Arm:
- All the testing and assembly procedures are well tried and exercised
- Equipment is all in place
- Experienced people are available to do the work and consult

- 6/1/2000