# Presentation: 860138

## How do D0 and CDF compare?

-                                     Alice Bean  (D0)
-                                     Univ of Kansas/Fermilab
- 	1. Designs
- 	2. M&S Costs
- 	3. Labor
- 	4. Schedule
- Thanks to CDF for help!

## Comments

- 1. Have tried to compare similar things, this may not be completely valid.
- 2.  Both Collaborations would like a chance to justify their current costs to the committee.
- 3. Both groups have leaders at Sidet that talk to each other every day!  There is more collaboration between collaborations than one might think.

## 1.  Designs

- Biggest difference in the detectors is how they handle L1:
-    * CDF uses 6 staves as part of outer barrel,
-    * D0 separate infrastructure
- CDF can’t split in z - must span support on ISL in z to 1m

## Design  - L0

- CDF and D0 designs are quite similar,
- The major difference is that CDF gangs together 2 sensors in z by wirebonding
- 	Sensors:  144 with same size and pitch
-               	Analog Cables connect sensors to hybrids
-                           CDF needs 144,  D0 needs 288
- 	Hybrids - each has a 2 chip hybrid
-                           CDF needs 72, D0 needs 144
- Beampipe Flange:
-                CDF>D0
-                L0 radius CDF>D0
- Mechanical designs:
-              CDF uses Fermilab Engineering
-              D0 uses Univ. of Washington Engineering

## Design  - Sensors

- Both use only single sided sensors
- All sensors have intermediate strips
- The thickness is 320m
- Each has 3 types of sensors
- 	CDF:   L0, Outer Axial, Outer Stereo
- 	D0:      L0, L1, Outer Axial

- Comparison of Outer Axial Sensors

## Design  - Readout

- CDF and D0 both use the SVX4 chip,
- 	CDF uses it in deadtimeless mode,
- 	D0 uses the chip in SVX2 mode
-    so the downstream DAQ is different.
- Outer Layer Hybrids:
- 	CDF uses one-ended hybrids
- 	D0 uses double-ended hybrids
- Stave Readout Digital Cable:
-             CDF wirebonds hybrid to cable on stave core
-                D0 uses connector on hybrid, cable on top of stave
- Outside of active region:
- 	CDF
- miniport card  junction card  junction port card FTM
-                D0
-    junction card  adapter card interface board

## 2. M&S Costs

- Reported costs without contingency which include all funding sources

## M&S Costs-comp

- To make 2 projects look alike:
- 	CDF: take out SVT & ind. costs    $567K
- 	D0: take out admin. and labor        $894K

## M&S Costs - Sensors

- Both assume 20% spares and 30% contingency
- Production Sensor costs per sensor:
-    L0                                     $300               $222
-    L1 [D0]                             $500
-    Outer (A)		         $675	        $460
-    Outer (S) [CDF]			        $484
- Note:  D0 has recently received a direct quote from HPK for outer layer sensors of $470 per sensor.  The total cost savings would be $450K in the M&S.

## M&S Costs- Electrical

- Note that both CDF and D0 get their SVX4 chip costs from Ray Yarema

## M&S Costs- Mechanical

- Amounts in kilo-$

## 3. Labor

- CDF and D0 have adopted the same categories for Fermilab labor.
- Both groups have based the labor on each task on Run2a experience for the actual times taken.
- 1 FTE year = 1456 hours
- Our base rates are slightly different, but we just found that out on Monday.

## Labor hours by type

- * The SVX4 chip labor is taken out

- D0 takes out installation crew to compare
- and D0 CMMT and MTSF are grouped

## Module constr. labor hours

## Staves, labor hours

## D0 non-FNAL labor

- There is a total of $810K in the M&S cost that is from labor:
- $516K is covered by NSF MRI
-       $334K for sensor masks and probing
-          $91K for hybrid testing
-          $33K for database work
-          $70K for mechicanical on L0
- $131K for KSU electronics engineering
- an additional $130K for UW engineering for
-        L0/L1 (total UW engineering $200K)
- In addition, there is off-project labor ($127K):
-           Hybrid testing at KU
-           Radiation monitors at NIKHEF
-           Technician Time at La Tech

## CDF non-FNAL labor 

-    Task group                    hours in project
- Hybrids            			11,040
- Power Supplies 			     976
- Sensor Testing			  2,880
- L0 cables				  1,760
- Positioning 				  3,440
- SVX4 chip				  1,496
- TOTAL				21,592
-                                                    =15 FTE

## 4. Schedule

- Some selected milestones

- *Note that D0 electrical prototype is made of production parts, the full chain test with prototype parts occurs in Fall 02