# Presentation: 703922

## Schedule

_**Schedule**_

- In preparation

- Done

- Done

- Late

- Done

- Done

- Done

- Done

- Done

- In preparation

- Done

- Done

- Done

- PMG, July 20, 2000

## Sensor Delivery 

- Axial detectors (3-chip):
- All sensors in hand
- 90o detectors, DSDM (6-chip):
- ~28 sensors still to be delivered
- we accepted 14 lower grade devices
- Micron would like them exchanged for A grade devices
- This will introduce slight asymmetry in barrels; barrel 3 has only A grade devices
- production paced by sensor delivery
- Micron personnel working significant overtime on DSDM project
- Need to keep pressure on but,   in all fairness, Micron is really trying to do its best to maintain an August 31 final delivery date
- 2o detectors (9-chip)
- Still to deliver 27 (lyr2), 4 (lyr4) sensors
- 36 (lyr2/4) being processed at Micron
- If we need to call into effect fallback: ~10 sensors
- Fallback: Accept sensors which have higher Rbias , ~50 sensors have been identified
- F-Wedge sensors
- 	Micron:
- All 125 sensors received
- 	Eurisys:
- Order of 65 sensors complete
- 17 exchanged sensors shipped to us
- Trying to optimize use of all F wedge sensors

- PMG, July 20, 2000

## Sensor Delivery

- _Sensor Delivery_

- H Wedges
- All sensors needed in hand. Sensors still need to be tested

- 

- 

- ()

- PMG, July 20, 2000

## High Density Interconnect Status

- 3-chip hdi’s
- done
- 6-chip hdi’s
- Last 45 (38 + 7) through surface mount, will be shipped next week
- almost done
- 9-chip hdi’s
- 26 hdi’s through surface mount, will be shipped next week
- 32 Promex shipped to Promex, will be processed this week
- ~12 to be laminated and still to go through Promex
- F-wedge hdi’s
- All hdi’s in hand
- 18 hdi’s through surface mount last Monday
- ~15 more to go for stuffing at Promex
- H-wedge hdi’s
- All hdi’s in hand
- 20 sent to Silitronics

- Total to be stuffed:
- Promex: ~60
- Silitronics: ~20

- PMG, July 20, 2000

## Ladder and Wedge Production

- Axial detectors (3-chip):
- Ladder production has started again at slow rate
- Will use lag in 9-chip ladder production to finish off 3-chip ladders
- No problems foreseen
- 2o detectors (9-chip):
- Production lagging due to availability of hdi’s
- There will be a lag due to lamination and stuffing
- 26 hdi’s to be shipped next week
- 48 hdi’s to follow week after next
- Expectation to have last hdi stuffed around September 1; hdi’s still will have to be tested and burned in before use in production.
- Production proceeding at very slow pace
- 90o detectors (6-chip):
- Paced by Micron delivery, 128 ladders built so far, 96 A/B grade
- Enough ladders for barrel 4
- F Wedges (14-chip):
- Production proceeding at adequate pace
- Sensor and hdi availability not a problem
- Will receive exchanged Eurisys sensors soon
- Testing sensors is cumbersome
- H Wedges (6-chip):
- 190 half wedges produced to date, 115 A/B grade
- Half wedge production proceeding adequately
- Glued 56 full wedges of which 30 detector grade
- Encapsulation is slow and tedious process
- Enough wedges for first two H disks, enough graded for first

- PMG, July 20, 2000

## Production Status and Projection

- _Production Status and Projection_

- Projected rates:			assumed yield	capacity
- 9-chip:     12.0/week 	      80%		    15/wk
- 6-chip:     6.1/week	      85%		    10/wk
- H-wedge: 6.2 week	      85%		    10/wk
- F-wedge:  4.9/week	      90% 		    15/wk
- Slope for end game for 9-chip ladder production getting steeper !Nominal completion date for ladder production still early September

- Nov 1, 00

- Aug 28, 00

- today

- 50% line

- PMG, July 20, 2000

## Production Schedule Summary first half cylinder

- “short tails”

- All barrels for first half cylinder assembled
- some testing and repair work still to be performed
- F Disks:
- All sensors glued and tested !
- Last F disk to complete first half cylinder (center disk of end disk assembly) waiting for ring preparation
- Outermost F disk waiting for radiation sensors, which are late
- One F disk assembled is for second half cylinder
- We’re nearly on schedule. Lag has been made up
- Plan to ramp up H disk mounting rapidly
- Imminent delivery of “short tail” hdi’s for 9-chip ladder production should allow us to nearly stay on schedule

- PMG, July 20, 2000

## Production Rate 

- PMG, July 20, 2000

## F Disk Status

- _(Close to) The Point of No Return _

- Disks 10 and 12 assembled
- Disk 10 first to be dropped in fallback scenarios
- Within the next few weeks, disk 11 will be assembled. At that point all 6 disks completed for first half cylinder
- If we proceed this way, and there are no good reasons to do so, it is implicit that there is no descoping of the silicon detector! Any remaining fallback is in scheduling

- PMG, July 20, 2000

## Action Triggers

- Currently:
- 6 disks complete
- 3 barrels complete
- Produced 2 disks in the month of July

- PMG, July 20, 2000

## Overall Quality of First Half Cylinder

- Classification:
- dead: laser response < 40 ADC counts
- noisy: pedestal width > 6 ADC counts
- A grade: < 2.6% dead/noisy channels
- B grade:  < 5.2% dead/noisy channels

- 9-Chip LaddersDead Channel Count                           Noisy Channel Count

- PMG, July 20, 2000

## Overall Quality First Half Cylinder

- F WedgesDead Channel Count                             Noisy Channel Count

- 6-Chip LaddersDead Channel Count                             Noisy Channel Count

- PMG, July 20, 2000

## Barrel / Disk Assembly and Mounting

- A lot of fixturing (“Erector Set work”) involved in getting the first half cylinder ready:
- Barrel Removal Fixture
- Barrel / Disk mating fixture
- Barrel / Disk insertion fixture
- End Disk Assembly Insertion Fixture
- Silicon Support Cradle, “tumbler”
- .........

- Barrel Rotating Fixture

- PMG, July 20, 2000

## Barrel / Disk Assembly and Mounting

_**Schedule**_

- PMG, July 20, 2000

## Barrel / Disk Assembly

- All barrels for first half cylinder done, but
- refitting of barrel 1 (grounding)
- final surveys of barrels
- Completion of fixtures
- F disks:
- Preparation of rings
- Radiation Monitors
- H disks
- CMM programming complete
- Ring assembly started. Aim for August 1 for first ring
- Support cylinder
- reinforcements of silicon support cylinder
- kinematic mounts done
- Procedure for mounting cover on support cylinder studied by FEA
- Exercise many procedures with dummy barrel F disk this week
- Barrel removal today
- Cooling tomorrow
- ......

- PMG, July 20, 2000

## Readout

- Schedule calls for move of first half support cylinder to DAB on September 15, 2000
- All assemblies installed in silicon support cylinder by August 15
- Interface Board design nearly complete
- “Acceptable” solution for cross talk still gives glitches
- Need to implement ALTERA FPGA
- To be tested this week
- Design will then be frozen for first 2/15 production boards
- termination of bus lines decided
- Controls and Monitoring features of board have been verified
- Board submitted for bid
- Interlock and Cooling system being setup
- Shortage of dedicated manpower is a problem. Recall, the 10% test is 80,000 readout channels, more channels that the whole calorimeter, and as many channels as the whole fiber tracker!

- PMG, July 20, 2000

## Test of Full Readout System (July 14) 

- Plan was to readout full F disk (F14) and exercise whole DAQ chain
- Instead, readout 3 hdi’s
- missing cooling, interlocks and some infrastructure
- Run Calibration in Front End
- Download parameters in Database
- Retrieve parameters from Database and download chips using proper protocol
- Start run
- Unpack and Analyze data in Level 3 node
- Ship data through collector / router to host
- Log data
- Store in SAM
- Analyze data online (Examine)
- Logging of monitoring parameters

- _COOR controlled:_

- PMG, July 20, 2000

## Low Mass Cables

- So far, cable production has met schedule. But delivery recently slowed down to 35/wk, whereas 56/wk needed
- Keeping close watch on production

- PMG, July 20, 2000

## Change Requests

- 1.1.1.5.3
- Unsubmitted invoices at Promex, cost for support of university repair and testing efforts assumes recovery of reqs 520326, 514874
- 1.1.1.6.3
- Increased charges due to welding costs, temperature readout and control systems, chiller modifications
- 1.1.1.6.4
- Modifications needed to the dry air system at DAB, additional electrical work
- 1.1.1.5.8
- Modifications needed to solve DVALID problems and obtain first articles for installation. Additional parts and poweer supply costs
- 1.1.1.5.4
- Extra costs for spare coax cables, $14k for KSU testing
- 1.1.1.2.1.3
- Misc shop charges, assuming some will still come in
- 1.1.1.2.1.1
- Costs to close out Micron contract reduction of number of delivered F disk detectors
- 1.1.1.3.3
- Travel costs and telephone bills to maintain FNAL technicians at Micron Semiconductor

- PMG, July 20, 2000