# Presentation: 637183

## An Overview of: 	STEP for Electronics

**Gregory L. Smith**
- Boeing Integrated Defense System
- Puget Sound IT Architecture and Systems Integration
- _[Gregory.L.Smith@Boeing.com](mailto:Gregory.L.Smith@Boeing.com)__ _

**A discussion on participants, activities and goals**
**relating to the use of STEP for Electronics **
**(last update: March, 2003)**

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## Goal of PresentationProvide a High Level Overview of:AP210, STEP for Electronics and Related Company and Consortium Activity

**Analysis**

**To/From**
**Mentor**

**Design**

**AP 210**

- _Goal of Presentation_Provide a High Level Overview of:AP210, STEP for Electronics and Related Company and Consortium Activity

**Mechanical**

**To/From**
**Mechanical**

**Repository**

**Exchanging Intelligent **
**Electronics Information**

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## STEP for Electronics ActivitiesWho are we? 

- PDES, Inc. member and non-member companies

- CAM-I (Consortium for Advanced Manufacturing

- International) member companies

- Individual companies providing strong support:

- Boeing 		-LK Soft
- Rockwell-Collins	-ATI
- Georgia Tech 	-IBM
- Univ. of Illinois	-Virginia Tech
- NASA JPL and NASA Goddard
- The US Army
- Northrop Grumman
- General Motors
- Arthur D. Little

- Other supporters:
- NIST
- STEP Tools
- Theorem Solutions
- Delphi Delco
- Honeywell

- Representatives from:

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## STEP for ElectronicsWhy are we here?

**To provide a high level education of STEP with emphasis on:**
- STEP for Electronics,
- STEP Related Activities,
- Member capabilities and products.
**To request involvement and support for standards and implementation development in the Electronics arena. **
- Assigned individuals to the team
- Provide technical support
- Select areas of interest to participate
- Select existing tasks and/or discuss new tasks

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## STEP for ElectronicsA Quick (Rough) History

**90**

**91**

**92**

**93**

**94**

**95**

**96**

**97**

**98**

**99**

**00**

**01**

**02**

**03**

**1991 STEP AP210**
**Registered**

**June 2002 Mentor & Zuken  – AP210 IS MR **
**Translators by LK Soft, initiated**

**Summer 2003 STEP AP210 Minor Amendment**

**April 2000 Mentor - AP210 DIS Translator by ITI, completed**

**February 1998 Mentor - AP210 DIS Translator by ITI, initiated**

**April 1999 STEP AP210 IS Standard Approved**

**AP210 **
**Activity**
** ****Initiated**

**June 1992 PreAmp NIST ATP, **
**Testing AP210 CD**

**May 1995 TIGER DARPA Contract, **
**Testing AP210 DIS**

**June 2001 STEP AP210 Minor Amendment**

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**Notes:**
Timeline showing AP210 CD/IS/R1
Mentor meetings
ITI Translator Activity
Timeline showing AP210 CD/IS/R1
Mentor meetings
ITI Translator Activity
Timeline showing AP210 CD/IS/R1
Mentor meetings
ITI Translator Activity
LKSoft Translator Activity

## STEP for ElectronicsElectronics Standards/Formats

***Too Many Formats!***

- STEP for Electronics**Electronics Standards/Formats**

- Copyright PDES, Inc.

## STEP for Electronics Standards Comparison

**Evolution**

**STEP**
**AP210**

**EDIF**

**ODB++**
**GenCAM**

**IPC-**
**D350**

**GERBER,**
**HP-GL,**
**DXF**

**IGES**

**IDF**

**Electrical**
**Functionality**

**Mechanical**
**Functionality**

**Functionality**

**DXF**

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## STEP for Electronics Activities Overview

- Engineering Framework

- AP210  Activities
- (Electronics)

- CAM-I Activities

- PDES, Inc.  Activities

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## STEP for Electronics ActivitiesPDES, Inc. Electro-Mechanical Pilot – Objective

- The objective of the pilot is to implement STEP for integrated electronic exchange of information between:
- electrical designers,
- mechanical designers, and
- design analysis
- 	in the design of printed circuit assemblies and their mounting hardware and enclosures.
- Support the development and deployment of applications protocols within the EM Pilot domain.

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## STEP for Electronics ActivitiesPDES, Inc. Electro-Mechanical Pilot – Details

- Participants
- Boeing, Rockwell-Collins, NASA (JPL and Goddard), Georgia Tech, ATI, LKSoft, U.S.Army, IBM
- Support the implementation of STEP for Electronics within the US and the world.
- Series of mini-activities worked by individual companies and teams of companies.
- Activities include:
- Translator development and marketing
- Standards publicity
- Tool development
- Standard development/refinement
- AP210, AP220, AP233.

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## STEP for Electronics ActivitiesConsortium for Adv Mfg -International (CAM-I) – Details

- Pool resources of numerous companies to resolve problems of common concern.
- Participants
- Boeing, Rockwell-Collins, Rockwell Automation, Honeywell, Proctor and Gamble, Honeywell, NASA JPL, NIST, Georgia Tech
- Series of mini-activities worked by individual companies and teams of companies.
- Activities include:
- Assembly Simulation
- Design for Test
- EM Glossary

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## STEP for Electronics ActivitiesSTEP AP210 Standard development

- Develop and enhance the STEP AP210 standard to support the storage and retrieval of PWA/PWB related information.
- Goal: Develop an international standard
- Participants: Boeing, Rockwell-Collins, Georgia Tech, NASA (JPL and Goddard), ADL, Northrop-Grumman IT and LKSoft
- Milestones:
- Jul 03 - AP210 Minor Revision (standard update)
- Mar 03 - WD32 complete
- Express Graphics AIM and ARM available

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## STEP for Electronics ActivitiesSTEP for Electrical/Electronics Product Data Exchange

**STEP AP 210 PCA Design Information**

**Technology**

**Physical**

-   Component Placement
-   Bare Board Design
-   Layout templates
-   Layers non-planar,
-    conductive & non-conductive
-   Material product

-  Geometrically Bounded 2-D
-   Wireframe with Topology
-   Surfaces
-   Advanced BREP Solids
-   Constructive Solid Geometry

**Part**

-   Functionality
-   Analysis Support
-   Shape 2D, 3D
-   Package
-   Material Product
-   Properties

**Configuration Mgmt**

-   Identification
-   Authority
-   Effectivity
-   Control
-   Requirement Traceability
-   Analytical Model
-   Document References

**Product Structure/**

**Connectivity**

-   Functional
-   Packaged

-   Fabrication Design Rules
-   Product Design Rules

**Requirements**

-   Design
-   Allocation
-   Constraints
-   Interface
-   Rules

-  Geometric Dimensioning 		and Tolerancing

**Geometry**

**Design Control**

**~950 Entities**

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## STEP for Electronics ActivitiesSTEP for Electrical/Electronics Product Data Exchange

**STEP AP 210 PCA Design Information**

**Product Enclosure**

**Externally**
**Visible Connectors**

**Printed Circuit Assemblies**

**Die**

**Package**

**Packaged Part**

**Interconnect**
**Assembly**

**Printed Circuit **
**Substrate**

**Die**

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## STEP for Electronics ActivitiesSTEP for Electrical/Electronics Manufacturing

- STEP for Electronics Activities**STEP for Electrical/Electronics Manufacturing**

**MANUFACTURING SPECIFIC**
**PRODUCT INFORMATION**

**PROCESS/FACTORY**
**CHARACTERIZATION**

** ****PCB Fabrication**

** ****PCA Assembly**

-  **Variability Characteristics**

**PRODUCT DESIGN**

**PLANNING**
**CHARACTERIZATION**

** ****PCB/PCA Planning Data**

** ****Plan Structure and Org**

** ****Operations and Steps Measurement**

** ****Work Measurement Standards**

** ****2D Panel Layout Geometry**

** ****Process Tolerance**

** ****Material, Consumable & Deliverable**

** ****Process Design**

**Manufacturing**
**   ****Engineering**
**         ****Workstation**

**Manufacturing**
**Facility**

**Printed Circuit**
**Board**

**STEP AP 220 PCA Process Planning**

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## STEP for Electronics ActivitiesGeneric Data Flow

- PWA/PWB Design Tool

- Mfg Analysis

- Analysis

- Thermal 	        EMC
- Producibility   Durability

- In-Circuit Test

- PWB Fabrication

- CAM Tools

- Design Requirements
- System Requirements

- text

- Nodal Analysis

- Sneak Circuit Analysis
- Functional Analysis

- EDIF

- results

- Gerber, ODB++
- GenCAM, Vendor
- Proprietary

- Vendor
- Proprietary

- results

- Vendor
- Proprietary

- results

- Flying Probe
- Bed of Nails
- Function Test

- results

- Gerber
- ODB++
- GenCAM

- PWB

- PWA

- Vendor
- Proprietary
- GDS II

- Mech Design Tool

- IDF

- results

- Enclosure Design

- Design Capture
- PWA/PWB Design

- PWB Warpage/Stackup
- Assembly Simulation
- Component Footprint
- Artwork

- results

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## STEP for Electronics ActivitiesProduct Life Cycle and AP210 Integration Status

- STEP for Electronics Activities**Product Life Cycle and AP210 Integration Status**

**Systems**
**Engineering**
**Applications**

**PDM**
**Systems**

**Mechanical**
**CAD**
**Applications**

**AP210/203 Conversion**

**Manufacturing**
**CAD**
**Applications**

**AP210/Gerber Conversion**

**STEP AP210**

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## STEP for Electronics ActivitiesAP210 Translation – Multiple Companies

- STEP for Electronics Activities**AP210 Translation – Multiple Companies**

**Eagle**

**STEP AP210**

_**Mentor Graphics**_
- International Standard (IS), Minor R Translator in development
-       Being developed by LKSoft
-       Funded by NASA JPL, ATI and Boeing

_**Zuken**_
- International Standard (IS), Minor Revision translator
-     Being developed by LKSoft
-     Funded by ATI and Rockwell-Collins

_**Cadence**_
- – no activity

_**Eagle**_
- International Standard (IS), Minor Revision translator
-     Being developed/funded by LKSoft

**Most Recent Version: **
**AP210 IS WD34**

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## STEP for Electronics ActivitiesAP210 Translation – Multiple Companies

- STEP for Electronics Activities**AP210 Translation – Multiple Companies**

**STEP AP210**

**Structure**
**/ Nodal**

**Electro-Mech**
**IDF to AP210**
**Converter**

**STEP**
**AP203 to AP210**
**Converter**

**Manufacturing**
**to AP210**
**Converter**

**EDIF/****VHDL**

**ODB++**
**GenCAM **
**Gerber**
**HPGL**

**AP203**

**IDF**

**Most Recent Version: **
**AP210 IS WD34**

**IDF to AP210 **
**Complete**
**AP210 to IDF**
**Not available**

**AP203 <-> AP210 **
**Update in process**

**EDIF to AP210 **
**complete**

**Via **
**CircuitCAM **
**to AP210**

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## STEP for Electronics ActivitiesElectro-Mechanical Integration 

- Goal: The seamless integration with no data loss between electrical and mechanical domains.
- Boeing, Rockwell-Collins, NASA (JPL), Raytheon, Theorem, Unigraphics and Northrop-Grumman.

- STEP for Electronics Activities**Electro-Mechanical Integration **

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## STEP for Electronics ActivitiesElectro-Mechanical Integration

**Exchange of data  independent of process or tools.  **
**Frequency controlled by unique Business needs.  **
**Exchange of *****intelligent***** data.**

**Requirements**

**Circuit Board**
**   ****Assembly**

**Product**
**        ****Package**

**ECAD**

**MCAD**

***Quality***
***Product***

**STEP Data for Exchange**

**AP210**

**AP203/**
**AP210**

**Proposed Design Process**

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## STEP for Electronics ActivitiesElectrical Mechanical Integration 

**Mechanical Systems**

**Electrical Systems**

**CATIA**
**Application**

**Dassault**

**Unigraphics**
**Application**

**Unigraphics Solutions**

**AP203**
**cc 2/6**

**CR-5000 PWS**
**Application**

**Zuken-Redac**

**IDF to**
**AP203 cc 2**

**Allegro**
**Application**

**Cadence**

**IDF to**
**AP203 cc 2**

**Board Station**
**Application**

**Mentor Graphics**

**AP210 to **
**AP203 cc 2**

**Solid**
**Edge**
**Application**

**AP203**
**cc 6**

**Unigraphics Solutions**

**Conformance challenges**

**Working with minor concerns**

**Data Transfer Between Systems**

- STEP for Electronics Activities**Electrical Mechanical Integration **

**AP203 **
**cc 2/6**

**Note: Update required for latest translators**

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## STEP for Electronics ActivitiesPWA/PWB Producibility Analysis – Boeing

- Company PWA/PWB
- Guidelines

*Codification of *
*Guidelines*
*(Rules Definition)*

- PWA/PWB Captured in Mentor Design Tools

- STEP AP210

- Rules

- Producibility
- Analysis
- Report

- Manufacturing Capabilities
- STEP AP220

*Comparison of Rules*
*Against Product Data*
*(Rules Execution)*

- STEP for Electronics Activities**PWA/PWB Producibility Analysis – Boeing**

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**Notes:**
Provide an analysis capability for the manufacturing entity to determine the producibility of the PWA/PWB.
Developed by Boeing
Prototyped and tested at Irving
Responses were excellent, identified areas not caught by M&P
Requested to extend coverage
Usage halted due to problems with ITI translator
Provided to Rockwell-Collins
Supplied in conjunction with Boeing-Rockwell data exchange project
Performed extensive testing and added Rockwell rules
Presenting supporting limited production use
Provided to Consortium for Advanced Manufacturing – International
Supplied to support Boeing membership
Part of Model-Based Manufacturing program
General Electric planning on implementing resulting applications

## STEP for Electronics ActivitiesPWA/PWB Producibility Analysis – Boeing

** ****Boeing PWA Analysis Completed - Generating Summary, Please Stand By...**
**   **
**  ****During this Analysis: **
**     ****14****	****Administration Checks were Executed.**
**     ****40****	****Data Collection Checks were Executed.**
**     ****52****	****Analysis Checks were Executed.**
**    ****----------------------------------------------------------------------- **
**     ****106****	****Checks Total were Executed.**
**   **
**     ****The Analysis on PWA: B169-78762-4,**
**    ****resulted in the possible violation of 5 rule(s) and 5 guideline(s).**
**  **
**The following (5) rules may have been violated by this design:**
**   ****IPG Sec      3.3.4  Check PWA support for Surface Mount Automation (Check175 Ver248.25)**
**   ****IPG Sec      3.3.2  Check PWA Requirement for In-Circuit Test  (Check176 Ver241.29)**
**   ****IPG Sec      3.2.9  Check Minimum PWB Dimensions for Wave Solder equipment (length) (Check17 Ver16.3)**
**   ****IPG Sec      3.5.5  Check Surface Mount Device Test Keep Out Zone - Minimum Edge (Components) (Check185 Ver296.12)**
**   ****IPG Sec      3.5.3  Check Wave Solder & Vibration Test Keep Out Zone - Minimum Edge (Components) (Check184 Ver531.9)**
**  **
**The following (5) guidelines may have been violated by this design:**
**   ****IPG Sec       3.10  Check PWA support for Mixed Technology (Check58 Ver310.28)**
**   ****IPG Sec      3.6.2  Check Common Surface Mount Component Orientation (Modulo 180) (primary) (Check34 Ver35.2)**
**   ****IPG Sec     3.10.5  Check Radial Component Lead Span (Check157 Ver914.57)**
**   ****IPG Sec      3.2.1  Check Maximum PWB Thickness (Check14 Ver245.8)**
**   ****IPG Sec       3.10  Check PWA support for Mixed Technology (2) (Check70 Ver255.26)**
**  **
******* Analysis Completed on 02/27/2002 at 8:20:03AM**

- Producibility
- Analysis
- Report

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## STEP for Electronics ActivitiesPWB Stackup – Georgia Tech

**Outline Detail**

**Stackup Specs**

**Stackup Notes**

- PWB
- Stackup

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## STEP for Electronics ActivitiesPWB Stackup – Georgia Tech

- Layer 1: 1 Oz. Cu Foil

- Layer 2: 2 Oz. Cu Foil

- Layer 3: 1 Oz. Cu Foil

- Layer 4: 1 Oz. Cu Foil

- Primary

- plane

- signal

- Epoxy Glass GF/ PGF

- Epoxy Glass GF/ PGF

- Epoxy Glass GF/ PGF

- .055
- .045
- over
- base
- material

- solder

- Secondary

- component

**Stackup Specs ***- PWA/B Designer*

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## STEP for Electronics ActivitiesPWA/PWB Assembly Simulation using AP210 – Rockwell

- Rules (From
- Definition
- Facility)

- Generic Manufacturing Equipment Definitions

- Specific
- Manufacturing Equipment Used

- User Alerted on Exceptions to Producibility
- Guidelines

- STEP for Electronics Activities**PWA/PWB Assembly Simulation using AP210 – Rockwell**

- Product Data
- (AP210)

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## STEP for Electronics ActivitiesPackage Modeler using AP210/AP203

- Develop a package modeling capability to support the creation of 2D and 3D electronic component
- Goal: Implement an automated package model
- Participants: Rockwell-Collins, and University of Illinois
- Lead Company: Rockwell-Collins
- Milestones:
- Jul 03 - Initial application available (U of I for Rockwell)

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## STEP for Electronics ActivitiesPackage Modeler using AP210/AP203

- Part Package
- Requirements

- STEP AP203
- Models

- STEP for Electronics Activities**Package Modeler using AP210/AP203**

**Part**
**Package**
**Modeler**
**Pro E Or**
**Unigraphics**

- 2D Package
- Extraction

- 3D Package
- Extraction

- Support:
-  STEP AP210 cc1
-  STEP AP203 cc14

- 2 1/2D Package
- Extraction
- (Length/Width + Height)

- Support:
-  Definition of features and shapes
-  Definition of electrical and mechanical parameters

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**Notes:**
Build an application based on MCAD system either Pro E or Unigraphics. Allow the definition of feature and shapes necessary to build Package with cc 1 of 210 and cc 14 ap210 
Build in 3d space. Extract 2d as necessary
Read in ap203 models if possible
Presently gathering requirements.

## STEP for Electronics ActivitiesPWA/PWB Durability Analysis – Boeing

- A metric to identify a failure mechanism and predict time to failure
- Provides assessment of COTS integrity
- Reduces cost of products by concurrent engineering
- Validated on numerous projects

**AP210**

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## STEP for Electronics ActivitiesAP210 Viewer – Boeing

- STEP for Electronics Activities**AP210 Viewer – Boeing**

- AP210 STEP Viewer

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## STEP for Electronics ActivitiesAP210 Functional Extract (Schematics) – Boeing

- STEP for Electronics Activities**AP210 Functional Extract (Schematics) – Boeing**

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## STEP for Electronics ActivitiesSTEP Book – LKSoft

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## STEP for Electronics ActivitiesSTEP Book, AP210 Training – Package Video – LKSoft 

- Copyright PDES, Inc.

## STEP for Electronics ActivitiesExpress/XML-based GUIs in STEP-Book App. – Georgia Tech AP203 Example - Tree View Widget

**LKSoft AP203**
**StepBook Application**

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## STEP for Electronics ActivitiesEngineering Framework – Georgia Tech 

- Awareness of design interfaces to other life cycle phases:
- pursuit & order capture, mfg., operation/service, and disposal
**Identifying existing work:**
- Architectures, components, and techniques
**Addressing gaps in existing work**
- Developing solution paths & testing approaches
- Example gap: ancillary information, including “dumb notes”

**Interoperability in multi-disciplinary engineering development environments**
- Emphasis dimensions:
*Organizational Level:* engineering group/department
*Domains:* systems & s/w engineering, electromechanical, analysis
*Design stages:* WIP designs at concept, preliminary, and detailed stages

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## STEP for Electronics ActivitiesDesign Repository an EM Pilot activity

- Goal: Provide a capability demonstration
- Participants: NASA (Goddard & JPL), Georgia Tech, GM, Boeing and LKSoft
- Lead Company: (3 separate activities) NASA (Goddard), Georgia Tech, and LKSoft
- Focal: Steve Waterbury, Russell Peak, Lothar Klein

- STEP for Electronics Activities**Design Repository an EM Pilot activity**

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## STEP for Electronics ActivitiesPDM Schema Activity – Georgia TechWarning Module PWA – Product Structure Model Overview

**PWA – Printed Wiring Assembly**
**PWB – Printed Wiring Board**

- U5

- PWA

- K1

- PWB

- R10; R46

- Goal:
- To demonstrate basic product structure.

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## STEP for Electronics ActivitiesPDM Schema Activity – Georgia TechWarning Module PWA – Product Structure Model Overview

- uses

- ABC-9010

**Warning Module PWA**

- Described by

- Design
- Document

- Described by

- Design
- Document

- 24052-4993
- Resistor RC1206

**R10, R11, R12, R13, R14**

- Described by

- Design
- Document

- 24052-2003
- Resistor RC1206

**R46, R47, R48**

- Described by

- Design
- Document

-  20135-5512
- Digital Oscillator  K_M28776_7

**K1**

- Described by

- Design
- Document

-  22471-338
- Relay  TO_220_5_LF

**U5**

- Described by

- Design
- Document

- ABC-9230
- Warning Module PWB

**Board 1**

- Mfg. Notes
- MS PowerPoint Document

- PWA Design
- STEP File

- Described by

- Design
- Document

- PWB Stack up Design
- STEP File

- Described by

- Design
- Document

- PWB Mfg. Notes
- MS PowerPoint Document

- Resistor Mfg. Notes
- MS PowerPoint Document

- Resistor Mfg. Notes
- MS PowerPoint Document

- K1 Mfg. Notes
- MS PowerPoint Document

- U5 Mfg. Notes
- MS PowerPoint Document

**Note: All components on the actual module are not included in this example. The main information structural variations are given for tutorial purposes.**

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## STEP for Electronics ActivitiesPWA/PWB Inwork Design Repository Multiple Companies

**Provide seamless electrical and mechanical I/F. **
**Provide vendor independence.**
**Provide intelligence for cross domain analysis.**
**Provide platform independence.**

**MCAD**
**Application**

**AP 210**

**MCAD**
**Translator**

**ECAD**
**Translator**

**ECAD**
**Application**

**Manufacturing**
**Applications**
**(Producibility)**

**AP 220**

**Manufac-**
**turing**

**Domain**
**Specific**
**Analysis**

**AP 210**

**Data**
**Extraction**

**Classes **
**x & y**

**AP 203**

**AP 210**

**AP 210**

**Corba**
**STEP**
**Data**
**Access**
**Interface**

**Cross**
**Domain**
**Analysis**

**AP xxx**

**Data**
**Extraction**

**Entities &**
**Attributes**

**AP 233**
**AP 210**

**AP 203**

**AP 220**

**AP 209**
**AP 202**

**AP 210**
**Schema**
**(Express)**

**AP 203**
**Schema**
**(Express)**

**AP 220**
**Schema**
**(Express)**

**AP 202**
**Schema**
**(Express)**

**Database Schema Generator**

**Corba**
**STEP**
**Data**
**Access**
**Interface**

**MCAD**
**Database**

**AP 203**

**AP 210**

**MCAD**
**Translator**

**ECAD**
**Translator**

**ECAD**
**Database**

**Manufacturing**
**Resources**

**AP 220**

**Resource**
**Capture**

**Analysis,**
**Design,**
**Requirements**
**Criteria**

**AP xxx**

**Criteria**
**Capture**

**Object Oriented or Object Relational **
**Database Management System**

- PDM

**AP 233**
**Schema**
**(Express)**

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## STEP for Electronics ActivitiesThe PGPDM Architecture - NASA

- STEP for Electronics Activities**The PGPDM Architecture - NASA**

**AP 233**

**AP 210**

**AP 209**

**AP 203**

**Analysis****(CAE)**

**Electronic****(ECAD)**

**Systems****Engineering**

**Mechanical****(MCAD)**

**Spacecraft X**
**Master Model**

**Integrated**
**Master Models**

**Discipline**
**Model Mappings**

**Instrument Y**
**Master Model**

***PGPDM***

***Repository***

**CAx Tool**
**with Std **
**API**

- SOAP/XMLRPC/CORBA

**Instrument Y**
**Object**

- STEP Data

**Integrating ****STEP ****and ****OMG ****Technologies**

- Copyright PDES, Inc.

**Notes:**
Lead Company: NASA (Goddard)
Focal: Steve Waterbury
Status: Integrating PostGres SQL within 1 or 2 months.  Will provide basic PDM capability to create products and versions.  In addition, will be able to upload files and provide document management.  1st production management system will be the NASA Alert system, a Parts reliability reporting system (80-90% electrical parts and components).  Will then be working on STEP input/ output through ExpressX mappings.
This diagram illustrates the concept of “Intelligent PDM”.  The essential ingredients for Intelligent PDM are:  
(1)  a set of discipline-specific information models (the examples shown are the STEP Application Protocols 203 [MCAD], 209 [Finite-Element Analysis], 210 [ECAD], and 232 [Systems Engineering]);
(2)  STEP translators for the discipline tools:  since Intelligent PDM is based on STEP, each tool to participate in this environment must have a STEP import/export capability;
(3)  a Product Master Model, which incorporates the STEP AP’s as subsets and represents each common object once.  For example, the geometry of the product is a subset of the Product Master Model, and is “reflected” in the MCAD, ECAD, and Analysis models, in which it may have different projections (e.g., 2-D or “2.5”-D in an ECAD model) or transformations to lower fidelity.  The Product Master Model could be thought of as a “union” or “superset” of all the discipline models of the product. 
 (4)  mappings between the discipline-specific views of the product (the STEP AP’s) and the Product Master Model.  These mappings are being developed using the EXPRESS-X mapping language, a new part of the STEP standard.
The diagram depicts the discipline tools feeding their models through the STEP AP’s and mappings into the Master Models for Spacecraft X and Instrument Y.  The Intelligent PDM system can then generate, through the reverse mappings, the changed versions of the other discipline models.

## STEP in Spacecraft Development

- JAU 2002-06-26

- How the family of STEP Data Standards
- can be applied to Spacecraft Development

**This slide provides high level information about how STEP can be applied to the engineering domains  that are part of the spacecraft development process.**

- De-emphasized boxes indicate data models that are IN DEVELOPMENT.

**As envisioned by NASA JPL.**

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## STEP for Electronics ActivitiesFuture (near)

- Goal:  Provide an evaluation and demonstration on the ability to share intelligent digital data between companies and vendors.
- Timeframe: June 03 - TBD
- Participants:
-  Jabil Circuits
-  Boeing
-  Honeywell
-  U.S.Navy/Air Force (TBD)

**Electronics Avionics Pilot**

**This will be very, very big for the STEP AP210 effort as far as acceptance within the electronics community!**

-  LK Soft (TBD)
-  Rockwell (TBD)
-  NASA (TBD)
-  Georgia Tech (TBD)

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## STEP for Electronics ActivitiesSummary

- We are supporting the development of AP 210 translation:
- Mentor, Zuken-Redac, Solid Edge, Eagle

- We have been working to develop a vendor independent model for electronics and electronics manufacturing for over ten years (over hundred man years of effort) – STEP AP210.

- We are deploying AP 210 on several projects:
- Durability & Producibility Analysis
- Electrical Mechanical Interface (AP210 <-> AP203)
- AP 210 Viewers and AP210 Book
- PWB Stackup Tool

** **Have invested extensively (time and money) in AP 210 development and implementation.

- We are planning future architectures around AP 210.

*** ******STEP for Electronics***
***is available and a viable standard for ***
***Product Data Exchange!***

**Numerous industry, university & government entities:**

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## For More Information - 

- Contact:
**Greg Smith**
**Boeing Integrated Defense Systems**
**P.O.Box 3999, 8R-03**
**Seattle, WA 98124-2499**
- Gregory.L.Smith@Boeing.com
**(253) 773-5947**
**Questions?**

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