# Presentation: 407866

## NASA Workmanship Standards Technical Committee Meeting

- Marshall Space Flight Center
- June 6-8, 2000
- Garry McGuire

## NASA-STD-8739.3; Soldered Electrical Connections.
The current standard for hand soldering.
Mostly editorial comments for discussion later this week.
Should consider bringing the SMT requirements into this standard for ease of use and to be able to have some auditable requirements for those organizations who opt to hand solder SMT assemblies.

- The current standard for hand soldering.
- Mostly editorial comments for discussion later this week.
- Should consider bringing the SMT requirements into this standard for ease of use and to be able to have some auditable requirements for those organizations who opt to hand solder SMT assemblies.

- Status of NASA Standards

- June 6-8, 2000

## NASA-STD-8739.3; Soldered Electrical Connections.
Jim Woodford (DoD) contacted G. McGuire to surface the idea of a joint NASA/DoD soldering standard for orbital hardware.
Identify risk factors without telling suppliers how to deal with them...only require that they are addressed in their internal procedures.
Internet sites such as NASA’s LLIS should require feedback from users describing the value of the lesson and how it applied to their application.

- Jim Woodford (DoD) contacted G. McGuire to surface the idea of a joint NASA/DoD soldering standard for orbital hardware.
- Identify risk factors without telling suppliers how to deal with them...only require that they are addressed in their internal procedures.
- Internet sites such as NASA’s LLIS should require feedback from users describing the value of the lesson and how it applied to their application.

- Status of Voluntary Consensus Standards

- June 6-8, 2000

## NAS 5300.4(3M); Surface Mount Technology
HQ/QS is currently reformatting into NASA-STD-8739.2.
We should take advantage of the opportunity to make some much needed revisions while it’s under construction.
Now is the time to decide a path for NASA’s soldering standards (see last agenda item for 6/6).

- HQ/QS is currently reformatting into NASA-STD-8739.2.
- We should take advantage of the opportunity to make some much needed revisions while it’s under construction.
- Now is the time to decide a path for NASA’s soldering standards (see last agenda item for 6/6).

- Status of NASA Standards

- June 6-8, 2000

## NAS 5300.4(3M); Surface Mount Technology
Does not address hand soldering which [unfortunately] many, if not most, NASA suppliers are using to build SMT assemblies.
Should address Ball Grid Array part packaging.
At a minimum, we should define some process and hardware qualification requirements.  Since we can’t really tell people not to use it until some important reliability questions are answered, we need to at least make it clear that anyone who intends to fly this technology can provide objective data that shows reliability for the expected mission life.

- Does not address hand soldering which [unfortunately] many, if not most, NASA suppliers are using to build SMT assemblies.
- Should address Ball Grid Array part packaging.
- At a minimum, we should define some process and hardware qualification requirements.  Since we can’t really tell people not to use it until some important reliability questions are answered, we need to at least make it clear that anyone who intends to fly this technology can provide objective data that shows reliability for the expected mission life.

- Status of NASA Standards

- June 6-8, 2000

## NASA-STD-8739.4; Crimp, Cables, & Harnesses
The current standard, but has several gaps that need to be filled:
Semi-rigid Coaxial Cable Assemblies
Flexible Circuits
Wire Wrapped Connections (MIL-STD-1130 was cancelled September, 1999).
These were agreed upon at our last meeting.  Necessary resources are identified in the 2001 Technical Program Plan. 

- The current standard, but has several gaps that need to be filled:
- Semi-rigid Coaxial Cable Assemblies
- Flexible Circuits
- Wire Wrapped Connections (MIL-STD-1130 was cancelled September, 1999).
- These were agreed upon at our last meeting.  Necessary resources are identified in the 2001 Technical Program Plan.

- Status of NASA Standards

- June 6-8, 2000

## NASA-STD-8739.5; Fiber Optic Terminations
Have received little technical input from the user community.
Difficult to judge why:
hasn’t found its way into many contracts yet.
specific to one aspect of the technology.
everybody loves it as-is .

- Have received little technical input from the user community.
- Difficult to judge why:
- hasn’t found its way into many contracts yet.
- specific to one aspect of the technology.
- everybody loves it as-is .

- Status of NASA Standards

- June 6-8, 2000

## NAS 5300.4(3J-1); Staking & Conformal Coating
The current standard, but also has gaps that need to be filled:
Connector Potting 
Adhesive Bonding
JPL has proposed adding embedment/encapsulation for discussion at this meeting.
The potting and bonding were agreed upon at our last meeting and the necessary resources are identified in the 2001 Technical Program Plan.

- The current standard, but also has gaps that need to be filled:
- Connector Potting
- Adhesive Bonding
- JPL has proposed adding embedment/encapsulation for discussion at this meeting.
- The potting and bonding were agreed upon at our last meeting and the necessary resources are identified in the 2001 Technical Program Plan.

- Status of NASA Standards

- June 6-8, 2000

## NASA-STD-8739.7; ESD Control
More comments on this standard than any others.
This committee agreed during our July, 1998, meeting at Stennis Space Center that it would be impractical to expend resources on this standard when its probable cancellation was forthcoming.
Comments should be tabled until after a decision is made regarding S20.20 (for which no comments were sent in).

- More comments on this standard than any others.
- This committee agreed during our July, 1998, meeting at Stennis Space Center that it would be impractical to expend resources on this standard when its probable cancellation was forthcoming.
- Comments should be tabled until after a decision is made regarding S20.20 (for which no comments were sent in).

- Status of NASA Standards

- June 6-8, 2000

## IPC/EIA J-STD-001; Soldered Electrical & Electronic Assemblies
Revision C released March, 2000.
There remain conflicts or gaps between NASA’s standards and J-STD-001.
Controlled testing is strongly recommended before unconditional acceptance is considered.
Associated training and handbook committees are reactivated to make appropriate updates.

- Revision C released March, 2000.
- There remain conflicts or gaps between NASA’s standards and J-STD-001.
- Controlled testing is strongly recommended before unconditional acceptance is considered.
- Associated training and handbook committees are reactivated to make appropriate updates.

- Status of Voluntary Consensus Standards

- June 6-8, 2000

## Should be much easier to understand and implement.
Text boxes identify the requirement for each class for each feature.
Defect table expanded to include paragraph references and class descriminators.

- Text boxes identify the requirement for each class for each feature.
- Defect table expanded to include paragraph references and class descriminators.

- IPC/EIA J-STD-001; Soldered Electrical & Electronic Assemblies

- Status of Voluntary Consensus Standards

- June 6-8, 2000

## IPC-3710/3711; Crimp, Cables & Harnesses
This committee is continuing to assemble a draft standard for harnessing requirements.
Joint effort between NASA, IPC, and the Wire Harness Manufacturer’s Association (WHMA).
The first delivery will be an acceptance document similar to IPC-A-610, to be followed closely by a process standard.
Next meetings are June 22-23 in Timonium, MD, and the week of September 11-15 in Miami, FL.

- This committee is continuing to assemble a draft standard for harnessing requirements.
- Joint effort between NASA, IPC, and the Wire Harness Manufacturer’s Association (WHMA).
- The first delivery will be an acceptance document similar to IPC-A-610, to be followed closely by a process standard.
- Next meetings are June 22-23 in Timonium, MD, and the week of September 11-15 in Miami, FL.

- Status of Voluntary Consensus Standards

- June 6-8, 2000

## IPC-3710/3711; Crimp, Cables & Harnesses
First review draft is hoped to be released by September, 2000, after the Miami meetings.
Committee continues to be very receptive to NASA input.
Probably 2 years before construction of both documents is complete and approval is received from IPC and WHMA membership, so a revision to the NASA standard, based on comments from this meeting, is recommended to go forth.

- First review draft is hoped to be released by September, 2000, after the Miami meetings.
- Committee continues to be very receptive to NASA input.
- Probably 2 years before construction of both documents is complete and approval is received from IPC and WHMA membership, so a revision to the NASA standard, based on comments from this meeting, is recommended to go forth.

- Status of Voluntary Consensus Standards

- June 6-8, 2000

## ESD Association S20.20; ESD Control
Released in the fall of 1999 (with ANSI approval).
Issues to consider as we discuss whether or not adoption will be unconditional or supplemented:
Audits will, for the most part, have to be conducted against internal supplier procedures rather than a control standard.  This isn’t necessarily a bad thing, but will require auditors to “recalibrate” themselves.
The standard requires a verification schedule, but does not define intervals.
Recommends, not requires, some action when humidity drops below 30%.

- Released in the fall of 1999 (with ANSI approval).
- Issues to consider as we discuss whether or not adoption will be unconditional or supplemented:
- Audits will, for the most part, have to be conducted against internal supplier procedures rather than a control standard.  This isn’t necessarily a bad thing, but will require auditors to “recalibrate” themselves.
- The standard requires a verification schedule, but does not define intervals.
- Recommends, not requires, some action when humidity drops below 30%.

- Status of Voluntary Consensus Standards

- June 6-8, 2000

## IPC 7711/7721; Rework, Repair & Modification
NASA was represented on the committee overseeing the development of the course materials and methods for the IPC-sanctioned certification course developed for these standards.
NASA was also asked to be a member of the IPC Rework and Repair Program Management Committee that identified training requirements (e.g., course length, retraining requirements, maximum number of students, etc.).

- NASA was represented on the committee overseeing the development of the course materials and methods for the IPC-sanctioned certification course developed for these standards.
- NASA was also asked to be a member of the IPC Rework and Repair Program Management Committee that identified training requirements (e.g., course length, retraining requirements, maximum number of students, etc.).

- Status of Voluntary Consensus Standards

- June 6-8, 2000

## IPC 7711/7721; Rework, Repair & Modification
The MTTC, Eastern Region, has had an instructor trained as an “IPC Registered Instructor” for these standards and plans to offer the course late 2000.
Will use the IPC methods appropriate for flight hardware.
Will use NASA end-item workmanship requirements.
Can only teach operators or inspectors.  IPC training programs have Master instructors (Level A) and Registered instructors (Level B without “same company” restriction).

- The MTTC, Eastern Region, has had an instructor trained as an “IPC Registered Instructor” for these standards and plans to offer the course late 2000.
- Will use the IPC methods appropriate for flight hardware.
- Will use NASA end-item workmanship requirements.
- Can only teach operators or inspectors.  IPC training programs have Master instructors (Level A) and Registered instructors (Level B without “same company” restriction).

- Status of Voluntary Consensus Standards

- June 6-8, 2000

## IPC 6000 series; Printed Wiring Boards
These IPC committees are very active.
NASA is not represented as much as we probably should be regarding this series of standards.
We should look at IPC-2222, Sectional Design Standard for Flexible Printed Circuits, and IPC-6013, Qualification and Performance Specification for Flexible Printed Circuits, before we spend much time developing a new section for our CCH standard as has been proposed.

- These IPC committees are very active.
- NASA is not represented as much as we probably should be regarding this series of standards.
- We should look at IPC-2222, Sectional Design Standard for Flexible Printed Circuits, and IPC-6013, Qualification and Performance Specification for Flexible Printed Circuits, before we spend much time developing a new section for our CCH standard as has been proposed.

- Status of Voluntary Consensus Standards

- June 6-8, 2000

## “...Currently, no concrete answers and drop-in replacements are available.  One thing is certain, though - the coming wave of lead-free pressures is inevitable.”
Chris Jorgensen, IPC
Circuits Assembly Magazine, 4/2000

*Chris Jorgensen, IPC*
*Circuits Assembly Magazine, 4/2000*

- Lead Free Solder Discussion

- June 6-8, 2000

## According to www.leadfree.org, which is maintained by the IPC:
The Japanese government has no plans for a ban, but is requiring recycling.  However, there are Japanese industry initiatives to eliminate lead.
The next draft of Europe’s Waste Electrical and Electronics Environment (WEEE) Directive moves Europe’s deadline for a ban for leaded solders from 2004 to 2008.

- The Japanese government has no plans for a ban, but is requiring recycling.  However, there are Japanese industry initiatives to eliminate lead.
- The next draft of Europe’s Waste Electrical and Electronics Environment (WEEE) Directive moves Europe’s deadline for a ban for leaded solders from 2004 to 2008.

- Lead Free Solder Discussion

- June 6-8, 2000

## Lead Free Solder Discussion

- Some Of The Issues:
- Most leading candidate alloys require higher processing temperatures:
- Can we count on our suppliers to do the reengineering that will be necessary to automated processes?
- Will our hand soldered PWB’s and parts withstand the greater thermal shock?
- Will there be a “patented alloy” trap similar to the solvents industry (i.e., once we qualify an alloy, will the company stop making it in order to market something “new and improved”)?

- June 6-8, 2000