# Presentation: 705901

## New Technology (Current and Future Challenges) 

**Larry Harzstark**
**Associate Director, PMP Dept**
**(310) 336-5883**
**01-30-07**

**1**

## Agenda Topics

**Background**
**New Technology Insertion Guidelines**
**Objectives of Guideline**
**New Technology Approach**
**Emerging Technologies**
**Background**
**Emerging Technology Concerns**
**Overview of Supplier Status**
**Emerging Technology Conclusions**
**Summary**

**2**

## Background

**Under the leadership of former Defense Secretary William Perry, the Department of Defense, starting in 1991, initiated fundamental changes to systems development and acquisition practices. **
**As part of this transformation, the DoD abandoned a large number of military standards in favor of contractor-defined systems, standards and approaches. **
**The revised Acquisition Policy enabled program managers to “allow contractors the flexibility to define and use their preferred quality management process that meets program objectives.” **
**Systems manufacturers have since evaluated the best part available and determined through a self-defined series of tests and analyses that a specific device is acceptable and meets system performance and reliability requirements.**

**3**

## Background

**However, based on discovery of a number of recent serious problems experienced in new space system technologies, which have had a critical impact upon launch schedules as well as on-orbit performance, it has been determined that a more stringent approach to parts, materials and processes (PMP) is warranted. **
**Therefore, a review of the space level requirements for utilization was begun.**
**A document was created to provide a set of guidelines to enable the appropriate insertion of new technologies.**

**4**

## Objectives of Guidelines

**Document does not provide specific requirements for a technology **
**Document does provide a set of guidelines to enable the appropriate insertion of new PMP technologies into space flight hardware**
**PMP that have not been qualified for application within the specific space environment**
**PMP that have undergone any changes that may alter the performance and/or functionality or reliability within the space environment**
**Document is oriented to encompass all types of missions/programs from experimental satellites to launch vehicles to strategic satellites**
**Provides guidance to program managers to understand the total magnitude and effort required**
**Provides information to designers and New Technology Insertion Boards to ensure all necessary areas of concern are evaluated**
**Provides government, contractors and suppliers a flowdown of contractually required information to be implemented **

**2**

**5**

## New Technology Approach

**Requires the development of a plan and procedures defining the methodology and approach**
**Definition of new technology**
**Criteria for determination of new technology**
**Establishment of a New Technology Insertion Board**
**Membership**
**Roles & Responsibilities**
**Approval process for new technology**
**Configuration control**

**6**

## New Technology Approach

**New Technology Evaluation**
**Characterization**
**All aspects of the technology must be evaluated **
**Process is well controlled – SPC**
**Reliability – long term**
**Radiation**
**Overall parametric performance is well defined including margins**
**Physics of Failure analysis including electrical, mechanical, thermal and chemical properties that could contribute to root cause failures throughout the product life cycle  **
**Process and performance margins and their sensitivities**
**Process trending**
**Yield enhancement**
**Failure Modes Effects Analysis to consider each mode of failure to ascertain the effects on device operation and reliability of each failure mode**
**Process/test optimization**
**Other tests based on information determined from the supplier’s data and/or system application requirements**

**7**

## New Technology Approach

**Qualification**
**Validation that all the previous characterization testing and evaluations of failure mechanisms shows the technology meets and exceeds quantifiable, specific, unambiguous and stringent requirements for space applications**
**Includes three categories**
**Manufacturing line qualification**
**Technology qualification**
**Product qualification**
**Approach**
**Cookbook approach is not recommended**
**Utilize standard military specification tests**
**Include additional tests as defined by the physics of failure analysis, Failure Modes Effects Analysis, Characterization tests and system level and mission requirements**
**New test methods maybe required to be established**

**8**

## New Technology Approach

**Independent Testing**
**Defines potential for independent testing**
**Provides avenues for New Technology Insertion Board to request outside support for evaluation testing**
**Examples**
**Provides two examples of New Technology Insertion plans**
**FPGA**
**III/V Based Semiconductor Devices/MMIC**

**9**

## Emerging Technology

**10**

## Background

**Commercial technology demands are driving electronic components towards smaller and smaller feature sizes to gain market advantages from: lower power demands, less weight, higher speeds, and overall greater functionality.  **
**Simple economics force the closure of older product lines in favor of the more profitable, but highly demanding, nano-electronics (<100nm topographies) market. **
**The commercial world is leaning far over the edge in its competitive race, oftentimes abandoning traditional engineering and risk reduction practices to be the first to market.**
**Caught in this commercial “tsunami” the National Security Space Community finds itself outside industry’s strategic investment portfolios—unique environmental requirements continue to drive the need for highly reliable electronic devices.  **

**11**

## Background

**National Security Space Systems (NSSS) rely heavily on the embedded electronic circuits and sensors.  The requirements for **_**space-qualified**_** electronics are more stringent than for other military applications.  For the past several years, the Department of Defense has experienced serious constraints in the availability of suitable electronics.  This situation is most severe for space-qualified NSSS electronic components.**
**The government is concerned about future technologies being developed by commercial markets and whether the suppliers/space community have the capabilities and understanding for insertion into high reliability space applications**
**NSS requested that a study be initiated to evaluate ****whether the U.S. (e.g. Government, industry and academia) is appropriately postured to meet challenges associated with the design, development, qualification, integration and testing of emerging nano-electronics (<100nm topographies) into future space programs**
**If not, provide a prioritized set of recommendations to ensure that the U.S. space program will be able to derive the maximum benefit from these technologies**** **

**12**

## Emerging Technology Concerns

**Qualification of technology, materials and processes is generally bounded by certain limitations, application environments, operating conditions and requirements.**
**Current infrastructure barely postured to deal with current generation of technologies **
**Heterojunction Bipolar Transistor**
**FPGA 250 nm**
**ASICs (350 nm)**
**Improvements badly needed, but hugely expensive – $100’s of millions **
**Domestic versus off-shore solutions**
**In 2000, 24% of the world’s leading-edge semiconductors were produced in the U.S.—2004 saw this percentage drop to 22%.  **
**Establishment of pure play foundries located in China, Singapore and Taiwan that have been overwhelmingly successful.  Making up the industry’s “Big 4” (TSMC, UMC Group, Chartered, and SMIC) the Taiwanese companies alone forecast sales by 2030 to reach $10 trillion for nano-electronics markets with $3 trillion for the semiconductor market, or 3% of the gross world product.  **
**The U.S. has clearly lost the market lead in this vital industry.    **

**13**

## Emerging Technology Concerns

**The influence of a global market environment cannot be ignored in the manufacturing world of nano-electronics.**
**The U.S. must deal with international competition from across all aspects of development of nanotechnologies in general from research to production.  **
**As a sector, nanotechnology has a high growth potential but low industry maturity level with only 9% of start-up companies having been successful.  **

**14**

## Overview of Supplier Status

**In a survey of the industrial supplier base (both commercial and space), it was learned that all of them are heavily involved in developing technologies and geometries of less than 100 nm, with some already offering products in the 45, 65 and 90 nm regime.  **
**The suppliers are performing characterization to understand materials and impacts, lithography requirements, cleaning and contamination control, inspection equipment requirements, advanced interconnect solutions, etc. **
**The understanding of the technologies will drive their qualification methodologies.**
**Some areas of concern that have been identified are: **
**Wafer cleaning - more stringent requirements for cleanliness  **
**Potential plasma damage**
**New methods and chemistries to safely clean porous low-k materials without turning them back into high-k materials**
**Optical wafer inspection**
** ****Metallization**
** ****Testing**
** ****Design**
** **

**Unfortunately, none of the commercial suppliers are performing the evaluations/characterizations and qualifications necessary to insert these new technologies in a space environment. **

## Emerging Technology Conclusions

**Nano-electronics will be a major factor in the 2010-2015 timeframe**
** **
**• ****Radiation tolerant devices for space applications will become an ever decreasing niche business**
**• ****Majority of Government, academia and industry are not focusing on space applications**
**• ****Terrestrial applications dominate**
**	****	****• ****Communications and networks**
**	****	****• ****Computer processors and data storage**
**	****	****• ****Bio-medical advances**
**• ****National security needs will require massive nano-electronics integration into future programs (20% of the parts-80% of costs)**
**• ****Performance (greater speed and power density, smaller size, lighter weight, etc.) **
**• ****New packaging, new materials, new integration concepts**
**	****	****• ****Existing models of behavior largely invalid**
**• ****Failure rates are being evaluated in a different manner**
**• ****New testing methods will be required**
**• ****Require significant enhancements to our basic knowledge of the physics and chemistry of failure and operation**
**	****	**

**16**

## Emerging Technology Conclusions

**In order for the government to have confidence that all new technology items have been assessed prior to implementation in a program, the contractor/subcontractor in conjunction with the parts manufacturer must develop procedures defining the methodology and process to be used for the implementation of new technology insertion.**
** **

**17**

## Summary

**Based on problems encountered, a New Technology Guidelines document was developed to:**
**enable the appropriate insertion of new technologies**
**intended to provide guidance **
**Emerging nano-electronic technologies (<100 nm geometries) are posing concerns for the future for the National Security Space Systems and require extensive characterization and qualification in order to be utilized**
**Commercial industry not performing these tests/evaluations **

**18**