# Presentation: 668309

## Layer 0 Module Production

- Outline:
- Introduction
- Parts/Procedures
- Module assembly overview
- Potential problems
- Schedule
- Summary

- Production Readiness Review
- B. Gonzalez (FNAL), D. Tsybychev(Stony Brook)

- Dmitri Tsybychev Stony Brook

## Introduction

- Layer 0 detector consists of modules of 8 types
- Sensor Type           Analog Cable Length (top/bottom)
-      71(81) m 70 mm                       346/348 mm
-      71(81) m 70 mm                       320/322 mm
-      71(81) m 120 mm                     244/246 mm
- 	 71(81) m 120 mm                     167/170 mm
- Need 48 modules ( 6 of each type)
- Strategy: built 8 modules of each type (64 total)
- Select 6 best modules for Layer 0 detector

- top cable

- bottom cable

- bonds

- kapton wrap circuit

- spacers

- Dmitri Tsybychev Stony Brook

## Parts

- Sensors, analog cables, pitch adapters, wrap circuits are on hand
- Information about parts is stored in database
- Hybrids are produced at NXGen (California)
- Tested at CSU at Fresno  Burn-in tests at KU  Fermilab
- Quick functionality test at Fermilab  12-hour burn in test
- Encapsulation of bonding area on back-end of SVX4 chip
- 24-hour burn in test
- Only perfect hybrids will go into production
- Hybrid, sensor, analog cables necessary for particular module production identified and entered in database
- Module traveler produced based on database record
- Keep module history
- Hybrid traveler is included
- Keep for future reference

- Dmitri Tsybychev Stony Brook

## Production Sequence

- Select parts according to traveler
- Module assembly
- Initial functionality test
- 72-hour burn in test
- Production sequence, assembly and testing procedures were successfully prototyped on 10 Layer 0 modules

- See A. Zieminski talk for testing procedure /sequence

- Dmitri Tsybychev Stony Brook

## Assembly Overview

- Sensor and spacer are glued to kapton wrap-around circuit; Spacers are glued to top cable
- Bottom cable is glued to hybrid and pitch adapter
- SVX chip is wire bonded to the bottom cable
- Top cable is glued to bottom cable. Wrapping of sensor is completed
- Pitch adapter is glued to the sensor
- Cables are wire bonded to the pitch adapter and SVX chip
- Sensor is bonded to pitch adapter

- Day 1

- Day 2

- Day 3

- Day 4

## Top cable fixtureBottom cable fixture

- Place top and bottom cables in fixtures
- Place PA and hybrid; align both
- Glue spacers to top cable
- Mask pitch adapter
- Glue bottom cable to PA and hybrid

- Stage 1,2

- Day 1

- Stage 1,2

- Hybrid

- Pitch adapter

- Mask bonding area of top and bottom cables

- Dmitri Tsybychev Stony Brook

## Sensor lamination fixture

- Sensor and spacer glued onto circuit

- Stage 1

- Stage 1

- Sensor

- Spacer

- Day 1

- Top cable and sensor
- can be prepared in
- separate procedure before
- module production

- Dmitri Tsybychev Stony Brook

## Masks are removed from all components
Bottom cable wire bonded to SVX
Add mesh spacer between top and bottom cables 
Glue top cable to bottom cable

- Bottom cable wire bonded to SVX
- Add mesh spacer between top and bottom cables
- Glue top cable to bottom cable

- Stage 4

- Stage 4

- Day 2

- Cut out kapton circuit

- Dmitri Tsybychev Stony Brook

## Wrap around kapton circuit, glue it to sensor

-  At this point new set of modules can be started using cable and sensor fixtures from day 1 and 2

- Stage 4

- Stage 4

- Day 2

- HV pad

- Gnd pad

- Dmitri Tsybychev Stony Brook

## Module Assembly Day 3,4

- Analog cable is glued to sensor
- Wire bonding finished:
- Top and bottom cables bonded to pitch adapter
- Top cable bonded to SVX
- Pitch adapter bonded to sensor
- Assembled module placed in testing box
- Ground with copper finger to box on hybrid only
- Digital jumper cable (pretested) attached
- Module ready for testing

- Stage 5

- Dmitri Tsybychev Stony Brook

## Bonding issues

- Had some problems with wire bonding in first prototype module (Module 121)
- Many shorted bonds
- Identified appropriate settings, alignment of the bonding machine
- 1478 bonding machine was used
- Use bonding machine 8090 for subsequent modules

- Dmitri Tsybychev Stony Brook

## Bonding issues

- Shorted bonds

- Dmitri Tsybychev Stony Brook

## Bonding issues

- Only minor problems with consecutive prototype modules
- 2-4 shorted channel (usually last 2 channels)
- Still there are several disconnected bonds after first pass
- Were observed in all bonding areas (cable to SVX, cable to pitch adapter, pitch adapter to sensor)
- Maximum 14 open channels
- 3 disconnected bonds after second pass in 1 module out of 9 prototype modules
- After each bonding pass bonds will be visually inspected
- Check for shorts
- Disconnected channels recorded in bonding report for future reference
- Used in testing to identify problematic channels

- Dmitri Tsybychev Stony Brook

## L0 Module prototypes

- Successfully build 10 prototype modules
- Have at least 1 of each type
- Developed handling and assembly procedures
- Tested performance
- Identified selection criteria for production modules

- See A. Zieminski talk for testing procedures /sequence

- Dmitri Tsybychev Stony Brook

## Potential assembly problems

- Module assembly takes 4 days
- Some problems can be identified only after electrical tests
- Damage to cable traces and bonding area during masking, cable placement on substructure
- Damage to SVX chip during cable assembly, bonding
- Damage to sensor during lamination, bonding
- Physical
- Due to static charge
- Misalignment of pitch adapter, cable, hybrid and sensor due to glue migration
- Proper personnel training
- Written procedures, documentation
- Necessary tooling
- Proper personnel and equipment grounding
- Extra attention to details, reasonable pace

- Dmitri Tsybychev Stony Brook

## Assembly fixtures

-   Type                     Stage  Qnt. needed  Remarks
-    Top cable placement          1               2(4)             Modify hybrid end
-     Hybrid placement fixture    2               2(4)             Corrected step
-      (bottom cable placement)
-     71 m sensor lamination    1              1(2)
-     81 m sensor lamination    1              2(2)
-     Fixture for wrapping      4               0(4)          Preliminary drawing exist
-     Hybrid, cable, pitch        5              0(4)          Preliminary drawing exist
-     adapter placement
-     Bonding fixture              3,6,7        0(1)           Preliminary drawing exist
-                         Became apparent during preproduction
-                         Reduce handling of the modules
-                         Simplify alignment, assembly

- Dmitri Tsybychev Stony Brook

## Schedule

- Can build 4 modules per week
- Schedule is conservative
- Will take 16 weeks to build 64 modules
- Production can be boosted to 8 modules per week
- Need additional fixtures
- Need to fix CMM machines

- Dmitri Tsybychev Stony Brook

## Schedule

- Dmitri Tsybychev Stony Brook

## Quality assurance and control

- Ensure module quality through rigorous tests program for assembled modules
- Testing procedures are finalized based on prototype modules
- Feed back to assembly in 4 days after first electrical tests
- Stop production if any systematic errors occur
- Understand problems
- Reevaluate assembly procedures
- Restart production after review

- Dmitri Tsybychev Stony Brook

## Documentation

- Layer 0 module production readiness review web page:
- _[http://d0server1.fnal.gov/projects/run2b/Silicon/www](http://d0server1.fnal.gov/projects/run2b/Silicon/www/smt2b/Documentation/Reviews/L0_module_PRR.htm)_
- _[/smt2b/Documentation/Reviews/L0_module_PRR.](http://d0server1.fnal.gov/projects/run2b/Silicon/www/smt2b/Documentation/Reviews/L0_module_PRR.htm)__[htm](http://d0server1.fnal.gov/projects/run2b/Silicon/www/smt2b/Documentation/Reviews/L0_module_PRR.htm)_
- Relevant documentation linked from this page
- Module QA/QC procedure document
- Created Layer 0 module and parts database
- Produce travelers based on DB records
- Keep information in travelers and hybrid/module testing web page

- Dmitri Tsybychev Stony Brook

## Summary

- Have 10 Layer 0 module prototypes
- Developed assembly procedures
- Developed testing procedures
- Documented assembly testing procedures
- Personnel: M.Hrycyk, B. Gonzalez, T. Hawke
- Ready for production

- Dmitri Tsybychev Stony Brook