# Presentation: 493781

## M. Garcia-Sciveres
LBNL

**LBNL**

**&****Module Assembly**WBS 1.1.1.5

** ****Hybrids**WBS 1.1.1.4

- M. Garcia-Sciveres - US ATLAS DOE/NSF Review

- March 20, 2001

## The Pixel Module

**Schematic Cross Section**

- (through here)

**Bumps**

**Flex Hybrid**

**Sensor**

**Wirebonds**

**ASICs**

**The Pixel Module**

- All modules are identical (barrel and disks)
- “Pigtails” of different varieties are attached in assembly depending on use location

- M. Garcia-Sciveres - US ATLAS DOE/NSF Review

- March 20, 2001

## Module Production

| COMPONENTS | US RESPONSIBILITY | INSTITUTIONS |
| --- | --- | --- |
| Bumped  8”  FE Wafers  | Probe  
Thin and Dice | LBNL |
| Sensors | Probe | New Mexico, Oklahoma |
| Bare modules | Probe (no flip-chip in US)  | LBNL |
| Flex Hybrids | Fabricate   Component load & Test  Load MCC chip & test | OklahomaOklahoma, AlbanyOklahoma, Albany |
| Full Modules | Assemble, Wirebond, Test, Burn-In | LBNLTBD  |
| Disk Pigtails | Fabricate, Test, Assemble | LBNL  |

- M. Garcia-Sciveres - US ATLAS DOE/NSF Review

- March 20, 2001

## Flowchart

- Support frame w/ flex hybrid

- No test tail.Glue and bond pigtail

- Remove from frame

- M. Garcia-Sciveres - US ATLAS DOE/NSF Review

- March 20, 2001

## 1.1.1.4 & 1.1.1.5 Schedule Summary

- M. Garcia-Sciveres - US ATLAS DOE/NSF Review

- March 20, 2001

## Flex Hybrids

- Development has so far gone through **two design cycles**
- Version **1.x**  (x=0,1,3,4)
- 80 Fabricated by CERN and Compunetics between 1998 and 1999.
- Used to make “proof of principle” working modules with rad-soft electronics
- Version **2.x**  (x=1,2)
- 150 Fabricated by CERN and Compunetics in 2000
- Detailed performance characterization & system tests have not been possible due to lack of rad-hard electronics
- Used to debug manufacturing & assembly process & to investigate mass production issues.
**F**inal **D**esign **R**eview during December ’00 Pixel Week
- “Early” in design terms to derive max. technical benefit

- M. Garcia-Sciveres - US ATLAS DOE/NSF Review

- March 20, 2001

## Flex Hybrids (continued)

- Goals for Version 3 Flex design (in progress):
**Qualify more vendors**
- Increasing ease of manufacture through interaction with designs of new FE chip and services.
** ****Test bed for first IBM FE chip run (FE-I) – to submit July 01**
- Accelerating design cycle and avoiding un-proven features so hybrids will be ready ahead of FE-I delivery
- Making compatible with existing (obsolete) controller chip
**Compatible with mass assembly, testing, and handling**
- Apply lessons learned from V2.x prototypes
**Address system integration**** **
- Work closely with parallel development of service connections
- Preliminary layout to be ready for bidding in April
- Expected fabrication June-Aug. 2001.

- M. Garcia-Sciveres - US ATLAS DOE/NSF Review

- March 20, 2001

## WBS 1.1.1.4 Funding Profile

**WBS 1.1.1.4 Funding Profile**

- M. Garcia-Sciveres - US ATLAS DOE/NSF Review

- March 20, 2001

## Carrier Frame

- New development for Flex V.3
- Needed for reliable mass production, handling, & shipping of hybrids & modules
- Based on module assembly and test experience with Flex V.2

- M. Garcia-Sciveres - US ATLAS DOE/NSF Review

- March 20, 2001

## Pre-Production Module Work

**Pre-Production Module Work**

**Validate Design**

**Debug Production Process**

- Electrical

- Envelope

- Assembly

- Handling

- Test

**Parts Used**

**“****Hot” Modules**

- Mechanical Dummies

- Mechanical Dummies

- Mechanical Dummies

- M. Garcia-Sciveres - US ATLAS DOE/NSF Review

- March 20, 2001

## Modules Produced To Date in FY01

- 23 Mechanical Dummies
- 1 Hot Module (limited by FE chip availability)
- All Use Version 2 Flex Hybrid
- Built by Operators on Version 1 Production Tooling following assembly line procedures

- M. Garcia-Sciveres - US ATLAS DOE/NSF Review

- March 20, 2001

## Mechanical Dummy Results

**1000 pulled bonds**

**1000  PULLED BONDS**

- Assembly tooling works
- Automatic wirebonding is feasible
- Adhesion and uniformity need improvement for production => better metalization
- Hybrids are fragile => need frame to control handling

- M. Garcia-Sciveres - US ATLAS DOE/NSF Review

- March 20, 2001

## FY01 “Hot” Module Results

- Full digital funtionality
- Excessive IR drops => need better metalization
- Analog performance needs more study. 150e- noise achieved but dependence on supply voltages not understood.
- Flex Circuitry is fragile => No tabs or soldered pigtail. Use Frame for test connections.

- M. Garcia-Sciveres - US ATLAS DOE/NSF Review

- March 20, 2001

## Global Summary of Hot Module Tests

- First full modules operated in 1998
- Rad-soft FE chips
- Assemblies bump-bonded by Boeing
- Version 1 Flex hybrid on support card
- Full digital functionality. Some coherent noise issues.
- Hot modules with various bump technology and sensor combinations tested in 1999
- Still Rad-soft electronics
- “Ideal” analog performance achieved
- Many assembly problems identified
- In 2000 fewer hot modules built due to lack of FE chips
- Aim of electrical test is to validate assembly and hybrids
- To do once FE-I chips are available
- Reproduce “ideal” performance with new chips and new flex hybrids
- Move on to multi-module system tests

- M. Garcia-Sciveres - US ATLAS DOE/NSF Review

- March 20, 2001

## “Ideal” Module Performance

**Threshold ******** = 139e****-**

**ENC = 138e****-**

- M. Garcia-Sciveres - US ATLAS DOE/NSF Review

- March 20, 2001

##  Mechanical Dummy Program 

- The 23 FY01 modules have no bumps- FE chips are glued to blank silicon
- Fabrication of  8” FE chip dummy wafers and 4” sensor dummies is under way – Expected delivery Apr. 5
- Enough parts for 300 bump-bonded dummies to test:
- Thinning of bumped 8” wafers
- Rate capability of flip-chip vendors
- Electrical continuity of bumps through module assembly
- Uniformity and rate of production line module assembly
- Will use remaining V.2 flex and assemble modules with V.3 flex ahead of FE-I delivery.
- Assembly period Jun. – Nov. 2001

- M. Garcia-Sciveres - US ATLAS DOE/NSF Review

- March 20, 2001

## WBS 1.1.1.5 Funding Profile

- M. Garcia-Sciveres - US ATLAS DOE/NSF Review

- March 20, 2001

## Optical Hybrids

**Optical Hybrids**

- 2cm

- Optic fibers

- OSU Optical Package (6 per hybrid)

- OSU Optical Hybrid Prototype

- PP0 Printed
- Flex Prototype

- 2cm

- M. Garcia-Sciveres - US ATLAS DOE/NSF Review

- March 20, 2001

## Optical Hybrids (continued)

- US to produce and test optical hybrids for disks
- Parallel Hybrid development in progress at Ohio State and Wuppertal
- Parallel optical package development at Ohio State and Taiwan
- Choice of a baseline optical package scheduled for June 01
- First full hybrid p+ irradiations scheduled for April 2001
- Initial  irradiations of optical packages done in FY00

- M. Garcia-Sciveres - US ATLAS DOE/NSF Review

- March 20, 2001

## Conclsions

- Flex Hybrids on track towards production design.
- Issues being addressed: more vendors, FE-I schedule, service integration, production assembly, handling and testing.
- Module production being addressed with mechanical dummy program ahead of availability of final electronics.
- Mechanical integration and manufacturing issues should not depend on details of readout chip.
- It is understood that design choices made now are contingent on results of system tests with final electronics.
- Optical hybrids designs advancing toward baseline selection date of June 2001.

- M. Garcia-Sciveres - US ATLAS DOE/NSF Review

- March 20, 2001