# Presentation: 271262

## Forward Vertex DetectorOverview

-  Technical Design Overview
-  Design status

## Forward Vertex DetectorTechnical Design – Specifications

- Cover the Muon Spectrometer Acceptance – both Arms (10-35 deg)
- Full Azimuthal coverage – hermetic
- DCA resolution < 200 μm at 5 GeV
- ≥ 3 space points / track
- Maximum Radiation Length < 2.4%
- Survive 10 year integrated dose = 200k Rad
- Low Occupancy in Au – Au Central < 10.0%
- Co-exist with barrel VTX
- Compatible with PHENIX DAQ

## Forward Vertex DetectorTechnical Design – Mechanical

- Combined VTX + FVTX without outer enclosure

- FVTX

- “Big Wheel”
- Location for all readout
- electronics

## Forward Vertex DetectorTechnical Design – Mechanical

- 4 hermetic disks, z=18.5 – 38 cm
- 48 wedge segments per disk ( 7.5 deg)
- Inner disk radius = 3.5 cm (4.5 cm active)
- Outer disk radius = 17 cm
- 75 micron strips, 550,000 strips/endcap
- Total power load of disks = 50 W each
- Power load of Readout cards= 450 W in big wheel
- Room temperature operation

- Each Endcap

## Forward Vertex DetectorTechnical Design – Mechanical

- Mechanical Integration with the Barrel VTX

- Fully integrated model

## Forward Vertex DetectorTechnical Design – Wedge

- Backplane (0.76mm graphite fiber composite)

- Screw (nylon)

- Pin hole
- (for alignment)

- Pin hole (for alignment)

- HDI

- Connectors for extension cables

- Detector

- FPIX Chips (26, 13 ea. side)

- Screw (nylon)

- All bonded with rigid epoxies

## Forward Vertex Detector FVTX Sensor

**Mini-strips are oriented to approximate an arc**

**Forward Vertex Detector**** ****FVTX Sensor**

- Sensor
-  2 columns of strips
-  1664 strips per column
-  strip length 2.8 to 11.2 mm
-  75 μm spacing
-  48 wedges per disk (7.5 ̊/sensor, ~15 ̊/wedge)
-  0.5 mm overlap with adjacent wedges
- FPHX Chip
-  1 column readout
-  128 channels
-  ~ 70 μm channel spacing
-  Dimensions –9mm x 1.2 mm

## Sensor layoutR&D prototyping design

**Sensor layout****R&D prototyping design**

- Zoom in ...

**one FPHX chip**

- testing pads
- (both staged)

- bonding pads

- Guard ring

- Dicing edge

- Vaclav Vrba, Prague

**Thickness ****	****	****300 μm**
**Doping of starting material****	****n type**
**Resistivity****	****	****2-5 K********-cm**
**Wafer diameter****	****	****6 “ preferred**
**Passivation****	****	****SiO or SiN**

## SensorR&D A real prototype 

- Vaclav Vrba, Prague

## Forward Vertex Detector HDI-High Density Interconnect

- HDI trace count
- 2 R/O lines x LVDS pair x 26 chips       104
- 4 Download and Reset lines                    	 4
- 2 Clocks x LVDS pair		 4
- 1 Calibration line		_	__ 1_
- 			                **113**
**                                                          **

**Forward Vertex Detector**** ****HDI-High Density Interconnect**

- High Density Interconnect (HDI) – kapton flat cable to transfer data from the chip to the read-out electronics
- 176 μm thick
- 4 copper planes (ground, power, 2ea signal), 5 Kapton films, 8 glue layers

- HDI

- glue

- glue

- glue

- glue

- glue

- glue

- glue

- glue

- kapton

- kapton

- kapton

- kapton

- kapton

## Wedge R&D Analysis Temperature & Stress

- Max deflection
- 10.4μm

- Zero deflection (boundary conditions)

**Wedge R&D Analysis**** ****Temperature**** & Stress**

**3-D Temperature Contour**

- Max To = 20.3oC
- Warmest ROC

- Min To = 15oC

- Warmest FPHX Chip is 5.3oC Warmer than Back Edge of Backplane

**3-D Distortion Contour**

## Forward Vertex Detector Half-Disk Assembly: Details

## Disk-Level R&D Modeling Thermal distortion

- Fundamental vibration mode: 164 Hz

- Distortion due to cooling

## Half Cage Assembly

**Half Cage Assembly**

- Z

- Y

- Al Honeycomb core, C face sheets

## Liquid Cooling CircuitR&D

**Liquid Cooling Circuit****R&D**

- FVTX Inlet: 10°C, ~5 psig

- station 4: ~20.6°C

- Outlet plane 4: 10.3°C

- FVTX Outlet: 11.1°C, ~3 psig

- station 3: ~20.9°C

- station 2: ~21.2°C

- Outlet plane 3: 10.6°C

- Outlet plane 2: 10.9°C

- Warmest Chip, station 1: ~21.4°C

## Half Cage AssemblyR&D

- Gravity Sag (Max = 3.2μm)

- Drum mode shape (f=137.7 Hz)

## VTX+FVTXFinite Element Model R&D

- First Mode: 38Hz

## Assembly

## Disk Detail

## VTX – FVTX IntegrationThe need began 2 years agoBut we found this 2 months ago

- Interference!