# Presentation: 689210

## CAM-I Scalable Flexible Manufacturing Initiative

- NGMS Task 6.1

## Vision

- Our vision is E-manufacturing where we have
- Seamless, scalable and robust evolution of products from design to manufacturing (and possibly to delivery and service)
- Computer tools (such as simulators, rule-bases, visualizing environments) to rapidly plan, validate and deploy manufacturing instructions
- Flexible manufacturing systems for simultaneous production of multiple products and minimum system change over

## Broad Goals

- Manufacturing evaluation and deployment of emerging standards (STEP 203 and 210, possibly 220)
- Development of environments for manufacturability analysis of designs
- Manufacturing process planning and simulation environments
- Simulation and control for flexible manufacturing of board assemblies

## Immediate Goals

- Implementation of visualization and translation tools for STEP AP210 (Generate 3-D models of assembly from AP210 descriptions)
- Computer implementation of Rockwell’s DFM rule base to function with AP210 description of boards
- Simulators for placement processes and machines (HSP and GSM simulators)
- Development of capabilities to ‘virtually’ produce a board (AP210 ‘as produced’ view of board assembly)
- Generation of (HSP) machine input files from AP210 model

## Present flow

- Physical
- Constraints
- and Functions

- Design and
- Drafting

- MFG. Review
- (DFM Checks)

- Design Release

- Trial&Error
- Production

## Proposed Flow

## Virtual Environment

## Product Enclosure

- Externally
- Visible Connectors

- Printed Circuit Assemblies

- Die

- Package

- Packaged Part

- Interconnect
- Assembly

- Printed Circuit
- Substrate

- Die

## Typical 2-D design of a PCB

## PCB Manufacturing Process

## Why STEP?

- Emerging standard
- Million seats of AP-203 presently deployed
- Simulation tool to be used across manufacturing facilities and vendors
- e-manufacturing
- E-Business applications of STEP are being enabled by the STEP and W3C committees working together.

## What is STEP?

- ISO standard (ISO 10303):
- to share and exchange digital technical information
- Set of common data structures
- Application Protocols - Domain specific usage of data structures
- AP 203 (3D solid Models)

## AP210: Electronic Assembly,Interconnect and Packaging Design

**Technology**

**Physical**

-   Component Placement
-   Bare Board Design
-   Layout templates
-   Layers non-planar,
-    conductive & non-conductive
-   Material product

-  Geometrically Bounded 2-D
-   Wireframe with Topology
-   Surfaces
-   Advanced BREP Solids
-   Constructive Solid Geometry

**Part**

-   Functionality
-   Analysis Support
-   Shape 2D, 3D
-   Package
-   Material Product
-   Properties

**Configuration Mgmt**

-   Identification
-   Authority
-   Effectivity
-   Control
-   Requirement Traceability
-   Analytical Model
-   Document References

**Product Structure/**

**Connectivity**

-   Functional
-   Packaged

-   Fabrication Design Rules
-   Product Design Rules

**Requirements**

-   Design
-   Allocation
-   Constraints
-   Interface
-   Rules

-  Geometric Dimensioning 		and Tolerancing

**Geometry**

**Design Control**

## AP 210

- Several product models in electromechanical domain.
- Supports Multidisciplinary library data.
- Scope is “as required” & “as designed” product information.
- Sharing across several levels of supply base.
- Ability to Integrate with other engineering domains.
-  Ability to integrate external services coherently.

## Flow Diagram

- DFM Rule Checker

- DFM
- Rule files

- AP 210 file (3D)

- AP 210 file (2D)

- Assembly configuration file

- Placement Sequence (OPTEL)

- Visualizer
- (STEP            OIV)

- Simulator

- Design Facts

## 2D to 3D converter

- ECAD translators generate AP 210 files containing 2D Geometry
- Simulate 3D view of the assembly board
- Converter
- Input : AP 210 file (2D geometry)
- Extrudes them into solids (Advanced BREP)
- Output:
- AP 210 file (2D + 3D geometry)
- AP 203 files

## 2D to 3D converter

- Ap203 files
- Individual packages
- Board
- These files then converted into Open Inventor format
- Inventor: Graphics package used for rendering

## Typical 2-D design of a PCB

## AP-210 Viewer 

## DFM

- We are adapting a system originally developed by Boeing for use at Rockwell
- Developed on PreAMP and TIGER project.
- RDF syntax
- Inputs
- AP-210 Design File
- Rule Files
- Configuration Management

## DFM Rule Facility

- Subset of Rockwell Collins DFM rules were chosen for implementation.
- Relevant facts extracted from the AP-210 file during preprocessing.
- Rule Inference engine insulated from intricacies of STEP
- Different facilities can easily plug in their DFM modules.
- Interface to the simulator
- DFM rules which were violated
- Components which violated these rules.

## Assembly Data

- Establish an assembly usage view
- Components
- Organization by package / part family
-  Part numbers, version
- Configuration management data
- Location, orientation
- Reference Designators
- Integrated with OPTEL
- Magazine Setup
- Optimized placement sequence

## 210 / 203 translator

- Electrical Domain 	 Mechanical Domain

## Simulator

## Simulator

- Configurable
- Kinematics – accepts a mechanism graph
- Graphics – Geometric Models of machine components
- Next steps
- Machine Library
- Adding functionality
- Nozzle compatibility
- Placement timing

## Project timeline

## Work done 

- Accepting an AP210 2D design file
- Manufacturability analysis
- Extracting component information
- Generating 3D models of components and assemblies
- Simulation using Universal HSP and GSM
- Generating
- “as designed” view
-  “as simulated” view

## Work done (cont.)

- Simulation
- Double sided boards
- Multi Panel Boards
- GSM
- Multiple stage simulation
- Testing
- Update of DFM Rules
- Development of ‘Fact Extraction’ software
- AP210 Viewer
- Full 3-D assembly model of board
- Association between Graphical entities and AP210 entities
- Ability to display properties

## Future Work

- DFT
- Bare Board testing
- In-circuit test: fixtures for the test
- Manufacturing systems planning
- Generating stencils for printed circuit substrates
- Explore transition from Line concept to Cell concept
- Capacity planning and simulation
- Describing production facilities (AP-220)
- Deployment