# Presentation: 194302

##  Practical Aspects ofRoHS Compliance

**Liz Moyer**, Manager
- Environmental, Safety and Health Public Affairs
- Texas Instruments Incorporated

## TI’s Commitment to the Environment 

- TI’s Commitment to the Environment

- Active in industry standards organizations and working with legislative groups to set achievable and meaningful environmental goals
- Began removing Lead (Pb) from products more than a decade ago
**91% of planned devices already compli****ant to RoHS**
**97% of 2Q05 “units shipped” already compliant**
- Executive SLT Sponsored Program Office
- Focused on “Piece of Mind” for the Customer

**Notes:**
TI is working directly with industry organizations such as JEDEC and also with the European Commission drafting RoHS (reduction of hazardous substances) recommendations and directives that will improve the environmental impact of our industry.

TI’s internal assembly locations began removing Pb solder plate leadframe in 1990.  The vast majority of all products assembled at TI facilities have had Pb-Free leadframe finishes for many years.

SLL logic products have been assembled internally on NiPdAu leadframes for years and have been qualified for Pb-Free soldering processes at 250C

Green solutions are not yet required by legislation, but customers are already beginning to request products that meet these standards in anticipation of future legislation.  TI is well ahead of the industry in this conversion also.

## OEM Readiness & Risk

** ****Every board, component, sub-assembly and bulk material  **
**  ****must have material composition information available to **
**  ****prove compliance and support producer due diligence**
- –  OEMs and each element in their supply chain must assume liability for
-     accurate data collection, aggregation and reporting
**• ****Results of Non-Compliance**
- –  Goods impounded
- –  Loss of rights to sell into the EU (25 countries)
- –  Potential non-recoverable loss of market share
- –  Reportable material event under Sarbanes-Oxley Act Section 409
- –  Fines, media coverage, etc.

## RoHS and “Green” Products

**Awareness**

**Jan04**

**Jan05**

**Jan06**

**Jan07**

**Pilot/Ramp**

**Production**

**An OEM Perspective ...**

## How “Green” do we want to be?

**Required:**
**Lead <=1000ppm**

**Assumed:**
**250C to 260C reflow **
** ****(JESD-020B)**
** ****-  Moving to 260C **
**    ****(JESD-020C)**
**Part number? Release date?**

**Note: * Cadmium threshold per JIG is 75ppm**

**Pb-free, RoHS & Green**

**Umbrella Policies**

- How “**Green**” do we want to be?

## RoHS/Green Product Challenges

- Technical Development:
- Maintain Performance Excellence
- Eliminate Tin Whiskering
- Flow Solder Temperature Compatibility
- Old Standard Product Compatibility
- Supplier Management
- Part Number Differentiation
- Labeling
- Symbolization
- Customer Communications
- Compliance Assurance, Import/Export Requirements per jurisdiction

## Global RoHS Legislation

_**European Union**_
- RoHS/WEEE legislation.
- Exemptions proposed and being constantly revisited.

_**China**_
- Banned substances equivalent to RoHS/WEEE.
- Scope and exemptions to be finalized.

_**New Jersey, Wisconsin, Washington ...**_
_**Proposed or in work**_

- The EU is not the only region proposing Legislation:

**EU RoHS compliant **
**End-Equipment Shipments **
**are required by July 1****st****, 2006**

_**California**_
- SB20 legislation, covers recycling+fees,
- SB50 only allows RoHS-friendly products after 1/01/07.

**Notes:**
- RoHS came from the EU but most OEMs are taking a WW Product transition approach.
- Generally confusing legislation, more so for the OEMs than Semiconductor suppliers.
- Other regions appear to be pursuing RoHS-like approaches, exemptions may not align.
- OEMS appear to be targeting 2H05 RoHS compliant product launches.

## Components from Many Suppliers Share One Circuit Board, One Flow Solder Process

## Getting the Lead (Pb) Out

**Ball Grid Array (BGA) Parts**

**Leadframe Based Parts**

_**iNEMI –**__ __Recommendations on Lead-Free Finishes for Components Used in High-Reliability Products (May2005)_
- Recommendation#1 – “Use a Non-tin plating: Nickel-Palladium-Gold should be strongly considered for 			lead-frame applications.”

_**Common Pb-Free Solutions ...**_
**1) Nickel-Palladium-Gold Plating**
**2) Tin Plating ****(risk of “Tin Whiskers”)**** **

_**Industry Standard Pb-Free Solution ...**_
**1) Tin-Silver-Copper Alloy Solder Balls**

## Part Numbering, Leadframe Parts

- SnPb Leadframe

- SnPb Board Process (Low-Temp)

-  TI’s primary Pb-Free solution is Nickel-Palladium-Gold (NiPdAu).
-  TI’s Pb-Free leadframe products _are backward compatible_ with SnPb processes.
-  A Pb-Free PN will be added using JEDEC/IPC based Pb-Free codes.
-  Both the Standard PN & the Pb-Free PN will be orderable part numbers.

- _G4_

**Converted**

- NiPdAu Leadframe

- Pb-Free Board Process (High-Temp)

**Notes:**
So most converted leadframe parts will get a “G4” type Alias PN similar to the BGAs getting a Z-type Pb-Free PN.

## Part Numbering, BGAs

- SnPb Solder Balls

- SnAgCu Solder Balls

- SnPb Board Process (Low-Temp)

- Pb-Free Board Process (High-Temp)

-  BGA Parts are _not interchangeable_, so two part numbers are required.
-  Support for both versions will be driven by customer/market demand.
-  New part numbers substitute a “Z” into the package suffix (Gxx  Zxx, YEx  YZx).

- * not actual color

- Bad Solder Joints

**Notes:**
- Can’t use SnPb Solder Balls on a Pb-Free Board - it would no longer be a Pb-Free board.
- Can’t use SnAgCu solder balls in a low-temp SnPb board process – SnAgCu solder balls need a high-temp process for good solder joints. 

## Symbolization Strategy

| JEDEC/IPC Finish Categories
(JESD97, IPC-1066) | JEDEC/IPC Pb-Free*
Marking Standard | TI-Green*
Marking Standard |
| --- | --- | --- |
| SnAgCu (BGA solder balls) | E1 | G1 |
| Precious Metals (No Tin) -
Ag, Au, NiPd, NiPdAu | E4 | G4 |

- *JESD97 only requires Pb < 1000ppm, TI will only use these markings when parts meet our Pb-Free & Green definitions. (TI “Pb-Free” = RoHS & High-Temp compatible, TI “Green” = TI “Pb-Free” and no Sb/Br)
- Some TI parts (<3%) will use E3 (Matte Tin) or E6 (Tin-Bismuth).

-  Parts will be marked with the following 2-character codes,
-    space permitting. (~98% of devices are OK, pkg size must be > 3.5mm X 3.5mm )
-  This added symbolization may lag the Conversion Date Code
-    by 1-2 months due to WIP issues.

## TI Box Labeling

-  Outer Box Shipping Labels will display the _ordered_ part number (Pb-Free PN or Std PN) and will also contain the PB-Free logo and Pb-Free/Green Finish Code.

-   Comparing the Assembly Site & Date Code to the Search Tool info _will always identify “Pb-Free” parts_.
- ( The initial Pb-Free shipments of a part might not have the Logo & Finish Code on the label. )

- MSL
- Caution
- Label

**Inner Box/Reel Labels**

## TI’s Material Content Analysis Process

- Each TI Raw Material Supplier (lead frames, die attach adhesive, bond wire, mold compound, etc) analyzes* and certifies, _annually_, the material composition of the raw materials supplied to TI.

- Weight data is then collected during each assembly step for each package type/configuration to identify the amount of each raw material used.

- * using an ISO/IEC 17025 or equivalent third-party or independent accredited lab

- Finally, the 2 databases are merged to create a material composition database for all TI package types that can be queried by part number and downloaded to Excel (TI Certificate included).   _[www.ti.com/leadfree](http://www.ti.com/leadfree)_

## Development of a RoHS Compliance Strategy

- Rather than expecting manufacturers to prove that every part they buy is RoHS compliant, EU member states will likely expect manufacturers to establish _documented and auditable systems_ to prevent noncompliant product from entering EU market.
- Development, implementation, and proof of a RoHS compliance strategy will be essential.
- Implementation of a “best management approach” that incorporates common compliance activities of industry leaders may prove to be a valuable corporate strategy.

*Holly Evans, *
*Strategic Counsel, LLC*

**Notes:**
This system would likely allow for some instances of non-compliance.
“Needle in haystack” analogy.  Try to sift it out through process, but once in a while, a noncompliant product may get through.

## “Ten Steps”

- Determine Company’s legal exposure
- Form company-wide RoHS compliance team
- Develop corporate-level compliance statement
- Develop internal compliance “roadmap”
- Assess company’s supply chain exposure
- Qualify suppliers to determine RoHS readiness
- Establish supplier material declaration process
- Perform limited risk-based testing/validate results
- Exchange RoHS compliance data with customers
- Incorporate RoHS compliance strategy into corporate operations/review process regularly.

*Holly Evans, *
*Strategic Counsel, LLC*

- Published in February 2005 issues of _Circuits Assembly_ magazine (http://www.circuitsassembly.com).

**Notes:**
These are the “ten steps”

## Resources for Further Assistance

- US Commercial Service “Buy USA” website: _[http://www.buyusa.gov/europeanunion/weee.html](http://www.buyusa.gov/europeanunion/weee.html)_
- UK’s Department of Trade and Industry website: _[http://www.dti.gov.uk/sustainability/weee/index.htm](http://www.dti.gov.uk/sustainability/weee/index.htm)_
- EU European Commission website: _[http://europa.eu.int/comm/environment/waste/weee_index.htm](http://europa.eu.int/comm/environment/waste/weee_index.htm)_
**Holly Evans (703-496-4832, **_[h.evans@cox.net](mailto:h.evans@cox.net)_**)**

*Holly Evans, *
*Strategic Counsel, LLC*

## Lead-Free Factoid

**~1,000,000,000**
** ****ICs**

**X**