# Presentation: 290476

## US CMS 

**Report to the NSF and DOE**
**Dan Green**
**US CMS Project Manager**
**Quarterly Report - January 25, 2001**

## Agenda

## Outline

**Project Status - Financial**
**Labor Experience**
**October Lehman Recommendations**
**The US CMS Research Program**
**Schedule Issues**

## US CMS - DOE, NSF Profile

**BA is ~ saturated. US CMS balance between DOE and NSF funds is roughly correct. We need to push planning into FY05 - started (PO). This will cost $ - M.R. talk.**

## US CMS Detector Project

**No major trends are evident. No “divergence”.  Schedule slip --> BCWS regression. Major effort to match ACWP and BCWS on 100% complete tasks for May Lehman Review - D.F. talk.**

## Contingency Usage and Performance

**We have > 2 years (31 months) of monthly reporting. We are again starting to “earn” contingency following the SiTrkr baselineing. But - PO marches into FY05 and SWC short term costs.**

## US CMS Contingency Use

**In the first 31 months of the Project  the EAC has grown ~ 15% w.r.t. the baseline. Ultimately, the EAC will grow by 40%. Slope must be watched.**

## Contingency Use at L2

**The largest % increase in the EAC has been in EMU. CP and ~ Tridas have reduced the EAC, while PO is ~ LOE  - except for FY05 and SWC. Most US CMS costs are M&S to date.**

## % Complete at L2

**The CP is ~ completed up to progress payments. ECAL and HCAL are ~ 50% complete, while Tridas and FPIX are only ~ 25% complete. PO is LOE**

## Performance Index at L2

**Define performance index as % complete w.r.t. the contingency % increase. CP has decreased EAC. TRIDAS has used ~ 0 contingency. ECAL is 50% complete with only an 8% EAC increase. FPIX is only 25% complete but has a 13% EAC increase.**

## CSC - Labor Experience

**Early experience on**
**CSC assembly is**
**favorable**

## HB OPTICS  - Labor Experience

**Labor experience for CSC and for HCAL optics has been good. This is the bulk of US CMS labor costs.**

**M&S ~ OK, Labor ~ OK ==> worry about electronics (schedule) and installation (EDIA too).**

## October Lehman Review

- Develop a corrective action plan for the ECAL bit serializer and present this plan at the next DOE/NSF Quarterly Status Meeting (January 2001).
- Develop detailed plans for the tooling, fixtures, procedures, training, and staffing for Muon system installation by the next DOE/NSF review (May 2001).
- Assess the impact of the proposed revision to the official CMS schedule for a working detector in 2005 (version 30*) on the completion schedule for U.S. activities by the next DOE/NSF Quarterly Status Meeting (January 2001).
- Develop a new schedule and plan for resolving the ALCT board/chip Single Event Upset problem.
- Ensure that the plans for RPC installation in the first disc do not adversely impact CSC installation.

**ECAL - P.D.**

**EMU - in train**

**PO - M.R. talk**

**EMU - PNPI EDIA for SEU tolerant**

**EMU**

## Oct. Lehman - II

- Recommendations:
**.**Identify the Parts Flow Manager (including any necessary engineering support) for the FAST sites by the end of November 2000.
**.**Finalize any procedures necessary to support full FAST site assembly and testing operations before the first chambers arrive, or before needed.
**.**Emphasize program, status, and issues for the ECAL subsystem at the next DOE/NSF Quarterly Status Meeting (January 2001).
**.** Develop a budget plan for the total U.S. CMS effort over the next five years including:  detector construction; pre-operations and operations; upgrade research and development; and software and computing.  Present this plan at the next DOE/NSF review in May 2001.

**EMU - written**

**EMU - written**

**PO, ECAL - agenda**

**PO - J.H. talk**

## US CMS M&O Cost Estimate

## M&O Cost Estimate at L2 (FY06 and beyond)

**L2 manager estimates for the different tasks. A PMP draft and a resource loaded schedule are in train.**

## Research Program Funding - JOG Dec. 6

## With the end of LEP, CMS now truly needs to keep to the schedule -  CMS discussions with CERN (MDN talk).

HF is now the first detector lowered into the UX5 experimental area. It is part of the ‘working detector”. US must accelerate the schedule - with Hungary, Iran, Russia, Turkey.

There are pending CR for muon trigger(0.25 M$) and FPIX (2.2 M$). In addition there are requests for ,ME1/1 electronics (2.0 M$) and ME4/1 electronics (0.9 M$).  Still other requests exist. Obviously, priorities must be set by the CMS SC. Meanwhile, we must earn more contingency before any scope increase is considered.

**HF is now the first detector lowered into the UX5 experimental area. It is part of the ‘working detector”. US must accelerate the schedule - with Hungary, Iran, Russia, Turkey.**
**There are pending CR for muon trigger(0.25 M$) and FPIX (2.2 M$). In addition there are requests for ,ME1/1 electronics (2.0 M$) and ME4/1 electronics (0.9 M$).  Still other requests exist. Obviously, priorities must be set by the CMS SC. Meanwhile, we must earn more contingency before any scope increase is considered.**

**Schedule Concerns**

## Critical Path - EMU, HCAL, ECAL

**CMS has defined ML1 for V30* schedule.**
**CP analysis is now in place for EMU, HCAL, and ECAL (M.R. talk)**
**CMS asks L2 managers for ML2, ML3, ML4 revisions.**

## CMS - ML1 (V30)

## US CMS Critical Path - EMU

## Summary

**US CMS is ~ on schedule and on budget.**
**The last Lehman review recommended contingency application in FY01 for scope increases if performance remains good. At this time it is not prudent to make any new contingency assignment until more contingency is “earned”. SiTrkr is now fully baselined.**
**Many hard decisions are ahead if we are to achieve a working detector ready at first beam to confront the Physics opportunities of the LHC.**

## US CMS Technical Summary

**No comments on ECAL - presentations at this meeting and n irradiation facility tour.**
**HCAL - HPD tour**
**L2 technical snapshots.**

## EMU - Chamber Production

**Fermilab: **
**Lab 8 (panel milling): all set and is running at full speed**
**MP9 (ME23/2 assembly): should be at full speed since Jan 1, 2001**
**US FAST sites (UF and UC):**
**Teams are in place**
**DAQ hardware and cosmic ray setups are ready**
**DAQ and Test Software are to be ready by May 2001 (on schedule)**
**PNPI Site:**
**Team is in place, trained at FNAL and UF**
**Chamber Assembly Tooling arrived and is being set up**
**FAST Site Equipment is packed and ready for shipment**
**IHEP Site:**
**Team is being finalized, trained at FNAL and UF**
**Chamber Assembly Tooling is being prepared for shipping**
**FAST Site Equipment is packed and ready for shipment**

## CSC Production Status

**Panel production (on budget, on schedule):  **
**CSC Types          ME23/2    ME2/1     ME1/2      ME3/1     ME1/3      ME4/1         **
**PPPs****	****	****    3            2              3              2              2              2**
**To be done****	****144+4****	****36+2****	****72+2****	****36+2****	****72+2****	****36+2        396+14**
**Done               ****	****144+2****	****19****	****  0****	****  0****	****  0****	****  0              (41%)**
**CSC Assembly (on budget, on schedule):  **
**CSC Types          ME23/2    ME2/1     ME1/2      ME3/1     ME1/3      ME4/1**
**PPPs****	****	****    3            1              2              1              1              0**
**To be done****	****144+4****	****36+2****	****72+2****	****36+2****	****72+2****	****36+2**
**Done               ****	****  18 (12%)  ****0****	****  0****	****  0****	****  0****	****  0**

## FNAL Production Experience

**FNAL Chamber Factory ramping up **
**Production rate increased as planned (3 chambers/month in last quarter of CY00, vs. an expected rate of ~3.3 chambers/month). **
**Total 18 large CSCs produces and tested by Jan 1, 01. Two more under tests.**
**Expect to meet the goal of production rate 4.5 chamber/month  in CY01**
**Odd extra jobs (last PNPI prototype, aging test chamber, ...) will probably prevent from reaching this rate until late Spring ‘01. **

**FNAL Production Experience**

## CSC - Beijing visit

**Visit to Beijing (Mitselmakher) - December 2000**
**Meetings with Chen Hesheng (IHEP Director), Wang Naiyan (China NSF)**
**Visit to the future CSC production site**
**Visit to the Peking University, discussion of the RPC schedule with Ye Yanglin et. al**** **

## CSC- Beijing visit

**Problems:**
**No formal CMS IHEP group yet**
**Delays with preparation of the CSC factory (team, floor plan, schedule/milestones, customs...), while schedule needs to be accelerated in view of V30 schedule ( assembly in UX5). Need > 1 year of 2 shifts.**

## CSCs - Beijing visit

**Action:**
**CMS/CSC group formed, Jiang Chunhua - leader, Wang Yunyong - technical expert, QC. **
**Space for production increased**
**Customs problems being solved, IHEP responsible (Deng,Jiang) identified**
**First shipment - tooling, parts for first two prototypes in box at Fermilab, waiting for property transfer paperwork.**

## Integration

**The integration design schedule has been  revised in coordination with the chamber production and installation effort.**
**Installation fixture -- Design is final and approved for production. Assembly of the fixture has begun.**

## Installation of CSC

- Test of CSC Installation fixture

- Fully balanced chamber can rotate to any angle

- Counterweight

- Balance limits w/ or w/o chamber

**Installation of CSC**

- W. Mason, F. Feyzi - UW/PSL

## CSC electronics

**CSC on-chamber electronics is being ordered**
**CFEB and AFEB boards on schedule and on budget**
**ALCT board is being redesigned to solve the Single Event Upsets problem. Conversion from ALTERA to Zilinx FPGAs - faster reloading. Expert engineering added to minimize the delay due to redesign (PNPI).**
**LVDB board may be delayed by 2-3 months due to delays with the rad hard regulator development at CERN.**

## EMU -On-Chamber Boards

**Electronics System Review took place on 9/18/2000.  Recommendations:**
**AFEB: Approved for procurement **
**CFEB: Approved for procurement (FPGA pending)**
**ALCT: Critical components approved for procurement. FPGAs pending. **_**Should replace Altera by XILINX.**_
**LVDB: Board not yet finalized.**
**Official schedule in EMU project file: **
**Deliver first set of production boards for all on-chamber boards by 5/18/01. (see table on next page) **
**Where do we stand w.r.t. this schedule?**

## Delivery Schedule in EMU File

## CFEB (Ohio State)

***Critical items: SCA, Comparator, ST regulator***

**CFEB (Ohio State)**

**Pre-production board produced and tested (12/00).**
**ASIC procurements**
**Buckeye: Order placed. No delivery schedule problem. **
**SCA: Order placed.  Delivery starts in 2/01?**
**Comparator: Order placed. Delivery first 2500 chips in 3/01.  Rest in 8/01 and 9/01?**
**Component procurements**
**Mostly (96 out of 98 components) ordered and in hand.**
**Pending: XILINX Virtex FPGA;  ST Regulator**
**Cables and connectors ordered and delivered.**
**PCB fabrication and assembly**
**Quotes from vendors obtained**
**Will place order in 1/01.**

## AFEB (CMU, PNPI)

**ASIC procurements**
**Amp-Disc chip: Pre-production (5 wafers) order placed in 12/00.  Will place full order in 4/01. **
**Delay chip (on ALCT): Pre-production chip delivery in 1/01.      Will place full order in 2/01. **
**Component procurements**
**All orders placed.**
**Cables and connectors ordered**
**PCB fabrication and assembly**
**Quotes from vendors obtained**
**Full order placed in 12/00.**

**AFEB On Schedule.**** **
***Critical path: Speed of ASIC testing.***

## ALCT (UCLA)

**ALCT-384 **
**Finalize Altera to Xilinx design change                 2/15/01**
**Deliver final prototype board                                  6/11/01**
**First batch (22 boards) delivered to FAST sites   9/30/02**
**ALCT-672 **
**first batch (6 boards) delivered to FAST sites      11/8/01**
**ALCT-288 **
**first batch delivered to FAST sites****	****                2/1/02**

**ALCT Schedule will slip by 5 months.**
***Critical issue: technical manpower***

## LVDB (Wisc)

**11/00  Deliver assembled preproduction board**
**  ****3/01   Finish testing of preproduction board**
**  ****3/01   Finalize design, award production contract**
**  ****4/01   Test production sample boards (~5)**
**  ****5/01   Start  Production**

**Schedule proposed by S. Lusin (9/11/00)**

**LVDB Schedule will slip by ~1-2 months **
***Critical item: ST regulator***

## HCAL - CMS Organization

## HB Absorber - Oct., 2000

**HB-1 pre-assembled at Felguera. Shipping to CERN . Megatiles will be inserted in bldg # 186. The mating of optics to absorber will begin at CERN in CY 2001.**

## HB Optics Quality Control

**Over 20,000 scintillator tiles built and measured**
**RMS of fibers = 4.4%**
**RMS of tiles = 6.5%**
**RMS of wire/coll = 1.2%**
**RMS of average  layer     light yield = 4.6%**

## The HPD - P.C. Tour

**Tube Fabrication by**** **_**D**_**elft **_**E**_**lectronic **_**P**_**roducts (Netherlands)**
**     ****Diode Array by****    Canberra (Belgium)****Vacuum Feedthru by ****	****Kyocera (Japan)**

- CMS  Design

-  12 kV across 3.5 mm gap with Vth < 3 kV  => Gain of 2500
-  Silicon PIN diode array, T-type
-  Thin (200 m) with  100 V reverse bias for fast charge (holes) collection

**The HPD - P.C. Tour**

## R&D for the HPD

- Custom Pixel Design:   *19 ch (towers) and 73 ch (short stacks)*
- Higher pin-out density: *Glass feedthrus replace with ceramic from Kyocera*
- Alignment to 50 m: *dead space, crosstalk, manufacturer tolerances tightened, **	**	**	**new measurement procedures necessitated*
- Improved Risetime:  *Thinner silicon: 200 ****m replaces 300 ****m*
- Guard ring and drain structure:  *3 interations as Canberra improves design*
- And NOW aluminization of surface and AR coating issues

**The Tube**
- Larger active area: *Less room for HV connection, possible field distortions** *
- HV coax cable: *Reliability and compatibility with RBS*
- Minimize gap: *Improve tube components *
- Gold-plated pins: *Enables us to use ZIF sockets - questions of gold diffusion*

**R&D for the HPD**

## HPD

**This Al overcoat solves the electronic cross talk ( ~ 100%) problem.**
**The electron backscatter problem (~ 15%) is solved by the application of the CMS magnetic field.**
**However, there remains the crosstalk (~ 10%) due to the semi-transparent photocathode and the optical reflection off the aluminum. A 1/4 wavelength anti-reflection coating is being explored (U. Minn.)**

## Minn. Studies of Coating

**Angular “acceptance” and numerical aperture.**

**Wavelength “acceptance” and photocathode response**

## QA Stations at UMinn

** ****	****Automate (in parallel)****	****	****       Complete Database**
**DC Test Station**	 (Minnesota)	=> boundary scans, uniformity, leakage current		      	 	=> diode capacitance and interpixel resistance	=> alignment and registration
**AC Test Station** (Minnesota, portable copies at FNAL,CERN)	   		 => one p.e. curves: dark current, resolution, vacuum check	     		 => gain curves and  linearity				 		 => AC Crosstalk and uniformity
**High Rate Tests**  (FNAL and Minnesota)	 => risetime and pulse shape						 => rate dependent effects
**Lifetime Studies** (Minnesota and Oak Ridge)	=> Total integrated charge	=> High Voltage stability	=> Radiation Damage

**QA Stations at UMinn**

## HPD Summary

** ****The start-up is delayed **
** ****Tube production and Testing will be accelerated to meet final milestones**
** ****Costs go up****	****New masks for diodes up front****              More expensive components ***Schott glass (US$ exchange rate)*                       			     *Canberra diodes (more complicated)*
** ****Additional testing cost reflects ****	***1 extra QA station and**** ****more student labor to speed up QA**	**longer validation time before QA kicks in*
** ****HPD’s do not represent a critical path item - YET**

**CONCLUSIONS**

**HPD Summary**

## HB RBX Detail View

**The issue for the RBX is the access to the HPD. There are integration issues with the tracker patch panel. A mockup was made and changes appear possible which will ease the problem. Schedule is such that a PRR is needed soon. Now scheduled for March, 2001.**

## HF - EDIA - “Bricks”

**HF - EDIA - “Bricks”**

**Design using RDMS “bricks” is basically complete. The dimensions are to be respected by the RDMS PPP.**
**Engineering meeting at CERN mid Feb. PPP to be available before.**

## HF - EDIA

**HF - EDIA**

**0.5 cm spacing, packing fraction, source tubes, edge chamfer design complete.**

## QIE Status - OK  

**Input Amplifiers/Splitters:  design finished, layout done.**
**Integrators: design finished, layout partially done.**
**FADC:  design finished, layout done**
**Range comparators and ranging logic:  not done**
**Biasing network:  not done**
**State machine, timing:  design being worked on now **
**LVDS drivers, receivers:  not done**
**Other digital logic: not done****Planning to submit total design early March ‘01 - on track so far - minor slippage.**

**Yarema group is on track with their scheule**

## HCAL Electronics - I

**Building 186 Electronics**
**	****800 channels of “slow” electronics built and being tested**
**Front End Readout Cards**
**	****QIE ASIC**
**	****	****Full 4 corner model simulations in progress**
**	****	****Full Chip Submission planned mid Feb ‘01**
**	****CCA ASIC**
**	****	****DLL - design and cell layout done**
**	****	****RBXbus serial interface design and layout done**
**	****	****Full Chip Submission planned end of Feb ‘01**
**	****CERN “GOL” Serializer**
**	****	****Chip submitted, parts expected in March.****	**

## HCAL Electronics - II

**Readout Box Clock and Control Module (CCM)**
**	****Engineering Specification begun**
**	****Module will provide for CANbus communication, temperature and     voltage monitoring, clocking**** **
**Readout Box Backplanes**
**	****Backplane engineering ~90% complete**
**	****Layout has begun on HB backplane**
**Trigger/DAQ**
**	****6U HTR Card PCB received (U. Maryland)**
**	****	**
**Initial System Test (FE and Trigger/DAQ)**
**	****Planned for late summer ‘01**
**	****Prototypes:  FE readout cards, CCM, backplane, HTR **

## HF - QP Specifications

**Core****	****	****	****: 600 +/- 10 micron dia**
**Clad****	****	****	****: 630 +5-10 micron dia**
**Buffer****	****	****	****: 800 +/- 30 micron dia **
**Core non-circularity****	****	****: 5%**
**Clad concentricity****	****	****: +/-2 microns**
**Buffer concentricity****	****	****: +/- 3 microns**
**NA****	****	****	****	****: 0.33 +/- 0.02   (Full acceptance cone : 38.5 degrees)**
**n****core****	****	****	****: 1.458 (@ 600 nm)**
**n****clad****	****	****	****: 1.419**
**Att(@ 300 nm)****	****	****: <0.15 dB/m**
**Att(@ 400 nm)****	****	****: <50 dB/km**
**Att(@ 450 nm)****	****	****: <30 dB/km**
**Core OH****-**** content****	****	****: 1000 – 1200 ppm (high OH****- ****Fiber)**
**R****min**** curvature (short time)*****	****: 6 cm/1 min**
**R****min**** curvature (long time)*****	****: 10 cm/2 months**
**Quantity****	****	****	****: 815 km**
**Proof test (100% fibers) ****	****: 100 kpsi**
**Operating temp range ****	****: - 65 – 125 C**
*** (>98% optical transmission in 300 - 700 nm with no memory or breakage) **

**PRR for HF PMT and QP fiber in Feb., 2001**

## HF-PMT Specifications

**HF-PMT Specifications**

**Window Material****	****	****	****Borosilicate glass**
**Window thickness****	****	****	****< 1 mm**
**Effective photocathode dia****	****	****>23 mm****	****	**
**Photocathode material****	****	****Bialkaline****	**
**QE****	****	****	****	****15 % 400-500 nm,  > 25 % at 420 n****	**
**Photocathode lifetime****	****	****> 200 mC ****	**
**Ave. anode current vs position****	****	****< +/- 20 % with 3 mm spot scan ****	****	**
**Gain****	****	****	****	****105  at < 0.75 x VKA(max) **
**single pe resolution****	****	****	****rms/mean of single pe peak < 50 %**
**pulse linearity****	****	****	****+/- 2 % for 1-3000 photoelectrons**
**peak current****	****	****	****< 10 mA **
**transit time****	****	****	****< 25 ns**
**rise time****	****	****	****< 2.5 ns**
**pulse width****	****	****	****< 15 ns FWHM**
**gain (1/2)-lifetime****	****	****	****> 1500 C**
**average current IK****	****	****	****< 1 nA**
**average current IA****	****	****	****< 10 mA    ( g = 104 )**
**stability****	****	****	****< +/- 3 % within any 48 hr. period **
**envelope****	****	****	****opaque and conductive coating****	****	****	**

## Trigger TDR

**Met June Milestone for 1st Draft (ML1)**
**Final draft by November TriDAS Week (6-11.11.00)**
**Submission to LHCC shortly thereafter**

## Calorimeter Trigger Status(U. Wisconsin)

**Successful Prototyping Program**
**Crate, 160 MHz Backplane & Clock Card **
**Receiver & Electron Isolation Cards tested**
**Adder ASIC tested & production finished**
**4 Gbit/sec Copper 20 m link system tested**
**ASIC Prototypes**
**Phase & Boundary Scan protos delivered**
**Isolation & Sort protos delivered**
**Testing Program Plans**
**Next generation Backplane finished**
**Next generation Receiver, Elect. Iso. Cards**
**Test remaining ASIC prototypes**
**Simulation Program**
**New ORCA4 results verify performance**

## Cal Trigger Serial Data Cable Gbit Link Tests

**Serial Link Test Card includes VME, memories & comparison circuitry to  fully test serial links @ 120 MHz TTL from Mezzanine Cards. *****(U. Wisconsin):******Bit Error rate < 10******-14***

**Mezzanine Transmit & Receive Cards convert ****4 x 1Gb/s links to 120 MHz TTL w/ Vitesse 7214 & cable equalization**

**Receiver Bottom**

**Transmitter Bottom**

**Receiver Top**

**Transmitter Top**

## ORCA4 Rates at L=1034

## ORCA4 Calorimeter Trig. Effcy.

**Jets are included in cut sets for Taus**
**|********| < 2.4 due to tracker limits for e, Tau, Jets out to |********| = 5 **
**Electrons are Isolated - high luminosity**
**Isolation not considered - low luminosity**

## Successful CSC Trigger Integration test
Prototype Muon Port Card, Sector Receiver, Sector Processor, Clock Board, Backplane work & communicate
New ORCA 4 full simulation working
Agreement/use with hardware test

**Prototype Muon Port Card, Sector Receiver, Sector Processor, Clock Board, Backplane work & communicate**
**New ORCA 4 full simulation working**
**Agreement/use with hardware test**

**Muon Trigger Progress**

## Track-Finder Crate Tests

**Track-Finder Crate Tests**

**SP**

**SR**

**CCB**

**Bit3 VME Interface**

**Custom backplane**

**MPC**

**100m optical fibers**

## Muon Trigger System Tests

**Port Card ******** Sector Receiver**
**MPC (Rice) & SR (UCLA) communicate  via HP GLinks & optical fiber**
**Data successfully sent from input of one MPC, through 100m of optical cables, to output of SR**
**Sector Receiver ******** Sector Processor**
**SR and SP (Florida) communicate via Channel-Link backplane**
**Data successfully sent from input of one SR, through custom backplane, into the SP**
**Successfully sent data from three SRs connected to the SP to emulate an entire trigger sector**

## Muon Trigger Tests (Cont’d)

**Port Card ******** Sector Receiver ******** Sector Processor**
** ****Successfully sent data from the input of two MPCs (representing ME2 and ME3), through one SR, and reconstructed tracks correctly in the SP**
** ****Complete chain test**
**Clock and Control Board prototype (Rice) coordinated these tests:**
** ****Distributed clock and control signals with programmable delays**
** ****Sent BC0 to initiate tests**
**Considerable software development & coordination**

## DAQ

**The DAQ effort continues in an R&D phase - watching and evaluating commercial developments.**
**The ML1 for DAQ is the TDR, due in 2001.**
**Paris Sphicas is US CMS L2 DAQ  manager and CMS L2 PRS manager. Much work on forming and launching the 4 PRS groups has been accomplished.**

## Forward Pixels, Test Beam

- Z, B

- X

- Y

- 20o

- Row

- Beam

- }

- Double
- Column

-  Charge Sharing

- Pixels
- 150 x150 m2

- D:\Transfer from Bob\Pictures\Test Beam Hardware\Geometry Pixels.ppt

- 8mm

- ROC, PSI36:
- 11 double columns
-  x 30 rows

- Test Beam CERN

- Vienna Repeater

**Forward Pixels, Test Beam**

## Pixels   -  Charge Sharing

- 150 m

****** ****= 14 ********m**
**over pixel**

- Pixels at 20o to beam

- 150 m / 12 = 43 m

****** ****= 46 ********m**
**over pixel**

- Charge sharing vs position

- Charge sharing vs position

- Pixels normal to beam

- 150 m

**Pixels   -  Charge Sharing**

## SiTrkr -Increased Scope

**Expanded Role**
**Build ~6000 modules installed in ~750 Rods**
**Project files prepared in detail including all resources, schedules, contingency analysis.**
**PMG committee review Sep. 14-15, 2000**
**M. Crisler – chair**
**Recommendations received and responses returned Nov. 1, 2000**
**Change Request signed Nov. 22, 2000**
**MOU’s and SOW’s being finalized & signed**

## Organization in US CMS

**Joined US CMS @ FNAL**

## Physicist Manpower

## SiTrkr Schedule

**Main Production Period:**
**~ 8 months of explicit float**

## Estimated Costs (FY00$)

- Price has risen 380k$.

- 520k$  of this is covered by the original support of CMS Tracker groups outside the US.

**Base                 Cont**

## Current Activities

**Frames**
**We’ve begun manufacturing the C Fiber**
**     ****frames supporting the sensors and hybrids.**
**Only making those for mock-up modules to be used in the training of the gantry robots.**
**Production equipment**
**We are expecting our gantry to arrive in late January.**
**We’ll set it up with the help of a CERN technician.**
**Test equipment**
**Test boxes being designed now.**
**Test stand definition is converging**
**Components**
**Silicon tender has begun**
**Hybrid design now on a likely final iteration**
**Commercial Frame manufacturers now being qualified**

## Frames

**C fiber frames on gluing jig at FNAL**

## Near term Schedule

**First Modules**
**Mechanicals this winter**
**First working modules produced at FNAL in Spring/Summer for Milestone 200 and initial system tests**
**Test & burn-in stands**
**First test stand here in Spring**
**Preliminary burn-in stand will re-use CDF Run 2 equipment. **

## CP - Disk Production

**Contractor:  Kawasaki (Japan)**
**Status:**
**Minus endcap shipped on 13 Jan ‘01**
**Approx. 2000 tons of steel**
**YE-1, YE-2, YE-3 disks, YN-1, YN-2 nose disks, nose support tube, 3 spacer rings**
**Finished trial assembly of YE-1 disk with nose disks**
**All items fit nicely**
**Photogrammetry shows hole location good to .2mm**
**Plus endcap fabrication**
**Good progress - half-disk of YE+2 machined**
**Sector blocks mostly finished**
**Expect to ship to CERN in Jul ‘01**

## YE-1  & nose trial assembly  Nov ‘00

**YE-1  & nose trial assembly  Nov ‘00**

## Sector blocks ready for shipping  Nov ‘00

**Sector blocks ready for shipping  Nov ‘00**

## YE Cart - Nov. 00

**YE Cart - Nov. 00**

## Tech Summary

**EMU - CSC ~ OK, ALCT SEU being addressed. ESR passed --> ASIC + boards in train. FAST and installation ? remain.**
**ORG for Physics. RBX and HPD schedule? QIE ~ OK. HF PMT and QP fiber ready to begin procurement.**
**Trig/DAQ ~ OK. PRS (HLT) working well.**
**ECAL - optical link resolved. LBNL work begun. Schedule ? for CMS remain. US CMS electronics schedule? remain - see CP analysis.**
**FPIX ~ OK (CR ?). SiTrkr well launched.**
**CP ~ done. PO transition to M&O  - PMP draft.**