# Presentation: 821975

## WBS 1.1.1.5(& W.B.S. 1.1.1.6.2 & Services)

- Pixel Module Assembly & Test

**Technical Status**
**Goals for 2004**
**Service Panels**

- M. Garcia-Sciveres  --  Module Assembly & Test

- July 10, 2003

## Technical Status 

- Thinning and dicing
- Module Assembly
- Pigtails are gone
- Adhesives
- Sector loading
- Production testing
- Burn-in setup

- M. Garcia-Sciveres  --  Module Assembly & Test

- July 10, 2003

## Technical Status: Thinning and Dicing

- This is going very well. Great work by Amanda, Aldo, & Al Clark. Vendor GDSI has been very reliable. Cost under control.
- Only issue with FE-I1 was suspected silicon particle contamination leading to shorts during flip chip. This may not be an issue for FE-I1 (or it may be worse). Chip squashing tests are under way.

- M. Garcia-Sciveres  --  Module Assembly & Test

- July 10, 2003

##  Technical Status: Module Assembly 1/2

- FE-I1 used to “shake down” the module assembly process.
- Yield of all steps has steadily improved. Not quite at planned levels yet, but plateau probably not yet reached.

- M. Garcia-Sciveres  --  Module Assembly & Test

- July 10, 2003

## Technical Status: Module Assembly 2/2

- Fixturing is very simple and works well. What we have is good enough for production.
- Assembly time with new adhesive tape is literally less than 1 hour per module
- Wire bonding with new machine is a breeze. But we need to buy such a machine! (availability assumed in cost and schedule)
- Only outstanding issue is how exactly to pot the bonds to avoid magnetic field resonance. Work in progress.

- M. Garcia-Sciveres  --  Module Assembly & Test

- July 10, 2003

## Technical Status: Pigtails Gone 1/3

- Original design had cable soldered to flex pigtail, in turn wire-bonded to module
- In fixing a defective pigtail bypassing it with wires, we realized that the pigtail was hurting more than helping.

- Now cable soldered directly to flex.
- Fewer things to test, fail and assemble.
- No wire bonded connections to module
- All modules for a given disk are identical (before needed 2 flavors)

- M. Garcia-Sciveres  --  Module Assembly & Test

- July 10, 2003

## Technical Status: Pigtails Gone 2/3implications for US assembly flow

- Flex + SMT

- LBL for cable

- Albany for HV test

- OU for MCC

- M. Garcia-Sciveres  --  Module Assembly & Test

- July 10, 2003

## Technical Status: Adhesives

- Flex Hybrid To module Attachment
**Original scheme of no glue under flex bond pads did not work due to flex bow**
**Switched to silicone tape adhesive under bond pads. **
**Allows for excellent wire bonding and instant assembly.**
**Radiation tested OK. Some further qualification needed (thermal cycling, etc.)**
- Module to Sector Attachment
**SE-4445 Silicone accepted as new universal baseline**
**Modules on sector being loaded with this glue now (used to be CGL). Very good initial experience.**

- M. Garcia-Sciveres  --  Module Assembly & Test

- July 10, 2003

## Technical Status: Sector Loading

**Major development here**
**First and only real sector was loaded ****“by hand” with makeshift fixtures**
**Original tooling, now 2 years old, had many problems. **
- Pickup of real modules built with Dyconex flex was a problem
- Sector tubing design evolved and no longer fit.
- No provision for survey of module position
**New concept introduced for sector safe ****handling, storage, survey, testing. ****“Sector frame”. Similar concept to flex frame. **
**Entirely **_[new tooling ](http://pxs.lbl.gov/~goozen/sector.html)_**designed around frame. ****All parts have need built and are almost ready ****for first use (build second real sector). ****(aside: Fred charges all this to SCT account)**

- M. Garcia-Sciveres  --  Module Assembly & Test

- July 10, 2003

## Technical Status: Production Testing

**Have been pushing for a documented module, sector and stave QA plan. Collaboration has been slow to respond.**
**Nevertheless, a fairly clear picture is emerging of the resources needed.**
**Basically:**
**Characterize each module with PC test setup**
**Burn-in and thermal cycle each module (new burn-in setup needed)**
**Burn-in, survey, thermal cycle, and IR image each sector (same burn-in setup as module)**
**Undecided: test each sector with ROD. **

- M. Garcia-Sciveres  --  Module Assembly & Test

- July 10, 2003

## Technical Status: Burn-in Setup

**Finally started development at LBL**
**Students + Eng. Div. drafter.**
**Design “specs”**
**Keep it simple**
**Add-on to existing single module test setup**
**Cheap and easy to replicate (we expect everyone will want one).**

- New burn-in board

- New burn-in board

- New burn-in board

- New burn-in board

- USB port or USB hub

- ISEG supplies for HV, bulk supply for LV power

- M. Garcia-Sciveres  --  Module Assembly & Test

- July 10, 2003

## Goals For 2004

**Start Production!**
**Finish production in early FY05!**
**Try to get collaboration to buy into this “5****th**** disk”**
**Gain time on ramp-up**
**If it ends up working more or less it becomes half of a 3****rd**** hit**

- M. Garcia-Sciveres  --  Module Assembly & Test

- July 10, 2003

## 2004 Goals: Type 0 Cable Production

**There is no flex pigtail fabrication ****(1.1.1.4.3.2 ****-> 0)**
**Copper clad wire and other materials ****($5K)**
**PCB for PP0 connector end of cable ****($1.7K)**
**Cables attached to flex hybrid at LBL ****(600hrs tech.)**
**Total:**
**$6.7K****	****	****	****	****	****this is part of**** **
**600 hours labor  ($40K)****	****	****module assy. in WBS**

- M. Garcia-Sciveres  --  Module Assembly & Test

- July 10, 2003

## 2004 Goals:  Wafer Thinning, Dicing, Die-probing Production

**100x Bumped FE-I wafer thin ****($15K)**
**Cleaning & re-coating in Microlab ****(100hrs student)**
**Inspection**** ****(25hrs student)**
**Dicing ****($20K)**
**Cleaning resist in Microlab ****(100hrs student)**
**Single Die Probing & inspection ****(1760hrs student)**
**Supplies (gel packs, etc) ****($12K)**
**Totals:**
**$47K****	****	****	****	****	****    ****ETC03 prod. total**
**2000 hours student ($30K)****	****	****	****            ****29K+28K**
**+20K**

- M. Garcia-Sciveres  --  Module Assembly & Test

- July 10, 2003

## 2004 Goals: Production Module Assembly

**Shipping Covers & supplies ($8K)**
**Equipment maintenance ($5K)**
**Technician Assembly Labor (600hrs)**
**Technician tests (bond pulls, etc.) (300hrs)**
**Shops (100hrs)**
**Totals**
**$13.3+****6.7****= $20K****	****	****  ****ETC03 prod. total **
**1160+****600**** hours  ($60K)****	****        **** 24K+176K****(type 0 cable)**
- -120K

- M. Garcia-Sciveres  --  Module Assembly & Test

- July 10, 2003

## 2004 Goals: Burn-in System Development

**Being developed by students + eng. Div. Drafter. **
**First prototype by end of summer => ****Much of this cost is in FY03!**
**At that point will need a lot of software help (new postdoc to jump in...) **
**Same system to be used for sector burn in.**
**See Module QA for operation of burn-in system **
**Copies of system likely to be requested by collaborators**
**$20K board fabrications and purchases **
**440 hours drafter ($20K)**
**880 hours student ($12K)**
**80 hours shop ($6K)****	****	****	****         ****ETC03 **
**Total: $58K****	****	****	****   ****	****           ****46K**
- +12K

- M. Garcia-Sciveres  --  Module Assembly & Test

- July 10, 2003

## 2004 Goals: Production Module QA

**Still hard to estimate how long it will take per module for 1 person + TDaq setup.**
**Optimistically assume 4 hours per module.**
**Need dedicated setup and a lot of disk space. **
**Note this is different setup than burn-in. That’s a second dedicated setup. **
**=> Do we need one more TDaq setup? Yes. **
**New Tdaq setup & pwr supplies ($15K)**
**1760 hrs student ($25K)**
**Burn-in setup operation**
**Operating supplies ($5K) **
**880 hrs student ($12K)****	****	****	****ETC03 Prod. Total**
**Total QA: $20K + $37K****	****	****	****   ****$45K + $75K**
- -63K

- M. Garcia-Sciveres  --  Module Assembly & Test

- July 10, 2003

## 2004 Goals: Production Sector Loading

**This should not be a very labor intensive operation**
**Ideally will be done by an engineering tech. now F/T on mechanics, to be trained by FRED.**
**Important cost is frame holders for production modules and possibly additional tooling. **
**Misc. tooling, & supplies ($7K) **
**20 frames, 16shop hours each ($16K)****	****ETC03 Prod. Total**
**440hrs. Mech. tech. ($16K)****	****	****      ****$7K + $24K**
- +8K

- M. Garcia-Sciveres  --  Module Assembly & Test

- July 10, 2003

## 2004 Goals: Production Sector QA

**Involves IR, Metrology, Thermal cycling, and electrical burn-in**
**Assume 1 sector/week**
**=> 1 FTE for this job (student OK)**
**Fixtures, storage ($25K)****	****	****	****ETC03 Prod. Total**
**1760 hrs student ($25K)****	****	****	****   ****$36K + $12K**
**What about database?****	****	****           ****ETC03 has $11K**
- +2K

- M. Garcia-Sciveres  --  Module Assembly & Test

- July 10, 2003

## Module Production Summary 

**Adding up the labor we need ****4.1FTE**** students in FY04. **
**We have ~1.**
**New postdocs can pick up some of the work**
**Probably still need to hire at least 2 temps (eg. finishing undergrads) or find visitors or other help. **
**Technicians needed: ****1.6FTE****. Seems OK. **
**Assuming we can find this many students, looks like significant reduction compared to ETC03. (about 140K). **
**But, part of these savings are not real because we are spending “production” money on continued prototype work in FY03. I have not tried to add up FY03 standing army cost and subtract it from production budget.**

- M. Garcia-Sciveres  --  Module Assembly & Test

- July 10, 2003

## Service Panel Production (2004)For 3-Hit System (everything up to PP1 tapes)

- 57Kg Cu-Clad Al Wire (+overage)   $81K
- Flex fabs, connectors, vendor assy.   $66K
- LBNL Tech. Labor			     3648Hrs
- Total for Electrical component of Service panel production:	       $293K
- (2 hit total is $226K)

- This is the slide from last year. New estimate looks a tiny bit less (10-20%), but uncertainty is still too large to reduce this.

- M. Garcia-Sciveres  --  Module Assembly & Test

- July 10, 2003