# Presentation: 323876

## Military  &  Aerospace Applications of Programmable                      Devices and Technologies Conference

_**A**_** **_**Step**_** **_**Towards**_** **_**Infusion**_** **_**of**_** **_**Reliable**_** **_**COTS**_** **_**Plastic**_** **_**Parts**_** **_**in**_** **_**NASA**_** **_**Flight**_** **_**Hardware**_

**Mike Sandor & Shri Agarwal                             4800 Oak Grove Drive                                  Pasadena, CA 91109                                       Phone: (818) 354-0681 FAX: (818) 393-4559**

- Goddard Space Flight Center
- 1998

## The Meaning of COTS

**The Meaning of COTS**

** “****Buy and Fly”**

- • **“****Procuring via catalog part number to QML-V standards”**

-  **“****Procurement is performed without formal specification”**

-  **“****The usage of any COTS equipment does not constitute**
** ****any waiver to fundamental applicable requirements”**

-  **COTS are parts whose specification is **_***manufacturer***_
_**-**__***controlled***_**  as opposed to traditional “Hi-Rel”parts whose**
** ****specification was **_***Government or customer-controlled***_
**  **

**JPL  Interpretation:**

- EPE

- 5

- 0

- 7

## Why Put COTS Plastic Parts in Space ?

**1. The availability of COTS plastic parts is proliferating.**
**2. COTS plastic parts performance capabilities continue to increase **
**(e.g.  processing power & high density memories)**
**3. COTS plastic parts enable reduction of hardware weight and volume**
**4. COTS plastic parts typically cost much less than ceramic **
**5.COTS plastic parts have been reported to demonstrate **
**good to excellent reliability in commercial and aerospace applications**
**6. Often they are the only option available to using state-of-the-art technologies**

**JET PROPULSION LABORATORY****Electronic Parts Engineering Office**** **

- EPE

- 5

- 0

- 7

## JPL’s Concerns About Using COTS Plastic Parts

**JPL’s Concerns About Using COTS Plastic Parts**

**• ****Reliability/RH of Plastic in Space Applications**

**• **** ****Process/Designs Change Frequently**
**• ****Lack of Lot Traceability & Uniformity**

**•**** ****Narrow Temperature Range for Commercial Grade**

**• ****Non Rad Hard Designed (maybe Rad Tolerant****)**

- EPE

- 5

- 0

- 7

## EPE  

**Assessment Options for COTS Plastic Parts & Their Relative Test Costs**

** ****Temperature/ Humidity ****	****   ****	****Corrosion****	****	****($)**
** ****Temperature Cycling****	****                Assembly Defects****	****	****($$) **
** ****Moisture Absorption****	****	****Popcorning****	****	****($$)**
** ****Radiation ****	****	****                TID Degradation****	****	****($$$$)**
** ****Outgassing****	****	****	****Condensables****	****	****($) **
** ****Glass Transition ****	****	****    ****	****Epoxy Stability****	****	****($$)**
** ****Delamination****	****	****	****Voids/Stresses****	****	****($)**
** ****Upscreening/Burn-in****	****	****Performance/Reliability****	****($$$$)**
** ****DPA****	****	****	****	****Manufacturing Quality****	****($$)**

- EPE

- 5

- 0

- 7

## EPE  

- EPE

- 5

- 0

- 7

**JET PROPULSION LABORATORY****Electronic Parts Engineering Office**

## EPE  

- EPE

- 5

- 0

- 7

- Irreversible weight gain

## EPE  

- EPE

- 5

- 0

- 7

**JET PROPULSION LABORATORY****Electronic Parts Engineering Office**

## W3(t): Slowest Reversible  Weight Gain, Reaches We @ t=

- EPE

- 5

- 0

- 7

**JET PROPULSION LABORATORY****Electronic Parts Engineering Office**

**85%RH/85oC Moisture Absorption Mechanisms  for SCR265**

**W1(t):**** ****Fast **_**Irreversible**_** Weight Gain ******** 24 hours (********1mg)**

**W2(t):**** ****Intermediate Reversible  Weight Gain, 80 to 140 hours**

**W3(t):**** ****Slowest Reversible  Weight Gain, Reaches We @ t=******

## EPE  

- EPE

- 5

- 0

- 7

**JET PROPULSION LABORATORY****Electronic Parts Engineering Office**

**Nickel Plated Heatsink Shows No Oxidation**

**Leads Show Extreme Oxidation      ****W1(t)**

**Post 85%RH/85oC for SCR265**

- Conclusion: Weight gain is solely attributed to oxidation of leads. The internal chip has miniscule Al area available for oxidation because of Cu intermetallic bonding to the Al.

## EPE  

- EPE

- 5

- 0

- 7

**JET PROPULSION LABORATORY****Electronic Parts Engineering Office**

**Outgassing Test Flow for Plastic Packages**

- 50% RH @ 25C
- for 24 hrs + Weighed

- 5x10-5 torr @ 125C for 24 hrs

- Collect Condensables on CP (25C) CVCM

- Cool & Dry Test Chamber

- Weigh Specimen & CP for TML

- 50% RH @ 25C for 24 hrs + Weighed for WVR

- Ref: ASTM E595-93

## EPE  

- EPE

- 5

- 0

- 7

**Outgassing Results of Plastic Packages**

- Material

- MCR

- 7612382FBA, E24,

- DA28F016SV, K8055, U6240332

- AM28F020-150PC, 9618FBB

- CSI, CAT28F020F, 1-15 09550B

- Part

- Motorola SCR

- Intel 16 M Flash Memory

- AMD 2M Flash Memory

- Catalyst 2M Flash Memory

- Sample No.

- 5

- 6

- 7

- 8

- a

- 9

- 10

- 11

- 24

- WT. Loss %

- 0.45

- 0.46

- 0.45

- 0.23

- 0.22

- 0.22

- 0.41

- 0.45

- 0.43

- 0.40

- 0.41

- 0.40

- Water Vapor

- Recovered, WVR,

- %

- 0.28

- 0.25

- 0.26

- 0.14

- 0.11

- 0.12

- 0.19

- 0.17

- 0.18

- 0.21

- 0.18

- 0.19

- TML (WT, LOSS-

- WVR) %

- 0.17

- 0.21

- 0.19

- 0.09

- 0.11

- 0.10

- 0.22

- 0.28

- 0.25

- 0.19

- 0.23

- 0.21

- CVCM %

- 0.04

- 0.08

- 0.06

- 0.02

- 0.01

- 0.01

- 0.03

- 0.05

- 0.04

- 0.04

- 0.04

- 0.04

- DEPOSIT on CP

- Opaque

- Negligible

- Opaque

- Opaque

- FTIR Results

- Amine cured epoxy

- Anhydride cured epoxy

- Amine cured epoxy

- Amine cured epoxy

- Conclusion: All materials passed. These tests are suited for lot-to-lot comparisons, tracking manufacturing continuity/changes, and measuring absorbed moisture at a known environment.

## EPE  

- EPE

- 5

- 0

- 7

**JET PROPULSION LABORATORY****Electronic Parts Engineering Office**

- Dose rate = 25r/s

**Radiation Results on Plastic Parts**

## EPE  

- EPE

- 5

- 0

- 7

**COTS Plastic Infusion Baseline Flow**

**JET PROPULSION LABORATORY****Electronic Parts Engineering Office**

**DPA**

**C-SAM**

**TEMP CYCLE**

**ELECTRICAL**

**ELECTRICAL**

**Burn-in**

**ELECTRICAL**

**ASSEMBLE  **
**HARDWARE**

**IDENTIFY & REVIEW REQUIREMENTS**

**ASSEMBLY **
**TEST**

**ASSEMBLY **
**QUALIFICATION**

**FLIGHT **
**READY**

**Part Level Screening**

**COST & TAILOR OBJECTIVES**

## In Summary

- EPE

- 5

- 0

- 7

**In Summary**

**JET PROPULSION LABORATORY****Electronic Parts Engineering Office**

-   Using COTS plastic parts without understanding their pedigree can
-    lead to mission delay or worst          **Mission Failure**

-   A methodology is in place in Office 507 to help JPL users of
-    plastic parts ascertain their risk and acceptance for Space Application

-   Work is underway in Office 507 to evaluate **all risk factors**
-    when using COTS plastic parts (quality, reliability, radiation,package).

- • JPL is currently infusing plastic parts into flight hardware utilizing                                                                                              a **Better-Faster-Cheaper Program** tailored individually for each Project