# Presentation: 815094

## The Inclusive  (Measurement ) FVTX aka   iFVTX 

**sponsored by LANL-DR in FY ‘06-08**

-  Hybrid
-  Module
-  Testcard
-  Pixel Plane
-  Assembly/Integration

- Gerd J. Kunde - LANL

## The Interaction Region at PHENIX

- Space for Vertex upgrade detectors

- Gerd J. Kunde - LANL

## Outline

- From Hybrid to Module
- From Module to Testcard
- From Testcard to Pixel Plane
- From Pixel Plane to Station
- From Station to Full Detector

- Gerd J. Kunde - LANL

## Detector Stackup

- NOT TO SCALE

- Bump Bonds

- Gerd J. Kunde - LANL

## 8 Chip Module

- _HDI designed by Fermilab/ made by Mircoconex/Dyconex /CERN:_

- HDI CAD top layer.

- HDI + 8 bare die chips.

- HDI + 8 chips with detector.
- (SINTEF PSPRAY)

- Several iterations, now minimal HDI

- Gerd J. Kunde - LANL

## Pixel Module Assembly  

- Fixture with Vacuum Chuck
- Gluing of FPIX to HDI

- Gerd J. Kunde - LANL

## Testcard and Wire Bonding  

-  Testcard for each module
-  Gluing of module to card
-  Wirebonding of HDI to card

- Gerd J. Kunde - LANL

## Ready Test Card

- Gerd J. Kunde - LANL

## PCI-based Test stands – PTA card

- Perform module test
- Initial characterization with inject pulser
- Hit map
- Absolute calibration
- Burn-in (normal operation for 72 hours)
- Repeat hit map
- Q&A and module classification
- ‘PINGA’ test software‘

- Gerd J. Kunde - LANL

## Module Removal for Plane Assembly

**Module Removal for Plane Assembly**

- Gerd J. Kunde - LANL

## The Layout of a Plane

**The Layout of a Plane**

- Gerd J. Kunde - LANL

## The Plane Design

- Flex Blades  (Temperature compensation)
- Center of Active Area is Stable
- Stiffer bar along the straight side

- Gerd J. Kunde - LANL

## Station Sandwich

**Station Sandwich**

- Modules are on the inside
- Connectors on the outside (not shown)

- Gerd J. Kunde - LANL

## Full Detector with Stations

**Full Detector with Stations**

- 2 Planes per Station
- 6 Identical Planes for Stations 2,3,4
- Smaller Plane for Station 1
- Room Temperature
- Carbon Fiber Structure from LA company HYTEC

- Gerd J. Kunde - LANL

## Large Pixel Plane (10 modules)   

**Large Pixel Plane (10 modules)   **

- Active components on the PCB are repeaters and regulators
-  First version delivered

- Gerd J. Kunde - LANL

## Small Pixel Plane Concept  

- 4-5 Modules

- Gerd J. Kunde - LANL

## Module Mounting and Cooling

- PEEK tube

- HDI

- TPG

- Sensor
- Readout Chip

- Placing and wirebonding
- Cooling with **Fluorocarbon**  at temperature that keeps the HDI at assembly conditions

* ***Polyetheretherketones** (**PEEK**), also referred to as _[polyketones](http://en.wikipedia.org/wiki/Polyketone)_, are obtained from aromatic dihalides and bisphenolate salts by _[nucleophilic](http://en.wikipedia.org/wiki/Nucleophilic_substitution)__[ substitution](http://en.wikipedia.org/wiki/Nucleophilic_substitution)_.

- Gerd J. Kunde - LANL

## Cables to Pole Face

**Cables to Pole Face**

- Five flat cables either side of active area on plane
- 20 per large station, 12 per small station , total 72
- 48 low voltage, high voltage cables

- Gerd J. Kunde - LANL

## Status and Plans

- Status
- All FPIXs are procured
- All Si-detectors are procured
- 15 Hybrids are delivered
- 25 HDIs delivered, preparing production order
- Large Plane PCBs delivered
- Several test cards are ready
- Wire bonding at Si-det
- Test stands are ready
- Assembly jigs are ready

- Gerd J. Kunde - LANL

## Preproduction and Production Plan

- Proto (spare)
- Hybrid Test
- TPG
- TPG + Cooling
- PCB
- Mate PCB TPG
- 15 Modules on Cards
- Assemble Plane

- Production
- Hybrid Test
- TPG
- TPG + Cooling
- PCB 3 small - 6 large
- Mate PCB TPG
- 88 Modules on Cards
- Assemble Planes
- Assemble Stations
- Cage
- Assemble Detector
- LV-HV and Slow-Control
- Testbeam

- VTT Rework ?

- 15 *FPIX only* Modules on Cards
- Assemble Plane
- Readout Test

- Gerd J. Kunde - LANL

**iFVTX     **
**   **

- FPIX 2.1

- 20 Module Station

- 8 chip module

- 4 Pixel Planes

- Gerd J. Kunde - LANL

## Back-Up Material

- Gerd J. Kunde - LANL

## Production Flow

- Chip and Sensor Test
- Hybridization by VTT
- Hybrid Test
- HDI Electrical Test
- Module Assembly
- Test-card Assembly
- Test and Burn-in
- Pixel Plane Assembly
- Test and Burn-in

- Gerd J. Kunde - LANL