**ATLAS SCT: Cost & Schedule**

**US ATLAS DoE/NSF Review**

**29-Jan/2-Feb-2000**

**Alex Grillo**

**U.S. ATLAS E.T.C.**

# WBS Summary Cost Estimates

**Funding Source: All Funding Type: Project + MC**

**Institutions: All**

**Base Cont Cont Total EDIA Mfg EDIA Mfg FTEs FTEs**

**WBS Cost % Labor Labor Matls Matls Project Other**

**Number Description Cost (k\$) Cost**

**1.1.2 Silicon Strip System 5812 1581 27 7392 717 890 87 4117 27.6
6.0**

**1.1.2.1 IC Electronics 3672 983 27 4655 554 61 77 2980 10.6 0.7**

**1.1.2.1.1 Design 636 51 8 687 537 0 77 21 7.1 0.1**

**1.1.2.1.2 Development and Prototypes 106 8 7 114 17 0 0 89 0.8 0.0**

**1.1.2.1.3 Production 2931 925 32 3855 0 61 0 2870 2.8 0.6**

**1.1.2.2 Hybrids/Cables/Fanouts 973 209 21 1181 76 200 0 697 5.1 3.4**

**1.1.2.2.1 Design 0 0 0 0 0 0 0 0 0.0 1.6**

**1.1.2.2.2 Development and prototype 32 1 3 33 0 0 0 32 0.0 0.1**

**1.1.2.2.3 Production 941 208 22 1148 76 200 0 665 5.1 1.7**

**1.1.2.3 Module Assembly and Test 1167 389 33 1555 87 630 10 440 11.9
1.8**

**1.1.2.3.1 Design of assembly and test 127 42 33 168 87 40 0 0 1.0
0.7**

**1.1.2.3.2 Development and prototypes 57 13 24 70 0 50 0 7 0.6 0.0**

**1.1.2.3.3 Production 983 334 34 1317 0 541 10 433 10.3 1.1**

**The base cost shown here includes \$988k of Management Contingency
which is reserved completely in\
1.1.2.1.3 (IC production costs) in FY02.**

**U.S. ATLAS E.T.C.**

# WBS Profile Estimates

**Funding Source: All Funding Type: Project**

**Institutions: All**

**WBS FY 96 FY 97 FY 98 FY 99 FY 00 FY 01 FY 02 FY 03 FY 04 FY 05
Total**

**Number Description (k\$) (k\$) (k\$) (k\$) (k\$) (k\$) (k\$) (k\$)
(k\$) (k\$) (k\$)**

**1.1.2 Silicon Strip System 0 0 0 0 1101 2537 958 228 0 0 4824**

**1.1.2.1 IC Electronics 0 0 0 0 626 1759 174 125 0 0 2684**

**1.1.2.1.1 Design 0 0 0 0 250 131 131 125 0 0 636**

**1.1.2.1.2 Development and Prototypes 0 0 0 0 106 0 0 0 0 0 106**

**1.1.2.1.3 Production 0 0 0 0 270 1628 44 0 0 0 1943**

**1.1.2.2 Hybrids/Cables/Fanouts 0 0 0 0 177 380 383 33 0 0 973**

**1.1.2.2.1 Design 0 0 0 0 0 0 0 0 0 0 0**

**1.1.2.2.2 Development and prototype 0 0 0 0 32 0 0 0 0 0 32**

**1.1.2.2.3 Production 0 0 0 0 145 380 383 33 0 0 941**

**1.1.2.3 Module Assembly and Test 0 0 0 0 298 398 401 70 0 0 1167**

**1.1.2.3.1 Design of assembly and test 0 0 0 0 127 0 0 0 0 0 127**

**1.1.2.3.2 Development and prototypes 0 0 0 0 57 0 0 0 0 0 57**

**1.1.2.3.3 Production 0 0 0 0 114 398 401 70 0 0 983**

**IC Electronics Costs**

**The SCT Collaboration has selected as its baseline the single chip
solution using the DMILL technology.\
(Discussion of this decision will be in the parallel session
tomorrow.)**

**The cost database has been updated to reflect this.\
(i.e. two chip WBS elements replaced with one chip elements).**

**The production wafer costs assume that listed in the CERN/Temic Frame
Contract.\
The yield at wafer tests assumes the minimum yield guarantee also listed
in the Frame Contract.**

**The details of this costing were not included in the Cost Book due to
the confidentiality agreement between CERN and the wafer foundries. We
have authorization to discuss the details with the DoE reviewers upon
agreement to maintain the confidentiality.**

**The cost model assumes a yield through the assembly, test and
installation process of roughly 80%.**

**Details of the cost model including yields and wafer costs are
available in a spreadsheet for backup.**

**IC Electronics Schedule**

**Near term milestones:**

### Selection of ABCD/DMILL as baseline 24-Feb-2000

> **Final Design Review of ABCD 06-Mar-2000**
>
> **Submission of Pre-production fabrication early Apr-2000**
>
> **Possible second pre-production fabrication Jun-2000**
>
> **Wafers back from foundry Sep-2000**
>
> **ICs ready for Module 0 mid Oct-2000**

**Production milestones:**

> **Production Readiness Review Feb-2001**
>
> **Release full production fabrication Mar-2001**
>
> **Production fabrication complete May-2002**
>
> **Production IC testing complete Aug-2002**

**Hybrid & Module Costs**

## The SCT Collaboration has recently selected the Kapton technology for the readout hybrid. 

**The cost estimates in the database and the Cost Book were done
assuming the ceramic hybrid technology.**

> **This was viewed by the US to be the more conservative solution from
> the standpoint of reliability, understanding and cost.**
>
> **The SCT Collaboration believe the cost of the Kapton hybrid will be
> approximately 60% that of the ceramic option.**

**The US has not yet repeated the cost estimate at the level of detailed
required for our review.**

> **The new detailed US cost estimate and schedule will be completed by
> July-2000**
>
> **Given the current estimates of our collaborators, we do not believe
> the hybrid costs will exceed those in the current US estimates.**

**Module costs have been updated in a few areas**

> **Thermal baseboard parts and assembly(now to be done by CERN under
> formal agreement with ATLAS).**
>
> **Small changes in tooling/equipment based on experience with
> prototypes.**
>
> **However, labor estimates(time) have not changed since baseline.
> Expect ATLAS and/or US ATLAS review by November-2000.**

**Hybrid & Module Schedule**

**Near term milestones:**

### Selection of Kapton hybrid as baseline Feb-2000

> **New detailed US cost estimate Jul-2000**
>
> **Design Review of Hybrid/Module Nov-2000**
>
> **Start pre-production module assembly Nov-2000**
>
> **Complete pre-production module testing Mar-2001**

**Production milestones:**

> **Hybrid Production Readiness Review Feb-2001**
>
> **Module Production Readiness Review Mar-2001**
>
> **Complete hybrid production assembly and test Nov-2002**
>
> **Complete production module assembly, test and ship Apr-2003**