+---------------+------------------------------------------------------+
| **Title:**    | ## Micro-Opto-Electro-M                              |
|               | echanical Systems (MOEMS) Interconnects Reliability  |
+---------------+------------------------------------------------------+
|               | **** New Proposal **** Continuing NEPP Work        |
+---------------+------------------------------------------------------+
| **Total \$    |                                                      |
| Requested**   |                                                      |
|               |                                                      |
| **FY 02:**    |                                                      |
+---------------+------------------------------------------------------+
| **Technology  | **** Newly Available ****Emerging/Advanced         |
| Type:**       |                                                      |
+---------------+------------------------------------------------------+
|               |                                                      |
+---------------+------------------------------------------------------+
| **Project     | ****Parts **** Packaging ****Radiation            |
| Area:**       |                                                      |
+---------------+------------------------------------------------------+
| **Proposing   | Jet Propulsion Laboratory                            |
| Centers:**    |                                                      |
+---------------+------------------------------------------------------+
|               | 33.3% GSFC                                           |
|               |                                                      |
|               | 57.8% JPL 8.9% JSC                                   |
+---------------+------------------------------------------------------+
| **Co          | SIM optical mirror project, NGST using micromirrors  |
| llaborators** | (FY01 funding), MDL (Optics/deformable micromirror), |
|               | JPL led consortium under MEMS aspect of SIP, West    |
|               | Virginia University (NSF/NASA).                      |
+---------------+------------------------------------------------------+
| **Point of    | Dr. Reza Ghaffarian/JPL                              |
| Contact:**    |                                                      |
|               | 818-354-2059 (Tel)                                   |
|               |                                                      |
|               | 818-393-5245(FAX)                                    |
|               |                                                      |
|               | reza.ghaffarian@jpl.nasa.gov                         |
+---------------+------------------------------------------------------+
| **In          | Dr. Reza Ghaffarian                                  |
| vestigator:** |                                                      |
+---------------+------------------------------------------------------+
| **            | -   Characterize in process test methodology and     |
| Objectives:** |     quality assurance guidelines for                 |
|               |     commercial-off-the-shelf                         |
|               |     micro-opto-electromechanical systems (MOEMS).    |
|               |                                                      |
|               | -   Provide selection criteria for COTS sensors      |
|               |     especially targeted for space-flight             |
|               |     applications.                                    |
|               |                                                      |
|               | -   Provide information dissemination for various    |
|               |     aspects of MOEMs technology..                    |
+---------------+------------------------------------------------------+
| **Task        | Opto MEMs device and package interconnections will   |
| Description** | be test validated to determine their quality and     |
|               | reliability and develop inspection methodologies.    |
|               | The MOEMS have potential of replacing many large and |
|               | massive electrical, mechanical, and optical systems. |
|               | For example, for NGST mission, at least three        |
|               | independent proposals recommended the use of MOEMS.  |
|               | These included the use of micromirrors and           |
|               | deformable mirrors, and microshutters. In this task, |
|               | in addition to commercially available packages,      |
|               | devices developed by NASA and other industry team    |
|               | will be selected for generating statistically        |
|               | meaningful test results on interconnections and will |
|               | develop inspection procedures for manufacturing      |
|               | defect detection by inspection. Test results will    |
|               | provide as standard/inspection criteria guidance.    |
|               | Knowledge and experience gained by this task will be |
|               | used to effectively support NASA's projects in MOEMS |
|               | areas.                                               |
+---------------+------------------------------------------------------+
| **Task        | All four objectives of NEPP are met by this task.    |
| Approach to   | Quality and reliability of commercially available    |
| meeting NEPP  | MEOMS will be test validated to generate             |
| Objectives**  | statistically meaningful test results. Additional    |
|               | MOEMS package developed for high reliability         |
|               | including NASA missions will be also characterized   |
|               | to define their package interconnect failure         |
|               | mechanisms. The MOEM system interconnects will be    |
|               | subjected to environmental tests as needed and       |
|               | damage progress with time will be identified to      |
|               | provide criteria for early failures. Destructive     |
|               | failure analyses will be performed to establish      |
|               | failure type and bound critical parameters and to    |
|               | establish the most effective testing approaches.     |
|               | Results will be disseminated and will be published   |
|               | as a guidelines document. Knowledge and experience   |
|               | gained will be used to effectively support the       |
|               | projects in these areas.                             |
+---------------+------------------------------------------------------+
| **Technical   | Microelectromechanical Systems (MEMS) offer a        |
| Background**  | powerful new technology for mechanical, optical, RF, |
|               | and integrated systems. The integration of optics    |
|               | and MEMS has created a new class of MOEMS devices    |
|               | and integrated circuits that are smaller, faster,    |
|               | more accurate and rugged, and consume less power     |
|               | than macro scale devices. MEMS allow moveable        |
|               | micro-mechanical parts to be integrated with         |
|               | micro-optical elements and 3-D structures, enabling  |
|               | miniaturized free-space optical systems to be        |
|               | mass-produced at low cost by batch fabrication       |
|               | processes. Since the physical effect caused by       |
|               | mechanical movement is usually larger than           |
|               | conventional electro-optic or free-carrier effects,  |
|               | very efficient light modulators, switches, broadly   |
|               | tunable semiconductor lasers, detectors, and filters |
|               | can be realized with the optical MEMS technology.    |
|               | Applications of optical MEMS include fiber optic     |
|               | switches, optical crossconnect, display, optical     |
|               | data storage, modulators, and fiber optic sensors.   |
|               | Interconnect technology for integrated microoptics   |
|               | and micromechanical devices are complex and is not   |
|               | well understood. Test and validation quality and     |
|               | reliability, characterization techniques are needed  |
|               | for packaging and interconnection.                   |
|               | Commercial-off-the-shelf (COTS) technology are       |
|               | required to be used to test validate interconnect    |
|               | failure with statistically meaningful reliability    |
|               | data. Data generated could be used for future        |
|               | standardization of reliability test methodology for  |
|               | optical MEMS interconnects. Therefore, understanding |
|               | of optical MEMS reliability and technology assurance |
|               | issues are key to their wider acceptance towards     |
|               | high reliability applications as well as technology  |
|               | transfer their commercialization. Optical MEMS       |
|               | interconnect reliability is one of the most          |
|               | difficult questions to answer since they are still   |
|               | in their infancy, developed for specific             |
|               | applications, and reliability requirements vary and  |
|               | which frequently depend on the user requirements. In |
|               | spite of these differences, similar common           |
|               | methodologies could be developed for assessing       |
|               | qualification and reliability for those with similar |
|               | failure mechanisms.                                  |
+---------------+------------------------------------------------------+
| **Technical   | Review methodologies for characterization of second  |
| Approach**    | level optical MEM systems to provide selection       |
|               | approaches since there are no industry specification |
|               | on how to perform the system characterization for    |
|               | the integrated MOEMS technology and packaging.       |
|               | Representative COTS MOEMS will be selected to        |
|               | investigate quality and reliability of their         |
|               | interconnects. Additional package will be included   |
|               | for high reliability application. Candidate devices  |
|               | will be characterized and a few will be packaged and |
|               | used as benchmark. Additional testing for NASA's     |
|               | missions will be also performed on both high         |
|               | reliability and COTS MOEMS by NASA centers. Modeling |
|               | will be performed to optimize package configuration  |
|               | and further project interconnect reliability.        |
|               | Methodologies similar to those developed under four  |
|               | JPL-led consortia in characterization of advanced    |
|               | electronics packaging and MEMS interconnects will be |
|               | adapted for the MOEMS with inclusion of specific     |
|               | needs for integration of optics and MEMS and their   |
|               | interconnections. Packages and attachments will be   |
|               | subjected to non-destructive evaluation to           |
|               | characterize manufacturing defect types and          |
|               | frequencies. The MOEMS system interconnects will be  |
|               | subjected to environmental tests as needed and       |
|               | damage progress with time will be identified to      |
|               | provide criteria for early failures. Destructive     |
|               | failure analyses (DPA) will be performed to          |
|               | establish failure type and bound critical parameters |
|               | and to establish the most effective testing          |
|               | approaches. Results will be disseminated as          |
|               | standard/inspection criteria guidelines. We will use |
|               | knowledge and experience gained during this task to  |
|               | effectively support NASA' projects in MOEMS areas.   |
+---------------+------------------------------------------------------+
|               |                                                      |
+---------------+------------------------------------------------------+
| **NASA        | CISM, X-2000, X-33, NGST, Gossamer Telescope, SIM,   |
| Customers:**  | TPF (Terrestrial Planet Finder), SRTM, HEDS, Space   |
|               | Shuttle/Station, Collaborate with the MDL Lab.       |
+---------------+------------------------------------------------------+
| **De          | -   Report on test methodologies procedures with     |
| liverables:** |     quality and reliability data                     |
|               |                                                      |
|               | -   Test vehicle assemblies with quantifiable test   |
|               |     data                                             |
|               |                                                      |
|               | -   Quality and reliability indicators and plots     |
|               |                                                      |
|               | -   Quality assurance guidelines                     |
|               |                                                      |
|               | -   Technical papers in NASA EEE Links,              |
|               |     industry-wide conferences and trade magazines    |
+---------------+------------------------------------------------------+

**Schedule:**

![](media/image1.wmf){width="6.472222222222222in"
height="3.3958333333333335in"}

1.  List of Procurements

Package /PWB/Assembly

Inspection and failure characterization

Unique testing

MDL entrance fees \$8,500

> Manpower Loading Average Heads (FTEs)

  --------------- -------------- -------------- ------------- ------------
                  **Q1**         **Q2**         **Q3**        **Q4**

  NASA            **.54**        **.54**        **.54**       **.54**

  JPL             **.16**        **.57**        **.51**       **.61**

  Contractor                                    **.1**        

  Consultant/                                                 
  University                                                  
  --------------- -------------- -------------- ------------- ------------

+---------------+------------------------------------------------------+
| *             | Will leverage from the NASA centers and several      |
| *Leveraging** | consortia for microelectronics and MEMS. These       |
|               | include: collaboration with NGST micromirror and     |
|               | microshutter MOEMS project, MDL deformable mirror,   |
|               | SIM/Terrestrial Planet Finder for MOEMS and optical  |
|               | switches. Will extend current collaboration between  |
|               | JPL/Aerospace/JSC to evaluate COTS MOEMS, NASA-Wide  |
|               | consortium concentrating on teaming and              |
|               | understanding needs of different centers and         |
|               | knowledge exchange, and will closely monitor West    |
|               | Virginia on development of an optical approach for   |
|               | quality and reliability assurance of package. All    |
|               | activities are designed such to have a coherent work |
|               | among various tasks on this subject within JPL and   |
|               | other NASA centers.                                  |
|               |                                                      |
|               | **JPL (506)/Dr. Reza Ghaffarian**: Organize          |
|               | NASA/industry-wide consortia activities to meet the  |
|               | objectives of the program at NASA centers as well as |
|               | industry partners. Perform environmental data        |
|               | correlation to failure to establish link between     |
|               | control parameters and life for package system level |
|               | interconnects. Coordinate release of NASA/IPC        |
|               | interconnect reliability guidelines for this         |
|               | technology.                                          |
|               |                                                      |
|               | **JPL (SIM-383)/Dr. A. Azizi:** Support in the area  |
|               | of optics specifically perform optical               |
|               | characterization of micromirrors supplied by GSFC    |
|               | and leveraging the SIM optical facility. Review two  |
|               | aspects of optical MEMS (micrmirrors and optical     |
|               | switching) for implementation into current SIM and   |
|               | future planet finder projects. Suppoet in            |
|               | preparation of MOEMS guidelines document in the area |
|               | of optics.                                           |
|               |                                                      |
|               | **GSFC/Dr. S. B. Dutta** Provide support on          |
|               | definition of test matrix design of experiment and   |
|               | reliability requirement for micromirror devices      |
|               | proposed for NGST program. Provide samples and       |
|               | perform reliability test for comparison to those     |
|               | commercially available. Leverage through cold        |
|               | electronic task to perform cryogenic thermal         |
|               | exposure to meet requirement. Provide inputs into    |
|               | guidebook.                                           |
|               |                                                      |
|               | **GSFC/H. Shaw/A. Sharma**: Provide support on test  |
|               | matrix design of experiment and package              |
|               | characterization and modeling for high reliability   |
|               | applications of micromirrors in coordination with    |
|               | Dr. Dutta. Provide inputs into guidebook.            |
|               |                                                      |
|               | **JSC/Alice Lee**: Provide support through this      |
|               | program. Similar to COTS MEMS program solicit JSC's  |
|               | internal fund to collaborate with industry for MOEMS |
|               | use for Space Shuttle and Space Station. Initially,  |
|               | identify areas of potential application by review of |
|               | current optical applications. Based on the results,  |
|               | further identify potential applications through      |
|               | interface with projects at JSC. Provide a report for |
|               | internal use and inclusion in NASA/IPC guidelines    |
|               | document.                                            |
|               |                                                      |
|               | **Dr. Rajeshuni Ramesham**: Provide technical        |
|               | support in the areas of selection of COTS MOEMs      |
|               | package/assembly and qualification approaches.       |
|               | Support in preparation of guidelines document for    |
|               | NASA and industry use.                               |
|               |                                                      |
|               | **Information Management and Dissemination           |
|               | Project**: Collaborate with NASA's project/mission   |
|               | assurance leaders and disseminate information as     |
|               | needed.                                              |
|               |                                                      |
|               | **NASA Training course**. Collaborate with the JPL   |
|               | and GSFC training centers to develop a training      |
|               | course for effective NASA-wide training and another  |
|               | vehicle for information dissemination.               |
|               |                                                      |
|               | **Association Connecting Electronics Industries      |
|               | (IPC)** : Collaborate to release NASA/IPC guidelines |
|               | for this technology                                  |
+---------------+------------------------------------------------------+
|               |                                                      |
+---------------+------------------------------------------------------+