+---------------+------------------------------------------------------+
| **Title:**    | ## Interconnect Reliability of Cold Electronics      |
+---------------+------------------------------------------------------+
|               | **** New Proposal **** Continuing NEPP Work        |
+---------------+------------------------------------------------------+
| **Total \$    |                                                      |
| Requested for |                                                      |
| FY 02:**      |                                                      |
+---------------+------------------------------------------------------+
| **Technology  | **** Newly Available (COTS) ****Emerging/Advanced  |
| Type:**       |                                                      |
+---------------+------------------------------------------------------+
|               |                                                      |
+---------------+------------------------------------------------------+
| **Project     | ****Parts **** Packaging ****Radiation            |
| Area:**       |                                                      |
+---------------+------------------------------------------------------+
| **Proposing   | Jet Propulsion Laboratory                            |
| Center:**     |                                                      |
+---------------+------------------------------------------------------+
| **            |                                                      |
| Participating |                                                      |
| Centers:**    |                                                      |
+---------------+------------------------------------------------------+
| **Co          | Leverage for FY01 **3:1**, MUSES CN, Mars            |
| llaborators** | Exploration Programs, MER, CISM, NGST, GRC, LaRC     |
+---------------+------------------------------------------------------+
|               |                                                      |
+---------------+------------------------------------------------------+
| **Point of    | Reza Ghaffarian                                      |
| Contact:**    |                                                      |
|               | 818-354-2059 (Tel)                                   |
|               |                                                      |
|               | 818-393-5245(FAX)                                    |
|               |                                                      |
|               | reza.ghaffarian@jpl.nasa.gov                         |
+---------------+------------------------------------------------------+
| **In          | Dr. Rajeshuni Ramesham                               |
| vestigator:** |                                                      |
+---------------+------------------------------------------------------+
| **            | -   Identify manufacturing processes, materials,     |
| Objectives:** |     quality, and reliability of interconnects        |
|               |     required for extreme temperature electronic      |
|               |     missions, e.g., Mars's exploration programs.     |
|               |     Evaluation will include development of           |
|               |     validation, assessment and test methods/tools,   |
|               |     advanced interconnect technology evaluation,     |
|               |     process characterization and interconnect        |
|               |     reliability guidelines as they relate to extreme |
|               |     temperatures with emphasis on cold temperature   |
|               |     systems.                                         |
|               |                                                      |
|               | -   Disseminate information on quality assurance and |
|               |     reliability to NASA community as well as         |
|               |     industry.                                        |
+---------------+------------------------------------------------------+
| **Task        | Microelectronics is key enabler in meeting most      |
| Description** | NASA's critical requirements for miniaturized        |
|               | spacecrafts. Significant weight and cost saving will |
|               | be achieved if they meet their life expectancy at    |
|               | extreme temperatures without the use of heavy and    |
|               | costly additional heating and cooling systems. DS-2  |
|               | and MUSES CN NASA programs needed functionality at   |
|               | extremely cold temp to --120°C (even lower to        |
|               | -180°C) such requirement and are considered for Mar  |
|               | Exploration Programs. Behavior of package and solder |
|               | joint at extreme temperature are not well understood |
|               | since these environments are generally unique to the |
|               | solar systems and therefore NASA's missions. This    |
|               | task will address many quality and reliability       |
|               | assessment issues for high reliability conventional  |
|               | and advanced microelectronic packages as well as     |
|               | their commercial-off-the-shelf (COTS) versions.      |
+---------------+------------------------------------------------------+
| **Task        | Collaboration in FY01 between                        |
| Approach to   | projects/parts/packaging enabled to characterize     |
| meeting NEPP  | quality and reliability of numerous devices needed   |
| Objectives**  | for the NASA's projects. We also closely             |
|               | collaborated with MUSES CN and Mars Exploration      |
|               | Program to evaluated behavior of numerous packages   |
|               | to --180°C. Exposure and the number of thermal       |
|               | cycles were expanded beyond these mission to cover   |
|               | the needs of other NASA's missions. In addition to   |
|               | the test vehicles built using SMT and BGAs, other    |
|               | test vehicles with advanced miniature packages       |
|               | including chip scale packages will be included in    |
|               | the test validation of quality and reliability of    |
|               | solder joint under extreme temperature environments  |
|               | meeting another objectives of NEPP. Results will be  |
|               | disseminated by publishing detailed reliability      |
|               | Weibull data and failures for the weakest links as a |
|               | guidelines document. In addition, knowledge and      |
|               | experience gained will enable us to effectively      |
|               | support the projects in these areas. This task will  |
|               | meet all four objectives of the NEPP program.        |
+---------------+------------------------------------------------------+
|               |                                                      |
+---------------+------------------------------------------------------+
| **Technical   | JPL now become the core knowledge base for SMT and   |
| Background**  | advanced packaging interconnection with emphasis on  |
|               | quality and reliability assurance. JPL has formed    |
|               | numerous industry-wide consortia including ball grid |
|               | array (BGA) and chip scale package (CSP) to gather   |
|               | test results information on quality and reliability  |
|               | for NASA/Aerospace/Military/Commercial use. Reported |
|               | interconnection reliability test data are for the    |
|               | common applications and therefore data do not        |
|               | include the more extreme environment. Electronics    |
|               | exposed on Mars reaching cold temperature            |
|               | significantly lower than --55°C specified by package |
|               | manufacturers. Understanding quality assurance       |
|               | issues of package and interconnection of             |
|               | conventional and advanced packaging are essential to |
|               | meet NASA's current and future needs.                |
+---------------+------------------------------------------------------+
| **Technical   | Optimum packages and manufacturing parameters will   |
| Approach**    | be selected from our prior SMT and BGA consortia     |
|               | investigations to study quality and reliability of   |
|               | solder joint reliability under extreme temperature   |
|               | environments. This study will characterize           |
|               | temperature aging and cycling behavior of several    |
|               | packages and interconnect materials systems to       |
|               | establish the weakest link failure mechanisms.       |
|               | Damage progress for assemblies and tested packages   |
|               | will be determined to Assess if there are indicators |
|               | for early failure warning and the risk associated    |
|               | with exposure to extreme temperatures. Will identify |
|               | the enabling technologies needed to improve          |
|               | reliability and lifetime of electronic packaging     |
|               | including applicability of LaRC-SI. Conventional low |
|               | temperature (e.g. In/Pb) and high temperature (e.g.  |
|               | 90/10) interconnect materials will be evaluated as   |
|               | needed to determine their performance limitations.   |
|               | Furthermore, defects correlation to reliability will |
|               | be established for extreme environmental             |
|               | applications based on the results of non-destructive |
|               | evaluation (NDE) and destructive physical analyses   |
|               | (DPA). Critical parameters will be bound to provide  |
|               | standards/inspection criteria guidelines. Results    |
|               | will be disseminated by publishing detailed          |
|               | reliability Weibull data and failures for the        |
|               | weakest links. We will use knowledge and experience  |
|               | gained to effectively support the projects in these  |
|               | areas for NASA's missions.                           |
+---------------+------------------------------------------------------+
| **NASA        | Mars Exploration program, GIFT, X-2000, HEDS at JPL, |
| Customers:**  | PICASSO, GAMS, STS, at LARC, Next Generation         |
|               | Telescope (NGST) at GSFC, Defect Detection and       |
|               | Prevention Program at GRC, JPL-led consortia (see    |
|               | below), Virginia power through LaRC, and University  |
|               | of Akron through GRC. FY00 supported MUSES CN, but   |
|               | unfortunately this program was cancelled. Contact    |
|               | names: D. Mcwatters, Mike Newel, Ross Jones, Don     |
|               | Noon.                                                |
+---------------+------------------------------------------------------+
| *             | -   Reliability data on the various packages and     |
| *Deliverables |     interconnect technologies showing the influence  |
| &             |     of package and manufacturing defects on circuit  |
| Milestones:** |     life (D)                                         |
|               |                                                      |
|               | -   Report showing failure mechanism differences     |
|               |     between standard and extreme environments on     |
|               |     conventional PWB materials and LARC-SI (D)       |
|               |                                                      |
|               | -   Inspection (acceptance/rejection) methodologies, |
|               |     tools, and criteria (D)                          |
|               |                                                      |
|               | -   Quality Assurance guidelines and training course |
|               |     (D)                                              |
|               |                                                      |
|               | -   Inputs to the Defect Detection and Prevention    |
|               |     Program for extreme temperature applications (M) |
|               |                                                      |
|               | -   Technical papers in NASA EEE Links,              |
|               |     industry-wide conferences and trade magazines    |
|               |     (D)                                              |
|               |                                                      |
|               | -   Report on the quality assurance and reliability  |
|               |     test performed in collaboration with MER (D)     |
|               |                                                      |
|               | -   Report on program status of joint technology     |
|               |     effort with Mar09 (D)                            |
|               |                                                      |
|               | -   Report on inspection and failure analysis of     |
|               |     package/assemblies including LCC20 and SMD2      |
|               |     before and after thermal exposure (D)            |
|               |                                                      |
|               | -   Complete report document D-20434, "Assessment of |
|               |     Electronics for Extreme Cold Environments" (D,M) |
|               |                                                      |
|               | -   Status publication in EEE links and NEPP web     |
|               |     site as well as papers for journal publication   |
|               |     and conference proceedings (D,M)                 |
|               |                                                      |
|               | -   Guidelines/training course materials for NASA    |
|               |     community (D, M).                                |
+---------------+------------------------------------------------------+

**Schedule:**

![](media/image1.wmf){width="6.625in" height="4.96875in"}

List of Procurements:

Package/PWB/Assembly

Inspection and failure characterization tools

> Manpower Loading: Average Heads (FTEs)

  --------------- -------------- -------------- ------------- ------------
                  **Q1**         **Q2**         **Q3**        **Q4**

  NASA            **0.1**        **0.2**        **0.2**       **0.1**

  JPL             **0.64**       **0.64**       **0.64**      **0.64**

  Contractor                     **0.1**        **0.1**       

  Consultant/                                                 
  University                                                  
  --------------- -------------- -------------- ------------- ------------

+---------------+------------------------------------------------------+
| **            | **JPL/Dr. R. Ghaffarian/Dr. R. Ramesham**: Organize  |
| Leveraging:** | NASA/industry-wide consortia activities to meet the  |
|               | objectives of the program at NASA centers as well as |
|               | industry partners. Perform the majority of           |
|               | controlled thermal cycling and failure analyses to   |
|               | establish link between control and extreme life      |
|               | cycle correlation. Coordinate release of NASA/IPC    |
|               | interconnect reliability guidelines for extreme      |
|               | temperatures applications.                           |
|               |                                                      |
|               | **GRC/Richard Patterson**: Provide thermal cycling   |
|               | support on assemblies using their low temperature    |
|               | facility, characterize functional behavior of        |
|               | representative packages over extreme temperature     |
|               | range, investigate failures phenomena due to aging   |
|               | and thermal cycling under the extreme conditions,    |
|               | provide findings as input to the Defect Detection    |
|               | and Prevention Program (DDPP).                       |
|               |                                                      |
|               | **LaRC/Ottis Riggins**: Provide LaRC-SI materials as |
|               | flex and rigid printed circuit boards and guidelines |
|               | for use in assemblies. Characterize behavior of      |
|               | circuit boards under extreme temperature environment |
|               | at LaRC. Investigate physical and mechanical, e.g.   |
|               | fatigue, characteristics of LaRC-SI and              |
|               | off-the-shelf materials in cold environment.         |
|               |                                                      |
|               | **GSFC/H. Shaw/A. Sharma**: Define the needs of NGST |
|               | program at GSFC specifically packaging and board lay |
|               | up and materials. Select one generic aspect and      |
|               | perform characterization at GSFC using cold          |
|               | environmental chamber being purchased at GSFC.       |
|               | Provide input into final cold electronic guideline   |
|               | document for NASA/industry use and training          |
|               | materials for JPL/GSFC Training Center.              |
|               |                                                      |
|               | **Industry Consortia**: Leverage from a large number |
|               | of test vehicles built under JPL led consortia       |
|               | including microBGA and chip scale package.           |
|               | Collaborate with other industry consortia including  |
|               | ITRI, Sematech, and NCMS. The consortia team members |
|               | include: Boeing, Raytheon, TRW, ITT, Litton, USAF,   |
|               | Harris, Sandia National Labs., Micron, Sun           |
|               | Microsystems, StorageTek, Siemens, Hughes Network    |
|               | Systems, Amkor, Kyocera, Abpac, AMD, Sony, GE,       |
|               | Mitsubishi, EPIC, Irvine Sensors, LG Semicon, Flip   |
|               | Chip. We have contacted other industry including     |
|               | APL, Aerospace Corp., Aerojet, and Honeywell for     |
|               | additional resources. We will expand and include     |
|               | additional consortia team members with a unique      |
|               | experience as needed.                                |
|               |                                                      |
|               | **Information Management and Dissemination           |
|               | Project**: Collaborate with NASA's project/mission   |
|               | assurance leaders and disseminate information as     |
|               | needed.                                              |
|               |                                                      |
|               | **NASA Training course**. Collaborate with JPL and   |
|               | GSFC training centers to develop a training course   |
|               | for effective NASA-wide training which is another    |
|               | vehicle for information dissemination.               |
|               |                                                      |
|               | **Association Connecting Electronics Industries      |
|               | (IPC)** : Collaborate to release NASA/IPC guidelines |
|               | for this technology                                  |
+---------------+------------------------------------------------------+