## Database for Solder Properties with Emphasis on New Lead-free Solders

## 

## National Institute of Standards and Technology

&

Colorado School of Mines

## Properties of Lead-Free Solders

**Release 4.0**

## Dr. Thomas Siewert

National Institute of Standards and Technology

**Dr. Stephen Liu**

Colorado School of Mines

**Dr. David R. Smith**

National Institute of Standards and Technology

**Mr. Juan Carlos Madeni**

Colorado School of Mines

Colorado, February 11, 2002

## Properties of Lead-Free Solders

Disclaimer: In the following database, companies and products are
sometimes mentioned, but solely to identify materials and sources of
data. Such identification neither constitutes nor implies endorsement by
NIST of the companies or of the products. Other commercial materials or
suppliers may be found as useful as those identified here.

**Note:** Alloy compositions are given in the form
"Sn-2.5Ag-0.8Cu-0.5Sb," which means: 2.5 % Ag, 0.8 % Cu, and 0.5 % Sb
(percent by mass), with the leading element (in this case, Sn) making up
the balance to 100 %.

**Abbreviations for metallic elements appearing in this database:**

  ----------------------- ----------------------- -----------------------
  **Ag:** silver          **Cu:** copper          **Pt:** platinum

  **Al:** aluminum        **In:** indium          **Sb:** antimony

  **Au:** gold            **Mo:** molybdenum      **Sn:** tin

                                                  

  **Bi:** bismuth         **Ni:** nickel          **W:** tungsten

  **Cd:** cadmium         **Pb:** lead            **Zn:** zinc

  **Cr:** chromium        **Pd:** palladium       

  **Sn-Ag-Cu:** Refers to                         
  compositions near the                           
  eutectic                                        
  ----------------------- ----------------------- -----------------------

Table of Contents:

1.  **Mechanical Properties:** creep, ductility, activation energy,
    elastic modulus, elongation, strain rate, stress relaxation, tensile
    strength, yield strength

> Table 1.1. Strength and Ductility of Low-Lead Alloys Compared with
> Alloy Sn-37Pb (NCMS Alloy A1), Ranked by Yield Strength (15 Alloys)
> and by Total Elongation (19 Alloys)
>
> Table 1.2. Tensile Properties of Lead-Free Solders (two parts)
>
> Table 1.3. Elastic Properties of Sn-37Pb (eutectic) and Sn-3.5Ag

###### Table 1.4. Elastic Properties of Sn-2.5Ag-0.8Cu-0.5Sb (Castin™) and Sn-37Pb Eutectic-A {#table-1.4.-elastic-properties-of-sn-2.5ag-0.8cu-0.5sb-castin-and-sn-37pb-eutectic-a .unnumbered}

###### Table 1.5. Elastic Properties of Sn-2.5Ag-0.8Cu-0.5Sb (Castin™) and Sn-37Pb Eutectic-B {#table-1.5.-elastic-properties-of-sn-2.5ag-0.8cu-0.5sb-castin-and-sn-37pb-eutectic-b .unnumbered}

1.  

> Table 1.6. Parameters for Strain Rate: Norton Equation, dε/dt =
> A·σ^n^·exp(-Q/(RT)); Dorn Equation, dε/dt = A·(σ^n^/T)·exp(-Q/(RT));
> Stress-relaxation Rate, dσ/dt = A·(σ-σ~t~)^n^ ·exp(-Q/(RT)); and
> Strain-Rate Sensitivity, σ = C·(dε/dt)^m^; for Two Lead-Free Solder
> Alloys, Sn-3.5Ag and Sn-9Zn.

Table 1.7. Steady-State Creep Properties and Associated Mechanisms for
Three Lead-Free Solders and Sn-37Pb Eutectic

Table 1.8. Stress Exponents and Activation Energies for Dorn Equation
for Tin and Four Lead-Free Solder Alloys

Table 1.9. Activation Energy versus Strain Rate for Two Lead-Free
Eutectic Solders (Sn-3.5Ag and Sn-9Zn)

> Table 1.10. Elastic Properties of Metallic Elements Used In Electronic
> Packaging
>
> Table 1.11. Material Properties of a Via-in-Pad Chip-Scale Package
> Printed Circuit Board (PCB) Assembly

###### Table 1.12. Elastic Properties and Thermal Expansion Coefficient of Electronic-Packaging Materials and Lead Solder Alloys {#table-1.12.-elastic-properties-and-thermal-expansion-coefficient-of-electronic-packaging-materials-and-lead-solder-alloys .unnumbered}

> Table 1.13. Lead-Free Solder Alloys: Tensile and Shear Strengths
>
> Table 1.14. Lead-Containing Solder Alloys: Tensile and Shear Strengths
>
> Table 1.15. Shear Strengths of Three Lead-Free Solders and Tin-Lead
> Eutectic (by Ring-and-Plug Test)
>
> Table 1.16. Mechanical Properties of Tin, Tin-Lead, and Four Lead-Free
> Solder Alloys (by Ring-and-Plug Tests)
>
> Table 1.17. Shear Strengths, Solidus and Liquidus Temperatures, and
> Wetting Angles of Experimental Sn-Ag-Cu Solder Alloys
>
> Table 1.18. Physical and Mechanical Properties of Lead-Free Alloys and
> Sn-37Pb (eutectic)
>
> Table 1.19. Pure Copper, Tin and Nickel, and Their Intermetallics:
> Room-Temperature Physical and Thermal Properties
>
> Table 1.20. Effects of Transition Metals on Vickers Hardness and
> Ultimate Tensile Strength of Sn-4.7Ag-1.7Cu Solder Alloys
>
> Table 1.21.1. SnAgCu Dynamic Elastic Constant
>
> Table 1.21.2. SnAgCu Dynamic Elastic Constant (cont.)
>
> Table 1.22.1. SnAgCu Elastic Properties vs. Temperature
>
> Table 1.22.2. SnAgCu Elastic Properties vs. Temperature (cont.)
>
> Table 1.22.3. SnAgCu Elastic Properties vs. Temperature (cont.)
>
> Table 1.22.4. SnAgCu Elastic Properties vs. Temperature (cont.)
>
> Table 1.22.5. SnAgCu Elastic Properties vs. Temperature (cont.)
>
> Table 1.22.6. SnAgCu Elastic Properties vs. Temperature (cont.)
>
> Table 1.23. SnAgCu - Coefficient of Thermal Expansion Data. Sample
> As-cast #1
>
> Table 1.24. SnAgCu - Coefficient of Thermal Expansion Data. Sample
> As-cast #2
>
> Table 1.25. SnAgCu - Coefficient of Thermal Expansion Data. Sample
> Aged #1
>
> Table 1.26. SnAgCu - Coefficient of Thermal Expansion Data. Sample
> Aged #2
>
> Table 1.27. Mechanical Properties of Three Selected Pb-free Alloys:
> Sn-3.2Ag-0.8Cu, Sn-3.5Ag, and Sn-0.7Cu
>
> Figure 1.1. Creep data at 75^o^C for Sn-Ag-Cu, Sn-Ag-Bi, Sn-Ag, Sn-Bi,
> and Sn-Pb solder alloys

2\. Thermal Properties

**2.1. Solidus, Liquidus, and Melting-Point Temperatures**

> Table 2.1.1. Liquidus and Reflow Temperatures of Candidate Lead-Free
> Solder Alloys for Replacing Eutectic Tin-Lead Solder

####### Table 2.1.2. Melting Temperatures of Lead-Free Solders (two parts) {#table-2.1.2.-melting-temperatures-of-lead-free-solders-two-parts .unnumbered}

**2.2. Thermal Properties: Miscellaneous**

> Table 2.2.1. Thickness (μm) of Intermetallics in Solder Alloys Aged at
> 150 ºC
>
> Table 2.2.2. Thermal and Electrical Properties of Castin™
> (Sn-2.5Ag-0.8Cu-0.5Sb)
>
> Table 2.2.3. Physical and Mechanical Properties of Sn-2.8Ag-20.0In and
> Sn-37Pb Eutectic Solders
>
> Table 2.2.4. Some Physical Properties of Materials Used as Electronic
> Packaging Conductors
>
> Table 2.2.5. Thermophysical Properties of Metallic Elements Used In
> Electronic Packaging
>
> Table 2.2.6. Some Properties of Materials Commonly Used In Electronics
> -- A
>
> Table 2.2.7. Some Properties of Materials Commonly Used In Electronics
> -- B
>
> Table 2.2.8. Electrical Resistivity and Temperature Coefficient of
> Resistance (TCR) of Pure Metallic Elements Used in Electronic
> Packaging
>
> Table 2.2.9. Wetting Properties of Sn-2.8Ag-20.0In and Sn-37Pb
> Eutectic Solders
>
> Table 2.2.10. Wetting Times and Forces (at 300 ºC): Lead-Free Solder
> Alloys, and Eutectic Tin-Lead
>
> Table 2.2.11. Wetting Times (at 250 ºC) of Lead-free Solder Alloys
>
> Table 2.2.12. Onset of Melting Temperatures for Five Sn-Ag-Cu
> Lead-Free Solder Alloys
>
> Table 2.2.13. Solidus Temperatures and Wetting Contact Angles of
> Selected Lead-Free Solder Alloys with Use of RMA (GF-1235) Flux
>
> Table 2.2.14. Solidus and Liquidus Temperatures and Wetting Angles of
> Some Lead-Free Alloys on Copper
>
> Table 2.2.15. Melting Properties, Resistivity, Wettability and
> Hardness of Lead-Free Solders
>
> Table 2.2.16. Wetting Contact Angles of Sn-Ag, Sn-Bi, and Sn-Zn Alloys
> on Copper: Eutectic, and With 1% Addition of Ternary Elements
>
> Table 2.2.17. Wetting Contact Angles on Copper of Sn-Bi Alloys:
> Eutectic, and With 1% Addition of Ternary Elements
>
> Table 2.2.18. Wetting Properties of Pure Tin, Four Lead-Free Tin
> Alloys and Three Lead-Tin Alloys
>
> Table 2.2.19. Lead-Free Solder Alloys: Solidus and Liquidus
> Temperatures, Coefficient of Thermal Expansion, Surface Tension, and
> Electrical Resistivity
>
> Table 2.2.20. Fluid Properties of Some Molten Lead-Free Solders
>
> Table 2.2.21. Densities and Costs of Popular Solder Metals and Alloys
> -- A
>
> Table 2.2.22. Densities and Costs of Popular Solder Metals and Alloys
> -- B
>
> Table 2.2.23. Cost of Lead-Free Solder Alloys Relative to That of
> Sn-37Pb Eutectic
>
> A. Solder Alloys for Plated-Through Holes

# 

1.  **Candidate Alloys for Replacing Lead-Alloy Solders**

###### Table 3.1. Criteria for Down-Selection of Lead-Free Alloys {#table-3.1.-criteria-for-down-selection-of-lead-free-alloys .unnumbered}

> Table 3.2. Chemical Compositions of 79 Lead-Free Solder Alloys
> Down-Selected for Preliminary Testing by the National Center for
> Manufacturing Sciences (NCMS).

##### Miscellaneous

A.  Major Considerations for Replacement Lead-Free Solders

> Table 4.1. Designation and Composition of Lead-Free Solders.

2.  Useful References

    1.  References to Tabular Data

    2.  Reference Books

    3.  Useful URLs

**Key words:** alloys, aluminum, antimony, atomic weight, bibliography,
bismuth, Castin, chemical, chromium, coefficient, composition,
conductivity, copper, costs, creep, ductility, elastic, electrical,
electronic, elements, elongation, eutectic, expansion, gold, hardness,
indium, intermetallic, lead, lead-free, liquidus, material, mechanical,
melting, metallic, modulus, molybdenum, nickel, packaging, palladium,
physical, platinum, Poisson ratio, PCB, printed circuit board,
properties, replacement, resistivity, silver, solders, solidus,
strength, surface tension, temperature, tensile, thermal,
thermophysical, tin, tungsten, viscosity, wetting, Young's modulus, zinc

Useful Conversion Factors

> **Standard Acceleration of Gravity, g:**
>
> g = 32.174 f/s^2^ **=** 9.80665 m/s^2^ (not to be confused with
> "gram", g)
>
> **Electrical Conductivity:**
>
> 1 S (siemens) = 1 Ω^--1^ (reciprocal ohm)
>
> Density:
>
> 1 g/cm^3^ = 0.036127 lb~m~/in^3^ = 62.428 lb~m~/ft^3^
>
> **Energy:**
>
> 1 cal = 4.187 J (joule)
>
> 1 Btu = 1055.056 J = 252 cal = 0.252 kcal (kilocalories)
>
> **Force:**
>
> 1 lb~f~ = 4.4482 N (newton)
>
> 1 kg~f~ = 9.80665 N
>
> 1 dyne = 10^--5^ N
>
> **Length:**
>
> 1 in = 2.54 cm = 0.0254 m (exact)
>
> 1 f t = 30.48 cm = 0.3048 m (exact)
>
> **Mass:**
>
> 1 lb~m~ = 0.45359 kg; 1kg = 2.20463 lb~m~
>
> **Pressure (or Tensile stress):**
>
> 1 Pa (pascal) = 1 N/m^2^
>
> 1 psi = 6894.76 Pa = 6.89476 kPa
>
> 1 kps = 6.89476 MPa
>
> **Specific Heat (Capacity):**
>
> 1 cal/(g∙K) = 1 Btu/(lb~m~ ∙F) = 4.187 J/(kg ∙K)

# Temperature; temperature intervals:

> Fahrenheit temperature F = 1.8∙C + 32, where C is Celsius
> [temperature]{.underline}
>
> Kelvin temperature K = C + 273.15
>
> 1 K (1 kelvin) = 1 ºC (1 Celsius degree) = 1.8 ºF (1 Fahrenheit degree
> = temperature [interval]{.underline})
>
> **Thermal Conductivity:**
>
> 1 W/(m∙K) = 0.5778 Btu/(ft∙hr ∙˚F)

**Explanatory Note:**

This version (11 February 2002) represents our present collection of
information on properties of lead-free solders. We are just now
beginning to have enough properties data to begin consolidating
duplicate data, to better organize the tables into a more useful order,
and to begin some evaluation of uncertainties. Also, no systematic
mining of resources from journals that publish articles on relevant
properties of lead-free solders has yet been done by us, but is a
planned next step. However these next steps await further funding. We
hope to greatly extend the work beyond this present state into a larger
and more useful one. Your patience is appreciated. -- the authors

1\. Mechanical Properties: creep, ductility, activation energy, elastic
modulus, elongation, strain rate, stress relaxation, tensile strength,
yield strength

[Table 1.1.]{.underline} Strength and Ductility of Low-Lead Alloys
Compared with Alloy Sn-37Pb (NCMS Alloy Code A1), Ranked by Yield
Strength (15 Alloys) and by Total Elongation (19 Alloys)

+-----+------------------+--------+-----+------------------+---------+
| **A | **Alloy**        | **Y    | **A | **Alloy**        | **      |
| llo |                  | ield** | llo |                  | Total** |
| y** | **Composition**  |        | y** | **Composition**  |         |
|     |                  | **Stre |     |                  | **Elong |
| **  |                  | ngth** | **  |                  | ation** |
| Cod |                  |        | Cod |                  |         |
| e** |                  | **(    | e** |                  | **(%)** |
|     |                  | psi)** |     |                  |         |
+-----+------------------+--------+-----+------------------+---------+
| C5  | Sn               | 14,560 | B6  | Sn-56Bi-2In      | 116     |
|     | -2Ag-9.8Bi-9.8In |        |     |                  |         |
+-----+------------------+--------+-----+------------------+---------+
| F1  | Sn               | 12,370 | F15 | Sn‑57Bi          | 77      |
|     | ‑2Ag‑7.5Bi‑0.5Cu |        |     |                  |         |
+-----+------------------+--------+-----+------------------+---------+
| F11 | Sn-2.5Ag-19.5Bi  | 12,070 | D2  | Sn-57Bi-2In      | 72      |
+-----+------------------+--------+-----+------------------+---------+
| D10 | Sn-              | 11,440 | D5  | Sn-57Bi-1Sb      | 60      |
|     | 3Ag-54Bi-2Cu-2Sb |        |     |                  |         |
+-----+------------------+--------+-----+------------------+---------+
| F7  | Sn-31.5Bi-3Zn    | 10,500 | B2  | Sn-52Bi          | 57      |
+-----+------------------+--------+-----+------------------+---------+
|     |                  |        |     |                  |         |
+-----+------------------+--------+-----+------------------+---------+
| D9  | Sn-              | 5,055  | B1  | Sn-50Bi          | 53      |
|     | 3Ag-54Bi-2In-2Sb |        |     |                  |         |
+-----+------------------+--------+-----+------------------+---------+
| F8  | Sn-3.5Ag-1.5In   | 4,616  | A8  | Sn-75Pb          | 53      |
+-----+------------------+--------+-----+------------------+---------+
| A1  | Sn-37Pb          | 3,950  | F7  | Sn-31.5Bi-3Zn    | 53      |
+-----+------------------+--------+-----+------------------+---------+
| F10 | Sn               | 3,758  | A1  | Sn-37Pb          | 48      |
|     | -0.2Ag-2Cu-0.8Sb |        |     |                  |         |
+-----+------------------+--------+-----+------------------+---------+
| F3  | Sn-0.5Ag-4Cu     | 3,724  | D4  | Sn-57Bi-2Sb      | 47      |
+-----+------------------+--------+-----+------------------+---------+
|     |                  |        |     |                  |         |
+-----+------------------+--------+-----+------------------+---------+
| A5  | Sn-5Sb           | 3,720  | A6  | Sn-58Bi          | 46      |
+-----+------------------+--------+-----+------------------+---------+
| A8  | Sn-75Pb          | 3,426  | D7  | Sn-              | 45      |
|     |                  |        |     | 3Ag-55.5Bi-1.5Sb |         |
+-----+------------------+--------+-----+------------------+---------+
| F2  | Sn-2             | 3,311  | D8  | Sn-3Ag-55Bi-2Sb  | 44      |
|     | .6Ag-0.8Cu-0.5Sb |        |     |                  |         |
+-----+------------------+--------+-----+------------------+---------+
| A4  | Sn-3.5Ag         | 3,256  | F13 | Sn-55Bi-2Cu      | 41      |
+-----+------------------+--------+-----+------------------+---------+
| A3  | Sn-97Pb          | 1,126  | F2  | Sn-2             | 9       |
|     |                  |        |     | .6Ag-0.8Cu-0.5Sb |         |
+-----+------------------+--------+-----+------------------+---------+
|     |                  |        |     |                  |         |
+-----+------------------+--------+-----+------------------+---------+
|     |                  |        | C5  | Sn               | 7       |
|     |                  |        |     | -2Ag-9.8Bi-9.8In |         |
+-----+------------------+--------+-----+------------------+---------+
|     |                  |        | D10 | Sn-              | 4       |
|     |                  |        |     | 3Ag-54Bi-2Cu-2Sb |         |
+-----+------------------+--------+-----+------------------+---------+
|     |                  |        | E9  | Sn-10Bi-20In     | 4       |
+-----+------------------+--------+-----+------------------+---------+
|     |                  |        | B5  | Sn-2Ag-46Bi-4Cu  | 3       |
+-----+------------------+--------+-----+------------------+---------+

**Source:** Technical Reports for the Lead Free Solder Project:
Properties Reports: \"Room Temperature Tensile Properties of Lead-Free
Solder Alloys;\" Lead Free Solder Project CD-ROM, National Center for
Manufacturing Sciences (NCMS), 1998

##### [Table 1.2.]{.underline} Tensile Properties of Lead-Free Solders

**(A.C.: Alloy Code (NCMS); Blank cells: no values reported)**

<table>
<colgroup>
<col style="width: 6%" />
<col style="width: 13%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 7%" />
<col style="width: 6%" />
<col style="width: 7%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 7%" />
</colgroup>
<tbody>
<tr class="odd">
<td rowspan="2"><strong>A.C.</strong></td>
<td><strong>Chemical Composition</strong></td>
<td colspan="2"><p><strong>Elastic</strong></p>
<p><strong>Modulus</strong></p></td>
<td colspan="2"><p><strong>Yield</strong></p>
<p><strong>Strength (0.2 % offset)</strong></p></td>
<td colspan="2"><p><strong>Tensile</strong></p>
<p><strong>Strength</strong></p></td>
<td colspan="2"><p><strong>Relative</strong></p>
<p><strong>Elongation</strong></p>
<p><strong>(%)</strong></p></td>
<td colspan="2"><p><strong>Strength</strong></p>
<p><strong>Coefficient</strong></p></td>
<td rowspan="2"><p><strong>Hard-ening</strong></p>
<p><strong>Expo-nent</strong></p></td>
</tr>
<tr class="even">
<td><strong>% by Mass</strong></td>
<td><strong>(ksi)</strong></td>
<td><strong>GPa</strong></td>
<td><strong>(psi)</strong></td>
<td><strong>MPa</strong></td>
<td><strong>(psi)</strong></td>
<td><strong>MPa</strong></td>
<td><p><strong>Uni-</strong></p>
<p><strong>form</strong></p></td>
<td><strong>Total</strong></td>
<td><strong>(psi)</strong></td>
<td><strong>MPa</strong></td>
</tr>
<tr class="odd">
<td>A1</td>
<td>Sn-37Pb</td>
<td>2,273</td>
<td>15.7</td>
<td>3,950</td>
<td>27.2</td>
<td>4,442</td>
<td>30.6</td>
<td>3</td>
<td>48</td>
<td>4,917</td>
<td>33.9</td>
<td>0.033</td>
</tr>
<tr class="even">
<td>A2</td>
<td>Sn-2Ag-36Pb</td>
<td>2,617</td>
<td>18.0</td>
<td>6,287</td>
<td>43.3</td>
<td>6,904</td>
<td>47.6</td>
<td>1</td>
<td>31</td>
<td>7,223</td>
<td>49.8</td>
<td>0.011</td>
</tr>
<tr class="odd">
<td>A3</td>
<td>Sn-97Pb</td>
<td>2,753</td>
<td>19.0</td>
<td>1,126</td>
<td>7.8</td>
<td>2,383</td>
<td>16.4</td>
<td>27</td>
<td>38</td>
<td>3,934</td>
<td>27.1</td>
<td>0.235</td>
</tr>
<tr class="even">
<td>A4</td>
<td>Sn-3.5Ag</td>
<td>3,793</td>
<td>26.2</td>
<td>3,256</td>
<td>22.5</td>
<td>3,873</td>
<td>26.7</td>
<td>3</td>
<td>24</td>
<td>4,226</td>
<td>29.1</td>
<td>0.026</td>
</tr>
<tr class="odd">
<td>A5</td>
<td>Sn-5Sb</td>
<td>6,460</td>
<td>44.5</td>
<td>3,720</td>
<td>25.7</td>
<td>5,110</td>
<td>35.2</td>
<td>3</td>
<td>22</td>
<td>4,177</td>
<td>28.8</td>
<td>0.031</td>
</tr>
<tr class="even">
<td>A6</td>
<td>Sn-58Bi</td>
<td>1,720</td>
<td>11.9</td>
<td>7,119</td>
<td>49.1</td>
<td>8,766</td>
<td>60.4</td>
<td>3</td>
<td>46</td>
<td>9,829</td>
<td>67,8</td>
<td>0.029</td>
</tr>
<tr class="odd">
<td>A7</td>
<td>Sn-3.5Ag-0.5Sb-1Cd</td>
<td></td>
<td></td>
<td>7,545</td>
<td>52.0</td>
<td></td>
<td></td>
<td></td>
<td>15</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>A8</td>
<td>Sn-75Pb</td>
<td></td>
<td></td>
<td>3,426</td>
<td>23.6</td>
<td></td>
<td></td>
<td></td>
<td>53</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>B1</td>
<td>Sn-50Bi</td>
<td></td>
<td></td>
<td>8,263</td>
<td>57.0</td>
<td>8,965</td>
<td>61,8</td>
<td></td>
<td>53</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>B2</td>
<td>Sn-52Bi</td>
<td></td>
<td></td>
<td>6,414</td>
<td>44.2</td>
<td>8,834</td>
<td>60.9</td>
<td></td>
<td>57</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>B5</td>
<td>Sn-2Ag-46Bi-4Cu</td>
<td></td>
<td></td>
<td>9,806</td>
<td>67.6</td>
<td>10,070</td>
<td>69.4</td>
<td></td>
<td>3</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>B6</td>
<td>Sn-56Bi-2In</td>
<td></td>
<td></td>
<td>7,224</td>
<td>49.8</td>
<td>8,429</td>
<td>58.1</td>
<td></td>
<td>116</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>C1</td>
<td>Sn-2Ag-1.5Sb-29Pb</td>
<td></td>
<td></td>
<td>6,489</td>
<td>44.7</td>
<td>6,865</td>
<td>47.3</td>
<td></td>
<td>25</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>C2</td>
<td>Sn-3Ag-4Cu</td>
<td></td>
<td></td>
<td>6,276</td>
<td>43.3</td>
<td>7,006</td>
<td>48.3</td>
<td></td>
<td>22</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>C3</td>
<td>Sn-2.5Ag-2Bi-1.5Sb</td>
<td></td>
<td></td>
<td>7,070</td>
<td>48.7</td>
<td>8,117</td>
<td>56.0</td>
<td></td>
<td>21</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>C4</td>
<td>Sn-3Ag-1Bi-1Cu-1.5Sb</td>
<td></td>
<td></td>
<td>8,361</td>
<td>57.6</td>
<td>9,256</td>
<td>63.8</td>
<td></td>
<td>21</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>C5</td>
<td>Sn-2Ag-9.8Bi-9.8In</td>
<td></td>
<td></td>
<td>14,560</td>
<td>100.4</td>
<td>15,380</td>
<td>106.0</td>
<td></td>
<td>7</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>D2</td>
<td>Sn-57Bi-2In</td>
<td></td>
<td></td>
<td>7,304</td>
<td>50.4</td>
<td>8,436</td>
<td>58.2</td>
<td></td>
<td>72</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>D3</td>
<td>Sn-2Ag-57Bi</td>
<td></td>
<td></td>
<td>9,487</td>
<td>65.4</td>
<td>10,390</td>
<td>71.6</td>
<td></td>
<td>31</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>D4</td>
<td>Sn-57Bi-2Sb</td>
<td></td>
<td></td>
<td>8,521</td>
<td>58.8</td>
<td>9,586</td>
<td>66.1</td>
<td></td>
<td>47</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>D5</td>
<td>Sn-57Bi-1Sb</td>
<td></td>
<td></td>
<td>8,285</td>
<td>57.1</td>
<td>8,944</td>
<td>61.7</td>
<td></td>
<td>60</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>D6</td>
<td>Sn-2Ag-56Bi-1.5Sb</td>
<td></td>
<td></td>
<td>9,063</td>
<td>62.5</td>
<td>9,946</td>
<td>68.6</td>
<td></td>
<td>27</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>D7</td>
<td>Sn-3Ag-55.5Bi-1.5Sb</td>
<td></td>
<td></td>
<td>8,665</td>
<td>59.7</td>
<td>9,379</td>
<td>64.7</td>
<td></td>
<td>45</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>D8</td>
<td>Sn-3Ag-55Bi-2Sb</td>
<td></td>
<td></td>
<td>8,984</td>
<td>61.9</td>
<td>9,807</td>
<td>67.6</td>
<td></td>
<td>44</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>D9</td>
<td>Sn-3Ag-54Bi-2In-2Sb</td>
<td></td>
<td></td>
<td>5,055</td>
<td>34.9</td>
<td>11,640</td>
<td>80.3</td>
<td></td>
<td>13</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>D10</td>
<td>Sn-3Ag-54Bi-2Cu-2Sb</td>
<td></td>
<td></td>
<td>11,440</td>
<td>78.9</td>
<td>12,280</td>
<td>84.7</td>
<td></td>
<td>4</td>
<td></td>
<td></td>
<td></td>
</tr>
</tbody>
</table>

##### Tensile Properties of Lead-Free Solders (cont.)

(A.C.: Alloy Code (NCMS); Blank cells: no values reported)

<table style="width:100%;">
<colgroup>
<col style="width: 6%" />
<col style="width: 14%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 7%" />
<col style="width: 6%" />
<col style="width: 7%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 7%" />
<col style="width: 6%" />
<col style="width: 7%" />
</colgroup>
<tbody>
<tr class="odd">
<td rowspan="2"><strong>A.C.</strong></td>
<td><strong>Chemical Composition</strong></td>
<td colspan="2"><p><strong>Elastic</strong></p>
<p><strong>Modulus</strong></p></td>
<td colspan="2"><p><strong>0.2%</strong></p>
<p><strong>Yield</strong></p>
<p><strong>Strength</strong></p></td>
<td colspan="2"><p><strong>Tensile</strong></p>
<p><strong>Strength</strong></p></td>
<td colspan="2"><p><strong>Relative</strong></p>
<p><strong>Elongation</strong></p>
<p><strong>(%)</strong></p></td>
<td colspan="2"><p><strong>Strength</strong></p>
<p><strong>Coefficient</strong></p></td>
<td rowspan="2"><p><strong>Hard-ening</strong></p>
<p><strong>Expo-nent</strong></p></td>
</tr>
<tr class="even">
<td><strong>% by Mass</strong></td>
<td><strong>(ksi)</strong></td>
<td><strong>GPa</strong></td>
<td><strong>(psi)</strong></td>
<td><strong>MPa</strong></td>
<td><strong>(psi)</strong></td>
<td><strong>Mpa</strong></td>
<td><p><strong>Uni-</strong></p>
<p><strong>form</strong></p></td>
<td><strong>Total</strong></td>
<td><strong>(psi)</strong></td>
<td><strong>MPa</strong></td>
</tr>
<tr class="odd">
<td>E1</td>
<td>Sn-3Ag-2Sb</td>
<td></td>
<td></td>
<td>5,749</td>
<td>39.6</td>
<td>6,124</td>
<td>42.2</td>
<td></td>
<td>25</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>E2</td>
<td>Sn-3Ag-2Cu-2Sb</td>
<td></td>
<td></td>
<td>6,684</td>
<td>46.1</td>
<td>7,655</td>
<td>52.8</td>
<td></td>
<td>32</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>E3</td>
<td>Sn-3Ag-2Bi-2Sb</td>
<td></td>
<td></td>
<td>6,918</td>
<td>47.7</td>
<td>9,212</td>
<td>63.5</td>
<td></td>
<td>36</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>E4</td>
<td>Sn-3Ag-2Bi</td>
<td></td>
<td></td>
<td>5,463</td>
<td>37.7</td>
<td>7,930</td>
<td>54.7</td>
<td>6</td>
<td>30</td>
<td>8,946</td>
<td>61.7</td>
<td>0.041</td>
</tr>
<tr class="odd">
<td>E5</td>
<td>Sn-2.5Ag-2Bi</td>
<td></td>
<td></td>
<td>6,592</td>
<td>45.5</td>
<td>7,564</td>
<td>52.2</td>
<td></td>
<td>26</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>E6</td>
<td>Sn-2Bi-1.5Cu-3Sb</td>
<td></td>
<td></td>
<td>7,343</td>
<td>50.6</td>
<td>9,350</td>
<td>64.5</td>
<td></td>
<td>28</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>E7</td>
<td>Sn-2Bi-8In</td>
<td></td>
<td></td>
<td>7,160</td>
<td>49.4</td>
<td>7,970</td>
<td>55.0</td>
<td></td>
<td>25</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>E9</td>
<td>Sn-10Bi-20In</td>
<td></td>
<td></td>
<td>--</td>
<td>--</td>
<td>6,938</td>
<td>47.8</td>
<td></td>
<td>4</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>E10</td>
<td>Sn-9Zn</td>
<td></td>
<td></td>
<td>7,478</td>
<td>51.6</td>
<td>7,708</td>
<td>53.1</td>
<td></td>
<td>27</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F1</td>
<td>Sn-2Ag-7.5Bi-0.5Cu</td>
<td></td>
<td></td>
<td>12,370</td>
<td>85.3</td>
<td>13,440</td>
<td>92.7</td>
<td></td>
<td>12</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F2</td>
<td>Sn-2.6Ag-0.8Cu-0.5Sb</td>
<td></td>
<td></td>
<td>3,311</td>
<td>22.8</td>
<td>3,749</td>
<td>25.8</td>
<td>2</td>
<td>9</td>
<td>4,536</td>
<td>31.3</td>
<td>0.049</td>
</tr>
<tr class="odd">
<td>F3</td>
<td>Sn-0.5Ag-4Cu</td>
<td></td>
<td></td>
<td>3,724</td>
<td>25.7</td>
<td>4,312</td>
<td>29.7</td>
<td></td>
<td>27</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F4</td>
<td>Sn-8.8In-7.6Zn</td>
<td></td>
<td></td>
<td>6,033</td>
<td>41.6</td>
<td>6,445</td>
<td>44.4</td>
<td></td>
<td>14</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F5</td>
<td>Sn-20In-2.8Zn</td>
<td></td>
<td></td>
<td>5,095</td>
<td>35.1</td>
<td>5,381</td>
<td>37.1</td>
<td></td>
<td>31</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F7</td>
<td>Sn-31.5Bi-3Zn</td>
<td></td>
<td></td>
<td>10,500</td>
<td>72.4</td>
<td>11,210</td>
<td>77.3</td>
<td></td>
<td>53</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F8</td>
<td>Sn-3.5Ag-1.5In</td>
<td></td>
<td></td>
<td>4,616</td>
<td>31.8</td>
<td>4,987</td>
<td>34.4</td>
<td></td>
<td>26</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F9</td>
<td>Sn-2Ag-0.5Bi-7.5Sb</td>
<td></td>
<td></td>
<td>8,230</td>
<td>56.7</td>
<td>8,773</td>
<td>60.5</td>
<td></td>
<td>19</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F10</td>
<td>Sn-0.2Ag-2Cu-0.8Sb</td>
<td></td>
<td></td>
<td>3,758</td>
<td>25.9</td>
<td>4,323</td>
<td>29.8</td>
<td></td>
<td>27</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F11</td>
<td>Sn-2.5Ag-19.5Bi</td>
<td></td>
<td></td>
<td>12,070</td>
<td>83.2</td>
<td>13,450</td>
<td>92.7</td>
<td></td>
<td>17</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F12</td>
<td>Sn-3Ag-41Bi</td>
<td></td>
<td></td>
<td>9,287</td>
<td>64.0</td>
<td>10,130</td>
<td>69.8</td>
<td></td>
<td>39</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F13</td>
<td>Sn-55Bi-2Cu</td>
<td></td>
<td></td>
<td>8,985</td>
<td>62.0</td>
<td>9,478</td>
<td>65.4</td>
<td></td>
<td>41</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F14</td>
<td>Sn-48Bi-2Cu</td>
<td></td>
<td></td>
<td>8,899</td>
<td>61.4</td>
<td>9,495</td>
<td>65.5</td>
<td></td>
<td>19</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F15</td>
<td>Sn-57Bi</td>
<td></td>
<td></td>
<td>7,972</td>
<td>55.0</td>
<td>8,540</td>
<td>58.9</td>
<td></td>
<td>77</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F16</td>
<td>Sn-56.7Bi-0.3Cu-1In</td>
<td></td>
<td></td>
<td>8,359</td>
<td>57.6</td>
<td>8,985</td>
<td>62.0</td>
<td></td>
<td>38</td>
<td></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F17</td>
<td>Sn-3.4Ag-4.8Bi</td>
<td></td>
<td></td>
<td>6,712</td>
<td>46.3</td>
<td>10,349</td>
<td>71.4</td>
<td>5</td>
<td>16</td>
<td>17,795</td>
<td>122.7</td>
<td>0.153</td>
</tr>
</tbody>
</table>

**Source:** Technical Reports for the Lead Free Solder Project:
Properties Reports: \"Room Temperature Tensile Properties of Lead-Free
Solder Alloys;\" Lead Free Solder Project CD-ROM, National Center for
Manufacturing Sciences (NCMS), 1998

### [Table 1.3.]{.underline} Elastic Properties of Sn-37Pb (eutectic) and Sn-3.5Ag

+----------------------------+------------+--------------+-------------+
| ### Property               | #          | ### Sn-3.5Ag | ### Sn-5Sb  |
|                            | ## Sn-37Pb |              |             |
+----------------------------+------------+--------------+-------------+
| Melting Point, ºC          | 183        | 221          |             |
+----------------------------+------------+--------------+-------------+
| UTS\* MPa                  | 31 -- 46   | 55           |             |
+----------------------------+------------+--------------+-------------+
| Elongation, %              | 35 -- 176  | 35           |             |
+----------------------------+------------+--------------+-------------+
| Shear Strength, MPa        | 28.4       | 32.1         |             |
+----------------------------+------------+--------------+-------------+
| Young's Modulus^§^, GPa    | 35^§^      | 56^§^        | 58^§^       |
+----------------------------+------------+--------------+-------------+

\*Ultimate Tensile Strength

Jeff D. Sigelko and K.N. Subramanian, "Overview of lead-free solders,"
Adv. Mat. & Proc., pp. 47-48 (March 2000)

^§^ Rodney J. McCabe and Morris E. Fine, "Athermal and Thermally
Activated Plastic Flow in Low Melting Temperature Solders at Small
Stresses," Scripta Materialia **39**(2), 189 (1998)

[Table 1.4.]{.underline} Elastic Properties of Sn-2.5Ag-0.8Cu-0.5Sb
(Castin™) and Sn-37Pb

Eutectic - A

+---------------------+---------+------------+---------+------------+
| #                   |         |            |         |            |
| Tensile Properties  |         |            |         |            |
| (1 ksi = 6.895 MPa) |         |            |         |            |
+---------------------+---------+------------+---------+------------+
| #                   | #  C    |            | #       |            |
|                     | astin™  |            | Sn-37Pb |            |
+---------------------+---------+------------+---------+------------+
|                     | (ksi)   | (MPa)      | (ksi)   | (MPa)      |
+---------------------+---------+------------+---------+------------+
| Young's Modulus     | 7420    | 51.16      | 4870    | 33.58      |
|                     |         | (GPa)      |         | (GPa)      |
+---------------------+---------+------------+---------+------------+
| Yield Strength      | 4.86    | 33.5       | 4.38    | 30.2       |
+---------------------+---------+------------+---------+------------+
| ### UTS\*           | 5.73    | 39.5       | 4.92    | 33.92      |
+---------------------+---------+------------+---------+------------+
| Elongation (%)      | 50.00   |            | 52.87   |            |
+---------------------+---------+------------+---------+------------+
| ##### Com           |         |            |         |            |
| pressive Properties |         |            |         |            |
+---------------------+---------+------------+---------+------------+
|                     | (ksi)   | (MPa)      | (ksi)   | (MPa)      |
+---------------------+---------+------------+---------+------------+
| Elastic Modulus     | 4260    | 29.37      | 3990    | 27.51      |
|                     |         | (GPa)      |         | (GPa)      |
+---------------------+---------+------------+---------+------------+
| Yield Strength      | 4.33    | 29.85      | 4.52    | 31.16      |
+---------------------+---------+------------+---------+------------+
| Stress (25 /u)      | 8.54    | 58.88      | 7.17    | 49.44      |
+---------------------+---------+------------+---------+------------+
| Rockwell Hardness   | 18.28   |            | 10.08   |            |
|                     |         |            |         |            |
| (15 W scale         |         |            |         |            |
| hardness)           |         |            |         |            |
+---------------------+---------+------------+---------+------------+

### \*Ultimate Tensile Strength

Karl Seelig and David Suraski, "The Status of Lead-Free Solder Alloys,"
Proc. 50^th^ IEEE 2000 Electronic Components and Technology Conference
(May 21-24, 2000), Las Vegas, NV

### [Table 1.5.]{.underline} Elastic Properties of Sn-2.5Ag-0.8Cu-0.5Sb (Castin™) and Sn-37Pb 

**Eutectic -- B**

+---------------------+---------+--------------+-------+--------------+
| #                   |         |              |       |              |
| Tensile Properties  |         |              |       |              |
| (1 ksi = 6.895 MPa) |         |              |       |              |
+---------------------+---------+--------------+-------+--------------+
| #                   | #  C    |              | #  Sn |              |
|                     | astin™  |              | -37Pb |              |
+---------------------+---------+--------------+-------+--------------+
|                     | (ksi)   | (MPa)        | (ksi) | (MPa)        |
+---------------------+---------+--------------+-------+--------------+
| Young's Modulus     | 4300    | 29.65 (GPa)  | 5740  | 39.58 (GPa)  |
+---------------------+---------+--------------+-------+--------------+
| Yield Strength      | 4.03    | 27.8         | 4.07  | 28.1         |
+---------------------+---------+--------------+-------+--------------+
| ### UTS\*           | 5.56    | 38.3         | 5.91  | 40.7         |
+---------------------+---------+--------------+-------+--------------+
| Elongation (%)      | 50.00   |              | 43.66 |              |
+---------------------+---------+--------------+-------+--------------+
| ##### Com           |         |              |       |              |
| pressive Properties |         |              |       |              |
+---------------------+---------+--------------+-------+--------------+
|                     | (ksi)   | (MPa)        | (ksi) | (MPa)        |
+---------------------+---------+--------------+-------+--------------+
| Young's Modulus     | 10890   | 75.08 (GPa)  | 16600 | 11.45 (GPa)  |
+---------------------+---------+--------------+-------+--------------+
| Yield Strength      | 4.53    | 31.2         | 4.84  | 33.4         |
|                     |         |              |       |              |
| (0.2% strain)       |         |              |       |              |
+---------------------+---------+--------------+-------+--------------+
| Stress (25 strain)  | 10.07   | 69.4         | 9.88  | 68.1         |
+---------------------+---------+--------------+-------+--------------+
| Rockwell Hardness   | 13.5    |              | 12.2  |              |
|                     |         |              |       |              |
| (16 W scale         |         |              |       |              |
| hardness)           |         |              |       |              |
+---------------------+---------+--------------+-------+--------------+

### \*Ultimate Tensile Strength

**Note:** It is not stated explicitly, but accompanying textual
description suggests that the measured specimens of these alloys may
have been first soaked at 125 C before the properties listed in this
table were measured. This may explain the differences in measured
properties between this table and the previous one (A) comparing Castin™
with Sn-37Pb.

Karl Seelig and David Suraski, "The Status of Lead-Free Solder Alloys,"
Proc. 50^th^ IEEE 2000 Electronic Components and Technology Conference
(May 21-24, 2000), Las Vegas, NV

**[Table 1.6.]{.underline} Parameters for Strain Rate (Norton Equation,
dε/dt = A·σ^n^·exp(-Q/RT); and Dorn Equation, dε/dt =
A·(σ^n^/T)·exp(-Q/(RT))); Stress-relaxation Rate, dσ/dt = A·(σ-σ~t~)^n^
·exp(-Q/(RT)); and Strain-rate Sensitivity, σ = C·(dε/dt)^m^; for Two
Lead-Free Solder Alloys, Sn-3.5Ag and Sn-9Zn.**

Here ε is strain, t is the time variable, dε/dt is strain rate (s^--1^),
A and C are constants, σ is stress (MPa), σ~t~ is a threshold stress for
stress relaxation, n is the stress exponent, Q is an activation energy
(kJ/mol), R is the universal gas constant, T is absolute temperature,
and m is the strain-rate sensitivity.

+---------+---+--------+-------+--------+-------+------+-----+------+
| ##      |   | **No   |       | **     |       | **St | **T |      |
| ####### |   | rton** |       | Dorn** |       | ress | emp |      |
|   Alloy |   |        |       |        |       | R    | era |      |
|         |   |        |       |        |       | elax | tur |      |
|         |   |        |       |        |       | -ati | e** |      |
|         |   |        |       |        |       | on** |     |      |
|         |   |        |       |        |       |      | **  |      |
|         |   |        |       |        |       |      | (ºK |      |
|         |   |        |       |        |       |      | )** |      |
+---------+---+--------+-------+--------+-------+------+-----+------+
|         |   | **Ten  | **Cr  | **Ten  | **Cr  | #    | **2 | **   |
|         |   | sile** | eep** | sile** | eep** |      | 5** | 80** |
+---------+---+--------+-------+--------+-------+------+-----+------+
| # S     | A | 6.62·  | 1     | 5.83   | 1     |      |     |      |
| n-3.5Ag |   | 10^-3^ | .50·1 |        | .36·1 |      |     |      |
|         |   |        | 0^-3^ |        | 0^-3^ |      |     |      |
+---------+---+--------+-------+--------+-------+------+-----+------+
|         | n | 12     | 11.3  | 12     | 11.3  | 6    |     |      |
+---------+---+--------+-------+--------+-------+------+-----+------+
|         | Q | 108.5  | 79.5  | 111.2  | 82.3  | 33.5 |     |      |
+---------+---+--------+-------+--------+-------+------+-----+------+
|         | m |        |       |        |       |      | 0.  | 0    |
|         |   |        |       |        |       |      | 080 | .083 |
+---------+---+--------+-------+--------+-------+------+-----+------+
|         | σ |        |       |        |       | 9.8  |     |      |
|         | ~ |        |       |        |       |      |     |      |
|         | t |        |       |        |       |      |     |      |
|         | ~ |        |       |        |       |      |     |      |
+---------+---+--------+-------+--------+-------+------+-----+------+
|         |   |        |       |        |       |      |     |      |
+---------+---+--------+-------+--------+-------+------+-----+------+
| #####   | A | 9.27   | 0     | 8220   | 19.1  |      |     |      |
|  Sn-9Zn |   |        | .0217 |        |       |      |     |      |
+---------+---+--------+-------+--------+-------+------+-----+------+
|         | n | 8.1    | 5.7   | 8.1    | 5.7   | 4.2  |     |      |
+---------+---+--------+-------+--------+-------+------+-----+------+
|         | Q | 99.9   | 65.2  | 102.6  | 68.0  | 1    |     |      |
|         |   |        |       |        |       | 06.9 |     |      |
+---------+---+--------+-------+--------+-------+------+-----+------+
|         | m |        |       |        |       |      | 0.  | 0    |
|         |   |        |       |        |       |      | 122 | .124 |
+---------+---+--------+-------+--------+-------+------+-----+------+
|         | σ |        |       |        |       | 3    |     |      |
|         | ~ |        |       |        |       |      |     |      |
|         | t |        |       |        |       |      |     |      |
|         | ~ |        |       |        |       |      |     |      |
+---------+---+--------+-------+--------+-------+------+-----+------+
|         |   |        |       |        |       |      |     |      |
+---------+---+--------+-------+--------+-------+------+-----+------+
| Sn-37Pb | n |        | 6.2\* |        |       |      |     |      |
+---------+---+--------+-------+--------+-------+------+-----+------+
|         | Q |        | 64\*  |        |       |      |     |      |
+---------+---+--------+-------+--------+-------+------+-----+------+

\*E.W. Hare and R.G. Stang, *J. Electronic Mater*. 21, 599 (1992)

H. Mavoori, J. Chin, S. Vaynman, B. Moran, L. Keer and M. Fine, "Creep,
Stress Relaxation, and Plastic Deformation in Sn-Ag and Sn-Zn Eutectic
Solders," *J. Electronic Materials*, 26(7), 783 (1997)

[Table 1.7.]{.underline} Steady-state Creep Properties and Associated
Mechanisms for Three Lead-free Solders and Sn-37Pb Eutectic

+--------------------+-------------+----------+----+-------+--------+
| **Alloy**          | **De        | **B\***  | ** | **n** | **n**  |
|                    | formation** |          | ΔH |       |        |
|                    |             | **(      | ** | **(40 | **(140 |
|                    | **          | MPa^-n^∙ |    | ºC)** | ºC)**  |
|                    | Mechanism** | s^-1^)** | ** |       |        |
|                    |             |          | (e |       |        |
|                    |             |          | V) |       |        |
|                    |             |          | ** |       |        |
+--------------------+-------------+----------+----+-------+--------+
| ###                | Athermal,   | 4.229    | 0  | 8.36  | 8.36   |
| ##### Sn-4Cu-0.5Ag | short-range | ×10^-12^ | .0 |       |        |
|                    | Cu          |          | 62 |       |        |
|                    | clustering  |          |    |       |        |
+--------------------+-------------+----------+----+-------+--------+
| Sn-2Cu-0.8Sb-0.2Ag | Dislocation | 3.031    | 0. | 8.91  | 7.37   |
|                    |             |          | 85 |       |        |
|                    | glide /     |          |    |       |        |
|                    | climb       |          |    |       |        |
+--------------------+-------------+----------+----+-------+--------+
| Sn-36Pb-2Ag        | Dislocation | 0.04423  | 0. | 5.25  | 5.25   |
|                    |             |          | 50 |       |        |
|                    | glide /     |          |    |       |        |
|                    | climb       |          |    |       |        |
+--------------------+-------------+----------+----+-------+--------+
| ### Sn-37Pb        | Dislocation | 0.205    | 0. | 5.25  | 5.25   |
|                    |             |          | 49 |       |        |
|                    | glide /     |          |    |       |        |
|                    | climb       |          |    |       |        |
+--------------------+-------------+----------+----+-------+--------+

Y.-H. Pao, S. Badgley, R. Govila and E. Jih, "An Experimental and
Modeling Study of Thermal Cyclic Behavior of Sn-Cu and Sn-Pb Solder
Joints," Mat. Res. Soc. Symp. Proc. Vol. 323, p. 128 (MRS, 1994)

\[Here the steady-state creep behavior was assumed to be described by
(Norton's Law; see previous table, "Parameters for Strain Rate"),
dγ~crp~/dt=B\*τ^n^ exp(-ΔH/(kT)), with dγ~crp~/dt as the rate of shear
creep strain, τ the shear stress, n a stress exponent, ΔH an activation
energy, kT the product of Boltzmann's constant and absolute temperature,
and B\* a material constant.\]

[Table 1.8.]{.underline} Stress Exponents and Activation Energies for
Dorn Equation for Tin and Four Lead-Free Solder Alloys

+------------+--------+--------+--------+--------+--------+--------+
| # Alloy    | **     |        | **     |        | **     |        |
|            | Region |        | Region |        | Region |        |
|            | 1**    |        | 2**    |        | 3**    |        |
+------------+--------+--------+--------+--------+--------+--------+
|            | **Acti | **     | **Acti | **     | **Acti | **     |
|            | vation | Stress | vation | Stress | vation | Stress |
|            | E      | Exp    | E      | Exp    | E      | Exp    |
|            | nergy, | onent, | nergy, | onent, | nergy, | onent, |
|            | Q**    | n**    | Q**    | n**    | Q**    | n**    |
|            |        |        |        |        |        |        |
|            | **(kJ/ |        | **(kJ/ |        | **(kJ/ |        |
|            | mol)** |        | mol)** |        | mol)** |        |
+------------+--------+--------+--------+--------+--------+--------+
| Sn         |        |        |        |        | 66     | 8.4    |
+------------+--------+--------+--------+--------+--------+--------+
| Sn-2.6Sb   |        |        | 115    | 5.9    | 87     | 9.0    |
+------------+--------+--------+--------+--------+--------+--------+
| Sn-5Sb     |        |        | 103    | 5.7    | 85     | 11.6   |
+------------+--------+--------+--------+--------+--------+--------+
| Sn-7.8Sb   | 68     | 0.9    | 52     | 6.2    | 49     | 9.8    |
+------------+--------+--------+--------+--------+--------+--------+
| Sn-2Sb-2In |        |        | 71     | 5.9    | 96     | 9.3    |
+------------+--------+--------+--------+--------+--------+--------+

Rodney J. McCabe and Morris E. Fine, "The Creep Properties of
Precipitation-Strengthened Tin-Based Alloys," JOM, p. 33 (June 2000)

**[Table 1.9.]{.underline} Activation Energy versus Strain Rate for Two
Lead-Free Eutectic Solders (Sn-3.5Ag and Sn-9Zn)**

+-------------------+------------------------+-------------------------+
| # Strain          | # Activation Energy    |                         |
|                   |                        |                         |
| # Rate            | # (J/mol)              |                         |
|                   |                        |                         |
| **(s^-1^)**       |                        |                         |
+-------------------+------------------------+-------------------------+
|                   | **Sn-3.5Ag**           | **Sn-9Zn**              |
+-------------------+------------------------+-------------------------+
| 10^--2^           | 8.56                   | 12.3                    |
+-------------------+------------------------+-------------------------+
| 10^--3^           | 9.97                   | 12.5                    |
+-------------------+------------------------+-------------------------+
| 10^--4^           | 7.90                   | 12.1                    |
+-------------------+------------------------+-------------------------+
| 10^--5^           | 9.70                   | 12.6                    |
+-------------------+------------------------+-------------------------+

H. Mavoori, Semyon Vaynman, Jason Chin, Brian Moran, Leon M. Keer and
Morris E. Fine, "Mechanical Behavior of Eutectic Sn-Ag and Sn-Zn
Solders," Mat. Res. Soc. Symp. Proc. Vol. 390, p. 161 (MRS, 1995)

### [Table 1.10.]{.underline} Elastic Properties of Metallic Elements Used In Electronic Packaging

+------------+------------+---------+---------+----------+-----------+
| #  Metal   | **C        | #       | **G**   | *        | **Yield   |
|            | ondition** | ####### |         | *Tensile | Str       |
|            |            |   **E** | **(S    | St       | ength\*** |
|            |            |         | hear)** | rength** |           |
|            |            | **(Ela  |         |          | **(MPa)** |
|            |            | stic)** | **      | *        |           |
|            |            |         | (GPa)** | *(MPa)** |           |
|            |            | **      |         |          |           |
|            |            | (GPa)** |         |          |           |
+------------+------------+---------+---------+----------+-----------+
| Aluminum   | Annealed   | 68.9    | 26.5    | 47.4     | 12.2      |
| 99.996     |            |         |         |          |           |
+------------+------------+---------+---------+----------+-----------+
| Antimony   |            | 77.8    |         | 11       |           |
+------------+------------+---------+---------+----------+-----------+
| Copper     | Rod,       | 127.7   | 46.8    | 351      | 340       |
| 99.997     | cold-drawn |         |         |          |           |
+------------+------------+---------+---------+----------+-----------+
|            |            |         |         |          |           |
+------------+------------+---------+---------+----------+-----------+
| Gold 99.99 | Cast       | 74.4    |         | 124      |           |
+------------+------------+---------+---------+----------+-----------+
| Lead 99.90 | Rolled,    |         |         |          | 9.5 (0.5  |
|            | aged       |         |         |          | %)        |
+------------+------------+---------+---------+----------+-----------+
| Molybdenum | Pressed,   | 340     |         | 690      |           |
|            | sintered   |         |         |          |           |
|            | sheet      |         |         |          |           |
+------------+------------+---------+---------+----------+-----------+
|            |            |         |         |          |           |
+------------+------------+---------+---------+----------+-----------+
| Nickel     | Wrought,   | 210     |         | 482      | 138       |
| \>99.0     | annealed   |         |         |          |           |
+------------+------------+---------+---------+----------+-----------+
| Platinum   | Annealed   | 147     |         | 120-130  |           |
| 99.99      |            |         |         |          |           |
+------------+------------+---------+---------+----------+-----------+
| Silver     | Strained 5 | 71 --   |         |          |           |
|            | %, heated  | 78      |         |          |           |
|            | 5 hr at    |         |         |          |           |
|            | 350 C      |         |         |          |           |
+------------+------------+---------+---------+----------+-----------+
|            |            |         |         |          |           |
+------------+------------+---------+---------+----------+-----------+
| Tin        | Pure, cast | 41 --   |         | 21.4     |           |
|            |            | 45      |         |          |           |
+------------+------------+---------+---------+----------+-----------+
| Tin-5Ag    | Sheet,     |         |         | 31.7     | 24.8      |
|            | aged at    |         |         |          |           |
|            | room temp. |         |         |          |           |
+------------+------------+---------+---------+----------+-----------+
|            |            |         |         |          |           |
+------------+------------+---------+---------+----------+-----------+
| Tungsten   |            | 340     | 135     |          |           |
+------------+------------+---------+---------+----------+-----------+
| Zinc       | Hot-rolled |         |         | 134-160  |           |
|            | strip      |         |         |          |           |
| \<0.10 Pb  |            |         |         |          |           |
+------------+------------+---------+---------+----------+-----------+

\*(0.2 % offset)

D.E. Gray, ed., *American Institute of Physics Handbook*, pp. 2-61 ff.
(McGraw-Hill, New York, 1957) \[Note: original units were in dyn/cm^2^;
10 dyn/cm^2^ = 1 N/m^2^ = 1 Pa\]

**\[FOLLOWING TABLE STILL NEEDS A COMPLETE DOCUMENTATION OF SOURCE\]:**

[Table 1.11.]{.underline} Material Properties of a Via-in-Pad Chip-Scale
Package Printed Circuit Board Assembly

+--------------------+----------------+-------------+-----------------+
| #####  Material    | **Young's**    | **          | **Thermal       |
|                    |                | Poisson's** | Exp.**          |
|                    | **Modulus, E** |             |                 |
|                    |                | **Ratio**   | **Coefficient** |
|                    | **(GPa)**      |             |                 |
|                    |                | **()**      | **(10^-6^/K)**  |
+--------------------+----------------+-------------+-----------------+
| ### FR-4 epoxy-g   | 22             | 0.28        | 18.5            |
| lass PCB substrate |                |             |                 |
+--------------------+----------------+-------------+-----------------+
| Copper VIP         | 76             | 0.35        | 17              |
|                    |                |             |                 |
| (via-in-pad)       |                |             |                 |
+--------------------+----------------+-------------+-----------------+
| Sn-37Pb            | E=32.0-0.088·t | 0.4         | 21              |
|                    | (0 ≤ t ≤ 100,  |             |                 |
| (eutectic) solder  | t is Celsius   |             |                 |
|                    | temp.)         |             |                 |
+--------------------+----------------+-------------+-----------------+
|                    |                |             |                 |
+--------------------+----------------+-------------+-----------------+
| Underfill          | 6              | 0.35        | 30              |
+--------------------+----------------+-------------+-----------------+
| Silicon chip       | 131            | 0.3         | 2.8             |
+--------------------+----------------+-------------+-----------------+
| Solder mask        | 6.9            | 0.35        | 19              |
+--------------------+----------------+-------------+-----------------+
| \*AL               | 69             | 0.33        | 22.8            |
+--------------------+----------------+-------------+-----------------+
| \*Si~3~Ni~4~       | 314            | 0.33        | 3               |
+--------------------+----------------+-------------+-----------------+
|                    |                |             |                 |
+--------------------+----------------+-------------+-----------------+
| Micro-via filler   | 7              | 0.3         | 35              |
+--------------------+----------------+-------------+-----------------+
| Bismaleimide       | 26             | 0.39        | 15              |
|                    |                |             |                 |
| Triazene (BT)      |                |             |                 |
+--------------------+----------------+-------------+-----------------+

J. Lau, C. Chang, R. Lee, T.-Y. Chen, D. Cheng, T.J. Tseng, D. Lin,
"Thermal-Fatigue Life of Solder Bumped Flip Chip on Micro Via-In-Pad
(VIP) Low Cost Substrates"

\*J.H. Lau and S.-W. Ricky Lee, "Fracture Mechanics Analysis of Low Cost
Solder Bumped Flip Chip Assemblies with *Imperfect* Underfills,"
Proceedings: NEPCON West Conference (February 28 -- March 2, 1995),
Anaheim, CA

**[Table 1.12.]{.underline} Elastic Properties and Thermal Expansion
Coefficient of Electronic-Packaging Materials and Lead Solder Alloys**

+------------------+-------+-----------+------------+----------------+
| #####  Material  | **Te  | **        | **P        | **Thermal      |
|                  | mp.** | Young's** | oisson's** | Exp.**         |
|                  |       |           |            |                |
|                  | **(   | **M       | **Ratio**  | *              |
|                  | ºC)** | odulus,** |            | *Coefficient** |
|                  |       |           | **()**     |                |
|                  |       | **(GPa)** |            | **(10^-6^/K)** |
+------------------+-------+-----------+------------+----------------+
| Sn-37Pb          | -70   | 38.1      | 0.4        | 24.0           |
|                  |       |           |            |                |
| (eutectic)       | 20    | 30.2      | 0.4        | 24.0           |
| solder           |       |           |            |                |
|                  | 140   | 19.7      | 0.4        | 24.0           |
+------------------+-------+-----------+------------+----------------+
| ### Pb-10Sn      | -55   | 13.4      | 0.4        | 27.8           |
|                  |       |           |            |                |
|                  | 22    | 9.78      | 0.4        | 28.9           |
|                  |       |           |            |                |
|                  | 100   | 4.91      | 0.4        | 30.5           |
+------------------+-------+-----------+------------+----------------+
| ### Alumina      | -55   | 303       | 0.21       | 3.9            |
|                  |       |           |            |                |
| (substrate)      | 22    | 303       | 0.21       | 4.5            |
|                  |       |           |            |                |
|                  | 100   | 303       | 0.21       | 6.7            |
+------------------+-------+-----------+------------+----------------+
| Silicon chip     | -73   | 162       | 0.22       | 1.40           |
|                  |       |           |            |                |
|                  | 27    | 162       | 0.22       | 2.62           |
|                  |       |           |            |                |
|                  | 127   | 162       | 0.22       | 3.23           |
+------------------+-------+-----------+------------+----------------+
| Polyimide PWB    | -55   | 14.5      | 0.16       | 13.0           |
|                  | to    |           |            |                |
|                  |       |           |            |                |
|                  | 125   |           |            |                |
+------------------+-------+-----------+------------+----------------+
| Hysol            | -73   | 9.78      | 0.3        | 33.0           |
|                  |       |           |            |                |
| FP4526           | 25    | 9.51      | 0.3        | 33.0           |
|                  |       |           |            |                |
| Underfill        | 52    | 9.23      | 0.3        | 33.0           |
|                  |       |           |            |                |
|                  | 77    | 8.82      | 0.3        | 33.0           |
|                  |       |           |            |                |
|                  | 102   | 7.72      | 0.3        | 33.0           |
|                  |       |           |            |                |
|                  | 127   | 5.37      | 0.3        | 33.0           |
+------------------+-------+-----------+------------+----------------+

Tim Wong and A.H. Matsunaga, "Ceramic Ball Grid Array Solder Joint
Thermal Fatigue Life Enhancement," Proceedings: NEPCON West Conference
(February 28 -- March 2, 1995), Anaheim, CA

### [Table 1.13.]{.underline} Lead-free Solder Alloys: Tensile and Shear Strengths

+----------------+--------+---------+----------+----------+---------+
| #              | **T    |         | *        | **Shear  | **De    |
| #### Lead-free | empera |         | *Tensile | St       | nsity** |
|                | ture** |         | St       | rength** |         |
| ####           |        |         | rength** |          | **(g/c  |
| # Solder Alloy | **     |         |          | *        | m^3^)** |
|                | (ºF)** |         | *        | *(psi)** |         |
|                |        |         | *(psi)** |          |         |
+----------------+--------+---------+----------+----------+---------+
|                | **Sol  | **Liq   |          |          |         |
|                | idus** | uidus** |          |          |         |
+----------------+--------+---------+----------+----------+---------+
| Sn (pure)      | 450    | 450     | 1800     | 2560     | 7.31    |
+----------------+--------+---------+----------+----------+---------+
|                |        |         |          |          |         |
+----------------+--------+---------+----------+----------+---------+
| Sn-3.5Ag       | 430    | 430     | 8900     | 4600     | 7.36    |
+----------------+--------+---------+----------+----------+---------+
| Sn-5Ag         | 430    | 473     | 10100    | 8400     | 7.45    |
+----------------+--------+---------+----------+----------+---------+
| Sn-3Cu         | 441    | 635     | 6420     | NA       | 7.34    |
+----------------+--------+---------+----------+----------+---------+
| ### Sn-5Sb     | 450    | 464     | 5900     | 6200     | 7.26    |
+----------------+--------+---------+----------+----------+---------+

Solder Data Sheet, Welco Castings, 2 Hillyard Street, Hamilton, Ontario,
Canada

### [Table 1.14.]{.underline} Lead-containing Solder Alloys: Tensile and Shear Strengths

+----------------+--------+---------+----------+----------+---------+
| ##### Solde    | **T    |         | *        | **Shear  | **De    |
| r (Lead) Alloy | empera |         | *Tensile | St       | nsity** |
|                | ture** |         | St       | rength** |         |
|                |        |         | rength** |          | **(g/c  |
|                | **     |         |          | *        | m^3^)** |
|                | (ºF)** |         | *        | *(psi)** |         |
|                |        |         | *(psi)** |          |         |
+----------------+--------+---------+----------+----------+---------+
|                | **Sol  | **Liq   |          |          |         |
|                | idus** | uidus** |          |          |         |
+----------------+--------+---------+----------+----------+---------+
| # Pb (pure)    | 621    | 621     | 1780     | 1800     | 11.34   |
+----------------+--------+---------+----------+----------+---------+
| Pb-1Sn-1.5Ag   |        |         | 3600     |          |         |
+----------------+--------+---------+----------+----------+---------+
| Pb-5Sn         | 518    | 596     | 4190     | 3000     | 11.13   |
+----------------+--------+---------+----------+----------+---------+
| Pb-10Sn        | 514    | 576     | 4400     | 3780     | 10.94   |
+----------------+--------+---------+----------+----------+---------+
| Pb-15Sn        | 437    | 553     | 4700     | 4470     | 10.7    |
+----------------+--------+---------+----------+----------+---------+
| Pb-20Sn        | 362    | 533     |          | 4740     | 10.5    |
+----------------+--------+---------+----------+----------+---------+
| Pb-25Sn        | 362    | 514     | 5770     | 5310     | 10.3    |
+----------------+--------+---------+----------+----------+---------+
| Pb-30Sn        | 362    | 490     | 6140     | 5500     | 9.8     |
+----------------+--------+---------+----------+----------+---------+
| Pb-35Sn        | 362    | 475     | 6230     | 5590     | 9.6     |
+----------------+--------+---------+----------+----------+---------+
| Pb-38Sn        | 362    | 465     | 6285     | 5640     | 9.81    |
+----------------+--------+---------+----------+----------+---------+
| Pb-40Sn        | 362    | 460     | 6320     | 5680     | 9.34    |
+----------------+--------+---------+----------+----------+---------+
| Pb-45Sn        | 362    | 440     | 6400     | 5780     | 9.13    |
+----------------+--------+---------+----------+----------+---------+
| Pb-50Sn        | 362    | 420     | 6450     | 5870     | 8.91    |
+----------------+--------+---------+----------+----------+---------+
| # Pb-60Sn      | 362    | 375     | 6400     | 5700     | 8.67    |
+----------------+--------+---------+----------+----------+---------+
| # Pb-62Sn      | 362    | 363     | 6700     | 6060     | 8.50    |
+----------------+--------+---------+----------+----------+---------+
| # Pb-63Sn      | 362    | 362     | 6700     | 6060     | 8.42    |
|                |        |         |          |          |         |
| (eutectic)     |        |         |          |          |         |
+----------------+--------+---------+----------+----------+---------+
| # Pb-95Sn      |        |         | 5900     |          |         |
+----------------+--------+---------+----------+----------+---------+
|                |        |         |          |          |         |
+----------------+--------+---------+----------+----------+---------+
| Sn-36Pb-4Ag    | 350    | 378     | 8500     | 7000     | 8.88    |
+----------------+--------+---------+----------+----------+---------+

Solder Data Sheet, Welco Castings, 2 Hillyard Street, Hamilton, Ontario,
Canada

**[Table 1.15.]{.underline} Shear Strengths of Three Lead-Free Solders
and Tin-Lead Eutectic (by Ring-and-Plug Test)**

+------------------------+-------+----------+------------+------------+
| #####  Solder          | **L   |          | **Stress   |            |
|                        | oad** |          | (area =    |            |
|                        |       |          | 0.046      |            |
|                        |       |          | in^2^)**   |            |
+------------------------+-------+----------+------------+------------+
|                        | **(l  | **(N)**  | **(psi)**  | **(MPa)**  |
|                        | bs)** |          |            |            |
+------------------------+-------+----------+------------+------------+
| Sn-37Pb (eutectic)     | 269   | 1197     | 5840       | 40.27      |
|                        | [+]{. | [+]{.un  | [+]{.      | [+]{.      |
|                        | under | derline} | underline} | underline} |
|                        | line} | 49       | 240        | 1.65       |
|                        | 11    |          |            |            |
+------------------------+-------+----------+------------+------------+
| Sn-3.5Ag               | 367   | 1632     | 7970       | 54.95      |
|                        | [+]{. | [+]{.un  | [+]{.      | [+]{.      |
|                        | under | derline} | underline} | underline} |
|                        | line} | 107      | 530        | 3.65       |
|                        | 24    |          |            |            |
+------------------------+-------+----------+------------+------------+
| Sn-3.33Ag-4.83Bi       | 540   | 2402     | 11,800     | 81.36      |
|                        | [+]{. | [+]{.un  | [+]{.      | [+]{.      |
|                        | under | derline} | underline} | underline} |
|                        | line} | 356      | 1700       | 11.7       |
|                        | 80    |          |            |            |
+------------------------+-------+----------+------------+------------+
| Sn-3.15Ag-5.0Bi-5.0Au  | 560   | 2491     | 12,170     | 83.91      |
|                        | [+]{. | [+]{.un  | [+]{.      | [+]{.      |
|                        | under | derline} | underline} | underline} |
|                        | line} | 67       | 330        | 2.28       |
|                        | 15    |          |            |            |
+------------------------+-------+----------+------------+------------+

Cynthia L. Hernandez, Paul T. Vianco, Jerome A. Rejent, "Effect of
Interface Microstructure on the Mechanical Properties of Pb-Free Hybrid
Microcircuit Solder Joints," IPC/SMTA Electronics Assembly Expo (1998),
p. S19-2-1

**[Table 1.16.]{.underline}** Mechanical Properties of Tin, Tin-Lead,
and Four Lead-Free Solder Alloys (by Ring-and-Plug Tests)

+-------------+--------+---------+--------+---------+--------+---------+
| #           | #      |         | **     |         | **Fat  |         |
|             | ###### |         | Stress |         | igue** |         |
|             | #  **S |         | to**   |         |        |         |
|             | hear** |         |        |         | **Stre |         |
|             |        |         | **Rup  |         | ngth** |         |
|             | ####   |         | ture** |         |        |         |
|             | ####   |         |        |         | **in   |         |
|             | **Stre |         | **in   |         | 1000   |         |
|             | ngth** |         | 1000   |         | cy     |         |
|             |        |         | hr**   |         | cles** |         |
|             | **at   |         |        |         |        |         |
|             | 1mm    |         | **(    |         | **(    |         |
|             | /min** |         | MPa)** |         | MPa)** |         |
|             |        |         |        |         |        |         |
|             | **(    |         |        |         |        |         |
|             | MPa)** |         |        |         |        |         |
+-------------+--------+---------+--------+---------+--------+---------+
| # Alloy     | ###### |         | **T    |         | **T    |         |
|             | ## **T |         | empera |         | empera |         |
|             | empera |         | ture** |         | ture** |         |
|             | ture** |         |        |         |        |         |
+-------------+--------+---------+--------+---------+--------+---------+
|             | **     | **100   | **     | **100   | **     | **100   |
|             | Room** | ºC**    | Room** | ºC**    | Room** | ºC**    |
+-------------+--------+---------+--------+---------+--------+---------+
| Sn (pure)   | 22.6   | 19.3    | 8.4    | 2.2     | 13.7   | 9.0     |
+-------------+--------+---------+--------+---------+--------+---------+
| Sn-1Cu      | 28.5   | 21.2    | 7.8    | 2.2     | 14.9   | 8.3     |
+-------------+--------+---------+--------+---------+--------+---------+
| Sn-3.5Ag    | 39.0   | 23.5    | 14.0   | 5.5     | 18.6   | 10.5    |
+-------------+--------+---------+--------+---------+--------+---------+
| Sn-5Sb      | 38.7   | 21.3    | 11.0   | 3.6     | 20.9   | 14.1    |
+-------------+--------+---------+--------+---------+--------+---------+
| Sn-58Bi     | 48.0   | 15.6    | 3.3    | 0.9     | 16.0   | 7.9     |
+-------------+--------+---------+--------+---------+--------+---------+
|             |        |         |        |         |        |         |
+-------------+--------+---------+--------+---------+--------+---------+
| Sn-40Pb     | 34.5   | 21.6    | 3.5    | 1.1     | 16.2   | 10.2    |
+-------------+--------+---------+--------+---------+--------+---------+

International Tin Research Institute, Publ. No. 656; through: William B.
Hampshire, "The Search for Lead-Free Solders," Proc. Surface Mount
International Conference (Sept. 1992) San Jose, CA, p. 729

[Table 1.17.]{.underline} Shear Strengths, Solidus and Liquidus
Temperatures, and Wetting Angles of Experimental Sn-Ag-Cu Solder Alloys

+--------------------+---+---+---------+---+-----+--------+--------+
| #####  Alloy       | * |   |         |   |     | *      | **Wet  |
|                    | * |   |         |   |     | *T~sol | ting** |
|                    | S |   |         |   |     | ~/T~li |        |
|                    | h |   |         |   |     | q\ ~** | **A    |
|                    | e |   |         |   |     |        | ngle** |
|                    | a |   |         |   |     | **     |        |
|                    | r |   |         |   |     | (ºC)** | **(    |
|                    | S |   |         |   |     |        | deg)** |
|                    | t |   |         |   |     |        |        |
|                    | r |   |         |   |     |        |        |
|                    | e |   |         |   |     |        |        |
|                    | n |   |         |   |     |        |        |
|                    | g |   |         |   |     |        |        |
|                    | t |   |         |   |     |        |        |
|                    | h |   |         |   |     |        |        |
|                    | ( |   |         |   |     |        |        |
|                    | M |   |         |   |     |        |        |
|                    | P |   |         |   |     |        |        |
|                    | a |   |         |   |     |        |        |
|                    | ) |   |         |   |     |        |        |
|                    | * |   |         |   |     |        |        |
|                    | * |   |         |   |     |        |        |
|                    |   |   |         |   |     |        |        |
|                    | * |   |         |   |     |        |        |
|                    | * |   |         |   |     |        |        |
|                    | ( |   |         |   |     |        |        |
|                    | C |   |         |   |     |        |        |
|                    | r |   |         |   |     |        |        |
|                    | o |   |         |   |     |        |        |
|                    | s |   |         |   |     |        |        |
|                    | s |   |         |   |     |        |        |
|                    | - |   |         |   |     |        |        |
|                    | h |   |         |   |     |        |        |
|                    | e |   |         |   |     |        |        |
|                    | a |   |         |   |     |        |        |
|                    | d |   |         |   |     |        |        |
|                    | s |   |         |   |     |        |        |
|                    | p |   |         |   |     |        |        |
|                    | e |   |         |   |     |        |        |
|                    | e |   |         |   |     |        |        |
|                    | d |   |         |   |     |        |        |
|                    | : |   |         |   |     |        |        |
|                    | 0 |   |         |   |     |        |        |
|                    | . |   |         |   |     |        |        |
|                    | 1 |   |         |   |     |        |        |
|                    | m |   |         |   |     |        |        |
|                    | m |   |         |   |     |        |        |
|                    | / |   |         |   |     |        |        |
|                    | m |   |         |   |     |        |        |
|                    | i |   |         |   |     |        |        |
|                    | n |   |         |   |     |        |        |
|                    | ; |   |         |   |     |        |        |
|                    | * |   |         |   |     |        |        |
|                    | * |   |         |   |     |        |        |
|                    |   |   |         |   |     |        |        |
|                    | * |   |         |   |     |        |        |
|                    | * |   |         |   |     |        |        |
|                    | g |   |         |   |     |        |        |
|                    | a |   |         |   |     |        |        |
|                    | p |   |         |   |     |        |        |
|                    | t |   |         |   |     |        |        |
|                    | h |   |         |   |     |        |        |
|                    | i |   |         |   |     |        |        |
|                    | c |   |         |   |     |        |        |
|                    | k |   |         |   |     |        |        |
|                    | n |   |         |   |     |        |        |
|                    | e |   |         |   |     |        |        |
|                    | s |   |         |   |     |        |        |
|                    | s |   |         |   |     |        |        |
|                    | : |   |         |   |     |        |        |
|                    | 7 |   |         |   |     |        |        |
|                    | 6 |   |         |   |     |        |        |
|                    | . |   |         |   |     |        |        |
|                    | 2 |   |         |   |     |        |        |
|                    | μ |   |         |   |     |        |        |
|                    | m |   |         |   |     |        |        |
|                    | ) |   |         |   |     |        |        |
|                    | * |   |         |   |     |        |        |
|                    | * |   |         |   |     |        |        |
+--------------------+---+---+---------+---+-----+--------+--------+
|                    | * |   |         |   |     |        |        |
|                    | * |   |         |   |     |        |        |
|                    | T |   |         |   |     |        |        |
|                    | e |   |         |   |     |        |        |
|                    | s |   |         |   |     |        |        |
|                    | t |   |         |   |     |        |        |
|                    | t |   |         |   |     |        |        |
|                    | e |   |         |   |     |        |        |
|                    | m |   |         |   |     |        |        |
|                    | p |   |         |   |     |        |        |
|                    | e |   |         |   |     |        |        |
|                    | r |   |         |   |     |        |        |
|                    | a |   |         |   |     |        |        |
|                    | t |   |         |   |     |        |        |
|                    | u |   |         |   |     |        |        |
|                    | r |   |         |   |     |        |        |
|                    | e |   |         |   |     |        |        |
|                    | * |   |         |   |     |        |        |
|                    | * |   |         |   |     |        |        |
+--------------------+---+---+---------+---+-----+--------+--------+
|                    | * |   |         | * |     |        |        |
|                    | * |   |         | * |     |        |        |
|                    | 2 |   |         | 1 |     |        |        |
|                    | 2 |   |         | 7 |     |        |        |
|                    | º |   |         | 0 |     |        |        |
|                    | C |   |         | º |     |        |        |
|                    | * |   |         | C |     |        |        |
|                    | * |   |         | * |     |        |        |
|                    |   |   |         | * |     |        |        |
+--------------------+---+---+---------+---+-----+--------+--------+
|                    | # | * | **C\*** | ^ | *   |        |        |
|                    |   | * |         | \ | *B\ |        |        |
|                    |   | B |         | # | *** |        |        |
|                    | A | \ |         | ^ |     |        |        |
|                    | \ | * |         | * |     |        |        |
|                    | * | * |         | * |     |        |        |
|                    |   | * |         | D |     |        |        |
|                    |   |   |         | * |     |        |        |
|                    |   |   |         | * |     |        |        |
+--------------------+---+---+---------+---+-----+--------+--------+
| ### Sn-3.5Ag       | 2 | 6 |         | 2 | 2   | 221    | 33     |
|                    | 0 | 1 |         | 7 | 0.5 |        |        |
|                    | . | . |         |   |     |        |        |
|                    | 9 | 2 |         | 3 |     |        |        |
|                    |   |   |         | 2 |     |        |        |
+--------------------+---+---+---------+---+-----+--------+--------+
| Sn-0.7Cu           | \ | 2 |         | 2 | 1   | 227    |        |
|                    | - | 9 |         | 3 | 0.1 |        |        |
|                    | - | . |         |   |     |        |        |
|                    |   | 8 |         |   |     |        |        |
+--------------------+---+---+---------+---+-----+--------+--------+
|                    |   |   |         |   |     |        |        |
+--------------------+---+---+---------+---+-----+--------+--------+
| Sn-3.60Ag-1.00Cu   | 5 | 6 | 70.8    |   | 2   | 217    |        |
|                    | 4 | 7 | [       |   | 4.4 | /217.9 |        |
| (gap thickness:    | . | . | +]{.und |   |     |        |        |
| 152.4 μm)          | 0 | 0 | erline} |   |     |        |        |
|                    |   |   | 2.3     |   |     |        |        |
|                    |   | [ |         |   |     |        |        |
|                    |   | + | (59.4   |   |     |        |        |
|                    |   | ] | [       |   |     |        |        |
|                    |   | { | +]{.und |   |     |        |        |
|                    |   | . | erline} |   |     |        |        |
|                    |   | u | 4.4)    |   |     |        |        |
|                    |   | n |         |   |     |        |        |
|                    |   | d |         |   |     |        |        |
|                    |   | e |         |   |     |        |        |
|                    |   | r |         |   |     |        |        |
|                    |   | l |         |   |     |        |        |
|                    |   | i |         |   |     |        |        |
|                    |   | n |         |   |     |        |        |
|                    |   | e |         |   |     |        |        |
|                    |   | } |         |   |     |        |        |
|                    |   | 2 |         |   |     |        |        |
|                    |   | . |         |   |     |        |        |
|                    |   | 4 |         |   |     |        |        |
+--------------------+---+---+---------+---+-----+--------+--------+
|                    |   |   |         |   |     |        |        |
+--------------------+---+---+---------+---+-----+--------+--------+
| Sn-3.              | 6 | 6 |         |   | 2   | 217    |        |
| 59Ag-0.99Cu-0.15Co | 5 | 5 |         |   | 2.8 | /218.5 |        |
|                    | . | . |         |   |     |        |        |
|                    | 4 | 5 |         |   |     |        |        |
+--------------------+---+---+---------+---+-----+--------+--------+
| Sn-3.              | 5 | 5 |         |   | 1   | 217    |        |
| 59Ag-0.99Cu-0.30Co | 3 | 6 |         |   | 7.5 | /219.3 |        |
|                    | . | . |         |   |     |        |        |
|                    | 5 | 1 |         |   |     |        |        |
+--------------------+---+---+---------+---+-----+--------+--------+
| Sn-3.              | 5 | 6 | 56.2    |   | 2   | 217    |        |
| 58Ag-0.99Cu-0.45Co | 6 | 5 | [       |   | 1.2 | /218.9 |        |
|                    | . | . | +­]{.und |   |     |        |        |
|                    | 7 | 7 | erline} |   |     |        |        |
|                    |   |   | 6.2     |   |     |        |        |
|                    |   | [ |         |   |     |        |        |
|                    |   | + |         |   |     |        |        |
|                    |   | ] |         |   |     |        |        |
|                    |   | { |         |   |     |        |        |
|                    |   | . |         |   |     |        |        |
|                    |   | u |         |   |     |        |        |
|                    |   | n |         |   |     |        |        |
|                    |   | d |         |   |     |        |        |
|                    |   | e |         |   |     |        |        |
|                    |   | r |         |   |     |        |        |
|                    |   | l |         |   |     |        |        |
|                    |   | i |         |   |     |        |        |
|                    |   | n |         |   |     |        |        |
|                    |   | e |         |   |     |        |        |
|                    |   | } |         |   |     |        |        |
|                    |   | 3 |         |   |     |        |        |
|                    |   | . |         |   |     |        |        |
|                    |   | 8 |         |   |     |        |        |
+--------------------+---+---+---------+---+-----+--------+--------+
|                    |   |   |         |   |     |        |        |
+--------------------+---+---+---------+---+-----+--------+--------+
| #######            | 4 | 5 |         |   | 2   | 217    | 21     |
| # Sn-4.70Ag-1.70Cu | 7 | 8 |         |   | 1.6 |        |        |
|                    | . | . |         |   |     |        |        |
|                    | 0 | 0 |         |   |     |        |        |
+--------------------+---+---+---------+---+-----+--------+--------+
| Sn-4.              | 5 | 5 |         |   | 2   | 217    | 18     |
| 68Ag-1.69Cu-0.30Co | 4 | 7 |         |   | 2.9 | /218.1 |        |
|                    | . | . |         |   |     |        |        |
|                    | 5 | 8 |         |   |     |        |        |
+--------------------+---+---+---------+---+-----+--------+--------+
| Sn-4.              | 5 | 6 |         |   | 2   | 217    | 24     |
| 68Ag-1.69Cu-0.30Ni | 0 | 5 |         |   | 3.2 | /218.1 |        |
|                    | . | . |         |   |     |        |        |
|                    | 2 | 5 |         |   |     |        |        |
+--------------------+---+---+---------+---+-----+--------+--------+
|                    |   |   |         |   |     |        |        |
+--------------------+---+---+---------+---+-----+--------+--------+
| Sn-3.8Ag-0.7Cu     | \ | 6 |         | 2 | 2   | 217    |        |
|                    | - | 3 |         | 7 | 5.1 |        |        |
|                    | - | . |         |   |     |        |        |
|                    |   | 8 |         |   |     |        |        |
+--------------------+---+---+---------+---+-----+--------+--------+
| Sn                 | \ | 6 |         |   | 2   |        | 44     |
| -3.8Ag-0.7Cu-0.5Sb | - | 4 |         |   | 8.9 |        |        |
|                    | - | . |         |   |     |        |        |
|                    |   | 1 |         |   |     |        |        |
+--------------------+---+---+---------+---+-----+--------+--------+
|                    |   |   |         |   |     |        |        |
+--------------------+---+---+---------+---+-----+--------+--------+
| Sn-40Pb            | 3 | 3 |         | 2 | 4.5 | 1      | 17     |
|                    | 7 | 6 |         | 6 |     | 83/188 |        |
|                    | . | . |         |   |     |        |        |
|                    | 4 | 5 |         |   |     |        |        |
+--------------------+---+---+---------+---+-----+--------+--------+

**\*A**: Cooling rate in soldering (test) butt joints=1.5 º/s

\***B**: Cooling rate=10 º/s

\***C**: "Refined" test, (solderability and microstructure)

Measurements A, B and C by Asymmetric Four-Point Bend \[AFPB\] method

^\#^ **D**: Values from technical literature (two different sources); by
ring-and-plug method

^\#^ Iver E. Anderson, Tamara E. Bloomer, Robert L. Terpstra, James C.
Foley, Bruce A. Cook and Joel Harringa, "Development of Eutectic and
Near-Eutectic Tin-Silver-Copper Solder Alloys for Lead-Free Electronic
Assemblies," IPCWorks '99: An International Summit on Lead-Free
Electronics Assemblies," (October 25-28, 1999), Minneapolis, MN

\# Iver E. Anderson, Tamara E. Bloomer, Robert L. Terpstra, James C.
Foley, Bruce A. Cook and Joel Harringa, "Development of Eutectic and
Near-Eutectic Tin-Silver-Copper Solder Alloys for Lead-Free Joining
Applications," p. 575

**[Table 1.18.]{.underline} Physical and Mechanical Properties of
Lead-free Alloys and Sn-37Pb (eutectic)**

+------------------+-----+-------+--------+--------+-------+--------+
| #  Property      |     | **    | **Sn-3 | **S    | **    | **S    |
|                  |     | Sn-3. | .5Ag-0 | n-3.8A | Sn-0. | n-37Pb |
|                  |     | 5Ag** | .7Cu** | g-0.7C | 7Cu** | (eutec |
|                  |     |       |        | u^@^** |       | tic)** |
|                  |     |       |        |        | *     |        |
|                  |     |       |        |        | *("Al |        |
|                  |     |       |        |        | loy** |        |
|                  |     |       |        |        |       |        |
|                  |     |       |        |        | *     |        |
|                  |     |       |        |        | *99C" |        |
|                  |     |       |        |        | \*)** |        |
+------------------+-----+-------+--------+--------+-------+--------+
| Density, g/cm^3^ |     | 7.5   |        | 7.5    | 7.3   | 8.4    |
+------------------+-----+-------+--------+--------+-------+--------+
| Melting Point    |     | 221   |        | 217    | 227-  | 183    |
| (ºC)             |     |       |        |        | 240\* |        |
+------------------+-----+-------+--------+--------+-------+--------+
| Electrical       |     | 14    | 13\*   | 13     | 13\*  | 11.9   |
| Conductivity,    |     |       |        |        |       |        |
| %IACS^\#^        |     |       |        |        |       |        |
+------------------+-----+-------+--------+--------+-------+--------+
| Electrical       |     | 12.3  |        | 13     |       | 14.5   |
| Resistivity,     |     |       |        |        |       |        |
| μΩ·cm            |     |       |        |        |       |        |
+------------------+-----+-------+--------+--------+-------+--------+
|                  |     |       |        |        |       |        |
+------------------+-----+-------+--------+--------+-------+--------+
| Brinell          |     | 15    |        | 15     |       | 17     |
| Hardness, HB     |     |       |        |        |       |        |
+------------------+-----+-------+--------+--------+-------+--------+
| Tensile Strength |     | 58    | 48\*   | 48     |       | 40     |
| (20 ºC),         |     |       |        |        |       |        |
|                  |     |       |        |        |       |        |
| N/mm^2^ at       |     |       |        |        |       |        |
| Strain Rate:     |     |       |        |        |       |        |
| 0.004 s^--1^     |     |       |        |        |       |        |
+------------------+-----+-------+--------+--------+-------+--------+
| # S              | +/- |       |        |        | 4     |        |
| tress to Rupture | 5   |       |        |        | 300\* |        |
|                  |     |       |        |        |       |        |
|                  | N   |       |        |        |       |        |
|                  | /mm |       |        |        |       |        |
|                  | ^2^ |       |        |        |       |        |
+------------------+-----+-------+--------+--------+-------+--------+
|                  | +/- |       |        |        | 1     |        |
|                  | 10  |       |        |        | 460\* |        |
|                  |     |       |        |        |       |        |
|                  | N   |       |        |        |       |        |
|                  | /mm |       |        |        |       |        |
|                  | ^2^ |       |        |        |       |        |
+------------------+-----+-------+--------+--------+-------+--------+
| Joint Shear      | 20  | 27    |        | 27     | 23    | 23     |
| Strength,        | ºC  |       |        |        |       |        |
|                  |     |       |        |        | 20\*  |        |
| N/mm^2^ at 0.1   |     |       |        |        |       |        |
| mm/min           |     |       |        |        |       |        |
+------------------+-----+-------+--------+--------+-------+--------+
|                  | 100 | 17    |        | 17     | 16    | 14     |
|                  | ºC  |       |        |        |       |        |
|                  |     |       |        |        | 21\*  |        |
+------------------+-----+-------+--------+--------+-------+--------+
| Creep Strength,  | 20  | 13.7  | 13\*   | 13.0   | 8.6   | 3.3    |
|                  | ºC  |       |        |        |       |        |
| N/mm^2^ at 0.1   |     |       |        |        |       |        |
| mm/min           |     |       |        |        |       |        |
+------------------+-----+-------+--------+--------+-------+--------+
|                  | 100 | 5.0   | 5\*    | 5.0    | 2.1   | 1.0    |
|                  | ºC  |       |        |        |       |        |
+------------------+-----+-------+--------+--------+-------+--------+

**^@^**Proprietary (patented) alloy ("Ecosol TSC") of Multicore Solders

\*Peter Biocca, "Global Update on Lead-free Solders," *Proc. Surface
Mount International* (San Jose, CA, 1998), pp. 705-709

^\#^100 %IACS = 58.00 MS/m

**[Table 1.19.]{.underline} Pure Copper, Tin and Nickel, and Their
Intermetallics: Room-Temperature Physical and Thermal Properties**

+-------------------------+------+------+------+------+------+------+
| ########  **Property**  | **   | **   | **   | **   | **C  | **   |
|                         | Cu** | Sn** | Ni** | Cu~6 | u~3~ | Ni~3 |
|                         |      |      |      | ~Sn~ | Sn** | ~Sn~ |
|                         |      |      |      | 5~** |      | 4~** |
+-------------------------+------+------+------+------+------+------+
| Density (g/cm^3^)       | 8.9  | 7.3  | 8.9  | 8.28 | 8.9  | 8.65 |
+-------------------------+------+------+------+------+------+------+
| Young's Modulus (GPa)   | 117  | 41   | 213  | 8    | 1    | 1    |
|                         |      |      |      | 5.56 | 08.3 | 33.3 |
+-------------------------+------+------+------+------+------+------+
| Shear Modulus (GPa)     |      |      |      | 5    | 4    | 45.0 |
|                         |      |      |      | 0.21 | 2.41 |      |
+-------------------------+------+------+------+------+------+------+
|                         |      |      |      |      |      |      |
+-------------------------+------+------+------+------+------+------+
| Toughness (MPa·m^-1/2^) |      |      |      | 1.4  | 1.7  | 1.2  |
+-------------------------+------+------+------+------+------+------+
| Vickers Hardness        | 30   | 100  | 15   | 378  | 343  | 365  |
| (kg/mm^2^)              |      |      |      |      |      |      |
+-------------------------+------+------+------+------+------+------+
|                         |      |      |      |      |      |      |
+-------------------------+------+------+------+------+------+------+
| Electrical Resistivity  | 1.7  | 11.5 | 7.8  | 17.5 | 8.93 | 28.5 |
| (μΩ·cm)                 |      |      |      |      |      |      |
+-------------------------+------+------+------+------+------+------+
|                         |      |      |      |      |      |      |
+-------------------------+------+------+------+------+------+------+
| Thermal Conductivity    | 3.98 | 0.67 | 0    | 34.1 | 70.4 | 19.6 |
| (W/(m·K))               |      |      | .905 |      |      |      |
+-------------------------+------+------+------+------+------+------+
| Thermal Diffusivity     |      |      |      | 0    | 0.24 | 0    |
| (cm^2^/s)               |      |      |      | .145 |      | .083 |
+-------------------------+------+------+------+------+------+------+
| Specific Heat           | 0    | 0    | 0    | 286  | 326  | 272  |
| (J/(kg·K))              | .385 | .227 | .439 |      |      |      |
+-------------------------+------+------+------+------+------+------+
| Thermal Expansion       | 17.1 | 23   | 12.9 | 16.3 | 19.0 | 13.7 |
| (10^--6^/K)             |      |      |      |      |      |      |
+-------------------------+------+------+------+------+------+------+

D.R. Frear, S.N. Burchett, H.S. Morgan, and J.H. Lau, eds., *The
Mechanics of Solder Alloy Interconnects*, p. 60 (Van Nostrand Reinhold,
New York, 1994)

[Table 1.20.]{.underline} Effects of Transition Metals on Vickers
Hardness and UTS of Sn-4.7Ag-1.7Cu Solder Alloys

+------------+------------+-----+----+-----+------+-----+----+-----+
| #          | **Des      | *   |    |     |      | **A |    |     |
| #### Alloy | ignation** | *As |    |     |      | nne |    |     |
|            |            | D   |    |     |      | ale |    |     |
|            |            | raw |    |     |      | d** |    |     |
|            |            | n** |    |     |      |     |    |     |
+------------+------------+-----+----+-----+------+-----+----+-----+
|            |            | *   | ** | *   | **Ra | *   | ** | **  |
|            |            | *VH | St | *UT | tio, | *VH | St | Est |
|            |            | N** | d. | S** | V    | N** | d. | .** |
|            |            |     | De |     | HN:U |     | De |     |
|            |            |     | v. | **( | TS** |     | v. | *   |
|            |            |     | ** | MPa |      |     | ** | *UT |
|            |            |     |    | )** |      |     |    | S** |
|            |            |     |    |     |      |     |    |     |
|            |            |     |    |     |      |     |    | **( |
|            |            |     |    |     |      |     |    | MPa |
|            |            |     |    |     |      |     |    | )** |
+------------+------------+-----+----+-----+------+-----+----+-----+
| Sn-3.5Ag   | eutectic   | 13  | 0. | 52  | 0    | 13  | 0. | 5   |
|            |            | .25 | 35 |     | .255 | .90 | 46 | 4.6 |
+------------+------------+-----+----+-----+------+-----+----+-----+
| Sn-4       | eutectic   | 10  | 0. | 44  | 0    | 12  | 0. | 53  |
| .7Ag-1.7Cu |            | .25 | 35 |     | .233 | .45 | 14 |     |
+------------+------------+-----+----+-----+------+-----+----+-----+
| Sn         | e          | 6   | 0. |     |      | 15  | 0. |     |
| -4.69Ag-1. | utectic+Fe | .25 | 07 |     |      | .05 | 35 |     |
| 69Cu-0.3Fe |            |     |    |     |      |     |    |     |
+------------+------------+-----+----+-----+------+-----+----+-----+
| Sn         | E          | 17  | 0. | 76  | 0    | 15  | 0. | 64  |
| -4.68Ag-1. | utectic+Co | .95 | 21 |     | .236 | .20 | 14 |     |
| 69Cu-0.5Co |            |     |    |     |      |     |    |     |
+------------+------------+-----+----+-----+------+-----+----+-----+
| Sn         | e          | 16  | 0. | 70  | 0    | 13  | 0. | 58  |
| -4.69Ag-1. | utectic+Ni | .55 | 35 |     | .236 | .75 | 35 |     |
| 69Cu-0.3Ni |            |     |    |     |      |     |    |     |
+------------+------------+-----+----+-----+------+-----+----+-----+
| Sn         | lean       | 15  | 0. | 6   | 0    | 13  | 0. | 53  |
| -3.59Ag-1. | e          | .70 | 42 | 1.5 | .255 | .55 | 49 |     |
| 00Cu-0.3Ni | utectic+Ni |     |    |     |      |     |    |     |
+------------+------------+-----+----+-----+------+-----+----+-----+

VHN: Vickers Hardness Number

UTS: Ultimate Tensile Strength

Iver E. Anderson, Özer Ünal, Tamara E. Bloomer and James C. Foley,
"Effects of Transition Metal Alloying on Microstructural Stability and
Mechanical Properties of Tin-Silver-Copper Solder Alloys," Proc. Third
Pacific Rim International Conference on Advanced Materials and
Processing (PRICM 3) (The Minerals, Metals and Materials Society, 1998)

**[Table 1.21.1.]{.underline} SnAgCu Dynamic Elastic Constant.**

  ------------- ------------------- ------------------- ------------------
  Test          As-cast #1 Young\'s As-cast #2 Young\'s Aged #1 Young\'s
  Temperature   Modulus (GPa)       Modulus (GPa)       Modulus (GPa)
  (°C)                                                  

  -50           57.3                56.46               56.43

  -25           55.79               54.66               54.65

  0             54.22               52.79               52.79

  25            52.62               50.86               50.86

  50            50.97               48.87               48.88

  75            49.29               46.83               46.84

  100           47.57               44.73               44.75

  125           45.83               42.59               42.61

  150           44.05               40.42               40.44

  175           42.26               38.21               38.23

  200           40.44               35.98               36
  ------------- ------------------- ------------------- ------------------

Vianco P. T., Sandia National Laboratories, 2001

**[Table 1.21.2.]{.underline} SnAgCu Dynamic Elastic Constant (cont.)**

+-------------+-------------+-------------+-------------+-------------+
| *           | **          | **Quadratic |             |             |
| *Material** | Parameter** | Function    |             |             |
|             |             | Coe         |             |             |
|             |             | fficients** |             |             |
|             |             |             |             |             |
|             |             | **(a + bT + |             |             |
|             |             | cT^2^)**    |             |             |
+-------------+-------------+-------------+-------------+-------------+
|             |             | **a**       | **b**       | **c**       |
+-------------+-------------+-------------+-------------+-------------+
| As-cast #1  | Young's     | 54.21       | -6.358 x    | -2.685 x    |
|             | Modulus     |             | 10^-2^      | 10^-5^      |
+-------------+-------------+-------------+-------------+-------------+
|             | Shear       | 20.24       | -2.635 x    | -6.503 x    |
|             | Modulus     |             | 10^-2^      | 10^-5^      |
+-------------+-------------+-------------+-------------+-------------+
|             | Bulk        | 56.19       | -5.461 x    | -4.223 x    |
|             | Modulus     |             | 10^-3^      | 10^-5^      |
+-------------+-------------+-------------+-------------+-------------+
|             | Poisson's   | 0.3392      | -1.722 x    | 4.879 x     |
|             | ratio       |             | 10^-4^      | 10^9^       |
+-------------+-------------+-------------+-------------+-------------+
|             |             |             |             |             |
+-------------+-------------+-------------+-------------+-------------+
| As-cast #2  | Young's     | 52.77       | -7.637 x    | -3.885 x    |
|             | Modulus     |             | 10^2^       | 10^5^       |
+-------------+-------------+-------------+-------------+-------------+
|             | Shear       | 19.59       | -3.110 x    | -1.077 x    |
|             | Modulus     |             | 10^2^       | 10^5^       |
+-------------+-------------+-------------+-------------+-------------+
|             | Bulk        | 57.39       | -1.258 x    | -2.703 x    |
|             | Modulus     |             | 10^2^       | 10^5^       |
+-------------+-------------+-------------+-------------+-------------+
|             | Poisson's   | 0.3467      | 1.874 x     | 1.096 x     |
|             | ratio       |             | 10^4^       | 10^7^       |
+-------------+-------------+-------------+-------------+-------------+
|             |             |             |             |             |
+-------------+-------------+-------------+-------------+-------------+
| Aged #1     | Young's     | 52.76       | -7.606 x    | -3.961 x    |
|             | Modulus     |             | 10^2^       | 10^5^       |
+-------------+-------------+-------------+-------------+-------------+
|             | Shear       | 19.59       | -3.110 x    | -1.075 x    |
|             | Modulus     |             | 10^2^       | 10^5^       |
+-------------+-------------+-------------+-------------+-------------+
|             | Bulk        | 57.31       | -9.213 x    | -2.810 x    |
|             | Modulus     |             | 10^3^       | 10^5^       |
+-------------+-------------+-------------+-------------+-------------+
|             | Poisson's   | 0.3465      | 1.957 x     | 9.912 x     |
|             | ratio       |             | 10^4^       | 10^8^       |
+-------------+-------------+-------------+-------------+-------------+

Vianco P. T., Sandia National Laboratories, 2001

**[Table 1.22.1.]{.underline} SnAgCu Elastic Properties vs.
Temperature**

+----------------+-----------------+----------------+-----------------+
| **Test         | **Mean Yield    | **Min. Yield   | **Max. Yield    |
| Temperature**  | Stress**        | Stress**       | Stress**        |
|                |                 |                |                 |
| **(°C)**       | **As-Cast**     | **As-cast**    | **As-cast**     |
|                |                 |                |                 |
|                | **(MPa)**       | **(MPa)**      | **(MPa)**       |
+----------------+-----------------+----------------+-----------------+
| -25            | 41.645          | 41.51          | 41.78           |
+----------------+-----------------+----------------+-----------------+
| 25             | 31.835          | 30.13          | 33.54           |
+----------------+-----------------+----------------+-----------------+
| 75             | 20.975          | 16.45          | 25.5            |
+----------------+-----------------+----------------+-----------------+
| 125            | 13.635          | 13.47          | 13.8            |
+----------------+-----------------+----------------+-----------------+
| 160            | 10.19           | 9.63           | 10.75           |
+----------------+-----------------+----------------+-----------------+

Vianco P. T., Sandia National Laboratories, 2001

**[Table 1.22.2.]{.underline} SnAgCu Elastic Properties vs. Temperature
(cont.)**

+--------------+------------------+-----------------+-----------------+
| **Test       | **Mean Elastic   | **Min. Elastic  | **Max. Elastic  |
| T            | Modulus**        | Modulus**       | Modulus**       |
| emperature** |                  |                 |                 |
|              | **As-Cast**      | **As-cast**     | **As-cast**     |
| **(°C)**     |                  |                 |                 |
|              | **(MPa)**        | **(MPa)**       | **(MPa)**       |
+--------------+------------------+-----------------+-----------------+
| -25          | 3978.3           | 2863.6          | 5093            |
+--------------+------------------+-----------------+-----------------+
| 25           | 5357.75          | 4956.5          | 5759            |
+--------------+------------------+-----------------+-----------------+
| 75           | 4455.5           | 4021.6          | 4889.4          |
+--------------+------------------+-----------------+-----------------+
| 125          | 3837.25          | 2836.8          | 4837.7          |
+--------------+------------------+-----------------+-----------------+
| 160          | 3309.05          | 2217.3          | 4400.8          |
+--------------+------------------+-----------------+-----------------+

Vianco P. T., Sandia National Laboratories, 2001

**[Table 1.22.3.]{.underline} SnAgCu Elastic Properties vs. Temperature
(cont.)**

+----------------+-----------------+----------------+-----------------+
| **Test         | **Mean Yield    | **Min. Yield   | **Max. Yield    |
| Temperature**  | Strain**        | Strain**       | Strain**        |
|                |                 |                |                 |
| **(°C)**       | **As-Cast**     | **As-cast**    | **As-cast**     |
+----------------+-----------------+----------------+-----------------+
| -25            | 0.01505         | 0.011          | 0.0191          |
+----------------+-----------------+----------------+-----------------+
| 25             | 0.00845         | 0.008          | 0.0089          |
+----------------+-----------------+----------------+-----------------+
| 75             | 0.0062          | 0.0053         | 0.0071          |
+----------------+-----------------+----------------+-----------------+
| 125            | 0.00565         | 0.0045         | 0.0068          |
+----------------+-----------------+----------------+-----------------+
| 160            | 0.0056          | 0.0047         | 0.0065          |
+----------------+-----------------+----------------+-----------------+

Vianco P. T., Sandia National Laboratories, 2001

**[Table 1.22.4.]{.underline} SnAgCu Elastic Properties vs. Temperature
(cont.)**

+----------------+-----------------+----------------+-----------------+
| **Test         | **Mean Yield    | **Min. Yield   | **Max. Yield    |
| Temperature**  | Stress**        | Stress**       | Stress**        |
|                |                 |                |                 |
| **(°C)**       | **Aged**        | **Aged**       | **Aged**        |
|                |                 |                |                 |
|                | **(MPa)**       | **(MPa)**      | **(MPa)**       |
+----------------+-----------------+----------------+-----------------+
| -25            | 38.655          | 36.77          | 40.54           |
+----------------+-----------------+----------------+-----------------+
| 25             | 21.925          | 21.21          | 22.64           |
+----------------+-----------------+----------------+-----------------+
| 75             | 17.005          | 16.97          | 17.04           |
+----------------+-----------------+----------------+-----------------+
| 125            | 12.15           | 10.71          | 13.59           |
+----------------+-----------------+----------------+-----------------+
| 160            | 11.35           | 10.79          | 11.91           |
+----------------+-----------------+----------------+-----------------+

Vianco P. T., Sandia National Laboratories, 2001

**[Table 1.22.5.]{.underline} SnAgCu Elastic Properties vs. Temperature
(cont.)**

+-------------+---------------------+----------------+----------------+
| **Test      | **Mean Elastic      | **Min. Elastic | **Max. Elastic |
| Te          | Modulus Aged**      | Modulus**      | Modulus**      |
| mperature** |                     |                |                |
|             | **(MPa)**           | **Aged**       | **Aged**       |
| **(°C)**    |                     |                |                |
|             |                     | **(MPa)**      | **(MPa)**      |
+-------------+---------------------+----------------+----------------+
| -25         | 3495.95             | 3415.9         | 3576           |
+-------------+---------------------+----------------+----------------+
| 25          | 4312.55             | 3828.7         | 4796.4         |
+-------------+---------------------+----------------+----------------+
| 75          | 4004.8              | 3752.6         | 4257           |
+-------------+---------------------+----------------+----------------+
| 125         | 3336.3              | 2742.4         | 3930.2         |
+-------------+---------------------+----------------+----------------+
| 160         | 3663.7              | 2715.7         | 4611.7         |
+-------------+---------------------+----------------+----------------+

Vianco P. T., Sandia National Laboratories, 2001

**[Table 1.22.6.]{.underline} SnAgCu Elastic Properties vs. Temperature
(cont.)**

+----------------+-----------------+----------------+-----------------+
| **Test         | **Mean Yield    | **Min. Yield   | **Max. Yield    |
| Temperature**  | Strain**        | Strain**       | Strain**        |
|                |                 |                |                 |
| **(°C)**       | **Aged**        | **Aged**       | **Aged**        |
+----------------+-----------------+----------------+-----------------+
| -25            | 0.0178          | 0.0165         | 0.0191          |
+----------------+-----------------+----------------+-----------------+
| 25             | 0.00715         | 0.0067         | 0.0076          |
+----------------+-----------------+----------------+-----------------+
| 75             | 0.00615         | 0.0058         | 0.0065          |
+----------------+-----------------+----------------+-----------------+
| 125            | 0.00555         | 0.0054         | 0.0057          |
+----------------+-----------------+----------------+-----------------+
| 160            | 0.0055          | 0.0049         | 0.0061          |
+----------------+-----------------+----------------+-----------------+

Vianco P. T., Sandia National Laboratories, 2001

**[Table 1.23.]{.underline} SnAgCu - Coefficient of Thermal Expansion
Data. Sample: As-cast #1.**

  --------------- ---------- ---------- ---------- ---------- ---------- ---------- ---------- ---------- ---------- ----------
  **Parameter**   **-50°C to **-25°C to **0°C to   **25°C to  **50°C to  **75°C to  **100°C to **125°C to **150°C to **175°C to
                  -25°C**    0°C**      25°C**     50°C**     75°C**     100°C**    125°C**    150°C**    175°C**    200°C**

  L/T             9.25E-06   1.42E-05   1.55E-05   1.57E-05   1.59E-05   1.62E-05   1.68E-05   1.69E-05   1.73E-05   1.71E-05

  CTE = L/Lo x T  1.27E-05   1.94E-05   2.12E-05   2.15E-05   2.17E-05   2.22E-05   2.30E-05   2.31E-05   2.37E-05   2.35E-05
  --------------- ---------- ---------- ---------- ---------- ---------- ---------- ---------- ---------- ---------- ----------

Vianco P. T., Sandia National Laboratories, 2001

**[Table 1.24.]{.underline} SnAgCu - Coefficient of Thermal Expansion
Data. Sample: As-cast #2**.

  --------------- ---------- ---------- ---------- ---------- ---------- ---------- ---------- ---------- ---------- ----------
  **Parameter**   **-50°C to **-25°C to **0°C to   **25°C to  **50°C to  **75°C to  **100°C to **125°C to **150°C to **175°C to
                  -25°C**    0°C**      25°C**     50°C**     75°C**     100°C**    125°C**    150°C**    175°C**    200°C**

  L/T             1.00E-05   1.43E-05   1.58E-05   1.64E-05   1.71E-05   1.70E-05   1.71E-05   1.69E-05   1.74E-05   1.59E-05

  CTE = L/Lo x T  1.37E-05   1.95E-05   2.16E-05   2.24E-05   2.33E-05   2.32E-05   2.34E-05   2.30E-05   2.37E-05   2.17E-05
  --------------- ---------- ---------- ---------- ---------- ---------- ---------- ---------- ---------- ---------- ----------

Vianco P. T., Sandia National Laboratories, 2001

**[Table 1.25.]{.underline} SnAgCu - Coefficient of Thermal Expansion
Data. Sample: Aged #1**.

  --------------- ---------- ---------- ---------- ---------- ---------- ---------- ---------- ---------- ---------- ----------
  **Parameter**   **-50°C to **-25°C to **0°C to   **25°C to  **50°C to  **75°C to  **100°C to **125°C to **150°C to **175°C to
                  -25°C**    0°C**      25°C**     50°C**     75°C**     100°C**    125°C**    150°C**    175°C**    200°C**

  L/T             1.01E-05   1.36E-05   1.53E-05   1.57E-05   1.61E-05   1.62E-05   1.63E-05   1.68E-05   1.72E-05   1.70E-05

  CTE = L/Lo x T  1.42E-05   1.92E-05   2.16E-05   2.22E-05   2.28E-05   2.30E-05   2.30E-05   2.38E-05   2.44E-05   2.41E-05
  --------------- ---------- ---------- ---------- ---------- ---------- ---------- ---------- ---------- ---------- ----------

Vianco P. T., Sandia National Laboratories, 2001

**[Table 1.26.]{.underline} SnAgCu - Coefficient of Thermal Expansion
Data. Sample: Aged #2.**

  --------------- ---------- ---------- ---------- ---------- ---------- ---------- ---------- ---------- ---------- ----------
  **Parameter**   **-50°C to **-25°C to **0°C to   **25°C to  **50°C to  **75°C to  **100°C to **125°C to **150°C to **175°C to
                  -25°C**    0°C**      25°C**     50°C**     75°C**     100°C**    125°C**    150°C**    175°C**    200°C**

  L/T             1.07E-05   1.45E-05   1.58E-05   1.62E-05   1.66E-05   1.72E-05   1.71E-05   1.70E-05   1.71E-05   1.61E-05

  CTE = L/Lo x T  1.46E-05   1.98E-05   2.16E-05   2.20E-05   2.26E-05   2.35E-05   2.33E-05   2.32E-05   2.32E-05   2.20E-05
  --------------- ---------- ---------- ---------- ---------- ---------- ---------- ---------- ---------- ---------- ----------

Vianco P. T., Sandia National Laboratories, 2001

**[Table 1.27.]{.underline} Mechanical Properties of Three Selected
Pb-free Alloys: Sn-3.2Ag-0.8Cu, Sn-3.5Ag, and Sn-0.7Cu**

+-------------+-------+------+-----+----------------+---------------+
| **Sample**  | *     | **   | *   | **Uniform      | **Total       |
|             | *Proc | YS** | *UT | Elongation     | Elongation    |
|             | ess** |      | S** | (%)**          | (%)**         |
|             |       | *    |     |                |               |
|             |       | *(MP | **( |                |               |
|             |       | a)** | MPa |                |               |
|             |       |      | )** |                |               |
+-------------+-------+------+-----+----------------+---------------+
| Sn-         | Q     | 26   | 31  | 4.2            | 24.5          |
| 3.2Ag-0.8Cu |       |      |     |                |               |
+-------------+-------+------+-----+----------------+---------------+
| Sn-         | Q     | 32   | 34  | 1.9            | 21.6          |
| 3.2Ag-0.8Cu |       |      |     |                |               |
+-------------+-------+------+-----+----------------+---------------+
| Sn-         | Q     | 25   | 30  | 4.0            | 20.2          |
| 3.2Ag-0.8Cu |       |      |     |                |               |
+-------------+-------+------+-----+----------------+---------------+
| **Average** | **Q** | **   | **3 | **3.4**        | **22.1**      |
|             |       | 28** | 2** |                |               |
+-------------+-------+------+-----+----------------+---------------+
| **Sn-3.     | *     | **   | **3 | **6.2**        | **26.1**      |
| 2Ag-0.8Cu** | *AC** | 20** | 0** |                |               |
+-------------+-------+------+-----+----------------+---------------+
|             |       |      |     |                |               |
+-------------+-------+------+-----+----------------+---------------+
| Sn-3.5Ag    | Q     | 30   | 31  | 2.9            | 26.3          |
+-------------+-------+------+-----+----------------+---------------+
| Sn-3.5Ag    | Q     | 20   | 25  | 4.3            | 20.1          |
+-------------+-------+------+-----+----------------+---------------+
| Sn-3.5Ag    | Q     | 23   | 28  | 5.0            | 16.2          |
+-------------+-------+------+-----+----------------+---------------+
| **Average** | **Q** | **   | **2 | **4.1**        | **20.9**      |
|             |       | 24** | 8** |                |               |
+-------------+-------+------+-----+----------------+---------------+
| *           | *     | **   | **2 | **6.4**        | **15.9**      |
| *Sn-3.5Ag** | *AC** | 19** | 8** |                |               |
+-------------+-------+------+-----+----------------+---------------+
|             |       |      |     |                |               |
+-------------+-------+------+-----+----------------+---------------+
| Sn-0.7Cu    | Q     | 15   | 20  | 5.7            | 27.7          |
+-------------+-------+------+-----+----------------+---------------+
| Sn-0.7Cu    | Q     | 15   | 20  | 8.5            | 22.2          |
+-------------+-------+------+-----+----------------+---------------+
| Sn-0.7Cu    | Q     | 16   | 18  | 2.0            | 12.6          |
+-------------+-------+------+-----+----------------+---------------+
| ### Average | **Q** | **   | **1 | **5.4**        | **20.8**      |
|             |       | 15** | 9** |                |               |
+-------------+-------+------+-----+----------------+---------------+
| *           | *     | **   | **2 | **9.1**        | **41.2**      |
| *Sn-0.7Cu** | *AC** | 16** | 2** |                |               |
+-------------+-------+------+-----+----------------+---------------+
| 63          | \-    | 27.2 | 3   | 3              | 48            |
| Sn-37Pb^\#^ |       |      | 0.6 |                |               |
+-------------+-------+------+-----+----------------+---------------+

^\*^ Q: water quenched, AC: air cooled\
\
**Source:** J. Madeni, S. Liu, and T. Siewert, \"Casting of Lead-Free
Solder Specimens with Various Solidification Rates\", ASM- International
Conference, Indianapolis 2001.

\# Data for the eutectic 63Sn-37Pb extracted from [Table
1.2.](http://www.mines.edu/students/j/jmadeni/Release4/part1.html# 1.2.)for
comparison.

![](media/image1.jpeg){width="5.1194444444444445in" height="4.21875in"}

**[Figure 1.1.]{.underline}** **Creep properties at 75^o^C for Sn-Ag-Cu,
Sn-Ag-Bi, Sn-Ag, Sn-Bi, and Sn-Pb solder alloys.**

Alan Woosley, Geoff Swan, T.S.Chong, Linda Matsushita, Thomas
Koschmieder and Kennon Simmons, \"Development of Lead (Pb) and Halogen
Free Peripheral Leaded and PBGA Components to Meet MSL3 260C Peak
Reflow\", Work presented by the research team from Motorola at EGG, 2001

**2. Thermal Properties:** Solidus, Liquidus, and Melting-point
Temperatures

**2.1. Solidus, Liquidus and Melting Temperatures**

[Table 2.1.1.]{.underline} Liquidus and Reflow Temperatures of Candidate
Lead-Free Solder Alloys for Replacing Eutectic Tin-Lead Solder

+---------------------------+-------------+------------+-------------+
| ### Alloy                 | Liquidus    | **Reflow** | **Melting** |
|                           |             |            |             |
| ###  Composition          | Temp.       | ###  Temp. | **          |
|                           |             |            | Range^\#^** |
|                           | (ºC)        | **(ºC)**   |             |
|                           |             |            | **(ºC)**    |
+---------------------------+-------------+------------+-------------+
| ### Sn-2Ag                |             |            | 221-226     |
+---------------------------+-------------+------------+-------------+
| ### Sn-3.5Ag              | 221         | 240 -- 250 | 221         |
+---------------------------+-------------+------------+-------------+
| Sn-0.7Cu                  | 227         | 245 -- 255 | 227         |
+---------------------------+-------------+------------+-------------+
| Sn-3.0Ag-0.5Cu\*          | 220\*\*     | 238 -- 248 |             |
+---------------------------+-------------+------------+-------------+
| Sn-3.2Ag-0.5Cu            | 218         | 238 -- 248 | 217-218     |
+---------------------------+-------------+------------+-------------+
| Sn-3.5Ag-0.75Cu\*         | 218         | 238 -- 248 |             |
+---------------------------+-------------+------------+-------------+
| Sn-3.8Ag-0.7Cu            | 210\*\*     | 238 -- 248 | 217-210     |
+---------------------------+-------------+------------+-------------+
| Sn-4.0Ag-0.5Cu            |             |            | 217-219     |
+---------------------------+-------------+------------+-------------+
| Sn-4.0Ag-1.0Cu\*          | 220\*\*     | 238 -- 248 | 217-220     |
+---------------------------+-------------+------------+-------------+
| Sn-4.7Ag-1.7Cu\*          | 244\*\*     | 237 -- 247 | 217-220     |
+---------------------------+-------------+------------+-------------+
|                           |             |            |             |
+---------------------------+-------------+------------+-------------+
| Sn-5Sb                    |             |            | 232-240     |
+---------------------------+-------------+------------+-------------+
| Sn-0.2Ag-2Cu-0.8Sb\*      | 285\*\*     | 246 - 256  | 226-228^%^  |
+---------------------------+-------------+------------+-------------+
| Sn-2.5Ag-0.8Cu-0.5Sb\*    | 225         | 233 -- 243 |             |
+---------------------------+-------------+------------+-------------+
|                           |             |            |             |
+---------------------------+-------------+------------+-------------+
| Sn-2Ag-7.5Bi\*            | 216\*\*     | 220 -- 230 |             |
+---------------------------+-------------+------------+-------------+
| Sn-3Ag-3Bi\*              | 218\*\*     | 233 -- 243 |             |
+---------------------------+-------------+------------+-------------+
| Sn-3Ag-5Bi\*              | 216\*\*     | 230 -- 240 |             |
+---------------------------+-------------+------------+-------------+
| Sn-3.4Ag-4.8Bi\*          | 215\*\*     | 225 -- 235 | 200-216     |
+---------------------------+-------------+------------+-------------+
| Sn-3.5Ag-3Bi\*            | 217\*\*     | 230 -- 240 |             |
+---------------------------+-------------+------------+-------------+
|                           |             |            |             |
+---------------------------+-------------+------------+-------------+
| Sn-58Bi                   |             |            | 138         |
+---------------------------+-------------+------------+-------------+
| ### Sn-3.2Ag-1.1Cu-3Bi\*  | 240\*\*     | 230 -- 240 |             |
+---------------------------+-------------+------------+-------------+
| Sn-3.5Ag-3In-0.5Bi\*      | 215\*\*     | 230 -- 240 |             |
+---------------------------+-------------+------------+-------------+
| Sn-3Bi-8Zn                |             |            | 189-199     |
+---------------------------+-------------+------------+-------------+

V. Solberg, "No-Lead Solder for CSP: The Impact of Higher Temperature
SMT Assembly Processing," Proc. NEPCON West 2000 Conf. (Feb. 28 - Mar.
2, 2000) Anaheim, CA (Source: Indium Corp.)

**^\#^**N.-C. Lee, "Lead-Free Chip-Scale Soldering of Packages," Chip
Scale Review, March-April 2000

\*Patented compositions; may require licensing or royalty agreements
before use.\
^\*\*^For more information see: [Phase Diagrams & Computational
Thermodynamics, Metallurgy Division of Materials Science and Engineering
Laboratory,
NIST.](http://www.metallurgy.nist.gov/phase/solder/agcusn.html)\
^%^Kester, SAF-ALLOY

### [Table 2.1.2.]{.underline} Melting Temperatures of Lead-Free Solders

+--------------------------+---------------+---------------------------+
| **Alloy**                | **Melting     | #  Comments^\#^           |
|                          | Temperature   |                           |
|                          | Range (ºC)**  |                           |
+--------------------------+---------------+---------------------------+
| ### Sn-25Ag-10Sb         | 233 (m.p.)    | High strength; patented   |
|                          |               | by Motorola ("Alloy J")   |
+--------------------------+---------------+---------------------------+
| ### Sn-0.7Cu             | 227^@^        |                           |
+--------------------------+---------------+---------------------------+
| Sn-3.5Ag                 | 221^@^        | Excellent strength and    |
|                          |               | wetting                   |
+--------------------------+---------------+---------------------------+
| Sn-2Ag                   | 221 -- 226    |                           |
+--------------------------+---------------+---------------------------+
| Sn-2.8Ag-20In            | 175 -- 186    |                           |
+--------------------------+---------------+---------------------------+
| Sn-5Sb\*                 | 232 -- 240    | Good high-temperature     |
|                          |               | shear strength            |
+--------------------------+---------------+---------------------------+
| Sn-58Bi                  | 138^@^        | Well established history; |
|                          |               | Inexpensive               |
+--------------------------+---------------+---------------------------+
| Sn-9Zn                   | 199\*         | Corrosion; high dross     |
+--------------------------+---------------+---------------------------+
|                          |               |                           |
+--------------------------+---------------+---------------------------+
| Sn-0.5Ag-4Cu             | 217 -- 350    | Very wide and high        |
|                          |               | melting range;            |
|                          |               | Engelhard's lead-free     |
|                          |               | plumbing solder           |
+--------------------------+---------------+---------------------------+
| Sn-2Ag-0.75Cu            | 217 -- 219    |                           |
+--------------------------+---------------+---------------------------+
| Sn-3.2Ag-0.5Cu           | 217 -- 218    |                           |
+--------------------------+---------------+---------------------------+
| Sn-3.8Ag-0.7Cu           | 217 -- 220    |                           |
+--------------------------+---------------+---------------------------+
| Sn-4Ag-0.5Cu             | 217 -- 225    |                           |
+--------------------------+---------------+---------------------------+
| Sn-4Ag-1Cu               | 217 -- 220    |                           |
+--------------------------+---------------+---------------------------+
| Sn-4.7Ag-1.7Cu           | 217 -- 244    |                           |
+--------------------------+---------------+---------------------------+
| Sn-8Zn-3Bi               | 192 -- 197    |                           |
+--------------------------+---------------+---------------------------+
|                          |               |                           |
+--------------------------+---------------+---------------------------+
| Sn-0.2Ag-2Cu-0.8Sb       | 287 -- 218    | High melting range;       |
|                          |               | Kester Solder Co.'s       |
|                          |               | Aquabond                  |
+--------------------------+---------------+---------------------------+
| Sn-2.5Ag-0.8Cu-0.5Sb     | 217 -- 225    |                           |
|                          |               |                           |
| (Castin)                 |               |                           |
+--------------------------+---------------+---------------------------+
| Sn-2Ag-7.5Bi             | 190 -- 216    |                           |
+--------------------------+---------------+---------------------------+
| Sn-3.4Ag-4.8Bi           | 201 -- 205    | (205 -- 210)^%^           |
+--------------------------+---------------+---------------------------+
| Sn-3.5Ag-3Bi             | 208 -- 217    | (m.p.: 220 ºC)^%^         |
+--------------------------+---------------+---------------------------+
| Sn-2Ag-3Bi-0.75Cu^%^     | 205 -- 217    |                           |
+--------------------------+---------------+---------------------------+
| Sn-3.5Ag-5Bi-0.7Cu^%^    | 198 -- 213    |                           |
+--------------------------+---------------+---------------------------+
|                          |               |                           |
+--------------------------+---------------+---------------------------+
| S                        | 202 -- 217    |                           |
| n-2Ag-4Bi-0.5Cu-0.1Ge^%^ |               |                           |
+--------------------------+---------------+---------------------------+
| Sn-57Bi-0.1Ag^%^         | 138 -- 140    |                           |
+--------------------------+---------------+---------------------------+
| Sn-52In                  | 118\*         | Lowest melt. pt.:         |
|                          |               | expensive                 |
+--------------------------+---------------+---------------------------+

\*Eutectic

N.-C. Lee and W. Casey, "Soldering Technology for Area Array Packages,"
Proceedings: NEPCON WEST 2000 (February 27 -- March 2, 2000), Anaheim,
CA

^\#^N.-C. Lee, J.A. Slattery, J.R. Sovinsky, I. Artaki, P.T. Vianco, "A
Drop-In Lead-Free Solder Replacement," Proceedings: NEPCON West
Conference (February 28 -- March 2, 1995), Anaheim, CA

\*Ning-Cheng Lee, "Lead-Free Soldering of Chip-Scale Packages," Chip
Scale Review, p. 42 (March-April 2000)

^%^Rao Mahidhara, "A Primer on Lead-Free Solder," Chip Scale Review
(March-April 2000)

**2.2. Thermal Properties: Miscellaneous**

### [Table 2.2.1.]{.underline} Thickness (μm) of Intermetallics in Solder Alloys Aged at 150 ºC

+-----------------+----------+-----------+----------+----------------+
| **Alloy:**      | **Sn     |           | **Sn-4A  |                |
|                 | -3.5Ag** |           | g-.5Cu** |                |
+-----------------+----------+-----------+----------+----------------+
| **Int           | **C      | **Cu~     | **C      | **Cu~6~Sn~5~** |
| er-metallics:** | u~3~Sn** | 6~Sn~5~** | u~3~Sn** |                |
+-----------------+----------+-----------+----------+----------------+
| **Time (h)**    |          |           |          |                |
+-----------------+----------+-----------+----------+----------------+
| 0               | 0.25     | 2         | 0.25     | 2              |
+-----------------+----------+-----------+----------+----------------+
| 48              | 0.5      | 3.25      | 0.5      | 2.5            |
+-----------------+----------+-----------+----------+----------------+
| 96              | 0.75     | 2.5       | 0.75     | 2.5            |
+-----------------+----------+-----------+----------+----------------+
| 264             | 1.0      | 2.5       | 1.0      | 3              |
+-----------------+----------+-----------+----------+----------------+
| 480             | 1.5      | 3         | 1.5      | 4.5            |
+-----------------+----------+-----------+----------+----------------+
| 984             | 2.5      | 4         | 2.5      | (nonuniform    |
|                 |          |           |          |                |
|                 |          |           |          | morphology)    |
+-----------------+----------+-----------+----------+----------------+

Angela Grusd, "Lead Free Solders in Electronics," SMI97, p. 648

[Table 2.2.2.]{.underline} Thermal and Electrical Properties of Castin™
(Sn-2.5Ag-0.8Cu-0.5Sb)

+---------------------------------+------------------------------------+
| ### Melting Point               | 215 -- 217 C                       |
+---------------------------------+------------------------------------+
| Thermal Diffusivity             | 35.82 +/- 0.18 mm^2^/s             |
+---------------------------------+------------------------------------+
| Specific Heat                   | 218.99 J/(kg.K)                    |
+---------------------------------+------------------------------------+
|                                 |                                    |
+---------------------------------+------------------------------------+
| Thermal Conductivity            | 57.26 W/(m.K)                      |
+---------------------------------+------------------------------------+
| Electrical Resistivity          | 1.2110^-7^ ohm.m                   |
+---------------------------------+------------------------------------+
| Electrical Conductivity         | 8.25 MS/m                          |
+---------------------------------+------------------------------------+

Karl Seelig and David Suraski, "The Status of Lead-Free Solder Alloys,"
Proc. 50^th^ IEEE 2000 Electronic Components and Technology Conference
(May 21-24, 2000), Las Vegas, NV

[Table 2.2.3.]{.underline} Physical and Mechanical Properties of
Sn-2.8Ag-20.0In and Sn-37Pb Eutectic

+-----------------------------------+----------------+----------------+
| ### Property                      | **Alloys**     |                |
|                                   |                |                |
| (measured at 20 C, except where   |                |                |
| otherwise noted)                  |                |                |
+-----------------------------------+----------------+----------------+
|                                   | **Sn-          | **Sn-37Pb      |
|                                   | 2.8Ag-20.0In** | (eutectic)**   |
+-----------------------------------+----------------+----------------+
| Density                           | 7.25           | 8.36           |
|                                   |                |                |
| (g/cm^3^)                         |                |                |
+-----------------------------------+----------------+----------------+
| Electrical Resistivity            | 0.170          | 0.146          |
|                                   |                |                |
| (10^-6^ohm.m)                     |                |                |
+-----------------------------------+----------------+----------------+
| Thermal Conductivity              | 53.5           | 50.9           |
|                                   |                |                |
| (W/(m.K)) (30 C)                  |                |                |
+-----------------------------------+----------------+----------------+
| Thermal Expansion                 | 28             | 25             |
|                                   |                |                |
| (10^-6^.K^-1^)                    |                |                |
+-----------------------------------+----------------+----------------+
| Tensile Strength                  | 6800           | 3900           |
|                                   |                |                |
| (psi)                             |                |                |
+-----------------------------------+----------------+----------------+
| Tensile Elongation                | 47             | 35             |
|                                   |                |                |
| (%)                               |                |                |
+-----------------------------------+----------------+----------------+
| Shear Strength                    | 4800           | 3450           |
|                                   |                |                |
| (psi)                             |                |                |
+-----------------------------------+----------------+----------------+
| Poisson's Ratio                   | 0.40           | 0.40           |
+-----------------------------------+----------------+----------------+
| Young's Modulus                   | 5600           | 4500           |
|                                   |                |                |
| (kpsi)                            |                |                |
+-----------------------------------+----------------+----------------+

N.-C. Lee, J.A. Slattery, J.R. Sovinsky, I. Artaki, P.T. Vianco, "A
Drop-In Lead-Free Solder Replacement," Proceedings: NEPCON West
Conference (February 28 -- March 2, 1995), Anaheim, CA

### [Table 2.2.4.]{.underline} Some Physical Properties of Materials Used as Electronic Packaging Conductors

+------------+-------+----------+----------+------------+-----+-----+
| #  Metal   | #     | El       | **T      | Thermal    | **^ |     |
|            | ## Me | ectrical | hermal** | Co         | \#^ |     |
|            | lting |          |          | nductivity | Sur |     |
|            |       | Res      | **Exp    |            | fac |     |
|            | ###   | istivity | ansion** | **(        | e** |     |
|            | Point |          |          | W/(m.K))** |     |     |
|            |       | **(μo    | **       |            | *   |     |
|            | **    | hm.cm)** | Coeff.** |            | *Te |     |
|            | (C)** |          |          |            | nsi |     |
|            |       |          | **(10^   |            | on, |     |
|            |       |          | -6^/C)** |            | σ** |     |
+------------+-------+----------+----------+------------+-----+-----+
|            |       |          |          |            | **( | *   |
|            |       |          |          |            | dyn | *(C |
|            |       |          |          |            | /** | )** |
|            |       |          |          |            |     |     |
|            |       |          |          |            | *   |     |
|            |       |          |          |            | *cm |     |
|            |       |          |          |            | )** |     |
+------------+-------+----------+----------+------------+-----+-----+
| Aluminum   | 660.1 | 4.3      | 23.0     | 240        | 520 | 750 |
+------------+-------+----------+----------+------------+-----+-----+
| ##         | 630.5 |          | 11.0\*   | 24.0\*     | 383 | 635 |
| # Antimony |       |          |          |            |     |     |
+------------+-------+----------+----------+------------+-----+-----+
| #          | 271.0 |          | 13.4\*   | 8.0\*      | 376 | 300 |
| ## Bismuth |       |          |          |            |     |     |
+------------+-------+----------+----------+------------+-----+-----+
| ##         | 1900  | 20       | 8.2      | 66         |     |     |
| # Chromium |       |          |          |            |     |     |
+------------+-------+----------+----------+------------+-----+-----+
| Copper     | 1083  | 1.7      | 16.6     | 393; 401\* |     |     |
+------------+-------+----------+----------+------------+-----+-----+
| Gold       | 1063  | 2.2      | 14.2     | 297        |     |     |
+------------+-------+----------+----------+------------+-----+-----+
| Indium     | 156.4 |          | 32.1\*   | 82.0\*     | 340 | 170 |
+------------+-------+----------+----------+------------+-----+-----+
| Lead       | 327.3 |          |          |            | 431 | 500 |
+------------+-------+----------+----------+------------+-----+-----+
| Molybdenum | 2625  | 5.2      | 5.0      | 146        |     |     |
+------------+-------+----------+----------+------------+-----+-----+
| Nickel     | 1455  | 6.8      | 12.8     | 92; 91\*   |     |     |
+------------+-------+----------+----------+------------+-----+-----+
| Palladium  | 1552  | 10.8     | 11.8     | 70         |     |     |
+------------+-------+----------+----------+------------+-----+-----+
| Platinum   | 1774  | 10.6     | 9.0      | 71         |     |     |
+------------+-------+----------+----------+------------+-----+-----+
| Silver     | 960.8 | 1.6      | 18.9     | 418; 429\* | 923 | 995 |
+------------+-------+----------+----------+------------+-----+-----+
| Tin        | 231.9 |          | 22.0\*   | 73.0\*     | 550 | 232 |
|            |       |          |          |            | ^%^ | ^%^ |
|            |       |          |          |            |     |     |
|            |       |          |          |            | 526 | 300 |
|            |       |          |          |            |     |     |
|            |       |          |          |            | 510 | 500 |
+------------+-------+----------+----------+------------+-----+-----+
| Tungsten   | 3415  | 5.5      | 4.5      | 200        |     |     |
+------------+-------+----------+----------+------------+-----+-----+
| Zinc       | 419.5 |          |          |            | 785 | 510 |
|            |       |          |          |            |     |     |
|            |       |          |          |            | 761 | 640 |
+------------+-------+----------+----------+------------+-----+-----+
|            |       |          |          |            |     |     |
+------------+-------+----------+----------+------------+-----+-----+
| Invar      | 1500  | 46       | 1.5      | 11         |     |     |
+------------+-------+----------+----------+------------+-----+-----+
| Kovar      | 1450  | 50       | 5.3      | 17         |     |     |
+------------+-------+----------+----------+------------+-----+-----+
|            |       |          |          |            |     |     |
+------------+-------+----------+----------+------------+-----+-----+
| Silver     | 1145  | 20       | 14.0     | 150        |     |     |
| -palladium |       |          |          |            |     |     |
+------------+-------+----------+----------+------------+-----+-----+
| Gol        | 1350  | 30       | 10.0     | 130        |     |     |
| d-platinum |       |          |          |            |     |     |
+------------+-------+----------+----------+------------+-----+-----+
|            |       |          |          |            |     |     |
+------------+-------+----------+----------+------------+-----+-----+
| Au-20Sn    | 280   | 16       | 15.9     | 57         |     |     |
+------------+-------+----------+----------+------------+-----+-----+
| Sn-37Pb    | 183   |          |          |            | 470 | 280 |
|            |       |          |          |            | ^%^ | ^%^ |
+------------+-------+----------+----------+------------+-----+-----+
| Pb-5Sn     | 310   | 19       | 29.0     | 63         |     |     |
+------------+-------+----------+----------+------------+-----+-----+
| C          | 1083  | 2.5      | 7.0      | 248        |     |     |
| u-W(20%Cu) |       |          |          |            |     |     |
+------------+-------+----------+----------+------------+-----+-----+
| Cu         | 1083  | 2.4      | 7.2      | 197        |     |     |
| -Mo(20%Cu) |       |          |          |            |     |     |
+------------+-------+----------+----------+------------+-----+-----+

*Microelectronics Packaging Handbook*, R.R. Tummala and E.J.
Rymaszewski, eds. (Van Nostrand Reinhold, 1989, NY)

^\#^ N.A. Lange, *Handbook of Chemistry*, p. 100 (Handbook Publishers,
Sandusky, Ohio, 1956)

^%^M. Abtew, "Wetting Characteristics of Lead Free Solders for High
Volume Surface Mount Application," Proc. NEPCON West 2000 Conf. (Feb.
28 - Mar. 2, 2000) Anaheim, CA

\*J.S. Hwang, "Overview of Lead-Free Solders for Electronics &
Microelectronics," Proc. SMI Conf. , p. 405

### [Table 2.2.5.]{.underline} Thermophysical Properties of Metallic Elements Used In Electronic Packaging

<table>
<colgroup>
<col style="width: 12%" />
<col style="width: 7%" />
<col style="width: 10%" />
<col style="width: 8%" />
<col style="width: 8%" />
<col style="width: 8%" />
<col style="width: 7%" />
<col style="width: 11%" />
<col style="width: 13%" />
<col style="width: 11%" />
</colgroup>
<tbody>
<tr class="odd">
<td rowspan="2"><h1 id="metal-2"> Metal</h1></td>
<td rowspan="2"><p>At.</p>
<p>Wt.</p></td>
<td><p><strong>Density</strong></p>
<p><strong>(20C)</strong></p></td>
<td><strong>Melt. Point</strong></td>
<td><strong>Lat. Ht. Fusion</strong></td>
<td colspan="2"><p><strong>Heat capacity</strong></p>
<p><strong>(25C)</strong></p></td>
<td><p><strong>Thermal</strong></p>
<p><strong>Exp. coef.</strong></p>
<p><strong>(20C)</strong></p></td>
<td><p><strong>Electrical</strong></p>
<p><strong>Resistivity</strong></p>
<p><strong>(20C)</strong></p></td>
<td><strong><sup>#</sup>Thermal conducti-vity</strong></td>
</tr>
<tr class="even">
<td><strong>(g/cm<sup>3</sup>)</strong></td>
<td><strong>(C)</strong></td>
<td><p><strong>(kg-cal/</strong></p>
<p><strong>g.atom)</strong></p></td>
<td><p><strong>(g-cal/</strong></p>
<p><strong>g-at.K)</strong></p></td>
<td><p><strong>J/</strong></p>
<p><strong>(kg.K)</strong></p></td>
<td><strong>(10<sup>-6</sup> K<sup>-1</sup>)</strong></td>
<td><strong>(10<sup>-6</sup> .cm)</strong></td>
<td><strong>(W/(m.K))</strong></td>
</tr>
<tr class="odd">
<td><h3 id="aluminum">Aluminum</h3></td>
<td>26.98</td>
<td>2.702</td>
<td>*660.46</td>
<td>2.6</td>
<td>5.817</td>
<td>902.1</td>
<td>23.03</td>
<td>2.62; 2.828<sup>#</sup></td>
<td>238.</td>
</tr>
<tr class="even">
<td>Antimony</td>
<td>121.76</td>
<td><p>6.684</p>
<p><strong>(25 C)</strong></p></td>
<td>*630.75</td>
<td>4.8</td>
<td>6.08</td>
<td>209.0</td>
<td>11.4</td>
<td>39; 39.1<sup>#</sup></td>
<td>24.5; 23.8<sup>§</sup></td>
</tr>
<tr class="odd">
<td>Bismuth</td>
<td>208.98</td>
<td>9.8</td>
<td>*271.44</td>
<td>2.63</td>
<td>6.1</td>
<td>122.1</td>
<td>13.4<sup>§</sup></td>
<td>115; 119.0<sup>#</sup></td>
<td>11.2; 9<sup>§</sup></td>
</tr>
<tr class="even">
<td>Chromium</td>
<td>51.996</td>
<td>7.1</td>
<td>1860<sup>§</sup></td>
<td>3.5</td>
<td>5.58</td>
<td>449.0</td>
<td>8.2</td>
<td>2.6 <strong>(0C)</strong></td>
<td>91.3<sup>§</sup></td>
</tr>
<tr class="odd">
<td><h3 id="copper">Copper</h3></td>
<td>63.54</td>
<td>8.92</td>
<td>*1084.9</td>
<td>3.11</td>
<td>5.85</td>
<td>385.2</td>
<td>16.6</td>
<td>1.69</td>
<td>416; 397<sup>§</sup></td>
</tr>
<tr class="even">
<td>Gold</td>
<td>196.97</td>
<td>19.3</td>
<td>*1064.4</td>
<td>3.03</td>
<td>6.0</td>
<td>127.5</td>
<td>14.2</td>
<td>2.4; 2.44<sup>#</sup></td>
<td>311;315.5<sup>§</sup></td>
</tr>
<tr class="odd">
<td>Indium</td>
<td>114.82</td>
<td>7.3</td>
<td>*156.63</td>
<td>0.78</td>
<td>6.55</td>
<td>238.7</td>
<td>33; 24.8<sup>§</sup></td>
<td>9; 8.37<sup>#</sup></td>
<td>80.0<sup>§</sup></td>
</tr>
<tr class="even">
<td>Lead</td>
<td>207.2</td>
<td>11.34</td>
<td>*327.50</td>
<td>1.22</td>
<td>6.41</td>
<td>129.4</td>
<td>29.1</td>
<td>21.9; 19.8<sup>#</sup></td>
<td>35.0</td>
</tr>
<tr class="odd">
<td>Molybdenum</td>
<td>95.94</td>
<td>10.2</td>
<td>*2623</td>
<td>6.66</td>
<td>5.61</td>
<td>244.8</td>
<td>4.</td>
<td>4.77; 5.14<sup>#</sup></td>
<td>138.</td>
</tr>
<tr class="even">
<td>Nickel</td>
<td>58.69</td>
<td>8.90; 8.8<sup>#</sup></td>
<td>*1455</td>
<td>4.2</td>
<td>6.21</td>
<td>442.6</td>
<td>12.8</td>
<td>6.9; 7.24<sup>#</sup></td>
<td>76.; 88.5<sup>§</sup></td>
</tr>
<tr class="odd">
<td>Palladium</td>
<td>106.42</td>
<td>12.</td>
<td>*1554</td>
<td>4.12</td>
<td>6.3</td>
<td>247.7</td>
<td>11.8</td>
<td>10.8; 10.21<sup>#</sup></td>
<td>75.2</td>
</tr>
<tr class="even">
<td>Platinum</td>
<td>195.08</td>
<td>21.45</td>
<td>*1769</td>
<td>5.2</td>
<td>6.35</td>
<td>136.2</td>
<td>8.9</td>
<td>10.5; 9.83<sup>#</sup></td>
<td>69.9; 73.4<sup>§</sup></td>
</tr>
<tr class="odd">
<td>Silver</td>
<td>107.87</td>
<td>10.5</td>
<td>*961.93</td>
<td>2.70</td>
<td>6.092</td>
<td>236.3</td>
<td>18.9</td>
<td>1.62; 1.47<sup>#</sup></td>
<td>417.; 425<sup>§</sup></td>
</tr>
<tr class="even">
<td>Tin</td>
<td>118.71</td>
<td>7.31</td>
<td>*231.97</td>
<td>1.69</td>
<td>6.30</td>
<td>222.1</td>
<td>20.; 23.5<sup>§</sup></td>
<td>11.4; 11.5<sup>#</sup></td>
<td>66.6; 73.2<sup>§</sup></td>
</tr>
<tr class="odd">
<td>Tungsten</td>
<td>184.83</td>
<td>19.3</td>
<td>*3387</td>
<td>8.42</td>
<td>5.97</td>
<td>135.9</td>
<td>4.</td>
<td>5.48; 5.51<sup>#</sup></td>
<td>169.; 174<sup>§</sup></td>
</tr>
<tr class="even">
<td>Zinc</td>
<td>65.39</td>
<td>7.14;7.04<sup>#</sup></td>
<td>*419.58</td>
<td>1.595</td>
<td>5.99</td>
<td>383.3</td>
<td>33.</td>
<td>6; 5.75<sup>#</sup></td>
<td>125.;119.5<sup>§</sup></td>
</tr>
</tbody>
</table>

N.A. Lange, *Handbook of Chemistry* pp. 100-107 (pp. 854-861) (Handbook
Publishers, Sandusky, Ohio, 1956)

\*Thermometric fixed point; E.A. Brandes, Smithells Metals Reference
Book, 6^th^ ed., p. 16-2 (Butterworths, London, 1983)

^\#^D.E. Gray, ed., *American Institute of Physics Handbook*, pp. 2-17
(density), 4-40 (ht. cap.), 5-204 (resistivity), 4-78 (th. cond.)
(McGraw-Hill, New York, 1957)

^§^E.A. Brandes, Smithells Metals Reference Book, 6^th^ ed., p. 14-1
(th. cond.: 0-100C) (Butterworths, London, 1983)

[Table 2.2.6.]{.underline} Some Properties of Materials Commonly Used In
Electronics - A

+---------------+---------+-----------+--------+---------+------------+
| #  Met        | **CTE** | Thermal   | **Ela  | **De    | ###        |
| al {#metal-3} |         |           | stic** | nsity** |  Poisson's |
|               | **(10^- | Cond.     |        |         |            |
|               | 6^/C)** |           | **     | **(g/c  | ###  Ratio |
|               |         | **(W      | Mod.** | m^3^)** |            |
|               |         | /(m.K))** |        |         | **(ν)**    |
|               |         |           | **(    |         |            |
|               |         |           | GPa)** |         |            |
+---------------+---------+-----------+--------+---------+------------+
| ### Aluminum  | 22.3    | 237       | 69     | 2.7     |            |
| {#aluminum-1} |         |           |        |         |            |
+---------------+---------+-----------+--------+---------+------------+
| Copper        | 16.5    | 398       | 124    | 8.9     | 0.31       |
|               |         |           |        |         |            |
|               | 1       |           | 1      |         |            |
|               | 6.9^\#^ |           | 25^\#^ |         |            |
|               |         |           |        |         |            |
|               | 17.3\*  |           | 117\*  |         |            |
+---------------+---------+-----------+--------+---------+------------+
| Molybdenum    | 5.0     | 140       | 324    | 10.2    |            |
+---------------+---------+-----------+--------+---------+------------+
|               |         |           |        |         |            |
+---------------+---------+-----------+--------+---------+------------+
| Cu/ Invar/Cu  | 5.2     | 167^%^    | \--    | 8.4     |            |
+---------------+---------+-----------+--------+---------+------------+
| Kovar         | 5.9     | 17        | 138    | 8.3     |            |
+---------------+---------+-----------+--------+---------+------------+
| Silicon       | 2.6     | \--       | 412    | 3.17    |            |
| Carbide       |         |           |        |         |            |
+---------------+---------+-----------+--------+---------+------------+
| Solder (95/5) | 28      | 36        | 23.5   | 11\.    |            |
+---------------+---------+-----------+--------+---------+------------+
|               |         |           |        |         |            |
+---------------+---------+-----------+--------+---------+------------+
| Diamond       | 1.7     | 2300      | 785    | 3.51    |            |
+---------------+---------+-----------+--------+---------+------------+
| Silicon       | 2.8     | 150       | 190    | 2.3     | 0.27       |
|               |         |           |        |         |            |
|               | 3.2^\#^ |           | 1      |         |            |
|               |         |           | 10^\#^ |         |            |
+---------------+---------+-----------+--------+---------+------------+
|               |         |           |        |         |            |
+---------------+---------+-----------+--------+---------+------------+
| Alumina       | 6.7     | 21        | 306    | 3.9     | 0.23       |
|               |         |           |        |         |            |
|               | 7.0^\#^ |           | 3      |         |            |
|               |         |           | 75^\#^ |         |            |
+---------------+---------+-----------+--------+---------+------------+
| Aluminum      | 4.5     | 250       | 327    | 3.2     | 0.25       |
|               |         |           |        |         |            |
| Nitride       | 4       |           | 3      |         |            |
|               | .03^\#^ |           | 20^\#^ |         |            |
+---------------+---------+-----------+--------+---------+------------+
| Beryllia      | 8.0     | 275       | 345    | 2.9     |            |
+---------------+---------+-----------+--------+---------+------------+
|               |         |           |        |         |            |
+---------------+---------+-----------+--------+---------+------------+
| Epoxy / Glass | 12 / 70 | 1.7       | 17.2   | 1.9     |            |
| (FR4; T\<Tg)  |         |           |        |         |            |
|               | x,y:    |           | x,y:   |         |            |
| (FR4; T\>Tg)  | 15.8\*  |           | 7.0\*  |         |            |
|               |         |           |        |         |            |
|               | z:      |           | z:     |         |            |
|               | 80-90\* |           | 7.5\*  |         |            |
|               |         |           |        |         |            |
|               | x,y:    |           | x,y:   |         |            |
|               | 20\*    |           | 17.0\* |         |            |
|               |         |           |        |         |            |
|               | z:      |           | z:     |         |            |
|               | 400\*   |           | 0.6\*  |         |            |
+---------------+---------+-----------+--------+---------+------------+
| Polyimides    | 45      | 8         | 4.2    | 1.6     |            |
+---------------+---------+-----------+--------+---------+------------+

(**CTE**: Coefficient of thermal expansion)

^%^In plane

Walter L. Winterbottom, "Converting to Lead-Free Solders: An Automotive
Industry Perspective," JOM, 20-24 (July 1993)

\*M.A. Korhonen, D.D. Brown and C.-Y. Li, "Mechanical Properties of
Plated Copper," Mat. Res. Soc. Symp. Proc. Vol. 323, p. 104 (MRS, 1994)
("plated \[thin foil\] copper")

^\#^S.M. Spearing, M.A. Tenhover, D.B. Lukco, L. Viswanathan and D.K.
Hollen, "Models for the Thermomechanical Behavior of Metal/Ceramic
Laminates," Mat. Res. Soc. Symp. Proc. Vol. 323, p. 128 (MRS, 1994)

[Table 2.2.7.]{.underline} Some Properties of Materials Commonly Used In
Electronics -- B

+--------------+---------+--------+---------+------------+-----------+
| ### Material | **Melt. | **Den  | **CTE** | *          | **        |
|              | Pt.**   | sity** |         | *Young's** | Tensile** |
|              |         |        | **(10^- |            |           |
|              | **(C)** | *      | 6^/C)** | **Modulus  | **S       |
|              |         | *(g/cm |         | E**        | trength** |
|              |         | ^3^)** |         |            |           |
|              |         |        |         | **(GPa)**  | **(MPa)** |
+--------------+---------+--------+---------+------------+-----------+
| Alumina      | 2050    | 3.985  | 5.8     | 380        | 620       |
|              |         |        |         |            |           |
| (Al~2~O~3~)  |         |        |         |            |           |
+--------------+---------+--------+---------+------------+-----------+
| Beryllia     | 2530    | 3.01   | 8.4 --  | 311        | 172 - 275 |
|              |         |        | 9.0     |            |           |
| (BeO)        |         |        |         |            |           |
+--------------+---------+--------+---------+------------+-----------+
| Silica       | 1710    | 2.19   | 0.54    | 69         | 110       |
| (SiO~2~)     |         |        |         |            |           |
|              |         |        |         |            |           |
| (vitreous)   |         |        |         |            |           |
+--------------+---------+--------+---------+------------+-----------+
| Zirconia     | 2960    | 5.56   | 10\.    | 138        | \>300     |
| (ZrO~2~) /   |         |        |         |            |           |
| (Yttria:     |         |        |         |            |           |
| Y~2~O~3~)    |         |        |         |            |           |
+--------------+---------+--------+---------+------------+-----------+
|              |         |        |         |            |           |
+--------------+---------+--------+---------+------------+-----------+
| AlN          | 2400    | 3.25   | 5.3     | 350        | 270       |
+--------------+---------+--------+---------+------------+-----------+
| Si~3~N~4~    | \>1750  | 3.19   | 3.3     | 304        | \>400     |
+--------------+---------+--------+---------+------------+-----------+
|              |         |        |         |            |           |
+--------------+---------+--------+---------+------------+-----------+
| Al           | 660     | 2.70   | 23.5    | 69         | 50 -195   |
+--------------+---------+--------+---------+------------+-----------+
| Cu           | 1083    | 8.96   | 17.0    | 180        |           |
+--------------+---------+--------+---------+------------+-----------+
| Ni           | 1453    | 8.9    | 13.3    | 199        | 660       |
+--------------+---------+--------+---------+------------+-----------+
| Mo           | 2617    | 10.22  | 5.1     | 324.8      | 458-690   |
+--------------+---------+--------+---------+------------+-----------+
| W            | 3410    | 19.3   | 4.5     | 411\.      | 550-620   |
+--------------+---------+--------+---------+------------+-----------+

S.D. Brandi, S. Liu, J.E. Indacochea and R. Xu, "Brazeability and
Solderability of Engineering Materials," ASM Handbook, Vol. 6: Welding,
Brazing and Soldering (ASM International, 1993)

[Table 2.2.8.]{.underline} Electrical Resistivity and Temperature
Coefficient (TCR) of Pure Metallic Elements Used in Electronic Packaging

+------------------+-----------+-----------------+-------------------+
| #####            | **Temp.** | **Resistivity** | #  TCR            |
| Metal {#metal-4} |           |                 |                   |
|                  | **(K)**   | **(ohm.cm)**    | **(10^--3^        |
|                  |           |                 | K^-1^)**          |
+------------------+-----------+-----------------+-------------------+
| ### Alumin       | 293       | 2.61            | 4.2               |
| um {#aluminum-2} |           |                 |                   |
+------------------+-----------+-----------------+-------------------+
| Antimony         | 293       | 37.6            | 5.1               |
+------------------+-----------+-----------------+-------------------+
| Bismuth          | 293       | 115             | 4.6               |
+------------------+-----------+-----------------+-------------------+
| Chromium         | 300       | 12.9            | 5.9               |
+------------------+-----------+-----------------+-------------------+
| ### Co           | 293       | 1.58            | 4.3               |
| pper {#copper-1} |           |                 |                   |
+------------------+-----------+-----------------+-------------------+
| Gold             | 293       | 2.01            | 4.0               |
+------------------+-----------+-----------------+-------------------+
| Indium           | 293       | 8.0             | 5.2               |
+------------------+-----------+-----------------+-------------------+
| Lead             | 293       | 19.3            | 4.2               |
+------------------+-----------+-----------------+-------------------+
| Molybdenum       | 300       | 5.3             | 4.35              |
+------------------+-----------+-----------------+-------------------+
| Nickel           | 293       | 6.2             | 6.8               |
+------------------+-----------+-----------------+-------------------+
| Palladium        | 300       | 10.5            | 4.2               |
+------------------+-----------+-----------------+-------------------+
| Platinum         | 300       | 10.4            | 3.0               |
+------------------+-----------+-----------------+-------------------+
| Silver           | 300       | 1.47            | 4.1               |
+------------------+-----------+-----------------+-------------------+
| Tin              | 293       | 10.1            | 4.6               |
+------------------+-----------+-----------------+-------------------+
| Tungsten         | 300       | 5.3             | 4.8               |
+------------------+-----------+-----------------+-------------------+
| Zinc             | 293       | 5.45            | 4.2               |
+------------------+-----------+-----------------+-------------------+

E.A. Brandes, Smithells Metals Reference Book, 6^th^ ed., p. 16-2
(Butterworths, London, 1983)

[Table 2.2.9.]{.underline} Wetting Properties of Sn-2.8Ag-20.0In and
Sn-37Pb Eutectic Solders

+-----------------------+----------+----------+-----------+-----------+
| ###  Fluxes           | **Sn-    |          |           |           |
|                       | 2.8Ag-20 |          |           |           |
|                       | .0In\*** |          |           |           |
+-----------------------+----------+----------+-----------+-----------+
|                       | *        |          | **Wetting |           |
|                       | *Wetting |          | Force**   |           |
|                       | Time**   |          |           |           |
|                       |          |          | **        |           |
|                       | **(se    |          | (mN/mm)** |           |
|                       | conds)** |          |           |           |
+-----------------------+----------+----------+-----------+-----------+
|                       | **200    | **240    | **200     | **240     |
|                       | ºC**     | ºC**     | ºC**      | ºC**      |
+-----------------------+----------+----------+-----------+-----------+
| A                     | 10.60    | 4.60     | 0.70      | 0.71      |
+-----------------------+----------+----------+-----------+-----------+
| B                     | 1.53     | 0.42     | 0.72      | 0.56      |
+-----------------------+----------+----------+-----------+-----------+
| C                     | 5.08     | 2.40     | 0.72      | 0.64      |
+-----------------------+----------+----------+-----------+-----------+
| D                     | 5.73     | 2.09     | 0.67      | 0.67      |
+-----------------------+----------+----------+-----------+-----------+
| Geometric Mean        | 4.66     | 1.76     | 0.70      | 0.64      |
+-----------------------+----------+----------+-----------+-----------+
|                       |          |          |           |           |
+-----------------------+----------+----------+-----------+-----------+
| A                     | #####    |          |           |           |
|                       |  Sn-37Pb |          |           |           |
+-----------------------+----------+----------+-----------+-----------+
|                       | 2.87     | 1.48     | 0.73      | 0.72      |
+-----------------------+----------+----------+-----------+-----------+
| B                     | 1.03     | 0.50     | 0.71      | 0.61      |
+-----------------------+----------+----------+-----------+-----------+
| C                     | 1.65     | 1.00     | 0.75      | 0.72      |
+-----------------------+----------+----------+-----------+-----------+
| D                     | 2.50     | 1.44     | 0.73      | 0.73      |
+-----------------------+----------+----------+-----------+-----------+
| Geometric Mean        | 1.87     | 1.02     | 0.73      | 0.69      |
+-----------------------+----------+----------+-----------+-----------+

N.-C. Lee, J.A. Slattery, J.R. Sovinsky, I. Artaki, P.T. Vianco, "A
Drop-In

Lead-Free Solder Replacement," Proceedings: NEPCON West Conference

(February 28 -- March 2, 1995), Anaheim, CA

\*J.A. Slattery and C.E.T. White, U.S. Patent 5,256,370 (Oct. 26, 1993)

[Table 2.2.10.]{.underline} Wetting Times and Forces (at 300 ºC):
Lead-Free Solder Alloys, and Eutectic Tin-Lead

+---------------+-----------+-----------+--------------+-------------+
| ### Alloy     | **T~0~**  | *         | **Force (2   | **F         |
|               |           | *T~2/3~** | s)**         | orce~max~** |
|               | **Mean    |           |              |             |
|               | [+]{.u    | **Mean    | **Mean       | **Mean      |
|               | nderline} | [+]{.u    | [+]          | [+]{        |
|               | σ**       | nderline} | {.underline} | .underline} |
|               |           | σ**       | σ**          | σ**         |
+---------------+-----------+-----------+--------------+-------------+
|               | **(s)**   | **(s)**   | **(μN/mm)**  | **(μN/mm)** |
+---------------+-----------+-----------+--------------+-------------+
| Sn-3.5Ag      | 0.0       | 1.23      | 549          | 579         |
|               | [+]{.u    | [+]{.u    | [+]          | [+]{        |
|               | nderline} | nderline} | {.underline} | .underline} |
|               | 0.0       | 0.01      | 42           | 47          |
+---------------+-----------+-----------+--------------+-------------+
| Sn-5Sb        | 0.11      | 0.74      | 403          | 413         |
|               | [+]{.u    | [+]{.u    | [+]          | [+]{        |
|               | nderline} | nderline} | {.underline} | .underline} |
|               | 0.08      | 0.07      | 14           | 15          |
+---------------+-----------+-----------+--------------+-------------+
| Sn-2.8Ag-20In | 0.0       | 1.28      | 250          | 290         |
|               | [+]{.u    | [+]{.u    | [+]          | [+]{        |
|               | nderline} | nderline} | {.underline} | .underline} |
|               | 0.0       | 0.04      | 24           | 31          |
+---------------+-----------+-----------+--------------+-------------+
|               |           |           |              |             |
+---------------+-----------+-----------+--------------+-------------+
| Sn-37Pb       | 0.0       | 1.00      | 470          | 485         |
|               | [+]{.u    | [+]{.u    | [+]          | [+]{        |
|               | nderline} | nderline} | {.underline} | .underline} |
|               | 0.0       | 0.06      | 24           | 19          |
+---------------+-----------+-----------+--------------+-------------+

M.A. Kwoka and D.M. Foster, "Lead Finish Comparison of Lead-Free Solders
versus Eutectic Solder," Proc. Surface Mount International Conference
(1994), p. 433

### [Table 2.2.11.]{.underline} Wetting Times (seconds; at 250 ºC) of Lead-free Solder Alloys 

+-----------------------+----------+----------+-----------+-----------+
| ###  Alloy            | **Pure   |          | **Actiec  |           |
|                       | Rosin**  |          | 5 Flux**  |           |
+-----------------------+----------+----------+-----------+-----------+
|                       | **Tb**   | **T2/3** | **Tb**    | **T2/3**  |
+-----------------------+----------+----------+-----------+-----------+
| Sn-40Pb               | 0.6      | 1.0      | 0.4       | 0.5       |
+-----------------------+----------+----------+-----------+-----------+
| Sn-3.6Ag              | 0.9      | 1.4      | 0.6       | 0.8       |
+-----------------------+----------+----------+-----------+-----------+
| Sn-3.6Ag-0.7Cu        | 0.6      | 1.0      | 0.5       | 0.7       |
+-----------------------+----------+----------+-----------+-----------+
| Sn-0.7Cu              | 1.0      | 1.4      | 0.7       | 1.0       |
+-----------------------+----------+----------+-----------+-----------+

^%^Rao Mahidhara, "A Primer on Lead-Free Solder," Chip Scale Review
(March-April 2000)

[Table 2.2.12.]{.underline} Onset of Melting Temperatures for Five
Sn-Ag-Cu Lead-Free Solder Alloys

+-----------------------------+-----------+-----------+----------------+
| Alloy                       | Spec.     | Tem       |                |
|                             |           | perature, |                |
|                             | No.       |           |                |
|                             |           | Onset of  |                |
|                             |           | Melting   |                |
|                             |           |           |                |
|                             |           | (ºC)      |                |
+-----------------------------+-----------+-----------+----------------+
|                             |           | This      | Other          |
|                             |           |           |                |
|                             |           | Work      | (Ref.)         |
+-----------------------------+-----------+-----------+----------------+
| Sn-3.6Ag-1.5Cu              | 1         | 217.0     | 225 (1)        |
+-----------------------------+-----------+-----------+----------------+
| Sn-4.7Ag-1.7Cu              | 2a        | 216.7     |                |
+-----------------------------+-----------+-----------+----------------+
| Sn-4.7Ag-1.7Cu              | 2b        | 216.8     |                |
+-----------------------------+-----------+-----------+----------------+
| Sn-4.1Ag-0.9Cu              | 3         | 216.5     |                |
+-----------------------------+-----------+-----------+----------------+
| Ave. onset temp., specimens |           | 216.8     |                |
| 1-3                         |           |           |                |
+-----------------------------+-----------+-----------+----------------+
| Reference Samples:          |           |           |                |
+-----------------------------+-----------+-----------+----------------+
| Sn-3.8Ag-2.3Cu              | \--       |           | 217.4 (3)      |
+-----------------------------+-----------+-----------+----------------+
| Sn-3.5Ag-0.0Cu              | 4         | 220.8     | 221 (2)        |
+-----------------------------+-----------+-----------+----------------+
| Sn (pure)                   | 5         | 231.2     | 231.97 (2)     |
+-----------------------------+-----------+-----------+----------------+

Chad M. Miller, Iver E. Anderson and Jack F. Smith, "A Viable Tin-Lead
Solder Substitute: Sn-Ag-Cu," J. Electronic Matls. 23(7) 595-601 (1994)

(1) E.Gebhardt and G. Petzow, Z. Metallkde. 50, 597 (1950)

(2) T.B. Massalski, *Binary Phase Diagrams*, 2^nd^ ed. (Amer. Soc.
    Metals, 1990)

\(3\) Miller, Anderson and Smith, Note added in proof, J. Electronic
Matls. 23(7) 601 (1994)

[Table 2.2.13.]{.underline} Solidus Temperatures and Wetting Contact
Angles of Selected Lead-Free Solder Alloys with Use of RMA (GF-1235)
Flux

+--------------------------------------+-------------+----------------+
| #########  **Alloy**                 | **Solidus** | **Contact**    |
|                                      |             |                |
|                                      | **(ºC)**    | **Angle**      |
|                                      |             |                |
|                                      |             | **(degrees)**  |
+--------------------------------------+-------------+----------------+
| # Sn-4.7Ag-1.7Cu                     | 217         | 32             |
|                                      | (eutectic)  |                |
+--------------------------------------+-------------+----------------+
|                                      |             |                |
+--------------------------------------+-------------+----------------+
| Sn-3.33Ag-4.83Bi                     | 212         | n.a.           |
+--------------------------------------+-------------+----------------+
| Sn-5Ag-2Bi                           | 214.5       | 30             |
+--------------------------------------+-------------+----------------+
| ######## Sn-8Ag-3Sb                  | 224         | 39             |
+--------------------------------------+-------------+----------------+
|                                      |             |                |
+--------------------------------------+-------------+----------------+
| Sn-4.5Ag-6Bi-5.4Sb-4In               | 214         | 36             |
+--------------------------------------+-------------+----------------+
| Sn-4.4Ag-6Bi-5.3Sb-6In               | 217         | 34             |
+--------------------------------------+-------------+----------------+
|                                      |             |                |
+--------------------------------------+-------------+----------------+
| Sn-37Pb (control)                    | 183         | 16             |
|                                      |             |                |
|                                      | (eutectic)  |                |
+--------------------------------------+-------------+----------------+

Iver E. Anderson, "Tin-Silver-Copper: A Lead-Free Solder for Capacitor
Interconnects," p. 16, Proc. 16^th^ Capacitor and Resistor Technology
Symposium (CARTS 96), 11-15 March, 1996;

**[Table 2.2.14.]{.underline} Solidus and Liquidus Temperatures and
Wetting Angles of Some Lead-free Alloys on Copper** (Note opposing
effects on wetting angle of increasing temperature for alloys with or
without zinc)

+-------------------+-----+-----+-----+-----+------+-------+-------+
| ###  Alloy        | **  |     | **L |     | *    |       |       |
|                   | Sol |     | iqu |     | *Wet |       |       |
|                   | idu |     | idu |     | ting |       |       |
|                   | s** |     | s** |     | A    |       |       |
|                   |     |     |     |     | ngle |       |       |
|                   | **  |     | **  |     | (de  |       |       |
|                   | (ºC |     | (ºC |     | g)** |       |       |
|                   | )** |     | )** |     |      |       |       |
|                   |     |     |     |     | **(  |       |       |
|                   |     |     |     |     | with |       |       |
|                   |     |     |     |     | Ke   |       |       |
|                   |     |     |     |     | ster |       |       |
|                   |     |     |     |     | Flux |       |       |
|                   |     |     |     |     | No.  |       |       |
|                   |     |     |     |     | 19   |       |       |
|                   |     |     |     |     | 7)** |       |       |
+-------------------+-----+-----+-----+-----+------+-------+-------+
|                   | **C | *   | **C | *   | *    | **295 | **340 |
|                   | alc | *Ex | alc | *Ex | *250 | ºC**  | ºC**  |
|                   | .** | ptl | .** | ptl | ºC** |       |       |
|                   |     | .** |     | .** |      |       |       |
+-------------------+-----+-----+-----+-----+------+-------+-------+
| ##                | 222 | 222 | 232 | 232 | 38   |       | 43    |
| ###### Sn-1Ag-1Sb |     |     |     |     |      |       |       |
+-------------------+-----+-----+-----+-----+------+-------+-------+
| Sn-1Ag-1Sb-1Zn    |     |     |     |     | 41   | 41    | 42    |
+-------------------+-----+-----+-----+-----+------+-------+-------+
| Sn-4Ag-7Sb        | 229 | 230 | 230 | 230 | 35   |       | 39    |
+-------------------+-----+-----+-----+-----+------+-------+-------+
| Sn-4Ag-7Sb-1Zn    |     |     |     |     | 48   | 46    | 36    |
+-------------------+-----+-----+-----+-----+------+-------+-------+
|                   |     |     |     |     |      |       |       |
+-------------------+-----+-----+-----+-----+------+-------+-------+
| Sn-2Ag-0.8Cu-6Zn  | 190 | 217 | 195 | 217 | 77   | 67    | 62    |
+-------------------+-----+-----+-----+-----+------+-------+-------+
| Sn-2Ag-0.8Cu-8Zn  | 191 | 215 | 200 | 215 | 86   | 70    | 52    |
+-------------------+-----+-----+-----+-----+------+-------+-------+
|                   |     |     |     |     |      |       |       |
+-------------------+-----+-----+-----+-----+------+-------+-------+
| Sn-10Bi-0.8Cu     | 178 | 185 | 218 | 217 | 32   |       | 42    |
+-------------------+-----+-----+-----+-----+------+-------+-------+
| Sn-10Bi-0.8Cu-1Zn |     |     |     |     | 33   | 38    | 27    |
+-------------------+-----+-----+-----+-----+------+-------+-------+
| Sn-10Bi-5Sb       | 186 | 193 | 228 | 232 | 39   |       | 48    |
+-------------------+-----+-----+-----+-----+------+-------+-------+
| Sn-10Bi-5Sb-1Zn   |     |     |     |     | 50   | 42    | 29    |
+-------------------+-----+-----+-----+-----+------+-------+-------+
| Sn-45Bi-3Sb       | 147 | 145 | 168 | 178 |      |       | 37    |
+-------------------+-----+-----+-----+-----+------+-------+-------+
| Sn-45Bi-3Sb-1Zn   |     |     |     |     | 98   | 46    | 27    |
+-------------------+-----+-----+-----+-----+------+-------+-------+
|                   |     |     |     |     |      |       |       |
+-------------------+-----+-----+-----+-----+------+-------+-------+
| Sn-37Pb           |     |     |     |     |      |       | 14    |
| (eutectic)        |     |     |     |     |      |       |       |
+-------------------+-----+-----+-----+-----+------+-------+-------+

M.E. Loomans, S. Vaynman, G.Ghosh and M.E. Fine, "Investigation of
Multi-component Lead-free Solders," J. Elect. Matls. 23(8), 741 (1994)

### [Table 2.2.15.]{.underline} Melting Properties, Resistivity, Wettability and Hardness of Lead-Free Solders

+------------------+------+------+------+-----------+-------+-------+
| **Alloy**        | *    | **T~ | *    | **Ele     | *     | **H   |
|                  | *T~e | p~** | *T~o | ctrical** | *Wett | ard-n |
|                  | x~** |      | b~** |           | a-bil | ess** |
|                  |      | **(º |      | ### Resi  | ity** |       |
|                  | **(º | C)** | **(º | stivity\* |       | *     |
|                  | C)** |      | C)** |           | **Ra  | *(VHN |
|                  |      |      |      | **        | tio** | )Ha** |
|                  |      |      |      | (μΩ-cm)** |       |       |
+------------------+------+------+------+-----------+-------+-------+
| Sn-3.5Ag         | 2    | 2    | 2    | 7.7       | 97,   | 17.9  |
|                  | 21.5 | 26.5 | 20.0 |           | 95    |       |
+------------------+------+------+------+-----------+-------+-------+
| Sn-5Bi           | 2    | 2    | 1    | 11.0      | 97,   | 25.6  |
|                  | 19.4 | 28.7 | 96.0 |           | 97    |       |
+------------------+------+------+------+-----------+-------+-------+
| Sn-10Bi          | 2    | 2    | 1    | 17.7      | 98,   | 33.0  |
|                  | 09.1 | 21.2 | 65.0 |           | 97    |       |
+------------------+------+------+------+-----------+-------+-------+
| Sn-5In           | 2    | 2    | 2    | 8.3       | 99,   | 20.8  |
|                  | 19.7 | 23.4 | 11.5 |           | 97    |       |
+------------------+------+------+------+-----------+-------+-------+
| Sn-5Sb           | 2    | 2    | 2    | 17.1      | 96,   | 17.2  |
|                  | 36.8 | 44.9 | 31.6 |           | 96    |       |
+------------------+------+------+------+-----------+-------+-------+
|                  |      |      |      |           |       |       |
+------------------+------+------+------+-----------+-------+-------+
| Sn-3Ag -5Bi      | 2    | 2    | 1    | 11.6      | 98,   | 29.9  |
|                  | 14.4 | 18.1 | 91.6 |           | 98    |       |
+------------------+------+------+------+-----------+-------+-------+
| Sn-3Ag-10Bi      | 2    | 2    | 1    | 8.8       | \-\-- | \-\-- |
|                  | 01.5 | 14.3 | 64.4 |           |       |       |
+------------------+------+------+------+-----------+-------+-------+
| Sn-3Ag-3In       | 2    | 2    | 1    | 7.7       | 99,   | 21.3  |
|                  | 10.7 | 14.7 | 93.3 |           | 99    |       |
+------------------+------+------+------+-----------+-------+-------+
| Sn-3Ag-5Sb       | 2    | 2    | 2    | 10.5      | 99,   | 25.4  |
|                  | 25.0 | 35.9 | 16.3 |           | 99    |       |
+------------------+------+------+------+-----------+-------+-------+
| Sn-3Ag-1Zn       | 2    | 2    | 2    | 10.4      | 98,   | 18.2  |
|                  | 15.9 | 20.9 | 10.0 |           | 97    |       |
+------------------+------+------+------+-----------+-------+-------+
| Sn-3Ag-3Zn       | 2    | 2    | 2    | 4.8       | 97,   | 21.9  |
|                  | 17.8 | 22.5 | 06.8 |           | 97    |       |
+------------------+------+------+------+-----------+-------+-------+
|                  |      |      |      |           |       |       |
+------------------+------+------+------+-----------+-------+-------+
| Sn-5Bi-5In       | 2    | 2    | 1    | 19.1      | 98,   | 28.0  |
|                  | 05.5 | 18.4 | 77.0 |           | 95    |       |
+------------------+------+------+------+-----------+-------+-------+
| Sn-5Sb-3In       | 2    | 2    | 2    | 9.8       | 98,   | 31.9  |
|                  | 26.7 | 40.3 | 11.7 |           | 97    |       |
+------------------+------+------+------+-----------+-------+-------+
| Sn-1Cu-5Bi       | 2    | 2    | 1    | 10.5      | 96,   | 31.9  |
|                  | 16.7 | 26.7 | 84.8 |           | 95    |       |
+------------------+------+------+------+-----------+-------+-------+
|                  |      |      |      |           |       |       |
+------------------+------+------+------+-----------+-------+-------+
| Sn-1Cu-5Bi-5In   | 2    | 2    | 1    | 14.1      | 96,   | 40.6  |
|                  | 04.9 | 11.0 | 67.5 |           | 95    |       |
+------------------+------+------+------+-----------+-------+-------+
| Sn-1.5Cu-2Bi-3Sb | 2    | 2    | 2    | 8.0       | 98,   | 32.9  |
|                  | 24.1 | 34.5 | 07.0 |           | 96    |       |
+------------------+------+------+------+-----------+-------+-------+
|                  |      |      |      |           |       |       |
+------------------+------+------+------+-----------+-------+-------+
| Sn-3Ag-2Cu -2Sb  | 2    | 2    | 2    | 11.2      | 98,   | 28.6  |
|                  | 18.6 | 30.1 | 12.8 |           | 98    |       |
+------------------+------+------+------+-----------+-------+-------+
| Sn-3Ag-3Cu -2Bi  | 2    | 2    | 1    | 10.6      | 97,   | 34.5  |
|                  | 11.1 | 22.2 | 95.7 |           | 96    |       |
+------------------+------+------+------+-----------+-------+-------+
| Sn-3Ag-5Bi-5In   | 1    | 2    | 1    | 12.1      | \-\-- | \-\-- |
|                  | 95.7 | 09.0 | 58.9 |           |       |       |
+------------------+------+------+------+-----------+-------+-------+
|                  |      |      |      |           |       |       |
+------------------+------+------+------+-----------+-------+-------+
| Sn (pure)        |      |      |      | 11.2      | \-\-- | 10.5  |
+------------------+------+------+------+-----------+-------+-------+
| Sn-37Pb          |      |      |      | 17.0      | 95,   | 12.9  |
| (eutectic)       |      |      |      |           | 91    |       |
+------------------+------+------+------+-----------+-------+-------+

T~ex~ is the extrapolated onset melting temperature by differential
scanning calorimetry (DSC)

T~p~ is the peak melting temperature by DSC

T~ob~ is the observed onset melting temperature

\*Method of Van der Pauw

S.K. Kang et al., "Pb-Free Solder Alloys for Flip Chip Applications,"
49^th^ Electronic Components Technology Conf. (1999), June 1-4, San
Diego CA

**[Table 2.2.16.]{.underline}** **Wetting Contact Angles of Sn-Ag,
Sn-Bi, and Sn-Zn Alloys on Copper: Eutectic, and With 1% Addition of
Ternary Elements**

+------------------+-----+------+----+-----+-----+-----+-----+-----+
| #  Solder        | **S |      | ** |     |     | *   |     |     |
|                  | nCl |      | Ke |     |     | *20 |     |     |
| **Alloy**        | ~2~ |      | st |     |     | %   |     |     |
|                  | ,** |      | er |     |     | R   |     |     |
|                  |     |      | R  |     |     | osi |     |     |
|                  | *   |      | os |     |     | n** |     |     |
|                  | *Sa |      | in |     |     |     |     |     |
|                  | tur |      | ** |     |     | *   |     |     |
|                  | ate |      |    |     |     | *in |     |     |
|                  | d** |      | ** |     |     | Is  |     |     |
|                  |     |      | Fl |     |     | opr |     |     |
|                  | **S |      | ux |     |     | opy |     |     |
|                  | olu |      | N  |     |     | l** |     |     |
|                  | tio |      | o. |     |     |     |     |     |
|                  | n** |      | 1  |     |     | **  |     |     |
|                  |     |      | 97 |     |     | Alc |     |     |
|                  |     |      | ** |     |     | oho |     |     |
|                  |     |      |    |     |     | l** |     |     |
+------------------+-----+------+----+-----+-----+-----+-----+-----+
|                  | *   | **2  | *  | *   | *   | *   | *   | *   |
|                  | *16 | 00** | *1 | *20 | *25 | *16 | *20 | *25 |
|                  | 5** |      | 65 | 0** | 0** | 5** | 0** | 0** |
|                  |     | **   | ** |     |     |     |     |     |
|                  | **º | ºC** |    | **º | **º | **º | **º | **º |
|                  | C** |      | ** | C** | C** | C** | C** | C** |
|                  |     |      | ºC |     |     |     |     |     |
|                  |     |      | ** |     |     |     |     |     |
+------------------+-----+------+----+-----+-----+-----+-----+-----+
| # Sn-3.5Ag       |     |      |    |     | 38  |     |     | 45  |
+------------------+-----+------+----+-----+-----+-----+-----+-----+
| Sn-3.5Ag-1Cu     |     |      |    |     | 36  |     |     | 44  |
+------------------+-----+------+----+-----+-----+-----+-----+-----+
| Sn-3.5Ag-1In     |     |      |    |     | 35  |     |     | 39  |
+------------------+-----+------+----+-----+-----+-----+-----+-----+
|                  |     |      |    |     |     |     |     |     |
+------------------+-----+------+----+-----+-----+-----+-----+-----+
| Sn-3.5Ag-1Sb     |     |      |    |     | 35  |     |     | 35  |
+------------------+-----+------+----+-----+-----+-----+-----+-----+
| Sn-3.5Ag-1Bi     |     |      |    |     | 28  |     |     | 38  |
+------------------+-----+------+----+-----+-----+-----+-----+-----+
| Sn-3.5Ag-5Bi     |     |      |    |     | 31  |     |     | 42  |
+------------------+-----+------+----+-----+-----+-----+-----+-----+
|                  |     |      |    |     |     |     |     |     |
+------------------+-----+------+----+-----+-----+-----+-----+-----+
| Sn-58Bi          | 10  | 15   | 27 | 28  |     | 40  | 32  |     |
+------------------+-----+------+----+-----+-----+-----+-----+-----+
| Sn-58Bi-1Ag      | 14  | 17   | 35 | 44  |     | 43  | 39  |     |
+------------------+-----+------+----+-----+-----+-----+-----+-----+
| Sn-58Bi-1Cu      | 9   | 12   | 36 | 38  |     | 40  | 30  |     |
+------------------+-----+------+----+-----+-----+-----+-----+-----+
|                  |     |      |    |     |     |     |     |     |
+------------------+-----+------+----+-----+-----+-----+-----+-----+
| Sn-58Bi-1In      | 7   | 12   | 40 | 35  |     | 56  | 43  |     |
+------------------+-----+------+----+-----+-----+-----+-----+-----+
| Sn-58Bi-1Sb      | 20  | 15   | 31 | 35  |     | 38  | 42  |     |
+------------------+-----+------+----+-----+-----+-----+-----+-----+
| Sn-58Bi-1Zn      | 18  | 12   | 58 | 54  |     | 50  | \-- |     |
+------------------+-----+------+----+-----+-----+-----+-----+-----+
|                  |     |      |    |     |     |     |     |     |
+------------------+-----+------+----+-----+-----+-----+-----+-----+
| # Sn-8.9Zn       |     |      |    |     | 59  |     |     | 58  |
+------------------+-----+------+----+-----+-----+-----+-----+-----+
| Sn-8.9Zn-1In     |     |      |    |     | 63  |     |     | 53  |
+------------------+-----+------+----+-----+-----+-----+-----+-----+

M.E. Loomans, S. Vaynman, G.Ghosh and M.E. Fine, "Investigation of
Multi-component Lead-free Solders," J. Elect. Matls. 23(8), 741 (1994)

**[Table 2.2.17.]{.underline}** **Wetting Contact Angles on Copper of
Sn-Bi Alloys: Eutectic, and With Addition of Ternary Elements**

+-------------+------+------+------+------+------+------+------+------+
| **Solder**  | **Sn |      | **Ke |      | **20 |      | **20 |      |
|             | Cl~2 |      | ster |      | %    |      | %    |      |
| **Alloy**   | ~,** |      | Fl   |      | Ros  |      | Ros  |      |
|             |      |      | ux** |      | in** |      | in** |      |
|             | *    |      |      |      |      |      |      |      |
|             | *Sat |      | *    |      | **in |      | **in |      |
|             | urat |      | *No. |      | Iso  |      | I    |      |
|             | ed** |      | 1    |      | prop |      | PA + |      |
|             |      |      | 97** |      | yl** |      | 1%   |      |
|             | **So |      |      |      |      |      | S    |      |
|             | luti |      |      |      | *    |      | nCl~ |      |
|             | on** |      |      |      | *Alc |      | 2~** |      |
|             |      |      |      |      | ohol |      |      |      |
|             |      |      |      |      | (IP  |      |      |      |
|             |      |      |      |      | A)** |      |      |      |
+-------------+------+------+------+------+------+------+------+------+
|             | *    | *    | *    | *    | *    | *    | *    | *    |
|             | *165 | *200 | *165 | *200 | *165 | *200 | *165 | *200 |
|             | ºC** | ºC** | ºC** | ºC** | ºC** | ºC** | ºC** | ºC** |
+-------------+------+------+------+------+------+------+------+------+
| #####       | 10   | 15   | 27   | 28   | 40   | 32   | 43   | 35   |
| ### Sn-58Bi |      |      |      |      |      |      |      |      |
+-------------+------+------+------+------+------+------+------+------+
| Sn-58Bi-1Ag | 14   | 17   | 35   | 44   | 43   | 39   | 93   | 45   |
+-------------+------+------+------+------+------+------+------+------+
| Sn-58Bi-1Cu | 9    | 12   | 36   | 38   | 40   | 30   | 46   | 31   |
+-------------+------+------+------+------+------+------+------+------+
|             |      |      |      |      |      |      |      |      |
+-------------+------+------+------+------+------+------+------+------+
| Sn-58Bi-1In | 7    | 12   | 40   | 35   | 56   | 43   |      |      |
+-------------+------+------+------+------+------+------+------+------+
| Sn-58Bi-1Sb | 20   | 15   | 31   | 35   | 38   | 42   |      |      |
+-------------+------+------+------+------+------+------+------+------+
| Sn-58Bi-1Zn | 18   | 12   | 58   | 54   | 50   | \--  |      |      |
+-------------+------+------+------+------+------+------+------+------+

M.E. Loomans, S. Vaynman, G.Ghosh and M.E. Fine, "Investigation of
Multi-component Lead-free Solders," J. Elect. Matls. 23(8), 741 (1994)

[Table 2.2.18.]{.underline} Wetting Properties of Pure Tin, Four
Lead-Free Tin Alloys and Three Lead-Tin Alloys

+------+-----+------------+------------+--------+------+-----+-----+
| **   | **T | **Wetting  | **Max.     | ###    |      | **A |     |
| Sold | emp | Time,**    | Wetting**  | Wettin |      | rea |     |
| er** | .** |            |            | g Rate |      | of  |     |
|      |     | **Mean     | **Force,** |        |      | Sp  |     |
| #### | **  | (s         |            |        |      | rea |     |
| #  A | (ºC | td.dev.)** | **mean     |        |      | d** |     |
| lloy | )** |            | (s         |        |      |     |     |
|      |     | **(s)**    | td.dev.)** |        |      | **  |     |
|      |     |            |            |        |      | (cm |     |
|      |     |            | **(mg)**   |        |      | ^2^ |     |
|      |     |            |            |        |      | )** |     |
+------+-----+------------+------------+--------+------+-----+-----+
|      |     |            |            | **     | **N  | **  | **P |
|      |     |            |            | mean** | orma | Flu | owe |
|      |     |            |            |        | l-** | xit | r** |
|      |     |            |            | **     |      | e** |     |
|      |     |            |            | (std.d | **Iz |     | **  |
|      |     |            |            | ev.)** | ed** |     | flo |
|      |     |            |            |        |      |     | w** |
|      |     |            |            | **(m   | *    |     |     |
|      |     |            |            | V/s)** | *(Sn |     | **  |
|      |     |            |            |        | =    |     | Flu |
|      |     |            |            |        | 1)** |     | x** |
+------+-----+------------+------------+--------+------+-----+-----+
| Sn   | 282 | 0.68       | 607 ( 84)  | 138 (  | 1.00 | 0.5 | 0   |
| (p   |     | (0.10)     |            | 43)    |      |     | .55 |
| ure) |     |            |            |        |      |     |     |
+------+-----+------------+------------+--------+------+-----+-----+
|      |     |            |            |        |      |     |     |
+------+-----+------------+------------+--------+------+-----+-----+
| Sn   | 300 | 0.60       | 565 ( 82)  | 120 (  | 0.87 | 0.5 | 0.5 |
| -1Cu |     | (0.11)     |            | 43)    |      |     |     |
+------+-----+------------+------------+--------+------+-----+-----+
| Sn   | 365 | 0.19       | 648 ( 61)  | 365    | 2.64 | 0.7 | 0.8 |
| -3Cu |     | (0.08)     |            | (122)  |      |     |     |
+------+-----+------------+------------+--------+------+-----+-----+
| Sn-3 | 260 | 0.60       | 533 (109)  | 124 (  | 0.90 | 0.5 | 0.6 |
| .5Ag |     | (0.12)     |            | 30)    |      |     |     |
+------+-----+------------+------------+--------+------+-----+-----+
| Sn   | 280 | 0.83       | 393 (117)  | 97 (   | 0.70 | 0.5 | 0   |
| -5Sb |     | (0.12)     |            | 24)    |      |     | .55 |
+------+-----+------------+------------+--------+------+-----+-----+
|      |     |            |            |        |      |     |     |
+------+-----+------------+------------+--------+------+-----+-----+
| Sn-  | 234 | 0.45       | 602 (114)  | 146 (  | 1.06 | 2.2 | \-- |
| 40Pb |     | (0.14)     |            | 43)    |      |     |     |
+------+-----+------------+------------+--------+------+-----+-----+
| Sn-  | 265 | 0.37       | 523 (115)  | 191    | 1.38 | 2.5 | 2.6 |
| 50Pb |     | (0.09)     |            | (119)  |      |     |     |
+------+-----+------------+------------+--------+------+-----+-----+
| Sn-  | 285 | 0.55       | 623 ( 68)  | 100 (  | 0.72 | 1.7 | 1.9 |
| 60Pb |     | (0.09)     |            | 17)    |      |     |     |
+------+-----+------------+------------+--------+------+-----+-----+

M.E. Warwick, "The Wetting and Mechanical Properties of Lead-Free
Capillary Plumbing Solders," ATB Metallurgie XXV, No. 1, 43-50 (1985)

**[Table 2.2.19.]{.underline} Lead-Free Solder Alloys: Solidus and
Liquidus Temperatures, Coefficient of Thermal Expansion, Surface
Tension, and Electrical Resistivity**

+------------+----+---+--------+-----+--------+-----------+---------+
| ##         | ** | * | *      | **S |        | **Interm  | **Elect |
| ###  Alloy | T~ | * | *CTE** | urf |        | etallic** | rical** |
|            | so | T |        | ace |        |           |         |
|            | l~ | ~ | **(20  | Ten |        | *         | *       |
|            | \* | l | ºC)**  | sio |        | *Phases** | *Resist |
|            | ** | i |        | n** |        |           | ivity** |
|            |    | q | **(x   |     |        |           |         |
|            | ** | ~ | 10^+5^ | **  |        |           | **(μ    |
|            | (º | * | /ºC)** | (at |        |           | Ω-cm)** |
|            | C) | * |        | T~  |        |           |         |
|            | ** |   |        | liq |        |           |         |
|            |    | * |        | ~ + |        |           |         |
|            |    | * |        | 50  |        |           |         |
|            |    | ( |        | ºC  |        |           |         |
|            |    | º |        | )** |        |           |         |
|            |    | C |        |     |        |           |         |
|            |    | ) |        | **  |        |           |         |
|            |    | * |        | (mN |        |           |         |
|            |    | * |        | /mm |        |           |         |
|            |    |   |        | )** |        |           |         |
+------------+----+---+--------+-----+--------+-----------+---------+
|            |    |   |        | *   | **Nitr |           |         |
|            |    |   |        | *Ai | ogen** |           |         |
|            |    |   |        | r** |        |           |         |
+------------+----+---+--------+-----+--------+-----------+---------+
| #          | 2  |   | 2.6    |     |        |           | 11.5    |
|  Sn (pure) | 32 |   |        |     |        |           |         |
+------------+----+---+--------+-----+--------+-----------+---------+
| Sn-37Pb    | 1  |   | 2.5    | 417 | 464    |           | 14.5    |
|            | 83 |   |        |     |        |           |         |
+------------+----+---+--------+-----+--------+-----------+---------+
|            |    |   |        |     |        |           |         |
+------------+----+---+--------+-----+--------+-----------+---------+
| Sn-3.5Ag   | 2  |   |        | 431 | 493    | Ag~3~Sn   | 10 --   |
|            | 21 |   |        |     |        |           | 15      |
+------------+----+---+--------+-----+--------+-----------+---------+
| Sn         | 2  | 2 |        |     |        | Ag~3~Sn,  | 10 --   |
| -4Cu-0.5Ag | 16 | 2 |        |     |        | C         | 15      |
|            |    | 2 |        |     |        | u~6~Sn~5~ |         |
+------------+----+---+--------+-----+--------+-----------+---------+
| Sn-0.7Cu   | 2  |   |        | 491 | 461    | C         | 10 --   |
|            | 27 |   |        |     |        | u~6~Sn~5~ | 15      |
+------------+----+---+--------+-----+--------+-----------+---------+
|            |    |   |        |     |        |           |         |
+------------+----+---+--------+-----+--------+-----------+---------+
| Sn-58Bi    | 1  |   | 1.5    | 319 | 349    |           | 30 --   |
|            | 38 |   |        |     |        |           | 35      |
+------------+----+---+--------+-----+--------+-----------+---------+
| Sn-52In    | 1  |   | 2.0    |     |        |           | 10 --   |
| ^§^        | 20 |   |        |     |        |           | 15      |
+------------+----+---+--------+-----+--------+-----------+---------+
| Sn-9Zn     | 1  |   |        | 518 | 487    |           | 10 --   |
|            | 99 |   |        |     |        |           | 15      |
+------------+----+---+--------+-----+--------+-----------+---------+

\*Where no liquidus temperature is given, the alloy is eutectic and has
a single, definite fusion temperature. (For pure tin the melting point
is given.)

^§^ (Eutectic: Sn-50.9In)

Judith Glazer, "Microstructure and Mechanical Properties of Pb‑free
Solder Alloys for Low-Cost Electronic Assembly: A Review," *J.
Electronic Materials* 23(8), 693 (1994)

### [Table 2.2.20.]{.underline} Fluid Properties of Some Molten Lead-Free Solders

+------------------+------------------+---------+---------+---------+
| #  Solder        | **Liquidus**     | **Co    | **We    | **      |
|                  |                  | ntact** | tting** | Surface |
| **Alloy**        | **temperature**  |         |         | te      |
|                  |                  | **      | *       | nsion** |
|                  |                  | angle** | *rate** |         |
+------------------+------------------+---------+---------+---------+
|                  | **(ºC)**         | **      | **(     | **(     |
|                  |                  | (deg)** | dyne/** | dyne/** |
|                  |                  |         |         |         |
|                  |                  |         | *       | **cm)** |
|                  |                  |         | *sec)** |         |
+------------------+------------------+---------+---------+---------+
| ######## Sn-58Bi | 138              | 43      | 350     | 300     |
+------------------+------------------+---------+---------+---------+
|                  |                  |         |         |         |
+------------------+------------------+---------+---------+---------+
| Sn-2.8Ag-20In    | 114 (low-temp.   | 44      | 650     | 390     |
|                  | peak);           |         |         |         |
|                  |                  |         |         |         |
|                  | 178 (primary     |         |         |         |
|                  | peak)            |         |         |         |
+------------------+------------------+---------+---------+---------+
| Sn-3.5Ag-4.8Bi   | 212              | 31      | 2420    | 420     |
+------------------+------------------+---------+---------+---------+
| Sn-2             | 217              | 44      | 4280    | 510     |
| .5Ag-0.8Cu-0.5Sb |                  |         |         |         |
+------------------+------------------+---------+---------+---------+
|                  |                  |         |         |         |
+------------------+------------------+---------+---------+---------+
| Sn-37Pb          | 183              | 17      | 2030    | 380     |
|                  |                  |         |         |         |
| (eutectic)       |                  |         |         |         |
+------------------+------------------+---------+---------+---------+

I. Artaki, D.W. Finley, A.M. Jackson, U. Ray and P.T. Vianco, "Wave
Soldering with Pb-Free Solders," *Proc. Surface Mount International*
(San Jose, CA, August 27-31, 1995), p. 495.

[Table 2.2.21.]{.underline} Densities and Costs of Popular Solder Metals
and Alloys -- A

+--------------+--------+------------+---------+---------+------------+
| ###  Meta    | #      |            | ###     | #  P    |            |
| l {#metal-5} | Price  |            | Density | rice pe |            |
|              | per kg |            |         | r cm^3^ |            |
|              |        |            | **(g/c  |         |            |
|              | **     |            | m^3^)** | *       |            |
|              | (2^nd^ |            |         | *(2^nd^ |            |
|              | Q.     |            |         | Q.      |            |
|              | 1      |            |         | 1999)** |            |
|              | 999)** |            |         |         |            |
+--------------+--------+------------+---------+---------+------------+
|              | **     | **No       |         | *       | **No       |
|              | (\$)** | rmalized** |         | *(\$)** | rmalized** |
|              |        |            |         |         |            |
|              |        | **(Pb =    |         |         | **(Pb =    |
|              |        | 1)**       |         |         | 1)**       |
+--------------+--------+------------+---------+---------+------------+
| Pb           | 0.55   | 1.00       | 11.36   | 0.00625 | 1.00       |
+--------------+--------+------------+---------+---------+------------+
| Sb           | 2.00\* | 2.5\*      | 6.684   | 0.0134  | 2.14       |
+--------------+--------+------------+---------+---------+------------+
| Cu           | 1.50   | 2.73       | 8.92    | 0.0134  | 2.14       |
+--------------+--------+------------+---------+---------+------------+
| Bi           | 6.60\* | 8.25\*     | 9.8     | 0.0647  | 10.35      |
+--------------+--------+------------+---------+---------+------------+
| Sn           | 5.70   | 10.36      | 7.31    | 0.0416  | 6.57       |
+--------------+--------+------------+---------+---------+------------+
| ### Ag       | 170\.  | 309.1      | 10.5    | 1.78    | 285\.      |
+--------------+--------+------------+---------+---------+------------+
| In           | 24     | 303.1\*    | 7.3     | 1.77    | 283\.      |
|              | 2.50\* |            |         |         |            |
+--------------+--------+------------+---------+---------+------------+
|              |        |            |         |         |            |
+--------------+--------+------------+---------+---------+------------+
| Sn-37Pb      | 3.80   | 6.91       | 8.4     | 0.0319  | 5.10       |
+--------------+--------+------------+---------+---------+------------+
| Sn-Pb        | 90.00  | 163.6      | 8.4     | 0.756   | 121\.      |
|              |        |            |         |         |            |
| (solder      |        |            |         |         |            |
| paste)       |        |            |         |         |            |
+--------------+--------+------------+---------+---------+------------+
| Sn-0.7Cu     | 5.66   | 10.29      | 7.30    | 0.0413  | 6.61       |
+--------------+--------+------------+---------+---------+------------+
| Sn-4Ag-0.5Cu | 12.25  | 22.27      | 7.39    | 0.0905  | 14.5       |
+--------------+--------+------------+---------+---------+------------+

Adapted from Alan Rae and Ronald C. Lasky, "Economics and Implications
of Moving to Lead-Free Assembly," Proc. NEPCON WEST 2000 (February 27 --
March 2, 2000), Anaheim, CA

\*(1992 prices; Pb: \$0.80/kg) Paul T. Vianco, "General Soldering," ASM
Handbook, Vol. 6, Welding, Brazing, and Soldering (ASM International,
9639 Kinsman Road, Materials Park, Ohio 44073 USA, 1993)

[Table 2.2.22.]{.underline} Densities and Costs of Popular Solder Metals
and Alloys -- B

+---------------+---------+-----+-----+----+----+----+----+--------+
| Element       |         | C   |     | D  |    | Co |    | C      |
|               |         | ost |     | en |    | st |    | omment |
|               |         | /(u |     | si |    | /( |    |        |
|               |         | nit |     | ty |    | un |    |        |
|               |         | ma  |     |    |    | it |    |        |
|               |         | ss) |     | (  |    |    |    |        |
|               |         | \   |     | 25 |    | v  |    |        |
|               |         | [2/ |     | º  |    | ol |    |        |
|               |         | 3/9 |     | C) |    | um |    |        |
|               |         | 9\] |     |    |    | e) |    |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
|               |         | \$  | \$  | lb | g  | \$ | \$ | Availa |
|               |         | /lb | /kg | /i | /c | /i | /c | bility |
|               |         |     |     | n^ | m^ | n^ | m^ |        |
|               |         |     |     | 3^ | 3^ | 3^ | 3^ |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
| Lead          |         | 0   | 0   | 0. | 1  | 0. | 0  |        |
|               |         | .45 | .99 | 41 | 1. | 18 | .0 |        |
|               |         |     |     |    | 35 |    | 11 |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
| Zinc          |         | 0   | 1   | 0  | 7. | 0. | 0  |        |
|               |         | .50 | .10 | .2 | 14 | 13 | .0 |        |
|               |         |     |     | 58 |    |    | 08 |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
| Copper        |         | 0   | 1   | 0  | 8. | 0. | 0  |        |
|               |         | .65 | .43 | .3 | 97 | 21 | .0 |        |
|               |         |     |     | 24 |    |    | 13 |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
| Antimony      |         | 0   | 1   | 0  | 6. | 0. | 0  |        |
|               |         | .80 | .76 | .2 | 61 | 19 | .0 |        |
|               |         |     |     | 39 |    |    | 12 |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
| Bismuth       |         | 3   | 7   | 0  | 9. | 1. | 0  | l      |
|               |         | .40 | .48 | .3 | 80 | 20 | .0 | imited |
|               |         |     |     | 54 |    |    | 73 |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
| Tin           |         | 3   | 7   | 0  | 7. | 0. | 0  |        |
|               |         | .50 | .70 | .2 | 31 | 92 | .0 |        |
|               |         |     |     | 64 |    |    | 56 |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
| Silver        |         | 84  | 185 | 0  | 1  | 3  | 1  | l      |
|               |         | .20 | .24 | .3 | 0. | 1. | .9 | imited |
|               |         |     |     | 79 | 50 | 91 | 47 |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
| Indium        |         | 125 | 275 | 0  | 7. | 3  | 2  | scarce |
|               |         | .00 | .00 | .2 | 31 | 3. | .0 |        |
|               |         |     |     | 64 |    | 00 | 14 |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
| Alloy         | Melt.   |     |     |    |    |    |    | Pa     |
|               | Range   |     |     |    |    |    |    | tented |
|               |         |     |     |    |    |    |    |        |
|               | (ºC)    |     |     |    |    |    |    |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
| Sn-37Pb       | 183     | 2   | 5   | 0  | 8. | 0. | 0  |        |
|               |         | .37 | .21 | .3 | 80 | 75 | .0 |        |
|               |         |     |     | 18 |    |    | 46 |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
|               |         |     |     |    |    |    |    |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
| Sn-3.5Ag      | 221     | 6   | 13  | 0  | 7. | 2. | 0  |        |
|               |         | .32 | .90 | .2 | 42 | 33 | .1 |        |
|               |         |     |     | 68 |    |    | 42 |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
| Sn-0.7Cu      | 227     | 3   | 7   | 0  | 7. | 0. | 0  |        |
|               |         | .48 | .66 | .2 | 31 | 92 | .0 |        |
|               |         |     |     | 64 |    |    | 56 |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
| Sn-58Bi       | 139     | 3   | 7   | 0  | 8. | 1. | 0  |        |
|               |         | .44 | .57 | .3 | 75 | 09 | .0 |        |
|               |         |     |     | 16 |    |    | 67 |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
| Sn-5Sb        | 232-240 | 3   | 7   | 0  | 7. | 0. | 0  |        |
|               |         | .37 | .41 | .2 | 28 | 88 | .0 |        |
|               |         |     |     | 63 |    |    | 54 |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
| Sn-9Zn        | 199     | 3   | 7   | 0  | 7. | 0. | 0  |        |
|               |         | .23 | .11 | .2 | 28 | 85 | .0 |        |
|               |         |     |     | 63 |    |    | 52 |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
|               |         |     |     |    |    |    |    |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
| Sn-4Ag-0.5Cu  | 217-218 | 6   | 14  | 0  | 7. | 1. | 0  |        |
|               |         | .55 | .41 | .2 | 44 | 76 | .1 |        |
|               |         |     |     | 69 |    |    | 07 |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
| S             | 208-215 | 6   | 13  | 0  | 7. | 1. | 0  | Y      |
| n-3.4Ag-4.8Bi |         | .24 | .73 | .2 | 53 | 70 | .1 |        |
|               |         |     |     | 72 |    |    | 04 |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
| Sn-3.5Ag-3Bi  | 216-220 | 5   | 13  | 0  | 7. | 1. | 0  |        |
|               |         | .92 | .02 | .2 | 44 | 59 | .0 |        |
|               |         |     |     | 69 |    |    | 97 |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
| Sn-2.8Ag-20In | 179-189 | 30  | 66  | 0  | 7. | 8. | 0  | Y      |
|               |         | .06 | .13 | .2 | 39 | 02 | .4 |        |
|               |         |     |     | 67 |    |    | 89 |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
| S             | 218     | 8   | 17  | 0  | 7. | 2. | 0  |        |
| n-3.5Ag-1.5In |         | .15 | .93 | .2 | 42 | 18 | .1 |        |
|               |         |     |     | 68 |    |    | 33 |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
|               |         |     |     |    |    |    |    |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
| Sn-2A         | 186-212 | 5   | 11  | 0  | 7. | 1. | 0  |        |
| g-0.5Cu-7.5Bi |         | .09 | .20 | .2 | 56 | 39 | .0 |        |
|               |         |     |     | 73 |    |    | 85 |        |
+---------------+---------+-----+-----+----+----+----+----+--------+
| Sn-2.5A       | 213-219 | 5   | 12  | 0  | 7. | 1. | 0  | Y      |
| g-0.8Cu-0.5Sb |         | .48 | .06 | .2 | 39 | 46 | .0 | (Ca    |
|               |         |     |     | 67 |    |    | 89 | stin™) |
+---------------+---------+-----+-----+----+----+----+----+--------+

Authors not listed; "Lead-Free Alloy Trends for the Assembly of Mixed
Technology PWBs", Proc. NEPCON-West 2000 (Feb. 27-Mar. 2) Anaheim, CA

[Table 2.2.23.]{.underline} Cost of Lead-Free Solder Alloys Relative to
That of Sn-37Pb Eutectic

+---------------------------------------+-------------+---------------+
| #####  Alloy                          | # Re        |               |
|                                       | lative Cost |               |
+---------------------------------------+-------------+---------------+
|                                       | **Bar**     | **Paste**     |
+---------------------------------------+-------------+---------------+
| Sn-37Pb                               | 1.000       | 1.000         |
+---------------------------------------+-------------+---------------+
|                                       |             |               |
+---------------------------------------+-------------+---------------+
| Sn-3.5Ag                              | 2.29        | 1.07          |
+---------------------------------------+-------------+---------------+
|                                       |             |               |
+---------------------------------------+-------------+---------------+
| Sn-3Ag-2Bi                            | 2.17        | 1.06          |
+---------------------------------------+-------------+---------------+
| Sn-3.4Ag-4.8Bi                        | 2.26        | 1.06          |
+---------------------------------------+-------------+---------------+
|                                       |             |               |
+---------------------------------------+-------------+---------------+
| Sn-3.2Ag-0.7Cu                        | 2.21        | 1.06          |
+---------------------------------------+-------------+---------------+
| Sn-3.5Ag-1.3Cu                        | 2.28        | 1.06          |
+---------------------------------------+-------------+---------------+
| Sn-4.7Ag-1.7Cu                        | 2.56        | 1.08          |
+---------------------------------------+-------------+---------------+
| Sn-2.6Ag-0.8Cu-0.5Sb                  | 2.06        | 1.05          |
+---------------------------------------+-------------+---------------+
| Sn-3.5Ag-0.5Cu-1Zn                    | 2.27        | 1.06          |
+---------------------------------------+-------------+---------------+
| Costs of pure metals (relative to     |             |               |
| Pb=1):                                |             |               |
|                                       |             |               |
| Zn: 1.7; Cu: 3.0; Sb: 3.9; Bi: 8.6;   |             |               |
| Sn: 11; Ag: 260; Au: 15000            |             |               |
+---------------------------------------+-------------+---------------+

Ning-Cheng Lee, "Lead-Free Soldering of Chip-Scale Packages," *Chip
Scale Review*, p. 42 (March/April 2000)

# A. Solder Alloy for Plated Through Holes

A series of investigations to reduce the solidus temperature and
strength of lead-free solders (by adding indium, which is very ductile)
was carried out by NCMS. Beginning with three alloys: (1) Sn-3.5Ag
(T~melt~=221 ºC), (2) Sn-3Ag-2Bi (T~onset~ = 216 ºC), and (3)
Sn-3.33Ag-4.83Bi (T~onset~ = 212 ºC). A solder alloy with composition
Sn-3.5Ag-5.0In, with addition of either 1 % or 2 % (by mass) Cu was
found to reduce the alloy\'s melting temperature by 5 ºC and also
desirably decreased the alloy\'s strength, reducing the probability of
its cracking due to buildup of residual stress during thermal cycling
(cooling after a soldering operation).

**Source:** Technical Reports for the Lead Free Solder Project:
Properties Reports: \"Solder Alloy Development for Plated Through-Hole
Applications: DSC Analyses and Ring-in-Plug Mechanical Tests;\" Lead
Free Solder Project CD-ROM, National Center for Manufacturing Sciences
(NCMS), 1998

**3. Candidate Alloys for Replacing Lead-Alloy Solders**

### [Table 3.1.]{.underline} Criteria for Down-Selection of Lead-Free Alloys

+------------+--------------------------------------------+------------+
| **         | **Definition**                             | **Minimum  |
| Property** |                                            | Acceptance |
|            |                                            | Level**    |
+------------+--------------------------------------------+------------+
| Liquidus   | Temperature at which solder alloy is       |            |
| t          | completely molten                          |            |
| emperature |                                            |            |
+------------+--------------------------------------------+------------+
| Pasty      | Range of temperature between solidus and   | \< 30 (ºC) |
| Range      | liquidus, where alloy is part solid and    |            |
|            | part liquid.                               |            |
+------------+--------------------------------------------+------------+
| W          | Assessed by force required to wet a copper | Fmax \>    |
| ettability | wire with molten solder. A large force     |            |
|            | indicates good wetting, as does short      | 300 N      |
|            | duration t0 at zero wetting force and time |            |
|            | t2/3 to reach two thirds of maximum        | t~0~ \<    |
|            | wetting force.                             | 0.6 s      |
|            |                                            |            |
|            |                                            | t2/3 \< 1  |
|            |                                            | s          |
+------------+--------------------------------------------+------------+
| Area of    | Measures coverage of copper test piece by  | \> 85 %    |
| Coverage   | solder                                     |            |
+------------+--------------------------------------------+------------+
| Drossing   | Measured by amount of oxide formed in air  | Q          |
|            | on surface of molten solder after a fix    | ualitative |
|            | duration at soldering temperature          |            |
+------------+--------------------------------------------+------------+
| TMF        | Lifetime at a given failure rate compared  | \> 75 %    |
|            | to that of (eutectic) Sn/37Pb, for a       |            |
|            | specific configuration of board and solder |            |
|            | joint                                      |            |
+------------+--------------------------------------------+------------+
| Thermal    | Difference in coefficients of thermal      | \< 29      |
| Mismatch   | expansion that causes unacceptable thermal | ppm/ºC     |
|            | stress                                     |            |
+------------+--------------------------------------------+------------+
| Creep      | Stress load to failure at room             | \> 500 psi |
|            | temperature, in 10,000 minutes (\~167      |            |
|            | hours)                                     |            |
+------------+--------------------------------------------+------------+
| Yield      |                                            | \>2000 psi |
| Strength   |                                            |            |
+------------+--------------------------------------------+------------+
| Elongation | Relative elongation of material under      | \> 10 %    |
|            | uniaxial tension at room temperature       |            |
+------------+--------------------------------------------+------------+

**Source:** Technical Reports for the Lead Free Solder Project:
Properties Reports: \"Down Selection;\" on Lead Free Solder Project
CD-ROM, National Center for Manufacturing Sciences (NCMS), 1998

**[Table 3.2.]{.underline} Chemical compositions of 79 lead-free solder
alloys down-selected for preliminary testing by the National Center for
Manufacturing Sciences (NCMS).** The seven lead-free alloys in bold type
are those down-selected for extensive testing and measurement from the
initial pool of 79. Selection process is detailed in Technical Reports
for the Lead Free Solder Project: Properties Reports: \"Down
Selection,\" on Lead Free Solder Project CD-ROM, National Center for
Manufacturing Sciences (1998).

+-----+----------------+---+----+----------------+---+----+---------------+
| **  | **Chemical**   |   | *  | **Chemical**   |   | *  | **Chemical**  |
| NCM |                |   | *A |                |   | *A |               |
| S** | *              |   | ll | *              |   | ll | **            |
|     | *Composition** |   | oy | *Composition** |   | oy | Composition** |
| **A |                |   | ** |                |   | ** |               |
| llo | **(% by        |   |    | **(% by        |   |    | **(% by       |
| y** | mass)**        |   | ** | mass)**        |   | ** | mass)**       |
|     |                |   | Co |                |   | Co |               |
| **  |                |   | de |                |   | de |               |
| Cod |                |   | ** |                |   | ** |               |
| e** |                |   |    |                |   |    |               |
+-----+----------------+---+----+----------------+---+----+---------------+
| A   | Sn-37Pb        |   | D8 | S              |   | F5 | Sn-20In-2.8Zn |
| 1\* |                |   |    | n-3Ag-55Bi-2Sb |   |    |               |
+-----+----------------+---+----+----------------+---+----+---------------+
| A2  | Sn-2Ag-36Pb    |   | D9 | Sn-3A          |   | F6 | Sn-5Bi-7Zn    |
|     |                |   |    | g-54Bi-2In-2Sb |   |    |               |
+-----+----------------+---+----+----------------+---+----+---------------+
| A3  | Sn-97Pb        |   | D  | Sn-3A          |   | F7 | Sn-31.5Bi-3Zn |
|     |                |   | 10 | g-54Bi-2Cu-2Sb |   |    |               |
+-----+----------------+---+----+----------------+---+----+---------------+
| A   | Sn-3.5Ag       |   |    |                |   | F8 | S             |
| 4\* |                |   |    |                |   |    | n-3.5Ag-1.5In |
+-----+----------------+---+----+----------------+---+----+---------------+
| A5  | Sn-5Sb         |   | E1 | Sn-3Ag-2Sb     |   | F9 | Sn-2A         |
|     |                |   |    |                |   |    | g-7.5Bi-0.5Cu |
+-----+----------------+---+----+----------------+---+----+---------------+
| A   | Sn-58Bi        |   | E2 | Sn-3Ag-2Cu-2Sb |   | F  | Sn-0.         |
| 6\* |                |   |    |                |   | 10 | 2Ag-2Cu-0.8Sb |
+-----+----------------+---+----+----------------+---+----+---------------+
| A7  | Sn-3           |   | E3 | Sn-3Ag-2Bi-2Sb |   |    |               |
|     | .5Ag-0.5Sb-1Cd |   |    |                |   |    |               |
+-----+----------------+---+----+----------------+---+----+---------------+
| A8  | Sn-75Pb        |   | E4 | Sn-3Ag-2Bi     |   | F  | Sn            |
|     |                |   |    |                |   | 11 | -2.5Ag-19.5Bi |
+-----+----------------+---+----+----------------+---+----+---------------+
|     |                |   | E5 | Sn-2.5Ag-2Bi   |   | F  | Sn-3Ag-41Bi   |
|     |                |   |    |                |   | 12 |               |
+-----+----------------+---+----+----------------+---+----+---------------+
| B1  | Sn-50Bi        |   | E6 | Sn             |   | F  | Sn-55Bi-2Cu   |
|     |                |   |    | -2Bi-1.5Cu-3Sb |   | 13 |               |
+-----+----------------+---+----+----------------+---+----+---------------+
| B2  | Sn-52Bi        |   | E7 | Sn-2Bi-8In     |   | F  | Sn-48Bi-2Cu   |
|     |                |   |    |                |   | 14 |               |
+-----+----------------+---+----+----------------+---+----+---------------+
| B3  | Sn-55Bi-3Cu    |   | E8 | Sn-10Bi-10In   |   | F  | Sn-57Bi       |
|     |                |   |    |                |   | 15 |               |
+-----+----------------+---+----+----------------+---+----+---------------+
| B4  | Sn-48Bi-4Cu    |   | E9 | Sn-10Bi-20In   |   | F  | Sn-56.        |
|     |                |   |    |                |   | 16 | 7Bi-0.3Cu-1In |
+-----+----------------+---+----+----------------+---+----+---------------+
| B5  | S              |   | E  | Sn-9Zn         |   | F  | S             |
|     | n-2Ag-46Bi-4Cu |   | 10 |                |   | 17 | n-3.4Ag-4.8Bi |
+-----+----------------+---+----+----------------+---+----+---------------+
| B6  | Sn-56Bi-2In    |   |    |                |   | F  | Sn-3Ag-15In   |
|     |                |   |    |                |   | 18 |               |
+-----+----------------+---+----+----------------+---+----+---------------+
|     |                |   | E  | Sn-5Ag-8.6In   |   | F  | Sn            |
|     |                |   | N1 |                |   | 19 | -3Ag-5Bi-10In |
+-----+----------------+---+----+----------------+---+----+---------------+
| C1  | Sn-            |   | E  | S              |   | F  | Sn-5Bi-10In   |
|     | 2Ag-1.5Sb-29Pb |   | N2 | n-5.6Ag-14.4In |   | 20 |               |
+-----+----------------+---+----+----------------+---+----+---------------+
| C2  | Sn-3Ag-4Cu     |   | E  | Sn-6.8Ag-20In  |   |    |               |
|     |                |   | N3 |                |   |    |               |
+-----+----------------+---+----+----------------+---+----+---------------+
| C3  | Sn-2           |   | E  | Sn-3.1Ag-6.1Bi |   | F  | Sn-2.8Ag-20In |
|     | .5Ag-2Bi-1.5Sb |   | N4 |                |   | 21 |               |
+-----+----------------+---+----+----------------+---+----+---------------+
| C4  | Sn-3Ag         |   | E  | Sn-3.5Ag-10Bi  |   | F  | Sn-0.         |
|     | -1Bi-1Cu-1.5Sb |   | N5 |                |   | 22 | 1Ag-1Bi-3.9Sb |
+-----+----------------+---+----+----------------+---+----+---------------+
| C5  | Sn-2           |   | E  | Sn-3.3Ag-15Bi  |   | F  | Sn-0.         |
|     | Ag-9.8Bi-9.8In |   | N6 |                |   | 23 | 5Ag-1.5Bi-3Sb |
+-----+----------------+---+----+----------------+---+----+---------------+
|     |                |   | E  | Sn-6.8Ag-30Bi  |   | F  | Sn-55Bi-2Zn   |
|     |                |   | N7 |                |   | 24 |               |
+-----+----------------+---+----+----------------+---+----+---------------+
| D1  | Sn-45Bi        |   | E  | Sn-3.3A        |   | F  | Sn-0.5Ag-56Bi |
|     |                |   | N8 | g-11.2Bi-5.5In |   | 25 |               |
+-----+----------------+---+----+----------------+---+----+---------------+
| D2  | Sn-57Bi-2In    |   | E  | Sn-2.5A        |   | F  | Sn-4.         |
|     |                |   | N9 | g-11.2Bi-5.5In |   | 26 | 5Ag-1.6Cu-5Sb |
+-----+----------------+---+----+----------------+---+----+---------------+
| D3  | Sn-2Ag-57Bi    |   |    |                |   | F  | Sn-3.         |
|     |                |   |    |                |   | 27 | 5Ag-0.5Cu-1Zn |
+-----+----------------+---+----+----------------+---+----+---------------+
| D4  | Sn-57Bi-2Sb    |   | F1 | Sn-2           |   | F  | Sn-3Ag        |
|     |                |   |    | Ag-7.5Bi-0.5Cu |   | 28 | -10.9In-0.4Sb |
+-----+----------------+---+----+----------------+---+----+---------------+
| D5  | Sn-57Bi-1Sb    |   | F2 | Sn-2.6         |   | F  | S             |
|     |                |   | ^\ | Ag-0.8Cu-0.5Sb |   | 29 | n-4.7Ag-1.7Cu |
|     |                |   | #^ |                |   |    |               |
+-----+----------------+---+----+----------------+---+----+---------------+
| D6  | Sn-            |   | F3 | Sn-0.5Ag-4Cu   |   | F  | S             |
|     | 2Ag-56Bi-1.5Sb |   |    |                |   | 30 | n-3.2Ag-0.7Cu |
+-----+----------------+---+----+----------------+---+----+---------------+
| D7  | Sn-3A          |   | F4 | Sn-8.8In-7.6Zn |   | F  | S             |
|     | g-55.5Bi-1.5Sb |   |    |                |   | 31 | n-3.5Ag-1.3Cu |
+-----+----------------+---+----+----------------+---+----+---------------+

\*Eutectic composition

^\#^Composition F2 is a proprietary composition, Castin®

**4. Miscellaneous**

A.  Major considerations for replacement of lead-free solders:

-   Melting (or solidus) temperature similar to that of Sn-37Pb solder

-   Other physical properties (such as ductility, tensile strength,
    thermal conductivity and expansion, electrical conductivity) as good
    as, or better than, those of Sn-37Pb solder

-   Narrow plastic range

-   Capability of being fabricated into contemporary physical forms of
    solder, such as wire, preforms, ribbon, spheres, powder, and paste

-   Adequate wetting properties and viscosity

-   Acceptably low dross formation when used in wave soldering

-   Compatibility with existing systems of liquid flux

-   For paste, adequate shelf life and performance

-   No toxicity problems

**[Table 4.1.]{.underline} Designation and Composition of Lead-Free
Solders.**

A.C. = \"Alloy Code\"; L = liquidus; S = solidus; P.R. = pasty range;
CTE = coefficient of thermal expansion. Blank cells indicate either zero
composition or no available data.

**\[Due to space limitations, source is documented at end of this series
of tables.\]**

<table>
<colgroup>
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 3%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 3%" />
<col style="width: 4%" />
<col style="width: 21%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 5%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
</colgroup>
<tbody>
<tr class="odd">
<td><strong>A. C.</strong></td>
<td colspan="8"><strong>Composition (% by Mass)</strong></td>
<td><strong>Comments</strong></td>
<td colspan="3"><p><strong>Melting</strong></p>
<p><strong>Temperature</strong></p>
<p><strong>(ºC)</strong></p></td>
<td colspan="2"><p><strong>Density</strong></p>
<p><strong>(g/cm<sup>3</sup>)</strong></p></td>
<td><p><strong>Spec-</strong></p>
<p><strong>ific</strong></p>
<p><strong>Heat</strong></p>
<p><strong>(J/g)</strong></p></td>
<td><p><strong>CTE</strong></p>
<p><strong>(µm</strong></p>
<p><strong>per</strong></p>
<p><strong>m.ºC)</strong></p></td>
</tr>
<tr class="even">
<td></td>
<td><strong>Sn</strong></td>
<td><strong>Ag</strong></td>
<td><strong>Bi</strong></td>
<td><strong>Cu</strong></td>
<td><strong>In</strong></td>
<td><strong>Sb</strong></td>
<td><strong>Zn</strong></td>
<td><strong>Pb</strong></td>
<td></td>
<td colspan="3"></td>
<td colspan="2"></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td><strong>L</strong></td>
<td><strong>S</strong></td>
<td><strong>P. R.</strong></td>
<td><strong>Meas.</strong></td>
<td><strong>Calc.</strong></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>A0</td>
<td>100</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>Reference: pure Sn</td>
<td></td>
<td></td>
<td></td>
<td>7.31</td>
<td>7.30</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>A1*</td>
<td>63</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>37</td>
<td><p>Baseline (eutectic) alloy,</p>
<p>properties used as</p>
<p>reference.</p></td>
<td>183</td>
<td>183</td>
<td>0</td>
<td>8.39</td>
<td>8.42</td>
<td>45.</td>
<td>18.74</td>
</tr>
<tr class="even">
<td>A2</td>
<td>62</td>
<td>2</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>36</td>
<td><p>Popular surface- mount</p>
<p>alloy</p></td>
<td>180</td>
<td>179</td>
<td>1</td>
<td>8.44</td>
<td>8.44</td>
<td>47.</td>
<td>25.70</td>
</tr>
<tr class="odd">
<td>A3</td>
<td>3</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>97</td>
<td><p>Low-usage, low-lead con-</p>
<p>tent, very-high-temp, C4</p>
<p>alloy used by IBM; very</p>
<p>good in thermal fatigue.</p></td>
<td>318</td>
<td>318</td>
<td>0</td>
<td>11.13</td>
<td>11.21</td>
<td>22.</td>
<td>29.72</td>
</tr>
<tr class="even">
<td>A4*</td>
<td>96.5</td>
<td>3.5</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td><p>Baseline (eutectic) alloy,</p>
<p>properties used as</p>
<p>reference.</p></td>
<td>221</td>
<td>221</td>
<td>0</td>
<td>7.37</td>
<td>7.38</td>
<td>64.</td>
<td>20.04</td>
</tr>
<tr class="odd">
<td>A5</td>
<td>95</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>5</td>
<td></td>
<td></td>
<td>Popular high-temp. alloy.</td>
<td>241</td>
<td>234</td>
<td>7</td>
<td>7.25</td>
<td>7.27</td>
<td>57.</td>
<td>20.09</td>
</tr>
<tr class="even">
<td>A6*</td>
<td>42</td>
<td></td>
<td>58</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td><p>Baseline (eutectic) alloy,</p>
<p>properties used as</p>
<p>reference.</p></td>
<td>138</td>
<td>138</td>
<td>0</td>
<td>8.57</td>
<td>8.57</td>
<td>46.</td>
<td>14.26</td>
</tr>
<tr class="odd">
<td>A7</td>
<td>95</td>
<td>3.5</td>
<td></td>
<td></td>
<td></td>
<td>0.5</td>
<td><p>Cd:</p>
<p>1.0</p></td>
<td></td>
<td><p>Alpha alloy #38, low</p>
<p>usage; contains cadmium.</p></td>
<td>223</td>
<td>221</td>
<td>2</td>
<td>7.39</td>
<td>7.39</td>
<td>64.</td>
<td>20.54</td>
</tr>
<tr class="even">
<td>A8</td>
<td>25</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>75</td>
<td></td>
<td>264</td>
<td>183</td>
<td>81</td>
<td>9.68</td>
<td>10.00</td>
<td>17.</td>
<td></td>
</tr>
</tbody>
</table>

<table>
<colgroup>
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 3%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 3%" />
<col style="width: 4%" />
<col style="width: 21%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 5%" />
<col style="width: 6%" />
<col style="width: 5%" />
<col style="width: 7%" />
<col style="width: 6%" />
</colgroup>
<tbody>
<tr class="odd">
<td colspan="17"><strong>Designation and Composition of Lead-Free
Solders (cont.)</strong></td>
</tr>
<tr class="even">
<td><strong>A. C.</strong></td>
<td colspan="8"><strong>Composition (% by Mass)</strong></td>
<td><strong>Comments</strong></td>
<td colspan="3"><p><strong>Melting</strong></p>
<p><strong>Temperature</strong></p>
<p><strong>(ºC)</strong></p></td>
<td colspan="2"><p><strong>Density</strong></p>
<p><strong>(g/cm<sup>3</sup>)</strong></p></td>
<td><p><strong>Spec-</strong></p>
<p><strong>ific</strong></p>
<p><strong>Heat</strong></p>
<p><strong>(J/g)</strong></p></td>
<td><p><strong>CTE</strong></p>
<p><strong>(µm</strong></p>
<p><strong>per</strong></p>
<p><strong>m.ºC)</strong></p></td>
</tr>
<tr class="odd">
<td></td>
<td><strong>Sn</strong></td>
<td><strong>Ag</strong></td>
<td><strong>Bi</strong></td>
<td><strong>Cu</strong></td>
<td><strong>In</strong></td>
<td><strong>Sb</strong></td>
<td><strong>Zn</strong></td>
<td><strong>Pb</strong></td>
<td></td>
<td colspan="3"></td>
<td colspan="2"></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td><strong>L</strong></td>
<td><strong>S</strong></td>
<td><strong>P. R.</strong></td>
<td><strong>Meas.</strong></td>
<td><strong>Calc.</strong></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>B1</td>
<td>50</td>
<td></td>
<td>50</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>Similar to B2, wider pasty range and lower elongation (21%)</td>
<td>152</td>
<td>138</td>
<td>14</td>
<td>8.37</td>
<td>8.37</td>
<td>43.</td>
<td></td>
</tr>
<tr class="even">
<td>B2</td>
<td>48</td>
<td></td>
<td>52</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>Compare solderability results with B1, choose one. High Bi
content</td>
<td>151</td>
<td>138</td>
<td>13</td>
<td>8.42</td>
<td>8.42</td>
<td>40.</td>
<td>12.13</td>
</tr>
<tr class="odd">
<td>B3</td>
<td>42</td>
<td></td>
<td>55</td>
<td>3</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>High Cu, wide pasty range, high liquidus, low elongation</td>
<td>&gt;400</td>
<td>-</td>
<td></td>
<td></td>
<td>8.55</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>B4</td>
<td>48</td>
<td></td>
<td>48</td>
<td>4</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>High Cu, wide pasty range, high liquidus, low elongation</td>
<td>&gt;400</td>
<td>-</td>
<td></td>
<td></td>
<td>8.39</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>B5</td>
<td>48</td>
<td>2</td>
<td>46</td>
<td>4</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>Poor ductility (2.7% elongation)</td>
<td>146</td>
<td>137</td>
<td>9</td>
<td>8.44</td>
<td>8.4</td>
<td>36.</td>
<td>14.38</td>
</tr>
<tr class="even">
<td>B6</td>
<td>42</td>
<td></td>
<td>56</td>
<td></td>
<td>2</td>
<td></td>
<td></td>
<td></td>
<td>Quenched alloy shows ternary melting (99°C solidus),116% total
elongation.</td>
<td>140</td>
<td>126</td>
<td>14</td>
<td>8.52</td>
<td>8.52</td>
<td>45.</td>
<td>16.01</td>
</tr>
</tbody>
</table>

<table>
<colgroup>
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 3%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 3%" />
<col style="width: 4%" />
<col style="width: 21%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 5%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
</colgroup>
<tbody>
<tr class="odd">
<td colspan="17"><strong>Designation and Composition of Lead-Free
Solders (cont.)</strong></td>
</tr>
<tr class="even">
<td><strong>A. C.</strong></td>
<td colspan="8"><strong>Composition (% by Mass)</strong></td>
<td><strong>Comments</strong></td>
<td colspan="3"><p><strong>Melting</strong></p>
<p><strong>Temperature</strong></p>
<p><strong>(ºC)</strong></p></td>
<td colspan="2"><p><strong>Density</strong></p>
<p><strong>(g/cm<sup>3</sup>)</strong></p></td>
<td><p><strong>Spec-</strong></p>
<p><strong>ific</strong></p>
<p><strong>Heat</strong></p>
<p><strong>(J/g)</strong></p></td>
<td><p><strong>CTE</strong></p>
<p><strong>(µm</strong></p>
<p><strong>per</strong></p>
<p><strong>m.ºC)</strong></p></td>
</tr>
<tr class="odd">
<td></td>
<td><strong>Sn</strong></td>
<td><strong>Ag</strong></td>
<td><strong>Bi</strong></td>
<td><strong>Cu</strong></td>
<td><strong>In</strong></td>
<td><strong>Sb</strong></td>
<td><strong>Zn</strong></td>
<td><strong>Pb</strong></td>
<td></td>
<td colspan="3"></td>
<td colspan="2"></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td><strong>L</strong></td>
<td><strong>S</strong></td>
<td><strong>P. R.</strong></td>
<td><strong>Meas.</strong></td>
<td><strong>Calc.</strong></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>C1</td>
<td>67.5</td>
<td>2</td>
<td></td>
<td></td>
<td></td>
<td>1.5</td>
<td></td>
<td>29</td>
<td>IBM patent alloy, low usage and lead content; not commercially
available.</td>
<td>198</td>
<td>183</td>
<td>15</td>
<td>8.1</td>
<td>8.19</td>
<td>52.</td>
<td>20.45</td>
</tr>
<tr class="even">
<td>C2</td>
<td>93.</td>
<td>3</td>
<td></td>
<td>4</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>95 ºC pasty range, liquidus &gt; 300 ºC.</td>
<td>221</td>
<td>221</td>
<td>0</td>
<td>7.42</td>
<td>7.42</td>
<td>61.</td>
<td>14.83</td>
</tr>
<tr class="odd">
<td>C3</td>
<td>94.</td>
<td>2.5</td>
<td>2</td>
<td></td>
<td></td>
<td>1.5</td>
<td></td>
<td></td>
<td>Similar to E3, same pasty range and YS but lower % elongation.</td>
<td>226</td>
<td>219</td>
<td>7</td>
<td>7.4</td>
<td>7.38</td>
<td>59.</td>
<td></td>
</tr>
<tr class="even">
<td>C4</td>
<td>93.5</td>
<td>3</td>
<td>1</td>
<td>1</td>
<td></td>
<td>1.5</td>
<td></td>
<td></td>
<td>A complex system, but meets acceptance criteria.</td>
<td>224</td>
<td>220</td>
<td>4</td>
<td>7.34</td>
<td>7.39</td>
<td>65.</td>
<td>19.9</td>
</tr>
<tr class="odd">
<td>C5</td>
<td>78.4</td>
<td>2</td>
<td>9.8</td>
<td></td>
<td>9.8</td>
<td></td>
<td></td>
<td></td>
<td><p>32 C pasty range, 7.1% total elongation, high indium</p>
<p>content ($12.8 / lb).</p></td>
<td>195</td>
<td>163</td>
<td>32</td>
<td>7.48</td>
<td>7.54</td>
<td>46.</td>
<td>11.86</td>
</tr>
</tbody>
</table>

<table>
<colgroup>
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 3%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 3%" />
<col style="width: 4%" />
<col style="width: 21%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 5%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
</colgroup>
<tbody>
<tr class="odd">
<td colspan="17"><strong>Designation and Composition of Lead-Free
Solders (cont.)</strong></td>
</tr>
<tr class="even">
<td><strong>A. C.</strong></td>
<td colspan="8"><strong>Composition (% by Mass)</strong></td>
<td><strong>Comments</strong></td>
<td colspan="3"><p><strong>Melting</strong></p>
<p><strong>Temperature</strong></p>
<p><strong>(ºC)</strong></p></td>
<td colspan="2"><p><strong>Density</strong></p>
<p><strong>(g/cm<sup>3</sup>)</strong></p></td>
<td><p><strong>Spec-</strong></p>
<p><strong>ific</strong></p>
<p><strong>Heat</strong></p>
<p><strong>(J/g)</strong></p></td>
<td><p><strong>CTE</strong></p>
<p><strong>(µm</strong></p>
<p><strong>per</strong></p>
<p><strong>m.ºC)</strong></p></td>
</tr>
<tr class="odd">
<td></td>
<td><strong>Sn</strong></td>
<td><strong>Ag</strong></td>
<td><strong>Bi</strong></td>
<td><strong>Cu</strong></td>
<td><strong>In</strong></td>
<td><strong>Sb</strong></td>
<td><strong>Zn</strong></td>
<td><strong>Pb</strong></td>
<td></td>
<td colspan="3"></td>
<td colspan="2"></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td><strong>L</strong></td>
<td><strong>S</strong></td>
<td><strong>P. R.</strong></td>
<td><strong>Meas.</strong></td>
<td><strong>Calc.</strong></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>D1</td>
<td>55.</td>
<td></td>
<td>45.</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>Similar to B1, 29 <strong>º</strong>C (26 <strong>º</strong>C) pasty
range, lower pasty range</td>
<td>164</td>
<td>138</td>
<td>26</td>
<td></td>
<td>8.25</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>D2</td>
<td>41.</td>
<td></td>
<td>57.</td>
<td></td>
<td>2.</td>
<td></td>
<td></td>
<td></td>
<td>Similar to B6, lower % elongation (71.8%)</td>
<td>140</td>
<td>127</td>
<td>13</td>
<td>8.55</td>
<td>8.54</td>
<td>44.</td>
<td>15.85</td>
</tr>
<tr class="odd">
<td>D3</td>
<td>41.</td>
<td>2.</td>
<td>57.</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>Meets acceptance criteria but questionable value over A6</td>
<td>147</td>
<td>140</td>
<td>7</td>
<td>8.61</td>
<td>8.60</td>
<td>44.</td>
<td>14.39</td>
</tr>
<tr class="even">
<td>D4</td>
<td>41.</td>
<td></td>
<td>57.</td>
<td></td>
<td></td>
<td>2.</td>
<td></td>
<td></td>
<td>Similar to D5, lower elongation, wider (sic) pasty range</td>
<td>150</td>
<td>141</td>
<td>9</td>
<td>8.53</td>
<td>8.52</td>
<td>45.</td>
<td>15.8</td>
</tr>
<tr class="odd">
<td>D5</td>
<td>42.</td>
<td></td>
<td>57.</td>
<td></td>
<td></td>
<td>1.</td>
<td></td>
<td></td>
<td>Meets acceptance criteria, high Bi</td>
<td>149</td>
<td>138</td>
<td>11</td>
<td></td>
<td>8.53</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>D6</td>
<td>40.5</td>
<td>2.</td>
<td>56.</td>
<td></td>
<td></td>
<td>1.5</td>
<td></td>
<td></td>
<td>Similar to D7, lower % elongation (26.8%)</td>
<td>145</td>
<td>137</td>
<td>8</td>
<td>8.59</td>
<td>8.56</td>
<td>44.</td>
<td>13.15</td>
</tr>
<tr class="odd">
<td>D7</td>
<td>40.</td>
<td>3.</td>
<td>55.5</td>
<td></td>
<td></td>
<td>1.5</td>
<td></td>
<td></td>
<td>Meets acceptance criteria but questionable value over D5</td>
<td>147</td>
<td>137</td>
<td>10</td>
<td></td>
<td>8.58</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>D8</td>
<td>40.</td>
<td>3.</td>
<td>55.</td>
<td></td>
<td></td>
<td>2.</td>
<td></td>
<td></td>
<td>Similar to D7, same % elongation, wider pasty range (12
<strong>º</strong>C)</td>
<td>150</td>
<td>138</td>
<td>12</td>
<td></td>
<td>8.56</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>D9</td>
<td>39.</td>
<td>3.</td>
<td>54.</td>
<td></td>
<td>2.</td>
<td>2.</td>
<td></td>
<td></td>
<td>99 <strong>º</strong>C solidus, wide pasty range (39
<strong>º</strong>C)</td>
<td>138</td>
<td>99</td>
<td>39</td>
<td>8.56</td>
<td>8.54</td>
<td>40.</td>
<td>15.25</td>
</tr>
<tr class="even">
<td>D10</td>
<td>39.</td>
<td>3.</td>
<td>54.</td>
<td></td>
<td></td>
<td>2.</td>
<td></td>
<td></td>
<td>3.7 % elongation</td>
<td>154</td>
<td>138</td>
<td>16</td>
<td>8.61</td>
<td>8.58</td>
<td>40.</td>
<td>15.24</td>
</tr>
</tbody>
</table>

<table>
<colgroup>
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 3%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 3%" />
<col style="width: 4%" />
<col style="width: 21%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 5%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
</colgroup>
<tbody>
<tr class="odd">
<td colspan="17"><strong>Designation and Composition of Lead-Free
Solders (cont.)</strong></td>
</tr>
<tr class="even">
<td><strong>A. C.</strong></td>
<td colspan="8"><strong>Composition (% by Mass)</strong></td>
<td><strong>Comments</strong></td>
<td colspan="3"><p><strong>Melting</strong></p>
<p><strong>Temperature</strong></p>
<p><strong>(ºC)</strong></p></td>
<td colspan="2"><p><strong>Density</strong></p>
<p><strong>(g/cm<sup>3</sup>)</strong></p></td>
<td><p><strong>Spec-</strong></p>
<p><strong>ific</strong></p>
<p><strong>Heat</strong></p>
<p><strong>(J/g)</strong></p></td>
<td><p><strong>CTE</strong></p>
<p><strong>(µm</strong></p>
<p><strong>per</strong></p>
<p><strong>m.ºC)</strong></p></td>
</tr>
<tr class="odd">
<td></td>
<td><strong>Sn</strong></td>
<td><strong>Ag</strong></td>
<td><strong>Bi</strong></td>
<td><strong>Cu</strong></td>
<td><strong>In</strong></td>
<td><strong>Sb</strong></td>
<td><strong>Zn</strong></td>
<td><strong>Pb</strong></td>
<td></td>
<td colspan="3"></td>
<td colspan="2"></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td><strong>L</strong></td>
<td><strong>S</strong></td>
<td><strong>P. R.</strong></td>
<td><strong>Meas.</strong></td>
<td><strong>Calc.</strong></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>E1</td>
<td>95</td>
<td>3</td>
<td></td>
<td></td>
<td></td>
<td>2</td>
<td></td>
<td></td>
<td>Meets acceptance criteria; other alloys more promising</td>
<td>228</td>
<td>225</td>
<td>3</td>
<td>7.35</td>
<td>7.35</td>
<td>62.</td>
<td>13.44</td>
</tr>
<tr class="even">
<td>E2</td>
<td>93</td>
<td>3</td>
<td></td>
<td>2</td>
<td></td>
<td>2</td>
<td></td>
<td></td>
<td>Meets acceptance criteria; other alloys more promising</td>
<td>224</td>
<td>221</td>
<td>3</td>
<td>7.36</td>
<td>7.38</td>
<td>62.</td>
<td>13.44</td>
</tr>
<tr class="odd">
<td>E3</td>
<td>93</td>
<td>3</td>
<td>2</td>
<td></td>
<td></td>
<td>2</td>
<td></td>
<td></td>
<td>Meets acceptance criteria; good yield strength and elongation</td>
<td>226</td>
<td>219</td>
<td>7</td>
<td>7.39</td>
<td>7.39</td>
<td>60.</td>
<td></td>
</tr>
<tr class="even">
<td>E4</td>
<td>95</td>
<td>3</td>
<td>2</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>Meets acceptance criteria; similar to F17, good candidate</td>
<td>220</td>
<td>216</td>
<td>4</td>
<td>7.39</td>
<td>7.41</td>
<td>59.</td>
<td>14.84</td>
</tr>
<tr class="odd">
<td>E5</td>
<td>95.5</td>
<td>2.5</td>
<td>2</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>Similar to E4; lower % elongation, wider pasty range</td>
<td>221</td>
<td>215</td>
<td>6</td>
<td></td>
<td>7.39</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>E6</td>
<td>93.5</td>
<td></td>
<td>2</td>
<td>1.5</td>
<td></td>
<td>3</td>
<td></td>
<td></td>
<td>Quaternary alloy; high Cu content</td>
<td>231</td>
<td>225</td>
<td>6</td>
<td>7.34</td>
<td>7.34</td>
<td>57.</td>
<td>16.81</td>
</tr>
<tr class="odd">
<td>E7</td>
<td>90</td>
<td></td>
<td>2</td>
<td></td>
<td>8</td>
<td></td>
<td></td>
<td></td>
<td>Meets acceptance criteria; high In content, lower elongation</td>
<td>215</td>
<td>206</td>
<td>9</td>
<td>7.33</td>
<td>7.34</td>
<td>49.</td>
<td>20.73</td>
</tr>
<tr class="even">
<td>E8</td>
<td>80</td>
<td></td>
<td>10</td>
<td></td>
<td>10</td>
<td></td>
<td></td>
<td></td>
<td>30-degree pasty range</td>
<td>200</td>
<td>170</td>
<td>30</td>
<td>7.47</td>
<td>7.49</td>
<td>38.</td>
<td>19.68</td>
</tr>
<tr class="odd">
<td>E9</td>
<td>70</td>
<td></td>
<td>10</td>
<td></td>
<td>20</td>
<td></td>
<td></td>
<td></td>
<td>Potentially expensive (high In content) and 3.6% elongation</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>7.49</td>
<td></td>
<td>15.69</td>
</tr>
<tr class="even">
<td>E10</td>
<td>91</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>9</td>
<td></td>
<td>High dross; low Fmax</td>
<td>198</td>
<td>198</td>
<td>0</td>
<td>7.26</td>
<td>7.29</td>
<td>69.</td>
<td>31.77</td>
</tr>
</tbody>
</table>

<table>
<colgroup>
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 3%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 3%" />
<col style="width: 4%" />
<col style="width: 21%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 5%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
</colgroup>
<tbody>
<tr class="odd">
<td colspan="17"><strong>Designation and Composition of Lead-Free
Solders (cont.)</strong></td>
</tr>
<tr class="even">
<td><strong>A. C.</strong></td>
<td colspan="8"><strong>Composition (% by Mass)</strong></td>
<td><strong>Comments</strong></td>
<td colspan="3"><p><strong>Melting</strong></p>
<p><strong>Temperature</strong></p>
<p><strong>(ºC)</strong></p></td>
<td colspan="2"><p><strong>Density</strong></p>
<p><strong>(g/cm<sup>3</sup>)</strong></p></td>
<td><p><strong>Spec-</strong></p>
<p><strong>ific</strong></p>
<p><strong>Heat</strong></p>
<p><strong>(J/g)</strong></p></td>
<td><p><strong>CTE</strong></p>
<p><strong>(µm</strong></p>
<p><strong>per</strong></p>
<p><strong>m.ºC)</strong></p></td>
</tr>
<tr class="odd">
<td></td>
<td><strong>Sn</strong></td>
<td><strong>Ag</strong></td>
<td><strong>Bi</strong></td>
<td><strong>Cu</strong></td>
<td><strong>In</strong></td>
<td><strong>Sb</strong></td>
<td><strong>Zn</strong></td>
<td><strong>Pb</strong></td>
<td></td>
<td colspan="3"></td>
<td colspan="2"></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td><strong>L</strong></td>
<td><strong>S</strong></td>
<td><strong>P. R.</strong></td>
<td><strong>Meas.</strong></td>
<td><strong>Calc.</strong></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>EN1</td>
<td>86.4</td>
<td>5</td>
<td></td>
<td>-</td>
<td>8.6</td>
<td>2</td>
<td></td>
<td></td>
<td>Meets acceptance criteria; midrange melting temperature</td>
<td>205</td>
<td>200</td>
<td>5</td>
<td>7.44</td>
<td>7.41</td>
<td>54.</td>
<td>.</td>
</tr>
<tr class="even">
<td>EN2</td>
<td>80</td>
<td>5.6</td>
<td></td>
<td></td>
<td>14.4</td>
<td></td>
<td></td>
<td></td>
<td>High liquidus, high In; similar to EN1 and F18</td>
<td>199</td>
<td>189</td>
<td>10</td>
<td>7.45</td>
<td>7.43</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>EN3</td>
<td>73.2</td>
<td>6.8</td>
<td></td>
<td></td>
<td>20</td>
<td></td>
<td></td>
<td></td>
<td>Low solidus, very wide pasty range</td>
<td>242</td>
<td>113</td>
<td>129</td>
<td>7.49</td>
<td>7.46</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>EN4</td>
<td>90.8</td>
<td>3.1</td>
<td>6.1</td>
<td></td>
<td>-</td>
<td>-</td>
<td></td>
<td></td>
<td>From quench, 78 degree pasty range, 137 ºC solidus</td>
<td>215</td>
<td>202</td>
<td>13</td>
<td>7.49</td>
<td>7.49</td>
<td>56.</td>
<td></td>
</tr>
<tr class="odd">
<td>EN5</td>
<td>86.5</td>
<td>3.5</td>
<td>10</td>
<td></td>
<td>-</td>
<td>-</td>
<td></td>
<td></td>
<td>Wide pasty range</td>
<td>208</td>
<td>137</td>
<td>71</td>
<td>7.6</td>
<td>7.57</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>EN6</td>
<td>81.7</td>
<td>3.3</td>
<td>15</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>Wide pasty range</td>
<td>200</td>
<td>137</td>
<td>63</td>
<td>7.7</td>
<td>7.67</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>EN7</td>
<td>63.2</td>
<td>6.8</td>
<td>30</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>Very wide pasty range</td>
<td>282</td>
<td>137</td>
<td>145</td>
<td>8.12</td>
<td>8.10</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>EN8</td>
<td>80</td>
<td>3.3</td>
<td>11.2</td>
<td></td>
<td>5.5</td>
<td></td>
<td></td>
<td></td>
<td>Wide pasty range</td>
<td>221</td>
<td>170</td>
<td>51</td>
<td>7.66</td>
<td>7.59</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>EN9</td>
<td>80.8</td>
<td>2.5</td>
<td>11.2</td>
<td></td>
<td>5.5</td>
<td></td>
<td></td>
<td></td>
<td>Wide pasty range</td>
<td>200</td>
<td>169</td>
<td>31</td>
<td>7.61</td>
<td>7.57</td>
<td>46.</td>
<td></td>
</tr>
</tbody>
</table>

<table>
<colgroup>
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 3%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 3%" />
<col style="width: 4%" />
<col style="width: 21%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 5%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
</colgroup>
<tbody>
<tr class="odd">
<td colspan="17"><strong>Designation and Composition of Lead-Free
Solders (cont.)</strong></td>
</tr>
<tr class="even">
<td><strong>A. C.</strong></td>
<td colspan="8"><strong>Composition (% by Mass)</strong></td>
<td><strong>Comments</strong></td>
<td colspan="3"><p><strong>Melting</strong></p>
<p><strong>Temperature</strong></p>
<p><strong>(ºC)</strong></p></td>
<td colspan="2"><p><strong>Density</strong></p>
<p><strong>(g/cm<sup>3</sup>)</strong></p></td>
<td><p><strong>Spec-</strong></p>
<p><strong>ific</strong></p>
<p><strong>Heat</strong></p>
<p><strong>(J/g)</strong></p></td>
<td><p><strong>CTE</strong></p>
<p><strong>(µm</strong></p>
<p><strong>per</strong></p>
<p><strong>m.ºC)</strong></p></td>
</tr>
<tr class="odd">
<td></td>
<td><strong>Sn</strong></td>
<td><strong>Ag</strong></td>
<td><strong>Bi</strong></td>
<td><strong>Cu</strong></td>
<td><strong>In</strong></td>
<td><strong>Sb</strong></td>
<td><strong>Zn</strong></td>
<td><strong>Pb</strong></td>
<td></td>
<td colspan="3"></td>
<td colspan="2"></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td><strong>L</strong></td>
<td><strong>S</strong></td>
<td><strong>P. R.</strong></td>
<td><strong>Meas.</strong></td>
<td><strong>Calc.</strong></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F1</td>
<td>90</td>
<td>2</td>
<td>7.5</td>
<td>0.5</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>ITRI alloy, meets acceptance criteria; lower elongation</td>
<td>213</td>
<td>193</td>
<td>20</td>
<td></td>
<td>7.50</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F2</td>
<td>96.1</td>
<td>2.6</td>
<td></td>
<td>0.8</td>
<td></td>
<td>0.5</td>
<td></td>
<td></td>
<td>AIM "Castin" alloy. Meets acceptance criteria, good results in mfg.
Trials</td>
<td>226</td>
<td>211</td>
<td>15</td>
<td></td>
<td>7.37</td>
<td></td>
<td>26.2</td>
</tr>
<tr class="odd">
<td>F3</td>
<td>95.5</td>
<td>0.5</td>
<td></td>
<td>4</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>Englehart alloy. Meets acceptance criteria; high liquidus</td>
<td>226</td>
<td>218</td>
<td>8</td>
<td></td>
<td>7.37</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F4</td>
<td>83.6</td>
<td></td>
<td></td>
<td></td>
<td>8.8</td>
<td>-</td>
<td>7.6</td>
<td></td>
<td>Midrange, Indium alloy. Low elongation. Zinc drossing</td>
<td>195</td>
<td>178</td>
<td>17</td>
<td></td>
<td>7.29</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F5</td>
<td>77.2</td>
<td></td>
<td></td>
<td></td>
<td>20</td>
<td></td>
<td>2.8</td>
<td></td>
<td>Indium alloy; wide pasty range</td>
<td>180</td>
<td>106</td>
<td>74</td>
<td></td>
<td>7.30</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F6</td>
<td>88</td>
<td></td>
<td>5</td>
<td></td>
<td></td>
<td></td>
<td>7</td>
<td></td>
<td>Alpha midrange alloy; Zinc drossing</td>
<td>194</td>
<td>185</td>
<td>9</td>
<td></td>
<td>7.38</td>
<td></td>
<td>20.5</td>
</tr>
<tr class="odd">
<td>F7</td>
<td>65.5</td>
<td></td>
<td>31.5</td>
<td></td>
<td></td>
<td></td>
<td>3</td>
<td></td>
<td>Alpha alloy, wide pasty range</td>
<td>171</td>
<td>133</td>
<td>38</td>
<td></td>
<td>7.93</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F8</td>
<td>95</td>
<td>3.5</td>
<td></td>
<td></td>
<td>1.5</td>
<td></td>
<td></td>
<td></td>
<td><p>Alpha high-indium alloy; meets acceptance criter-</p>
<p>ia; lower yield strength may be beneficial</p></td>
<td>220</td>
<td>214</td>
<td>6</td>
<td></td>
<td>7.38</td>
<td></td>
<td>20.4</td>
</tr>
<tr class="odd">
<td>F9</td>
<td>90</td>
<td>2</td>
<td>0.5</td>
<td></td>
<td></td>
<td>7.5</td>
<td></td>
<td></td>
<td>Alpha quaternary alloy</td>
<td>238</td>
<td>229</td>
<td>9</td>
<td></td>
<td>7.30</td>
<td></td>
<td></td>
</tr>
</tbody>
</table>

<table>
<colgroup>
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 3%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 3%" />
<col style="width: 4%" />
<col style="width: 21%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 5%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
</colgroup>
<tbody>
<tr class="odd">
<td colspan="17"><strong>Designation and Composition of Lead-Free
Solders (cont.)</strong></td>
</tr>
<tr class="even">
<td><strong>A. C.</strong></td>
<td colspan="8"><strong>Composition (% by Mass)</strong></td>
<td><strong>Comments</strong></td>
<td colspan="3"><p><strong>Melting</strong></p>
<p><strong>Temperature</strong></p>
<p><strong>(ºC)</strong></p></td>
<td colspan="2"><p><strong>Density</strong></p>
<p><strong>(g/cm<sup>3</sup>)</strong></p></td>
<td><p><strong>Spec-</strong></p>
<p><strong>ific</strong></p>
<p><strong>Heat</strong></p>
<p><strong>(J/g)</strong></p></td>
<td><p><strong>CTE</strong></p>
<p><strong>(µm</strong></p>
<p><strong>per</strong></p>
<p><strong>m.ºC)</strong></p></td>
</tr>
<tr class="odd">
<td></td>
<td><strong>Sn</strong></td>
<td><strong>Ag</strong></td>
<td><strong>Bi</strong></td>
<td><strong>Cu</strong></td>
<td><strong>In</strong></td>
<td><strong>Sb</strong></td>
<td><strong>Zn</strong></td>
<td><strong>Pb</strong></td>
<td></td>
<td colspan="3"></td>
<td colspan="2"></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td><strong>L</strong></td>
<td><strong>S</strong></td>
<td><strong>P. R.</strong></td>
<td><strong>Meas.</strong></td>
<td><strong>Calc.</strong></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F10</td>
<td>97</td>
<td>0.2</td>
<td></td>
<td>2</td>
<td></td>
<td>0.8</td>
<td></td>
<td></td>
<td>Kester alloy, meets acceptance criteria; lower yield strength may be
beneficial</td>
<td>230</td>
<td>219</td>
<td>11</td>
<td></td>
<td>7.33</td>
<td></td>
<td>21.8</td>
</tr>
<tr class="even">
<td>F11</td>
<td>78</td>
<td>2.5</td>
<td>19.5</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>Kester alloy; wide pasty range</td>
<td>196</td>
<td>138</td>
<td>58</td>
<td></td>
<td>7.74</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F12</td>
<td>56</td>
<td>3</td>
<td>41</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>IBM Endicott alloy; low elongation (38.9%)</td>
<td>166</td>
<td>138</td>
<td>28</td>
<td></td>
<td>8.24</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F13</td>
<td>43</td>
<td></td>
<td>55</td>
<td>2</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>High Cu, similar to A6; lower elongation, wider pasty range</td>
<td>140</td>
<td>138</td>
<td>2</td>
<td></td>
<td>8.53</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F14</td>
<td>50</td>
<td></td>
<td>48</td>
<td>2</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>Similar to F13 and A6; lower elongation (18.5%), wider pasty
range</td>
<td>153</td>
<td>138</td>
<td>15</td>
<td></td>
<td>8.35</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F15</td>
<td>42</td>
<td></td>
<td>57</td>
<td></td>
<td>1</td>
<td></td>
<td></td>
<td></td>
<td>IBM alloy; high Bi content, improved elongation over A6, meets
acceptance criteria; poor wetting</td>
<td>138</td>
<td>132</td>
<td>6</td>
<td></td>
<td>8.54</td>
<td></td>
<td>16.5</td>
</tr>
<tr class="odd">
<td>F16</td>
<td>42</td>
<td></td>
<td>56.7</td>
<td>0.3</td>
<td>1</td>
<td></td>
<td></td>
<td></td>
<td>IBM alloy; similar to F15, lower elongation</td>
<td>138</td>
<td>132</td>
<td>6</td>
<td></td>
<td>8.54</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F17</td>
<td>91.8</td>
<td>3.4</td>
<td>4.8</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>SNL alloy #1. Similar to E4; small peak at 137 ºC from quench.</td>
<td>215.9</td>
<td>211</td>
<td>4.9</td>
<td></td>
<td>7.47</td>
<td></td>
<td>22.3</td>
</tr>
</tbody>
</table>

<table>
<colgroup>
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 3%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 3%" />
<col style="width: 4%" />
<col style="width: 21%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 5%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
</colgroup>
<tbody>
<tr class="odd">
<td colspan="17"><strong>Designation and Composition of Lead-Free
Solders (cont.)</strong></td>
</tr>
<tr class="even">
<td><strong>A. C.</strong></td>
<td colspan="8"><strong>Composition (% by Mass)</strong></td>
<td><strong>Comments</strong></td>
<td colspan="3"><p><strong>Melting</strong></p>
<p><strong>Temperature</strong></p>
<p><strong>(ºC)</strong></p></td>
<td colspan="2"><p><strong>Density</strong></p>
<p><strong>(g/cm<sup>3</sup>)</strong></p></td>
<td><p><strong>Spec-</strong></p>
<p><strong>ific</strong></p>
<p><strong>Heat</strong></p>
<p><strong>(J/g)</strong></p></td>
<td><p><strong>CTE</strong></p>
<p><strong>(µm</strong></p>
<p><strong>per</strong></p>
<p><strong>m.ºC)</strong></p></td>
</tr>
<tr class="odd">
<td></td>
<td><strong>Sn</strong></td>
<td><strong>Ag</strong></td>
<td><strong>Bi</strong></td>
<td><strong>Cu</strong></td>
<td><strong>In</strong></td>
<td><strong>Sb</strong></td>
<td><strong>Zn</strong></td>
<td><strong>Pb</strong></td>
<td></td>
<td colspan="3"></td>
<td colspan="2"></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td><strong>L</strong></td>
<td><strong>S</strong></td>
<td><strong>P. R.</strong></td>
<td><strong>Meas.</strong></td>
<td><strong>Calc.</strong></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F18</td>
<td>82</td>
<td></td>
<td>3</td>
<td></td>
<td>15</td>
<td></td>
<td></td>
<td></td>
<td>NIST Sn-Bi-In system, similary to EN1; 113 ºC solidus</td>
<td></td>
<td>113</td>
<td></td>
<td></td>
<td>7.37</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F19</td>
<td>82</td>
<td>3</td>
<td>5</td>
<td></td>
<td>10</td>
<td></td>
<td></td>
<td></td>
<td>Midrange high-In alloy, composition adjusted to reduce pasty
range</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>7.46</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F20</td>
<td>85</td>
<td></td>
<td>5</td>
<td></td>
<td>10</td>
<td></td>
<td></td>
<td></td>
<td>Midrange high-In alloy, composition adjusted to reduce pasty
range</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>7.40</td>
<td></td>
<td>20.3</td>
</tr>
<tr class="even">
<td>F21</td>
<td>77.2</td>
<td>2.8</td>
<td></td>
<td></td>
<td>20</td>
<td></td>
<td></td>
<td></td>
<td>INDALLOY 227</td>
<td>187</td>
<td>175</td>
<td>12</td>
<td></td>
<td>7.36</td>
<td></td>
<td>23.1</td>
</tr>
<tr class="odd">
<td>F22</td>
<td>95</td>
<td>0.1</td>
<td>1</td>
<td></td>
<td></td>
<td>3.9</td>
<td></td>
<td></td>
<td>Plumbing solder</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>7.29</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F23</td>
<td>95</td>
<td>0.5</td>
<td>1.5</td>
<td></td>
<td></td>
<td>3</td>
<td></td>
<td></td>
<td>Plumbing solder</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>7.32</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F24</td>
<td>43</td>
<td></td>
<td>55</td>
<td></td>
<td></td>
<td></td>
<td>2</td>
<td></td>
<td>Ternary Sn-Bi-Zn eutectic</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>8.49</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F25</td>
<td>43.5</td>
<td>0.5</td>
<td>56</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>Ternary Sn-Bi-Ag eutectic</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>8.53</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F26</td>
<td>88.9</td>
<td>4.5</td>
<td></td>
<td>1.6</td>
<td></td>
<td>5</td>
<td></td>
<td></td>
<td>SNL alloy #2</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>7.39</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F27</td>
<td>95.5</td>
<td>3.5</td>
<td></td>
<td>0.5</td>
<td></td>
<td></td>
<td>1</td>
<td></td>
<td>AT&amp;T alloy [check total composition, 100.5%]</td>
<td>221</td>
<td>219</td>
<td>2</td>
<td></td>
<td>7.38</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F28</td>
<td>85.7</td>
<td>3</td>
<td></td>
<td></td>
<td>10.9</td>
<td>0.4</td>
<td></td>
<td></td>
<td>Qualitek alloy</td>
<td>217.6</td>
<td>201</td>
<td>16.6</td>
<td></td>
<td>7.37</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F29</td>
<td>93.6</td>
<td>4.7</td>
<td></td>
<td>1.7</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>SNL alloy #3</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>7.43</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F30</td>
<td>96.1</td>
<td>3.2</td>
<td></td>
<td>0.7</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>NIST alloy</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>7.38</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F31</td>
<td>95.2</td>
<td>3.5</td>
<td></td>
<td>1.3</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>NIST alloy</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>7.40</td>
<td></td>
<td></td>
</tr>
</tbody>
</table>

**Note:** Following alloys F32 to F65 and A0 were experimental or
reference alloys prepared to investigate failures due

to fillet-lifting observed in through-hole joints when soldered with
certain lead-free solder alloys. Because these alloys

were not intended to replace tin-lead solder, their property values were
not systematically collected.

<table style="width:100%;">
<colgroup>
<col style="width: 4%" />
<col style="width: 6%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 5%" />
<col style="width: 5%" />
<col style="width: 21%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 5%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
</colgroup>
<tbody>
<tr class="odd">
<td><strong>A. C.</strong></td>
<td colspan="6"><strong>Composition (% by Mass)</strong></td>
<td><strong>Comments</strong></td>
<td colspan="3"><p><strong>Melting</strong></p>
<p><strong>Temperature</strong></p>
<p><strong>(ºC)</strong></p></td>
<td colspan="2"><p><strong>Density</strong></p>
<p><strong>(g/cm<sup>3</sup>)</strong></p></td>
<td><p><strong>Spec-</strong></p>
<p><strong>ific</strong></p>
<p><strong>Heat</strong></p>
<p><strong>(J/g)</strong></p></td>
<td><p><strong>CTE</strong></p>
<p><strong>(µm</strong></p>
<p><strong>per</strong></p>
<p><strong>m.ºC)</strong></p></td>
</tr>
<tr class="even">
<td></td>
<td><strong>Sn</strong></td>
<td><strong>Ag</strong></td>
<td><strong>Bi</strong></td>
<td><strong>Cu</strong></td>
<td><strong>In</strong></td>
<td><strong>Pb</strong></td>
<td></td>
<td colspan="3"></td>
<td colspan="2"></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td><strong>L</strong></td>
<td><strong>S</strong></td>
<td><strong>P. R.</strong></td>
<td><strong>Meas.</strong></td>
<td><strong>Calc.</strong></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F32</td>
<td>95.54</td>
<td>3.47</td>
<td></td>
<td></td>
<td>0.99</td>
<td></td>
<td>Alloy A4, plus 1% In; Sn/Ag ratio preserved</td>
<td>223</td>
<td>218.8</td>
<td>4.2</td>
<td></td>
<td>7.38</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F33</td>
<td>93.69</td>
<td>3.40</td>
<td></td>
<td></td>
<td>2.91</td>
<td></td>
<td>Alloy A4, plus 3% In; Sn/Ag ratio preserved</td>
<td>216</td>
<td>214.1</td>
<td>1.9</td>
<td></td>
<td>7.38</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F34</td>
<td>91.90</td>
<td>3.33</td>
<td></td>
<td></td>
<td>4.76</td>
<td></td>
<td>Alloy A4, plus 5% In; Sn/Ag ratio preserved</td>
<td>214.7</td>
<td>210.4</td>
<td>4.3</td>
<td></td>
<td>7.38</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F35</td>
<td>94.06</td>
<td>2.97</td>
<td>1.98</td>
<td></td>
<td>0.99</td>
<td></td>
<td>Alloy E4, plus 1% In; Sn/Ag ratio preserved</td>
<td>221.1</td>
<td>215.2</td>
<td>5.9</td>
<td></td>
<td>7.40</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F36</td>
<td>92.23</td>
<td>2.91</td>
<td>1.94</td>
<td></td>
<td>2.91</td>
<td></td>
<td>Alloy E4, plus 3% In; Sn/Ag ratio preserved</td>
<td>215.1</td>
<td>208.9</td>
<td>6.2</td>
<td></td>
<td>7.40</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F37</td>
<td>90.48</td>
<td>2.86</td>
<td>1.90</td>
<td></td>
<td>4.76</td>
<td></td>
<td>Alloy E4, plus 5% In; Sn/Ag ratio preserved</td>
<td>210.1</td>
<td>202.8</td>
<td>7.3</td>
<td></td>
<td>7.40</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F38</td>
<td>90.89</td>
<td>3.37</td>
<td>4.75</td>
<td></td>
<td>0.99</td>
<td></td>
<td>Alloy E4, plus 1% In; Sn/Ag ratio preserved</td>
<td>215.9</td>
<td>210.4</td>
<td>5.5</td>
<td></td>
<td>7.47</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F39</td>
<td>89.13</td>
<td>3.30</td>
<td>4.66</td>
<td></td>
<td>2.91</td>
<td></td>
<td>Alloy E4, plus 3% In; Sn/Ag ratio preserved</td>
<td>212.6</td>
<td>206.1</td>
<td>6.5</td>
<td></td>
<td>7.46</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F40</td>
<td>87.43</td>
<td>3.24</td>
<td>4.57</td>
<td></td>
<td>4.76</td>
<td></td>
<td>Alloy E4, plus 5% In; Sn/Ag ratio preserved</td>
<td>208.0</td>
<td>199.1</td>
<td>8.9</td>
<td></td>
<td>7.46</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F41</td>
<td>89.5</td>
<td>3.5</td>
<td>7</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>202.0</td>
<td>185</td>
<td>17</td>
<td></td>
<td>7.51</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F42</td>
<td>86.5</td>
<td>3.5</td>
<td>10</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>213.3</td>
<td>205.5</td>
<td>7.8</td>
<td></td>
<td>7.57</td>
<td></td>
<td></td>
</tr>
</tbody>
</table>

<table style="width:100%;">
<colgroup>
<col style="width: 4%" />
<col style="width: 6%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 5%" />
<col style="width: 5%" />
<col style="width: 21%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 5%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
</colgroup>
<tbody>
<tr class="odd">
<td colspan="15"><strong>Designation and Composition of Lead-Free
Solders (cont.)</strong></td>
</tr>
<tr class="even">
<td><strong>A. C.</strong></td>
<td colspan="6"><strong>Composition (% by Mass)</strong></td>
<td><strong>Comments</strong></td>
<td colspan="3"><p><strong>Melting</strong></p>
<p><strong>Temperature</strong></p>
<p><strong>(ºC)</strong></p></td>
<td colspan="2"><p><strong>Density</strong></p>
<p><strong>(g/cm<sup>3</sup>)</strong></p></td>
<td><p><strong>Spec-</strong></p>
<p><strong>ific</strong></p>
<p><strong>Heat</strong></p>
<p><strong>(J/g)</strong></p></td>
<td><p><strong>CTE</strong></p>
<p><strong>(µm</strong></p>
<p><strong>per</strong></p>
<p><strong>m.ºC)</strong></p></td>
</tr>
<tr class="odd">
<td></td>
<td><strong>Sn</strong></td>
<td><strong>Ag</strong></td>
<td><strong>Bi</strong></td>
<td><strong>Cu</strong></td>
<td><strong>In</strong></td>
<td><strong>Pb</strong></td>
<td></td>
<td colspan="3"></td>
<td colspan="2"></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td><strong>L</strong></td>
<td><strong>S</strong></td>
<td><strong>P. R.</strong></td>
<td><strong>Meas.</strong></td>
<td><strong>Calc.</strong></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F43</td>
<td>91.5</td>
<td>2.5</td>
<td></td>
<td>1</td>
<td>5</td>
<td></td>
<td>Ag reduced to increase ductility; Cu added to improve wetting. Same
room-temperature strength as for F2.</td>
<td>205</td>
<td>140</td>
<td></td>
<td></td>
<td>7.37</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F44</td>
<td>91.5</td>
<td>1.5</td>
<td></td>
<td>2</td>
<td>5</td>
<td></td>
<td>Ag reduced to increase ductility; Cu added to improve wetting. Same
room-temperature strength as for F2.</td>
<td>205</td>
<td>140</td>
<td></td>
<td></td>
<td>7.36</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F45</td>
<td>91.5</td>
<td>0.5</td>
<td></td>
<td>3</td>
<td>5</td>
<td></td>
<td>Ag reduced to increase ductility; Cu added to improve wetting. Same
room-temperature strength as for F2.</td>
<td>212</td>
<td></td>
<td></td>
<td></td>
<td>7.35</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F46</td>
<td>95</td>
<td></td>
<td>5</td>
<td></td>
<td></td>
<td></td>
<td>Ag replaced by 5% Bi to lower melting point.</td>
<td>222</td>
<td></td>
<td></td>
<td></td>
<td>7.39</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F47</td>
<td>94</td>
<td></td>
<td>5</td>
<td></td>
<td>1</td>
<td></td>
<td>Ag replaced by 5% Bi to lower melting point; 1% In added to increase
ductility, lower melting pt.</td>
<td>221</td>
<td></td>
<td></td>
<td></td>
<td>7.39</td>
<td></td>
<td></td>
</tr>
</tbody>
</table>

<table style="width:100%;">
<colgroup>
<col style="width: 4%" />
<col style="width: 6%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 5%" />
<col style="width: 4%" />
<col style="width: 22%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 5%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
</colgroup>
<tbody>
<tr class="odd">
<td colspan="15"><strong>Designation and Composition of Lead-Free
Solders (cont.)</strong></td>
</tr>
<tr class="even">
<td><strong>A. C.</strong></td>
<td colspan="6"><strong>Composition (% by Mass)</strong></td>
<td><strong>Comments</strong></td>
<td colspan="3"><p><strong>Melting</strong></p>
<p><strong>Temperature</strong></p>
<p><strong>(ºC)</strong></p></td>
<td colspan="2"><p><strong>Density</strong></p>
<p><strong>(g/cm<sup>3</sup>)</strong></p></td>
<td><p><strong>Spec-</strong></p>
<p><strong>ific</strong></p>
<p><strong>Heat</strong></p>
<p><strong>(J/g)</strong></p></td>
<td><p><strong>CTE</strong></p>
<p><strong>(µm</strong></p>
<p><strong>per</strong></p>
<p><strong>m.ºC)</strong></p></td>
</tr>
<tr class="odd">
<td></td>
<td><strong>Sn</strong></td>
<td><strong>Ag</strong></td>
<td><strong>Bi</strong></td>
<td><strong>Cu</strong></td>
<td><strong>In</strong></td>
<td><strong>Pb</strong></td>
<td></td>
<td colspan="3"></td>
<td colspan="2"></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td><strong>L</strong></td>
<td><strong>S</strong></td>
<td><strong>P. R.</strong></td>
<td><strong>Meas.</strong></td>
<td><strong>Calc.</strong></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F48</td>
<td>92</td>
<td></td>
<td>5</td>
<td></td>
<td>3</td>
<td></td>
<td>Ag replaced by 5% Bi to lower melting point; 3% In added to increase
ductility, lower melting pt.</td>
<td>215</td>
<td></td>
<td></td>
<td></td>
<td>7.39</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F49</td>
<td>90</td>
<td></td>
<td>5</td>
<td></td>
<td>5</td>
<td></td>
<td>Ag replaced by 5% Bi to lower melting point; 3% In added to increase
ductility, lower melting pt.</td>
<td>210</td>
<td></td>
<td></td>
<td></td>
<td>7.39</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F50</td>
<td>95</td>
<td></td>
<td></td>
<td></td>
<td>5</td>
<td></td>
<td>Sn only, with 5% In added to increase ductility, lower melting
pt</td>
<td>221</td>
<td></td>
<td></td>
<td></td>
<td>7.30</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F51</td>
<td>93.5</td>
<td>0.5</td>
<td></td>
<td>1</td>
<td>5</td>
<td></td>
<td>Reintroduce Ag; add Cu at eutectic composition; complements
F43-F45.</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>7.33</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F52</td>
<td>92.5</td>
<td>1.5</td>
<td></td>
<td>1</td>
<td>5</td>
<td></td>
<td>Add more Ag; add Cu at eutectic composition; complements
F43-F45.</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>7.35</td>
<td></td>
<td></td>
</tr>
</tbody>
</table>

<table style="width:100%;">
<colgroup>
<col style="width: 4%" />
<col style="width: 6%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 5%" />
<col style="width: 5%" />
<col style="width: 21%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 5%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
</colgroup>
<tbody>
<tr class="odd">
<td colspan="15"><strong>Designation and Composition of Lead-Free
Solders (cont.)</strong></td>
</tr>
<tr class="even">
<td><strong>A. C.</strong></td>
<td colspan="6"><strong>Composition (% by Mass)</strong></td>
<td><strong>Comments</strong></td>
<td colspan="3"><p><strong>Melting</strong></p>
<p><strong>Temperature</strong></p>
<p><strong>(ºC)</strong></p></td>
<td colspan="2"><p><strong>Density</strong></p>
<p><strong>(g/cm<sup>3</sup>)</strong></p></td>
<td><p><strong>Spec-</strong></p>
<p><strong>ific</strong></p>
<p><strong>Heat</strong></p>
<p><strong>(J/g)</strong></p></td>
<td><p><strong>CTE</strong></p>
<p><strong>(µm</strong></p>
<p><strong>per</strong></p>
<p><strong>m.ºC)</strong></p></td>
</tr>
<tr class="odd">
<td></td>
<td><strong>Sn</strong></td>
<td><strong>Ag</strong></td>
<td><strong>Bi</strong></td>
<td><strong>Cu</strong></td>
<td><strong>In</strong></td>
<td><strong>Pb</strong></td>
<td></td>
<td colspan="3"></td>
<td colspan="2"></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td><strong>L</strong></td>
<td><strong>S</strong></td>
<td><strong>P. R.</strong></td>
<td><strong>Meas.</strong></td>
<td><strong>Calc.</strong></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F53</td>
<td>94</td>
<td></td>
<td>1</td>
<td></td>
<td>5</td>
<td></td>
<td>Reintroduce 1% Bi to lower melting point; keep In at 5%.</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>7.32</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F54</td>
<td>92</td>
<td></td>
<td>3</td>
<td></td>
<td>5</td>
<td></td>
<td>Increase Bi; keep In at 5%.</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>7.36</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F55</td>
<td>94.5</td>
<td>0.5</td>
<td></td>
<td></td>
<td>5</td>
<td></td>
<td>Remove Bi, reintroduce Ag; keep In at 5%.</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>7.31</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F56</td>
<td>93.5</td>
<td>1.5</td>
<td></td>
<td></td>
<td>5</td>
<td></td>
<td>Increase Ag; keep In at 5%.</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>7.33</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F57</td>
<td>94.15</td>
<td>3.41</td>
<td></td>
<td></td>
<td></td>
<td>2.44</td>
<td>2.5% Pb added to A4; Sn/Ag ratio maintained same as in A4</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>7.44</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F58</td>
<td>91.90</td>
<td>3.33</td>
<td></td>
<td></td>
<td></td>
<td>4.76</td>
<td>5% Pb added to A4; Sn/Ag ratio maintained same as in A4</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>7.50</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F59</td>
<td>89.56</td>
<td>3.32</td>
<td>4.68</td>
<td></td>
<td></td>
<td>2.44</td>
<td>2.5% Pb added to F17; Sn/Ag ratio maintained same as in F17</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>7.53</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F60</td>
<td>87.43</td>
<td>3.24</td>
<td>4.57</td>
<td></td>
<td></td>
<td>4.76</td>
<td>5% Pb added to F17; Sn/Ag ratio maintained same as in F17</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>7.59</td>
<td></td>
<td></td>
</tr>
</tbody>
</table>

<table style="width:100%;">
<colgroup>
<col style="width: 4%" />
<col style="width: 6%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 5%" />
<col style="width: 5%" />
<col style="width: 21%" />
<col style="width: 4%" />
<col style="width: 4%" />
<col style="width: 5%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
<col style="width: 6%" />
</colgroup>
<tbody>
<tr class="odd">
<td colspan="15"><strong>Designation and Composition of Lead-Free
Solders (cont.)</strong></td>
</tr>
<tr class="even">
<td><strong>A. C.</strong></td>
<td colspan="6"><strong>Composition (% by Mass)</strong></td>
<td><strong>Comments</strong></td>
<td colspan="3"><p><strong>Melting</strong></p>
<p><strong>Temperature</strong></p>
<p><strong>(ºC)</strong></p></td>
<td colspan="2"><p><strong>Density</strong></p>
<p><strong>(g/cm<sup>3</sup>)</strong></p></td>
<td><p><strong>Spec-</strong></p>
<p><strong>ific</strong></p>
<p><strong>Heat</strong></p>
<p><strong>(J/g)</strong></p></td>
<td><p><strong>CTE</strong></p>
<p><strong>(µm</strong></p>
<p><strong>per</strong></p>
<p><strong>m.ºC)</strong></p></td>
</tr>
<tr class="odd">
<td></td>
<td><strong>Sn</strong></td>
<td><strong>Ag</strong></td>
<td><strong>Bi</strong></td>
<td><strong>Cu</strong></td>
<td><strong>In</strong></td>
<td><strong>Pb</strong></td>
<td></td>
<td colspan="3"></td>
<td colspan="2"></td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td><strong>L</strong></td>
<td><strong>S</strong></td>
<td><strong>P. R.</strong></td>
<td><strong>Meas.</strong></td>
<td><strong>Calc.</strong></td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F61</td>
<td>92.68</td>
<td></td>
<td></td>
<td></td>
<td>4.88</td>
<td>2.44</td>
<td>2.5% Pb added to F50; Sn/In ratio maintained same as in F50</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>7.37</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F62</td>
<td>90.48</td>
<td></td>
<td></td>
<td></td>
<td>4.76</td>
<td>4.76</td>
<td>5% Pb added to F50; Sn/In ratio maintained same as in F50</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>7.43</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F63</td>
<td>97.5</td>
<td>2.5</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>7.36</td>
<td></td>
<td></td>
</tr>
<tr class="even">
<td>F64</td>
<td>95.12</td>
<td>2.44</td>
<td></td>
<td></td>
<td></td>
<td>2.44</td>
<td>2.5% Pb added to F63; Sn/Ag ratio maintained same as in F63</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>7.42</td>
<td></td>
<td></td>
</tr>
<tr class="odd">
<td>F65</td>
<td>92.86</td>
<td>2.38</td>
<td></td>
<td></td>
<td></td>
<td>4.76</td>
<td>5% Pb added to F63; Sn/Ag ratio maintained same as in F63</td>
<td></td>
<td></td>
<td></td>
<td></td>
<td>7.48</td>
<td></td>
<td></td>
</tr>
</tbody>
</table>

**Source:** Technical Reports for the Lead Free Solder Project: Alloy
Descriptions: \"Lead-Free Solder Alloy Designation and Composition;\"
Lead Free Solder Project CD-ROM, National Center for Manufacturing
Sciences (NCMS), 1998

5\. Useful References:

5.1. References to Tabular Data:

1.  Authors not listed; "Lead-Free Alloy Trends for the Assembly of
    Mixed Technology PWBs", Proc. NEPCON-West 2000 (Feb. 27-Mar. 2)
    Anaheim, CA

2.  M. Abtew, "Wetting Characteristics of Lead Free Solders for High
    Volume Surface Mount Application," Proc. NEPCON West 2000 Conf.
    (Feb. 28 - Mar. 2, 2000) Anaheim, CA

3.  Chad M. Miller, Iver E. Anderson and Jack F. Smith, "A Viable
    Tin-Lead Solder Substitute: Sn-Ag-Cu," J. Electronic Mater. 23(7)
    595-601 (1994)

4.  Iver E. Anderson, "Tin-Silver-Copper: A Lead-Free Solder for
    Capacitor Interconnects," p. 16, Proc. 16^th^ Capacitor and Resistor
    Technology Symposium (CARTS 96), 11-15 March, 1996

5.  Iver E. Anderson, Özer Ünal, Tamara E. Bloomer and James C. Foley,
    "Effects of Transition Metal Alloying on Microstructural Stability
    and Mechanical Properties of Tin-Silver-Copper Solder Alloys," Proc.
    Third Pacific Rim International Conference on Advanced Materials and
    Processing (PRICM 3) (The Minerals, Metals and Materials Society,
    1998)

6.  Iver E. Anderson, Tamara E. Bloomer, Robert L. Terpstra, James C.
    Foley, Bruce A. Cook and Joel Harringa, "Development of Eutectic and
    Near-Eutectic Tin-Silver-Copper Solder Alloys for Lead-Free
    Electronic Assemblies," IPCWorks '99: An International Summit on
    Lead-Free Electronics Assemblies," (October 25-28, 1999),
    Minneapolis, MN

7.  Iver E. Anderson, Tamara E. Bloomer, Robert L. Terpstra, James C.
    Foley, Bruce A. Cook and Joel Harringa, "Development of Eutectic and
    Near-Eutectic Tin-Silver-Copper Solder Alloys for Lead-Free Joining
    Applications," p. 575 (complete citation not available)

8.  Artaki, D.W. Finley, A.M. Jackson, U. Ray and P.T. Vianco, "Wave
    Soldering with Pb-Free Solders," *Proc. Surface Mount International*
    (San Jose, CA, August 27-31, 1995), p. 495.

9.  Peter Biocca, "Global Update on Lead-free Solders," *Proc. Surface
    Mount International* (San Jose, CA, 1998), pp. 705-709

10. E.A. Brandes, *Smithells Metals Reference Book*, 6^th^ ed.
    (Butterworths, London, 1983)

11. S.D. Brandi, S. Liu, J.E. Indacochea and R. Xu, "Brazeability and
    Solderability of Engineering Materials," ASM Handbook, Vol. 6:
    Welding, Brazing and Soldering (ASM International, 1993)

12. D.R. Frear, S.N. Burchett, H.S. Morgan, and J.H. Lau, eds., *The
    Mechanics of Solder Alloy Interconnects*, p. 60 (Van Nostrand
    Reinhold, New York, 1994)

13. E.Gebhardt and G. Petzow, Z. Metallkde. 50, 597 (1950)

14. Judith Glazer, "Microstructure and Mechanical Properties of Pb‑free
    Solder Alloys for Low-Cost Electronic Assembly: A Review," *J.
    Electronic Materials* 23(8), 693 (1994)

15. D.E. Gray, ed., *American Institute of Physics Handbook*,
    (McGraw-Hill, New York, 1957)

16. Angela Grusd, "Lead Free Solders in Electronics," SMI97, p. 648

17. William B. Hampshire, "The Search for Lead-Free Solders," Proc.
    Surface Mount International Conference (Sept. 1992) San Jose, CA, p.
    729

18. E.W. Hare and R.G. Stang, *J. Electronic Mater*. 21, 599 (1992)

19. Cynthia L. Hernandez, Paul T. Vianco, Jerome A. Rejent, "Effect of
    Interface Microstructure on the Mechanical Properties of Pb-Free
    Hybrid Microcircuit Solder Joints," IPC/SMTA Electronics Assembly
    Expo (1998), p. S19-2-1

20. J.S. Hwang, "Overview of Lead-Free Solders for Electronics &
    Microelectronics," Proc. SMI Conf. , p. 405

21. S.K. Kang, J. Horkans, P.C. Andricacos, R.A. Carruthers, J.
    Cotte, M. Datta, P. Gruber, J.M.E. Harper, K. Kwietniak, S.
    Sambucetti, L. Shi, G. Brouillette and D. Danovitch, "Pb-Free Solder
    Alloys for Flip Chip Applications," 49^th^ Electronic Components
    Technology Conf. (1999), June 1-4, San Diego CA

22. M.A. Korhonen, D.D. Brown and C.-Y. Li, "Mechanical Properties of
    Plated Copper," Mat. Res. Soc. Symp. Proc. Vol. 323, p. 104
    (MRS, 1994) ("plated \[thin foil\] copper")

23. M.A. Kwoka and D.M. Foster, "Lead Finish Comparison of Lead-Free
    Solders versus Eutectic Solder," Proc. Surface Mount International
    Conference (1994), p. 433

24. N.A. Lange, *Handbook of Chemistry*, p. 100 (Handbook Publishers,
    Sandusky, Ohio, 1956)

25. J. Lau, C. Chang, R. Lee, T.-Y. Chen, D. Cheng, T.J. Tseng, D. Lin,
    "Thermal-Fatigue Life of Solder Bumped Flip Chip on Micro Via-In-Pad
    (VIP) Low Cost Substrates"

26. J.H. Lau and S.-W. Ricky Lee, "Fracture Mechanics Analysis of Low
    Cost Solder Bumped Flip Chip Assemblies with *Imperfect*
    Underfills," Proceedings: NEPCON West Conference (February 28 --
    March 2, 1995), Anaheim, CA

27. N.-C. Lee, J.A. Slattery, J.R. Sovinsky, I. Artaki, P.T. Vianco, "A
    Drop-In Lead-Free Solder Replacement," Proceedings: NEPCON West
    Conference (February 28 -- March 2, 1995), Anaheim, CA

28. N.-C. Lee and W. Casey, "Soldering Technology for Area Array
    Packages," Proceedings: NEPCON WEST 2000 (February 27 -- March 2,
    2000), Anaheim, CA

29. Ning-Cheng Lee, "Lead-Free Soldering of Chip-Scale Packages," *Chip
    Scale Review*, p. 42 (March/April 2000)

30. M.E. Loomans, S. Vaynman, G.Ghosh and M.E. Fine, "Investigation of
    Multi-component Lead-free Solders," J. Elect. Matls. 23(8), 741
    (1994)

31. Rao Mahidhara, "A Primer on Lead-Free Solder," Chip Scale Review
    (March-April 2000)

32. T.B. Massalski, *Binary Phase Diagrams*, 2^nd^ ed. (Amer. Soc.
    Metals, 1990)

33. H. Mavoori, Semyon Vaynman, Jason Chin, Brian Moran, Leon M. Keer
    and Morris E. Fine, "Mechanical Behavior of Eutectic Sn-Ag and Sn-Zn
    Solders," Mat. Res. Soc. Symp. Proc. Vol. 390, p. 161 (MRS, 1995)

34. H. Mavoori, J. Chin, S. Vaynman, B. Moran, L. Keer and M. Fine,
    "Creep, Stress Relaxation, and Plastic Deformation in Sn-Ag and
    Sn-Zn Eutectic Solders," *J. Electronic Materials*, 26(7), 783
    (1997)

35. Rodney J. McCabe and Morris E. Fine, "Athermal and Thermally
    Activated Plastic Flow in Low Melting Temperature Solders at Small
    Stresses," Scripta Materialia 39(2), 189 (1998)

36. Rodney J. McCabe and Morris E. Fine, "The Creep Properties of
    Precipitation-Strengthened Tin-Based Alloys," JOM, p. 33 (June 2000)

37. NCMS, Technical Reports for the Lead Free Solder Project: Properties
    Reports: \"Room Temperature Tensile Properties of Lead-Free Solder
    Alloys;\" Lead Free Solder Project CD-ROM, National Center for
    Manufacturing Sciences (NCMS), 1998

38. Y.-H. Pao, S. Badgley, R. Govila and E. Jih, "An Experimental and
    Modeling Study of Thermal Cyclic Behavior of Sn-Cu and Sn-Pb Solder
    Joints," Mat. Res. Soc. Symp. Proc. Vol. 323, p. 128 (MRS, 1994)

39. Alan Rae and Ronald C. Lasky, "Economics and Implications of Moving
    to Lead-Free Assembly," Proc. NEPCON WEST 2000 (February 27 -- March
    2, 2000), Anaheim, CA

40. Karl Seelig and David Suraski, "The Status of Lead-Free Solder
    Alloys," Proc. 50^th^ IEEE 2000 Electronic Components and Technology
    Conference (May 21-24, 2000), Las Vegas, NV

41. Jeff D. Sigelko and K.N. Subramanian, "Overview of lead-free
    solders," Adv. Mat. & Proc., pp. 47-48 (March 2000)

42. J.A. Slattery and C.E.T. White, U.S. Patent 5,256,370 (Oct. 26,
    1993)

43. V. Solberg, "No-Lead Solder for CSP: The Impact of Higher
    Temperature SMT Assembly Processing," Proc. NEPCON West 2000 Conf.
    (Feb. 28 - Mar. 2, 2000) Anaheim, CA (Source: Indium Corp.)

44. S.M. Spearing, M.A. Tenhover, D.B. Lukco, L. Viswanathan and D.K.
    Hollen, "Models for the Thermomechanical Behavior of Metal/Ceramic
    Laminates," Mat. Res. Soc. Symp. Proc. Vol. 323, p. 128 (MRS, 1994)

45. R.R. Tummala and E.J. Rymaszewski, eds. *Microelectronics Packaging
    Handbook*, (Van Nostrand Reinhold, 1989, NY)

46. Paul T. Vianco, "General Soldering," ASM Handbook, Vol. 6, Welding,
    Brazing, and Soldering (ASM International, 9639 Kinsman Road,
    Materials Park, Ohio 44073 USA, 1993)

47. M.E. Warwick, "The Wetting and Mechanical Properties of Lead-Free
    Capillary Plumbing Solders," ATB Metallurgie XXV, No. 1, 43-50
    (1985)

48. Welco Castings, Solder Data Sheet, 2 Hillyard Street, Hamilton,
    Ontario, Canada

49. Walter L. Winterbottom, "Converting to Lead-Free Solders: An
    Automotive Industry Perspective," JOM, 20-24 (July 1993)

50. Tim Wong and A.H. Matsunaga, "Ceramic Ball Grid Array Solder Joint
    Thermal Fatigue Life Enhancement," Proceedings: NEPCON West
    Conference (February 28 -- March 2, 1995), Anaheim, CA

5.2. Reference Books:

1.  **ASM Handbook, Vol. 6, Welding, Brazing, and Soldering** (ASM
    International, 9639 Kinsman Road, Materials Park, Ohio 44073 USA,
    1993)

2.  P. Borgesen, K.F. Jensen and R.A. Pollak, eds., "**Electronic
    Packaging Materials Science VII**," Matls. Res. Soc. Symp. Proc.
    Vol. 323, (MRS, Pittsburgh, 1994

3.  E.A. Brandes, **Smithells Metals Reference Book**, 6^th^ ed.
    (Butterworths, London, 1983)

4.  J.R. Davis, ed., **Metals Handbook, Desk Edition** (2^nd^ ed.), (ASM
    International, Materials Park, Ohio 44073-0002 USA, 1998)

5.  D.R. Frear, W.B. Jones and K.R. Kinsman, eds., **Solder Mechanics**
    (TMS, 1991)

6.  D.R. Frear, H.S. Morgan, S.N. Burchett, and J.H. Lau, eds., **The
    Mechanics of Solder Alloy Interconnects** (Van Nostrand Reinhold.
    New York, 1994)

7.  D.E. Gray, ed., **American Institute of Physics Handbook,**
    (McGraw-Hill, New York, 1957)

8.  R.J. Klein Wassink, **Soldering in Electronics** (Electrochemical
    Publications, Ltd., 1989)

9.  N.A. Lange, **Handbook of Chemistry,** p. 100 (Handbook Publishers,
    Sandusky, Ohio, 1956)

10. Lieberman, **Modern Soldering and Brazing Techniques** (Business
    News Publishing Co., 1988)

11. H.H. Manko, **Solders and Soldering**, 3^nd^ ed. (McGraw-Hill, 1992)

12. R. Skipp, **Soldering Handbook** (McGraw-Hill, 1964)

13. R.R. Tummala and E.J. Rymaszewski, eds. **Microelectronics Packaging
    Handbook,** (Van Nostrand Reinhold, 1989, NY)

14. Paul T. Vianco, "General Soldering," **ASM Handbook, Vol. 6,
    Welding, Brazing, and Soldering** (ASM International, 9639 Kinsman
    Road, Materials Park, Ohio 44073 USA, 1993)

15. R.W. Woodgate, **The Handbook of Machine Soldering**, 2^nd^ ed.
    (John Wiley & Sons, 1988)

**5.3. Useful URLs**

Organizations Involved in Lead-Free Solder Issues:

[Japan Electronic Industry Development Association
(JEIDA)](http://www.jeida.or.jp/english/information/pbfree/roadmap.html):
"Challenges and Efforts Toward Commercialization of Lead-free Solder --
Road Map 2000 for Commercialization of Lead-free Solder" -- Ver 1.2

[Lead Free Soldering Technology Centre
(Soldertec)](http://www.lead-free.org/)

( [www.lead-free.org/](http://www.lead-free.org/) and
<http://www.solderworld.com/> )

IPC: Association Connecting Electronics Industries ("Get the Lead OUT!)

( <http://www.leadfree.org/> )

[Materials Properties and Data, Materials Science and Engineering
Laboratory (MSEL), NIST](http://www.msel.nist.gov/data.html)