July 2005

NASA Electronic Parts and Packaging Program

Characterization of Philips UBA2033 Silicon-On-Insulator

Full-Bridge Driver IC at Extreme Temperatures

Richard Patterson, NASA Glenn Research Center

Ahmad Hammoud, QSS Group, Inc. / NASA GRC

Malik Elbuluk, University of Akron

**Scope**

Electronics designed for use in future NASA space exploration missions
are expected to encounter extreme temperatures and wide thermal swings.
Such missions include planetary surface exploration, bases, rovers,
landers, orbiters, and satellites. Electronics designed for such
applications must, therefore, be able to withstand exposure to extreme
temperatures and to perform properly for the duration of mission.
Silicon-On-Insulator (SOI) technology has been under active
consideration in the electronics industry for many years due to the
advantages that it can provide in integrated circuit (IC) chips and
computer processors. Faster switching, less power, radiation-tolerance,
reduced leakage, and high temperature capability are some of the
benefits that are offered by using SOI-based devices. Very little data,
however, exist on the performance of silicon-on-insulator devices and
circuits under cryogenic temperatures. In this work, the performance of
a Philips UBA2033 SOI full-bridge driver integrated circuit was
evaluated under low temperature and thermal cycling. The investigations
were carried out to establish a baseline on the functionality and to
determine suitability of this device for use in space exploration
missions at cryogenic temperatures. The findings will be disseminated to
mission planners and circuit designers so that proper selection of
electronic parts can be made, and risk assessment can be established for
such devices for use in space missions.

**Test Procedure**

The device investigated in this work comprised of Philips UBA2033
full-bridge driver circuit. It is a high voltage monolithic integrated
circuit that is built using an SOI process. The circuit is designed for
driving metal-oxide semiconductor field-effect transistors (MOSFETs) in
a full-bridge configuration \[1\]. It has an internal adjustable
oscillator, and can be also operated via external oscillator control.
Some of the manufacturer's specifications for this SOI chip are shown in
Table I \[1\]. The driver chip was tested in a circuit constructed to
power a resistive load via MOSFET switches in a full-bridge setup, as
shown in Figure 1. Operation of the chip was investigated as a function
of temperature between -195 °C and +85 °C. Only the driver chip, the
oscillator components (R~osc~ & C~osc~), the filter capacitors (C~i~ &
C~3~), and the bootstrap capacitors (C~1~ & C~2~) were subjected to
temperature variation. The rest of the circuit was placed outside the
environmental test chamber. R~osc~ was a metal film resistor, and all
capacitors were ceramic units. The values of R~osc~ (100 kΩ) and C~osc~
(0.3 nF) were chosen to acquire an oscillation frequency of about 60
kHz. Performance characterization of the SOI driver chip was obtained in
terms of its modulated output signals (GHR, GLR, GHL, and GLL),
commutating frequency (f~com~), supply current (I~s~), and release power
drive voltage (V~DD(rel)~) at specific test temperatures. These
temperatures were +20, 0, -50, -75, -100, -125, -150, -175, -195, and
+85 °C. A LeCroy LT374 Digital Scope was used to measure the switching
frequency and to capture the output waveforms. A temperature rate of
change of 10 °C per minute was used, and a soak time of at least 20
minutes was allowed at every test temperature. Cold-restart capability,
i.e. power switched on while the device was at a temperature of -195 °C,
was also investigated. In addition, the effects of thermal cycling under
a wide temperature range on the operation of this driver chip were
determined. The device was exposed to a total of 12 cycles between -195
°C and +85 °C at a temperature rate of 10 °C/minute. Following the
thermal cycling, measurements were then performed at the test
temperatures of +20, -195, and +85 °C.

Table I. Specifications of Philips UBA2033 Integrated Circuit \[1\].

  -------------------------------------- --------------- -----------------
  **Parameter**                          **Symbol**      **UBA2033TS**

  Low Voltage Supply (V)                 V~DD~           14

  High Voltage Supply (V)                V~HV~           550

  V~DD~ Input Current (mA)               I~i(DD)~        1

  Output Sink Current (mA)               I~o(sink)~      200

  Release Power Drive Voltage (V)        (V~DD(rel)~)    9.0

  Max. Bridge Frequency (kHz)            f~bridge~       100 to 250

  Operating Temperature (°C)             T(oper)         -40 to +150

  Package                                                SSOP28

  Lot Number                                             Hn0408 1Y
  -------------------------------------- --------------- -----------------

![](media/image1.png){width="5.9944444444444445in"
height="3.265972222222222in"}

Figure 1. Schematic of circuit used in the evaluation of UBA2033 IC chip
\[1\].

**Test Results**

*Temperature Effects*

Waveforms of the UBA2033 driver output signals GHR, GLR, GHL, and GLL
obtained at room temperature are shown in Figure 2. These waveforms were
also obtained, as was mentioned earlier, at test temperatures of 0, -50,
-75, -100, -125, -150, -175, -195, and +85 °C. No major change or
distortion was observed in the shape or magnitude of these waveforms as
test temperature was changed throughout the range of -195 °C to +85 °C.
For illustrative purposes, therefore, only those waveforms obtained at
the extreme temperature, i.e. -195 °C and +85 °C, are presented here as
shown in Figures 3 and 4, respectively.

![](media/image2.png){width="4.170138888888889in"
height="2.7597222222222224in"}

Figure 2. Waveforms of UBA2033 output signals GHR, GLR, GHL, and GLL at
+20°C.

![](media/image3.png){width="4.159722222222222in"
height="2.7402777777777776in"}

Figure 3. Waveforms of UBA2033 output signals GHR, GLR, GHL, and GLL at
-195°C.

![](media/image4.png){width="4.1402777777777775in" height="2.7in"}

Figure 4. Waveforms of UBA2033 output signals GHR, GLR, GHL, and GLL at
+85°C.

All of these output waveforms were obtained with the device configured
in an internal oscillator mode, i.e. using R~osc~ & C~osc~ to generate
the required oscillating input frequency, with the low voltage supply
(V~DD~) powered at 11.0V. Measurements obtained on the other properties
of the chip driver at various temperatures are shown in Table II.

Table II. Variation of UBA2033 driver properties with test temperature.

  -------------- -------------- -------------- -------------- --------------
  **Temp. (°C)** **V~DD(rel)~   **I~s~ (mA)**  **f~osc~       **f~com~
                 (V)**                         (kHz)**        (kHz)**

  +20            9.11           2.52           60             29.6

  0              9.12           2.56           59             29.2

  -50            9.11           2.72           59             29.9

  -75            9.11           2.81           60             30.2

  -100           9.11           2.90           60             30.2

  -125           9.80           2.96           60             30.0

  -150           8.90           2.96           59             29.3

  -175           8.67           2.93           57             28.9

  -195           8.68           2.87           55             28.4

  +85            9.11           2.40           57             28.2
  -------------- -------------- -------------- -------------- --------------

It can be seen that the supply current exhibited a gradual but slight
increase with decrease in temperature, and the trend reversed when
temperature was increased to +85 °C. While the release power drive
voltage held a steady value in the temperature range between +20 °C and
-100 °C, it decreased very slightly as temperature was further
decreased. At +85 °C, V~DD(rel)~ regained its room temperature value. As
far as the bridge commutating frequency is concerned, the only apparent
change with temperature was an insignificant decrease at the extreme
temperatures of -175 °C, -195 °C, and +85 °C. It is quite possible that
changes experienced in the values of the oscillator elements (R~osc~ &
C~osc~) at these extreme temperatures would have resulted in reducing
the oscillating frequency and, as a result, a decrease in the bridge
commutating frequency. It should be noted that all of these
temperature-induced changes were minimal and the device performed
extremely well throughout the test temperature range.

*Cold Re-Start*

Cold-restart capability of the Philips UBA2033 chip was investigated by
allowing the device to soak at -195 °C for at least 20 minutes without
the application of electrical bias. Power was then applied to the driver
circuit, and measurements were taken on the output characteristics. The
driver chip was able to successfully cold-restart at -195 °C, and the
results obtained were the same as those obtained earlier at that
temperature.

*Effects of Thermal Cycling*

The effects of thermal cycling under a wide temperature range on the
operation of the Philips UBA2033 driver IC chip were investigated by
subjecting it to a total of 12 cycles between -195 °C and +85 °C at a
temperature rate of 10 °C/minute. Measurements of the investigated
parameters were then taken at +20, -195, and +85 °C. A comparison of the
driver output signals at test temperatures of +20, -195, and +85 °C for
pre- and post-cycling conditions are shown in Figures 5, 6, and 7,
respectively. It can be clearly seen that the post-cycling modulated
outputs at any given test temperature were the same as those obtained
prior to cycling. Similar results were obtained on the release power
drive voltage (V~DD(rel)~), supply current (I~s~), and commutating
frequency (f~com~) characteristics. Table III lists the values of these
parameters that were obtained at +20, -195, and +85 °C for pre- and
post-cycling conditions. It can be clearly seen that these investigated
properties did not experience any change with cycling. Therefore, it can
be concluded that the extreme temperature exposure and the thermal
cycling did not induce much change in the behavior of this
silicon-on-insulator full-bridge driver integrated circuit chip. This
limited thermal cycling also appeared to have no effect on the
structural integrity of this device as no structural deterioration or
packaging damage was observed.

![](media/image2.png){width="3.1979166666666665in"
height="2.1194444444444445in"}

Pre-cycling at +20 °C.

![](media/image5.png){width="3.2243055555555555in" height="2.0875in"}

Post-cycling at +20 °C.

Figure 5. Waveforms of UBA2033 output signals GHR, GLR, GHL, and GLL at
+20°C.

![](media/image3.png){width="3.136111111111111in"
height="2.3756944444444446in"}

Pre-cycling at -195 °C.

![](media/image6.png){width="3.2083333333333335in"
height="2.3743055555555554in"}

Post-cycling at -195 °C.

Figure 6. Waveforms of UBA2033 output signals GHR, GLR, GHL, and GLL at
-195°C.

![](media/image4.png){width="3.175in" height="2.270138888888889in"}

Pre-cycling at +85 °C.

![](media/image7.png){width="3.216666666666667in"
height="2.2708333333333335in"}

Post-cycling at +85 °C.

Figure 7. Waveforms of UBA2033 output signals GHR, GLR, GHL, and GLL at
+85°C.

Table III. Pre- & post-cycling values of release voltage, current, and
frequency.

  ----------- -------------- -------- --------- -------- ----------- -----------
              **V~DD(rel)~            **I~s~             **f~com~    
              (V)**                   (mA)**             (kHz)**     

  **Temp.     Prior          Post     Prior     Post     Prior       Post
  (°C)**                                                             

  +20         9.11           9.11     2.52      2.52     29.6        28.9

  -195        8.68           8.67     2.87      2.90     28.4        28.4

  +85         9.11           9.11     2.40      2.43     28.2        28.3
  ----------- -------------- -------- --------- -------- ----------- -----------

**Conclusions**

The Silicon-On-Insulator (SOI) full-bridge driver integrated circuit,
Philips UBA2033, was evaluated for operation between -195 °C and +85 °C.
The effects of thermal cycling under a wide temperature range on the
operation of this chip and cold-restart capability were also
investigated. The driver circuit was able to maintain good operation
between\
-195 °C and +85 °C with minimal changes in its characteristics. The
limited thermal cycling performed on the device had no effect on its
performance, and the driver chip was able to cold start at -195 °C.
These preliminary results indicate that this SOI-based full- bridge
driver integrated circuit potentially could be used in space exploration
missions under cryogenic environments. Further testing under long-term
cycling is, however, required to fully establish the reliability of such
devices and to determine their suitability for extended use in extreme
temperature environments.

**References**

\[1\]. Philips Semiconductor, "UBA2033 HF Full-bridge Driver IC", Data
Sheet, Product Specification, October 8, 2002.

**Acknowledgements**

This work was performed under the NASA Glenn Research Center GESS
Contract \# NAS3-00145. Funding was provided by the NASA Electronic
Parts and Packaging (NEPP) Program.