![](media/image1.jpeg){width="5.291666666666667in"
height="1.4986111111111111in"}

U.S. ATLAS PROJECT OFFICE

**Physics Department**

**UPTON, NEW YORK 11973**

July 25, 2001

Mr. James Yeck

Department of Energy

Fermi Group

POB 2000

Batavia, IL 60510

Dr. Thomas Kirk

Associate Laboratory Director

Brookhaven National Laboratory

Upton, NY 11973

SUBJECT: U.S. ATLAS Project Monthly Status Report for May 2001

Dear Sirs:

Attached please find Monthly Status Report No. 39 for the U.S. ATLAS
Project.

Sincerely yours,

William J. Willis

U.S. ATLAS Project Manager

[Distribution]{.underline}:

Abolins, M.

Alam, S.

Baker, K.

Barnett, M.

Bensinger, J.

Blair, R.

Butehorn, C.

Carolan, P. - DOE

Cleland, W.

Crawford, G.

Cullen, J. -- PAP

De, K.

Dodd, J.

Ernst, R.

Errede, S.

Feldman, G.

Gilchriese, M.

Goldberg, M. - NSF

Gordon, H.

Firestone, A. - NSF

Harrison, M. -- PAP

Hinchliffe, I.

Huth, J.

Kagan, H.

Kane, S.

Kirby, D.

Kirk, T.

Lankford, A.

Larsen, R. - PAP

Lissauer, D.

Lubatti, H.

Mantsch, P. - PAP

Murtagh, M.

Neal, H.

Norton, S.

Ogren, H.

Oh, S.

Parsons, J.

Pilcher, J.

Polychronakos, V.

Premisler, L.

Price, L.

Rijssenbeek, M.

Ritchie, J., DOE

Rutherfoord, J.

Seiden, A.

Seidel, S.

Siegrist, J.

Sikinger, P.

Sinkular, M., NSF

Skubic, P.

Slattery, P.

Sliwa, K.

Sondericker, J.

Stroynowski, R.

Taylor, F.

Toohig, T., DOE

Tuts, M. -- PAP

Whitaker, S.

Wolbers, S. - PAP

Williams, H.

Willis, W.

Wu, S.L.

Yeck, J.

![](media/image2.wmf){width="3.3895833333333334in" height="4.0in"}

**PROJECT STATUS REPORT No. 39**

**REPORTING PERIOD**

**May 2001**

**TABLE OF CONTENTS**

[Page]{.underline}

1.  Project Objective 1

2.  Technical Approach Changes 2

3.  Project Manager's Summary 2

4.  Technical Progress --subsystem managers' summaries 3

5.  Open Items between DOE/NSF and U.S. ATLAS 7

6.  Summary Assessment and Forecast 7

> 1\. Financial Status 7
>
> 2\. Schedule Status 7
>
> 3\. Baseline Change Proposals 7
>
> Table 6-1 - Summary Cost Estimate 8
>
> Figure 6-1 - Project System Network 9

7.  Funding 10

> Table 7.1 - Summary of Funds Authorized & Total Costs and Commitments
> to Date 10
>
> Table 7.2 - FY 2001 Funds -- U.S. ATLAS Summary by Institution and
> Subsystem 11

8.  Performance Analysis 12

9.  Figure 9-1 - Budget Authority, Costs and Obligations 15

10. Table 10-1 - Cost Schedule Status Report by WBS 16

11. Figure 11-1 - Milestone Schedule Status Report 17

Figure 11-2 - Line of Balance Chart 18

12. Table 12-1 - Milestone Log 19

13. NSF COST SCHEDULE STATUS REPORT 24

> Table 13 -- Cost Schedule Status Report 26

14\. DETAILED TECHNICAL PROGRESS REPORTS 27

> WBS 1.1 Silicon 27
>
> WBS 1.2 TRT 47
>
> WBS 1.3 LAr 59
>
> WBS 1.4 Tile 75
>
> WBS 1.5 Muon 81
>
> WBS 1.6 Trigger/DAQ 101

# 1. PROJECT OBJECTIVE

The U.S. ATLAS Project consists of the activities to design, supply,
install and commission the U.S. portion of the ATLAS detector. The
detector will become part of the Large Hadron Collider (LHC) at CERN,
the European Laboratory for Particle Physics. The ATLAS detector is
being designed to understand the dynamics of electroweak symmetry
breaking. The U.S. ATLAS collaboration is funded jointly by the U.S.
Department of Energy and the National Science Foundation.

The fundamental unanswered problem of elementary particle physics
relates to the understanding of the mechanism that generates the masses
of the W and Z gauge bosons and of quarks and leptons. To attack this
problem, one requires an experiment that can produce a large rate of
particle collisions of very high energy. The LHC will collide protons
against protons every 25 ns with a center-of-mass energy of 14 TeV and a
design luminosity of 10^34^ cm^-2^ s^-1^. It will probably require a few
years after turn-on to reach the full design luminosity.

The detector will have to be capable of reconstructing the interesting
final states. It must be designed to fully utilize the high luminosity
so that detailed studies of rare phenomena can be carried out. While the
primary goal of the experiment is to determine the mechanism of
electroweak symmetry breaking via the detection of Higgs bosons,
supersymmetric particles or structure in the WW scattering amplitude,
the new energy regime will also offer the opportunity to probe for quark
substructure or discover new exotic particles. The detector must be
sufficiently versatile to detect and identify the final state products
of these processes. In particular, it must be capable of reconstructing
the momenta and directions of quarks (hadronic jets, tagged by their
flavors where possible), electrons, muons, taus, and photons, and be
sensitive to energy carried off by weakly interacting particles such as
neutrinos that cannot be directly detected. The ATLAS detector will have
all of these capabilities.

The ATLAS detector is expected to operate for twenty or more years at
the CERN LHC, observing collisions of protons, and recording more than
10^7^ events per year. The critical objectives to achieve these goals
are:

-   Excellent photon and electron identification capability, as well as
    energy and directional resolution.

-   Efficient charged particle track reconstruction and good momentum
    resolution.

-   Excellent muon identification capability and momentum resolution.

-   Well-understood trigger system to go from 1 GHz raw interaction rate
    to \~100 Hz readout rate without loss of interesting signals.

-   Hermetic calorimetry coverage to allow accurate measurement of
    direction and magnitude of energy flow, and excellent reconstruction
    of missing transverse momentum.

-   Efficient tagging of b-decays and b-jets.

The U.S. ATLAS cost objective is \$163.75M while supplying initially the
work scope described in Appendix 3 of the Project Management Plan (PMP)
and, if possible, all the goals described in Appendix 2 of the PMP.

The ATLAS project was initiated in FY 1996, and is scheduled for a
10-year design and fabrication period beginning in the first quarter of
FY 1996, and finishing in FY 2005. This period will be followed by
operation at the LHC.

# 2. TECHNICAL APPROACH CHANGES

No change.

# 3. PROJECT MANAGER'S SUMMARY ASSESSMENT -- W. Willis

**Attention should be paid to two important points in this Report, both
found in the report for the Liquid Argon Calorimeter, WBS 1.3.**

**This detector comprises a very large number of fast, high
dynamic-range read out channels. The front-end electronics for this
system are buried deep inside the detector, leading to complex
arrangements for access, cooling and inside a region subject to high
radiation fields. The U.S. has assumed the primary responsibility for
designing and producing this system, as the result of a process in ATLAS
that concluded that the U.S. team was best qualified for this difficult
task. In order to accumulate sufficient resources to carry out the
production and testing of the system, a number of funding entities were
required to cooperate in sharing the expenses. It was important, in the
view of U.S. Management, to retain technical and managerial control over
this task while assembling the required funds. This required a long
effort on the part of the physicist representatives with the essential
mediation of the Electronics Coordinator for Liquid Argon, Bill Cleland,
and the former and present ATLAS Financial Coordinators, Peter Schmid
and Marcus Nordberg. This effort led to a final agreement in May.
Leadership on the part of the CERN group, in providing the last
increment of funding that allowed the Agreement to be completed, is
gratefully acknowledged. The Agreement is just in time to allow the
production to proceed, under conditions that should permit a smooth
operation.**

**There is bad news connected with the same area of LAr Calorimeter
readout. There are many electronic systems in the four LHC experiments
that are exposed to radiation, and need a voltage regulator which will
survive in the radiation field. It has long been known that the standard
industrial devices will not survive in the radiation environment. For
this reason, and to avoid the cost of duplicate efforts in the
experiments, CERN took the initiative to establish a common effort with
a major European vendor to develop devices that would be available to
all the experiments. The LA Calorimeter in ATLAS is, we believe, the
largest user. The initiative of CERN to avoid duplication is surely
commendable, but it has introduced a correlated problem across the
board. The CERN Directorate has taken an interest in this problem, and
the Research Director has been in contact the leadership of the vendor,
who promise that the required part will be delivered as soon as
possible. Nevertheless, there will be a substantial delay due to the
late availability of the regulators. Testing is proceeding with
radiation-soft devices, and the new schedule will be fixed when the
regulator delivery is known, but a few months delay is likely.**

#  

# 4. technical progress - subsystem mangers' summaries

**1.1 Subsystem Manager\'s Summary** **Murdock Gilchriese (Lawrence
Berkeley Lab.)**

1.1.1 Pixels

Overall the work in most areas of the pixel system is proceeding as
planned. First results on a 0.25-micron analog test chip are encouraging
and this process appears to be both very rad-hard and predictable
(measurements agree with simulations). However, some risks for delay
(1-2 months) are starting to appear in some elements of the mechanics,
the front-end IC and flex hybrids. It is likely there will be at least a
one month delay in the submission of the first major engineering run
that will include the four custom ICs needed for the pixel system, and
this remains the critical path item.

1.1.2 Silicon Strip System

Preparations for the SCT ASIC PRR in July continued in May. The wafer
probing system is now operational at Santa Cruz and CERN (but limited by
lack of access to a dedicated probe station) and nearly operational at
RAL. Analysis of test data still must be done at CERN, but there is
progress in providing access to the rather complicated analysis code
that determines the yield.

The SCT barrel module FDR was completed in May. Preproduction orders for
hybrids (Japan) and baseboards (UK/CERN) will be now be placed. Detector
fabrication is already in progress.

Considerable progress was made to resolve software problems with the
module assembly system at LBNL. A few days trip to RAL was required to
understand these problems and to be updated on tooling design.

1.1.3 ReadOut Drivers

The prototype ROD has now been debugged enough to schedule an
integration test at Cambridge with the Back-of-Crate Card and the Timing
Interface Module. This will occur at the end of June into early July.
This is a major milestone for the RODs.

**1.2 Subsystem Manager\'s Summary** **Harold Ogren (Indiana
University)**

1.2.1 Mechanics

Component systems continued in production during May. We completed the
certification of assembly processes. All aspects of production were
restarted by the middle of May. Most of the assembly processes at Duke
and Indiana are now compatible if not identical, and the entire
production flow is standardized to a set of unified procedures.

Four modules are completed at Indiana, six modules completed at Duke,
and eight modules in production. Gain tests on three type 2 modules have
been carried out at Duke, and one type 1 module from Indiana will soon
start gain tests at Duke. Module 2.1 is at University of Pennsylvania
for systems tests and module 1.01 at Dubna undergoing a reactor test.

1.2.5 Electronics

The final engineering run of ASDBLR and DTMROC wafers were due back in
June, however, at the end of May we were informed by TEMIC that the
ASDBLR/DTMROC processing run submitted on 15 January had had significant
processing problems - leading to the certain loss of at least 25% of
each wafer (one quadrant). We have arranged for some of the chips to be
packaged to see if any of the chips are recoverable. TEMIC is starting
more wafers through the line, but have not yet given us a ship date for
the backup processing.

We have made good progress with Signetics on defining a custom FBGA
package for the ASDBLR (DTMROC to follow). An FBGA package would be
small enough to fit on the barrel stamp boards, thus obviating the need
for wire bonding (Chip On Board) to the board and, in addition would be
a lower mass, lower inductance, lower capacitance solution for the End
Cap. The goal here is to have a design and tooling ready for delivery of
the DMILL wafers - now more plausible given the TEMIC problems.

Additional stamp boards have been bonded at Lund and are now being
tested at Penn. Lund is also working on a non- chip on board design
based upon getting silicon in smaller packages.

**1.3 Subsystem Manager\'s Summary** **Richard Stroynowski (Southern
Methodist University)**

Good progress on cryostat and feedthroughs: The cryostat is on its way
to CERN: It is transported via ship to Rotterdam, on barge along Rhine
to Strassbourg and then on truck to Geneva. Its arrival at CERN is
expected at the end of June and the start of acceptance tests is planned
for July.

Feedthrough production continues at a good pace. Mechanical components
of HV feedthroughs are completed and there are 18 completed and ready to
ship signal FT. Pin carrier production rate continues to be higher than
needed.

Preparations for the FT installation have started. In order to protect
HV cables, a decision was made to install HV ports first, followed by
signal FT installation and finally to install HV cables last.

The award of the contract for cryogenics components was delayed because
the bids came higher than expected. Negotiations continue.

The protracted discussion on the re-alignment of the responsibilities
for the FEB production and purchase of its components has been finally
concluded. In the new scheme, US groups will be fully responsible for
the production and assembly of the FEB boards excluding several of the
radiation tolerant chips, SCAs, voltage regulators and 50% of ADCs. A
loan covering missing funds for the SCA will be extended by CERN. There
is no change in the overall US financial obligations, and there is a
much simpler matrix of responsibilities.

The technical progress on the Front-End electronics remains an area of
concern. On the positive side - the preamps and layer sum boards
production is proceeding well and the prototypes of 5 out of 7 radiation
tolerant digital chips have been delivered and successfully tested. The
tests of the 1/4 FEB are expected to be on schedule. However, additional
delays have been incurred by the failure of the radiation tolerant
voltage regulators developed under CERN guidance. A search for alternate
solutions has started, but a delay in completion of the overall design
of the board is expected. Another unresolved problem is the
identification of radiation tolerant power supplies. Here, the main
problem lies in keeping the cost of acceptable technical solutions to be
within allocated budget.

There is steady progress in the motherboards production with 5 sets sent
already to France. The contract for baseplane production has been
awarded.

The production of the FCAL-C module (both mechanical and cold
electronics) proceeds ahead of recent expectations.

**1.4 Subsystem Manager\'s Summary** **Lawrence Price (Argonne National
Lab.)**

Submodule production was completed at the University of Chicago, with a
total of 194 submodules constructed. Other submodule and module
production continues on schedule. A design for the extended barrel
support saddle has been completed and sent to ATLAS Technical
Coordination for evaluation. Iteration of the structural analysis is
continuing. Checks have so far verified the result that stresses and
deflections of the saddles are within acceptable limits. Instrumentation
work is proceeding well. It is not quite as routine as the mechanical
production because of the variability of scintillator light output and
fiber transmission, plus the possibility of fiber misalignment. PMT
testing also continues well, but some delays have been encountered in
receiving PMT batches and the frid of reference tubes. 3-in-1 card
production is complete and burn-in and testing is approaching the 50%
point. Volume deliveries of the motherboards will begin in June. ITC
production is on schedule.

**1.5 Subsystem Manager\'s Summary** **Frank Taylor (MIT)**

Work continued on the ATLAS endcap muon system during May with a
Production Advancement Review (PAR), a review of the big wheel design at
CERN, chamber and alignment parts production and mechanical and
electrical engineering of critical items.

The PAR was held at Harvard University May 4-5. Presentations were given
on all aspects of the ATLAS Endcap system - with an emphasis on the MDT
chamber construction, services and electronics. The results of the
review are given in ATC-RM-ER-0013. The reviewers noted good progress on
the production of bare MDT chambers at the three U.S. MDT production
sites and gave strong encouragement to accelerate the production and
installation of chamber services (gas manifolds, Faraday cages,
electronics, etc.). A number of findings were recorded and seven general
action items noted - most to be answered by September 2001.

The Big Wheel Final Design Review (Part 1) was held at CERN May 14,
2001. Bensinger, Coco, Daly, Mulhall and Polychronakos attended. The
summary comments of Coco are:

\"The overall impression of the material presented at the ATLAS Big
Wheel Final Design Review 1 (FDR1) is very positive. The time and focus
on details of the big wheel design were in evidence. It was reported
that a comparison between the FEA analysis results completed by the
VNIITF design team and CERN engineering agreed to \~10% which gives a
level of confidence on the results reported.

The design team from VNIITF accomplished much in the four months since
the redesign of the Big Wheel structure was initiated at CERN. In no
small way this positive result can be attributed to the fact that the
team was physically located at CERN during this period. This provided
them with the necessary support of CERN engineering and the ability to
discuss and quickly solve design problems as they were discovered.

It is strongly recommended that this same working relationship, (with)
the (design) team based at CERN, continue during the next phase of the
engineering effort which will lead to the Final Design Review 2 (FDR2)
tentatively scheduled for September 01.\"

MDT base chamber production continued on schedule at each production
site. Of special note is the completion of the entire EML2 base chamber
series (all 16 modules) at Seattle. This is a significant milestone and
was achieved ahead of schedule. Both BMC and Michigan sites completed
their Modules 15 on schedule. Preparations were started for the next
chamber series at each site. For example, tube production was started
for EIS1 - the next chamber series for the BMC. Retooling of the tube
production setups at Michigan and Seattle was started. Wellenstein and
his engineering staff (Brandeis) worked closely with Marin (Boston),
Hurst and Haggerty (Harvard) to prepare the tooling for the EIS1 BMC
series 2 tooling. And the chamber teams at Michigan (Zhou, et al.) and
Seattle (Mocket, et al.) worked closely with Wellenstein et al. on their
chamber tooling.

MDT parts procurement and mechanical engineering focused on the next
chamber series production cycle. Fries (Harvard) continued to track the
procurement of critical path items and was able to always supply the
U.S. sites with enough tubes, endplugs and associated parts to keep the
U.S. tube/chamber production on schedule. Wang and Daly (Seattle)
finished all the assembly drawings for the spacer frames of the next 3
chamber series. Coco, Marzocchi (MIT) and Kelrikh (Harvard) worked on
the gas, Faraday cage designs and chamber assembly drawings.

A critical MDT electronics milestone was achieved in May. The EIL1
module 0 was fully instrumented with electronics and studied with cosmic
rays yielding 81-micron resolution (2 to 14 mm tube radius), 97%
efficiency with a threshold set at 20 electrons. The work was performed
by a collaboration of Harvard (Guimaraes, Oliver, Brandenburg, et al.),
Boston (Ahlen, Ide, Sherman, Hazen) and Michigan (Chapman and team) and
coordinated by Ahlen using the BMC cosmic setup. In addition, Chapman et
al. continued to develop the MDT Chamber Service Module (CSM) into a
less expensive and more efficient design.

Good progress was made on Detector Control System (DCS) at Seattle.
Rothberg continued to develop the controls readout that uses PVASS -
utilizing DIM connectivity protocol.

The CSC factory at BNL is ramping up for series production. Module 0 is
complete. The QA rigs for cathode flatness and for wire tension are
operational.

CSC electronics work concentrated on modifying the IC50 preamp/shaper
design for improved yield and enhanced operation characteristics at BNL
(O\'Connor). The Sparsifier Processing Unit coding advanced at UC-Irvine
(Stoker, Langford, et al.).

Effort continued on the alignment system at Brandeis (Bensinger, Hashemi
et al.). Preparations for the next round of chamber production, the big
wheel review, H8, responding to TC questions and developing the layout
of the polar lines with the new big wheel location (moved back by 399
mm) were made. In addition work continued on the design of the
multipoint system (BCAM), alignment bars, proximity monitors and inplane
MDT monitors.

**1.6 Subsystem Manager\'s Summary** **Robert Blair (Argonne National
Lab.)**

This month\'s TDAQ activity included refining the Users Requirement
Documents for various components of the TDAQ system in preparation for
review at the July TDAQ workshop at CERN. The evaluation of Athena as a
Level 2 framework has proceeded and initial performance measurements
have been redone with improved results. Work on ROD/ROS and TTC readout
has progressed.

#  

# 5. Open Items between DOE/NSF and U.S. ATLAS

a)  [Financial]{.underline}: There is \$3,377,000 of available funding
    residing in management reserve and \$9,590,000 of undistributed
    budget pending approval and implementation of MOU documents.
    Table7-2 contains the summary of FY01 funds distribution. There was
    \$4,255,000 requested in additional funding allocations during May.

```{=html}
<!-- -->
```
a)  [Schedule]{.underline}: None.

```{=html}
<!-- -->
```
c)  [Technical]{.underline}: None.

**6. Summary Assessment and Forecast**

1\. [Financial Status]{.underline}

A total of \$96,288,000 (58.8%) was authorized, held in reserve or
identified as undistributed budget of the \$163.75M Total Project Cost
Objective. The details of the overall project cost objective are
presented in Table 6-1 reproduced overleaf from the U.S. ATLAS Project
Plan as approved on 3/18/98 and revised to include cost changes approved
through BCP #46.

The details of the reported costs and reported obligations are presented
in the Table 7-1 in Section 7 of this report. In addition Table7-2 shows
the cost breakdown by institution and funding source.

The relationship between budget authority/cost/obligations (including an
estimate of other accrued costs and obligations) is presented in Figure
9-1 in Section 9 of this report.

The level 2 CSSR statistics are presented in section 10. Performance
analysis is included for major subsystems in section 8 of this report.

2\. [Schedule Status]{.underline}

See details in Figure 11-1.

The overall schedule status report is found in section 11.

The milestone log from the PMP, including revised forecast dates, is
reproduced as section 12.

3\. [Baseline Change Proposals]{.underline}

Forty-seven BCPs were received through May 2001. Forty-four BCP's were
approved, two were withdrawn and one is pending approval.

Table 6-1 reflects all cost BCPs through 46.

**Table 6-1: Summary Cost Estimate**

![](media/image3.png){width="4.853472222222222in"
height="7.561805555555556in"}

**Figure 6-1 - Project System Network**

![](media/image4.wmf)

**Funding**

**Table 7.1 - Summary of Funds Authorized & Total Costs and Commitments
to Date**

![](media/image5.png){width="5.997916666666667in"
height="5.683333333333334in"}

![](media/image6.png){width="8.93125in"
height="5.944444444444445in"}**Table 7.2 -- FY01 Funds -- U.S. ATLAS
Summary by Institution and Subsystem**

# 8. Performance Analysis

Status through the month of May 2001 reflects the new baseline schedules
for all subsystems. The re-baseline date was established on October 1,
2000 and the Estimate to Complete 01 (ETC 01) was defined as all tasks
and resources required to complete the project. All prior efforts were
equated to the actual costs expended. The schedules are resource loaded
to the baseline funding of \$163,750K with Contingency, Management
Contingency, and Items Outside of the Approved Baseline shown on
separate lines and excludes all NSF R&D funds.

The CSSR in section 10 shows \$62,041.3k of the work has been performed,
which represents approximately 49.2% of the work authorized to date.
There is an unfavorable schedule variance of (\$792.0k) or 1.3% behind
the plan. There is an unfavorable cost variance of (\$123.8k) or 0.2%
over spent for the work accomplished. There are outstanding commitments
of \$7,422.9k at this time that do not show up in the performance. This
analysis will provide a breakdown of these variances into the individual
subsystems and identify the specific tasks that cause these variances.

## WBS 1.1 Silicon

## Summary

The CSSR shows that \$8,333.0k of the work has been completed which
represents 46.9% of the total effort for the Silicon subsystem. There is
an unfavorable schedule variance of (\$271.2k) or 3.2% behind the plan
and an unfavorable cost variance of (\$61.1k) or 0.7% over spent for the
work accomplished. There are outstanding commitments of \$90.4k at this
time that do not show up in the performance.

## 

## Schedule Variance

The unfavorable schedule variance is concentrated in the following WBS
level 3 elements:

WBS 1.1.2 Silicon Strip System SV = (\$45.5k)

-   Hybrids/Cables/Fanouts are behind plan (\$15.3k)

-   Module Assembly and Test is behind plan (\$30.2k)

WBS 1.1.3 RODs SV = (\$225.7k)

-   Design ROD Cards is behind plan (\$16.9k)

-   ROD Test Stand is behind plan (\$63.5k)

-   ROD Prototypes is behind plan (\$51.2k)

-   ROD Prototype Evaluation is behind plan (\$12.6k)

-   ROD Production Model is behind plan (\$79.4k)

-   ROD Fabrication is behind plan (\$2.0k)

## 

## Cost Variance

There is a unfavorable cost variance of (\$61.1k) which is distributed
as follows: Pixel (\$238.6k), the Silicon Strip System \$254.3k and the
ROD Design and Fabrication (\$76.7k).

# 

# WBS 1.2 TRT

## Summary

The CSSR shows that \$4,815.5k of the work has been completed which
represents 52.4% of the total effort for the TRT subsystem. There is an
unfavorable schedule variance of (\$216.1k) or 4.3% behind the plan and
a favorable cost variance of \$12.3k or 0.3% under spent for the work
accomplished. There are outstanding commitments of \$1,077.1k at this
time that do not show up in the performance.

## Schedule Variance

The unfavorable schedule variance is concentrated in the following WBS
level 3 elements

WBS 1.2.1 Barrel Mechanics SV = (\$211.1k)

-   Detector Elements are behind plan (\$23.5k)

-   Component Assembly is behind plan (\$81.9k)

-   Module Assembly #2 (Duke) is behind plan (\$44.1k)

-   Module Assembly #1 (IU) is behind plan (\$61.6k)

## 

## WBS 1.3 LAr

## Summary

The CSSR shows that \$19,595.4k of the work has been completed which
represents 46.5% of the total effort for the LAr subsystem. There is an
unfavorable schedule variance of (\$110.8k) or 0.6% behind the plan and
a favorable cost variance of \$409.0k or 2.1% under spent for the work
accomplished. There are outstanding commitments of \$4,426.1k at this
time that do not show up in the performance.

## 

## Schedule Variance

The unfavorable schedule variance is concentrated in the following WBS
level 3 elements:

1.3.7 Front End Board SV = (\$1.3k)

1.3.10 Forward Calorimeter SV = (\$93.2k)

-   FCAL1 Module Production is behind plan (\$36.4k)

-   FCAL Electronics Design and Prototype are behind plan (\$15.9k) and
    (\$30.8k) respectively

-   FCAL Production is behind plan (\$10.0k)

## 

## Cost Variance

# The favorable cost variance of \$409.0k is a combination of positive and negative variances concentrated in the following WBS Level 3 elements.

-   131 Barrel Cryostat CV = \$364.0k

-   132 Feedthroughs CV = \$15.7k

-   133 Cryogenics CV = (\$40.4k)

-   134 Readout Electrodes/MB CV = (\$32.7k)

-   136 System Crate Integration CV = \$1.6k

-   137 Front End Board CV = (\$35.4k)

-   139 ROD System CV = \$105.2k

-   1310 FCAL CV = \$22.9k

## WBS 1.4 Tile

## Summary

The CSSR shows that \$6,904.9k of the work has been completed which
represents 75.5% of the total effort for the Tile subsystem. There is an
unfavorable schedule variance of (\$106.7k) or 1.5% behind the plan and
a favorable cost variance of \$7.1k or 0.1% under spent for the work
accomplished. There are outstanding commitments of \$131.3k at this time
that do not show up in the performance.

## 

## Cost Variance

# There is a favorable cost variance of \$7.1k which is distributed as follows:

-   141 EB Mechanics (\$44.0k)

-   142 EB Optics (\$39.0k)

-   143 Readout \$126.3k

-   144 ITC (\$36.1k)

## WBS 1.5 Muon

## Summary

The CSSR shows that \$11,589.6k of the work has been completed which
represents 43.9% of the total effort for the Muon subsystem. There is an
unfavorable schedule variance of (\$50.4k) or 0.4% behind the plan and
an unfavorable cost variance of (\$432.0k) or 3.7% over spent for the
work accomplished. There are outstanding commitments of \$1,698.0k at
this time that do not show up in the performance.

## 

## Schedule Variance

The unfavorable schedule variance is concentrated in the following WBS
level 3 elements:

1.5.8 MDT Supports SV = (\$31.3k)

-   Chamber Mount Struts Design is behind plan (\$13.5k)

```{=html}
<!-- -->
```
-   Integration with Support Structure Design is behind plan (\$17.8k)

## Cost Variance

The unfavorable cost variance of (\$432.0k) is a combination of positive
and negative variances concentrated in the following WBS Level 3
elements.

-   154 CSC Chambers CV = (\$221.3k)

-   157 MDT Chambers CV = (\$90.7k)

-   158 MDT Supports CV = (\$23.1k)

-   159 MDT Electronics CV = \$41.9k

-   1511 CSC Electronics CV = (\$43.6k)

-   1512 Global Align System CV = (\$95.2k)

## WBS 1.6 Trigger/DAQ

## Summary

The CSSR shows that \$1,484.5k of the work has been completed which
represents 47.6% of the total effort for the Trigger/DAQ subsystem.
There is an unfavorable schedule variance of (\$36.8k) or 2.4% behind
the plan and an unfavorable cost variance of (\$59.0k) or 4.0% over
spent for the work accomplished. There is an unfavorable cost variance
of (\$116.0k) for the Level 2 Supervisor but this is offset by a
favorable cost variance of 71.4k for the Level 2 Calorimeter Trigger.
There are no outstanding commitments at this time.

# 9. Budget Authority Costs and Obligations

![](media/image7.png){width="8.68125in" height="5.511111111111111in"}

# 10. WBS -- Cost Schedule Status Report

![](media/image8.png){width="8.18125in" height="5.229166666666667in"}

# Figure 11-1 - Milestone Schedule Status Report

![](media/image9.wmf){width="9.05625in" height="5.990277777777778in"}

# ![](media/image10.wmf){width="5.999305555555556in" height="7.865277777777778in"}  {#section-10 .unnumbered}

# 12. MILESTONE LOG

**The milestones have been updated with the new ETC 01 baseline dates.**

U.S. ATLAS Major Project Milestones (Level 1)

  ------------------- ----------------- ----------------- ----------------
  Description         Baseline Schedule Forecast (F) Date Actual (A) Date

  Project Start       01-Oct-95         01-Oct-95 (F)     01-Oct-95 (A)

  Project Completion  30-Sep-05         30-Sep-05 (F)     
  ------------------- ----------------- ----------------- ----------------

**U.S. ATLAS Major Project Milestones (Level 2)**

  ------------------------------------------------------------------------------------------
  **Subsystem**    **Schedule     **Description**                 **Baseline   **Forecast
                   Designator**                                   Schedule**   (F) / Actual
                                                                               (A) Date**
  ---------------- -------------- ------------------------------- ------------ -------------
                                                                               

  **Silicon        SIL L2/1       Start Full Silicon Strip        06-Jul-01    **15-Jul-01
  (1.1)**                         Electronics Production                       (F)**

                   SIL L2/2       Start Full Strip Module         07-Jan-02    07-Jan-02 (F)
                                  Production                                   

                   SIL L2/3       ROD Design Complete             01-Oct-01    01-Oct-01 (F)

                   SIL L2/4       Complete Shipment of Silicon    13-Oct-03    13-Oct-03 (F)
                                  Strip Module Production                      

                   SIL L2/5       ROD Production/Testing Complete 24-Jun-03    24-Jun-03 (F)

                   SIL L2/6       Pixels 1^st^ IBM Prototype      26-Jul-01    26-Jul-01 (F)
                                  Submitted                                    

                   SIL L2/7       Pixels Start IBM Production     13-Mar-03    13-Mar-03 (F)

                   SIL L2/8       Pixels Start IBM Outer Bare     22-Oct-03    22-Oct-03 (F)
                                  Module Prod                                  

                   SIL L2/9       Pixels Disk System at CERN      13-Oct-04    13-Oct-04 (F)

                                                                               

  **TRT (1.2)**                                                                

  **Mechanical**   TRT L2/1       Final Design Complete           31-Dec-98    07-Dec-98 (A)

                   TRT L2/2       Module Production Complete (CUM 31-Mar-03    31-Mar-03 (F)
                                  102)                                         

                   TRT L2/3       Barrel Construction Complete    16-Sep-03    16-Sep-03 (F)

                                                                               

  **Electrical**   TRT L2/4       Select Final Elec Design        15-Jun-01    30-Aug-00 (A)

                   TRT L2/5       Start Production of ASICS       18-Jan-02    18-Jan-02 (F)

                   TRT L2/6       Installation Complete           04-Jan-05    04-Jan-05 (F)

                                                                               

  **LAr Cal**      LAr L2/1       Cryostat Contract Award         24-Jul-98    05-Aug-98 (A)

  **(1.3)**        LAr L2/2       Barrel Feedthroughs Final       30-Sep-98    02-Oct-98 (A)
                                  Design Review                                

                   LAr L2/3       Start Electronics Production    30-Jun-00    30-Jun-00
                                  (Preamps)                                    (A**)**

                   LAr L2/4       FCAL Mechanical Design Complete 14-Dec-98    15-Dec-99 (A)

                   LAr L2/5       FEB SCA Prod. Chip              19-Jul-01    **01-Oct-01
                                  Submission/Contract Award                    (F)**

                   LAr L2/6       Level 1 Trigger Final Design    04-Oct-01    04-Oct-01 (F)
                                  Complete                                     

                   LAr L2/7       ROD Final Design Complete       12-Dec-02    12-Dec-02 (F)

                   LAr L2/8       Motherboard System Production   30-Jun-02    30-Jun-02 (F)
                                  Complete                                     

                   LAr L2/9       Cryostat Arrives at CERN        15-May-01    **02-Jul-01
                                                                               (F)**

                   LAr L2/10      Barrel Feedthroughs Production  15-Feb-02    15-Feb-02 (F)
                                  Complete                                     

                   LAr L2/11      FCAL-C Delivered to EC          17-Oct-02    17-Oct-02 (F)

                   LAr L2/12      FCAL-A Delivered to EC          08-Dec-03    08-Dec-03 (F)

                                                                               
  ------------------------------------------------------------------------------------------

**U.S. ATLAS Major Project Milestones (Level 2) (Continued)**

+--------+--------+-------------------------------+-------+----------+
| *      | **Sc   | **Description**               | **Bas | **       |
| *Subsy | hedule |                               | eline | Forecast |
| stem** | Design |                               | Sched | (F) /    |
|        | ator** |                               | ule** | Actual   |
|        |        |                               |       | (A)      |
|        |        |                               |       | Date**   |
+========+========+===============================+=======+==========+
| **Tile | Tile   | Start Submodule Procurement   | 01-S  | 0        |
| Cal**  | L2/1   |                               | ep-97 | 1-Sep-97 |
|        |        |                               |       | (A)      |
+--------+--------+-------------------------------+-------+----------+
| **(    | Tile   | Technology Choice for F/E     | 15-N  | 1        |
| 1.4)** | L2/2   | Electronics                   | ov-97 | 5-Nov-97 |
|        |        |                               |       | (A)      |
+--------+--------+-------------------------------+-------+----------+
|        | Tile   | Start Module Construction     | 01-M  | 2        |
|        | L2/3   |                               | ay-99 | 0-Sep-99 |
|        |        |                               |       | (A)      |
+--------+--------+-------------------------------+-------+----------+
|        | Tile   | Start Production of           | 01-A  | 3        |
|        | L2/4   | Motherboards                  | pr-01 | 0-Mar-01 |
|        |        |                               |       | (A**)**  |
+--------+--------+-------------------------------+-------+----------+
|        | Tile   | All Electronic Components     | 01-O  | 0        |
|        | L2/5   | Delivered to CERN             | ct-02 | 1-Oct-02 |
|        |        |                               |       | (F)      |
+--------+--------+-------------------------------+-------+----------+
|        | Tile   | Module Construction Complete  | 30-Se | 3        |
|        | L2/6   |                               | pt-02 | 0-Sep-02 |
|        |        |                               |       | (F)      |
+--------+--------+-------------------------------+-------+----------+
|        | Tile   | All Modules Delivered to CERN | 02-D  | 0        |
|        | L2/7   |                               | ec-02 | 2-Dec-02 |
|        |        |                               |       | (F)      |
+--------+--------+-------------------------------+-------+----------+
|        |        |                               |       |          |
+--------+--------+-------------------------------+-------+----------+
| **Muon | Muon   | Start MDT Chambers Lines 1    | 17-J  | 1        |
| (      | L2/1   | and 3                         | ul-00 | 5-Sep-00 |
| 1.5)** |        |                               |       | (A)      |
+--------+--------+-------------------------------+-------+----------+
|        | Muon   | Start CSC Chamber Production  | 01-S  | 0        |
|        | L2/2   |                               | ep-01 | 1-Sep-01 |
|        |        |                               |       | (F)      |
+--------+--------+-------------------------------+-------+----------+
|        | Muon   | MDT Electronics ASD PRR       | 19-O  | 0        |
|        | L2/3   |                               | ct-01 | 1-Oct-01 |
|        |        |                               |       | (F)      |
+--------+--------+-------------------------------+-------+----------+
|        | Muon   | Final Design of Global        | 01-A  | 0        |
|        | L2/4   | Alignment Devices Complete    | pr-02 | 1-Apr-02 |
|        |        |                               |       | (F)      |
+--------+--------+-------------------------------+-------+----------+
|        | Muon   | CSC IC Production Complete    | 15-M  | 1        |
|        | L2/5   |                               | ay-02 | 5-May-02 |
|        |        |                               |       | (F)      |
+--------+--------+-------------------------------+-------+----------+
|        | Muon   | Kinematic Mount Design        | 30-J  | 3        |
|        | L2/6   | Complete                      | an-01 | 0-Jan-01 |
|        |        |                               |       | (A)      |
+--------+--------+-------------------------------+-------+----------+
|        | Muon   | MDT Chambers (U.S.)           | 27-A  | 1        |
|        | L2/7   | Production Complete           | ug-04 | 4-Sep-04 |
|        |        |                               |       | (F)      |
+--------+--------+-------------------------------+-------+----------+
|        | Muon   | Kinematic Mount Production    | 24-M  | 2        |
|        | L2/8   | Complete                      | ay-04 | 4-May-04 |
|        |        |                               |       | (F)      |
+--------+--------+-------------------------------+-------+----------+
|        | Muon   | CSC ROD Production Complete   | 05-N  | 0        |
|        | L2/9   |                               | ov-03 | 5-Nov-03 |
|        |        |                               |       | (F)      |
+--------+--------+-------------------------------+-------+----------+
|        | Muon   | MDT Elec.'s Mezzanine         | 06-M  | 0        |
|        | L2/10  | Production Complete           | ar-03 | 6-Mar-03 |
|        |        |                               |       | (F)      |
+--------+--------+-------------------------------+-------+----------+
|        | Muon   | CSC Assembly/Testing at CERN  | 17-D  | 1        |
|        | L2/11  | Complete                      | ec-04 | 7-Dec-04 |
|        |        |                               |       | (F)      |
+--------+--------+-------------------------------+-------+----------+
|        | Muon   | Global Alignment System Final | 30-S  | 3        |
|        | L2/12  | Delivery                      | ep-04 | 0-Sep-04 |
|        |        |                               |       | (F)      |
+--------+--------+-------------------------------+-------+----------+
|        |        |                               |       |          |
+--------+--------+-------------------------------+-------+----------+
| **Trig | TDAQ   | Select Final LVL2             | 31-D  | 3        |
| ger/** | L2/1   | Architecture                  | ec-99 | 1-Mar-00 |
|        |        |                               |       | (A)      |
| **DAQ  |        |                               |       |          |
| (      |        |                               |       |          |
| 1.6)** |        |                               |       |          |
+--------+--------+-------------------------------+-------+----------+
|        | TDAQ   | LVL2 Trigger Design Complete  | 31-D  | 3        |
|        | L2/2   |                               | ec-02 | 1-Dec-02 |
|        |        |                               |       | (F)      |
+--------+--------+-------------------------------+-------+----------+
|        | TDAQ   | LVL2 Trigger Prototype        | 30-S  | 3        |
|        | L2/3   | Complete                      | ep-02 | 0-Sep-02 |
|        |        |                               |       | (F)      |
+--------+--------+-------------------------------+-------+----------+
|        | TDAQ   | Start Production              | 08-J  | 0        |
|        | L2/4   |                               | an-03 | 8-Jan-03 |
|        |        |                               |       | (F)      |
+--------+--------+-------------------------------+-------+----------+
|        | TDAQ   | Start Installation &          | 05-M  | 0        |
|        | L2/5   | Commissioning                 | ar-03 | 5-Mar-03 |
|        |        |                               |       | (F)      |
+--------+--------+-------------------------------+-------+----------+
|        | TDAQ   | Production Complete           | 30-J  | 3        |
|        | L2/6   |                               | ul-05 | 0-Jul-05 |
|        |        |                               |       | (F)      |
+--------+--------+-------------------------------+-------+----------+
|        | TDAQ   | LVL2 Installation &           | 30-S  | 3        |
|        | L2/7   | Commissioning Complete        | ep-05 | 0-Sep-05 |
|        |        |                               |       | (F)      |
+--------+--------+-------------------------------+-------+----------+
|        |        |                               |       |          |
+--------+--------+-------------------------------+-------+----------+

U.S. ATLAS Major Project Milestones (Level 4)

+----+------+--------------------------+------+--------+------+------+
| *  | **   | **U.S. ATLAS             | *    | **Fo   | **A  | **   |
| *W | Sche | Responsibility**         | *ETC | recast | TLAS | Base |
| BS | dule |                          | 01** | (F)/** | Requ | line |
| ** | Desi | **Completion             |      |        | ired | S    |
|    | gnat | Description**            | **   | **     | Da   | cope |
|    | or** |                          | Base | Actual | te** | Pla  |
|    |      |                          | line | (A)**  |      | nned |
|    |      |                          | S    |        |      | F    |
|    |      |                          | cope | **Ba   |      | loat |
|    |      |                          | Pla  | seline |      | (M   |
|    |      |                          | nned | Scope  |      | onth |
|    |      |                          | Co   | Comp   |      | s)** |
|    |      |                          | mple | letion |      |      |
|    |      |                          | tion | Date** |      |      |
|    |      |                          | Da   |        |      |      |
|    |      |                          | te** |        |      |      |
+----+------+--------------------------+------+--------+------+------+
| *  |      |                          |      |        |      |      |
| *S |      |                          |      |        |      |      |
| il |      |                          |      |        |      |      |
| ic |      |                          |      |        |      |      |
| on |      |                          |      |        |      |      |
| ** |      |                          |      |        |      |      |
+----+------+--------------------------+------+--------+------+------+
| 1  | Sil  | Complete Shipping of     | 1    | 10/03  | 4/03 | -6   |
| .1 | L4/1 | Silicon Strip Prod       | 0/03 |        |      |      |
| .2 |      | Modules                  |      |        |      |      |
+----+------+--------------------------+------+--------+------+------+
| 1  | Sil  | RODs 45% Production      | 9/02 | 9/02   | 6/03 | 9    |
| .1 | L4/2 | Complete                 |      |        |      |      |
| .3 |      |                          |      |        |      |      |
+----+------+--------------------------+------+--------+------+------+
| 1  | Sil  | Pixels 'Disk System at   | 1    | 10/04  | 1    | 2    |
| .1 | L4/3 | CERN'                    | 0/04 |        | 2/04 |      |
| .1 |      |                          |      |        |      |      |
+----+------+--------------------------+------+--------+------+------+
| *  |      |                          |      |        |      |      |
| *T |      |                          |      |        |      |      |
| RT |      |                          |      |        |      |      |
| ** |      |                          |      |        |      |      |
+----+------+--------------------------+------+--------+------+------+
| 1  | TRT  | Barrel Modules Ship to   | 8/02 | 8/02   | 3/03 | 7    |
| .2 | L4/1 | CERN Complete            |      |        |      |      |
| .1 |      |                          |      |        |      |      |
+----+------+--------------------------+------+--------+------+------+
| 1  | TRT  | ASDBLRs Ship to LUND     | 1    | 10/02  | 1    | 1    |
| .2 | L4/2 | Complete                 | 0/02 |        | 1/02 |      |
| .5 |      |                          |      |        |      |      |
+----+------+--------------------------+------+--------+------+------+
|    | TRT  | ASDBLRs Ship to CERN     | 1    | 11/02  | 1    | 1    |
|    | L4/3 | Complete                 | 1/02 |        | 2/02 |      |
+----+------+--------------------------+------+--------+------+------+
|    | TRT  | PCB-Endcaps Ship to CERN | 4/03 | 4/03   | 1    | 6    |
|    | L4/4 | Complete                 |      |        | 0/03 |      |
+----+------+--------------------------+------+--------+------+------+
|    |      |                          |      |        |      |      |
+----+------+--------------------------+------+--------+------+------+
| *  |      |                          |      |        |      |      |
| *L |      |                          |      |        |      |      |
| Ar |      |                          |      |        |      |      |
| ** |      |                          |      |        |      |      |
+----+------+--------------------------+------+--------+------+------+
| 1  | LAr  | Cryostat Final           | 8/01 | 8/01   | 1    | 3    |
| .3 | L4/1 | Acceptance Test Complete |      |        | 1/01 |      |
| .1 |      |                          |      |        |      |      |
+----+------+--------------------------+------+--------+------+------+
| 1  | LAr  | Signal FT Installation   | 1    | 11/02  | 1    | -1   |
| .3 | L4/2 | Complete                 | 1/02 |        | 0/02 |      |
| .2 |      |                          |      |        |      |      |
+----+------+--------------------------+------+--------+------+------+
|    | LAr  | HV FT End-Cap C Install  | 2/02 | 2/02   | 1    | -3   |
|    | L4/3 | Complete                 |      |        | 1/01 |      |
+----+------+--------------------------+------+--------+------+------+
|    | LAr  | HV FT Barrel Install     | 1    | 11/01  | 5/02 | 6    |
|    | L4/4 | Complete                 | 1/01 |        |      |      |
+----+------+--------------------------+------+--------+------+------+
|    | LAr  | HV FT End-Cap A Install  | 1    | 12/02  | 9/02 | -3   |
|    | L4/5 | Complete                 | 2/02 |        |      |      |
+----+------+--------------------------+------+--------+------+------+
| 1  | LAr  | LAr Cryogenics Vendor    | 9/03 | 9/03   | 1    | 3    |
| .3 | L4/6 | Install Complete         |      |        | 2/03 |      |
| .3 |      |                          |      |        |      |      |
+----+------+--------------------------+------+--------+------+------+
| 1  | LAr  | Last Del of Readout      | 1    | 12/02  | 1    | -2   |
| .3 | L4/7 | Electrodes               | 2/02 |        | 0/02 |      |
| .4 |      |                          |      |        |      |      |
| .1 |      |                          |      |        |      |      |
+----+------+--------------------------+------+--------+------+------+
| 1  | LAr  | MBs Ship to              | 6/02 | 6/02   | 9/02 | 3    |
| .3 | L4/8 | Annecy,Saclay (France)   |      |        |      |      |
| .4 |      |                          |      |        |      |      |
| .2 |      |                          |      |        |      |      |
+----+------+--------------------------+------+--------+------+------+
| 1  | LAr  | Preamp Deliveries to FEB | 5/03 | 5/03   | 3/04 | 10   |
| .3 | L4/9 | Complete                 |      |        |      |      |
| .5 |      |                          |      |        |      |      |
| .1 |      |                          |      |        |      |      |
+----+------+--------------------------+------+--------+------+------+
| 1  | LAr  | Prec Calor Calib         | N/A  | N/A    | N/A  | N/A  |
| .3 | L    | Production Complete      |      |        |      |      |
| .5 | 4/10 |                          |      |        |      |      |
| .2 |      |                          |      |        |      |      |
+----+------+--------------------------+------+--------+------+------+
|    |      |                          |      |        |      |      |
+----+------+--------------------------+------+--------+------+------+

U.S. ATLAS Major Project Milestones (Level 4) (Continued)

+----+------+-------------------------+------+--------+------+------+
| *  | **   | **U.S. ATLAS            | *    | **Fo   | **A  | **   |
| *W | Sche | Responsibility**        | *ETC | recast | TLAS | Base |
| BS | dule |                         | 01** | (F)/** | Requ | line |
| ** | Desi | **Completion            |      |        | ired | S    |
|    | gnat | Description**           | **   | **     | Da   | cope |
|    | or** |                         | Base | Actual | te** | Pla  |
|    |      |                         | line | (A)**  |      | nned |
|    |      |                         | S    |        |      | F    |
|    |      |                         | cope | **Ba   |      | loat |
|    |      |                         | Pla  | seline |      | (M   |
|    |      |                         | nned | Scope  |      | onth |
|    |      |                         | Co   | Comp   |      | s)** |
|    |      |                         | mple | letion |      |      |
|    |      |                         | tion | Date** |      |      |
|    |      |                         | Da   |        |      |      |
|    |      |                         | te** |        |      |      |
+----+------+-------------------------+------+--------+------+------+
| *  |      |                         |      |        |      |      |
| *L |      |                         |      |        |      |      |
| ar |      |                         |      |        |      |      |
| (  |      |                         |      |        |      |      |
| Co |      |                         |      |        |      |      |
| nt |      |                         |      |        |      |      |
| in |      |                         |      |        |      |      |
| ue |      |                         |      |        |      |      |
| d) |      |                         |      |        |      |      |
| ** |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
| 1  | LAr  | Pedestal Ship to CERN   | 1    | 12/01  | 7/02 | 7    |
| .3 | L    | Complete                | 2/01 |        |      |      |
| .6 | 4/12 |                         |      |        |      |      |
| .1 |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
|    | LAr  | Barrel Ship to CERN     | 1    | 12/01  | 3/03 | 15   |
|    | L    | Complete                | 2/01 |        |      |      |
|    | 4/13 |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
| 1  | LAr  | Cables Shipping         | 1    | 10/02  | 3/03 | 5    |
| .3 | L    | Complete                | 0/02 |        |      |      |
| .6 | 4/14 |                         |      |        |      |      |
| .2 |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
|    | LAr  | Baseplane Last Delivery | 1    | 10/02  | 3/03 | 5    |
|    | L    | to CERN Complete        | 0/02 |        |      |      |
|    | 4/15 |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
| 1  | LAr  | EC Crates Last Delivery | 1    | 10/02  | 3/03 | 5    |
| .3 | L    | to CERN Complete        | 0/02 |        |      |      |
| .6 | 4/16 |                         |      |        |      |      |
| .3 |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
|    | LAr  | Barrel Crates Last      | 1    | 10/02  | 3/03 | 5    |
|    | L    | Delivery to CERN        | 0/02 |        |      |      |
|    | 4/17 | Complete                |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
| 1  | LAr  | Controls Ship to CERN   | 9/03 | 9/03   | 5/04 | 8    |
| .3 | L    | Complete                |      |        |      |      |
| .6 | 4/18 |                         |      |        |      |      |
| .4 |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
|    | LAr  | Power Supplies Last     | 9/04 | 9/04   | 5/04 | -4   |
|    | L    | Delivery Complete       |      |        |      |      |
|    | 4/19 |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
| 1  | LAr  | Thermal Contacts        | 9/02 | 9/02   | 9/02 | 0    |
| .3 | L    | (Proto) Last Delivery   |      |        |      |      |
| .6 | 4/21 | Complete                |      |        |      |      |
| .5 |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
| 1  | LAr  | FEB Last Delivery       | 8/04 | 8/04   | 1/05 | 5    |
| .3 | L    | Complete                |      |        |      |      |
| .7 | 4/22 |                         |      |        |      |      |
| .1 |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
| 1  | LAr  | SCAs Last Delivery to   | N/A  | N/A    | N/A  | N/A  |
| .3 | L    | FEB Complete            |      |        |      |      |
| .7 | 4/23 |                         |      |        |      |      |
| .2 |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
| 1  | LAr  | Last Driver Delivery to | 4/04 | 4/04   | 5/04 | 1    |
| .3 | L    | FEB Complete            |      |        |      |      |
| .7 | 4/24 |                         |      |        |      |      |
| .4 |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
| 1  | LAr  | Layer Sums Last         | 1    | 12/02  | 3/04 | 15   |
| .3 | L    | Delivery to FEB         | 2/02 |        |      |      |
| .8 | 4/26 | Complete                |      |        |      |      |
| .1 |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
| 1  | LAr  | I/F to Level 1 Ship to  | 8/04 | 8/04   | 1    | 4    |
| .3 | L    | CERN Complete           |      |        | 2/04 |      |
| .8 | 4/27 |                         |      |        |      |      |
| .2 |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
| 1  | LAr  | ROD System Final        | 8/02 | 8/02   | 8/02 | 0    |
| .3 | L    | Prototype Complete      |      |        |      |      |
| .9 | 4/28 |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
| 1. | LAr  | Deliver Finished FCAL-C | 1    | 10/02  | 1    | 0    |
| 3. | L    | to EC                   | 0/02 |        | 0/02 |      |
| 10 | 4/29 |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
|    | LAr  | Deliver Finished FCAL-A | 1    | 12/03  | 1    | -1   |
|    | L    | to EC                   | 2/03 |        | 1/03 |      |
|    | 4/30 |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
|    | LAr  | FCAL Elec.\'s Summ Bds  | 1    | 12/01  | 2/02 | 2    |
|    | L    | Ready for Installation  | 2/01 |        |      |      |
|    | 4/31 |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
|    | LAr  | FCAL Elec.\'s Cold      | 1    | 11/01  | 2/02 | 3    |
|    | L    | Cables Testing Complete | 1/01 |        |      |      |
|    | 4/32 |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+

U.S. ATLAS Major Project Milestones (Level 4) (Continued)

+----+------+-------------------------+------+--------+------+------+
| *  | **   | **U.S. ATLAS            | *    | **Fo   | **A  | **   |
| *W | Sche | Responsibility**        | *ETC | recast | TLAS | Base |
| BS | dule |                         | 01** | (F)/** | Requ | line |
| ** | Desi | **Completion            |      |        | ired | S    |
|    | gnat | Description**           | **   | **     | Da   | cope |
|    | or** |                         | Base | Actual | te** | Pla  |
|    |      |                         | line | (A)**  |      | nned |
|    |      |                         | S    |        |      | F    |
|    |      |                         | cope | **Ba   |      | loat |
|    |      |                         | Pla  | seline |      | (M   |
|    |      |                         | nned | Scope  |      | onth |
|    |      |                         | Co   | Comp   |      | s)** |
|    |      |                         | mple | letion |      |      |
|    |      |                         | tion | Date** |      |      |
|    |      |                         | Da   |        |      |      |
|    |      |                         | te** |        |      |      |
+----+------+-------------------------+------+--------+------+------+
| ** |      |                         |      |        |      |      |
| Ti |      |                         |      |        |      |      |
| le |      |                         |      |        |      |      |
| ** |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
| 1  | Tile | Submodules Production   | 7/01 | 7/01   | 8/01 | 1    |
| .4 | L4/1 | Complete                |      |        |      |      |
| .1 |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
|    | Tile | EB Module Ship to CERN  | 1    | 12/01  | 7/02 | 7    |
|    | L4/2 | Complete                | 2/01 |        |      |      |
+----+------+-------------------------+------+--------+------+------+
| 1  | Tile | Optics Instrumentation  | 9/02 | 9/02   | 1    | 2    |
| .4 | L4/3 | at ANL & MSU Complete   |      |        | 1/02 |      |
| .2 |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
| 1  | Tile | PMT Ship to ATLAS       | 1/02 | 1/02   | 7/02 | 6    |
| .4 | L4/4 | Complete                |      |        |      |      |
| .3 |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
| 1  | Tile | Readout Ship to ATLAS   | 6/02 | 6/02   | 9/02 | 3    |
| .4 | L4/5 | Complete                |      |        |      |      |
| .3 |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
| 1  | Tile | Gap Submodules Ship to  | 7/01 | 7/01   | 8/01 | 1    |
| .4 | L4/6 | ANL & BCN Complete      |      |        |      |      |
| .4 |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
|    |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
| ** |      |                         |      |        |      |      |
| Mu |      |                         |      |        |      |      |
| on |      |                         |      |        |      |      |
| ** |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
| 1  | Muon | MDT Chamber Prod        | 6/04 | 6/04   | 2/04 | -4   |
| .5 | L4/1 | Complete (BMC Qty. 80)  |      |        |      |      |
| .7 |      |                         |      |        |      |      |
| (  |      |                         |      |        |      |      |
| 1) |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
|    |      | MDT Chamber Prod        | 8/04 | 8/04   | 2/04 | -6   |
|    |      | Complete (Mich Qty. 80) |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
|    |      | MDT Chamber Prod        | 8/04 | 8/04   | 2/04 | -6   |
|    |      | Complete (Seattle Qty.  |      |        |      |      |
|    |      | 80)                     |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
| 1  | Muon | MDT Mounts Prod         | 1    | 10/03  | 2/04 | 4    |
| .5 | L4/2 | Complete/Delivered to   | 0/03 |        |      |      |
| .8 |      | Chambers                |      |        |      |      |
| (  |      |                         |      |        |      |      |
| 2) |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
| 1  | Muon | MDT Elec.\'s Mezzanine  | 3/03 | 3/03   | 2/03 | -1   |
| .5 | L4/3 | Bd Production Complete  |      |        |      |      |
| .9 |      |                         |      |        |      |      |
| (  |      |                         |      |        |      |      |
| 3) |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
|    | Muon | MDT Elec.\'s Hedgehog   | 1    | 12/01  | 4/01 | -8   |
|    | L4/4 | Production Complete     | 2/01 |        |      |      |
+----+------+-------------------------+------+--------+------+------+
| 1  | Muon | CSC Chambers Production | 1/03 | 1/03   | 4/04 | 15   |
| .5 | L4/5 | Complete                |      |        |      |      |
| .4 |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
| 1. | Muon | ASMs Production         | 4/04 | 4/04   | 4/04 | 0    |
| 5. | L4/6 | Complete                |      |        |      |      |
| 11 |      |                         |      |        |      |      |
| (  |      |                         |      |        |      |      |
| 5) |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
|    | Muon | Sparsifiers Ship to     | 3/04 | 3/04   | 1    | 7    |
|    | L4/7 | CERN                    |      |        | 0/04 |      |
+----+------+-------------------------+------+--------+------+------+
|    | Muon | RODs Ship to CERN       | 3/04 | 3/04   | 1    | 7    |
|    | L4/8 |                         |      |        | 0/04 |      |
+----+------+-------------------------+------+--------+------+------+
|    | Muon | Support Electronics     | 3/04 | 3/04   | 1    | 7    |
|    | L4/9 | Ship to CERN            |      |        | 0/04 |      |
+----+------+-------------------------+------+--------+------+------+
| 1. | Muon | Align Bars Ship to CERN | 3/04 | 3/04   | 1    | 9    |
| 5. | L    |                         |      |        | 2/04 |      |
| 12 | 4/10 |                         |      |        |      |      |
| (  |      |                         |      |        |      |      |
| 6) |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
|    | Muon | Proximity Monitors Ship | 1    | 12/03  | 1    | 12   |
|    | L    | to CERN                 | 2/03 |        | 2/04 |      |
|    | 4/11 |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
|    | Muon | Multi-Point System Ship | 3/03 | 3/03   | 3/05 | 24   |
|    | L    | to CERN                 |      |        |      |      |
|    | 4/12 |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
|    | Muon | DAQ Ship to CERN        | 9/04 | 9/04   | 1    | 3    |
|    | L    |                         |      |        | 2/04 |      |
|    | 4/13 |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+
|    |      |                         |      |        |      |      |
+----+------+-------------------------+------+--------+------+------+

# 13. NSF cost schedule status Report

Fourteen US ATLAS institutions will receive funding under the NSF
Cooperative Agreement (No. PHY 9722537) in FY01. Technical progress
reports are given in the respective subsystem paragraphs of Section 4.
The NSF Cost Schedule Status Report (CSSR) in this section covers these
14 institutions, in addition to the Education, Institutional Dues and
Common Project items which will be funded by the NSF, and also the Items
Outside Approved Baseline and Contingency.

Status through the month of May 2001 reflects the new baseline schedules
for all subsystems. The schedules are resource-loaded to the baseline
funding of \$163,750K with Contingency, Management Contingency and Items
Outside of the Approved Baseline shown on separate lines, excluding all
NSF R&D funds. The anticipated NSF contribution to the baseline funding
is \$60,800K

We note that more than half of the universities in the NSF CSSR are, or
have been, funded by both NSF and DOE, while we manage the project
without distinguishing the agency source of funding. For this reason,
the NSF+DOE Budgeted AY\$s column in Table 13-1 includes all Project
funds allocated to each institution, while the last two columns to the
far right show the contribution of each agency.

The re-baseline date was established as October 1 2000 and the FY 01
Estimate to Complete (ETC-01) was defined as all tasks and resources
required too complete the project. These tasks were scheduled and the
necessary resources were loaded into the schedules. All prior efforts
were equated to the actual cost expended. There was a negative schedule
variance along with a positive cost variance in the old baseline and
this resulted in a reduction in both the work scheduled and the work
performed in the new baseline.

The CSSR shows that \$22,184.2K of the work has been completed which
represents approximately 39.0% of the work authorized to date. There is
an unfavorable schedule variance of \$279.1 or 1.2% behind the plan and
a favorable cost variance of \$134.0K or 0.6% under spent for the work
accomplished. There are outstanding commitments of \$897.8k at this time
that do not show up in the performance.

**Schedule Variance**

Hampton -- SV = (\$81.9k)

> WBS 1.2.1.1.3 Barrel Module Component Assembly is behind plan \$81.9k

University of Chicago -- SV = (\$94.3k)

WBS 1.4.3.3.3 Front End Mother Board Production is behind plan \$89.7k

**Cost Variance**

Although the overall cost variance for NSF Institutions is a favorable
\$134.0k it is comprised of both positive and negative variances as
follows:

-   Brandeis -- CV = (\$132.3k)

```{=html}
<!-- -->
```
-   Overspent on tooling (\$39.8k)

-   Charging against Global System Production tasks (\$92.7k)

```{=html}
<!-- -->
```
-   Nevis -- CV = (\$46.8K)

```{=html}
<!-- -->
```
-   Over spent on the FEB

```{=html}
<!-- -->
```
-   MSU CV = (\$81.7K)

```{=html}
<!-- -->
```
-   Over spent on Trigger/DAQ Level 2 SRB

```{=html}
<!-- -->
```
-   SUNY Stony Brook CV = (\$51.7K)

```{=html}
<!-- -->
```
-   Over spent on the HV Feedthrough Production

```{=html}
<!-- -->
```
-   University of Rochester CV = \$508.4K

```{=html}
<!-- -->
```
-   Under spent by \$349.8k on Vendor Manufacturing but shows an
    outstanding commitment of \$317.8k

-   Under spent by \$161.4k on Manufacturing Monitoring

```{=html}
<!-- -->
```
-   University of Texas Arlington CV = (\$109.6K)

```{=html}
<!-- -->
```
-   Over spent by \$47.8k on the Intermediate Tile Calorimeter
    Production

-   Reported \$60k of prior year cost

```{=html}
<!-- -->
```
-   University of Chicago CV = \$90.8

```{=html}
<!-- -->
```
-   Under spent by \$117.7k on Readout

-   Overspent by \$33k Extended Barrel Module

```{=html}
<!-- -->
```
-   University of Washington CV = (\$35.5K)

### Table 13

![](media/image11.png){width="9.18125in" height="5.5375in"}

# 14. detailed Technical progress

**1.1 SILICON**

**Milestones with changed forecast dates:**

  --------------------- -------------- ---------------- -------------- ------------------
  **1.1.1.3.1 Design**                                                 

  **Milestone**         **Baseline**   **Previous**     **Forecast**   **Status**

  FE-I1 spec complete   16-May-01      16-May-01        16-Jul-01      Delayed (See #1)

  **Note                                                               
  #1**  Specification                                                  
  has been started, and                                                
  was supposed to be                                                   
  ready for June                                                       
  review. Testing of                                                   
  Analog Test chip has                                                 
  taken priority                                                       
  --------------------- -------------- ---------------- -------------- ------------------

  -------------------------- -------------- ---------------- -------------- -------------------
  **1.1.1.3.2                                                               
  Development/Prototypes**                                                  

  **Milestone**              **Baseline**   **Previous**     **Forecast**   **Status**

  FE-D3 submitted            2-May-01       2-May-01         2-Dec-01       Delayed (See #1)

  **Note #1**  We have                                                      
  delayed all further work                                                  
  on FE-D3 pending                                                          
  submission of FE-I1 and                                                   
  study of its performance.                                                 
  At the present time, no                                                   
  further DMILL submissions                                                 
  are foreseen unless                                                       
  significant problems are                                                  
  observed with 0.25μ                                                       
  designs                                                                   
  -------------------------- -------------- ---------------- -------------- -------------------

+------------------------------+-------+-------+------+---------------+
| **1.1.2.1.3 Production**     |       |       |      |               |
+------------------------------+-------+-------+------+---------------+
| **Milestone**                | **    | **Pr  | **Fo | **Status**    |
|                              | Basel | eviou | reca |               |
|                              | ine** | s**   | st** |               |
+------------------------------+-------+-------+------+---------------+
| Complete preproduction fab   | 28-F  | 30-M  | 3    | Delayed (See  |
|                              | eb-01 | ay-01 | 0-Ju | #1)           |
|                              |       |       | n-01 |               |
+------------------------------+-------+-------+------+---------------+
| Complete preproduction       | 23-M  | 23-M  | 3    | Delayed (See  |
| design verification          | ay-01 | ay-01 | 0-Ju | #2)           |
|                              |       |       | n-01 |               |
+------------------------------+-------+-------+------+---------------+
| **Note #1**  The last of the |       |       |      |               |
| 5 pre-production lots was    |       |       |      |               |
| delivered with one out of    |       |       |      |               |
| spec fab parameter. We gave  |       |       |      |               |
| Atmel a conditional waiver   |       |       |      |               |
| in that we said we would     |       |       |      |               |
| first test the wafers and    |       |       |      |               |
| then determine to accept     |       |       |      |               |
| them only if the out of spec |       |       |      |               |
| parameter did not effect     |       |       |      |               |
| yield or performance. Atmel  |       |       |      |               |
| has also delivered some      |       |       |      |               |
| extra wafers to augment the  |       |       |      |               |
| last lots which did yield    |       |       |      |               |
| poorly. We have not tested   |       |       |      |               |
| all the wafers and therefore |       |       |      |               |
| have not accepted the last   |       |       |      |               |
| lot. The remaining wafers    |       |       |      |               |
| should be tested by end of   |       |       |      |               |
| June so that we can complete |       |       |      |               |
| acceptance.                  |       |       |      |               |
|                              |       |       |      |               |
| **Note #2**  We are still    |       |       |      |               |
| studying one post-rad        |       |       |      |               |
| problem. Progress has been   |       |       |      |               |
| made in understanding the    |       |       |      |               |
| problem but it is not        |       |       |      |               |
| complete. This must be done  |       |       |      |               |
| before the PRR on 4-Jul.     |       |       |      |               |
+------------------------------+-------+-------+------+---------------+

+---------------------------+--------+---------+--------+-------------+
| **1.1.2.2.1 Design**      |        |         |        |             |
+---------------------------+--------+---------+--------+-------------+
| > **Milestone**           | >      | >       | >      | ### Status  |
|                           | **Base | **Previ | **Fore |             |
|                           | line** | ous**   | cast** |             |
+---------------------------+--------+---------+--------+-------------+
| > Start Procurement for   | > 5-   | > 25    | > 15-  | Delayed     |
| > Production Hybrid       | Mar-01 | -May-01 | Jun-01 | (See #1)    |
| > Assembly                |        |         |        |             |
+---------------------------+--------+---------+--------+-------------+
| **Note #1**  The FDR was  |        |         |        |             |
| completed but some minor  |        |         |        |             |
| modifications have been   |        |         |        |             |
| circulated since.         |        |         |        |             |
+---------------------------+--------+---------+--------+-------------+

+--------------------------+---------+--------+--------+--------------+
| **1.1.2.2.3 Production** |         |        |        |              |
+--------------------------+---------+--------+--------+--------------+
| **Milestone**            | **Bas   | **     | **Fore | **Status**   |
|                          | eline** | Previo | cast** |              |
|                          |         | us**   |        |              |
+--------------------------+---------+--------+--------+--------------+
| 1st Preproduction        | 4       | 1-     | 15-    | Delayed (See |
| Hybrids Avail for Mod    | -Jun-01 | Sep-01 | Sep-01 | #1)          |
| Assy                     |         |        |        |              |
+--------------------------+---------+--------+--------+--------------+
| Compl Preproduction Assy | 13      | 13-    | 21-    | Delayed (See |
|                          | -Aug-01 | Oct-01 | Oct-01 | #2)          |
+--------------------------+---------+--------+--------+--------------+
| Compl Testing of Preprod | 3       | 3-     | 21-    | Delayed (See |
| Hybrid                   | -Sep-01 | Sep-01 | Oct-01 | #3)          |
+--------------------------+---------+--------+--------+--------------+
| **Note #1**  This will   |         |        |        |              |
| follow the hybrid design |         |        |        |              |
| review and is set by     |         |        |        |              |
| Japanese procurement     |         |        |        |              |
| schedule. The FDR is     |         |        |        |              |
| complete but some minor  |         |        |        |              |
| mods have been           |         |        |        |              |
| circulated.              |         |        |        |              |
|                          |         |        |        |              |
| **Note #2-3**  Set by    |         |        |        |              |
| date of item1 above.     |         |        |        |              |
+--------------------------+---------+--------+--------+--------------+

  ------------------------------- -------------- ---------------- -------------- -------------
  **1.1.2.3.3 Production**                                                       

  **Milestone**                   **Baseline**   **Previous**     **Forecast**   **Status**

  Complete Preproduction Module   3-Sep-01       3-Sep-01         30-Oct-01      Delayed (See
  Testing                                                                        #1)

  **Note #1**  See note 1.                                                       
  ------------------------------- -------------- ---------------- -------------- -------------

  ------------------------------- -------------- ---------------- -------------- ----------------
  **1.1.3.4.3 SCT/Pixel Test                                                     
  Stand Software**                                                               

  **Milestone**                   **Baseline**   **Previous**     **Forecast**   **Status**

  Production Diagnostic Test      29-Sep-00      29-Jul-01        29-Aug-01      Delayed (See #1)
  Stand Completed                                                                

  **Note #1**  The test stand                                                    
  software is complete. It will                                                  
  not be verified as production                                                  
  test stand until the first card                                                
  has been debugged and tested.                                                  
  This was expected in 2000 but                                                  
  the date now selected for                                                      
  completion is August 29, 2001.                                                 
  This is caused by the slow                                                     
  progress in testing the ROD.                                                   
  Recently much testing of                                                       
  software has been performed.                                                   
  With the working ROD                                                           
  infrastructure, the testing of                                                 
  the software can proceed at its                                                
  own pace. The software is 80%                                                  
  complete. Completion will be                                                   
  done when the first ROD is full                                                
  completed. The completion of                                                   
  the software is waiting on the                                                 
  production models of the ROD.                                                  
  Sufficient time after debugging                                                
  of the ROD is projected into                                                   
  August. This will be in time                                                   
  for the production of the ROD.                                                 
  ------------------------------- -------------- ---------------- -------------- ----------------

+--------------------+----------+---------+---------+----------------+
| **1.1.3.7.3        |          |         |         |                |
| Evaluation of      |          |         |         |                |
| Production Model** |          |         |         |                |
+--------------------+----------+---------+---------+----------------+
| **Milestone**      | **Ba     | **Previ | **For   | **Status**     |
|                    | seline** | ous**   | ecast** |                |
+--------------------+----------+---------+---------+----------------+
| Release Production | 1        | 16      | 25      | Delayed (See   |
| Dwg/Specs          | 6-May-01 | -Jun-01 | -Jul-01 | #1)            |
+--------------------+----------+---------+---------+----------------+
| Pixel ROD Design   | 1        | 14      | 1       | Delayed (See   |
| complete           | 4-Jun-01 | -Jul-01 | -Aug-01 | #2)            |
+--------------------+----------+---------+---------+----------------+
| **Note #1**  The   |          |         |         |                |
| current progress   |          |         |         |                |
| show that the      |          |         |         |                |
| drawing will not   |          |         |         |                |
| be ready till      |          |         |         |                |
| June. This was     |          |         |         |                |
| caused by the      |          |         |         |                |
| extended time      |          |         |         |                |
| required to debug  |          |         |         |                |
| the proto ROD.     |          |         |         |                |
| Production is not  |          |         |         |                |
| expected to slip.  |          |         |         |                |
|                    |          |         |         |                |
| **Note #2**  The   |          |         |         |                |
| code for the pixel |          |         |         |                |
| specific part is   |          |         |         |                |
| written and        |          |         |         |                |
| simulated. The     |          |         |         |                |
| one-month delay is |          |         |         |                |
| expected to have   |          |         |         |                |
| little impact. The |          |         |         |                |
| delay of 2 months  |          |         |         |                |
| is expected to     |          |         |         |                |
| have little        |          |         |         |                |
| impact.            |          |         |         |                |
+--------------------+----------+---------+---------+----------------+

**1.1.1 Pixels** **Murdock Gilchriese (Lawrence Berkeley Lab.)**

**1.1.1.1 Mechanics**

Preparations for a Conceptual Design Review of all of the pixel
mechanics and a PRR for the local supports is proceeding on schedule. In
general, we are on or ahead of schedule with two possible exceptions.
One, delivery of carbon-carbon plates to our specifications may be
delayed as the result of vendor fabrication problems. We will know if
there will be a delay by mid-June. Two, the design requirements for the
pixel support tube (PST) are partly driven by overall ATLAS and beam
pipe installation requirements. These have only recently been frozen, so
there may be some delay in completing the PST design. It will take until
July to understand if there will be a delay or not.

**1.1.1.2 Sensors**

The test results on the CIS preproduction sensors continue to look good.
The second vendor, Tesla, claims to now understand their yield problems
and additional preproduction wafers should arrive soon for testing.

**1.1.1.3 Electronics**

A third generation DMILL prototype of the opto-ICs was submitted in May.

First test results of the analog test chip (ATC) for the front-end IC
are promising. Some minor errors were found in this chip and understood.
A more significant problem, excessive threshold dispersion, appears to
also have an explanation. The first irradiation of the ATC to about 60
MRad showed essentially no change in performance - very encouraging. The
layout and verification of the complete FE chip is progressing, but
it\'s very likely there will be at least a one-month delay in
submission. Layout revisions will likely be necessary to fix the
threshold problem, and final layout and verification is proceeding
somewhat more slowly than planned.

Fabrication of the first parts for the new test system were completed in
May. Additional parts are still in design and layout.

**1.1.1.4 Hybrids**

The submission of the 3rd generation flex hybrid will be delayed for two
reasons. First, two designs were found to be required, one compatible
with existing AMS MCC chips (v.3) and one with the 0.25 micron MCC to be
included in the IBM engineering run. Second, CERN, which was to be the
first vendor for these, has recently informed us they no longer can
support this work until the fall of 2001 because of lack of personnel.
The plan is to submit v.3 first to Compunetics, one of the vendors for
the v.2 flex.

Work on the optical hybrids is proceeding as scheduled. A selection
between the OSU and Taiwan optical packages will be made in the second
week of June.

Albany is reporting for the first time this month. They are now working
on QC (HV testing and other) of the flex hybrids using fixtures made at
LBNL and at Albany.

**1.1.1.5 Modules**

The \"dummy module\" program continues with advancements made in wire
bonding and mounting these dummies on disk sectors.

The 8\" dummy wafers made in the US have been rejected because of poor
nitride passivation. We are attempting to determine how to get the
vendor to improve the passivation step, but this is a major delay in
qualifying bump bonding vendors to handle 8\" wafers.

**1.1.1.1 Mechanics**

**1.1.1.1.1 Design**

  ----------------- -------------- -------------- ----------------- ------------------------
  **Milestone**     **Baseline**   **Previous**   **Forecast**      **Status**

  Cables/services   20-Jun-01      \--            11-Jul-01         Delayed (See #1)
  CDR                                                               

  Disk Sector PRR   20-Jun-01      \--            12-Jul-01         Delayed (See #2)

  Global Support    20-Jun-01      \--            11-Jul-01         Delayed (See #3)
  CDR                                                               

  Support tube CDR  20-Jun-01      \--            11-Jul-01         Delayed (See #4)

  Global Support    16-Oct-01      \--            16-Oct-01         On Schedule
  FDR                                                               
  ----------------- -------------- -------------- ----------------- ------------------------

**Note #1-4**  Unable to arrange reviewers with TC on original date.

**Pixel Support Tube** **Eric Anderssen (Lawrence Berkeley Lab.)**

Interface to SCT Barrel was presented for approval to the ID engineers,
and the detail design of the supports for the Pixel Support Tube (PST)
were developed and discussed. Designs for support blocks and flexures
were proposed and analysis results presented. Flexures are proposed in
place of sliding contact joints for reliability and predictable forces.
Design of the PST barrel flange details (bolt patterns,
web-reinforcement, thickness) was completed based on preliminary
manufacturing plan (needed for composite parts).

Interface Drawing to SCT was presented with new support condition
implemented. FEA analysis with this support condition has been the
baseline for all PST development since end of April, and requests to SCT
to analyze the ramifications of this support condition were incorporated
into FEA analysis of the SCT Barrel structure, results of which were
made available at end of May.

PST support and interface to the SCT remain subject to approval, but
tentative agreement was reached to continue in these directions for the
CDR in July.

Disk Sectors **Murdock Gilchriese (Lawrence Berkeley Lab.)**

The detailed design of tooling for fabrication of the disk sectors is
continuing. The preparation of documents for the Local Support PRR also
continues.

Disk Support Rings

The design of the tooling needed to fabricate the disk support rings has
started. The current design now includes a close connection with the
disk sector construction. The proposal is to create a master gauge

tool that fixes the location of the three support points for the disk
sector. Mistress gauges would be used to both fabricate the disk sectors
so that the support points are always located in the same position. A
similar mistress gauge would be used to transfer the location of the
three support points, in groups, to the graphite tooling used to
fabricate the disk support ring. The intent is to allow any sector to be
placed on any disk support ring, in any location.

Global Support Frame

Work on the FE analysis of the global support is continuing. This is
going slowly, and is limited by obtaining updated information on the
correct weights of components, services, etc.

**Sally Seidel (University Of New Mexico)**

Several iterations of the connector selection and layout on PP2 were
performed. At the LBNL mechanics meeting, several options A1 and A2 for
the optimization of Type II cables were proposed, and an option B was
presented which moved PP2 outside the first layer of the muon chamber
and increased the dimensions to 450 mm x 450 mm x 150 mm. Iterations of
the PP2 connector layout were performed for option B; these included
placing four cables per connector (total of 11 connectors) and two
cables per connector (total of 25 connectors). The one connector per
cable (total of 50 connectors) design is presently in progress at New
Mexico.

**1.1.1.1.2 Development/Prototypes**

+----------------------------+-------+---------+--------+------------+
| # Milestone                | > **  | >       | >      | >          |
|                            | Basel | **Previ | **Fore | **Status** |
|                            | ine** | ous**   | cast** |            |
+----------------------------+-------+---------+--------+------------+
| Complete sector            | >     | > \--   | > 20-  | > On       |
| development                |  20-J |         | Jun-01 | > Schedule |
|                            | un-01 |         |        |            |
+----------------------------+-------+---------+--------+------------+
| Complete disk development  | >     | > \--   | > 16-  | > On       |
|                            |  16-O |         | Oct-01 | > Schedule |
|                            | ct-01 |         |        |            |
+----------------------------+-------+---------+--------+------------+
| Complete global support    | >     | > \--   | > 16-  | > On       |
| development/prototypes     |  16-O |         | Oct-01 | > Schedule |
|                            | ct-01 |         |        |            |
+----------------------------+-------+---------+--------+------------+

INSTALLATION MOCKUP **Neal Hartman (Lawrence Berkeley Lab.)**

Work on the mockup is being suspended until a study of sliding materials
for the detector and service panels can be completed. The study will
evaluate different plastics (yet to be identified) in actual contact
with a carbon fiber/cyanate ester laminate. Once this study is
completed, a slider design will be fabricated and tested in the mockup.

COOLING SERVICES

The cold testing He leak checker setup has been tested at low
temperature, and it has been found that -22 Celsius can easily be
reached. Warm up time is up to an hour, however, so forced warming may
need to be used in order to cycle samples through at a higher rate.
Several samples have been tested so far at low temperature.

One of four variseals has been successfully leak checked through the
entire regimen (including cold and irradiation). One sample failed
initially (on first fitup) and should have been re-clamped in order to
retest,

but this was never done. The two other samples failed during pressurized
leak checking, and never made it to cold testing. One of the failures
passed, however, after being pressure cycled once. Four more variseal
samples are being made in order to add to this data set.

The taper seal fittings (similar to Luer-Lok) did not fare well during
pressure testing, with one of three surviving the test. This poor
behavior may be due to surface finish, so new seals are being
fabricated.

The indium seal fittings also did not fare well. One fitting of three
failed during pressure testing, while one could never be made to seal
(for the initial vac check). The third fitting fared well. These
failures are thought to be due to the fact that the seals were not
initially designed for indium, but were adapted from other fittings. In
order to fairly test an indium joint, a new set of fittings are being
made.

Four \"dumbbell\" laser welded samples were received and visually look
good. The fabricator tested them to low 7 scale, and retesting upon
receipt confirmed this result to better than mid 10 scale. The laser
welded samples have yet to be tested with variseals in them.

It was decided to suspend all brazing work for the time being. The
brazed dumbbell samples have fared well (all of them passing initial
leak and proof tests) but laser welding is much more desirable (due
mostly to the small heat affected zone) and appears to be feasible based
on initial samples and quotes, so all effort will be devoted to this
solution.

Disk Sectors and Staves **Murdock Gilchriese (Lawrence Berkeley Lab.)**

The fabrication of the three prototype disk sectors to the current
dimensions is complete. One of these uses the baseline thermal compound
(used in the previous ten prototypes) to couple the aluminum tube in the
sector to the faceplates. The other two prototypes use a rigid epoxy.
Testing of the prototypes will begin in June.

Testing of a stave prototype continued. The stave underwent 50 thermal
cycles from room temperature to -35F. The thermal performance was not
affected. LN2 vapor was used to quickly cool the stave to -40C(thermal
shock). The thermal performance was not affected. A similar test was
done first on an older sector prototype with no changes in thermal
performance. A stave and sector were both cooled when powered by LN2
vapor. This may be an effective way of doing cold QC tests on individual
staves and sectors when real modules are mounted.

Disk Support Rings and Global Support Frame

The Disk Support Rings are supported by mounts in the Global Support
Frame. These mounts are located in holes drilled in the Global Support
Frame after its fabrication. Bushings are glued into the Support Frame
using precision tooling. This tooling is also used to locate the Support
Ring. We are trying this procedure with the second prototype Support
Ring and the prototype of the Support Frame. A set of holes was drilled
and the bushings glued into the frame at the end of May. Testing will
occur in June.

**1.1.1.1.3 Production** **Murdock Gilchriese (Lawrence Berkeley Lab.)**

Disk Sector and Support Ring

Chemical vapor deposition of the carbon-carbon plates for disk sectors
and the disk support ring was completed. There were some problems found
by the vendor. The plates were cut into two pieces - a circular cutout
and the remainder. This was required by the subcontractor providing the
furnace time for the CVD to allow temperature measurements to be made.
The plates before CVD were all less than 0.018\" thick. The circular
cutout after CVD was 0.021-0.025\" thick. The outer section was about
0.021\" thick. These are larger than expected, as is the variation. The
next step in the process is heat treatment. The vendor is concerned that
he will not meet our specifications and may have to cut the plates, sand
the pieces, re-CVD and re-heat treat. The heat treatment will be
completed by mid-June. We will inspect the material at this time to
determine if some of it meets spec or if additional steps will be
necessary. The vendor is producing much more material than we need, so
it\'s possible enough will be produced to our specifications.

**1.1.1.2 Sensors**

**1.1.1.2.1 Design**

  ------------------------------------ -------------- -------------- -------------- ------------
  **Milestone**                        **Baseline**   **Previous**   **Forecast**   **Status**

  Compl. Spec for production order     12-Mar-01      \--            16-Jun-01      See Note #1
  release                                                                           

  ATLAS PM approval of production      23-Jul-01      \--            23-Jul-01      On Schedule
  procurement                                                                       

  Release initial MC for               23-Jul-01      \--            23-Jul-01      On Schedule
  sensors/testing                                                                   
  ------------------------------------ -------------- -------------- -------------- ------------

**Note #1**  Tests of pre-production wafers are continuing. As the
sensor schedule is ahead of the schedules of other components and
consequently not on the critical path, this is not expected to impact
the global schedule.

**1.1.1.2.2 Development/Prototypes** **Sally Seidel (University Of New
Mexico)**

Acceptance tests of the pre-production wafers are continuing. At New
Mexico, the CV measurements on the six single chip structures have now
been completed. QA tests 7, 8, and 9 have been completed for all 13
wafers. These are, respectively, the IV on the oxide test structure, the
CV on the oxide test structure, and the IVgate on the GCD. The wafers
continue to look good. Cross calibration measurements have been
performed on wafer 4455-08 including QA procedures 3, 4, 5, and 6. Work
is underway at all the probing institutes to adapt the Dortmund
double-sided probing chucks to use in their own facilities.

**1.1.1.3 Electronics**

**1.1.1.3.1 Design**

  ------------------- -------------- ---------------- -------------- ----------------
  **Milestone**       **Baseline**   **Previous**     **Forecast**   **Status**

  FE-I1 spec complete 16-May-01      16-May-01        16-Jul-01      Delayed (See #1)

  FE-I1 FDR           13-Jun-01      \--              13-Jun-01      On Schedule
  ------------------- -------------- ---------------- -------------- ----------------

**Note #1**  Specification has been started, and was supposed to be
ready for June review. Testing of Analog Test chip has taken priority

**Murdock Gilchriese (Lawrence Berkeley Lab.)**

This report was prepared by K. K. Gan. We have completed the layout for
the 3rd DMILL prototype of the optical dice, DORIC-D3 and VDC-D3. There
are two improvements in the DORIC: the RC time constant in the feedback
circuit for canceling the pre-amp offset has been increased to 20 us so
that the die can handle larger offset. In addition, the feedback is now
connected directly into the input of the pre-amp via a 1 MOhm resistor.

The input coupling capacitor has been increased from 4 pF to 20 pF. This
design is much simpler than the IBM design submitted in February and can
handle pre-amp offset of up to 50 mV, even at corner transistor
parameters. The design was submitted near the end of May and we expect
to receive the dice in October.

**Kevin Einsweiler (Lawrence Berkeley Lab.)**

We are still awaiting the return of bump-bonded FE-D2S assemblies from
IZM and AMS for further characterization. They are now expected to
return during the month of June. In our Feb meeting with ATMEL, they
promised to process a new lot, using our FE-D2 masks, in which they
would divide the lot between wafers in which the top epitaxial layer was
deposited by their present US vendor, and wafers in which this layer was
deposited by a second German vendor. Preliminary evidence from other
designs indicated a significant yield improvement, and they suggested
exploring this for pixels. We will receive 10 wafers in LBL, and probe
them during the coming month.

We continue to place all of our design resources on the deep-submicron
design effort. We have received our TSMC Analog Test chip, submitted in
March. We have rapidly commissioned our new test system for this chip.
This system uses a PCMCIA I/O register to control the digital lines on
the chip, and a LabWindows program to support basic operations such as
DAC characterization, threshold scans, TOT scans, and timewalk scans.
Within about one week, we had the system and the chips working.

It appears that there are only three relatively minor problems with the
chip. The first is that the output pads were all inverting. The second
is that the readback function for the pixel control bits does not work.
Further simulation indicates that this is related to the risetime of the
load signals used during readback, and that if they were slowed
slightly, this function would work. The third problem was a power bus
sizing error for the DAC supplies (these DACs each consume a standing
current of 255uA), which causes some systematic shifts in the currents
delivered to the pixels.

We have carried out a detailed analog characterization of the chip. The
current reference works well, and the DACs are very linear (0.3LSB
differential linearity). The front-end performance can be monitored in
several ways. There is a multiplexed fast buffer which can display the
preamp waveform, or the two sides of the second stage waveform, for a
special test pixel. It has a test input for calibration purposes.
Second, there is a direct discriminator output from one pixel. Finally,
there is our usual FastOR readout, in which a programmable set of pixels
OR their discriminator outputs together for analysis. This latter signal
is used to drive all of our threshold, TOT, and timewalk scans.

The front-end waveforms look almost identical to those in simulation.
The noise is roughly what was expected. The noise of an unloaded pixel
is about 160-180e. There are programmable capacitive loads in the test
chip to allow adding load in 100fF increments. Our nominal design load
is 400fF, at which point the noise is about 300e. Our initial noise
measurements are relatively sensitive to environmental effects, which
were not always fully controlled during these measurements. Injection of
leakage current does not alter the preamp waveform shape or baseline
(unlike previous designs, where most TOT information was lost after
leakage injection). The noise increase for a 50nA leakage (this is the
design value, we expect only 30nA at end of lifetime) is roughly what is
expected, giving about 400e total noise.

We immediately noticed that the threshold dispersion is extremely large
for this front-end. There are only 20 pixels in each test chip, so in
order to gain statistics, we have averaged the results from threshold
scans on 5 different chips. This gives a very large dispersion of over
2000e, about 5 times larger than our design goal. Some of this comes
from dispersion between chips, but most seems to arise directly on one
chip. We have examined the design in some detail to understand this
effect, but we have only had the chips for a bit more than 2 weeks, so
this analysis is very preliminary. It appears that the threshold
dispersion of the design is quite sensitive to the matching of a number
of transistors in weak inversion. By taking measured VT matching numbers
as a function of transistor size from RD-49 work at CERN, we can
estimate the effects. A first analysis suggests that perhaps as much as
1500e of the threshold dispersion could be explained by this mechanism.
Further studies are needed, but we intend to modify the front-end layout
and significantly increase the size of those transistors which are most
critical for matching (some of which are quite small). This should allow
us to reduce the matching errors by about a factor of 2. Stay tuned for
further updates...

We were fortunate enough to get two short dedicated runs scheduled at
the 88\" Cyclotron for irradiations. The first of this was in late May,
and we irradiated a single TSMC test chip to 61 MRad. The chip was
operated continuously during the irradiation, and the current reference,
DAC performance, and front-end noise and threshold were monitored. There
were no major changes observed in the chip performance, despite the fact
that towards the end of the irradiation, we were providing a dose of
about 15MRad/hour. The current reference was observed to increase by
about 10%, but due to the way in which the reference is used by the
DACs, the change in DAC scale was only a few percent. There were no
systematic changes in the front-end noise performance. There were some
modest threshold shifts, but the threshold dispersion remained
essentially unchanged. Further lab characterization was performed on the
irradiated chip, and we observed that the trim DAC performance was
unchanged, as well as the timewalk performance. This is the first time
that we have observed our acceptable pre-rad performance persist under
the expected lifetime doses for ATLAS pixels!

There is a special current mirror inside the preamp that allows us to
directly measure the feedback current in each pixel (as well as the
leakage current). We have used this node to characterize the feedback
current dispersion between pixels, and to extract the feedback
capacitance by examining the dV/dt for the preamp return to baseline.
The feedback current dispersion is only about 15% between pixels, which
is quite acceptable. We have also checked the values for the injection
capacitors, and they also agree roughly with our extracted values. We
have characterized the new two new 5-bit trim DACs that are placed in
each pixel, and find them to have reasonable performance.

Meanwhile, work is continuing on all aspects of the complete FE-I chip.
We are preparing for a 2-day review at CERN in early June. This, plus
our test chip evaluation effort, have slowed down the main activity
somewhat. The integration of the chip is progressing well, but more
slowly than expected. The analog integration has not progressed much in
the last month, but it is almost complete. We have decided to integrate
significant \"smart\" decoupling into the column pairs, in order to
better manage the power distribution in the chip (we are very worried
about the large transient currents that are generated in the 0.25u
process when the large annular NMOS switch). These capacitors have a
\"test\" mode in which they check for low resistance across the
capacitor, and if it is found, automatically disconnect the capacitor
from ground so that no current flows. Each capacitor is about 1.5pF, and
fits in about 30x40u of area, conveniently inside a pixel. The digital
integration has been going smoothly. The layout of the column pair and
the EOC buffers and their related logic is now complete. Extensive
simulations are starting using TimeMill (an accelerated timing and power
simulator that works from SPICE netlists and BSIM models, which being
several orders of magnitude faster than SPICE), and Verilog. We intend
to use TimeMill at the column pair level as our timing simulation,
cross-checked on smaller netlists using ELDO SPICE. We are using Verilog
for the overall functional verification, and have developed some simple
code to check for the operation of all of the registers, etc.

In summary, very significant progress has been made towards a submission
of the complete pixel array to IBM this summer. However, we are
beginning to believe that we will submit in August, missing our July
milestone date by one month.

In order to exercise the next generation of chips from ATMEL and IBM to
the fullest extent possible, and in particular to develop the capability
to label chips as \"known good die\", and be sure that this
classification will remain true after exposure to the full radiation
doses of ATLAS, we are developing an improved test system.

We received the first PLL boards, and loaded two of them this month. One
has been undergoing preliminary testing. We have not been able to devote
much effort to this because of the higher priority given to the 0.25u
work. However, basic checking of the module has taken place. The power
and clock distribution are working, and the VME interface is working.
Further checking, which involves the real VHDL in the module, is just
starting.

We are now working on putting the final finishing touches on the PICT
schematics. We will need to make some minor modifications to cope with
what appears to be the final pinout for the FE chip. We plan to have a
full schematic review at the end of June. This will use other experts in
the engineering group at LBL, some of whom have worked on the similar
SCT test system. We have begun board layout. The layout of this
mixed-signal board will be somewhat challenging, and could easily take a
month. With our present complement of 1 FTE of engineering working on
this design, it is progressing, but significantly more slowly than
initially expected. However, we anticipate that it will be fully
operational in our labs by Sept, when it is required for testing the
returning FE-I wafers.

**1.1.1.3.2 Development/Prototypes**

+--------------------------+--------+---------+---------+-------------+
| **Milestone**            | ### Ba | **Pre   | **For   | **Status**  |
|                          | seline | vious** | ecast** |             |
+--------------------------+--------+---------+---------+-------------+
| FE-D3 submitted          | 2-     | 2       | 2       | Delayed     |
|                          | May-01 | -May-01 | -Dec-01 | (See #1)    |
+--------------------------+--------+---------+---------+-------------+
| Analog test chip         | 11-    | \--     | 11      | Completed   |
| delivered                | May-01 |         | -May-01 |             |
+--------------------------+--------+---------+---------+-------------+
| 1st IBM prototype        | 26-    | \--     | 26      | Delayed     |
| submitted (FE-I1)        | Jul-01 |         | -Jul-01 | (See #2)    |
+--------------------------+--------+---------+---------+-------------+
| FE-D3 wafers arrive      | 22-    | \--     | 22      | Delayed     |
|                          | Aug-01 |         | -Aug-01 | (See #3)    |
+--------------------------+--------+---------+---------+-------------+
| 1st IBM prototype        | 24-    | \--     | 24      | Delayed     |
| delivered                | Oct-01 |         | -Oct-01 | (See #4)    |
+--------------------------+--------+---------+---------+-------------+

**Note #1, 3**  We have delayed all further work on FE-D3 pending
submission of FE-I1 and study of its performance. At the present time,
no further DMILL submissions are foreseen unless significant problems
are observed with 0.25u designs

**Note #2, 4**  Testing of the Analog Test chip has revealed large
threshold dispersion. This must be improved before full submission.
Other accumulated delays suggest a one-month delay in the submission
date.

**1.1.1.4 Flex Hybrids/Optical Hybrids**

**1.1.1.4.1 Design**

  ----------------------- -------------- ---------------- -------------- --------------
  **Milestone**           **Baseline**   **Previous**     **Forecast**   **Status**

  Optical package         15-Jun-01      \--              15-Jun-01      On Schedule
  decision                                                               
  ----------------------- -------------- ---------------- -------------- --------------

Flex Hybrids -- University of Oklahoma **Rusty Boyd (University of
Oklahoma)**

The design and layout for the version 3 flex hybrid is behind schedule.
It became apparent when the layout was about 80% complete that the idea
of an AMS and DSM MCC compatible layout would lead to neither a final
MCC pad layout nor a final flex hybrid layout. Thus, it was decided to
design separate AMS and DSM layouts in order to keep the flex hybrid PRR
on schedule for June 2002. At the end of May, we were still considering
various pad layouts for the DSM MCC. This has been a complicated issue,
as we need to keep a layout that is essentially compatible with the AMS
MCC in order to prevent the need to redesign and fabricate circuit
boards, jigs, probe cards, etc. used for MCC testing and also meet the
layout requirements of the flex hybrid.

The AMS compatible flex is now designated v3 and the DSM version is v4.
The layout of these two versions only differ by the routing of the MCC
and the extra components (about 13) required by the AMS MCC. Therefore,
the routing for v3 is about 90% compatible with v4, which allows a quick
migration of the design from the AMS version the DSM version. In
addition, v4 should be very near to the final layout. It is anticipated
that v3 should be completed by the end of June and v4 by mid-July, as
two weeks will be spent traveling to Bonn, Genova and CERN in June.

**1.1.1.4.2 Development/Prototypes** **Murdock Gilchriese (Lawrence
Berkeley Lab.)**

This report was prepared by K. K. Gan. The new opto-packs designed for
the pixel detector have been fabricated. 31 single VCSEL opto-packs have
been produced. The VCSEL was placed using a new technique. In the old
method, the precision VCSEL placement was done using a jig. In this jig,
there is a slot for the base plus a pocket for the VCSEL. There are
three contributions to the VCSEL placement precision: the slight
oversize of the slot and pocket and the relative location of the pocket
with respect to the slot. These uncertainties yield opto-packs of
limited quality: 12 out of the 18 packages fabricated satisfy the
minimum coupled power requirement of 300 uW. In the new procedure, the
location of the pin on the cap mold is precisely measured so that the
VCSEL is placed precisely at the location where we expect the fiber. All
31 bases fabricated have coupled power significantly above the
specification. In addition, the caps are interchangeable: a cap was
tested on all the 31 bases and all yield power significantly above the
specification. This demonstrates that the cap is reusable. Two 3-PIN
opto-packs were fabricated and both have responsivity \~25% above the
spec. A review panel will choose between the OSU design and Taiwan
design in June. The new opto-board designed to use the pixel opto-packed
has been submitted and we expect the delivery in early June.

This report was prepared by S. Alam and F. Wappler.

Conducted tests on three AFHs (not populated):

2.2-4, 2.2-5, and 2.2-10.

\(1\) Tests of Conductivity (Opens & Shorts of Bus, Power, and FE-to-MCC
Traces)

Defects were only found on 2.2-4, where four traces were non-conducting
(FE0 to MCC, FE2 to MCC, two data traces at FE2); five corresponding
wirebond pads appeared grey/non-reflective (gold coating covered or
removed).

\(2\) Tests for Pinholes and HV Breaks (with Probe-to-AlFoil Setup, and
with LBNL HV Test Fixture)

An initial visual inspection was inconclusive. No defects were found
with the Probe-to-AlFoil technique up to 1050V. With the HV Fixture,
breakdowns occurred in all three AFHs;

2.2-5 at 450V, 2.2-4 and 2.2-10 at 550V.

Those breakdowns occurred during initial tests, while we were learning
to operate the HV Fixture; in particular without being completely
certain that the metallic ring around the survey hole was perfectly
aligned with the hole in the rubber layer of the HV Fixture. Only
subsequently we drilled a hole through one side of the HV Fixture to
better observe the alignment, and we cut approx. 2mm of one rubber band
side to ensure the rubber bands being completely separated by an aligned
AFH. The breakdowns remained observable at 50V to 350V, subject to
moderate pressure applied to the fixture.

Renewed visual inspection of the backside showed pinholes/burnmarks
through the bottom layer underneath the MCC pad (about two, in each of
the three tested AFHs), and an entire burned/blackened corner under the
MCC pad of 2.2-4.

Subsequent Probe-to-AlFoil tests showed breakdowns when connecting to
the corresponding pads (at 150V - 250V through the bottom metal layer
under the MCC, and at 650V through the top metal layer under the MCC),
and still no breakdown up to 1050V connecting to other metal traces via
corresponding pads.

Meeting at Genova on 06-09-01, Rusty Boyd inspected those three AFHs
under a microscope as well (apparently the performance of this
particular bottom cover layer type was not entirely surprising).

Various pictures of the setup can be found at
http://charm.phy.albany.edu/flex/flex_pics.html

Flex Hybrids - UOK **Rusty Boyd (University of Oklahoma)**

The CERN PCB shop will be unable to fabricate v3 or v4 flex before the
fall of 2001 because of a personnel shortage there, due to attrition.
The original plan was to have the CERN PCB shop fabricate v3, but now
they will be made by Compunetics. They estimate that they can fabricate
the flex circuits in about three weeks after receipt of the drawings.
The relaxed flex design rules have resulted in a 1/3 reduction in cost
of fabrication by Compunetics.

Fifteen CERN v2.2 flex hybrids have been assembled at Mipot in Italy,
including mounting and wire bonding of the MCC. Only five of these are
defect free, with 6 having defective MCC\'s. Although the MCC\'s were
believed to be good when shipped to Mipot, they were tested several
years ago. The application of thin Kapton tape over the traces in the
area of the test tab where no cover layer is present prevented
disintegration of the traces there during component loading this time.
At least two others have shorts due to Au bridges between traces.
Although the flex circuits are tested, it is done before Au plating in
order to repair defects in the Cu etching.

It has also been discovered that the cover layer on these flex circuits
is 60 microns thick instead of the 25 microns specified. In addition,
the cover layer has many defects, including holes that cause initial
breakdown at 500 V or less (see the Albany section of this report for
details). Visual inspection reveals several defects in each flex which
appear to be bubbles in the Pyralux.

**1.1.1.5 Modules**

**1.1.1.5.2 Development/Prototypes** **Maurice Garcia-Sciveres (Lawrence
Berkeley Lab.)**

LBL Module Assembly Status Report for May 30, 2001

Dummy-Dummy modules

No noticeable change in wirebond pull strength was seen after 24 hours
in C~3~F~8~. Three modules have been loaded on a sector using
\"production\" tooling and CGL. Measurements in progress before loading
remaining 3 modules on other side. No thermal cycling yet. No dummy
pigtails have been added yet.

Dummy Modules

Wirebonding on 3 dummy modules assembled with CERN V2 Flex is of
\"production quality\". One of the modules was bonded with zero misbonds
in full auto mode. Wirebond pull strength is consistent and high
(average around 8 grams).

Hot Modules

A second Flex V2 hot module has been assembled and wirebonded using
Compunetics flex and an Alenia module. Electrical tests have not yet
been performed due to priority for testing 0.25um test chip.

HV holdoff tests of flex HV test fixture has been sent to Albany and
further tests are in progress there.

Dummy wafers

The 6 wafers sent to Bonn were closely inspected by Ogumundur and by
Norbert, and all of them have been rejected as having too many defects
in the nitride passivation to proceed with bump deposition. It seems at
this point that the only way to recover any of the 25 wafers is to
remove the nitride passivation and re-coat. The vendor (Process
Specialties) is investigating the feasibility of removal of the nitride
without damage to the metal and oxide below. An injury has been sent to
IZM for possible alternatives to using thick low stress nitride (no
response yet). Deposition of thick low stress nitride on 8\" wafers is
not a widely available capability, and the path to improving the results
without going to another passivation is not clear at this point. Using a
different passivation would be the fastest way to recover the 8\" dummy
wafers.

Wafer Thinning

Removal of the glass \"handle\" wafer from the thinned test wafers was
problematic even after attaching with photoresist a second handle wafer
to the back of the thinned wafer. The problem is that the UV-release
tape adheres too strongly to the resist-coated surface of the bumped
wafer.

A second attempt is being made where the UV-release tape is pre-exposed
on most of its area, thus making a much weaker bond to the wafer being
thinned (but still strong enough for the grinding process).

**1.1.2 Silicon Strip System** **Abe Seiden (University Of Calif. At
Santa Cruz)**

This past month the Barrel Modules had a final design review. The review
was very successful and \"the most significant recommendation the
reviewers could give to the SCT team is to go into production as fast as
possible.\"

During May Carl Haber spent a significant amount of time at RAL to go
over the software which runs the module fabrication. This software has
not been functioning in a sufficiently smooth fashion at the LBNL
production site.

In the area of front-end chips, preparation continued for the July 4th
PRR. The tester at UCSC is running well and several wafers have been
tested both in the U.S. and at CERN allowing detailed comparisons. The
software to be used in analyzing the test results is still not
sufficiently transparent, although we are slowly beginning to be able to
do analyses in the U.S. Issues to be worked on in the coming month
include this software, settling on the final set of test vectors to be
used, and a choice of the number of repetitions of measurements to allow
sufficient statistics to pin down the gain, noise and offset without
requiring excessive test time.

**1.1.2.1 IC Electronics**

**1.1.2.1.1 Design**

  ---------------------------- -------------- ---------------- -------------- --------------
  **Milestone**                **Baseline**   **Previous**     **Forecast**   **Status**

  Production Readiness Review  15-Jun-01      \--              4-Jul-01       Delayed (See
  (PRR)                                                                       #1)
  ---------------------------- -------------- ---------------- -------------- --------------

**Note #1**  The PRR has been delayed until 4-Jul to further understand
one last post-rad problem we are having with some chips. SCT is moving
forward with the PRR on this date. Preparations are underway.

**Alexander A. Grillo (University Of Calif. At Santa Cruz)**

LBNL & UCSC

The wafer tester operated smoothly all month. The hardware is operating
without problems and the \"online\" programs seem to be stable for the
time being although we know some enhancements must be made before full
production starts. We have tested 5 reference wafers at UCSC, which were
already tested on the new tester at CERN and the old original tester at
CERN. The problem now is getting the analysis software working so that
we can analyze the test results and check the correlation of the various
testers. This has been frustrating this month. It has been an ongoing
struggle to get adequate software support from our European
collaborators. The original software developer is trying to help but it
is clear this is not his primary job. The CERN person who has most
recently been working on the software is also solely responsible for
testing wafers at CERN and coordinating material movement and inventory
there. We are working towards getting more control of the software here
in California but this is going slowly.

RAL has made good progress with their tester. It appears to be
functional and ready to test the reference wafers. They will be shipped
from UCSC to RAL as soon as we have some first analysis of the UCSC test
data indicating that re-test is not necessary.

Progress finding a solution to the lack of room for services continues
to be a problem. The ATLAS EB made a final decision to increase the GAP
by 40mm giving 32mm to the ID for extra services space and giving 8mm to
TC for contingency. This was done in spite of the fact that the ID
management, including the ID Project Engineer, did not agree with this
decision and stated clearly that they could not guarantee that a
solution was possible in the available space. The bottom line was that
the ID was told to find their own solution within the new parameters.
The SCT may be left with a choice between building something, which is
mechanically unreliable or electrically unreliable.

**1.1.2.1.2 Development/Prototypes**

  --------------------- -------------- ---------------- -------------- --------------
  **Milestone**         **Baseline**   **Previous**     **Forecast**   **Status**

  Test Systems Complete 3-Aug-01       \--              3-Aug-01       On Schedule
  --------------------- -------------- ---------------- -------------- --------------

LBNL & UCSC **Alexander A. Grillo (University Of Calif. At Santa Cruz)**

In spite of the fact that we have not completed the analysis of the
reference wafers on the new tester at UCSC, we have started to test new
untested wafers from the April delivery. These are from the 4-way split
of new epitaxy sub-contractor and a thinner oxide layer. Both are
experiments that Atmel believes may improve the yield. If the wafers
from the new epitaxy sub-contractor do show markedly improved yield,
they will launch a program to qualify the new sub-contractor for
production. That could happen as early as November or December of this
year.

**1.1.2.1.3 Production**

+-----------------------------+-------+-------+------+---------------+
| # Milestone                 | **    | **Pr  | **Fo | **Status**    |
|                             | Basel | eviou | reca |               |
|                             | ine** | s**   | st** |               |
+-----------------------------+-------+-------+------+---------------+
| Complete preproduction fab  | 28-F  | 30-M  | 3    | Delayed (See  |
|                             | eb-01 | ay-01 | 0-Ju | #1)           |
|                             |       |       | n-01 |               |
+-----------------------------+-------+-------+------+---------------+
| Complete preproduction      | 23-M  | 23-M  | 3    | Delayed (See  |
| design verification         | ay-01 | ay-01 | 0-Ju | #2)           |
|                             |       |       | n-01 |               |
+-----------------------------+-------+-------+------+---------------+
| Release/Start Full          | 6-J   | \--   | 1    | Delayed (See  |
| Electronics Production      | ul-01 |       | 5-Ju | #3)           |
|                             |       |       | l-01 |               |
+-----------------------------+-------+-------+------+---------------+

**Note #1**  The last of the 5 pre-production lots was delivered with
one out of spec fab parameter. We gave Atmel a conditional waiver in
that we said we would first test the wafers and then determine to accept
them only if the out of spec parameter did not effect yield or
performance. Atmel has also delivered some extra wafers to augment the
last lots which did yield poorly. We have not tested all the wafers and
therefore have not accepted the last lot. The remaining wafers should be
tested by end of June so that we can complete acceptance.

**Note #2**  We are still studying one post-rad problem. Progress has
been made in understanding the problem but it is not complete. This must
be done before the PRR on 4-Jul.

**Note #3**  See note on delay of PRR to 4-Jul. If the PRR on 4-Jul is
passed, we should start production by mid-July.

LBNL & UCSC **Alexander A. Grillo (University Of Calif. At Santa Cruz)**

The decision was made at the SCT Steering Group meeting to go forward
with the ABCD Production Readiness Review on 4-July. The goal will be to
issue the first production release order for 520 wafers as soon as
possible after that date. Atmel has started fabricating approximately 75
wafers even without our release but in anticipation of a successful PRR
in July. Those wafers will be ready for delivery as soon as we can issue
the order. The first large batch of 200 wafers will then be delivered in
late November or early December. Preparations are now in full swing for
the PRR.

**1.1.2.2 Hybrids/Cables/Fanouts**

**1.1.2.2.1 Design**

  ------------------------------ -------------- ---------------- -------------- --------------
  **Milestone**                  **Baseline**   **Previous**     **Forecast**   **Status**

  Start Procurement for          5-Mar-01       25-May-01        15-Jun-01      Delayed (See
  Production Hybrid Assembly                                                    #1)

  Hybrid/Module Final Design     16-Apr-01      \--              25-May-01      Completed
  Review                                                                        

  Release Hybrid Bids            30-Apr-01      \--              15-Jun-01      Delayed (See
                                                                                #2)

  Hybrid Bid Evaluation Complete 11-Jun-01      \--              15-Jul-01      Delayed (See
                                                                                #3)

  ATLAS PM Approval of Maj Procs 20-Aug-01      \--              20-Aug-01      On Schedule

  Hybrid/Module Production       3-Sep-01       \--              3-Sep-01       On Schedule
  Readiness Review                                                              

  Complete Award Hybrid          14-Sep-01      \--              14-Sep-01      On Schedule
  Contracts                                                                     
  ------------------------------ -------------- ---------------- -------------- --------------

**Note #1**  The FDR was completed but some minor modifications have
been circulated since.

**Note #2-3**  Not a US responsibility.

**Carl Haber (Lawrence Berkeley Lab.)**

This is no longer a US responsibility. An FDR was held this month and
the hybrid design was accepted. The Japanese group sent afterwards a
list of minor design modifications which are currently under review.

**1.1.2.2.2 Development & Prototype Fabrication** **Carl Haber (Lawrence
Berkeley Lab.)**

The hybrid-folding fixture was inspected. An additional assembly step is
pending and will be completed in June. A set of dummy hybrids is being
fabricated for assembly test purposes.

The temperature cycling test setup is still underway.

**1.1.2.2.3 Production**

+-----------------------------+--------+-------+--------+------------+
| # Milestone                 | **Base | **    | **Fore | **Status** |
|                             | line** | Previ | cast** |            |
|                             |        | ous** |        |            |
+-----------------------------+--------+-------+--------+------------+
| 1st Preproduction Hybrids   | 4-     | 1-S   | 15-    | Delayed    |
| Avail for Mod Assy          | Jun-01 | ep-01 | Sep-01 | (See #1)   |
+-----------------------------+--------+-------+--------+------------+
| Compl Preproduction Assy    | 13-    | 13-O  | 21-    | Delayed    |
|                             | Aug-01 | ct-01 | Oct-01 | (See #2)   |
+-----------------------------+--------+-------+--------+------------+
| Compl Testing of Preprod    | 3-     | 3-S   | 21-    | Delayed    |
| Hybrid                      | Sep-01 | ep-01 | Oct-01 | (See #3)   |
+-----------------------------+--------+-------+--------+------------+

**Note #1**  This will follow the hybrid design review and is set by
Japanese procurement schedule. The FDR is complete but some minor mods
have been circulated.

**Note #2-3**  Set by date of item 1 above.

**1.1.2.3 Module Assembly and Test**

**1.1.2.3.1 Design of Assembly & Test Tooling**

+--------------------------------+--------+-------+--------+----------+
| # Milestone                    | **Base | **    | **Fore | **       |
|                                | line** | Previ | cast** | Status** |
|                                |        | ous** |        |          |
+--------------------------------+--------+-------+--------+----------+
| Module FDR                     | 16-    | \--   | 25-    | C        |
|                                | Apr-01 |       | May-01 | ompleted |
+--------------------------------+--------+-------+--------+----------+
| Compl Design of Preprod Mod    | 3-     | \--   | 3-     | On       |
| Assy/Test                      | Sep-01 |       | Sep-01 | Schedule |
+--------------------------------+--------+-------+--------+----------+
| Module PRR                     | 3-     | \--   | 3-     | On       |
|                                | Sep-01 |       | Sep-01 | Schedule |
+--------------------------------+--------+-------+--------+----------+

**Carl Haber (Lawrence Berkeley Lab.)**

A visit was made to RAL this month. A number of aspects of the assembly
design were discussed. Additional drawings were obtained of the
metrology plate and the RAL hybrid-folding fixture. The folding fixture
seems too complex. We expect to either further develop ours or design a
new simpler one for us in the US.

**1.1.2.3.2 Development & Prototypes**

  ---------------------------- -------------- -------------- -------------- ----------------
  **Milestone**                **Baseline**   **Previous**   **Forecast**   **Status**

  Compl Assy of Proto Modules  5-Mar-01       \--            23-May-01      Completed (See
                                                                            #1)

  Compl Test/Measure Proto     16-Apr-01      \--            23-May-01      Completed (See
  Modules                                                                   #2)
  ---------------------------- -------------- -------------- -------------- ----------------

**Note #1**  Shift due to shift of module fdr and difficulty
commissioning UK fixtures and code. The FDR occurred and was passed. All
modules now are considered pre-production. Due to difficulties and
evolution of UK code and fixtures work continues partly on components
from the prototyping phase but all is in support of pre-production
effort now.

**Note #2**  Shift due to shift of module fdr and difficulty
commissioning UK fixtures and code. Same comments as Note #1 applies.

**Carl Haber (Lawrence Berkeley Lab.)**

Hardware was installed for Z motion. Currently this is controlled by a
separate box, but we will commission LabView code to run this in the
near future. A new manual focus wait routine was added to the LV system.

A visit was made to RAL. Problems with image processing and acquisition
were discussed and resolved during the visit. With some suggested mods
we expect our system will work properly now. Various other aspects of
the code and calibration process where covered as well.

Discussions were held at RAL concerning the commissioning of the new
assembly stages. An additional set of mods is now required to align
these stages properly.

An FDR of the baseboard design was held at CERN and the design was
accepted. Concern still remains about flatness and the nature of the
precision alignment holes. One recommendation was the SCT project
engineer's study these issues further.

Discussions were held at RAL concerning the metrology process using the
Smart Scope. A set of tests to try on our system was identified.

Used probe station vendors were contacted and visited so that a station
can be procured for use in the module detector probing. The RAL system
was examined during the site visit there. An appropriate current
measuring instrument was identified and will be ordered. A new computer
was installed for these measurements.

**Murdock Gilchriese (Lawrence Berkeley Lab.)**

Work continued on dummy module parts. Tooling for making dummy hybrid
assemblies was completed and one dummy hybrid made. Dummy detectors were
processed in the UC Berkeley Microlab.

**1.1.2.3.3 Production**

  ------------------------------- -------------- ---------------- -------------- --------------
  **Milestone**                   **Baseline**   **Previous**     **Forecast**   **Status**

  Complete Preproduction Module   30-Jul-01      \--              30-Oct-01      Delayed (See
  Assembly                                                                       #1)

  Complete Preproduction Module   3-Sep-01       3-Sep-01         30-Oct-01      Delayed (See
  Testing                                                                        #2)
  ------------------------------- -------------- ---------------- -------------- --------------

**Note #1-2**  Requires pre-production hybrids which won\'t be available
until the end of summer.

**1.1.3 ROD Design & Fabrication** **Dick Jared (Lawrence Berkeley
Lab.)**

The data path through the ROD has been tested. The data flow is correct.
This is a major step in the debugging of the ROD. System testing at
Cambridge has been scheduled and tickets purchased. The test will start
June 23, 2001. This testing will include the ROD, ROD Test Stand
Software, TIM, BOC and RCC (the complete system). Minor corrections are
being made to the ROD formatter, event fragment builder and router.
These corrects are relatively simple and present no concerns. The
controller all though functional has some problems that will require
rewriting of the code that generates the event ID and dynamic mask. The
current version supports data flow testing but is not optimal. The code
rewriting is expected to be completed before the start of the Cambridge
system test.

**1.1.3.4 ROD Test Stand**

**1.1.3.4.3 SCT/Pixel Test Stand Software**

  ------------------------------- -------------- ---------------- -------------- --------------
  **Milestone**                   **Baseline**   **Previous**     **Forecast**   **Status**

  Production Diagnostic Test      29-Sep-00      29-Jul-01        29-Aug-01      Delayed (See
  Stand Completed                                                                #1)
  ------------------------------- -------------- ---------------- -------------- --------------

**Note #1**  The test stand software is complete. It will not be
verified as production test stand until the first card has been debugged
and tested. This was expected in 2000 but the date now selected for
completion is August 29, 2001. This is caused by the slow progress in
testing the ROD. Recently much testing of software has been performed.
With the working ROD infrastructure, the testing of the software can
proceed at its own pace. The software is 80% complete. Completion will
be done when the first ROD is full completed. The completion of the
software is waiting on the production models of the ROD. Sufficient time
after debugging of the ROD is projected into August. This will be in
time for the production of the ROD.

**1.1.3.6 ROD Prototype Evaluation**

**1.1.3.6.1 SCT Prototype Testing**

  ---------------------------- -------------- ---------------- -------------- ------------
  **Milestone**                **Baseline**   **Previous**     **Forecast**   **Status**

  SCT Complete ROD Proto       7-Jun-01       \--              7-Jun-01       On Schedule
  Testing                                                                     
  ---------------------------- -------------- ---------------- -------------- ------------

**1.1.3.6.3 User Evaluation of ROD in Europe**

  -------------------------- -------------- ---------------- -------------- -------------------
  **Milestone**              **Baseline**   **Previous**     **Forecast**   **Status**

  SCT ATLAS Final Design     11-Jun-01      \--              11-Aug-01      Delayed (See #1)
  Review                                                                    

  SCT ROD User Evaluation    1-Oct-01       \--              1-Oct-01       On Schedule
  Complete                                                                  
  -------------------------- -------------- ---------------- -------------- -------------------

**Note #1**  The delay is partially due to progress and the ROD.
Availability of the review personnel has caused the date to be projected
for August.

**1.1.3.7 ROD Production Model**

**1.1.3.7.1 Updating of ROD to production Model**

  ---------------------- -------------- ---------------- -------------- -----------------
  **Milestone**          **Baseline**   **Previous**     **Forecast**   **Status**

  SCT ATLAS ROD PRR      1-Oct-01       \--              1-Oct-01       On Schedule
  ---------------------- -------------- ---------------- -------------- -----------------

**1.1.3.7.3 Evaluation of Production Model**

  ------------------------- -------------- ---------------- -------------- -----------------
  **Milestone**             **Baseline**   **Previous**     **Forecast**   **Status**

  Start Production          13-Apr-01      \--              13-Jul-01      Delayed (See #1)
  Procurements                                                             

  Release Production        16-May-01      16-Jun-01        25-Jul-01      Delayed (See #2)
  Dwg/Specs                                                                

  Pixel ROD Design complete 14-Jun-01      14-Jul-01        1-Aug-01       Delayed (See #3)

  Release Production Bids   4-Jul-01       \--              4-Jul-01       On Schedule

  Bid Evaluation Complete   15-Aug-01      \--              15-Aug-01      On Schedule
  ------------------------- -------------- ---------------- -------------- -----------------

**Note #1**  The procurement should wait for the final design review in
July. The change in the parts market due to low demand should allow the
parts to be available on time.

**Note #2**  The current progress show that the drawing will not be
ready till June. This was caused by the extended time required to debug
the proto ROD. Production is not expected to slip.

**Note #3**  The code for the pixel specific part is written and
simulated. The one-month delay is expected to have little impact. The
delay of 2 months is expected to have little impact.

**1.1.3.8 ROD Fabrication**

**1.1.3.8.1 ROD 5% Production**

  ------------------------------ -------------- ---------------- -------------- -------------
  **Milestone**                  **Baseline**   **Previous**     **Forecast**   **Status**

  Project Managers Approval 5%   1-Oct-01       \--              1-Oct-01       On Schedule
  Production                                                                    
  ------------------------------ -------------- ---------------- -------------- -------------

**1.2 TRT**

**Milestones with changed forecast dates:**

+--------------------------+-----------+---------+------+------------+
| **1.2.1.1.3 Production** |           |         |      |            |
+--------------------------+-----------+---------+------+------------+
| **Milestone**            | **B       | **Previ | **Fo | **Status** |
|                          | aseline** | ous**   | reca |            |
|                          |           |         | st** |            |
+--------------------------+-----------+---------+------+------------+
| Module Assy #1 IU Module | 28-Feb-01 | 28      | 2    | Delayed    |
| Assy CUM #4 Complete     |           | -May-01 | 8-Ju | (See #1)   |
|                          |           |         | l-01 |            |
+--------------------------+-----------+---------+------+------------+
| Shells (Module #3) CUM   | 28-Feb-01 | 28      | 2    | Delayed    |
| #9 Available             |           | -May-01 | 8-Ju | (See #2)   |
|                          |           |         | n-01 |            |
+--------------------------+-----------+---------+------+------------+
| Module Assy #1 IU Module | 30-Mar-01 | 30      | 3    | Delayed    |
| Assy CUM #5 Complete     |           | -May-01 | 0-Ju | (See #3)   |
|                          |           |         | n-01 |            |
+--------------------------+-----------+---------+------+------------+
| HV Plates (Module #1)    | 30-Mar-01 | 30      | 3    | Delayed    |
| CUM #12 Available        |           | -May-01 | 0-Ju | (See #4)   |
|                          |           |         | l-01 |            |
+--------------------------+-----------+---------+------+------------+
| HV Plates (Module #2)    | 30-Mar-01 | 30      | 3    | Delayed    |
| CUM #12 Available        |           | -May-01 | 0-Ju | (See #5)   |
|                          |           |         | l-01 |            |
+--------------------------+-----------+---------+------+------------+
| HV Plates (Module #3)    | 30-Mar-01 | 30      | 3    | Delayed    |
| CUM #9 Available         |           | -May-01 | 0-Se | (See #6)   |
|                          |           |         | p-01 |            |
+--------------------------+-----------+---------+------+------------+
| Shells (Module #2) CUM   | 31-May-01 | 31      | 3    | Delayed    |
| #15 Available            |           | -May-01 | 1-Ju | (See #7)   |
|                          |           |         | l-01 |            |
+--------------------------+-----------+---------+------+------------+
| Shells (Module #3) CUM   | 31-May-01 | 31      | 3    | Delayed    |
| #12 Available            |           | -May-01 | 1-Ju | (See #8)   |
|                          |           |         | l-01 |            |
+--------------------------+-----------+---------+------+------------+
| Shells (Module #1) CUM   | 31-May-01 | 31      | 3    | Delayed    |
| #16 Available            |           | -May-01 | 1-Ju | (See #9)   |
|                          |           |         | l-01 |            |
+--------------------------+-----------+---------+------+------------+
| CUM #32 Kit Available    | 31-May-01 | 31      | 1-Se | Delayed    |
|                          |           | -May-01 | p-01 | (See #10)  |
+--------------------------+-----------+---------+------+------------+
| CUM #9 Test Complete     | 31-May-01 | 31      | 1-Se | Delayed    |
|                          |           | -May-01 | p-01 | (See #11)  |
+--------------------------+-----------+---------+------+------------+
| HV Plates (Module #1)    | 31-May-01 | 31      | 3    | Delayed    |
| CUM #16 Available        |           | -May-01 | 1-Ju | (See #12)  |
|                          |           |         | l-01 |            |
+--------------------------+-----------+---------+------+------------+
| HV Plates (Module #2)    | 31-May-01 | 31      | 3    | Delayed    |
| CUM #15 Available        |           | -May-01 | 1-Ju | (See #13)  |
|                          |           |         | l-01 |            |
+--------------------------+-----------+---------+------+------------+
| Module Assy #1 IU Module | 31-May-01 | 31      | 1-Se | Delayed    |
| Assy CUM #9 Complete     |           | -May-01 | p-01 | (See #14)  |
+--------------------------+-----------+---------+------+------------+
| Module Assy #2 Duke      | 31-May-01 | 31      | 3    | Delayed    |
| Module Assy CUM #9       |           | -May-01 | 1-Ju | (See #15)  |
| Complete                 |           |         | l-01 |            |
+--------------------------+-----------+---------+------+------------+
| Module Assy #3 Duke & IU | 31-May-01 | 31      | 1-Se | Delayed    |
| Module Assy CUM #4       |           | -May-01 | p-01 | (See #16)  |
| Complete                 |           |         |      |            |
+--------------------------+-----------+---------+------+------------+
| CUM #16,000 Available    | 31-May-01 | 31      | 1-Ju | Delayed    |
| from Hampton             |           | -May-01 | n-01 | (See #17)  |
+--------------------------+-----------+---------+------+------------+
| **Note #1, 10-17**  Held |           |         |      |            |
| up due to production     |           |         |      |            |
| pause.                   |           |         |      |            |
|                          |           |         |      |            |
| **Note #2**  Vision has  |           |         |      |            |
| started an accelerated   |           |         |      |            |
| production. We expect to |           |         |      |            |
| catch up soon, but this  |           |         |      |            |
| has not been a hold up.  |           |         |      |            |
|                          |           |         |      |            |
| **Note #3**  Slow down   |           |         |      |            |
| do to production pause.  |           |         |      |            |
|                          |           |         |      |            |
| **Note #4**  HV plates   |           |         |      |            |
| are not available for    |           |         |      |            |
| kits.                    |           |         |      |            |
|                          |           |         |      |            |
| **Note #5-6**  In        |           |         |      |            |
| production, but not here |           |         |      |            |
| yet.                     |           |         |      |            |
|                          |           |         |      |            |
| **Note #7-9**  Shells    |           |         |      |            |
| are keeping up with      |           |         |      |            |
| production but are       |           |         |      |            |
| delayed WRT schedule.    |           |         |      |            |
+--------------------------+-----------+---------+------+------------+

  ---------------------------------- -------------- -------------- -------------- --------------
  **1.2.1.2.3 Production**                                                        

  **Milestone**                      **Baseline**   **Previous**   **Forecast**   **Status**

  Production Management Contingency  2-Jul-01       2-Jul-01       2-Oct-01       Delayed (See
  Go-Ahead                                                                        #1)

  **Note #1**  Next meeting will be                                               
  in October.                                                                     
  ---------------------------------- -------------- -------------- -------------- --------------

  ---------------------------------- -------------- -------------- -------------- --------------
  **1.2.1.3 Installation**                                                        

  **Milestone**                      **Baseline**   **Previous**   **Forecast**   **Status**

  Installation Management            2-Jul-01       2-Jul-01       2-Oct-01       Delayed (See
  Contingency Go-Ahead                                                            #1)

  **Note #1**  Next meeting will be                                               
  in October.                                                                     
  ---------------------------------- -------------- -------------- -------------- --------------

**1.2.1 Barrel Mechanics**

**1.2.1.1 Barrel Module** **Ken McFarlane (Hampton University)**

See details in sub-categories.

**Harold Ogren (Indiana University)**

Design work continues on the space frame and the module assembly
tooling. This is being done in collaboration with CERN and Protvino. We
are also working on the Module services envelope and the cooling plates.

**1.2.1.1.3 Production**

  ------------------------------ -------------- ---------------- -------------- ----------------
  **Milestone**                  **Baseline**   **Previous**     **Forecast**   **Status**

  HV Plates (Module #3) CUM #3   31-Jan-01      \--              30-Jun-01      Delayed (See #1)
  Available                                                                     

  CUM #18 Kit Available          28-Feb-01      \--              1-Jun-01       Delayed (See #2)

  HV Plates (Module #1) CUM #8   28-Feb-01      \--              28-Jun-01      Delayed (See #3)
  Available                                                                     

  HV Plates (Module #2) CUM #8   28-Feb-01      \--              28-Jun-01      Delayed (See #4)
  Available                                                                     

  HV Plates (Module #3) CUM #5   28-Feb-01      \--              28-Jun-01      Delayed (See #5)
  Available                                                                     

  Module Assy #1 IU Module Assy  28-Feb-01      28-May-01        28-Jul-01      Delayed (See #6)
  CUM #4 Complete                                                               

  Shells (Module #3) CUM #9      28-Feb-01      28-May-01        28-Jun-01      Delayed (See #7)
  Available                                                                     

  CUM #12,000 Available from     30-Mar-01      \--              30-Jun-01      Delayed (See #8)
  Hampton                                                                       

  CUM #18,743 Available from     30-Mar-01      \--              30-May-01      Completed
  CERN                                                                          

  HV Plates (Module #1) CUM #12  30-Mar-01      30-May-01        30-Jul-01      Delayed (See #9)
  Available                                                                     

  HV Plates (Module #2) CUM #12  30-Mar-01      30-May-01        30-Jul-01      Delayed (See
  Available                                                                     #10)

  HV Plates (Module #3) CUM #9   30-Mar-01      30-May-01        30-Sep-01      Delayed (See
  Available                                                                     #11)

  Module Assy #1 IU Module Assy  30-Mar-01      30-May-01        30-Jun-01      Delayed (See
  CUM #5 Complete                                                               #12)

  Module Assy #3 Duke & IU       30-Mar-01      \--              30-Jun-01      Delayed (See
  Module Assy CUM #2 Complete                                                   #13)

  Shells (Module #1) CUM #12     30-Mar-01      \--              30-May-01      Completed
  Available                                                                     

  CUM #14,097 Available from     30-Apr-01      \--              30-Jul-01      Delayed (See
  Hampton                                                                       #14)

  CUM #27 Kit Available          30-Apr-01      \--              30-Sep-01      Delayed (See
                                                                                #15)

  CUM #5 Test Complete           30-Apr-01      \--              30-Sep-01      Delayed (See
                                                                                #16)

  HV Plates (Module #1) CUM #14  30-Apr-01      \--              30-Jul-01      Delayed (See
  Available                                                                     #17)

  HV Plates (Module #2) CUM #14  30-Apr-01      \--              30-Jul-01      Delayed (See
  Available                                                                     #18)

  HV Plates (Module #3) CUM #11  30-Apr-01      \--              30-Sep-01      Delayed (See
  Available                                                                     #19)

  Module Assy #1 IU Module Assy  30-Apr-01      \--              30-Jun-01      Delayed (See
  CUM #7 Complete                                                               #20)

  Module Assy #3 Duke & IU       30-Apr-01      \--              30-Sep-01      Delayed (See
  Module Assy CUM #3 Complete                                                   #21)

  CUM #16,000 Available from     31-May-01      31-May-01        1-Jun-01       Delayed (See
  Hampton                                                                       #22)

  CUM #2343 Available from CERN  31-May-01      \--              31-May-01      Completed

  CUM #32 Kit Available          31-May-01      31-May-01        1-Sep-01       Delayed (See
                                                                                #23)

  CUM #9 Test Complete           31-May-01      31-May-01        1-Sep-01       Delayed (See
                                                                                #24)

  HV Plates (Module #1) CUM #16  31-May-01      31-May-01        31-Jul-01      Delayed (See
  Available                                                                     #25)

  HV Plates (Module #2) CUM #15  31-May-01      31-May-01        31-Jul-01      Delayed (See
  Available                                                                     #26)

  HV Plates (Module #3) CUM #12  31-May-01      \--              31-Jul-01      Delayed (See
  Available                                                                     #27)

  Module Assy #1 IU Module Assy  31-May-01      31-May-01        1-Sep-01       Delayed (See
  CUM #9 Complete                                                               #28)

  Module Assy #2 Duke Module     31-May-01      31-May-01        31-Jul-01      Delayed (See
  Assy CUM #9 Complete                                                          #29)

  Module Assy #3 Duke & IU       31-May-01      31-May-01        1-Sep-01       Delayed (See
  Module Assy CUM #4 Complete                                                   #30)

  Shells (Module #1) CUM #16     31-May-01      31-May-01        31-Jul-01      Delayed (See
  Available                                                                     #31)

  Shells (Module #2) CUM #15     31-May-01      31-May-01        31-Jul-01      Delayed (See
  Available                                                                     #32)

  Shells (Module #3) CUM #12     31-May-01      31-May-01        31-Jul-01      Delayed (See
  Available                                                                     #33)

  Wire Joints -1 CUM #28 (600/m) 31-May-01      \--              31-May-01      Completed
  Available                                                                     

  Wire Joints -2 CUM #11 (200/m) 31-May-01      \--              31-May-01      Completed
  Available                                                                     

  Wire Joints -2 CUM #13 (200/m) 28-Jun-01      \--              28-Jun-01      On Schedule
  Available                                                                     

  CUM #37 Kit Available          29-Jun-01      \--              29-Jun-01      On Schedule

  HV Plates (Module #1) CUM #17  29-Jun-01      \--              29-Jun-01      On Schedule
  Available                                                                     

  HV Plates (Module #2) CUM #17  29-Jun-01      \--              29-Jun-01      On Schedule
  Available                                                                     

  HV Plates (Module #3) CUM #13  29-Jun-01      \--              29-Jul-01      Delayed (See
  Available                                                                     #34)

  Module Assy #1 IU Module Assy  29-Jun-01      \--              29-Jun-01      On Schedule (See
  CUM #11 Complete                                                              #35)

  Module Assy #2 Duke Module     29-Jun-01      \--              29-Jun-01      On Schedule
  Assy CUM #11 Complete                                                         

  Module Assy #3 Duke & IU       29-Jun-01      \--              29-Sep-01      Delayed (See
  Module Assy CUM #6 Complete                                                   #36)

  Shells (Module #1) CUM #17     29-Jun-01      \--              29-Jun-01      On Schedule
  Available                                                                     

  Shells (Module #2) CUM #17     29-Jun-01      \--              29-Jun-01      On Schedule
  Available                                                                     

  Shells (Module #3) CUM #13     29-Jun-01      \--              29-Jun-01      On Schedule
  Available                                                                     

  Wire Joints -1 CUM #32 (600/m) 29-Jun-01      \--              29-Jun-01      On Schedule
  Available                                                                     

  CUM #18,200 Available from     30-Jun-01      \--              30-Jun-01      On Schedule
  Hampton                                                                       

  CUM #25,643 Available from     30-Jun-01      \--              30-Jun-01      On Schedule
  CERN                                                                          

  Mangement Contingency Go-Ahead 2-Jul-01       \--              2-Jul-01       On Schedule

  CUM #20,665 Available from     31-Jul-01      \--              31-Jul-01      On Schedule
  Hampton                                                                       

  CUM #27,943 Available from     31-Jul-01      \--              31-Jul-01      On Schedule
  CERN                                                                          

  CUM #42 Kit Available          31-Jul-01      \--              31-Jul-01      On Schedule

  HV Plates (Module #1) CUM #18  31-Jul-01      \--              31-Jul-01      On Schedule
  Available                                                                     

  HV Plates (Module #2) CUM #18  31-Jul-01      \--              31-Jul-01      On Schedule
  Available                                                                     

  HV Plates (Module #3) CUM #14  31-Jul-01      \--              31-Jul-01      On Schedule
  Available                                                                     

  Module Assy #1 IU Module Assy  31-Jul-01      \--              31-Jul-01      On Schedule
  CUM #13 Complete                                                              

  Module Assy #2 Duke Module     31-Jul-01      \--              31-Jul-01      On Schedule
  Assy CUM #13 Complete                                                         

  Module Assy #3 Duke & IU       31-Jul-01      \--              31-Jul-01      On Schedule
  Module Assy CUM #8 Complete                                                   

  Shells (Module #1) CUM #18     31-Jul-01      \--              31-Jul-01      On Schedule
  Available                                                                     

  Shells (Module #2) CUM #18     31-Jul-01      \--              31-Jul-01      On Schedule
  Available                                                                     

  Shells (Module #3) CUM #14     31-Jul-01      \--              31-Jul-01      On Schedule
  Available                                                                     

  Wire Joints -1 CUM #36 (600/m) 31-Jul-01      \--              31-Jul-01      On Schedule
  Available                                                                     

  Wire Joints -2 CUM #15 (200/m) 31-Jul-01      \--              31-Jul-01      On Schedule
  Available                                                                     

  CUM #1 Kit Available           31-Aug-01      \--              31-Aug-01      On Schedule

  CUM #23,000 Available from     31-Aug-01      \--              31-Aug-01      On Schedule
  Hampton                                                                       

  CUM #30,243 Available from     31-Aug-01      \--              31-Aug-01      On Schedule
  CERN                                                                          

  CUM #48 Kit Available          31-Aug-01      \--              31-Aug-01      On Schedule

  HV Plates (Module #1) CUM #20  31-Aug-01      \--              31-Aug-01      On Schedule
  Available                                                                     

  HV Plates (Module #2) CUM #19  31-Aug-01      \--              31-Aug-01      On Schedule
  Available                                                                     

  HV Plates (Module #3) CUM #15  31-Aug-01      \--              31-Aug-01      On Schedule
  Available                                                                     

  Module Assy #1 IU Module Assy  31-Aug-01      \--              31-Aug-01      On Schedule
  CUM #15 Complete                                                              

  Module Assy #2 Duke Module     31-Aug-01      \--              31-Aug-01      On Schedule
  Assy CUM #15 Complete                                                         

  Module Assy #3 Duke & IU       31-Aug-01      \--              31-Aug-01      On Schedule
  Module Assy CUM #10 Complete                                                  

  Shells (Module #1) CUM #20     31-Aug-01      \--              31-Aug-01      On Schedule
  Available                                                                     

  Shells (Module #2) CUM #19     31-Aug-01      \--              31-Aug-01      On Schedule
  Available                                                                     

  Shells (Module #3) CUM #15     31-Aug-01      \--              31-Aug-01      On Schedule
  Available                                                                     

  Wire Joints -1 CUM #40 (600/m) 31-Aug-01      \--              31-Aug-01      On Schedule
  Available                                                                     

  Wire Joints -2 CUM #17 (200/m) 31-Aug-01      \--              31-Aug-01      On Schedule
  Available                                                                     

  CUM #25,400 Available from     28-Sep-01      \--              28-Sep-01      On Schedule
  Hampton                                                                       

  CUM #32,543 Available from     28-Sep-01      \--              28-Sep-01      On Schedule
  CERN                                                                          

  CUM #54 Kit Available          28-Sep-01      \--              28-Sep-01      On Schedule

  HV Plates (Module #1) CUM #21  28-Sep-01      \--              28-Sep-01      On Schedule
  Available                                                                     

  HV Plates (Module #2) CUM #21  28-Sep-01      \--              28-Sep-01      On Schedule
  Available                                                                     

  HV Plates (Module #3) CUM #16  28-Sep-01      \--              28-Sep-01      On Schedule
  Available                                                                     
  ------------------------------ -------------- ---------------- -------------- ----------------

  ------------------------------ ----------- ------- ----------- ----------------
  Module Assy #1 IU Module Assy  28-Sep-01   \--     28-Sep-01   On Schedule
  CUM #17 Complete                                               

  Module Assy #2 Duke Module     28-Sep-01   \--     28-Sep-01   On Schedule
  Assy CUM #17 Complete                                          

  Module Assy #3 Duke & IU       28-Sep-01   \--     28-Sep-01   On Schedule
  Module Assy CUM #12 Complete                                   

  Shells (Module #1) CUM #21     28-Sep-01   \--     28-Sep-01   On Schedule
  Available                                                      

  Shells (Module #2) CUM #21     28-Sep-01   \--     28-Sep-01   On Schedule
  Available                                                      

  Shells (Module #3) CUM #16     28-Sep-01   \--     28-Sep-01   On Schedule
  Available                                                      

  Wire Joints -1 CUM #44 (600/m) 28-Sep-01   \--     28-Sep-01   On Schedule
  Available                                                      

  Wire Joints -2 CUM #19 (200/m) 28-Sep-01   \--     28-Sep-01   On Schedule
  Available                                                      

  CUM #25 Test Complete          30-Sep-01   \--     31-May-02   Delayed (See
                                                                 #37)

  Production Modules A Testing   30-Sep-01   \--     30-Sep-01   On Schedule
  Complete                                                       

  Shells (Module #3) CUM #10     30-Sep-01   \--     30-Sep-01   On Schedule
  Available                                                      

  CUM #27,800 Available from     31-Oct-01   \--     31-Oct-01   On Schedule
  Hampton                                                        

  CUM #31 Test Complete          31-Oct-01   \--     31-Oct-01   On Schedule

  CUM #34,843 Available from     31-Oct-01   \--     31-Oct-01   On Schedule
  CERN                                                           

  CUM #60 Kit Available          31-Oct-01   \--     31-Oct-01   On Schedule

  HV Plates (Module #1) CUM #22  31-Oct-01   \--     31-Oct-01   On Schedule
  Available                                                      

  HV Plates (Module #2) CUM #22  31-Oct-01   \--     31-Oct-01   On Schedule
  Available                                                      

  HV Plates (Module #3) CUM #17  31-Oct-01   \--     31-Oct-01   On Schedule
  Available                                                      

  Module Assy #1 IU Module Assy  31-Oct-01   \--     31-Oct-01   On Schedule
  CUM #19 Complete                                               

  Module Assy #2 Duke Module     31-Oct-01   \--     31-Oct-01   On Schedule
  Assy CUM #19 Complete                                          

  Module Assy #3 Duke & IU       31-Oct-01   \--     31-Oct-01   On Schedule
  Module Assy CUM #14 Complete                                   

  Modules Production A Complete  31-Oct-01   \--     31-Oct-01   On Schedule

  Shells (Module #1) CUM #22     31-Oct-01   \--     31-Oct-01   On Schedule
  Available                                                      

  Shells (Module #2) CUM #22     31-Oct-01   \--     31-Oct-01   On Schedule
  Available                                                      

  Shells (Module #3) CUM #17     31-Oct-01   \--     31-Oct-01   On Schedule
  Available                                                      

  Wire Joints -1 CUM #48 (600/m) 31-Oct-01   \--     31-Oct-01   On Schedule
  Available                                                      

  Wire Joints -2 CUM #21 (200/m) 31-Oct-01   \--     31-Oct-01   On Schedule
  Available                                                      
  ------------------------------ ----------- ------- ----------- ----------------

**Note #1**  HV plate type 3, has been delayed. We now have new plates
being manufactured.

**Note #2-5, 21, 34, 36**  Waiting on HV plates.

**Note #6**  Held up due to production pause.

**Note #7**  Vision has started an accelerated production. We expect to
catch up soon, but this has not been a hold up.

**Note #8**  Hampton is now back in production and should fill this
quota in April.

**Note #9**  HV plates are not available for kits.

**Note #10-11**  In production, but not here yet.

**Note #12**  Slow down due to production pause.

**Note #13**  Awaiting HV plate for type 3.

**Note #14**  Delayed due to late shipment and production pause.

**Note #15**  Successful shipment from Dubna.

**Note #16**  Testing at Hampton still not operational.

**Note #17-18**  American Circuits working on backlog of approved
plates.

**Note #19**  HV plate 3 are delayed due to machining problems.

**Note #20**  Delayed due to late HV plate and production pause.

**Note #22-26, 28-30**  Delayed due to pause.

**Note #27**  Delayed due to HV 3 plates.

**Note #31-33**  Shells are keeping up with production but are delayed
wrt schedule.

**Note #35**  Delayed due to pause and parts

**Note #37**  This appears to be out of sequence.

**Ken McFarlane (Hampton University)**

**1.2.1.1.3 Production**

Staff

No change; we now have a total of 5 technicians (including the QA tech,
who does not do assembly work).

**1.2.1.1.3.1 Detector Elements**

**1.2.1.1.3.1.1 Straws**

Straws were received from JINR-Dubna (4,900).

**1.2.1.1.3.1.1.2 End sockets (end plugs)**

**1.2.1.1.3.1.1.4.1 Twister**

**1.2.1.1.3.1.1.4.2 Twister**

**1.2.1.1.3.1.1.8.2 Wire bushing (eyelet)**

**1.2.1.1.3.1.1.8.3 Crimp pin (taper pin)**

**1.2.1.1.3.1.1.8.5, 6 Gas connections**

All purchase orders or contracts for the above components have been
placed, and deliveries are on schedule.

**1.2.1.1.3.4 Assembly**

Straw subassemblies

2,546 straw subassemblies were completed, 1,253 shipped, leaving 2,638
in inventory.

Radiator packs

Two type-1, and one type-2, radiator pack kits were produced this month.

Dividers

Three divider kits were produced.

Wire supports

No outer wire supports were assembled this month. 1,094 were shipped,
leaving none in inventory.

Capacitor Barrels

These are now produced as needed for tension-plate processing. Reports
on these will be discontinued.

Tension plates

These are now processed as needed to create HV plate/TP kits. Reports on
these will be discontinued.

HV plate testing and assembly with tension plates

Three HV plate/TP kits were produced (Two type-1, one type-2).

HV Plates **Seog Oh (Duke University)**

We have received several new sets of Type III plates and they were
measured at FNAL. The measurement showed that all non-mirrored plates
met the specification while all mirrored plates were not. We have talked
with the vendor and we do not understand the reason. We are
investigating. Meanwhile the good HV plates for Type I and Type II were
sent to American Circuit for the final assembly. We should have \~10
good sets of plates for each type within a couple of weeks.

Module Construction

Module 2.06

The module has gone through the final HV and leak test and meets both
specs. This is ready for the x-ray scan.

Module 2.07

This module has also gone through the final HV and leak test. The leak
rate is somewhat worse than the previous modules but still meets the
specification. This is also ready for the x-ray scan.

Module 2.08

We have just started the module.

Module 2.09

We are waiting for the components.

Wire-joint production

The wire-joint production is moving well. Both stations are producing
high quality wire-joints.

The number of joints produced is above LOB requirement.

**Harold Ogren (Indiana University)**

Divider material:

All of the laser cut sheets have been shipped to Hampton. This part of
our production is complete, but we have spare stock to supply some extra
dividers if needed.

Radiator fiber punching

Radiator material of all types is almost complete at Breiner Co. There
are only a few more shipments of type 3 required. We have spare material
at Breiner and at Bloomington to handle extra requests.

Module production:

Module 1.01 has been shipped to Dubna for radiation testing. It has
arrived at the Laboratory. It was set up for the test by Pauline Gagnon
and the staff at the laboratory. The radiation test has started. First
indications are that current rates are acceptable (even with C02, the
modules has some limited gain). The test will finish the middle of May
with approximently 20 LHC years of radiation.

Module 1.02 has completed the signal testing. It has been taken to Duke
for gain testing.

Module 1.03 has also finished signal testing. It also has two dead
wires, and low dark current.

Module 1.04 has passed the leak test and is being prepared for
stringing.

Module 1.05 is being strung.

Module 1.06 has passed the leak test and is being prepared for
stringing.

Module 1.07 has passed the leak test and is being strung.

Modules 1.08 and 1.09 are being assembled.

Module 3.01 has been strung, and is being tested.

**1.2.1.2 Gas/Cooling** **Ken McFarlane (Hampton University)**

Dr. Ketevi Assamagan continued work on a \'User Requirements\' document
for the TRT gas system. This document will specify to the CERN Detector
Gas group what the TRT requires for the TRT gas system.

**1.2.1.2.3 Production**

  --------------------------------- -------------- -------------- -------------- ------------
  **Milestone**                     **Baseline**   **Previous**   **Forecast**   **Status**

  Production Management Contingency 2-Jul-01       2-Jul-01       2-Oct-01       Delayed (See
  Go-Ahead                                                                       #1)
  --------------------------------- -------------- -------------- -------------- ------------

**Note #1**  Next meeting will be in October.

**1.2.1.3 Installation**

  --------------------------------- -------------- -------------- -------------- -------------
  **Milestone**                     **Baseline**   **Previous**   **Forecast**   **Status**

  Installation Management           2-Jul-01       2-Jul-01       2-Oct-01       Delayed (See
  Contingency Go-Ahead                                                           #1)
  --------------------------------- -------------- -------------- -------------- -------------

**Note #1**  Next meeting will be in October.

**1.2.5 TRT Electronics**

**1.2.5.1 ASD/BLR**

**1.2.5.1.1 Design** **Richard Van Berg (University Of Pennsylvania)**

No significant design activity for the ASDBLR in the past month.

**1.2.5.1.2 Prototype**

  ----------------------- -------------- -------------- -------------- ----------------------
  **Milestone**           **Baseline**   **Previous**   **Forecast**   **Status**

  ASDBLR Design Frozen    13-Jul-01      \--            13-Jul-01      On Schedule (See #1)

  Select Final Electronic 31-Aug-01      \--            31-Aug-01      On Schedule
  Design                                                               
  ----------------------- -------------- -------------- -------------- ----------------------

**Note #1**  We hope we are on schedule here, the wafer processing
problems at TEMIC may cause a delay in getting certifiably good chips
from the run submitted in mid January and could cause this date to slip.

**Richard Van Berg (University Of Pennsylvania)**

At the end of May we were informed by TEMIC that the ASDBLR/DTMROC
processing run submitted on 15 January had had significant processing
problems - leading to the certain loss of at least 25% of each wafer
(one quadrant). Two to four of the damaged wafers will be sent to CERN
soon and can then be diced and packaged to see if any of the chips are
recoverable. Any perfect die from these wafers will tell us if the
design changes worked, but failures are not necessarily so interesting
since it is plausible that they could have been caused by processing
errors. TEMIC is starting more wafers through the line, but have not yet
given us a ship date for the backup processing.

On the packaging front we are making good progress with Signetics on
defining a custom FBGA package for the ASDBLR (DTMROC to follow). An
FBGA package would be small enough to fit on the barrel stamp boards,
thus obviating the need for wire bonding (Chip On Board) to the board
and, in addition would be a lower mass, lower inductance, lower
capacitance solution for the End Cap. The goal here is to have a design
and tooling ready for delivery of the DMILL wafers - now more plausible
given the TEMIC problems.

**1.2.5.1.3 Production (Qty = 64,000 + 32,000 Chips)**

  ---------------------------- -------------- ---------------- -------------- ------------
  **Milestone**                **Baseline**   **Previous**     **Forecast**   **Status**

  Management Contingency       2-Jul-01       \--              2-Jul-01       On Schedule
  Go-Ahead                                                                    
  ---------------------------- -------------- ---------------- -------------- ------------

**Richard Van Berg (University Of Pennsylvania)**

Not yet, but may be getting closer. Hard to know yet what the processing
glitch will do to our actual schedule. We still hope to have a PRR for
the ASDBLR at the end of 2001.

**1.2.5.2 DTM/ROC**

**1.2.5.2.1 Design** **Richard Van Berg (University Of Pennsylvania)**

All DTMROC design effort is being concentrated on the DSM (Deep
SubMicron) option. Most of that work is being carried out at CERN, but
some of the analog blocks are being designed by Penn - specifically, the
test pulse, the ternary receiver, the \"LVDS\" driver and the LVDS
receiver. All that work is complete and cells have been (or soon will
be) submitted for test fab. The first round test fab with the ternary
receiver and LVDS pair has been returned to be bonded and tested in the
next few weeks. The CERN group has completed the verilog model, tested
the synthesis chain, defined the memory blocks and, except for a lot of
remaining simulation and the actual place and route process is in good
shape. A submission in Sept. or Oct. is probable.

**1.2.5.2.2 Prototype** **Richard Van Berg (University Of
Pennsylvania)**

As noted under the ASDBLR heading, the Jan 15 run of DMILL had a
processing problem that ruined at least one quadrant of each wafer so we
will not be able to make yield (or maybe even precision analog)
measurements on the wafers that get delivered in June. However, even one
\"perfect\" chip would indicate that the design modifications were
successful. Real yield measurements will have to wait for the backup
wafers. We do not yet have a schedule for those from TEMIC.

**1.2.5.3 PCB - End Cap**

**1.2.5.3.1 Design** **Richard Van Berg (University Of Pennsylvania)**

The End Cap board design is frozen at this time and could be final but
needs to be verified through the testing process. There is also the
possibility that modifications to the design will be necessary to
increase the yield which, for the triple flex DTMROC board, are not yet
very good. CERN is working with various pc vendors on this issue.

**1.2.5.3.2 Prototype** **Richard Van Berg (University Of
Pennsylvania)**

Continuing tests at CERN using the new sector prototype show good
performance. Noise figures are near or at the thermal threshold and
simple correlation plots show no structure although the statistics taken
so far are marginal. More testing needs to be done, especially with a
larger system using the 8 plane wheel but the system can only get a
little larger until we receive the new ASDBLRs and DTMROCs.

Some Barrel stamp flex boards made at CERN have had ASDBLRs bonded to
them at Lund (the bonding done at CERN failed - maybe because of a
cleaning step) and at least one board seems to be in full working
condition - it has been tested on the Penn IMS and shown to be alive
(precision threshold measurements have not yet been made) and it
survived having glop put atop it. There are nine other such boards that
were bonded at Lund and once we have a better handle on the performance
of the first board we will be in a position to move up to a somewhat
larger test system - see the section of integration and system testing.

**1.2.5.4 Common Electronics**

  ------------------- -------------- ---------------- -------------- -------------------
  **Milestone**       **Baseline**   **Previous**     **Forecast**   **Status**

  End of 01 Test Beam 28-Sep-01      \--              4-Nov-01       Delayed (See #1)
  ------------------- -------------- ---------------- -------------- -------------------

**Note #1**  We have been granted additional time up through Nov. 4 01.
This is a GOOD thing, so \"delay\" is too pejorative a term, but seems
the only thing to pull down. Also, this milestone should be under Test
Beam, nicht wahr? Also, of course, this should be under test beam, not
common electronics.

**Richard Van Berg (University Of Pennsylvania)**

No activity here except for some low level design (and some lively
discussions) on the proposed \"bulk\" HV system. We now have
collaboration agreement on a common and inexpensive approach to HV, but
the possible budget is now in Management Contingency - producing a
nearly perfect cancellation.

**1.2.5.6 System Integration & installation**

  -------------------- -------------- ---------------- -------------- -----------------------
  **Milestone**        **Baseline**   **Previous**     **Forecast**   **Status**

  System Design        1-Oct-01       \--              1-Oct-01       On Schedule (See #1)
  Certified                                                           
  -------------------- -------------- ---------------- -------------- -----------------------

**Note #1**  This depends upon getting large enough system tests in
place before Oct. and that depends upon getting enough chips from the
Jan. submission and that depends upon getting wafers back and there is a
glitch there, so hard to be sure that we can make this schedule, but not
yet unreasonable - just tight and getting tighter.

**Richard Van Berg (University Of Pennsylvania)**

Tests with the TB3 boards have been going forward. Noise figures are
slightly above what one would expect from just chamber capacitance, but
in this configuration we are very sensitive to the position and
arrangement of the digital I/O cable going to the patch panel (there is
no Faraday cage at the tension plate possible with a TB3 as it mounts
perpendicular to the tension plate - in the stamp board configuration
(which we hope to be able to test soon) the cooling plate acts as a
Faraday cage isolation structure in between the board and the cable.
Nevertheless, even with the TB3 we can make measurements using a Co^57^
source and look for cross talk patterns. At the present sensitivity, we
can use the TR threshold vs. the tracking threshold to get a \> 50::1
ratio between the large hit and any possible crosstalk pickup. We are
beginning to be sensitive enough to see crosstalk on the order of the \~
1% that we have seen before on the chip and board measurements (this may
simply be a limitation of the methods). There is some hint that the
chamber may actually contribute slightly to the crosstalk, but below the
dominate chip/board level - these measurements may be easier using the
stamp boards, but are reassuring already although we have not looked at
all possible board positions.

**1.3 ARGON**

**Milestones with changed forecast dates:**

  ----------------- -------------- ---------------- -------------- ------------------
  **1.3.2.1.3                                                      
  Production**                                                     

  **Milestone**     **Baseline**   **Previous**     **Forecast**   **Status**

  20 Ft Complete    31-Dec-00      30-May-01        30-Jun-01      Delayed (See #1)

  **Note #1**  The                                                 
  delay is due to                                                  
  the initial delay                                                
  in pin carrier                                                   
  production.                                                      
  Present schedule                                                 
  matches that of                                                  
  ATLAS.                                                           
  ----------------- -------------- ---------------- -------------- ------------------

+----------------------+---------+---------+---------+---------------+
| **1.3.2.1.4          |         |         |         |               |
| Installation**       |         |         |         |               |
+----------------------+---------+---------+---------+---------------+
| **Milestone**        | **Bas   | **Previ | **For   | **Status**    |
|                      | eline** | ous**   | ecast** |               |
+----------------------+---------+---------+---------+---------------+
| Installation         | 17      | 18      | 30      | Delayed (See  |
|                      | -Jan-01 | -Nov-02 | -Sep-02 | #1)           |
+----------------------+---------+---------+---------+---------------+
| Start Installation   | 13      | 13      | 15      | Delayed (See  |
| Procedure            | -Jul-01 | -Jul-01 | -Sep-01 | #2)           |
+----------------------+---------+---------+---------+---------------+
| Last Shipment        | 31      | 31      | 30      | Delayed (See  |
|                      | -Oct-01 | -Oct-01 | -Aug-02 | #3)           |
+----------------------+---------+---------+---------+---------------+
| **Note #1**  New     |         |         |         |               |
| completion date      |         |         |         |               |
| matches new ATLAS    |         |         |         |               |
| schedule.            |         |         |         |               |
|                      |         |         |         |               |
| **Note               |         |         |         |               |
| #2**  Installation   |         |         |         |               |
| cannot start before  |         |         |         |               |
| the acceptance tests |         |         |         |               |
| of the cryostat are  |         |         |         |               |
| complete.            |         |         |         |               |
|                      |         |         |         |               |
| **Note #3**  The     |         |         |         |               |
| last shipment date   |         |         |         |               |
| matches the new      |         |         |         |               |
| ATLAS schedule.      |         |         |         |               |
| Feedthroughs         |         |         |         |               |
| production will be   |         |         |         |               |
| completed earlier.   |         |         |         |               |
+----------------------+---------+---------+---------+---------------+

  ------------------------ -------------- -------------- -------------- --------------------
  **1.3.2.2.3 Production**                                              

  **Milestone**            **Baseline**   **Previous**   **Forecast**   **Status**

  2 Complete HV            1-Mar-01       1-Jun-01       1-Jul-01       Delayed (See #1)
  Feedthrough Ports                                                     

  **Note #1**  The                                                      
  delivery of 2 ports will                                              
  match the cryostat                                                    
  availability at CERN.                                                 
  ------------------------ -------------- -------------- -------------- --------------------

  -------------------------- -------------- ---------------- -------------- --------------------
  **1.3.2.2.4 Installation**                                                

  **Milestone**              **Baseline**   **Previous**     **Forecast**   **Status**

  End-Cap C Install Complete 5-Sep-01       25-Sep-01        25-Nov-01      Delayed (See #1)

  Installation HVFT ports on 5-Sep-01       25-Sep-01        25-Nov-01      Delayed (See #2)
  Endcap C                                                                  

  **Note #1-2**  Delay will                                                 
  match the cryostat                                                        
  availability.                                                             
  -------------------------- -------------- ---------------- -------------- --------------------

  ----------------------------- -------------- -------------- -------------- -----------------
  **1.3.3.1.2 LN2 Ref. System                                                
  Procurement**                                                              

  **Milestone**                 **Baseline**   **Previous**   **Forecast**   **Status**

  Proposal Assessment &         1-Feb-01       10-May-01      10-Jul-01      Delayed (See #1)
  Contract Start                                                             

  LN2 Ref. System Procurement   2-Apr-01       15-May-01      15-Jul-01      Delayed (See #2)
  Complete                                                                   

  **Note #1-2**  Bids are                                                    
  higher than expected.                                                      
  Negotiations continue.                                                     
  ----------------------------- -------------- -------------- -------------- -----------------

+-------------------------+------+-------+------+---------------------+
| **1.3.3.1.3 LN2 Ref.    |      |       |      |                     |
| System Fabrication**    |      |       |      |                     |
+-------------------------+------+-------+------+---------------------+
| **Milestone**           | **Ba | **Pr  | **Fo | **Status**          |
|                         | seli | eviou | reca |                     |
|                         | ne** | s**   | st** |                     |
+-------------------------+------+-------+------+---------------------+
| Ln2 Ref. System         | 1-Ju | 11-O  | 1-Se | Delayed (See #1)    |
| Fabrication             | n-01 | ct-02 | p-03 |                     |
+-------------------------+------+-------+------+---------------------+
| LN2 Ref. System         | 1-Ju | 1-J   | 1-Au | Delayed (See #2)    |
| Fabrication Start       | n-01 | un-01 | g-01 |                     |
+-------------------------+------+-------+------+---------------------+
| **Note #1**  The        |      |       |      |                     |
| completion date of      |      |       |      |                     |
| system installation     |      |       |      |                     |
| matches new ATLAS       |      |       |      |                     |
| installation schedule.  |      |       |      |                     |
|                         |      |       |      |                     |
| **Note #2**  Delay is   |      |       |      |                     |
| due to continuing price |      |       |      |                     |
| negotiations. Not on    |      |       |      |                     |
| the critical path.      |      |       |      |                     |
+-------------------------+------+-------+------+---------------------+

  ------------------------ -------------- ---------------- -------------- -------------------
  **1.3.6.2.3 Production**                                                

  **Milestone**            **Baseline**   **Previous**     **Forecast**   **Status**

  RFP Issued               14-Jun-01      14-Aug-01        14-Aug-00      Completed

  20% Warm Cables Ship in  29-Jun-01      29-Oct-01        29-Oct-00      Completed
  Place                                                                   

  20% Warm Cables          29-Jun-01      20-Oct-01        20-Oct-00      Completed
  Delivered                                                               

  Bid Evaluation           12-Jul-01      1-Sep-01         1-Sep-00       Completed
  Completion                                                              

  PM Approval of Purchase  26-Jul-01      10-Sep-01        10-Sep-00      Completed
  Order                                                                   

  Contract Award           2-Aug-01       20-Sep-01        20-Sep-00      Completed

  40% Warm Cables          30-Aug-01      1-Dec-01         1-Dec-00       Completed
  Delivered                                                               

  40% Warm Cables Ship in  30-Aug-01      1-Dec-01         1-Jan-01       Completed
  Place                                                                   

  60% Warm Cables          30-Oct-01      30-Oct-01        30-Mar-01      Completed
  Delivered                                                               

  60% Warm Cables Ship in  30-Oct-01      30-Oct-01        30-Mar-01      Completed
  Place                                                                   
  ------------------------ -------------- ---------------- -------------- -------------------

+---------------------+------+--------+--------+---------------------+
| **1.3.7.1.2         |      |        |        |                     |
| Pre-Proto/Mod       |      |        |        |                     |
| 0/Atlas Prototype** |      |        |        |                     |
+---------------------+------+--------+--------+---------------------+
| **Milestone**       | **Ba | **     | **Fore | **Status**          |
|                     | seli | Previo | cast** |                     |
|                     | ne** | us**   |        |                     |
+---------------------+------+--------+--------+---------------------+
| Freeze Connector    | 1-Ma | 1-     | 1-     | Delayed (See #1)    |
| Location            | y-01 | May-01 | Jul-01 |                     |
+---------------------+------+--------+--------+---------------------+
| Rad Tol. FEB Design | 1-Ma | 1-     | 3-     | Delayed (See #2)    |
| Review              | y-01 | May-01 | Sep-01 |                     |
+---------------------+------+--------+--------+---------------------+
| **Note              |      |        |        |                     |
| #1**  Delayed due   |      |        |        |                     |
| to delay in         |      |        |        |                     |
| finalizing TTC      |      |        |        |                     |
| connector.          |      |        |        |                     |
|                     |      |        |        |                     |
| **Note              |      |        |        |                     |
| #2**  Delayed due   |      |        |        |                     |
| to late delivery of |      |        |        |                     |
| rad-tol voltage     |      |        |        |                     |
| regulators.         |      |        |        |                     |
+---------------------+------+--------+--------+---------------------+

  ----------------------------- -------------- ---------------- -------------- --------------
  **1.3.8.1.3 Production (Qty =                                                
  3,441 Boards)**                                                              

  **Milestone**                 **Baseline**   **Previous**     **Forecast**   **Status**

  Start Deliveries to FEB       2-Jul-01       2-Jul-01         1-Jan-02       See Note #1
  (ORSAY/Nevis)                                                                

  **Note #1**  Delivery will be                                                
  started to Nevis or Orsay                                                    
  only when requested.                                                         
  ----------------------------- -------------- ---------------- -------------- --------------

+---------------------------+------+------+-------+-------------------+
| **1.3.10.1.3 Production** |      |      |       |                   |
+---------------------------+------+------+-------+-------------------+
| **Milestone**             | **Ba | **Pr | **    | **Status**        |
|                           | seli | evio | Forec |                   |
|                           | ne** | us** | ast** |                   |
+---------------------------+------+------+-------+-------------------+
| FCAL1-C Matrix Plate      | 8-Ju | 8-Ju | 8-M   | Completed (See    |
| Inspection-2              | n-01 | n-01 | ay-01 | #1)               |
+---------------------------+------+------+-------+-------------------+
| FCAL1-C Matrix on Carrier | 2    | 2    | 15-J  | On Schedule (See  |
|                           | 3-Ju | 3-Ju | un-01 | #2)               |
|                           | l-01 | l-01 |       |                   |
+---------------------------+------+------+-------+-------------------+
| FCAL1-C Tube Swaging      | 1-Oc | 1-Oc | 31-A  | On Schedule (See  |
| Complete                  | t-01 | t-01 | ug-01 | #3)               |
+---------------------------+------+------+-------+-------------------+
| **Note #1**  This will be |      |      |       |                   |
| completed well ahead of   |      |      |       |                   |
| this schedule. But as     |      |      |       |                   |
| I\'ve pointed out many    |      |      |       |                   |
| times, we negotiated an   |      |      |       |                   |
| addendum to the plate     |      |      |       |                   |
| machining contract which  |      |      |       |                   |
| accelerated the schedule  |      |      |       |                   |
| and these milestones do   |      |      |       |                   |
| not reflect this change.  |      |      |       |                   |
|                           |      |      |       |                   |
| **Note #2**  We seem to   |      |      |       |                   |
| be able to clean plates   |      |      |       |                   |
| faster than our           |      |      |       |                   |
| conservative estimates of |      |      |       |                   |
| two months ago so we      |      |      |       |                   |
| believe we will have the  |      |      |       |                   |
| completed matrix on the   |      |      |       |                   |
| carrier by this date (if  |      |      |       |                   |
| not earlier).             |      |      |       |                   |
|                           |      |      |       |                   |
| **Note #3**  I\'ve        |      |      |       |                   |
| aggressively moved up the |      |      |       |                   |
| forecast date to our      |      |      |       |                   |
| present best estimate.    |      |      |       |                   |
+---------------------------+------+------+-------+-------------------+

**1.3.1 Barrel Cryostat**

**1.3.1.4 Barrel Cryostat Manufacturing**

**1.3.1.4.3 Manufacturing Monitor**

  -------------------- -------------- -------------- -------------- ---------------------
  **Milestone**        **Baseline**   **Previous**   **Forecast**   **Status**

  Cryostat Transport   1-Sep-00       \--            1-Sep-00       Completed
  Review                                                            
  -------------------- -------------- -------------- -------------- ---------------------

**Barrel Cryostat Monthly Report** **Jack Sondericker (Brookhaven
National Lab.)**

Throughout the month of April the Barrel Cryostat was being prepared for
shipment to CERN.

Work packing up the cryostat and its fixtures for shipment to CERN was
completed by the second week of the month. Special care was taken to
protect the feed through flange surfaces. The Cryostat and fixtures were
loaded on a barge at the Kawasaki dock on May 18th and brought to Kobe
harbor. Here the Cryostat and fixtures were loaded aboard and carried
below the deck of an ocean going container ship that will transport the
equipment to Rotterdam. Then the cryostat will go by barge up the Rhine
River to Strasbourg and the remaining distance overland by truck to
CERN. By the end of May, the transport ship will be about 80% of the way
across the Indian Ocean, heading for the Suez Canal.

**1.3.1.5 Assembly & test in West Hall**

+----------------------------+--------+--------+--------+-------------+
| > **Milestone**            | >      | >      | >      | >           |
|                            | **Base | **Prev | **Fore |  **Status** |
|                            | line** | ious** | cast** |             |
+----------------------------+--------+--------+--------+-------------+
| > Cryostat Arrives at CERN | > 15-  | > \--  | > 15-  | > Delayed   |
|                            | May-01 |        | Jul-01 | > (See #1)  |
+----------------------------+--------+--------+--------+-------------+
| > Final Cryostat           | > 31-  | > \--  | > 31-  | > On        |
| > Acceptance (KHI-CERN)    | Aug-01 |        | Aug-01 | > Schedule  |
+----------------------------+--------+--------+--------+-------------+

**Note #1**  The delay is due to last minute leak tests and packing
arrangements. The arrival date matches the availability of the Building
180.

**1.3.2 Feedthrough**

**1.3.2.1 FT-Signal**

**1.3.2.1.1 Design**

  ------------------------------------ -------------- -------------- -------------- ------------
  **Milestone**                        **Baseline**   **Previous**   **Forecast**   **Status**

  Cryostat Install Design Complete     1-Sep-00       \--            15-May-01      Completed

  I/F Equipment Avail for Final        3-Sep-01       \--            3-Sep-01       On Schedule
  Cryostat Complete                                                                 
  ------------------------------------ -------------- -------------- -------------- ------------

**1.3.2.1.3 Production**

  ----------------------- -------------- ---------------- -------------- -----------------------
  **Milestone**           **Baseline**   **Previous**     **Forecast**   **Status**

  20 Ft Complete          31-Dec-00      30-May-01        30-Jun-01      Delayed (See #1)

  Last Pin Carrier        1-Mar-01       \--              1-Sep-01       Delayed (See #2)
  Delivery                                                               

  25% of Pin Carriers     1-May-01       \--              1-May-01       Completed
  Delivered                                                              

  50% of Pin Carriers     2-Jul-01       \--              2-Jul-01       On Schedule
  Delivered                                                              

  34 FT Complete          15-Oct-01      \--              15-Oct-01      On Schedule
  ----------------------- -------------- ---------------- -------------- -----------------------

**Note #1**  The delay is due to the initial delay in pin carrier
production. Present schedule matches that of ATLAS.

**Note #2**  After initial delay, the production matches the new ATLAS
schedule

**Bob Hackenburg (Brookhaven National Lab.)**

We now have 18 Feedthroughs fully assembled and tested, and ready for
shipment. We have scrapped our plans to send one (defective, FT003)
feedthrough on a round trip to CERN and back, as a shipping study, and
instead will be sending 4 ready-to-install FTs on a one-way trip to
CERN, probably in about a week. We are acquiring a number of
shock-monitors for this purpose. The defective FT has been dissected
instead of shipped, (which we were planning on doing anyway after it
returned, but we got impatient to verify the details of its trouble). We
had believed the failure (which was a short between two signal lines,
reproducible as the temperature dropped below -54C) to be an internally
defective Vacuum Cable connector, since the TDR had pinpointed the
location to the cold flange. However, upon opening up of the bellows and
removing the cable, the cable turned out to be OK. The problem in fact
turned out to be the spring clips, which bottom out in the pincarriers
(i.e., a design flaw in the vacuum cable connector) and are forced in
too close to the signal pins. We had already identified that problem
after the first three FTs were made (and the first one failed), and have
addressed it months ago by installing small, nylon washers over the
screws on the vacuum cable connectors, so that they don\'t bottom out in
the pincarrier. The bottom line is that we didn\'t learn anything we
needed to learn, since the real problem had already been fixed (except
in the first 3 FTs, two of which are perfectly good in spite of their
lack of nylon washers), but at least we didn\'t get a nasty surprise.

The plan is to install the nylon washers on FT003, and close it back up,
test it, etc., and it should be perfectly good. FT020, the latest
failure, is actually a good failure because of its lesson. That is,
FT020 developed a small leak (but bad enough: 10^-6^) around one of the
pins in the pincarrier. The good news is that it was precisely the pin
which had been badly bent over during cable installation, so it\'s
preventable, sort of, and the lesson is that by badly bending any one
pin during installation at CERN, we would have to discard the entire FT.
Which means, as we already know, only more so now, that we absolutely
need to minimize the number of times cables are connected to
pincarriers. We are looking into the possibility of installing the warm
cables at CERN, during FT installation, even if the baseplanes aren\'t
ready, so that we can test the FTs without making additional
connections.

We also have 2 more feedthroughs nearly done, bringing the total to 22,
and when FT003 and FT020 are repaired (sometime next week, most likely),
our total will be 24. We see no problem in being ready to install the
first 32 by September, even allowing for vacations, etc.

Also, pincarriers continue to arrive (slightly) faster than we can use
them, following about a two week lapse when about 24 were diverted to
UVIC, accompanied by a government snafu which caused the manufacturer to
stop production for about a week (now fixed!).

**1.3.2.1.4 Installation**

  ----------------------- -------------- ---------------- -------------- ---------------------
  **Milestone**           **Baseline**   **Previous**     **Forecast**   **Status**

  Installation            17-Jan-01      18-Nov-02        30-Sep-02      Delayed (See #1)

  1st Shipment            23-Apr-01      \--              10-Jul-01      Delayed (See #2)

  Start Installation      13-Jul-01      13-Jul-01        15-Sep-01      Delayed (See #3)
  Procedure                                                              

  Last Shipment           31-Oct-01      31-Oct-01        30-Aug-02      Delayed (See #4)
  ----------------------- -------------- ---------------- -------------- ---------------------

**Note #1**  New completion date matches new ATLAS schedule.

**Note #2**  First Feedthrough shipment will be in July. Cryostat and
West area will not be ready before that time.

**Note #3**  Installation cannot start before the acceptance tests of
the cryostat are complete.

**Note #4**  The last shipment date matches the new ATLAS schedule.
Feedthroughs production will be completed earlier.

**1.3.2.2 HV Feedthrough**

**1.3.2.2.3 Production**

  ------------------------------- -------------- ---------------- -------------- --------------
  **Milestone**                   **Baseline**   **Previous**     **Forecast**   **Status**

  2 Complete HV Feedthrough Ports 1-Mar-01       1-Jun-01         1-Jul-01       Delayed (See
                                                                                 #1)

  Barrel FTs (Mechanical)         1-May-01       \--              15-Jul-01      Delayed (See
  Delivered to CERN                                                              #2)

  Barrel FTs (Electrical)         1-Jun-01       \--              15-Jul-01      Delayed (See
  delivered to CERN                                                              #3)

  Production Complete             14-Sep-01      \--              14-Sep-01      On Schedule
  ------------------------------- -------------- ---------------- -------------- --------------

**Note #1**  The delivery of 2 ports will match the cryostat
availability at CERN.

**Note #2-3**  The delivery will match the cryostat availability at
CERN.

**Michal Rijssenbeek (SUNY Stony Brook)**

**1.3.2.2.3.1 Warm Connectors**

REDEL/LEMO warm HV connectors all in house. Crimping tests done, and
tooling started.

**1.3.2.2.3.2 Cold Connectors**

Cold connectors all in house. Crimping tests successful, tooling
available.

**1.3.2.2.3.3 HV Wire**

All wire has been received and used for manufacture of wire
feedthroughs.

**1.3.2.2.3.6 Sealed Wire FT (WFT)**

Douglas Engineering has delivered all 28 WFTs (includes spares).

All WFTs have been tested in water at 5 kV. 2-3 wireloops per WFT found
faulty, which is compensated by 2-3 excess loops available in the WFTs.
Cleaning of the WFTs is well advanced.

Wire FT Plates have all been delivered, and are being cleaned. The first
plate with four WFTs is in the cleanroom awaiting inserting in the HVFT.

**1.3.2.2.3.4-5 Filter Modules and Filter Crate**

All HV parts have been delivered. The remaining Filter daughter boards
are expected in the next week. Front/back panels for the modules and
backplane have been ordered. HV spark tests of the filter resistor have
restarted, in order to check that resistors survive when HV PSs trip and
crowbar the voltage at the power supply. In that situation the full
energy of the calorimeter cells attached to a HV channel is dissipated
over the filter resistor. For the current test, we connected a
64-channel filter prototype module in reverse, and charged (to 5 kV) and
spark-discharged it via a 100 kOhm resistor (as foreseen in the EMB and
EMEC). This is equivalent to 1.6 uF capacitance, and an energy of 25% of
the energy expected from a 25 uF calorimeter capacitance at 2.5 kV.

**1.3.2.2.3.7-9 Vacuum Components for the HV FT**

All six HVFTs (flanges, bellows, pipe, ALU/SS transitions) have been
received, machined, and have been welded and tested at BNL. The two
barrel Feedthrough Ports have been completed and await shipping to CERN.

**1.3.2.2.3.10 Assembly**

After cleaning the first four WFTs, assembly has started. A two-story
platform for installation of the cable tree into the HVFT port is
installled in the clean room area, including a small electric hoist to
lift the feedthrough plate plus wire feedthroughs. HV corona test
equipment is now in place to start testing the HV cable tree in Argon
inside the HVFT Testvessel.

**1.3.2.2.4 Installation**

  -------------------------- -------------- ---------------- -------------- --------------------
  **Milestone**              **Baseline**   **Previous**     **Forecast**   **Status**

  Ship End-Cap C to CERN     5-Mar-01       \--              15-Jul-01      Delayed (See #1)

  Ship Barrel to CERN        1-May-01       \--              1-Aug-01       Delayed (See #2)

  End-Cap C Install Complete 5-Sep-01       25-Sep-01        25-Nov-01      Delayed (See #3)

  Installation HVFT ports on 5-Sep-01       25-Sep-01        25-Nov-01      Delayed (See #4)
  Endcap C                                                                  
  -------------------------- -------------- ---------------- -------------- --------------------

**Note #1**  Delayed due to FT delay. Not on critical path.

**Note #2-4**  Delay will match the cryostat availability

**Michal Rijssenbeek (SUNY Stony Brook)**

We are designing and fabricating a shipping container for the FT ports.
Details and order of installation are under discussion with CERN and BNL
personnel. Current plans are to install/weld the HVFT before Signal FTs
(as in the original plan), but to install the HV cable tree and do the
routing afterwards (i.e. with the signal FT cables in place).

**1.3.3 LAr Cryogenics**

**1.3.3.1 LN2 Refrigerator System**

**1.3.3.1.2 LN2 Ref. System Procurement**

  ------------------------------ -------------- ---------------- -------------- ---------------
  **Milestone**                  **Baseline**   **Previous**     **Forecast**   **Status**

  Proposal Assessment & Contract 1-Feb-01       10-May-01        10-Jul-01      Delayed (See
  Start                                                                         #1)

  Bid Return                     15-Mar-01      \--              10-May-01      Completed

  LN2 Ref. System Procurement    2-Apr-01       15-May-01        15-Jul-01      Delayed (See
  Complete                                                                      #2)

  Start Production               1-Aug-01       \--              1-Aug-01       On Schedule
  ------------------------------ -------------- ---------------- -------------- ---------------

**Note #1-2**  Bids are higher than expected. Negotiations continue.

**Jack Sondericker (Brookhaven National Lab.)**

**LN2 Refrigerator Procurement Request for Proposal (RFP)**

Two Proposals for the ATLAS Nitrogen Refrigerator System (ANRS) were
received at BNL before the closing date of April 28th. Members of the
Source Selection Board read and evaluated the technical portion of the
submissions. Both offerors were deemed technically capable of supplying
a reliable refrigerator system to CERN and the selection process
essentially defaulted to that proposer with the lowest cost. Upon
opening price information, both offerors were considerably more
expensive than estimates. Negotiations were initiated with both
contenders to reduce costs by any means possible. By months end
negotiations are continuing.

**1.3.3.1.3 LN2 Ref. System Fabrication**

  ------------------------ -------------- ---------------- -------------- ---------------------
  **Milestone**            **Baseline**   **Previous**     **Forecast**   **Status**

  Ln2 Ref. System          1-Jun-01       11-Oct-02        1-Sep-03       Delayed (See #1)
  Fabrication                                                             

  LN2 Ref. System          1-Jun-01       1-Jun-01         1-Aug-01       Delayed (See #2)
  Fabrication Start                                                       
  ------------------------ -------------- ---------------- -------------- ---------------------

**Note #1**  The completion date of system installation matches new
ATLAS installation schedule.

**Note #2**  Delay is due to continuing price negotiations. Not on the
critical path.

**1.3.3.2 LN2 Quality Meter System**

  -------------------- -------------- ---------------- -------------- -------------------------
  **Milestone**        **Baseline**   **Previous**     **Forecast**   **Status**

  LN2 Quality Meter    19-Nov-03      \[New\]          19-Nov-03      On Schedule
  System                                                              
  -------------------- -------------- ---------------- -------------- -------------------------

**1.3.3.2.2 Quality Meter Prototype**

  -------------------- -------------- ---------------- -------------- -------------------------
  **Milestone**        **Baseline**   **Previous**     **Forecast**   **Status**

  Quality Meter        1-May-00       \--              21-Aug-01      Delayed (See #1)
  Prototype                                                           

  Final Design Review  1-May-01       \--              21-Aug-01      Delayed (See #2)

  Specification PRR    1-Aug-01       \--              1-Aug-01       On Schedule
  Review                                                              
  -------------------- -------------- ---------------- -------------- -------------------------

**Note #1**  The prototype exist. An improved design with higher
reliability is under development.

**Note #2**  Will match the cryostat installation schedule

**Quality Meter Prototype** **Jack Sondericker (Brookhaven National
Lab.)**

Progress continued to be made in the month of May in that an optimized
mechanical design was adopted as the official prototype. Meanwhile
changes were made in the design of the electronic circuitry to afford
better stability, greater overall accuracy and complete insensitivity to
effects of distributed cable capacity.

A prototype meter will be constructed and tested in time for the
Production Readiness Review scheduled next August.

**1.3.3.2.3 Quality Meter Production**

  --------------------- -------------- ---------------- -------------- ---------------------
  **Milestone**         **Baseline**   **Previous**     **Forecast**   **Status**

  Parts and Material    29-Aug-01      \--              29-Aug-01      On Schedule
  Start                                                                

  Quality Meter         1-Oct-01       \--              30-Oct-02      Delayed (See #1)
  Production                                                           
  --------------------- -------------- ---------------- -------------- ---------------------

**Note #1**  Delay matches the new ATLAS schedule

**1.3.4 EM Electronics/MB System**

**1.3.4.2 Motherboard System**

**1.3.4.2.3 Production**

  ----------------------------- -------------- ---------------- -------------- --------------
  **Milestone**                 **Baseline**   **Previous**     **Forecast**   **Status**

  Delivery of Module 3 boards   15-Mar-01      \--              15-Apr-01      Completed

  Delivery of Module 4 boards   15-Apr-01      \--              15-Apr-01      Completed

  10% MB System Production      14-May-01      \--              30-Apr-01      Completed
  Complete                                                                     

  Delivery of Module 5 boards   1-Jun-01       \[New\]          1-Jun-01       On Schedule

  Delivery of Module 6 boards   20-Jun-01      \[New\]          20-Jun-01      On Schedule

  Delivery of Module 7 boards   15-Jul-01      \[New\]          15-Jul-01      On Schedule

  25% MB System Production      6-Aug-01       \--              6-Aug-01       On Schedule
  Complete                                                                     
  ----------------------------- -------------- ---------------- -------------- --------------

**Srini Rajagopalan (Brookhaven National Lab.)**

Module 13: Completed, packed, shipped to Saclay on May 3, 2001

Module 12: Completed, packed, shipped to Annecy on May 6, 2001

Module 11: Completed, packed, shipped to Saclay on May 31, 2001

Module 10: Target ship date June 11, 2001

Summing Boards: All boards received. Visual inspection and test in
process.

High Voltage Boards: Completed, packed and ready for shipment

All Motherboards: Completed, packed and ready for shipment

Alignment Boards: All boards will be packed and ready for shipment by
6/4/01.

Module 9 Target ship date June 30, 2001

Summing Boards: Targeted vendor ship date June 15,2001

High Voltage Boards: Targeted vendor ship date June 15, 2001

Front Motherboards: Received 14 out of 16 printed circuit board
assemblies. They have been inspected and testing is in process.

Back Motherboards: Received 13 out of 14 printed circuit board
assemblies. They have been inspected and testing is in process.

Alignment Boards: In BNL stock

**1.3.4.2.4 Installation Complete** **Srini Rajagopalan (Brookhaven
National Lab.)**

Installation of Module 15 has been completed at Saclay

Installation of Module 14 is in progress at Annecy

Installation/Test of Module 13 is in progress at Annecy

**1.3.5 Preamp/Calibration**

**1.3.5.1 Preamps**

**1.3.5.1.3 Production (QTY=30000)**

  --------------------------- -------------- ---------------- -------------- ---------------
  **Milestone**               **Baseline**   **Previous**     **Forecast**   **Status**

  Start Preamp Deliveries to  3-Sep-01       \--              3-Sep-01       On Schedule
  FEB                                                                        
  --------------------------- -------------- ---------------- -------------- ---------------

**Hong Ma (Brookhaven National Lab.)**

Hybrid production is going well.

IO-826: 1056 received. 1043 passed and ready for shipment. Unchanged
from last month.

IO-824: Received 576 from vendor since last report.

Total: 1056 received. 288 test in progress. 697 passed and ready for
shipment.

IO-823: Received 1536 from vendor since last report.

Total: 2752 received. 864 test in progress. 1809 passed and ready for
shipment.

Test Station-I experienced timing jitter. This is being worked on.

Test Station-II is in use.

**1.3.5.2 Precision Calor. Calibration**

**1.3.5.2.3 Production Support to LAPPL/LAL**

  ----------------------- -------------- ---------------- -------------- ------------------
  **Milestone**           **Baseline**   **Previous**     **Forecast**   **Status**

  Production Readiness    1-May-01       \--              1-Aug-01       Delayed (See #1)
  Review                                                                 
  ----------------------- -------------- ---------------- -------------- ------------------

**Note #1**  Delay in DMILL chip production

**1.3.6 System Integration**

**1.3.6.1 Pedestal**

**1.3.6.1.1 Design** **Helio Takai (Brookhaven National Lab.)**

The barrel pedestal design is concluded. The pedestal design for the
other systems is being finalized.

**1.3.6.1.3 Production** **Helio Takai (Brookhaven National Lab.)**

Qualification part is expected to be delivered June 15.

**1.3.6.2.3 Production** **Helio Takai (Brookhaven National Lab.)**

An award for baseplane construction was awarded to Tyco. Tyco was chosen
for being cheaper although it is not clear if they understood clearly
what needs to be done.

**1.3.6.3.2 Prototype** **Helio Takai (Brookhaven National Lab.)**

Qualification piece to be delivered June15.

**1.3.6.4 Power and Services**

**1.3.6.4.1 Design** **Helio Takai (Brookhaven National Lab.)**

The design of the power supply exists. The prototype is now being
concluded for initial phase of testing.

**1.3.6.4.2 Prototype** **Helio Takai (Brookhaven National Lab.)**

Two DC-DC converters, 300 V in, 4V out were manufactured by Modular
Devices. These two units are designed to meet the radiation
requirements. A procurement for MOSFETs in die form was also purchased.
We should have the remaining 10 (ten) DC-DC converters for testing in
about 2-4 weeks. The tests include radiation tests, magnetic field test,
stability, and noise. The tests are expected to take a minimum of two
months. Help is welcome.

**1.3.6.5 Cooling**

**1.3.6.5.1 Design** **Helio Takai (Brookhaven National Lab.)**

A new cooling plate design is being evaluated.

**1.3.6.5.2 Prototype** **Helio Takai (Brookhaven National Lab.)**

Prototypes delivered to us by Showa Aluminum are under test. So far only
accelerated corrosion tests were performed. Dynamic parameters and
cooling efficiency need to be carried out.

**1.3.7 Front End Board**

**1.3.7.1 FEB**

**1.3.7.1.1 Design** **John Parsons (Columbia University)**

The DMILL DMUX ASIC and the DMILL TTCRx were successfully integrated
into the 1/4 Digital FEB. We now have 5 DMILL chips (these plus SPAC
Slave, ConfigControl and GainSel) working together, along with an FPGA
emulator of the final ASIC, the SCA Controller (for which DMILL and DSM
versions are expected by July).

Design of the FEB continues, with work concentrating on the digital
part.

The STm development of rad-tol voltage regulators has suffered another
setback, with the latest prototype proving to be non-functional. STM is
working to understand the latest problem, but it is clear prototypes
will not be available now until at least November, an additional 6 month
delay. This poses a serious problem for the FEB schedule, which is now
held up by the regulators; we are in the process of re-evaluating the
schedule in light of this problem. Due to the continued failure of the
STm development, we have also diverted significant engineering manpower
to investigation of possible alternative solutions.

An agreement has been reached within LAr on how to divide procurement
responsibilities among the various labs involved in the FEB. This was
necessary to allow orders (e.g. for ADCs) to proceed within the next few
months.

**1.3.7.1.2 Pre-Proto/Mod 0/Atlas Prototype**

  ----------------------------- -------------- ---------------- -------------- -------------
  **Milestone**                 **Baseline**   **Previous**     **Forecast**   **Status**

  Freeze Component for ATLAS    1-Mar-01       \--              1-Aug-01       Delayed (See
  Prototype                                                                    #1)

  Freeze Connector Location     1-May-01       1-May-01         1-Jul-01       Delayed (See
                                                                               #2)

  Rad Tol. FEB Design Review    1-May-01       1-May-01         3-Sep-01       Delayed (See
                                                                               #3)

  1st Delivery of Layer Sum     2-Jul-01       \--              2-Jul-01       On Schedule
  Boards                                                                       

  Feb - ATLAS Layout Complete   21-Aug-01      \--              21-Aug-01      On Schedule

  Critical Design Review        3-Sep-01       \--              3-Sep-01       On Schedule

  Start Assembly                11-Sep-01      \--              11-Sep-01      On Schedule

  Rad Hard. - All Components    28-Sep-01      \--              28-Sep-01      On Schedule
  ----------------------------- -------------- ---------------- -------------- -------------

**Note #1**  Delayed due to requirement for additional radiation testing
of COTs.

**Note #2**  Delayed due to delay in finalizing TTC connector.

**Note #3**  Delayed due to late delivery of rad-tol voltage regulators.

**1.3.7.1.5 Radiation Testing** **John Parsons (Columbia University)**

Proton-irradiation tests were performed of the DMILL GainSel and
ConfigControl ASICs. The chips survived, as expected for DMILL, the
total dose. Online monitoring detected the occurrence of SEUs at a low
rate; further analysis of the data is ongoing to understand the types of
errors seen and the impact for operation within ATLAS.

**1.3.7.2 SCA**

**1.3.7.2.1 Design** **John Parsons (Columbia University)**

SCA testing with the robotic test setup at Grenoble is being prepared
for the chips from the engineering run; tests should start by July.

Due to the reassignment of procurement responsibilities, the US will no
longer pay for SCA chips, which will be paid for by our European
colleagues. Therefore, the milestones associated with submission of the
US order for SCA chips have been deleted.

**1.3.7.4 Optical Links**

**1.3.7.4.1 Design** **John Parsons (Columbia University)**

Work is continuing with our Taiwanese colleagues to finalize the optical
link integration on the FEB.

**1.3.7.4.2 Prototype/Module 0**

+-------------------------+--------+---------+---------+-------------+
| > **Milestone**         | >      | >       | > **For | >           |
|                         | **Base | **Previ | ecast** |  **Status** |
|                         | line** | ous**   |         |             |
+-------------------------+--------+---------+---------+-------------+
| > ATLAS Prototype       | > 1-   | > \--   | > 1     | > On        |
|                         | Jun-01 |         | -Jun-01 | > Schedule  |
+-------------------------+--------+---------+---------+-------------+
| > Optical Links ATLAS   | > 1-   | > \--   | > 1     | > On        |
| > Prototype             | Jun-01 |         | -Jun-01 | > Schedule  |
+-------------------------+--------+---------+---------+-------------+

**1.3.8 Trigger Summation**

**1.3.8.1 Layer Sums**

**1.3.8.1.3 Production (Qty = 3,441 Boards)**

  ------------------------------ -------------- ---------------- -------------- ------------
  **Milestone**                  **Baseline**   **Previous**     **Forecast**   **Status**

  Last Delivery of Layer Sum Bds 1-Jul-01       \--              1-Jul-01       On Schedule

  Start Deliveries to FEB        2-Jul-01       2-Jul-01         1-Jan-02       See Note #1
  (ORSAY/Nevis)                                                                 
  ------------------------------ -------------- ---------------- -------------- ------------

**Note #1**  Delivery will be started to Nevis or Orsay only when
requested.

**Bill Cleland (University Of Pittsburgh)**

The production of LSBs continues apace. The S2x8 have been completed and
are in storage. The S1x16 have been tested, but a small modification is
required on the G=2 version to prevent the output from going to the
voltage rails whenever the input is disconnected. This will be done in
the fall.

The S4x4 boards have been delivered and are in the burn-in process.
There is a problem at the moment with the testing software, which is
causing a few days delay in the testing of the S4x4 boards.

**1.3.8.2 Interface to Level 1**

**1.3.8.2.1 Design/Electronic Tooling/Comp. Specs**

  -------------------------------- -------------- ---------------- -------------- ------------
  **Milestone**                    **Baseline**   **Previous**     **Forecast**   **Status**

  Circuit Design of ATLAS receiver 12-Aug-01      \--              12-Aug-01      On Schedule
  Complete                                                                        

  Final Design Complete            4-Oct-01       \--              4-Oct-01       On Schedule
  -------------------------------- -------------- ---------------- -------------- ------------

**Bill Cleland (University Of Pittsburgh)**

A set of test boards for evaluating the analog chain for the receiver
was received this month, and they are being assembled during the month
of June. A replacement IC for the variable gain amplifier has been found
(CLC522) which has a gain linear in voltage and is well suited for an
application with low gain, as in our system. The evaluation board for
this IC has been received, so it will be evaluated in June. Layout work
on the VGA daughterboard is stalled until the IC question is settled.
The control circuit FPGA code has been designed, and a timing simulation
has been carried out. The code for the controller card is being
developed simultaneously.

**1.3.9 ROD System**

**1.3.9.1 ROD Board**

**1.3.9.1.1 Design**

  -------------------------------- -------------- ---------------- -------------- ------------
  **Milestone**                    **Baseline**   **Previous**     **Forecast**   **Status**

  Reconstruct E, T, and chisquare  12-Feb-01      \--              1-Jul-01       See Note #1
  for TB data                                                                     

  Complete Code to form averages   18-Jun-01      \--              10-Jul-01      See Note #2
  of Cal.                                                                         

  Complete Code to get OFC from    4-Sep-01       \--              4-Sep-01       See Note #3
  CAL. Data                                                                       
  -------------------------------- -------------- ---------------- -------------- ------------

**Note #1**  Done, not completely reviewed.

**Note #2-3**  Calibration procedure not completely defined.

**Rod Engelmann (SUNY Stony Brook)**

BNL/Stony Brook - ROD demo tests: The DAQ-1 data acquisition software
was installed and customization for the BNL hardware was begun. Tests
with the calibration board continued.

Nevis Lab: The design of the PU board with a TI C6203 DSP and no dual
port memory proceeded and a one-DSP PU board to be fitted on the
existing ROD motherboard was submitted for construction.

SMU: Code development for averaging calibration data in the TI C62 DSP
continued. SMU also started to look at the new TI C64 DSP and the coding
of it as an ongoing R&D project.

**1.3.10 Forward Calorimeter**

**1.3.10.1 FCAL1 Module**

**1.3.10.1.3 Production**

  ------------------------- -------------- ---------------- -------------- ------------------
  **Milestone**             **Baseline**   **Previous**     **Forecast**   **Status**

  FCAL1-C Interconnects     30-Apr-01      \--              30-Jun-01      Delayed (See #1)
  Complete                                                                 

  FCAL1-C Matrix Plate      8-Jun-01       8-Jun-01         8-May-01       Completed (See #2)
  Inspection-2                                                             

  FCAL1-C Matrix on Carrier 23-Jul-01      23-Jul-01        15-Jun-01      On Schedule (See
                                                                           #3)

  FCAL1-C Tube Swaging      1-Oct-01       1-Oct-01         31-Aug-01      On Schedule (See
  Complete                                                                 #4)
  ------------------------- -------------- ---------------- -------------- ------------------

**Note #1**  The sample panel of interconnects works very well. One HV
test went to 3.5 kV in air without breakdown where 250 V in Argon is the
operating potential. We\'ll place the final order for the regular shaped
interconnects as soon as we have some spare time. This is not on the
critical path and since we are trying to catch up in some more critical
areas we will let this slide until time is available.

**Note #2**  This will be completed well ahead of this schedule. But as
I\'ve pointed out many times, we negotiated an addendum to the plate
machining contract which accelerated the schedule and these milestones
do not reflect this change.

**Note #3**  We seem to be able to clean plates faster than our
conservative estimates of two months ago so we believe we will have the
completed matrix on the carrier by this date (if not earlier).

**Note #4**  I\'ve aggressively moved up the forecast date to our
present best estimate.

**FCal1 Module** **John Rutherfoord (University Of Arizona)**

Fourteen (of 18) copper matrix plates for FCal1C have been cleaned and
set up on the assembly stand (aka the carrier). The remaining four
plates will be stacked before mid-June. At this point we will have met
the milestone called \"Matrix on Carrier\" for FCal1C.

The two ultrasound units which broke during April were fixed
more-or-less on schedule and with a little weekend work we were able to
limit the lost time to just two weeks. It was discovered that two ground
pin holes (out of about 6,000 in each end plate) were not drilled at the
machine shop (STC) on each of the two endplates so we did these by hand.

About 25,800 copper electrode rods (24,520 needed) were sent to our
machine shop to have holes drilled in one end. These holes will accept
the signal pins. About 4,000 have been drilled in the first week and we
expect this rate to continue. We will start cleaning the first batch in
early June. We anticipate the rod cleaning will be difficult and
time-consuming but not a critical path item.

As soon as the matrix is completed we will start inserting the copper
electrode rods (completely processed some time ago and now in storage in
dry nitrogen) and swaging them in place. Present best guess is that tube
stuffing will begin in mid June and be completed by end of August.

We had originally planned to make mirror image modules for the C and A
ends. However it was pointed out at the FCal PRR that other systems and
the electronics were arranged in a way that made the two ends nearly
identical rather than mirror symmetric so we changed plans to make
identical modules. However because of the somewhat irregular tiling of
our readout we are re-evaluating this decision, quite late in the game.
A decision to switch at this point requires agreement from our
collaborators within the FCal and some concurrence (procedure unknown)
from the management and knowledgeable colleagues. We must make a
decision quickly because the FCal1A plates are being machined at this
moment so that the decision will soon be made for us. Mirror symmetry
(and 180 degree rotational symmetry about the beam axis which we always
had) allows each phi segment of the FCal to be identical at each end. It
also means that back-to-back particles originating from the interaction
point will impact identical shaped readout tiles. We view both these as
very desirable, particularly considering reconstructing events in the
forward calorimeters. A change in symmetry will require a change order
with the STC and a re-negotiation of the complex contract.

**1.3.10.2 FCAL Electronics**

**1.3.10.2.3 Production**

  ------------------------ -------------- ---------------- -------------- -------------------
  **Milestone**            **Baseline**   **Previous**     **Forecast**   **Status**

  PCBs received at AZ      21-Nov-00      \--              15-Dec-01      Delayed (See #1)

  A Cables Delivery from   2-Jul-01       \--              2-Jul-01       On Schedule (See
  Axon                                                                    #2)
  ------------------------ -------------- ---------------- -------------- -------------------

**Note #1**  The start of the summing board layout was recently delayed
by about one month. So yet another schedule was produced showing the
boards completed in December of this year. The layout has started so
there is slightly more realism to this forecast. (Note spelling of
forecast.)

**Note #2**  No new news on this. This milestone is FAR from the
critical path.

**Cold Electronics** **John Rutherfoord (University Of Arizona)**

The relay boards which will be used for production characterization of
our Axon cold cables and which will operate in liquid N2 or Argon,
arrived back from the fabrication house and were sent out to be stuffed.
The control board which operates outside the cryostat has been built and
mostly programmed. The on-line computer with programming and data
acquisition is largely in place and parts have been tested. We\'ve
received some help in interpreting the data from Bill Cleland and his
co-workers.

Work continues on laying out the summing boards. We have not yet
received quotes on the transmission line transformers, the technically
critical component on the summing boards, but expect a response soon.
The other components were ordered long ago but with extraordinarily
protracted delivery. None of this is yet on the critical path.

**1.4 TILE**

**Milestones with changed forecast dates:**

  ----------------------------- -------------- ---------------- -------------- ------------
  **1.4.3.2.3 Production**                                                     

  **Milestone**                 **Baseline**   **Previous**     **Forecast**   **Status**

  3-In-1 Card Fab 100% Complete 16-Jul-01      16-Jul-01        31-May-01      Completed

                                                                               
  ----------------------------- -------------- ---------------- -------------- ------------

+-------------------+---------+----------+---------+-----------------+
| **1.4.4.1.3       |         |          |         |                 |
| Production**      |         |          |         |                 |
+-------------------+---------+----------+---------+-----------------+
| **Milestone**     | **Bas   | **Prev   | **For   | **Status**      |
|                   | eline** | ious**   | ecast** |                 |
+-------------------+---------+----------+---------+-----------------+
| Scintillator      | 1       | 1-Jul-01 | 1       | Delayed (See    |
| procurement       | -Oct-00 |          | -Aug-01 | #1)             |
+-------------------+---------+----------+---------+-----------------+
| Start             | 1       | 1-Aug-01 | 1       | Delayed (See    |
| Scintillator      | -Dec-00 |          | -Sep-01 | #2)             |
| Assembly          |         |          |         |                 |
+-------------------+---------+----------+---------+-----------------+
| **Note            |         |          |         |                 |
| #1**  Prototypes  |         |          |         |                 |
| of the ITC        |         |          |         |                 |
| extension         |         |          |         |                 |
| scintillators     |         |          |         |                 |
| were tested at    |         |          |         |                 |
| the CERN test     |         |          |         |                 |
| beam last summer. |         |          |         |                 |
| Based on the test |         |          |         |                 |
| beam experience,  |         |          |         |                 |
| we have made      |         |          |         |                 |
| final             |         |          |         |                 |
| modifications to  |         |          |         |                 |
| the scintillator  |         |          |         |                 |
| design.           |         |          |         |                 |
| Procurement will  |         |          |         |                 |
| follow as soon as |         |          |         |                 |
| final drawings    |         |          |         |                 |
| are approved, and |         |          |         |                 |
| funding to buy    |         |          |         |                 |
| extension         |         |          |         |                 |
| scintillators is  |         |          |         |                 |
| available at MSU. |         |          |         |                 |
|                   |         |          |         |                 |
| **Note            |         |          |         |                 |
| #2**  Prototypes  |         |          |         |                 |
| of the ITC        |         |          |         |                 |
| extension         |         |          |         |                 |
| scintillators     |         |          |         |                 |
| were tested at    |         |          |         |                 |
| the CERN test     |         |          |         |                 |
| beam last summer. |         |          |         |                 |
| Based on the test |         |          |         |                 |
| beam experience,  |         |          |         |                 |
| we have made      |         |          |         |                 |
| final             |         |          |         |                 |
| modifications to  |         |          |         |                 |
| the scintillator  |         |          |         |                 |
| design. Assembly  |         |          |         |                 |
| will follow as    |         |          |         |                 |
| soon as funding   |         |          |         |                 |
| to buy extension  |         |          |         |                 |
| scintillators are |         |          |         |                 |
| available at MSU. |         |          |         |                 |
+-------------------+---------+----------+---------+-----------------+

**1.4.1 Extended Barrel Mechanics** **James Proudfoot (Argonne National
Lab.)**

Submodule production was completed at the University of Chicago, with a
total of 194 submodules constructed. Of these, 13 submodules will
require rework to correct distorted slots and 3 are oversize and will
not fit on the girder. This rework will be carried out at Argonne when
deemed necessary. At the other two submodule sites, 136 submodules have
been constructed at the University of Illinois and 153 at Argonne.
module production is also continuing well on schedule with 33 modules
mechanically tested, of which 17 have been shipped to Michigan State
University for instrumentation. 28 modules in total have been tested
using a radioactive source or LED test system. All modules are meeting
the TileCal specification. A total of 24 modules have been shipped to
CERN and in addition 4 are ready for shipment (including one module
being retained at Argonne for long term testing).

**1.4.1.1 Submodules**

**1.4.1.1.3 Production** **Steven Errede (University
Illinois-Urbana-Champaign)**

In May 2001, we made 10 ATLAS TileCal submodules. We have now made a
total of 143 submodules. Because a significant portion of the floor of
our high-bay lab area here at UI is concurrently being replaced (wood to
concrete), we shipped 8 fully-completed submodules to Argonne in
mid-May. A total of 136 submodules have now been shipped to Argonne from
UIUC.

**Victor Guarino (Argonne National Lab.)**

Six submodules were fabricated completely at ANL during May. An
additional 2 were stacked and glued but were not fully welded and
painted. Problems arose with the glue dispenser, several seals began
leaking and had to be replaced which resulted in production being closed
down nearly 1 week. Regular maintenance was performed on the remainder
of the equipment.

**James Pilcher (University Of Chicago)**

At the end of May we closed out submodule production at Chicago. In
total, 194 submodules were stacked, glued, and tack welded. In
consultation with ANL we agreed that 13 submodules which require re-work
because some scintillator slots are too small will be set aside in an
incomplete state until the amount of spare materials is known. It would
be more straightforward to replace them with new submodules. The raw
material status will not be known for several months and any recovery
work will be done at other sites.

The work accomplished in May involved stacking, gluing, and tack welding
of 2 submodules to bring the total to 194.

Full welding was done on 3 submodules to give a revised and final total
of 189. We note that 5 of the 13 incomplete submodules were only tack
welded.

Cleaning was done on 3 submodules in May for a revised and final total
of 181. Cleaning was not done on the 13 submodules with small slots.

Painting was done this month on 7 for a total of 175. The unpainted ones
are the 13 incomplete submodules plus the 6 which exceeded the thickness
spec, as mentioned in a previous month's report.

The QC sheets are not quite up to date at the end of May and will be
completed in June. As of the end of May some miscellaneous material such
as spare weld bars, paint, spring pins, etc. must still be transferred
to ANL. All submodules and spare steel plates have been already shipped.

Our certified welder and his helper have been let go and we have no
further manpower. Final cleanup tasks are being handled by U of C
personnel.

**1.4.1.2 Extended Barrel Module**

**1.4.1.2.1 Design** **Victor Guarino (Argonne National Lab.)**

Design work continued during May on the support saddles and cryostat
supports for the Extended Barrel. The preliminary design of the support
saddles is now complete and has been sent to CERN to be evaluated for
integration with muons and other components of the detector.

Structural analysis work continued on the design of the saddle and
cryostat supports. A Finite Element model of EB has been created which
included a simplified model of the saddle structures. This FE model was
used to find the forces acting between the EB and the saddles. These
forces were then applied to a very detailed FE model of the saddles in
order to examine stresses in the saddles. The stresses and deflections
of the saddles are within acceptable limits.

Detailed analysis is continuing on the cryostat back supports. The basic
design is complete and the stresses and deflections are within
acceptable limits. However, work is continuing on methods of supporting
the cryostat under earthquake conditions.

**1.4.1.2.3 Production**

  -------------------------- -------------- ---------------- -------------- ------------
  **Milestone**              **Baseline**   **Previous**     **Forecast**   **Status**

  Module Completion (30 Cum) 1-May-01       \--              1-May-01       Completed
  -------------------------- -------------- ---------------- -------------- ------------

**Victor Guarino (Argonne National Lab.)**

Two modules were constructed during May, ANL33 and ANL34. No problems
were encountered during the construction of these modules. Girders
#43-50 were inspected during the month at the factory in Spain. No
problems were found with any of them.

**1.4.1.4 Testing**

  ----------------- -------------- ---------------- -------------- --------------------
  **Milestone**     **Baseline**   **Previous**     **Forecast**   **Status**

  Beam test Series  2-Oct-01       \--              2-Oct-01       Delayed (See #1)
  A                                                                
  ----------------- -------------- ---------------- -------------- --------------------

**Note #1**  Testing of production modules has been delayed due to a
delay in the fabrication of production electronics. In particular a
major factor in this delay was the unavailability of the TTC chip. This
test is now scheduled to commence at the beginning of July 2001.

**1.4.2 Extended Barrel Optics**

**1.4.2.1 Extended Barrel Scintillator**

**1.4.2.1.3 Production**

  ------------------------------- -------------- ---------------- -------------- ------------
  **Milestone**                   **Baseline**   **Previous**     **Forecast**   **Status**

  100% Tile Deliveries from       2-Jul-01       \--              2-Jul-01       On Schedule
  Russia Compl                                                                   
  ------------------------------- -------------- ---------------- -------------- ------------

**David G. Underwood (Argonne National Lab.)**

At Argonne we completed module ANL 30. There were three scintillation
tiles in one pack which gave significantly less light than the rest of
the pack. These were replaced.

Optical Instrumentation Summary **Robert Miller (Michigan State
University)**

Instrumentation of the Tilecal extended barrel modules continued on a
normal schedule in May at ANL and MSU. Two modules were completed, one
at each site. A total of 29 modules have been instrumented with 3
additional modules in production. A new batch of tiles, sizes 4-11, was
received in May. This shipment will be sufficient for the next 16
modules instrumented at MSU and ANL.

At MSU, module ANL-25 was completed in May, scanned with the LED source,
and shipped back to ANL. Module ANL-31 was shipped to MSU and prepared
for instrumentation. Fibers were glued and polished in module ANL-28.
Fiber and profile installation was started in ANL-29. The rate of EB
module instrumentation at MSU could increase during the summer months to
3 weeks/module while our students are working full time. This rate will
be limited by module construction and other supplies.

**1.4.2.2 Extended Barrel Fibers**

**1.4.2.2.3 Production**

  ------------------------------- -------------- ---------------- -------------- ------------
  **Milestone**                   **Baseline**   **Previous**     **Forecast**   **Status**

  65% Fibers in Profiles from     2-Jan-01       \--              1-Jul-01       Delayed (See
  Lisbon to ANL & MSU                                                            #1)

  50% Module Instrum Complete     29-Jun-01      \--              29-Jun-01      On Schedule
  ------------------------------- -------------- ---------------- -------------- ------------

**Note #1**  Initial delivery of WLS fibers and profiles was delayed by
about 6 months due to start up problems with the robot facility in
Lisbon. Production and delivery of these components is now proceeding at
a rate that matches the module instrumentation rate, but is expected to
continue on a just-in-time schedule.

**David G. Underwood (Argonne National Lab.)**

At Argonne we completed module ANL 30. We had much more trouble with
fibers than usual. By means of the Cs scan, two fibers were found to
have severe damage at locations inside the profiles. These were
replaced. The damage must have occurred before the fibers were inserted
into profiles.

Also, 5 fibers had very low light output. These were all \"A\" fibers in
long profiles. There is some correlation of the low output with faint
marks on the fibers in the area in which they would be inside the
asperin tube. These marks may be from the fiber-stuffing machine, or may
be from the original fiber production. There is also a correlation with
the pattern of light seen at the end of the fiber when the fiber is
illuminated by room light or blue LED.

**1.4.3 Readout**

**1.4.3.1 PMT Block**

**1.4.3.1.3 Production** **Steven Errede (University
Illinois-Urbana-Champaign)**

We continued with setting up/testing/debugging Step2
hardware/electronics, while waiting for the Step1 reference grid to
arrive. Since it was significantly delayed, we instead commenced with
Step1 testing of Batch 5 Hamamatsu R-7877 PMTs, at the end of May. The
reference grid finally arrived on the last day in May.

**1.4.3.2 Front-end 3-in-1 Card**

**1.4.3.2.3 Production**

  ------------------------- -------------- ---------------- -------------- ----------------
  **Milestone**             **Baseline**   **Previous**     **Forecast**   **Status**

  3-In-1 Card Test 50%      1-Jun-01       \--              15-Jun-01      Delayed (See #1)
  Complete                                                                 

  3-In-1 Card Fab 100%      16-Jul-01      16-Jul-01        31-May-01      Completed
  Complete                                                                 
  ------------------------- -------------- ---------------- -------------- ----------------

**Note #1**  Based on where we are now and the current rate of
completion, a two week delay is expected in this milestone. It should be
noted that this has no impact on the overall TileCal progress.

**James Pilcher (University Of Chicago)**

In May we 398 3-in-1 cards to bring the total to 10,600 cards which is
100% of the order. Invoices for these were received and paid in May. The
card assembly process is complete.

In May we completed burn-in and testing and shipped to CERN 1600 pieces
to bring this total to 4879 or 46% of the total. The monthly average
over the 7-month period since burn-in and testing began is now up to 697
cards per month and our most recent 3 month running average is 930 per
month. Our original estimates were for 867 per month. Thus our current
throughput is above the expected rate and the long-term average will
continue to climb slowly.

**1.4.3.3 Front-end Motherboards**

**1.4.3.3.3 Production**

  --------------------- -------------- ---------------- -------------- ------------------------
  **Milestone**         **Baseline**   **Previous**     **Forecast**   **Status**

  MB Card Fab 10%       29-Jan-01      \--              30-Jun-01      Delayed (See #1)
  Complete                                                             

  MB Card Fab 25%       12-Feb-01      \--              31-Jul-01      Delayed (See #2)
  Complete                                                             

  MB Card Fab 50%       28-Feb-01      \--              31-Jul-01      Delayed (See #3)
  Complete                                                             

  MB Card Test 10%      1-Mar-01       \--              31-Jul-01      Delayed (See #4)
  Complete                                                             

  MB Card Fab 100%      6-Apr-01       \--              31-Aug-01      Delayed (See #5)
  Complete                                                             

  MB Card Test 25%      1-May-01       \--              1-Oct-01       Delayed (See #6)
  Complete                                                             

  MB Card Test 50%      1-Aug-01       \--              30-Nov-01      Delayed (See #7)
  Complete                                                             
  --------------------- -------------- ---------------- -------------- ------------------------

**Note #1-7**  On track for current forecast.

**James Pilcher (University Of Chicago)**

In May, based on our prodding, we received a detailed delivery schedule
from the assembly firm which calls for volume deliveries to start in
June. At the end of May the number of production board-sets received
remains at 5 (2% of total).

\[NOTE: At the time of writing in mid-June, volume deliveries have in
fact begun and we are at 12% of the total.\]

**1.4.3.6 Read System Management**

  -------------------------- -------------- ---------------- -------------- ----------------
  **Milestone**              **Baseline**   **Previous**     **Forecast**   **Status**

  Test BM Calib of 4 Prod.   1-Oct-01       \--              1-Oct-01       On Schedule
  Modls.                                                                    
  -------------------------- -------------- ---------------- -------------- ----------------

**James Pilcher (University Of Chicago)**

TileCal is on schedule to do test beam calibration of 2 production
barrel modules and 4 production extended barrel modules this summer.
Materials for the electronics drawers have been provided to Clermont
Ferrand for their integration work.

**1.4.4 Intermediate Tile Calorimeter**

**1.4.4.1 Gap Submodules**

**1.4.4.1.3 Production**

  ------------------------- -------------- ---------------- -------------- ------------------
  **Milestone**             **Baseline**   **Previous**     **Forecast**   **Status**

  Scintillator procurement  1-Oct-00       1-Jul-01         1-Aug-01       Delayed (See #1)

  Start Scintillator        1-Dec-00       1-Aug-01         1-Sep-01       Delayed (See #2)
  Assembly                                                                 

  Ship submodules 33-36 to  5-Mar-01       \--              15-May-01      Completed
  ANL                                                                      

  Ship submodules 37-40 to  11-Jun-01      \--              11-Aug-01      Delayed (See #3)
  ANL                                                                      

  Ship submodules 37-40 to  18-Jun-01      \--              18-Jun-01      On Schedule
  BCN                                                                      

  Ship submodules 41-44 to  27-Aug-01      \--              27-Aug-01      On Schedule
  ANL                                                                      

  Ship submodules 41-44 to  3-Sep-01       \--              3-Sep-01       On Schedule
  BCN                                                                      
  ------------------------- -------------- ---------------- -------------- ------------------

**Note #1**  Prototypes of the ITC extension scintillators were tested
at the CERN test beam last summer. Based on the test beam experience, we
have made final modifications to the scintillator design. Procurement
will follow as soon as final drawings are approved, and funding to buy
extension scintillators is available at MSU.

**Note #2**  Prototypes of the ITC extension scintillators were tested
at the CERN test beam last summer. Based on the test beam experience, we
have made final modifications to the scintillator design. Assembly will
follow as soon as funding to buy extension scintillators are available
at MSU.

**Note #3**  Due to delayed startup of production in 1999, we are 2
months behind original schedule. There is no impact on module
production.

**Kaushik De (University Of Texas At Arlington)**

Two submodules were shipped to Argonne in May. Two more were shipped to
Barcelona. One of these was the first special ITC submodule. The
production of these specials is progressing smoothly. Since these
specials require part of the ITC to be truncated, we have successfully
made a special out of an old rejected ITC0025 by cutting it down!

We received 250 PMTs and the calibration Grid - both in May. PMT testing
has now started at UTA. The first results were shown during the ATLAS
Tile week at CERN in May. We plan to finish Phase I testing of these 250
PMTs in June.

**1.4.4.2 Cryostat Scintillators**

**1.4.4.2.3 Production**

  ---------------------------- -------------- ---------------- -------------- ----------------
  **Milestone**                **Baseline**   **Previous**     **Forecast**   **Status**

  Scintillator procurement     1-Dec-00       \--              1-Dec-01       Delayed (See #1)

  Start Scintillator Assembly  7-Sep-01       \--              7-Sep-01       On Schedule

  Management Contingency       1-Oct-01       \--              1-Oct-01       On Schedule
  Go-Ahead                                                                    
  ---------------------------- -------------- ---------------- -------------- ----------------

**Note #1**  Scintillator purchase and production of the ITC crack
scintillators is delayed pending the decision to authorize this part of
the project that was included in the management contingency fund. That
decision is scheduled for 1 Oct. 01. Funding for the mechanical
components was approved in Feb. 01, and those components will be
purchase in FY 01.

**Robert Miller (Michigan State University)**

Assembly of the clear ITC fibers into the guide plates for the special
EB modules continued at MSU in May. The design of the ITC crack
scintillator was reviewed and we have decided to reduce the thickness of
the Aluminum cover to allow ourselves more tolerance on the 8 mm
thickness.

**1.5 MUON**

**Milestones with changed forecast dates:**

  ------------------ -------------- ---------------- -------------- ------------------
  **1.5.4.4.1 CSC1**                                                

  **Milestone**      **Baseline**   **Previous**     **Forecast**   **Status**

  16 Chambers        2-Oct-01       2-Oct-01         30-Apr-02      Delayed (See #1)
  Complete                                                          

  **Note                                                            
  #1**  Please see                                                  
  Note #1.                                                          
  ------------------ -------------- ---------------- -------------- ------------------

  -------------------------- -------------- ---------------- -------------- ----------------
  **1.5.4.5 CSC Support                                                     
  Structure**                                                               

  **Milestone**              **Baseline**   **Previous**     **Forecast**   **Status**

  Start Support Structures   3-Jan-01       3-May-01         3-Dec-01       Delayed (See #1)
  Construction                                                              

  **Note #1**  The small                                                    
  wheel fabrication is                                                      
  expected to be launched by                                                
  the end of the year. The                                                  
  contract and follow-up                                                    
  will be CERN                                                              
  responsibility.                                                           
  -------------------------- -------------- ---------------- -------------- ----------------

<table>
<colgroup>
<col style="width: 33%" />
<col style="width: 5%" />
<col style="width: 3%" />
<col style="width: 7%" />
<col style="width: 4%" />
<col style="width: 6%" />
<col style="width: 4%" />
<col style="width: 10%" />
<col style="width: 21%" />
<col style="width: 0%" />
</colgroup>
<tbody>
<tr class="odd">
<td colspan="10"><strong>1.5.7.3.3 Series Production Precision
Tooling</strong></td>
</tr>
<tr class="even">
<td><strong>Milestone</strong></td>
<td colspan="2"><strong>Baseline</strong></td>
<td colspan="2"><strong>Previous</strong>  </td>
<td colspan="2"><strong>Forecast</strong></td>
<td colspan="2"><h3 id="status-1">Status</h3></td>
<td></td>
</tr>
<tr class="odd">
<td>Finish Series Production Tooling</td>
<td colspan="2">1-Feb-01</td>
<td colspan="2">15-May-01</td>
<td colspan="2">15-Jun-01</td>
<td colspan="2">Delayed (See #1)</td>
<td></td>
</tr>
<tr class="even">
<td colspan="10"><strong>Note #1</strong>  All parts are complete for
the next series chambers except the gluing of the Bessel bridges. This
will be done at HU HEPL after the granite table is free. All BMC tooling
will be delivered to Harvard by June 15 - at time of need.</td>
</tr>
<tr class="odd">
<td colspan="10"><strong>1.5.7.3.11 BMC Chamber Assembly
Station</strong></td>
</tr>
<tr class="even">
<td colspan="2"><strong>Milestone</strong></td>
<td colspan="2"><strong>Baseline</strong></td>
<td colspan="2"><strong>Previous</strong>  </td>
<td colspan="2"><strong>Forecast</strong></td>
<td colspan="2"><strong>Status</strong></td>
</tr>
<tr class="odd">
<td colspan="2">EIS1 tooling drawings delivered to BMC</td>
<td colspan="2">15-Apr-01</td>
<td colspan="2">15-May-01</td>
<td colspan="2">1-Jun-01</td>
<td colspan="2">Delayed (See #1)</td>
</tr>
<tr class="even">
<td colspan="2">EIS1 Drawings available</td>
<td colspan="2">15-Apr-01</td>
<td colspan="2">15-May-01</td>
<td colspan="2">1-Jun-01</td>
<td colspan="2">Delayed (See #2)</td>
</tr>
<tr class="odd">
<td colspan="10"><p><strong>Note #1</strong>  All Brandeis drawings
delivered. Sp.Fr Jigging design delayed.</p>
<p><strong>Note #2</strong>  Brandeis and Engineering Dept. deliver
drawings to BMC site. EIS1 drawings are waiting the final determination
of the global alignment fixture. This is an integration issue with the
support structure, chamber design and the alignment system.</p></td>
</tr>
</tbody>
</table>

  ------------------- -------------- ---------------- -------------- ------------------
  **1.5.9.2.1 Signal                                                 
  Hedgehog 3X8**                                                     

  **Milestone**       **Baseline**   **Previous**     **Forecast**   **Status**

  Hedgehog PCB        30-Aug-00      1-Jul-01         1-Aug-01       Delayed (See #1)
  Certified                                                          

  **Note                                                             
  #1**  Delayed to                                                   
  consider design                                                    
  changes:                                                           
  shortening, coating                                                
  change. Also the HV                                                
  capacitor vendor                                                   
  selected is                                                        
  unacceptable to                                                    
  CERN; we must                                                      
  evaluate other                                                     
  vendors and choose                                                 
  a replacement.                                                     
  ------------------- -------------- ---------------- -------------- ------------------

  ------------------------- -------------- ---------------- -------------- ----------------
  **1.5.11.1.1 Design**                                                    

  **Milestone**             **Baseline**   **Previous**     **Forecast**   **Status**

  System Critical Design    2-Oct-01       2-Oct-01         1-Dec-01       Delayed (See #1)
  Review                                                                   

  Preamp/Shaper Final       2-Oct-01       2-Oct-01         1-Dec-01       Delayed (See #2)
  Design Review                                                            

  **Note #1-2**  Delayed to                                                
  allow us to verify design                                                
  modifications to                                                         
  preamp/shaper for yield                                                  
  enhancement, reduced                                                     
  crosstalk, and improved                                                  
  overload recovery..                                                      
  ------------------------- -------------- ---------------- -------------- ----------------

  ------------------------ -------------- -------------- -------------- ----------------------
  **1.5.11.4.1 Sparsifier                                               
  Design**                                                              

  **Milestone**            **Baseline**   **Previous**   **Forecast**   **Status**

  Sparsifier Prelim Design 2-Mar-01       15-Jun-01      30-May-01      Completed (See #1)
  Review                                                                

  **Note #1**  Held                                                     
  jointly with ROD PDR on                                               
  30-May-01.                                                            
  ------------------------ -------------- -------------- -------------- ----------------------

  -------------------- -------------- -------------- -------------- ---------------------------
  **1.5.11.5.1 ROD                                                  
  design**                                                          

  **Milestone**        **Baseline**   **Previous**   **Forecast**   **Status**

  RODs Prelim Design   31-Oct-00      15-Jun-01      30-May-01      Completed (See #1)
  Review                                                            

  **Note #1**  Held                                                 
  jointly with                                                      
  Sparsifier PDR on                                                 
  30-May-01.                                                        
  -------------------- -------------- -------------- -------------- ---------------------------

  ------------------------------- -------------- -------------- -------------- ----------------
  **1.5.12.1.3 Multi-Point System                                              
  (BCAM)**                                                                     

  **Milestone**                   **Baseline**   **Previous**   **Forecast**   **Status**

  Design Compete for H8 version   31-Jan-01      1-Jun-01       31-May-01      Completed
  of the BCAM                                                                  
  ------------------------------- -------------- -------------- -------------- ----------------

  --------------------------------- -------------- ---------------- -------------- -------------
  **1.5.12.1.5 DAQ**                                                               

  **Milestone**                     **Baseline**   **Previous**     **Forecast**   **Status**

  Complete design of H8 alignment   1-Apr-01       1-Jun-01         30-Jun-01      Delayed (See
  DAQ hardware.                                                                    #1)

  **Note #1**  Responding to the                                                   
  moves of the Big and Small wheel                                                 
  has drained resources needed to                                                  
  complete this job.                                                               
  --------------------------------- -------------- ---------------- -------------- -------------

  --------------- -------------- ---------------- -------------- --------------------
  **1.5.12.4.5                                                   
  EIS1 (Boston)**                                                

  **Milestone**   **Baseline**   **Previous**     **Forecast**   **Status**

  Ship to Site    16-Feb-01      1-Jun-01         15-Jun-01      Delayed (See #1)

  **Note                                                         
  #1**  The                                                      
  latest MDT                                                     
  production                                                     
  schedule has                                                   
  shifted the                                                    
  delivery date                                                  
  of the inplane                                                 
  system to Jun                                                  
  1, 2001. Delays                                                
  in shop                                                        
  schedules have                                                 
  delayed this                                                   
  item about 2                                                   
  weeks.                                                         
  --------------- -------------- ---------------- -------------- --------------------

  --------------- -------------- ---------------- -------------- --------------------
  **1.5.12.4.17                                                  
  EMS2                                                           
  (Seattle)**                                                    

  **Milestone**   **Baseline**   **Previous**     **Forecast**   **Status**

  Ship to Site    23-Jan-01      1-Jun-01         15-Jun-01      Delayed (See #1)

  **Note                                                         
  #1**  The                                                      
  latest MDT                                                     
  production                                                     
  schedule has                                                   
  shifted the                                                    
  delivery date                                                  
  of the inplane                                                 
  system to Jun                                                  
  1, 2001. Delays                                                
  in shop                                                        
  schedules have                                                 
  delayed this                                                   
  item about 2                                                   
  weeks.                                                         
  --------------- -------------- ---------------- -------------- --------------------

**1.5.4 CSC Chambers**

**1.5.4.2 Tooling**

  --------------------- -------------- -------------- -------------- -------------
  **Milestone**         **Baseline**   **Previous**   **Forecast**   **Status**

  QA Systems Complete   31-Jul-00      \--            31-May-01      Completed
  --------------------- -------------- -------------- -------------- -------------

**1.5.4.4 CSC Construction**

  -------------------------- -------------- -------------- -------------- ---------------
  **Milestone**              **Baseline**   **Previous**   **Forecast**   **Status**

  Start CSC Chamber          1-Mar-01       \--            1-Sep-01       Delayed (See
  Production                                                              #1)
  -------------------------- -------------- -------------- -------------- ---------------

**Note #1**  Start of production will likely slip further pending
completion of the work on documentation, procurement specification, and
other open issues identified during the November 27 PRR.

**1.5.4.4.1 CSC1**

  --------------------- -------------- ---------------- -------------- -------------------
  **Milestone**         **Baseline**   **Previous**     **Forecast**   **Status**

  4 Chambers Complete   1-May-01       \--              1-Dec-01       Delayed (See #1)

  16 Chambers Complete  2-Oct-01       2-Oct-01         30-Apr-02      Delayed (See #2)
  --------------------- -------------- ---------------- -------------- -------------------

**Note #1-2**  This milestone follows the delay in start of
construction, now scheduled for September 1.

**1.5.4.5 CSC Support Structure**

  ---------------------------- -------------- ---------------- -------------- ----------------
  **Milestone**                **Baseline**   **Previous**     **Forecast**   **Status**

  Start Support Structures     3-Jan-01       3-May-01         3-Dec-01       Delayed (See #1)
  Construction                                                                
  ---------------------------- -------------- ---------------- -------------- ----------------

**Note #1**  The small wheel fabrication is expected to be launched by
the end of the year. The contract and follow-up will be CERN
responsibility.

**1.5.7 MDT Chamber Production**

**1.5.7.1 Engineering Management**

**1.5.7.1.1 Chamber Integration Drawings**

  ----------------------------- -------------- ---------------- -------------- -----------------
  **Milestone**                 **Baseline**   **Previous**     **Forecast**   **Status**

  Complete Chamber Integration  1-Jul-01       \--              1-Oct-01       Delayed (See #1)
  Drawings                                                                     

  Chamber Integration Drawings  28-Sep-01      \--              28-Sep-01      On Schedule

  Chamber Integration Drawings  28-Sep-01      \--              28-Sep-01      On Schedule
  ----------------------------- -------------- ---------------- -------------- -----------------

**Note #1**  The drawing schedule is ahead of need.

**Richard Coco (MIT)**

Chamber Integration drawings for the next three chambers in the US MDT
construction sequence - Series 2 - EIS1 (BMC);EMS4(UM) and EMS2(UW) are
in process.

The Series 1 top level chamber assembly drawings for EIL1, EMS5 and EML2
were posted to the CERN drawing directory. CDD assigned drawing numbers
are:

ATLMMP_0021 EIL1 - Side A

ATLMMP_0022 EIL1 - Side C

ATLMMS_0041 EMS5 - Side A

ATLMMS_0042 EMS5 - Side C

ATLMMT_0024 EML2 - Side A

ATLMMT_0034 EML2 - Side C

**1.5.7.1.2 Engineering Documentation** **Richard Coco (MIT)**

Engineering documentation continues to focus on the next series of
chambers to be assembled, top chamber assembly drawings for EIS1; EMS4
and EMS2.

The drawings for the 4x6x14Deg; 3x8x14 Deg and 3x8x8.5 Deg faraday cages
have been completed. Work is in process to complete the final 4x6x8.5Deg
FC design during the next reporting period. Effort will then focus on
completing the final mezz card box and H/V power feed box designs.

Type 3 gas bar drawings have been completed for the EIS1, EMS4 and EMS2
chambers.

**1.5.7.1.4 QA/QC Engineering Support** **Richard Coco (MIT)**

General engineering support is provided to chamber parts procurement and
production QA/QC activities as required.

**1.5.7.1.5 Project Engineering** **Richard Coco (MIT)**

Project engineering activities include supervision of: engineering
design and documentation, parts procurement and completion of cost and
schedule studies as directed by the program manager.

Activities in early May focused on the PAR review meeting held at
Harvard HEPL on 5/4 and 5/5/01.

**1.5.7.2 Design of Chambers and Tooling**

**1.5.7.2.1 Faraday Cages**

  ------------------------ -------------- ---------------- -------------- -------------------
  **Milestone**            **Baseline**   **Previous**     **Forecast**   **Status**

  Finished Faraday Cage    21-Dec-00      \--              22-Aug-01      Delayed (See #1)
  Designs                                                                 
  ------------------------ -------------- ---------------- -------------- -------------------

**Note #1**  EIL1 is complete and parts have been made. The 3 layer
designs of the base plates are finished and have been sent to vendor for
production quote and prototype.

**Richard Coco (MIT)**

The Faraday Cage design was completed in May for the 3x8x8.5 Deg and
3x8x14 Deg chambers. Much of the effort focused on providing a power
distribution box on the H/V side of the chamber. This had not been
requested to be part of the initial FC design.

The 4x6x14 Deg FC design completed in April was revised to include the
modification to correct these problems.

Efforts will next focus on the final FC design, that for the 4x6x8.5Deg
chambers.

The evaluation of the 4x6x14 Deg FC on one of the completed EIL1
chambers found several minor design problems which have been corrected\>
These corrections were also made to the 3x8 FC drawings.

**1.5.7.2.2 Gas System**

  --------------------- -------------- ---------------- -------------- ----------------
  **Milestone**         **Baseline**   **Previous**     **Forecast**   **Status**

  Finish Gas System     7-Jun-01       \--              7-Jun-01       On Schedule
  Design                                                               
  --------------------- -------------- ---------------- -------------- ----------------

**Krzysztof Sliwa (Tufts University)**

An initial set of six Noryll gas blocks, produced at the end of April,
was submitted to BMC for inspection and testing of the matchup to gas
values. The pieces were found to be properly machined and Tufts was
given approval to proceed with mass production near the of the month. A
review of all drawings for these pieces was carried out by L. McMaster;
in consultation with Dick Coco. A few minor tuneups were discussed and
approved. The setup for mass production of gas blocks was ready in the
Tufts shop on June 1st, 2001. The production manufacture of 480 pieces
will require approximately five weeks.

**Richard Coco (MIT)**

Drawings were completed for the new Type 3 gas manifold bars for the
next series of chambers, EIS1, EMS4 and EMS2. The Noryl gas block design
was modified to improve machining. Preliminary layouts of the gas
distribution tubing, which supply the gas from the Noryl gas block to
each gas manifold bar, were initiated.

**1.5.7.2.3 Spacer Farme Design** **Henry Lubatti (University of
Washington)**

Colin Daly began design and analysis of the EIL2/3 spacer frame.

**1.5.7.2.4 Chamber Analysis**

  --------------------- -------------- ---------------- -------------- ------------------
  **Milestone**         **Baseline**   **Previous**     **Forecast**   **Status**

  Finish FEA Modeling   30-Aug-01      \--              30-Aug-01      On Schedule
  --------------------- -------------- ---------------- -------------- ------------------

**Henry Lubatti (University of Washington)**

Colin Daly continued his work on thermal analysis of MDT chambers.

**1.5.7.2.5 design of Special Chamber Tooling**

  ---------------------------- -------------- ---------------- -------------- ----------------
  **Milestone**                **Baseline**   **Previous**     **Forecast**   **Status**

  Finish all Special Chamber   27-Sep-01      \--              27-Sep-01      Delayed (See #1)
  Tooling                                                                     
  ---------------------------- -------------- ---------------- -------------- ----------------

**Note #1**  Design of special chamber tooling is delayed. Much
integration work needs to be done to finish this.

**1.5.7.3 Tooling**

**1.5.7.3.1 Module 0-Precision Tooling**

**1.5.7.3.3 Series Production Precision Tooling**

  --------------------------- -------------- ---------------- -------------- ------------------
  **Milestone**               **Baseline**   **Previous**     **Forecast**   **Status**

  Finish Series Production    1-Feb-01       15-May-01        15-Jun-01      Delayed (See #1)
  Tooling                                                                    
  --------------------------- -------------- ---------------- -------------- ------------------

**Note #1**  All parts are complete for the next series chambers except
the gluing of the Bessel bridges. This will be done at HU HEPL after the
granite table is free. All BMC tooling will be delivered to Harvard by
June 15 - at time of need.

**1.5.7.3.5 BMC Tube Assembly Station** **Frank Taylor (MIT)**

The BMC tube assembly station continues to operate. Tubes for EIS1 are
now being fabricated and tested. All tube parameters are within nominal
ranges but an investigation of the details of the wire tension
measurement is underway. The tube rejection fraction is about 2.3%. The
station is a collaboration of personnel from Brandeis, Tufts and MIT.

**1.5.7.3.8 BMC Tube Test Station** **Frank Taylor (MIT)**

The BMC tube test station continues to operate. EIS1 tubes (BMC series
2) are being fabricated and checked. Good throughput of the tube leak
testing is maintained by the Brandeis Schublade which is able to certify
24 tubes at once. A few leaky tubes were recently encountered. One has a
definite pinhole in the tube wall. Examination by microscope reveals an
inclusion in the die penetrated the tube wall. Sample testing of the
wire position is now the standard operating procedure. The tube test
station is a collaboration of personnel from Brandeis, Harvard, MIT, and
Tufts.

**1.5.7.3.11 BMC Chamber Assembly Station**

  ------------------------------ -------------- ---------------- -------------- -------------
  **Milestone**                  **Baseline**   **Previous**     **Forecast**   **Status**

  EIS1 Drawings available        15-Apr-01      15-May-01        1-Jun-01       Delayed (See
                                                                                #1)

  EIS1 tooling drawings          15-Apr-01      15-May-01        1-Jun-01       Delayed (See
  delivered to BMC                                                              #2)

  EIS1 tooling parts delivered   15-May-01      \--              10-Jun-01      Delayed (See
  to BMC assembly group                                                         #3)

  Start Retooling for EIS1       14-Jun-01      \--              14-Jun-01      See Note #4

  Start EIS1 Production          10-Jul-01      \--              10-Jul-01      See Note #5
  ------------------------------ -------------- ---------------- -------------- -------------

**Note #1**  Brandeis and Engineering Dept. deliver drawings to BMC
site. EIS1 drawings are waiting the final determination of the global
alignment fixture. This is an integration issue with the support
structure, chamber design and the alignment system.

**Note #2**  All Brandeis drawings delivered. Sp.Fr Jigging design
delayed.

**Note #3**  Due one month after tooling drawings delivery. As of 5/25
only the approved Brandeis tooling drawings received by the BMC HU shop.
The productions started on May 10. On May 25, HU received additional
jobs which originally were assigned to other places.

**Note #4**  Pending tooling parts and drawings delivery

**Note #5**  Three weeks after Start Retooling. Pending chamber drawings
delivery.

**Alex Marin (Boston University)**

See the updated 5 milestones for tooling and EIS1 start of production.
(Ahlen, Hurst, Haggerdy, Hennessy, Sal, Sansone, Marin)

**1.5.7.3.14 BMC Chamber Test Station** **Alex Marin (Boston
University)**

Cosmic Ray Test Stand: (Steve Ahlen)

Tracking resolution of 80 microns and single tube efficiencies of 97%
have been obtained with 93-7 Ar-CO2 at 3 bar, 3080 volts, and threshold
at 20 electrons. Early difficulties with AMT-1 and CSM-0 have been
resolved by proper tuning of mezzanine card and CSM-0 parameters.
Currently using an acquisition program written in C using NI-VXI calls
that includes zero suppression for scintillator QDC and TDC data. The
acquisition program runs well, with no problems other than buffer errors
for scintillator and CSM-0 every few thousand events due to noise.
Analysis programs being developed by Ahlen and students Michael Ide and
Daniel Sherman to deal with high statistics data sets (20 million events
per day) for refined studies of Mod-0 performance.

Gas Test Room (Steve Ahlen)

Students Dan Hoak and Paula Brock working with Ahlen to build gas test
system to check for leaks in chambers. Differential manometers,
thermometers and pressure transducers are read out by 15 bit Kinetic
Systems scanning ADC with LabView/Mac system. Plumbing and
monitoring/analysis programs will be completed in June.

**1.5.7.5 Chamber Handling and Shipping Containers**

**1.5.7.5.2 Chamber Shipping Containers** **Richard Coco (MIT)**

The design of the next shipping box for the BMC Series 3 chamber EIS2
will be re-worked to allow for removal of the boxer sides to allow
installation of services or checkout of electronics without having to
removing the chamber from the shipping crate.

**1.5.7.6 Common Procurement**

**1.5.7.6.1 Procurement of Tubes** **Tom Fries (Harvard University)**

All 3 US assembly sites have received the 1st & 2nd series tubes.
Additionally, batch Nos. 73 & 84 are being prepared at Menziken for
delivery to BMC & UW respectively.

**1.5.7.6.2 Procurement of Wire** **Tom Fries (Harvard University)**

No additional wire was received during this period. There is enough on
hand for many months\' production requirements.

**1.5.7.6.3 Procurement of Endplugs** **Tom Fries (Harvard University)**

4,600 NIEF Endplugs were received from CERN and distributed among the 3
US sites. Additionally, the final machining of the 10,000 piece
MPI-style Endplugs commenced. This will provide a 6 week buffer
inventory once they arrive during June.

**1.5.7.6.4 Procurement of Faraday Cage** **Tom Fries (Harvard
University)**

The balance of the 16-chamber EIL-1 Box-On-Box order arrived at BMC
during the 1st week of May. By month\'s end, 2 orders for 16 chambers
each of EMS & EML were on-hold pending final changes to the engineering
drawings.

**1.5.7.6.5 Procurement of Gas Supply System** **Tom Fries (Harvard
University)**

Tubeletts:

The domestic supplier (ATB) began shipping production quantities and by
month\'s end had shipped about 75% of the order. The European supplier
(Heim) was finishing up the tooling. They plan to complete tooling in
June and will then begin series production of tubeletts.

Retainers, Tubelett:

The European supplier (Walter Hugin) of the 8.5 & 14 degree molded
plastic retainers for the Type-III gas bars expects to complete final
tooling in June.

Extrusion for Gas Bars:

The extrusion tooling for the Type-III bar design was approved. An
extrusion order will be placed in early June with delivery expected in
early July. The order will be drop-shipped to UW for fabrication.

**1.5.7.6.6 Procurement of Spacer Frame + Attachment** **Henry Lubatti
(University of Washington)**

Josh Wang finished series 2 (EIS1, EMS2 and EMS4) spacer frame
part-drawings and submitted them for checking, began the series 3 spacer
frame part-drawings, and did some preliminary design of the EIL2-3
spacer frame top establish the material-order requirement.

**1.5.7.7 BMC Chamber Construction 104**

**1.5.7.7.1 EIL 1 Series (WBS 1.5.7.7.1)**

  ------------------------ -------------- ---------------- -------------- -----------------
  **Milestone**            **Baseline**   **Previous**     **Forecast**   **Status**

  End of EIL1 series       14-Jun-01      \--              14-Jun-01      On Schedule
  production                                                              
  ------------------------ -------------- ---------------- -------------- -----------------

**Frank Taylor (MIT)**

All the tubes for EIL1 have been made and are delivered to the chamber
makers at the BMC.

**Alex Marin (Boston University)**

Mod 15 completed as of May 26. See milestone. (Ahlen, Hurst, Haggerdy,
Hennessy, Sal, Sansone, Marin)

**1.5.7.7.2 EIS1 series (WBS 1.5.7.7.2)** **Frank Taylor (MIT)**

Over a 1,000 tubes for EIS1 have been made. For the complete EIS1 series
about 5,376 tubes are required.

**Alex Marin (Boston University)**

See 1.5.7.3.11 five milestones, containing preparation and schedule for
EIS1 production start. (Ahlen, Hurst, Haggerdy, Hennessy, Sal, Sansone,
Marin)

**1.5.7.8 WBS 1.5.7.8 Michigan Chamber Construction 104**

**1.5.7.8.1 EMS5 Series (WBS 1.5.7.8.1)** **Ed Diehl (University of
Michigan)**

We have completed 15 base EMS5 chambers in May, and will complete the
16th and final EMS5 chamber in the first week of June. We finished EMS5
tube production and started changing the wiring room for EMS4 tube
production.

We have decided to set up a cosmic-ray stand in the truck bay which is
the only available space for it. We\'ll use the stand to test a complete
chamber with full electronics readout.

We had a few small glitches in production. NIEF (endplug maker) recently
switched to packaging endplugs in black plastic holders, which are
superior to the cardboard which had been used (which left a lot of dust
in the endplugs). However, it happens that some of the black plastic
rubs on the endplugs and is hard to clean off. Fortunately, the plastic
seems to be non-conductive and so it does not seem to cause problems.

We still had some dark current problems. Nearly all were fixed by
reverse HV, and long burn-in times.

We did a final BCAL measurement of the comb positions for EMS5. We found
the comb positions had been stable to +- 10 microns for the entire EMS5
run.

**1.5.7.8.2 EMS4 Series (WBS 1.5.7.8.2)** **Ed Diehl (University of
Michigan)**

We continued preparing for EMS4 production. We\'ve upgraded most of our
computers to Windows2000 which makes them less crash-prone, but run more
slowly due to OS bloat. Most of our production programs have been
revised for EMS4.

**1.5.7.9 WBS 1.5.7.9 Seattle Chamber Construction 96**

**1.5.7.9.1 EML2 Series (WBS 1.5.7.9.1)** **Henry Lubatti (University of
Washington)**

We completed 683 tubes in May, which completes the tubes needed for EML2
chambers. We began modifications to tube assembly line needed for next
series of chambers. Upgraded all three PC systems used in Tube Assembly
and Tube QA/QC from Windows NT to Windows 2000.

**1.5.7.9.1.2 Seattle Series Chamber Assembly** **Paul Mockett
(University of Washington)**

We completed the assembly of EML.2C7 to 2C11 (series numbers 12, 13, 14)
during April. Chamber production is currently limited by the rate of
tube production.

**1.5.7.9.1.3 Ship/Store**

We have 7 chambers stored at an expeditor's warehouse. Module 2 has been
returned from CERN following the X-Tomo.

**1.5.8 MDT Supports**

**1.5.8.1 Mechanical design**

**1.5.8.1.1 Kinematic Mounts** **Henry Lubatti (University of
Washington)**

Colin Daly attended the PAR review meeting in Boston and presented the
Forward chamber mount design and production status.

**1.5.8.1.3 Integ with Support Structure**

  ------------------------------ -------------- ---------------- -------------- --------------
  **Milestone**                  **Baseline**   **Previous**     **Forecast**   **Status**

  (SM Wheel) CERN Design/FEA     15-Jul-00      \--              1-Dec-01       Delayed (See
  Complete                                                                      #1)

  (Big Wheel) CERN Design/FEA    1-Feb-01       \--              15-Dec-01      Delayed (See
  Complete                                                                      #2)

  50% Complete                   15-Feb-01      \--              15-Jul-01      Delayed (See
                                                                                #3)

  50% Complete                   1-Aug-01       \--              1-Aug-01       On Schedule
  ------------------------------ -------------- ---------------- -------------- --------------

**Note #1**  A large fraction of this work has been completed, but as we
depend on CERN for the detailed small wheel design from CERN and others
for alignment bar and plumbing information we have a delay. Some small
progress was made in April. We forecast that this will not be completed
until December 4, 2001.

**Note #2**  Because we depend on CERN for the detailed big wheel design
and others for alignment bar and plumbing information we have a delay.
We forecast that this will not be completed until March 15,2002.

**Note #3**  For reasons given in the delayed small/big wheel the 50%
complete point will not be reached until about July 15, 2001.

**Henry Lubatti (University of Washington)**

Colin Daly attended the Big Wheel Final Design Review at CERN. Colin
Daly continued design work on integration of the chamber mounts with the
support structures. Specifically the integration of the mount strut
design with the Big and Small wheel structures and chamber support
points.

**1.5.9 MDT Electronics**

**1.5.9.1 Mezzanine Card**

**1.5.9.1.1 MDT-ASD**

  --------------- -------------- ---------------- -------------- -------------------------
  **Milestone**   **Baseline**   **Previous**     **Forecast**   **Status**

  ASD PRR         19-Oct-01      \--              19-Oct-01      On Schedule
  --------------- -------------- ---------------- -------------- -------------------------

**1.5.9.2 Hedgehog Cards**

**1.5.9.2.1 Signal Hedgehog 3X8**

  ------------------------- -------------- ---------------- -------------- -----------------
  **Milestone**             **Baseline**   **Previous**     **Forecast**   **Status**

  Hedgehog PCB Certified    30-Aug-00      1-Jul-01         1-Aug-01       Delayed (See #1)

  Hedgehog Production       28-Feb-01      \--              31-Dec-02      Delayed (See #2)
  Complete                                                                 
  ------------------------- -------------- ---------------- -------------- -----------------

**Note #1**  Delayed to consider design changes: shortening, coating
change. Also the HV capacitor vendor selected is unacceptable to CERN;
we must evaluate other vendors and choose a replacement.

**Note #2**  Production will most likely now take place at CERN starting
in the last quarter of 2001. The first production quantities should be
available at the end of 2001. Production will continue during 2002 in
parallel with chamber building.

**1.5.9.4 Chamber Service Module**

  ----------------- -------------- ---------------- -------------- -----------------
  **Milestone**     **Baseline**   **Previous**     **Forecast**   **Status**

  CSM-1 Prototype   1-Sep-00       \--              1-Jun-02       Delayed (See #1)
  ----------------- -------------- ---------------- -------------- -----------------

**Note #1**  The scope of the CSM-1 has recently changes to a simpler,
more robust design. As a result the completion date of the first
prototype has moved to spring 02. Work on the design for this more
ambitious design is progressing.

**Jay Chapman (University of Michigan)**

Progress has been made on the five major components of the CSM-1. Each
is described below:

a\) The main multiplexing task of the CSM-1 has been compressed from 4
FPGAs into one using a scheme of clock phase sampling to remove the need
for many independent clock networks, using a large fine pitch ball grid
array chip, and using a LVDS compatible FPGA from Xilinx, the XCVnnnnE
series. Work to compress the FPGA code into a single chip is underway.

b\) Prototype testing of the optical fiber output to the MROD will be
done using the ODIN Duplex implementation of S-Link to expedite the
project although we expect to use an S-Link core module within our own
FPGA in the final design. The final design will use a Simplex optical
channel so we must recode the FPGA code from it current Duplex
implementation to the Simplex form prior to the final CSM development.
Work is being carried out in parallel to do this Duplex to Simplex
conversion.

c\) The CSM-1 requires clocking and event triggering. The initial
prototype, the CSM-0, is configured to use an FPGA for emulation of the
TTC system. For the CSM-1 design the Trigger, Timing, and Control will
be based on the CERN developed TTC system. Our transition from the
internal simulation of the trigger and timing to the externally
generated functions implies and integration of the CERN chip into the
module and the software integration of the TTCvi module into our
environment. This work has begun and will continue throughout year 2001.

d\) The initialization of the ASD/TDC mezzanine cards is done via JTAG
protocol which in the case of the CSM-0 is built into the VME functions
of the CSM-0 module. In the CSM-1 no VME connections is available. The
CSM-0 will use an opto-isolated JTAG function as will the final CSM.
However, the final CSM will have a DCS connection and a CAN bus
interface to provide the programming for the JTAG. To make progress
toward this final goal, the opto-isolated JTAG will be driven from a
commercial module.

e\) The CSM will interconnect to the ASD/TDC modules via shielded ribbon
cables that leave the Faraday cages and converge at the spacer place of
the MDT. At this location they will attach to a passive interconnect on
which the active CSM will reside. This interconnect board is designed.
To make use of the current CSM-0 with the new interconnect board, an
adapter board will be constructed with the same circuit design as the
adapter currently in use with the CSM-0, but designed to attach to the
passive interconnect. Following use with the CSM-0, a simple replacement
of this new adapter with the CSM-1 will convert a chamber from CSM-0
readout to the MROD readout via the CSM-1.

**1.5.9.5 Detector Control System** **Paul Mockett (University of
Washington)**

1\) OPC User Document has gone through initial revision by author and
programmer for consistency and correctness. Will give to 3rd person for
installation test.

2\) As for PVSS not allowing numerical arrays, one method of getting
around this is to take our arrays of unsigned chars and converting it to
an array of characters and thus creating a text string - which is
supported by PVSS in the current version.

3\) Our 2 EPC-1316 VME processors have arrived and after some questions
about ethernet drivers, the systems were both configured for
Windows2000. Both systems function correctly. A third board was acquired
and setup in the Chamber Assembly room.

4\) The EPC-15 in the Chamber assembly room was replaced with an
EPC-1316. The EPC-15 was moved to the Chamber test area to help in the
construction of Spacer supports, and installation of the In-Plane Rasnik
system on the supports.

5\) A ccd multiplexer failed, and when fuses were replaced, an IC
exploded. The board will be returned to Brandeis to be evaluated and
repaired/replaced.

6\) An LED multiplexer failed as well. This was due to the output being
shorted when a tube tray accidentally bumped it. The board is also going
to be returned to Brandeis for evaluation and repair/replacement. The
location of the LED multiplexer has been moved to avoid such a future
accident.

7\) The new EPC-1316\'s have been fully tested with the DAWN VME crates.
Once the backplane had been jumpered to allow the bus-grant line to be
passed to all card, the EPC-1316\'s functioned as expected with the 2004
ccd driver card. While one system will be used for the BCAM development,
the second system will be used for CSM software development and also for
testing Linux with the VME hardware.

8\) 2 bases have been constructed for the BCAM test station. They allow
for alignment of the BCAM ccd and a small block with 3 - 1mm holes for
LED\'s. Used the current generation of CCD driver to implement a test
station. The original software developed here and at CERN works fine.
Also tested with the DIM software under development by Joe Rothberg.

9\) Started to convert the LabWindows/CVI software developed by the CSM
people (J. Chapman, et al) to work on our embedded VME system. Need to
convert the NI-VXI calls to EPConnect calls. This looks feasible.

10\) Have a student now working on database entries for the Chamber
assembly data. He is looking at both the real time data, and the data
previously taken. He estimates middle to late May for having data into
the database.

11\) Joe Rothberg chaired a session on controls read out at the H8
workshop held at CERN in early April. He also presented a talk entitled
\"Control Systems and Read Out of Alignment Devices for H8.

12\) Rothberg continues his work on the controls read out using PVASS by
utilizing the DIM connectivity protocol. DIM is a Linux based
alternative to Microsoft OPC.

**1.5.11 CSC Electronics**

**1.5.11.1 ASM1 Boards**

**1.5.11.1.1 Design**

  ---------------------------- -------------- ---------------- -------------- -----------------
  **Milestone**                **Baseline**   **Previous**     **Forecast**   **Status**

  Preamp/Shaper Final Design   2-Oct-01       2-Oct-01         1-Dec-01       Delayed (See #1)
  Review                                                                      

  System Critical Design       2-Oct-01       2-Oct-01         1-Dec-01       Delayed (See #2)
  Review                                                                      
  ---------------------------- -------------- ---------------- -------------- -----------------

**Note #1-2**  Delayed to allow us to verify design modifications to
preamp/shaper for yield enhancement, reduced crosstalk, and improved
overload recovery.

**Paul O\'Connor (BNL)**

Work continued on modifying the IC50 preamp/shaper design for improved
yield, reduced input impedance, faster overload recovery, and reduced
baseline dispersion. Chip layout 70% done. We changed the chip from a
12 + 4 channel configuration (active + reference) to 24 + 1 to save
layout area. ASM 1 board prototype and rigid-flex cable in fabrication
in house.

**1.5.11.2 ASM II Board**

**1.5.11.2.1 ASM II Board design** **Paul O\'Connor (BNL)**

ASM-2b 192-channel prototype board design in progress. Schematics will
be completed in mid June, then go to layout. Concept for ASIC MUX will
be tested by using small FPGA on ASM-2b. Summer student to start on June
3, will be assigned to help with digital section of ASM.

**1.5.11.3 Low Voltage power, Cooling and Cabling**

**1.5.11.3.1 Design, Identification and Specification** **Paul O\'Connor
(BNL)**

Going for quote on cooling design. Recalculated power and cabling
requirements based on 25 + 12 m cable run from power supplies on UX15
floor, assumed regulator dropout.

**1.5.11.4 Sparsifiers**

**1.5.11.4.1 Sparsifier Design**

  ----------------------- -------------- ---------------- -------------- --------------------
  **Milestone**           **Baseline**   **Previous**     **Forecast**   **Status**

  Sparsifier Prelim       2-Mar-01       15-Jun-01        30-May-01      Completed (See #1)
  Design Review                                                          
  ----------------------- -------------- ---------------- -------------- --------------------

**Note #1**  Held jointly with ROD PDR on 30-May-01.

**1.5.11.4.2 Sparsifier Prototype**

  ---------------------- -------------- ---------------- -------------- ------------------------
  **Milestone**          **Baseline**   **Previous**     **Forecast**   **Status**

  Sparsifier 1st Proto   1-Aug-01       \--              15-Jul-01      On Schedule (See #1)
  in Hand                                                               
  ---------------------- -------------- ---------------- -------------- ------------------------

**Note #1**  Generic processing unit prototype complete and tested.
Motherboard in layout.

**1.5.11.5 ROD\'s**

**1.5.11.5.1 ROD design**

  -------------------- -------------- ---------------- -------------- -------------------------
  **Milestone**        **Baseline**   **Previous**     **Forecast**   **Status**

  RODs Prelim Design   31-Oct-00      15-Jun-01        30-May-01      Completed (See #1)
  Review                                                              
  -------------------- -------------- ---------------- -------------- -------------------------

**Note #1**  Held jointly with Sparsifier PDR on 30-May-01.

**David Stoker (University of California Irvine)**

During May we continued coding of the SPU (Sparsifier Processing Unit) C
and assembly code. Verilog coding of the revised Clock Generation PLD\'s
was finished. We began layout of the ROD motherboard. Other work
centered on preparation for the ROD/Sparsifier PDR (preliminary design
review) which has held on May 30.

**1.5.11.5.2 ROD Prototype**

  ---------------------- -------------- ---------------- -------------- --------------------
  **Milestone**          **Baseline**   **Previous**     **Forecast**   **Status**

  RODs 1st Proto in Hand 2-Apr-01       \--              15-Jul-01      Delayed (See #1)
  ---------------------- -------------- ---------------- -------------- --------------------

**Note #1**  Generic processing unit prototype complete and tested.
Motherboard in layout.

**1.5.11.7 Software**

**1.5.11.7.1 Software design**

  ------------------------ -------------- ---------------- -------------- -------------------
  **Milestone**            **Baseline**   **Previous**     **Forecast**   **Status**

  S/W Conceptual Design    2-May-01       \--              15-Jul-01      Delayed (See #1)
  Review                                                                  
  ------------------------ -------------- ---------------- -------------- -------------------

**Note #1**  Development of code external to ROD and documentation not
ready for review.

**1.5.12 Global Alignment System** **Jim Bensinger (Brandeis
University)**

This month work has revolve around the following:

\(1\) Getting ready for the next round of chamber production. This
includes preparations for producing inplane and proximity mounting
pieces for next round of chamber production.

\(2\) The Big Wheel review. This included continuing work responding to
the 399 mm move and the new structural design of the wheels.

\(3\) Getting ready for H8. This includes preparation of layout drawing,
work on the phantom chambers, and detailed design of the Version 2 of
the DAQ and sensors.

\(4\) Responding to questions from Technical Coordination.

**1.5.12.1 Global Design**

**1.5.12.1.1 Alignment Bars**

  ------------------------- -------------- ---------------- -------------- ----------------
  **Milestone**             **Baseline**   **Previous**     **Forecast**   **Status**

  Alignment Bar Design      30-Mar-01      \--              30-Jun-01      Delayed (See #1)
  Complete                                                                 
  ------------------------- -------------- ---------------- -------------- ----------------

**Note #1**  Due to changes in the big and small wheel positions some of
the design work will have to be redone, resulting in several months
delay.

**Jim Bensinger (Brandeis University)**

All the sensors mounts for the H8 bars have at least preliminary
designs. This allows final calculations of the positions of the gimbal
mounts. Since the gimbals have to be at the effective \"Bessel Points\"
to within 1%, the exact positions of the mounts cannot be known until
the complete weight distribution on the bars is known. This has now been
established on the long bars. Specifications for the mounting holes have
been transmitted to CERN for modification of the H8 chamber supports.

**1.5.12.1.2 Proximity Monitors**

  --------------------------- -------------- ---------------- -------------- -----------------
  **Milestone**               **Baseline**   **Previous**     **Forecast**   **Status**

  Proximity Monitor Design    29-Sep-00      \--              7-Aug-01       Delayed (See #1)
  Complete                                                                   
  --------------------------- -------------- ---------------- -------------- -----------------

**Note #1**  Delays in H8 and new information from simulation have
pushed this item back.

**Jim Bensinger (Brandeis University)**

The Version 2 design of the sensors was completed. This is a novel
design where the readout header board was underneath the optical path
and small lens holders which can be positioned over the header. This
gives much greater flexibility using the same physical camera size. The
extrusions for this device and the mask mounts were ordered.

**1.5.12.1.3 Multi-Point System (BCAM)**

  ----------------------------------- -------------- ---------------- -------------- ------------
  **Milestone**                       **Baseline**   **Previous**     **Forecast**   **Status**

  Design Compete for H8 version of    31-Jan-01      1-Jun-01         31-May-01      Completed
  the BCAM                                                                           
  ----------------------------------- -------------- ---------------- -------------- ------------

**Jim Bensinger (Brandeis University)**

The testing of the prototype of Version 2 of the BCAM has been
completed. All of the operational features of the BCAM were at or better
than expectations and the performance was definitely better the previous
version. Some simplifications of the design for manufacturing have been
made and the shop drawings detailed. This is now ready to go the shop
for H8 production.

The BCAMs that were exposed at the Saclay radiation test facility were
returned to Brandeis and tested. The BCAMs received sixty times the
ATLAS dose of ionizing radiation and suffered no degradation in
performance. A report was written and can be found at

http://www.hep.brandeis.edu/alignment/temporary/ionizing.pdf on the
Brandeis server.

**1.5.12.1.4 System Design** **Jim Bensinger (Brandeis University)**

The 399-mm move of the MDT big wheel and the new design of all the big
wheels have made major changes in the layout of the location of the
polar and proximity monitors necessary. Moving sensors to accommodate
these changes has caused several collisions either with physical objects
or with lines of sight that have to be kept clear. This was compounded
by the problem of translating files from yet another CAD system (the big
wheel design was done in MD5). This work was much more extensive than we
anticipated and will not be completed for at least another month. We are
preparing a list of changes requested in the design of the Big Wheel for
our CERN colleagues. Our preliminary conclusions were presented at the
Big Wheel Preliminary Design Review at CERN on May 14 and private
discussions for a few days following the review.

**1.5.12.1.5 DAQ**

  ------------------------------- -------------- ---------------- -------------- -------------
  **Milestone**                   **Baseline**   **Previous**     **Forecast**   **Status**

  Complete design of H8 alignment 1-Apr-01       1-Jun-01         30-Jun-01      Delayed (See
  DAQ hardware.                                                                  #1)

  DAQ Design Complete             28-Sep-01      \--              28-Sep-01      On Schedule
  ------------------------------- -------------- ---------------- -------------- -------------

**Note #1**  Responding to the moves of the Big and Small wheel has
drained resources needed to complete this job.

**Jim Bensinger (Brandeis University)**

The design of the Version 2 of the DAQ system was completed. A device
driver and some headers were sent to the Seattle group for beta testing
and they are now fully operational at the University of Washington. This
system will be used in H8.

At Brandeis we have built and tested 14 inplane sensor heads, 14 inplane
mask heads, and 4 device drivers. This is for distribution of the first
set of kits for the inplane system for the second round of MDT chamber
construction.

**1.5.12.2 Operational Test Stands**

**1.5.12.2.3 H8 DATCHA**

  ---------------- -------------- ---------------- -------------- ---------------------
  **Milestone**    **Baseline**   **Previous**     **Forecast**   **Status**

  H8 Operational   24-Nov-00      \--              30-Jul-01      Delayed (See #1)
  ---------------- -------------- ---------------- -------------- ---------------------

**Note #1**  The assembly of support structures and frames at CERN has
been slower than expected. We now expect that this will be completed by
the end of June 2001. Mounting of alignment devices can only begin when
the structural work is complete.

**Jim Bensinger (Brandeis University)**

All the sensors mounts for the H8 bars have at least preliminary
designs. This allows final calculations of the positions of the gimbal
mounts. Since the gimbals have to be at the effective \"Bessel Points\"
to within 1%, the exact positions of the mounts cannot be known until
the complete weight distribution on the bars is known. This has now been
established on the long bars. Specifications for the mounting holes have
been transmitted to CERN for modification of the H8 chamber supports.

The testing of the prototype of Version 2 of the BCAM has been
completed. All of the operational features of the BCAM were at or better
than expectations and the performance was definitely better the previous
version. Some simplifications of the design for manufacturing have been
made and the shop drawings detailed. This is now ready to go the shop
for H8 production.

The design of the Version 2 of the DAQ system was completed. A device
driver and some headers were sent to the Seattle group for beta testing
and they are now fully operational at the University of Washington. This
system will be used in H8.

**1.5.12.3 Global System Production**

  --------------------------- -------------- ---------------- -------------- ----------------
  **Milestone**               **Baseline**   **Previous**     **Forecast**   **Status**

  Align Bar/Prox Monitors PRR 3-Jan-01       \--              31-Oct-01      Delayed (See #1)

  Critical System Design      3-Jan-01       \--              31-Aug-01      Delayed (See #2)
  Review                                                                     
  --------------------------- -------------- ---------------- -------------- ----------------

**Note #1-2**  Delayed due to delays in the construction of H8.

**Jim Bensinger (Brandeis University)**

The only part of system production that has begun is the part relating
to the production of MDT chambers, the inplane system and the camera
mounts and mask mounts for the proximity monitors that go on the
chambers.

**1.5.12.3.1 Alinment Bars**

  ------------------------- -------------- ---------------- -------------- ----------------
  **Milestone**             **Baseline**   **Previous**     **Forecast**   **Status**

  Bar Production 10%        1-Oct-01       \--              1-Oct-01       On Schedule
  Complete                                                                 
  ------------------------- -------------- ---------------- -------------- ----------------

**1.5.12.3.2 Proximity Monitors** **Jim Bensinger (Brandeis
University)**

All proximity mount components (cameras and mask) needed for the first
round of production of MDT chambers have been delivered to the US
production sites and Protvino.

**1.5.12.4 MDT Inplane Monitors**

**1.5.12.4.1 Common Items** **Jim Bensinger (Brandeis University)**

Almost all of the common parts for the approved MDT chamber production
now exists at Brandeis.

**1.5.12.4.2 EIL1 (Boston)** **Jim Bensinger (Brandeis University)**

The complete set of kits for the first round of production has been
delivered to the production site.

**1.5.12.4.5 EIS1 (Boston)**

  --------------- -------------- ---------------- -------------- --------------------
  **Milestone**   **Baseline**   **Previous**     **Forecast**   **Status**

  Ship to Site    16-Feb-01      1-Jun-01         15-Jun-01      Delayed (See #1)
  --------------- -------------- ---------------- -------------- --------------------

**Note #1**  The latest MDT production schedule has shifted the delivery
date of the inplane system to Jun 1, 2001. Delays in shop schedules has
delayed this item about 2 weeks.

**Jim Bensinger (Brandeis University)**

The parts for the EIS1 have been received from Michigan. Because of
confusion about the drawings some modifications had to be made at
Brandeis. These modifications are in process. The first kit will be
distributed to the BMC chamber production facility when modifications
are complete.

**1.5.12.4.6 EIS2 (Boston)**

  --------------- -------------- ---------------- -------------- -------------------------
  **Milestone**   **Baseline**   **Previous**     **Forecast**   **Status**

  Ship to Site    23-Oct-01      \--              23-Oct-01      On Schedule
  --------------- -------------- ---------------- -------------- -------------------------

**1.5.12.4.12 EML2 (Seattle)** **Jim Bensinger (Brandeis University)**

The complete set of kits for the first round of production has been
delivered to the production site.

**1.5.12.4.17 EMS2 (Seattle)**

  --------------- -------------- ---------------- -------------- -------------------
  **Milestone**   **Baseline**   **Previous**     **Forecast**   **Status**

  Ship to Site    23-Jan-01      1-Jun-01         15-Jun-01      Delayed (See #1)
  --------------- -------------- ---------------- -------------- -------------------

**Note #1**  The latest MDT production schedule has shifted the delivery
date of the inplane system to Jun 1, 2001. Delays in shop schedules has
delayed this item about 2 weeks.

**Jim Bensinger (Brandeis University)**

Drawings for the central mask lens mounts and the mask mounts have been
sent to Michigan for manufacture. All other mechanical components are in
hand.

**1.5.12.4.18 EMS3 (Seattle)**

  --------------- -------------- ---------------- -------------- --------------------
  **Milestone**   **Baseline**   **Previous**     **Forecast**   **Status**

  Ship to Site    7-Sep-01       \--              1-Apr-02       Delayed (See #1)
  --------------- -------------- ---------------- -------------- --------------------

**Note #1**  This chamber is not scheduled to be built until the third
round of MDT production.

**1.5.12.4.20 EMS5 (Michigan)** **Jim Bensinger (Brandeis University)**

The complete set of kits for the first round of production has been
delivered to the production site.

The correct name for this WBS item is EMS5 (Michigan)

**1.6 TRIGGER**

**Milestones with changed forecast dates:**

  ---------------------------- -------------- ---------------- -------------- --------------
  **Milestone**                **Baseline**   **Previous**     **Forecast**   **Status**

  LVL2 Trigger Prototype       30-Sep-01      \--              30-Sep-01      On Schedule
  Complete                                                                    
  ---------------------------- -------------- ---------------- -------------- --------------

**1.6.1 LVL2 SRB**

**1.6.1.2 SRB Protos**

**1.6.1.2.1 SRB Protos EDIA** **Robert Blair (Argonne National Lab.)**

The 9U prototype RoI Builder is progressing. The general layout of the
system was described in last month\'s report. A requirements document
has been circulated for discussion in the group.

**1.6.1.2.4 SRB Prototype Travel**

  ------------------------ -------------- ---------------- -------------- ------------------
  **Milestone**            **Baseline**   **Previous**     **Forecast**   **Status**

  Calo for Integ Study     30-Sep-01      \--              30-Sep-01      On Schedule
  Compl                                                                   

  Prototype SRB Assy Compl 30-Sep-01      \--              30-Sep-01      On Schedule
  ------------------------ -------------- ---------------- -------------- ------------------

**1.6.2 LVL2 Calorimeter Trg**

**1.6.2.2 Calo Protos**

  ---------------------- -------------- ---------------- -------------- ----------------
  **Milestone**          **Baseline**   **Previous**     **Forecast**   **Status**

  Prototype Calo PDR     31-Mar-01      \--              31-Jul-01      Delayed (See #1)

  Prototype Calo Assy    30-Sep-01      \--              30-Sep-01      On Schedule
  Compl                                                                 
  ---------------------- -------------- ---------------- -------------- ----------------

**Note #1**  This PDR as several others has been delayed to conform to
the initial review of the Phase 2a prototype. This aligns it with the
Atlas wide milestones presented to the LHCC in March.

**1.6.3 LVL2 SCT Trg**

**1.6.3.1 SCT Design**

**1.6.3.1.1 SCT Design EDIA** **Haimo G. Zobernig (University Of
Wisconsin)**

The work in May focused on finishing the Performance Evaluation of the
Reference Software. Since the Phase 1 Integration Prototype did not
attempt to evaluate the performance of any of its components, but just
the functionality, a separate performance evaluation of the Reference
Software only was undertaken by members of the CERN, RAL and Wisconsin
groups. This consisted in carefully attempting to understand the
behavior of the Reference Software. To this end, the software was run
under well-specified run parameters on small testbeds of 3-6 PC nodes.
Three different and complementary tools were used to characterize the
behavior of the software. One was a profiling package, called TAU, from
LANL (see http://www.acl.lanl.gov/tau). It allowed us to do timing
profiles of the multithreaded, dynamically-linked Reference Software at
the function/method level. This was used to understand where time is
spent in the current implementation and to discover any unexpectedly
large time consumers. The use of TAU involved a considerable amount of
work to adapt the TAU tool to the Reference Software\'s environment, and
necessitated changes to the RefSW source code because TAU uses a C++
compiler front end (EDG), which is not fully compatible with the
compiler used in the Reference Software, g++.

The second tool used was NetLogger from LBL
(http://www-didc.lbl.gov/NetLogger). Using NetLogger, we could measure
and correlate specific times spent within, and in particular also across
applications i.e. inter-node measurements.

Finally, some built-in features of the Reference Software were used to
gather timing histograms within each application, with particularly low
measurement overheads. The results from using these tools have enabled
us to gain a good understanding of the behavior of the Reference
Software. They will be presented at the RT2001 Conference in Valencia,
Spain, in early June 2001 and have also been submitted there as a
contributed paper. This is currently available as

http://bogaerts.home.cern.ch/bogaerts/Hlt/RT2001/rt2001_v8.pdf.

**Saul Gonzalez (University Of Wisconsin)**

The implementation of the common classes (developed by W. Wiedenmann)
will wait until the new HLT software design is finalized. Discussions
with the ATLAS offline group - and in particular with the Architecture
team - are continuing.

**Andrew Lankford (University Of Calif. At Irvine)**

Recent UCI activities continued to focus on the interface between TDAQ
and front-end electronics. Study of alternative implementations of the
ROD/ROB interface continued. A conceptual design was developed for a
ROBin (the input and buffering component of the Readout Subsystem (ROS))
that can be mounted directly on each ROD, thus replacing the Readout
Link with a standard network connection. This ROBin would be used in a
network-based ROS, rather than a VME or PCI bus-based ROS. System issues
of such a ROS implementation need further study. Possible Readout Link
implementations were discussed with the LArg ROD architecture task
force. Issues are bandwidth and cost. These investigations and
discussions will continue in June.

**1.6.3.1.4 SCT Design Travel**

  ------------------------ -------------- ---------------- -------------- -----------------
  **Milestone**            **Baseline**   **Previous**     **Forecast**   **Status**

  SCT for Integ Study      30-Sep-01      \--              30-Sep-01      On Schedule
  Compl                                                                   
  ------------------------ -------------- ---------------- -------------- -----------------

**1.6.3.2 SCT Protos**

  ---------------------- -------------- ---------------- -------------- ------------------
  **Milestone**          **Baseline**   **Previous**     **Forecast**   **Status**

  Prototype SCT PDR      31-Mar-01      \--              31-Jul-01      Delayed (See #1)

  Prototype SCT Assy     30-Sep-01      \--              30-Sep-01      On Schedule
  Compl                                                                 
  ---------------------- -------------- ---------------- -------------- ------------------

**Note #1**  This PDR as several others has been delayed to conform to
the initial review of the Phase 2a prototype. This aligns it with the
Atlas wide milestones presented to the LHCC in March.

**1.6.4 Architecture & LVL2 Global Trigger**

**1.6.4.1 Arch. Design**

  ------------------ -------------- ---------------- -------------- ----------------------
  **Milestone**      **Baseline**   **Previous**     **Forecast**   **Status**

  Prototype Project  31-Mar-01      \--              31-Jul-01      Delayed (See #1)
  PDR                                                               
  ------------------ -------------- ---------------- -------------- ----------------------

**Note #1**  This PDR as several others has been delayed to conform to
the initial review of the Phase 2a prototype. This aligns it with the
Atlas wide milestones presented to the LHCC in March.

**1.6.4.1.1 Arch. Design EDIA** **Robert Blair (Argonne National Lab.)**

Runs on the Argonne 256 node cluster were performed for various size
systems. The stability of the jobs (whether they correctly run to
completion and/or report results) is not good. Further work is being
done to improve this. The results appear to show unusual behavior as the
system size rises. This too is being investigated. It may be necessary
to significantly revamp the control software to properly use this large
cluster.

**Maris Abolins (Michigan State University)**

Maris Abolins continued his work with Jos Vermeulen et al. on simulation
studies of the trigger/daq system using the \"paper model\" approach. A
new intermediate trigger menu was added and updates made to link speeds
and processor performance to reflect current realities.

Abolins also served on a committee, chaired by Klaus Pretzl of Bern, to
set up guidelines for a \"speaker's committee\". This work has been
completed and the document will go before the Institutional Board for
vote during the T/DAQ workshop in July.

Reiner Hauser's activities include the following:

1\. On the DataCollection software side a simple package was created
which allows to use a precompiled installation of the OnlineSW as an
\'external package\'.

2\. A first implementation of the configuration database interface using
OKS was written and made available in CVS.

3\. A first version of the message passing design document was written
and made available on the web.

4\. Various discussions on other aspects of data collection took place,
most notably the message flow inside the system and possible alterations
to the currently accepted \"baseline\" protocol.

Yuri Ermoline has been asked to contribute to the technical coordination
efforts within TDAQ, namely to the ROD coordination in the DIG. This
important task involves coordination between ROD designers and external
systems like TTC, readout links, etc. LVL2 RODs are included in the
scope of that activity.

**Andrew Lankford (University Of Calif. At Irvine)**

Work resumed with the TDAQ system leaders on project planning for the
development and prototyping period preceding the HLT/DAQ/DCS TDR. Steps
were taken to address some of the global ATLAS manpower shortfalls in
the area of the Data Collection Subsystem. As mentioned in the March
report, this subsystem requires a considerable amount of new design work
in order to facilitate an appropriate degree of integration of LVL2, EF,
and DAQ data flow functionality. Some software issues at the interface
of TDAQ with detectors (e.g. data format) and at the interface with
Computing (e.g. Event Filter dependencies on offline code) were
investigated.

**1.6.4.1.3 Arch. Design M&S** **Robert Blair (Argonne National Lab.)**

TTC receiver boards were sent for fabrication. When the boards were
finished a problem was discovered that requires them to be redone. This
still allows time for them to be done prior to the July TDAQ workshop.
This would be the first opportunity to use them. They are not critical
path items since the previous generation can still be used to
synchronize DAQ and Level 2.

**1.6.4.1.4 Arch. Design Travel**

  --------------------------- -------------- ---------------- -------------- ---------------
  **Milestone**               **Baseline**   **Previous**     **Forecast**   **Status**

  Arch Design for Integ Study 30-Sep-01      \--              30-Sep-01      On Schedule
  Compl                                                                      

  Prototype Project Assy      30-Sep-01      \--              30-Sep-01      On Schedule
  Compl                                                                      
  --------------------------- -------------- ---------------- -------------- ---------------

**1.6.4.2 Global Production**

**1.6.4.2.1 Global Prod Eqmt** **Saul Gonzalez (University Of
Wisconsin)**

A second meeting of the \"Athena suitability task force\" was held (led
by S.Gonzalez) in May 21st. As identified in the previous meeting, one
of the central tasks is the benchmarking of Athena. This benchmarking
includes Athena services in order to ensure that there are no
\'show-stoppers\' in the Athena architecture. During the meeting, Werner
Wiedenmann presented some recent results in benchmarking Athena with
TAU. He repeated earlier studies performed on StoreGate, which initially
gave unacceptable long latencies for registering/retrieving objects from
the transient store. Werner found that the initial studies were flawed
and that the StoreGate performance was better than initially thought. An
agenda (including slides) of this meeting can be found at
<http://www-wisconsin.cern.ch/~atsaul/HLTAthena> Another ongoing effort
is in HLT software design. A second cycle of design was recently
finished after the review of the HLT SW requirements document and a
first cycle. The focus now is in writing a first draft of the Software
Design Document.