***NASA Electronic Parts and Packaging (NEPP) Program***

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***Information Management and Dissemination (IMD) Project***

***Hybrid Supplier Survey and Assessment***

***Checklist***

**NASA**

***NASA Electronic Parts Project (EPAR)***

***Code 562***

***Goddard Space Flight Center***

***Greenbelt, MD 20771***

***HYBRID SUPPLIER SURVEY AND ASSESSMENT***

***CHECKLIST***

**Date:**

**Company Name:**

**Address:**

**CAGE Code:**

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  **Technical Assessment Team:**

  1\.

  2\.

  3\.

  4\.

  5\.

  6\.

  7\.
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***HYBRID SUPPLIER SURVEY/ASSESSMENT***

***CHECKLIST***

  ------------ ------------------------------- --------------------------------------
  **Number**   **I. Quality Management Plan**  **Comments**

  **1**        **QML Status**                  

                Class K                       
               Since\_\_\_\_\_\_\_\_\_\_\_\_   

               **** Class H                   
               Since\_\_\_\_\_\_\_\_\_\_\_\_   

               **** Non-Compliant using QML   
               line                            

                                               

  **2**        **Certification** **** 38534   

               **** 38535                     

               **** ISO9001                   

                                               

  **3**        **Device Specifications** **** 
               SCDs                            

               **** SMDs                      

                                               

  **4**        **TRB Program**                 

               **** Complies with 38534,      
               Appendix A requirements         

               **** Has adopted optional plan 
               that allows modification of     
               generic flow, fabrication,      
               design, testing, and inspection 

  **5**        **Performs Element Evaluation   
               per** **** Class K             

               **** Class H                   

                                               
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***HYBRID SUPPLIER SURVEY/ASSESSMENT***

***CHECKLIST***

  ------------ ----------------------------------------- --------------------------------------
  **Number**   **I. Quality Management Plan (Cont.)**    **Comments**

  **6.**       **Last DSCC                               
               Audit**\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_   

                                                         

  **7**        **Quality System Review** **** QA Manual 

               **** Training of Personnel               

               **** Training Frequency                  

                                                         

  **8**        **Training Evaluation** **** On-line     

               **** Off-line                            

                                                         

  **9**        **Statistical Process Control (SPC)       
               Verification**                            

               **** Fabrication                         

               **** Assembly                            

               **** Test                                

                                                         
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***HYBRID SUPPLIER SURVEY/ASSESSMENT***

***CHECKLIST***

  ------------ ------------------------------- ----------------------------------
  **Number**   **II. Design and Documentation  **Comments**
               Control**                       

  **1**        **Design Process**              

               **** Design                    
               Rules/Procedures/Verification   

               **** Conversion of Customer    
               requirements                    

               **** Design of Experiments     

               **** Derating Rules            

               **** Thermal                   
               Analysis/Verification           

               **** Radiation Test            

               **** Design Qualification      

               **** Life Test                 

                                               

  **2**        **Document Control**            

               **** Design Software           

               **** Detailed Assembly         
               Procedures                      

               **** Detailed Test Procedures  

               **** Change Control (process,  
               assembly, test)                 

               **** Traveler                  

               **** Data Retention            

               **** Retention of Test Samples 

               **** Retention of Qual./Test   
               Samples                         

                                               

                                               
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***HYBRID SUPPLIER SURVEY/ASSESSMENT***

***CHECKLIST***

  ------------ --------------------------- --------------------------------------
  **Number**   **III. Materials**          **Comments**

  **1**        **Incoming Inspection**     
               **** Visual (sample or 100 
               %)                          

               **** Sample Electrical     

               **** C-of-C Only           

               **** Element Evaluation    
               (Performed In-house)        

               **Ο** Per Class K Flow      

               **Ο** Per Class H Flow      

               **** Element Evaluation    
               (Performed by Supplier)     

               **** Per Class K Flow      

               **** Per Class H Flow      

               **** Element Evaluation    
               Test Data Available?        

                                           

  **2**        **Procurement ** Item      
               Drawing used                

               **** Specification used    

               **** Customer Approved     

                                           

  **3**        **Approved Suppliers**      

               **** Approved List of      
               Suppliers                   

               **** Rating System in      
               Place                       

               **** Ship-to-Stock         

               **** Sole Source           

                                           
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***HYBRID SUPPLIER SURVEY/ASSESSMENT***

***CHECKLIST***

  ------------ -------------------------- --------------------------------------
  **Number**   **IV. Processes**          **Comments**

  **1**        **Substrate Fabrication**  

               **** Fabricated In-house  

               **** Procured from        
               outside supplier           

               **Ο** Specification used:  
               **Ο** Mil spec             

               **Ο** Vendor spec          

               **** Thick Film process   

               **** Thin Film process    

               **** Oven firing          
               profile/data               

               **** Set-up for Single    
               layer printing             

               **** Multi-layer printing 

               **** Co-fired             

               **** Pre emulsified       
               screen                     

               **** Resistors printed    

               **** Laser-trim           
               operations                 

               **Ο** Abrasive trim        

               **Ο** Static trim          

               **Ο** Dynamic trim         

               **** 2 or 4 point probe   
               resistance                 
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***HYBRID SUPPLIER SURVEY/ASSESSMENT***

***CHECKLIST***

  ------------ -------------------------- --------------------------------------
  **Number**   **IV. Processes (Cont.)**  **Comments**

               **** Termination type     

               **** Dielectric layers    

               **** Capacitors printed   

               **** Capacitors stacked   

               **Ο** Stacking performed   
               In-house                   

               **Ο** Stacking done by     
               supplier                   

               **** In-process monitor   

               **** Substrate            
               qualification              

               **Ο** Specification used   

               **Ο** Mil Spec             

               **Ο** Vendor Spec          

               **** Rework Requirements  

                                          

  **2**        **Substrate-to Header      
               Attach**                   

               **** Solder type          

               **** Epoxy type           

               **** Attach flow          

               **** Heat spreader (e.g.  
               moly tabs, etc.)           

               **** Process Controls     
  ------------ -------------------------- --------------------------------------

***HYBRID SUPPLIER SURVEY/ASSESSMENT***

***CHECKLIST***

  ------------ -------------------------- --------------------------------------
  **Number**   **IV. Processes (Cont.)**  **Comments**

  **3**        **Die Attach - (Epoxy)**   

               **** Die metallization    

               **** Epoxy (883 Method    
               5011) qualified            

               **** Epoxy control        

               **** Epoxy cure           Note temperature

               **** Epoxy shelf life     

               **** Die attach rework    Note temperature
               requirements               

               **** Cleaning flow method Inspection/verification

                                          

  **4**        **Die Attach - (Solder)**  

               **** Solder type          

               **** Flux type            

               **** Solder temperature   

               **** Solder joint         
               inspect.                   

               **** Cleaning flow        

               **** Attach Voiding/X-ray 

                                          
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***HYBRID SUPPLIER SURVEY/ASSESSMENT***

***CHECKLIST***

  ------------ --------------------------- --------------------------------------
  **Number**   **IV. Processes (Cont.)**   **Comments**

  **5**        **Die Attach - (Eutectic)** 

               **** Base plate            
               temperature                 

               **** Base plate            
               temperature joint           
               inspection                  

                                           

  **6**        **Magnetic Element Attach** 

               **** Transformer/Inductor  
               attached to header          

               **** Adhesive for bottom   
               attach                      

               **** Adhesive used on      
               inside top cover            

               **** Meets out-gassing     
               requirements                

               **** Wire routing/Staking  

               **** Magnet wire           
               stripping - abrasive        

               **** Magnet wire           
               stripping - chemical        

               **** Magnet wire attach -  
               hand solder                 

               **** Cleaning Procedure    

               **** Magnet wire attach -  
               reflow                      

               **** Type of Solder used   

               **** Reflow temperature    

                                           
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***HYBRID SUPPLIER SURVEY/ASSESSMENT***

***CHECKLIST***

  ------------ ----------- --------------------------- --------------------------------------
  **Number**   **IV.                                   **Comments**
               Processes                               
               (Cont.)**                               

  **7**                    **Element Attachment        
                           Verification**              

                           **** Meets 38534 constant  
                           acceleration req.           

                           **** Mechanical shock test 

                           **** Thermal shock test    

                                                       

  **8**                    **Stacked Component         
                           Attachment**                

                           **** Capacitor stacking on 
                           frame                       

                           **** Capacitor attached    
                           directly to substrate       

                                                       

  **9**                    **Wire Bonding**            

                           **** Automatic bonding     
                           machines                    

                           **** Wire material and     
                           sizes used                  

                           **** Thermosonic bonding   

                           **** Thermocompression     
                           bonding                     

                           **** Ribbon bonding        

                           **** Destructive wire pull 
                           test                        

                           **** Non-destructive wire  
                           pull test                   

                           **** Generates Test Coupon 

                           **** Performs ball shear   
                           test                        
  ------------ ----------- --------------------------- --------------------------------------

***HYBRID SUPPLIER SURVEY/ASSESSMENT***

***CHECKLIST***

  ------------ --------------------------- --------------------------------------
  **Number**   **IV. Processes (Cont.)**   **Comments**

               **** Performs die shear    
               test                        

               **** Rework procedures     

               **** SPC Charts            

                                           

  **10**       **Cleaning**                

               **** Prior to die bonding  

               **** Prior to wire bonding 

               **** After soldering       
               operations                  

               **** Cleaning procedures   

               **** UV ozone, plasma      
               cleaning - type             

               **** Inspection after      
               cleaning                    

               **** Aqueous based         
               material                    

               **** Baked-out after       
               cleaning                    

                                           

  **11**       **Package Sealing**         

               **** Ceramic, metal,       
               plastic                     

               **** Pre-seal vacuum       
               bake - time, temp.          

               **** RGA analysis          

               **** Sealing environment   
               Ni/He                       
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***HYBRID SUPPLIER SURVEY/ASSESSMENT***

***CHECKLIST***

  ------------ ----------------- -------------------------- --------------------------------------
  **Number**                     **IV. Processes (Cont.)**  **Comments**

               **** Dew point                              
               monitor setting                              

               **** Resistance                             
               weld                                         

               **** Parallel                               
               seam weld                                    

               **** Leak                                   
               testing                                      

               **Ο** Fine                                   

               **Ο** Gross                                  

               **** Package                                
               rework                                       

               **** Header and                             
               lid material                                 

               **** Plating                                

               **Ο** Performed                              
               In-house                                     

               **Ο** Performed                              
               outside                                      

               **Ο** Plating                                
               Material                                     

  **12**       **Package                                    
               Material**                                   

               **** Ceramic,                               
               metal, or plastic                            

               ****                                        
               Glass-to-metal                               
               seal                                         

               **** Getter                                 
               material used                                

               **Ο** 883 Method                             
               5011 qualified                               

               **Ο** Package                                
               with 5011                                    
               qualified                                    

               **** Package                                
               evaluation/test                              
  ------------ ----------------- -------------------------- --------------------------------------

***HYBRID SUPPLIER SURVEY/ASSESSMENT***

***CHECKLIST***

  ------------ -------------------------- --------------------------------------
  **Number**   **IV. Processes (Cont.)**  **Comments**

  **13**       **Clean Room**             

               **** Class 100K, 10K, 1K, 
               100, 10                    

               **** Particulate          
               monitor/count              

               **** Laminar-flow work    
               stations                   

               **** Storage of unsealed  
               hybrids                    

               **** Nitrogen cabinets    
               storage                    

                                          

  **14**       **ESD Control**            

               **** Work station         
               grounding                  

               **** Wrist strap material 

               **** Humidity control     

               **** Solder irons, wire   
               bonder grounding           

                                          

  **15**       **Training**               

               **** Operator Training    
               schedule                   

               **** Training records     

                                          

  **16**       **Failure Analysis**       

               **** Design-of-experiment 
               setup                      

               **** Test lab             
               sophistication             
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***HYBRID SUPPLIER SURVEY/ASSESSMENT***

***CHECKLIST***

  ------------ -------------------------- --------------------------------------
  **Number**   **V. Testing**             **Comments**

  **1**        **Incoming inspection**    

               **** Material accepted    
               based on C-of-C            

               **** Level of testing     
               performed at receiving     

               **** Segregation/Storage  
               of Class K, H lots         

               **** Issue procedure      
               **-** kit or bulk          

               **** Traceability of      
               material issued            

               **** Epoxy shelf life     
               control                    

                                          

  **2**        **Element Evaluation       
               Testing**                  

               **** Performed in-house   

               **** Performed by         
               supplier                   

               **** Test samples stored  
               at supplier                

               **** Test data package    
               requested                  

                                          

  **3**        **Screening**              

               **** Screening flow per   Note Deviations:
               MIL-PRF-38534              

               **** Additional screening List Tests:
               imposed                    

               **** Screening            
               fall-out/lot acceptance    
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***HYBRID SUPPLIER SURVEY/ASSESSMENT***

***CHECKLIST***

  ------------ -------------------------- --------------------------------------
  **Number**   **V. Testing (Cont.)**     **Comments**

               **** Burn-in test bias    
               and temperature            

               **Ο** Static burn-in       

               **Ο** Dynamic burn-in      

               **** QCI (In-line or      
               End-of-Line?)              

               **** Tests performed by   List Tests:
               outside vendors            

               **** Resolution of        
               conflict with test data    

               **** Hermeticity testing  
               after solder dip?          

               **** Group B Tests        

               **** Life test set-up     
               verification               

               **** FA lab capabilities  

                                          

  **4**        **Metrology**              

               **** Calibration methods  

               **** Calibration          
               records/recall system      

               **** Performed in-house?  

                                          
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***HYBRID SUPPLIER SURVEY/ASSESSMENT***

***CHECKLIST***

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  ***[General Assessment]{.underline}***

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