![](media/image1.wmf){width="0.8576388888888888in"
height="0.7756944444444445in"} **Fermi National Accelerator Laboratory**

**Batavia, IL 60510**

![](media/image2.emf)

**[SPECIFICATIONS\
for]{.underline}**

**[Endcap Muon Cathode Strip Chamber]{.underline}**

**[Wire Fixation Bar Gold Plating]{.underline}**

**[5520-ES-368057]{.underline}**

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  ---------------------------- ------------------------ ----------------------------------------- -------------------------------
  **[Revision]{.underline}**   **[Date]{.underline}**   **[Description]{.underline}**             **[Approval(s)]{.underline}**

  0                            8/24/99                  Initial Engineering Release ER \# 6597    See Above

  A                            4/14/00                  Added IPC specs., min plating thickness,  N. Chester
                                                        and "voids". ECO#4945                     

                                                                                                  

                                                                                                  

                                                                                                  

                                                                                                  

                                                                                                  

                                                                                                  

                                                                                                  
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**1.0 [General:]{.underline}**

This specification defines the requirements for the gold plating of
copper coated FR4 strips having 1/0 copper cladding on one face, to be
used as CMS Endcap Muon Cathode Strip Chamber Wire Fixation Boards.

**2.0 [Finish:]{.underline}**

1.  Laminated thermosetting material, Grade FR4 consisting of continuous
    filament glass, copper coated on one side, in conformance with
    Fermilab Specification ES-368050.

2.  The copper is to coated with nickel\* and gold by electroplating
    (electrolytic) or chemical deposition (electroless) according to the
    following as applicable:

> ANSI/ASTM B 488-71, MIL-STD-275, MIL F-55561, IPC-4101, IPC-6010
> series, and ANSI/IPC-D-275.
>
> 2.2.1 Nickel coat the cleaned and etched designated copper surfaces
> with a minimum of 20 u in. of Nickel (Ni) followed by a minimum
> coating of 5 u in. of Gold (Au), 99.0% minimum purity.

2.  The nickel and gold coatings shall be of sufficient uniformity and
    thickness to impart the characteristic color of the electrolytic or
    chemical deposited metal. Each coating must completely cover the
    metal below it and be uniform in appearance, free from voids,
    blisters, cracks, or peeled areas.

3.  There shall be no traces of metal deposition in places where it is
    supposed to be removed or otherwise not supposed to exist.

**3.0 [Quality Assurance]{.underline}**

1.  Parts having plated surface imperfections or any other defects
    caused by the manufacturing process are to be rejected at the
    vendor. Fermilab reserves the right to visit the vendor and inspect
    the parts prior to shipment or make final assessment of the shipped
    parts as received and reject those that are found non-conforming to
    these specifications.

2.  The vendor is to suitably protect the parts, particularly the
    finished gold coated surfaces, against scratches, scrapes, and other
    physical damage during shipping and storage.

\* Palladium coating may be substituted for nickel plating.