## **Specifications for RFQ 1-025-RGB.1234**

## 

## Title: MEMS Actuator and Sensor Fabrication and Characterization

[Description]{.underline}: Design, Fabrication, and Characterization of
MEMS Silicon Beam Shear Stress Sensors and Piezoelectric MEMS Actuators

[Completion Date]{.underline}: Within 18 Weeks from the date of contract

## **Sensors**: MEMS Silicon Beam Shear Stress Sensors

[Quantity]{.underline}: Minimum of 20 units of each length (160 total
minimum)

[Specifications:]{.underline}

1.  Micro-machined silicon beams electrically insulated from the silicon
    substrate of 3mm x 5 mm. Sketches of the sensor and specifications
    are given in *Figures 1 and 2*, of MS PowerPoint File:
    "*Si-Beams-Diagrams.ppt*"

2.  Dimensions of the sensor beams are shown in the Table I

3.  The top surface of the silicon beam is in plane with the upper
    surface of the device

4.  Beam resistances are equal to or less than 10k Ohms, 1k Ohm
    preferred.

5.  Electrical isolation of the beams is achieved by etching the
    top-level silicon layer surrounding the beam from the Si-SiO~2~-Si
    or other substrate structure

6.  Electrical contact pads are 250 micron square

7.  The electrical contact pads of the beams are positioned as far away
    as possible from the beam

8.  Two (2) electrical contact pads for the top and bottom silicon
    substrate are required

9.  Characterization includes measurements of resistance values and
    average beam dimensions

# Table I

  ----------------------- ------- ------- ------- ------- ------- ------- ------- -------
  **Die Type**            1       2       3       4       5       6       7       8

                                                                                   

  **Length (micron)**     300     400     500     600     700     400     500     600

  **Width (micron)**      1       1       1       1       1       0.75    0.75    0.75

  **\~Thickness           0.186   0.186   0.186   0.186   0.186   0.186   0.186   0.186
  (micron)**                                                                      

  **Gap size (micron)**   1.072   1.226   1.553   2.146   3.123   1.402   1.983   3.037
  ----------------------- ------- ------- ------- ------- ------- ------- ------- -------

**Actuators**: Piezoelectric MEMS Actuators (PZT based)

[Quantity:]{.underline} Total: 66 Minimum

A.  Pattern A: Minimum 9 units per diaphragm thickness

B.  Pattern B: Minimum 3 units per diaphragm thickness

C.  Pattern C: Minimum 3 units per diaphragm thickness

D.  Pattern D: Minimum 3 units per diaphragm thickness

E.  Pattern E: Minimum 6 units per diaphragm thickness

F.  Pattern F: Minimum 9 units per diaphragm thickness

[Specifications:]{.underline}

1.  Four actuating diaphragm sizes are 1mm, 2mm, 2.83mm, and 4mm square
    for, diaphragms are rigidly fixed at the four edges

2.  Actuator displacements perpendicular to the diaphragm plane at 40
    Volts input are:

    a.  20 microns for 1mm square membrane

    b.  60 microns for 2 mm square membrane

    c.  100 microns for 2.83 mm square membrane

    d.  140 microns for 4mm square membrane

3.  Two (2) different diaphragm thickness are requested for each
    diaphragm size, they are 0.2 and 5 microns

4.  Sketches of the actuator dice patterns are shown in the attached MS
    PowerPoint file *"MEMS-Actuator-Diagrams.ppt*," which includes
    Pattern A through F

5.  Generalized characterizations of the actuation functions are
    required:

    a.  Displacements with respect to diaphragm thickness

    b.  Displacements with respect to applied voltages