+-----------+-----------------------------+---------------------------+
| ![](me    | NASA TECHNICAL STANDARD     | NASA-STD-8739.1A          |
| dia/image |                             |                           |
| 1.jpeg){w |                             |                           |
| idth="1.1 |                             |                           |
| 659722222 |                             |                           |
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| ght="0.88 |                             |                           |
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| 77777in"} |                             |                           |
+-----------+-----------------------------+---------------------------+
| National  |                             | Approved: 2008-03-04\     |
| Ae        |                             | Expiration Date:          |
| ronautics |                             | 2013-03-04                |
| and Space |                             |                           |
| Admini    |                             |                           |
| stration\ |                             |                           |
| Wa        |                             |                           |
| shington, |                             |                           |
| DC 20546  |                             |                           |
+-----------+-----------------------------+---------------------------+
|           |                             |                           |
+-----------+-----------------------------+---------------------------+
| WO        |                             |                           |
| RKMANSHIP |                             |                           |
| STANDARD  |                             |                           |
| FOR       |                             |                           |
| POLYMERIC |                             |                           |
| AP        |                             |                           |
| PLICATION |                             |                           |
| ON        |                             |                           |
| E         |                             |                           |
| LECTRONIC |                             |                           |
| A         |                             |                           |
| SSEMBLIES |                             |                           |
+-----------+-----------------------------+---------------------------+
| Me        |                             |                           |
| asurement |                             |                           |
| System    |                             |                           |
| Identi    |                             |                           |
| fication: |                             |                           |
|           |                             |                           |
| Metric    |                             |                           |
| (English) |                             |                           |
+-----------+-----------------------------+---------------------------+
| APPROVED  |                             |                           |
| FOR       |                             |                           |
| PUBLIC    |                             |                           |
| RELEASE   |                             |                           |
| --        |                             |                           |
| DIS       |                             |                           |
| TRIBUTION |                             |                           |
| IS        |                             |                           |
| UNLIMITED |                             |                           |
+-----------+-----------------------------+---------------------------+

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DOCUMENT HISTORY LOG

  --------------- ------------- ----------------- ----------------------------
  Status          Document      Approval Date     Description
                  Revision                        

  \-              Baseline      1999-08-06        Initial Release

  Update/Revise   Revision A    2008-03-04        Technical corrections and
                                                  addition of sections
                                                  covering bonding and
                                                  encapsulation.
  --------------- ------------- ----------------- ----------------------------

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[]{#__RefHeading___Toc190679846 .anchor}FOREWORD

This NASA Standard (NASA-STD) is published by the National Aeronautics
and Space Administration (NASA) to provide uniform engineering and
technical requirements for processes, procedures, practices, and methods
that have been endorsed as standard for NASA programs and projects,
including requirements for selection, application, and design criteria
of an item. Use of this NASA-STD is the responsibility of the user as
required by NASA Policy Directive (NPD) 8730.5, NASA Quality Assurance
Program Policy.

This NASA-STD is approved for use by NASA Headquarters and NASA Centers,
including Component Facilities. This NASA-STD may be applied on
contracts for spacecraft, instrument, or launch vehicle contractors per
contractual documentation.

The requirements herein prescribe NASA's technical requirements,
procedures, and documenting requirements for staking, conformal coating,
bonding, and encapsulation of printed wiring boards and electronic
assemblies. These may be tailored to the program applications to obtain
the most cost effective, best quality product. These requirements
describe basic considerations necessary to ensure reliable staking,
conformal coating, bonding, and encapsulation of printed circuit boards
and electronic assemblies. Included are requirements which establish the
responsibility for documenting fabrication and inspection procedures to
be used for NASA work including supplier innovations, special processes,
and changes in technology. For the purpose of this document, the term
"supplier" is defined as in-house NASA, NASA contractors, and subtier
contractors.

Requests for information, corrections, or additions to this NASA-STD can
be submitted via "Feedback" in the NASA Technical Standards System at
[**http://standards.nasa.gov**](http://standards.nasa.gov/). This
NASA-STD was developed by the NASA Headquarters Office of Safety and
Mission Assurance, Safety and Assurance Requirements Division and the
NASA Workmanship Technical Committee which is managed by NASA Goddard
Space Flight Center.

s/ Bryan O'Connor March 4, 2008

Bryan O'Connor Approval Date\
Chief, Safety and Mission Assurance

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[]{#__RefHeading___Toc190679847 .anchor}TABLE OF CONTENTS

[FOREWORD 5](#__RefHeading___Toc190679846)

[TABLE OF CONTENTS 7](#__RefHeading___Toc190679847)

[LIST OF FIGURES 9](#__RefHeading___Toc190679848)

[LIST OF TABLES 10](#__RefHeading___Toc190679849)

[1. SCOPE 11](#scope)

[1.1 Purpose 11](#purpose)

[1.2 Applicability 11](#applicability)

[1.3 Special Requirements 11](#special-requirements)

[1.4 Approval of Departures from this Standard
11](#approval-of-departures-from-this-standard)

[2. APPLICABLE DOCUMENTS 12](#applicable-documents)

[2.1 Applicable Documents 12](#applicable-documents-1)

[2.1.1 General 12](#general)

[2.1.2 Government Documents 12](#government-documents)

[2.1.3 Non-Government Documents 12](#non-government-documents)

[3. ACRONYMS AND DEFINITIONS 13](#acronyms-and-definitions)

[3.1 Acronyms 13](#acronyms)

[3.2 Definitions 14](#definitions)

[4. GENERAL REQUIREMENTS 18](#general-requirements)

[4.1 General 18](#general-1)

[4.2 Documentation 18](#documentation)

[4.3 Rework and Repair 18](#rework-and-repair)

[4.4 Electrostatic Discharge Requirements
19](#electrostatic-discharge-requirements)

[4.5 Selection and Approval Requirements for Polymeric Materials
19](#selection-and-approval-requirements-for-polymeric-materials)

[5. TRAINING AND CERTIFICATION PROGRAM
22](#training-and-certification-program)

[5.1 General 22](#general-2)

[5.2 Vision Requirements 22](#vision-requirements)

[5.3 Personnel Certification Levels 23](#personnel-certification-levels)

[5.4 Training Program Requirements 23](#training-program-requirements)

[5.5 Documentation 24](#documentation-1)

[5.6 Maintenance of Certification Status
24](#maintenance-of-certification-status)

[5.7 Training Resources 25](#training-resources)

[6. FACILITIES, TOOLS, AND MATERIALS
26](#facilities-tools-and-materials)

[6.1 Safety 26](#safety)

[6.2 Facility Cleanliness 26](#facility-cleanliness)

[6.3 Environmental Conditions 26](#environmental-conditions)

[6.4 Silicone Operations 27](#silicone-operations)

[6.5 Tool and Equipment Control 27](#tool-and-equipment-control)

[6.6 Material Storage and Records Retention
28](#material-storage-and-records-retention)

[6.7 Inspection Optics 29](#inspection-optics)

[6.8 In-Process Storage and Handling
29](#in-process-storage-and-handling)

[6.9 Solvents 29](#solvents)

[7. CLEANLINESS REQUIREMENTS 31](#cleanliness-requirements)

[7.1 General 31](#general-3)

[7.2 Cleanliness Testing 31](#cleanliness-testing)

[7.3 Test Limits 32](#test-limits)

[7.4 Resistivity of Solvent Extract 32](#resistivity-of-solvent-extract)

[7.5 Sodium Chloride Salt Equivalent Ionic Contamination Test
32](#sodium-chloride-salt-equivalent-ionic-contamination-test)

[8. PREPARATION FOR POLYMERIC APPLICATIONS
34](#preparation-for-polymeric-applications)

[8.1 Surface Preparation 34](#surface-preparation)

[8.2 Masking 34](#masking)

[8.3 Priming 34](#priming)

[8.4 Material Preparation 36](#material-preparation)

[8.5 Test Specimen 38](#test-specimen)

[8.6 Conformal Coating Specimens 38](#conformal-coating-specimens)

[9. STAKING 39](#staking)

[9.1 Requirements 39](#requirements)

[9.2 Fastener Staking 47](#fastener-staking)

[9.3 Torque Striping 49](#torque-striping)

[10. CONFORMAL COATING 50](#conformal-coating)

[10.1 Purpose 50](#purpose-1)

[10.2 Conformal Coating Application 50](#conformal-coating-application)

[10.3 Curing 53](#curing)

[10.4 Cleanup 53](#cleanup)

[10.5 Touchup/Rework 53](#touchuprework)

[11. BONDING 58](#bonding)

[11.1 General 58](#general-4)

[11.2 Bonding 58](#bonding-1)

[12. ENCAPSULATION 60](#encapsulation)

[12.1 General 60](#general-5)

[12.2 Pre-cure Examination 60](#pre-cure-examination)

[12.3 Post-cure Examination 60](#post-cure-examination)

[12.4 Potting Connectors used with Shielded Cable
62](#potting-connectors-used-with-shielded-cable)

[12.5 Cleanup 62](#cleanup-1)

[12.6 Examples 63](#examples)

[13. QUALITY ASSURANCE 64](#quality-assurance)

[13.1 General 64](#general-6)

[13.2 Documentation Verification 64](#documentation-verification)

[13.3 Documentation Authorization 65](#documentation-authorization)

[13.4 Verification of Tools, Equipment, and Materials
65](#verification-of-tools-equipment-and-materials)

[13.5 General Inspection Methods for Polymeric Applications
65](#general-inspection-methods-for-polymeric-applications)

[13.6 Acceptance/Rejection Criteria for Staking
66](#acceptancerejection-criteria-for-staking)

[13.7 Acceptance/Rejection Criteria for Fastener Staking and Torque
Striping
68](#acceptancerejection-criteria-for-fastener-staking-and-torque-striping)

[13.8 Inspection Methods for Conformal Coating
69](#inspection-methods-for-conformal-coating)

[13.9 Acceptance/Rejection Criteria for Conformal Coating
69](#acceptancerejection-criteria-for-conformal-coating)

[13.10 Acceptance/Rejection Criteria for Bonding
70](#acceptancerejection-criteria-for-bonding)

[13.11 Acceptance/Rejection Criteria for Encapsulation
71](#acceptancerejection-criteria-for-encapsulation)

[APPENDIX A. CONFORMAL COATING PROBLEMS
73](#__RefHeading___Toc190679932)

[A.1 Conformal Coating Thickness 73](#__RefHeading___Toc190679933)

[A.2 Coverage -- Points and Edges 73](#__RefHeading___Toc190679934)

[A.3 Bubbles 73](#__RefHeading___Toc190679935)

[]{#__RefHeading___Toc190679848 .anchor}LIST OF FIGURES

[Figure 9‑1: Typical Staking for Horizontally-Mounted Sleeveless
Cylindrical Part 42](#__RefHeading___Toc192295523)

[Figure 9‑2: Typical Staking for Horizontally-Mounted Sleeved
Cylindrical Parts 42](#__RefHeading___Toc192295524)

[Figure 9‑3: Typical Staking of a Single Vertically-Mounted Rectangular
Part 43](#__RefHeading___Toc192295525)

[Figure 9‑4: Typical Staking for an Array of Vertically-Mounted
Rectangular Parts 43](#__RefHeading___Toc192295526)

[Figure 9‑5: Staking for Radial Lead Components
44](#__RefHeading___Toc192295527)

[Figure 9‑6: Staking for Radial Multi-lead Rectangular Components
44](#__RefHeading___Toc192295528)

[Figure 9‑7: Wire Bundle Staking 45](#__RefHeading___Toc192295529)

[Figure 9‑8: Single Wire Staking 45](#__RefHeading___Toc192295530)

[Figure 9‑9: Toroid Staking 46](#__RefHeading___Toc192295531)

[Figure 9‑10: Vibration Isolation Staking
47](#__RefHeading___Toc192295532)

[Figure 9‑11: Locking of Screws and Bolts with Nuts
48](#__RefHeading___Toc192295533)

[Figure 9‑12: Thread Locking of Blind Screw
49](#__RefHeading___Toc192295534)

[Figure 9‑13: Torque Striping Methods 49](#__RefHeading___Toc192295535)

[Figure 10‑1: Spray Application 51](#__RefHeading___Toc192295536)

[Figure 10‑2: Conformal Coating -- Bubbles
54](#__RefHeading___Toc192295537)

[Figure 10‑3: Conformal Coating -- Scratches
55](#__RefHeading___Toc192295538)

[Figure 10‑4: Conformal Coating - Lifting and Peeling
56](#__RefHeading___Toc192295539)

[Figure 10‑5: Conformal Coating -- Coverage Defects
57](#__RefHeading___Toc192295540)

[Figure 11‑1: Component Bonding - Excess Bonding Material
59](#__RefHeading___Toc192295541)

[Figure 12‑1: Encapsulating Wires at Connector
61](#__RefHeading___Toc192295542)

[Figure 12‑2: Potting Concerns 62](#__RefHeading___Toc192295543)

[]{#__RefHeading___Toc190679849 .anchor}LIST OF TABLES

[Table 6‑1: Solvent and Cleaners 30](#__RefHeading___Toc190058044)

[Table 7‑1: Cleanliness Test Values 33](#__RefHeading___Toc190058045)

[Table 8‑1: Demoisturizing Schedules for Pre-Solder, Rework,
Post-Cleaning, and Pre‑Conformal Coating
35](#__RefHeading___Toc190058046)

[Table 10‑1: Conformal Coating Thickness
52](#__RefHeading___Toc190058047)

# SCOPE

This standard prescribes NASA's technical requirements, procedures, and
documentation requirements for polymeric applications for electrical and
electronic assemblies. These requirements may be tailored to the program
applications via the engineering documentation (See Sections 1.3, 1.4
and 4.1.3).

## Purpose

This publication sets forth requirements for staking, conformal coating,
bonding, and encapsulation of components used in electronic hardware.

## Applicability

This publication is applicable to NASA programs involving polymeric
applications for flight hardware, mission critical ground support
equipment, and elements thereof and wherever invoked contractually.

## Special Requirements

Special requirements may exist that are not in conformance with the
requirements of this publication. Engineering documentation shall
contain the details for such requirements, including modifications to
existing equipment, and shall take precedence over appropriate portions
of this publication when approved in writing by the procuring NASA
Center (*Requirement)*.

## Approval of Departures from this Standard

1.4.1 Minor departures from this standard require written approval from
the cognizant NASA contracting officer. The supplier is responsible for
assuring that any departures from this publication are evaluated by,
coordinated with, and submitted to the procuring NASA Center for
approval prior to use or implementation. Departures which reduce the
requirements herein may warrant a request for waiver of associated
requirements in NPD 8730.5, per NASA Procedural Requirements (NPR)
8715.3, NASA General Safety Program Requirements.

1.4.2 For in-house NASA projects, this publication requires written
approval by the in-house NASA project management to deviate from the
provisions herein.

# APPLICABLE DOCUMENTS

## Applicable Documents

### General

The documents listed in this section contain provisions that constitute
requirements of this NASA-STD. The latest issuance of cited documents is
to be used unless otherwise approved by the assigned Technical
Authority. The applicable documents are accessible via the NASA Online
Directives Information System at <http://nodis3.gsfc.nasa.gov/>, the
NASA Technical Standards website at
[http://standards.nasa.gov](http://standards.nasa.gov/), or directly
from the Standards Developing Organizations (SDOs) or other document
distributors.

### Government Documents

27 CFR 21.35 Code of Federal Regulations, Title 27, Alcohol, Tobacco and
Firearms, Part 21, Formulas for Denatured Alcohol and Rum, [Subpart D,
Specially Denatured Spirits Formulas and Authorized
Uses](http://ecfr.gpoaccess.gov/cgi/t/text/text-idx?c=ecfr;sid=646ca07ac73369730cf612f02a5d7aa5;rgn=div5;view=text;node=27%3A1.0.1.1.17;idno=27;cc=ecfr#27:1.0.1.1.17.4%2327:1.0.1.1.17.4),
Formula No. 3-A

O-M-232 Methanol (Methyl Alcohol)

NASA-STD-6001 Flammability, Odor, Offgassing and Compatibility
Requirements and Test Procedures for Materials in Environments that
Support Combustion

NPD 8730.5 NASA Quality Assurance Program Policy

OSHA Standards Occupational Safety and Health Administration (OSHA),
Title 29, Code of Federal Regulations (CFR), Part 1910, Occupational
Safety and Health Standards.

### Non-Government Documents

ANSI/NCSL Z540.1 Requirements for the Calibration of Measuring and Test
Equipment

ASTM-D-1007 Standard Specification for sec-Butyl Alcohol

ASTM-D-2240 Standard Test Method for Rubber Property -- Durometer
Hardness

ASTM D770 Standard Specification for Isopropyl Alcohol

ASTM-E-595 Standard Test Method for Total Mass Loss and Collected
Volatile Condensable Materials From Outgassing in a Vacuum Environment

ANSI/ESD S20.20 Standard for Electrostatic Discharge Control (Excluding
Electrically Initiated Explosive Devices)

# ACRONYMS AND DEFINITIONS

## Acronyms

CFR Code of Federal Regulations

CTE Coefficient of Thermal Expansion

CVCM Collected Volatile Condensable Material

CVD Chemical Vapor Deposition

DIP Dual-In-Line Package

DOT Department of Transportation

EEE Electrical, Electronic, and Electromechanical

EPA Environmental Protection Agency

ESD Electrostatic Discharge

GSFC Goddard Space Flight Center

JPL Jet Propulsion Laboratory

MSDS Material Safety Data Sheet

NASA National Aeronautics and Space Administration

NASA-STD NASA Standard

NPD NASA Policy Directive

NPR NASA Procedural Requirements

SDO Standards Developing Organizations

OSHA Occupational Safety and Health Administration

OSMA Office of Safety and Mission Assurance

PRT Platinum Resistance Thermometer

PWA Printed Wiring Assembly

PWB Printed Wiring Board

QPL Qualified Products List

RH Relative Humidity

TML Total Mass Loss

UV Ultraviolet

## Definitions

*Accelerator*: A compounding material used in small amounts with a
curing agent to increase the cure rate.

*Area Array Package*: A package with an X-Y grid interconnect pattern on
the under-surface (i.e., ball grid array, column grid array, land grid
array, pin grid array).

*Batch*: That quantity of material that was subjected to unit chemical
processing or physical mixing, or both, designed to produce a product of
substantially uniform characteristics.

*Blister*: Undesirable rounded elevation of the surface of a polymer,
whose boundaries may be more or less sharply defined.

*Bonding*: Bonding refers to fastening parts or materials to a substrate
or assembly using a polymer sandwich construction.

*Catalyst*: A substance that changes the rate of a chemical reaction
without undergoing permanent change in its composition; a substance that
markedly speeds up the cure of a compound when added in minor quantity
as compared to the amount of primary reactants.

*Certification of Personnel*: The act of verifying and documenting that
personnel have completed the required training and have demonstrated
specified proficiency and have met other specified requirements.

*Coefficient of Thermal Expansion (CTE)*: The measure of the fractional
change in dimension per unit change in temperature.

*Conductor*: A lead or wire, solid, stranded, or printed wiring path
serving as an electrical connection.

*Conformal Coating*: A thin electrically nonconductive protective
coating that conforms to the contours of the printed wiring assembly
(PWA) or electronic assemblies.

*Conformal Coating Specimen*: A representative sample of the conformal
coating process that is created simultaneously with the same materials,
at the same time, and with the same processes as used to coat the
finished item.

*Contaminant*: An impurity or foreign substance present in a material
that affects one or more properties of the material. A contaminant may
be either ionic or nonionic. An ionic, or polar, compound forms free
ions when dissolved in water, making the water a more conductive path. A
nonionic substance does not form free ions, nor increase the water's
conductivity. Ionic contaminants are usually processing residue such as
flux activators, fingerprints, and etching or plating salts.

*Cure*: A chemical reaction that hardens and changes the physical
properties of a material(s).

*Deterioration*: (as in the context of the condition of stored polymer
materials) A change in the material that can be observed prior to its
use, or during use, that indicates it no longer meets its performance
requirements. Deteriorated in this context includes degraded or
separated.

*Dielectric*: A material with a high resistance to the flow of
electrical current, and which is capable of being polarized by an
electrical field.

*Dielectric Strength*: The maximum voltage that a dielectric can
withstand under specified conditions without resulting in a voltage
breakdown, usually expressed as volts per unit dimension.

*Diluent*: Any material that reduces the concentration of the
fundamental resin; usually a liquid added to the resin to afford lower
viscosity.

*Embedment*: The complete encasement of a component or module in a
resin. Equivalent to "encapsulation."

*Encapsulation*: The complete encasement of a component or module in a
resin. Encapsulation is equivalent to "potting," "embedment," and
"molding."

*Engineering Documentation*: Drawings and specifications which provide
instructions, design features, requirements, acceptance criteria, and
other documentation to invoke and/or modify requirements.

*Filler*: A material added to polymers in order to reduce cost or modify
physical properties.

*Fillet*: A smooth, generally concave, buildup of material between two
surfaces (e.g., a buildup of conformal coating material between a part
and the printed wiring board (PWB)).

*Flatpack*: A part with two straight rows of leads (normally on 1.27mm
(0.050 inch) centers) that are parallel to the part body.

*Flux*: A chemically-active compound which, when heated, removes minor
surface oxidation, minimizes oxidation of the basis metal, and promotes
the formation of an intermetallic layer between solder and basis metal.

*Gelling*: Formation of a semi-solid system consisting of a network of
solid aggregates in which liquid is held; the initial gel-like solid
phase that develops during the formation of a resin from a liquid.

*Glass Transition Temperature (Tg)*: The approximate midpoint of the
temperature range over which the glass transition takes place. The glass
transition is a reversible change in an amorphous polymer or in
amorphous regions of a partially crystalline polymer from (or to) a
viscous or rubbery condition to (or from) a hard and relatively brittle
one. Not only do hardness and brittleness undergo rapid changes in this
temperature region, but other properties, such as dissipation factor,
thermal expansibility, and specific heat, also change rapidly. The glass
transition has its origin in short scale segmental motion involving
intramolecular rotation of the main chain, and, if present, side chains
or pendant groups. Moreover, the observed transition temperature can
vary significantly depending on the specific property chosen for
observation and on details of the experimental technique (for example,
rate of heating, frequency). Therefore, the observed Tg should be
considered only an estimate.

*Impregnation*: An encapsulation process that results in complete
saturation of the unit with the insulating material to include
penetration and filling of every void replacing all air and gasses.

*Lifting*: Any separation of conformal coating from the PWA.

*Measling*: A condition at the interface of the conformal coating and
base material, in the form of whitish spots or patches which reveal a
separation of the conformal coating from the surface of the printed
wiring board or from the surface of attached components or from both.

*Mix Record*: A record of the procedure followed for mixing the
polymeric compounds.

*Module*: A separable unit in a packaging scheme.

*Molding*: The complete encasement of a component or module in a resin.
Equivalent to "encapsulation."

*Offgassing*: Deaeration or other gaseous emission from a liquid or
solid material when exposed to reduced pressure, heat, or both that may
affect crew members. Reference NASA-STD-6001.

*Outgassing*: Gaseous emission from a liquid or solid material when
exposed to reduced pressure, heat, or both.

*Part Lead*: The conductor attached to a part.

*Peeling*: The separation of conformal coating from the PWA, usually due
to improper preparation or abrasion. Peeling is distinguished from
lifting in that the layer of conformal coating is not continuous.

*Polymer*: A compound of high molecular weight that is derived from
either the joining together of many small similar or dissimilar organic
molecules or by the condensation of many small molecules by the
elimination of water, alcohol, or a solvent.

*Potting*: The complete encasement of a component or module in a resin.
Equivalent to "encapsulation."

*Printed Wiring Assembly (PWA)*: The PWA consists of the PWB,
components, and associated hardware and materials.

*Printed Wiring Board (PWB)*: A pattern of conductors printed (screened)
onto the surface of an insulating base to provide interconnection for
parts.

*Repair(ing)*: The act of restoring the functional capability of a
defective article in a manner that precludes compliance of the article
with applicable drawings or specifications.

*Resin*: Generally, any synthetic organic material produced by
polymerization.

*Rework*: The act of reprocessing noncomplying articles, through the use
of original or alternate equivalent processing, in a manner that assures
compliance of the article with applicable drawings or specifications.

*Shall*: Signifies a requirement statement herein.

*Should*: Signifies statement of a recommended practice herein.

*Squeeze-out*: The resin and/or reinforcement that is visible at the
edges of a bond.

*Staking*: The process of bonding and securing components or parts to
PWB's and electronic assemblies by means of an adhesive material.

*Staking Compound*: An electrically nonconductive adhesive material used
for additional\
support.

*Stress Relief*: The formed portion of a conductor that provides
sufficient length to minimize stress between terminations.

*Substrate*: That surface upon which an adhesive is spread for any
purpose, such as coating; a broader term than "adherent."

*Supplier*: In-house NASA, NASA contractors, and subtier contractors.

*Test Specimen*: A sample of the same material processed using the same
method, at the same time, and under the same conditions as the original
end item product. It used as a quality record of the hardness and cure
achieved with the particular material batch and the operations
performed.

*Traceability Code*: The code uniquely identifying the production lot by
the manufacturer, equivalent to batch code, lot code, or date code.

*Transmissivity:* The fractional quantity of incident radiation
transmitted by matter.

*Viscosity*: A measure of the resistance of a material to flow under
stress.

# GENERAL REQUIREMENTS

## General

4.1.1 Implementation. NASA quality assurance personnel will advise and
assist suppliers, NASA personnel, and delegated agencies in the proper
and effective implementation of the provisions of this publication.
Effective implementation includes establishing a system that will
identify each inspection point and provide records.

4.1.2 Changes in Requirements. When related requirements or changes in
requirements are specified, NASA quality assurance personnel will assure
that the Government agency delegated to inspect at the supplier's site
of fabrication has received full instructions so that the work will be
inspected to actual contract requirements.

4.1.3 Nonstandard Processes, Materials, or Parts. When the supplier
intends to use processes, materials, or parts not covered by this
standard, the supplier shall document the details of fabrication and
inspection, including acceptance and rejection criteria, and provide the
documentation along with appropriate test data to the procuring NASA
Center for approval prior to use (*Requirement)*.

4.1.4 Proactive Work Stoppages. If at any time during any phase of
staking or conformal coating, a condition should arise that any
responsible party, including the operator, inspector, or manager, feels
may damage or in any way affect the reliability of the hardware, the
work shall be halted until that condition has been reviewed and resolved
(*Requirement)*.

4.1.5 Requirement Flow Down. The prime contractors are responsible for
delegating the requirements herein to their subtier suppliers as
required (*Requirement)*.

## Documentation

4.2.1 The supplier shall document the methods and procedures proposed to
incorporate the requirements of this standard into the design,
fabrication, and inspection of staking, conformal coating, bonding, and
encapsulation applications involved in the contract or purchase order
(*Requirement)*.

4.2.2 Staking material shall be applied as defined herein unless
exceptions or additions are documented on the engineering drawings. In
this case, the engineering drawing takes precedence. Instructions for
staking on the engineering drawings include, as a minimum, the staking
material and the locations to be staked (*Requirement)*.

4.2.3 Documents required herein, except as specified by paragraph 4.1.3,
shall be submitted to the procuring NASA Center, or its designated
representative, as required by the contract or purchase order
(*Requirement)*.

4.2.4 Applicable supplier polymeric applications program documents, or
portions thereof, accepted on other NASA contracts shall be included to
avoid duplication of effort (*Requirement)*.

## Rework and Repair

4.3.1 Rework. Rework is permissible unless excluded by other provisions
of the contract.

4.3.1.1 All rework shall meet the requirements of this publication and
approved engineering documentation (*Requirement)*.

4.3.1.2 The discrepancies shall be documented before rework is performed
(*Requirement)*.

4.3.1.3 Rework procedures shall be approved prior to performing rework
by the procuring NASA Center or its designated representative
(*Requirement)*.

4.3.2 Repair.

4.3.2.1 Repairs shall be made only in compliance with applicable
contractual requirements and after authorization for each incident by
the procuring NASA Center (*Requirement)*.

4.3.2.2 Repairs shall be accomplished using documented procedures
previously approved by the procuring NASA Center (*Requirement)*.

4.3.2.3 For in-house NASA projects, repairs shall be authorized for each
incident by the Project Office and the Project quality technical lead
(*Requirement)*.

4.3.2.4 Repair is not rework.

## Electrostatic Discharge Requirements

Electrostatic Discharge (ESD) requirements shall be in accordance with
ANSI/ESD S20.20 (*Requirement).*

## Selection and Approval Requirements for Polymeric Materials

4.5.1 Minimum Criteria for Material Selection. The polymeric material(s)
shall be selected in accordance with the following:

a\. Workable using the processes described herein such that the intended
performance of the polymer is realized in the application. This includes
continuous and consistent coverage for conformal coating, material
volume control for staking material, and bond line control for bonding
materials (*Requirement)*.

b\. Suitable to the complexity of the assembly and the mission lifetime
defined by the project (*Requirement)*.

c\. Compatible with, and adheres to, the intended substrates (including
the PWB, electrical, electronic, and electromechanical (EEE) parts,
jumper wires, cable ties, metal brackets, enclosure surfaces)
(*Requirement)*.

d\. Stable with respect to moisture exposure, the project's test,
operating, and storage temperature range, and vacuum conditions
(including thermal-vacuum). Other environmental conditions may be
applicable such as ionizing radiation and UV radiation (*Requirement)*.

e\. In vacuum or low-pressure compartments, does not release greater
than 1.0 percent total mass loss (TML) and 0.1 percent collected
volatile condensable material (CVCM) when tested in accordance with
ASTM-E-595 and Project requirements (*Requirement)*.

f\. In habitable areas of spacecraft, stowed equipment, and experiments,
is evaluated for flammability, odor, and offgassing characteristics in
accordance with NASA-STD-6001 and Project requirements (*Requirement)*.

g\. Selected to conform to the project contamination control
requirements plan (*Requirement)*.

h\. Noncorrosive to the electronic assembly for which it is selected
(*Requirement)*.

i\. Curable under temperature conditions compatible with the assembly on
which it is located (*Requirement)*.

j\. Shall be selected to enable the finished assembly to meet all
mechanical, thermal, electrical, and optical requirements associated
with test and mission use, with consideration given to the following
characteristics: dielectric constant, permittivity, dielectric
withstanding voltage, tensile modulus over temperature range,
coefficient of thermal expansion (CTE), glass transition temperature
(Tg), viscosity and transmissivity, and Project-specific requirements
(*Requirement)*.

k\. Allow repair and rework as needed without damaging the assembly or
other elements (*Requirement)*.

4.5.2 Qualification and Acceptance of Polymeric Materials. Materials
proposed for use in accordance with this standard shall be validated,
approved, and accepted using the following as a minimum:

a\. When required by the procuring NASA Center, verification tests shall
be conducted to establish confidence in the reliability of the solder
joints (*Requirement)*.

\(1\) A test plan shall be submitted to the procuring NASA Center, or
its designated representative, for approval (*Requirement)*.

\(2\) The test plan shall detail the test environment, test duration,
test assembly design, and failure criteria based on life and mission
requirements (*Requirement)*.

b\. The suppliers have established a consistent record of supplying lots
which have been verified to meet their datasheet characteristics and are
homogeneous on a lot-to-lot basis (*Requirement)*.

c\. Materials are traceable to a production lot identifier and
manufacturing date (*Requirement)*.

d\. Procurements are made from the original manufacturer or their
authorized distributors (*Requirement)*.

e\. A certificate of compliance from the supplier is required for each
purchase certifying compliance with 4.5.2.c and 4.5.2.d above
(*Requirement)*.

4.5.3 Special Design Elements for Staking Material. Additional minimum
design elements when staking are the following:

a\. Staking material shall be electrically insulative (*Requirement)*.

b\. The mechanical support provided by staking shall extend to worst
case application of thermal, shock, and vibration conditions
(*Requirement)*.

c\. Staking shall not negate stress relief (*Requirement)*.

d\. Through-hole solid tantalum capacitors and jumper wires in excess of
25 mm (1 inch) shall be staked (*Requirement)*.

4.5.4 Special Design Elements for Conformal Coating. Additional minimum
design elements for conformal coating are the following:

a\. The conformal coating process and material shall be capable of
continuously and uniformly covering the PWA (*Requirement)*.

b\. To facilitate examination for coverage, conformal coating materials
with a fluorescent indicator are preferred.

CAUTION: ULTRAVIOLET (UV) SENSITIVE EQUIPMENT MAY BE ADVERSELY AFFECTED
BY USING FLUORESCENT INDICATORS.

c\. The following shall be identified in the engineering documentation:

i\. Maskant material and areas to be masked (*Requirement)*

ii\. Conformal coat material (*Requirement)*

4.5.5. Special Design Elements for Bonding. The minimum design elements
to assure reliable bonding are:

a\. Fixturing or other methods for controlling device placement during
bonding and cure may be required.

b\. The following shall be identified in the engineering documentation:

i\. Bonding material (*Requirement)*

ii\. Locations of the items to be bonded (*Requirement)*

iii\. Bond line thickness requirements if applicable (*Requirement)*

4.5.6. Special Design Elements for Encapsulation. The minimum design
elements to assure reliable encapsulation are:

a\. Shall extend to worst case application electrical, thermal, and
mechanical conditions (*Requirement)*.

b\. Shall prevent damaging stress during processing (*Requirement)*.

c\. Shall identify the following in the engineering documentation:

i\. The encapsulation material (*Requirement)*

ii\. The items to be encapsulated (*Requirement)*

4.5.7 Underfill of Area Array Interconnect Packages. Underfill of area
array interconnect packages shall require qualification using the
identical material, application process, PWA configuration, and
operating environment(s) for the intended mission (Requirement).

# TRAINING AND CERTIFICATION PROGRAM

## General

5.1.1 The supplier is responsible for maintaining a documented training
program that meets the requirements of this standard.

5.1.2 The supplier shall assure that design personnel are familiar with
the requirements of this standard, staking, conformal coating, bonding
and encapsulation techniques, and other pertinent requirements of the
contract (Requirement).

5.1.3 The supplier shall implement and document a training program that
provides the necessary training of staking and conformal coating
fabrication and inspection personnel in techniques, use of equipment,
and procedures pertinent to their responsibilities in performance of the
contract requirements (Requirement).

5.1.4 The supplier shall certify and maintain the certification of each
individual who fabricates, inspects, or instructs (Requirement).

5.1.5 Operators, inspectors, and instructors shall be qualified to
fulfill all requirements of this standard involved in their assigned
tasks (Requirement).

5.1.6 Demonstration of proficiency and understanding of the requirements
is a requisite for certification and recertification, and evidence of
certification status shall be maintained in the work area (Requirement).

## Vision Requirements

5.2.1 The supplier is responsible for ensuring that all personnel who
perform or inspect staking or conformal coating applications meet vision
test requirements as a prerequisite to training, certification, and
recertification (Requirement). The vision requirements may be met with
corrected vision (personal eyeglasses).

5.2.2 The vision tests shall be administered every 2 years by a
qualified eye examiner, accepted by the procuring supplier, using
standard instruments and techniques (Requirement).

5.2.3 Results of the visual examinations shall be maintained and
available for review (Requirement).

5.2.4 The following are minimum vision requirements:

a\. Far Vision. Snellen Chart 20/50 (Requirement).

b\. Near Vision. Jaeger 1 at 355.6 mm (14 inches), or reduced Snellen
20/20, or equivalent (Requirement).

c\. Color Vision. Ability to distinguish red, green, blue, and yellow
colors as prescribed in Dvorine Charts, Ishihara Plates, or AO-HRR Tests
(Requirement).

NOTE: A PRACTICAL TEST, USING COLOR CODED WIRES AND/OR COLOR CODED
ELECTRICAL PARTS, AS APPLICABLE, IS ACCEPTABLE FOR COLOR VISION TESTING.

## Personnel Certification Levels

5.3.1 Level A NASA instructors are certified by the NASA Training and
Certification Board. Level A NASA instructors have the authority to
train Level B instructors, operators, and inspectors. Upon successful
course completion, a certificate shall be issued by the instructor
(*Requirement)*.

5.3.2 Certification of Level B instructors shall be provided by the
supplier based on successful completion of training by a Level A NASA
instructor (*Requirement)*. Level B instructors are authorized to train
operators and inspectors employed at their organization and subtier
contractors.

5.3.3 Certification of inspectors shall be provided by the supplier
based on successful completion of training by a Level A NASA instructor
or Level B supplier instructor (*Requirement)*. An inspector is trained
and certified to inspect for conformance with the requirements of this
standard.

5.3.4 Certification of operators shall be provided by the supplier based
on successful completion of training by a Level A NASA instructor or
Level B supplier instructor (*Requirement)*.

5.3.5 An operator is trained and certified to apply polymeric materials
in conformance with the requirements of this standard. When operators
are certified to perform limited operations or processes, the
limitation(s) shall be stated on the certification card (*Requirement).*

## Training Program Requirements

5.4.1 The supplier is responsible for training and certification of
operators and inspectors in the staking, conformal coating, bonding, and
encapsulation processes and associated processing equipment
(*Requirement)*.

5.4.2 The supplier shall submit training program documentation to the
procuring NASA Center as directed by the contract (*Requirement)*.

5.4.3 The training program shall:

a\. Identify the criteria for qualification and certification of Level B
instructors, inspectors, and operators (*Requirement)*.

b\. Document the methods and procedures proposed to fulfill the
requirements of this standard (*Requirement)*.

c\. Utilize visual standards consisting of satisfactory work samples or
visual aids that clearly illustrate the quality characteristics of
polymeric applications applicable to the contract (*Requirement)*.

d\. Utilize applicable illustrations in this standard, supplemented as
necessary, for visual standards. Standards of unacceptable conditions
may also be used for clarification or comparison (*Requirement)*.

e\. Make applicable standards readily available (*Requirement)*.

## Documentation

5.5.1 The supplier training program documentation shall describe the
training and certification program proposed to satisfy the requirements
herein for the staking and conformal coating applications
(*Requirement)*.

5.5.2 This description shall include the following:

a\. Qualification of instructors (*Requirement)*.

b\. Procedures for training, including who will be trained and for what
purpose, (e.g., operator, inspector) (*Requirement)*.

c\. Lesson plan(s)/student standards (*Requirement)*.

d\. Hours of instruction (*Requirement)*.

e\. Procedures for certification and recertification (*Requirement)*.

f\. Procedures for recording training, recertification, and a method of
identifying/recalling trained personnel (*Requirement)*.

g\. Certification criteria (*Requirement)*.

5.5.3 Records of training and certification shall become part of the
supplier's quality data and be retained for a minimum of 5 years
(*Requirement)*.

5.5.4 Evidence of certification status, including limitations, shall be
available in the work area (*Requirement)*.

## Maintenance of Certification Status

5.6.1 Maintenance of certification for instructors, operators, and
inspectors requires continuous proficiency.

5.6.2 Recertification of Level B instructors shall include the
successful completion of retraining by a Level A NASA instructor
(*Requirement)*.

5.6.3 Recertification of operators and inspectors shall include
successful completion of retraining by a Level A NASA instructor or a
Level B supplier instructor (*Requirement)*.

5.6.4 Recertification shall be required when:

a\. Proficiency requirements herein are not met (*Requirement)*.

i\. Instructors - proficiency unacceptable.

ii\. Operators - unsatisfactory quality of articles fabricated.

iii\. Inspectors - unsatisfactory quality of inspection.

iv\. Quality/quantitative data demonstrates a need for recertification.

b\. New polymeric applications or inspection techniques have been
approved that require different skills (*Requirement)*.

c\. Work period interruption of greater than 6 months occurs
(*Requirement)*.

d\. Two years have elapsed since the last certification (*Requirement)*.

5.6.5 Certification shall be revoked when:

a\. Certificate holder fails recertification (*Requirement)*.

b\. Certificate holder fails to meet visual acuity requirements of
paragraph 5.2 (*Requirement)*.

c\. Employment is terminated (*Requirement)*.

d\. Supplier training program fails to meet requirements set forth
herein or those set forth otherwise in the contract (*Requirement)*.

## Training Resources

5.7.1 Training of Level B instructors is available at either the Goddard
Space Flight Center (GSFC) or Jet Propulsion Laboratory (JPL). Contact
information for these facilities can be found at
[http://workmanship.nasa.gov](http://workmanship.nasa.gov/). The NASA
Generic Polymeric Applications Training Plan will be supplied to
instructors at the time of course completion.

5.7.2 Suppliers may train operator or inspector personnel in-house for
certification or recertification utilizing certified instructors and
approved training programs, or arrange for this training at one of the
NASA-conducted schools.

5.7.3 A fee is required. Contact the training center at GSFC or JPL for
information.

# FACILITIES, TOOLS, AND MATERIALS

## Safety

6.1.1 General. Personal protective equipment (such as eye protection,
gloves) complies with the requirements of OSHA, 29 CFR Part 1910,
Personal Protective Equipment and any state and local regulations shall
be provided and used as appropriate to the work being performed
(*Requirement)*.

6.1.2 Handling of Staking, Conformal Coating, Bonding, and Encapsulating
Materials. Staking, conformal coating, bonding, and encapsulating
materials may be flammable or contain harmful solvents. No smoking or
open flame shall be allowed within 7.6 meters (25 feet) of the polymeric
application and storage areas (*Requirement)*.

WARNING: ALL SOLVENTS AND CHEMICALS MAY PRESENT HEALTH AND SAFETY
PROBLEMS. FOLLOW DOT/EPA/OSHA PRECAUTIONS AND GUIDELINES FOR STORING,
HANDLING, TRANSPORTING, STAGING, AND DISPOSAL OF HAZARDOUS WASTE. FOR
WORK DONE OFF-SHORE, HOST GOVERNMENT OR COUNTRY REGULATIONS MAY APPLY.

6.1.3 Exposure to Solvents. Personnel exposure to solvents and vapor of
solvents shall be minimized and controlled in accordance with OSHA, 29
CFR Part 1910 (*Requirement)*.

6.1.4 Exposure to Hazardous Chemicals. Chemical hazards associated with
each material shall be known and understood (*Requirement)*.

6.1.4.1 The relevant Material Safety Data Sheets (MSDS's) shall be read
and understood before work with any material begins.

6.1.4.2 MSDS's shall be available for reference in the work area
(*Requirement)*.

## Facility Cleanliness

6.2.1 The work area shall be maintained in a clean and orderly condition
(*Requirement)*.

6.2.2 Smoking, eating, and drinking materials in staking and conformal
coating areas and at individual work stations shall not be permitted
(*Requirement)*.

6.2.3 Nonessential tools and materials shall not be permitted at the
work station (*Requirement)*.

WARNING: SMOKING, EATING, AND DRINKING IN AREAS WHERE HAZARDOUS
CHEMICALS ARE PRESENT IS HAZARDOUS TO HUMANS AND CAN COMPROMISE HARDWARE
QUALITY.

## Environmental Conditions

6.3.1 Controlled Environment.

6.3.1.1 The staking and conformal coating area shall have a controlled
environment that limits the entry of contamination (*Requirement)*.

6.3.1.2 The temperature and humidity of this area shall be monitored and
maintained to 24±3ºC (75±5ºF), 30 percent to 70 percent Relative
Humidity (RH) (*Requirement)*.

6.3.2 Special Environmental Requirements. Parts, materials, or equipment
being processed that require more stringent control of environmental
conditions than those stated above shall have these requirements and
controls identified and specified on the engineering documentation
(*Requirement)*.

6.3.3 Field Operations Requirement. In field operations where the
required controlled conditions cannot be effectively achieved, special
precautions shall be identified in the appropriate documentation and
followed to minimize the effects of the uncontrolled environment on the
operation being performed on the hardware (*Requirement)*.

6.3.4 Lighting Requirements. Light intensity shall be a minimum of 1077
Lumens per square meter (Lm/m^2^) (100 foot - candles) on the surface
being staked, conformally coated, or inspected (*Requirement)*.
Supplemental lighting may be used to achieve the required levels.

## Silicone Operations

6.4.1 All silicone processing, including the use of curing ovens, tools,
equipment, fixtures, the supplies, and garments used in the operations,
shall be segregated from other polymeric material operations
(*Requirement)*.

6.4.2 Segregation shall be to the degree that ensures no contamination
of assemblies, tools, workspaces, and equipment that are not intended
for use with silicone materials (*Requirement)*.

WARNING: FLIGHT EQUIPMENT CAN BE CONTAMINATED WHEN TOOLS AND EQUIPMENT
USED FOR SILICONE PROCESSING ARE NOT RIGOROUSLY SEGREGATED FROM THOSE
NOT USED FOR SILICONE PROCESSING.

## Tool and Equipment Control

6.5.1 Each supplier shall:

a\. Select tools to be used in staking, conformal coating, and in work
preparation areas appropriate to their intended function
(*Requirement)*.

b\. Clean and properly maintain all tools and equipment (*Requirement)*.

c\. Examine all elements of tools used in polymeric applications for
physical damage (*Requirement)*.

d\. Prohibit unauthorized, defective, or uncalibrated tools in the work
area (*Requirement)*.

e\. Document detailed operating procedures and maintenance schedules for
tools and equipment requiring calibration or set up (*Requirement)*.

f\. Maintain records of tool and equipment calibration and functional
testing (*Requirement)*.

6.5.2 The supplier shall have a documented calibration system in
accordance with ANSI/NCSL Z540.1 (*Requirement)*.

6.5.3 The supplier's process documentation for tool control is subject
to review and approval by the procuring NASA Center.

## Material Storage and Records Retention

6.6.1 Shelf Life.

a\. Shelf Life Stickers. Material storage shall be controlled
(*Requirement)*. A standard method used is attaching shelf life stickers
to each material container.

b\. Expired Shelf Life. Staking and conformal coating material shall not
be used if the shelf life has expired (*Requirement)*. Shelf life
extension may be granted on an individualized basis when adequate data
is provided by the polymer manufacturer in advance of actual use.

c\. Shelf Life. The material shelf life shall be as stated by the
manufacturer and in accordance with the manufacturer's specifications
governing the usable life of the product (*Requirement)*.

d\. Material in Use. The staking and conformal coating material shall be
free of foreign matter and shall not show any signs of deterioration
(*Requirement)*.

6.6.2 Storage.

a\. Solvents. All cleaning and diluent solvents shall be stored in
accordance with applicable regulations (*Requirement)*.

b\. Staking and Conformal Coating Materials. Materials shall be stored
in accordance with the manufacturer's recommendations (*Requirement)*.
All stored containers shall be sealed (*Requirement)*.

6.6.3 Records.

a\. Purchase Data Recording. Records of manufacturing date, lot number,
receiving date, and manufacturer's certification of compliance of each
material shipment shall be maintained (*Requirement)*.

b\. Container Markings. Material containers shall be marked with the
following:

i\. Manufacturer's identification (*Requirement)*.

ii\. Manufacturer's product designation (*Requirement)*.

iii\. Traceability code (if applicable) (*Requirement)*.

iv\. Storage temperature range (if applicable) (*Requirement)*.

v\. Expiration date of guaranteed product life or use (*Requirement)*.

vi\. Caution notes (where applicable) (*Requirement)*.

## Inspection Optics

Visual inspection shall be performed using magnification aids conforming
to the following:

6.7.1 Inspection magnification aids that permit simultaneous viewing
with both eyes are preferred but single eye viewing devices are
acceptable.

6.7.2 Magnification aids shall be capable of rendering true colors,
proportional dimensions, and adequate resolution at the chosen
magnification to perform the specified inspection (*Requirement)*.

6.7.3 The light source shall provide shadowless illumination of the area
being viewed except when oblique lighting is required (*Requirement)*.

6.7.4 Inspection optics shall be capable of 1x to 10x magnification.
(See Section 13, Quality Assurance) (*Requirement)*.

## In-Process Storage and Handling

6.8.1 Each supplier performing staking, conformal coating, bonding, and
encapsulating operations shall develop and implement requirements and
procedures that control conditions to prevent damage to and degradation
of parts and deliverable items (*Requirement)*.

6.8.1.1 Means shall be provided to prevent damage or contamination of
printed wiring terminating areas, terminals, connectors, wire ends, and
part leads during handling or storage (*Requirement)*.

6.8.1.2 Containers shall be compatible with materials stored therein
(*Requirement)*.

6.8.2 When handling metal surfaces, printed wiring terminating areas,
terminals, connectors, wire ends, or part leads is unavoidable, clean,
particulate free gloves or finger cots shall be used (*Requirement)*.

## Solvents

6.9.1 The solvents or aqueous cleaners used to remove grease, oil, dirt,
flux, and other debris shall be selected for their ability to remove
both ionic and nonionic contamination (Requirement).

6.9.2 The solvents or cleaners used shall not degrade the materials or
parts being cleaned (Requirement).

6.9.3 A list of approved solvents and cleaners is provided in Table 6-1.
Cleaners and solvents shall not be used in any manner that will deposit
residue on electrical contact surfaces such as those in switches,
potentiometers, or connectors (Requirement).

6.9.4 Mixtures of the approved solvents may be used. Solvent containers
shall be properly labeled (Requirement).

6.9.5 The use of any other solvents requires the approval of the
procuring NASA Center and shall be identified in the supplier's process
documentation (Requirement).

6.9.6 MSDS's for solvents and cleaners shall be available for personnel
review at the work area (Requirement).

6.9.7 Methyl alcohol and secondary butyl alcohol shall be used only when
purchased as a constituent of an already blended solvent (Requirement).

6.9.8 When deionized water is used, forced nitrogen drying or an
equivalent method shall be accomplished immediately after its use
(Requirement).

6.9.9 Water based saponifier and detergent systems as per Table 6-1
shall require the approval of the procuring NASA Center (Requirement).

6.9.10 Solvent and cleaning systems have the potential of removing
marking information from parts. Appropriate marking permanency testing
shall be performed as part of the evaluation procedure for any solvent
or cleaning system (Requirement).

[]{#__RefHeading___Toc190058044 .anchor}Table 6‑1: Solvent and Cleaners

+---------------------------------+------------------------------------+
| Solvents and Cleaners           | Specification                      |
+---------------------------------+------------------------------------+
| Ethyl Alcohol                   | Per Federal Regulation 27 CFR Part |
|                                 | 21, Subpart.35, Formula No. 3-A    |
+---------------------------------+------------------------------------+
| Isopropyl Alcohol               | ASTM-D-770-05                      |
+---------------------------------+------------------------------------+
| Deionized Water                 | 1 megohm-cm, minimum resistivity   |
|                                 |                                    |
|                                 | (See paragraph 6.9.8)              |
+---------------------------------+------------------------------------+
| Detergent cleaners and          | (See paragraph 6.9.9)              |
| saponifiers                     |                                    |
+---------------------------------+------------------------------------+

WARNING: TREAT ALL SOLVENTS USED IN THE STAKING AND CONFORMAL COATING
PROCESSES AS HAZARDOUS AND VOLATILE UNLESS THEY ARE OTHERWISE RATED ON
THE MSDS.

# CLEANLINESS REQUIREMENTS

## General

All cleaning procedures shall be specified in the supplier's process
documentation (*Requirement)*.

7.1.1 Monitoring. The effectiveness of the cleaning process depends upon
the proper execution of the approved cleaning procedure. To assure the
effectiveness of the cleaning method, a system for monitoring the purity
of the cleaning solvents shall be established (Requirement).

7.1.2 Compatibility of Solvent With Hardware. The cleaning solvent shall
be chemically benign to the hardware and in accordance with Table 6-1
and paragraph 6.9 (Requirement). The solvent used shall not degrade the
reliability of the hardware being cleaned (Requirement).

CAUTION: SOME SOLVENTS OR METHODS OF CLEANING MAY BE DETRIMENTAL TO
POLYMERIC MATERIALS.

7.1.3 Protection of Unsealed Parts. Unsealed parts shall not be
completely immersed in the cleaning solvent and hardware containing
unsealed parts shall be immersed in the solvent only after these parts
have been sealed or masked prior to cleaning (Requirement).

7.1.4 Ultrasonic Cleaning. Ultrasonic cleaning shall not be used for
cleaning assemblies that contain electronic parts (Requirement).

7.1.5 Rework Cleaning. The rework area shall be cleaned and dried prior
to application of rework staking and conformal coating (Requirement).
Conformal coated assemblies shall not be immersion cleaned
(Requirement).

7.1.6 Immersion Cleaning. Immersion cleaning shall not be used for
silver-plated copper wire in order to mitigate the risks associated with
the propensity for silver-plated copper wire to develop cuprous-oxide
corrosion product (red plague) (Requirement).

7.1.7 Alternate Cleaning Processes. Alternate cleaning processes and
systems, such as plasma systems, shall be supported by objective
evidence that their use does not degrade the hardware (Requirement). The
objective evidence shall be reviewed and approved by the responsible
NASA project manager or their designee prior to use (Requirement).

## Cleanliness Testing

All PWAs shall be tested prior to conformal coating (*Requirement)*.

7.2.1 One of the following tests shall be used to determine the
cleanliness level (*Requirement)*:

a\. Resistivity of solvent extract in accordance with the limits in
paragraph 7.3.1 and the method of paragraph 7.4.

b\. Sodium chloride (NaCl) salt equivalent ionic contamination in
accordance with the limits in paragraph 7.3.2 and the method of
paragraph 7.5.

c\. Other test methods shall be approved by the responsible NASA project
manager prior to use (*Requirement)*.

7.2.2 Failed PWAs shall not be recleaned until appropriate corrective
actions have been performed on the cleaning system to ensure its correct
operation (*Requirement)*.

## Test Limits

7.3.1 Resistivity of Solvent Extract. The resistivity of the solvent
extract shall have a final value greater than 2,000,000 ohm-cm
(Requirement).

7.3.2 Sodium Chloride Salt Equivalent Ionic Contamination Test. The
final value for this test shall be less than 1.55 micrograms per sq. cm
(10 micrograms per square inch) of PWB surface area (Requirement).

## Resistivity of Solvent Extract

Solvent extract resistivity shall be measured as follows (also, see
Table 7-1):

7.4.1 Prepare a test solution of 75 percent by volume isopropyl alcohol
and 25 percent by volume deionized water. Pass this solution through a
mixed bed deionizer cartridge. After passage through the cartridge, the
resistivity of the solution shall be greater than 6 x 10^6^ ohm-cm
(conductivity less than 0.166 micromhos/cm) (Requirement).

7.4.2 Clean a funnel, a wash bottle, and a container with a portion of
this test solution.

7.4.3 Measure out 1.55 ml for each square centimeter (10 ml for each
square inch) of PWA area on both sides of the PWA (Requirement).

7.4.4 Slowly, direct the test solution in a fine stream onto both sides
of the PWA until all the measured solution is used (Requirement).

7.4.5 The resistivity of the solvent extract shall be determined by
using a resistivity meter *(Requirement)*.

## Sodium Chloride Salt Equivalent Ionic Contamination Test

Sodium chloride salt equivalent ionic contamination shall be measured as
follows (also, see Table 7-1):

7.5.1 The sodium chloride salt equivalent ionic contamination test shall
use a solution of 75 percent isopropyl alcohol and 25 percent deionized
water (Requirement).

7.5.2 This solution shall be verified for correct composition upon
initial use and every 4 hours during a shift (Requirement). The time
limit may be extended when the results of data provide definite
indications that such actions will not adversely affect the results of
the test.

7.5.3 The equipment shall be calibrated using a known amount of sodium
chloride standard on the same schedule as the percentage composition
verification (Requirement).

7.5.4 The starting or reference purity of the solution shall be greater
than 20 x 10^6^ ohm‑centimeters (0.05 micromhos/centimeter) before each
sample is tested (Requirement).

[]{#__RefHeading___Toc190058045 .anchor}Table 7‑2: Cleanliness Test
Values

+---------------------+---------------------+--------------------------+
| Test Method         | Starting            | Ending Values            |
|                     | Resistivity         |                          |
+---------------------+---------------------+--------------------------+
| Resistivity of      | 6 X 10^6^ ohm-cm    | Shall be greater than 2  |
| Solvent Extract     |                     | X                        |
|                     |                     |                          |
|                     |                     | 10^6^ ohm-cm             |
|                     |                     | (Requirement)            |
+---------------------+---------------------+--------------------------+
| Sodium Chloride     | 20 X 10^6^ ohm-cm   | Shall be less than 1.55  |
| Salt Equivalent     |                     |                          |
| Ionic contamination |                     | micrograms/square        |
|                     |                     | centimeter               |
|                     |                     | (10.0 micrograms/square  |
|                     |                     | inch) (Requirement)      |
+---------------------+---------------------+--------------------------+

# PREPARATION FOR POLYMERIC APPLICATIONS

## Surface Preparation

8.1.1 The PWAs shall be cleaned and demoisturized within 8 hours before
any polymeric application (Requirement).

8.1.2 Demoisturizing shall be defined on the engineering documentation
(Requirement).

8.1.3 Demoisturizing may be accomplished by an oven bake at 90°C ± 5.5°C
(194F° ± 10°F) for a minimum of 4 hours, or by a vacuum bake at a lower
temperature (See Table 8-1). The time in and out of the oven or chamber
and the temperature shall be recorded (Requirement). The PWAs may be
stored for longer periods of time in a controlled moisture free
atmosphere.

8.1.4 Surface preparation varies with the type of material and
substrate. For materials, substrates, or combinations not specifically
addressed in this standard, special instructions shall be generated in
accordance with paragraph 1.4 (Requirement).

## Masking

8.2.1 Material.

8.2.1.1 Areas to be kept free of polymeric material shall be masked with
approved tape, covers, or other suitable masking material or devices
(Requirement).

8.2.1.2 Masking material shall be compatible with the PWA being
processed (Requirement).

8.2.1.3 ESD protective tapes containing conductive adhesive shall not be
applied over PWB conductor patterns (Requirement).

8.2.1.4 Precautions shall be taken to assure that no residues are left
when the masking material is removed (Requirement).

CAUTION: TAPES MAY CONTAIN METALLIC OR METALLIZED POLYMERIC MATERIAL
THAT CAN CAUSE ELECTRICAL SHORTS OR CORROSION.

8.2.2 Masking for Paraxylene Conformal Coating.

8.2.2.1 Unsealed parts and areas not to be coated shall be properly
masked to prevent paraxylene vapors from penetrating minute openings
(Requirement).

8.2.2.2 Masking materials shall be compatible with the primer and the
vacuum deposition system (Requirement).

## Priming

8.3.1 Materials Requiring Primer.

8.3.1.1 When a primer is used, it shall be of a material recommended by
the same manufacturer that produced the conformal coating material and
be applied and cured in accordance with the manufacturer's instruction
(Requirement).

8.3.1.2 Any excess buildup of primer shall be removed (Requirement).

[]{#__RefHeading___Toc190058046 .anchor}Table 8‑3: Demoisturizing
Schedules for Pre-Solder, Rework, Post-Cleaning, and Pre‑Conformal
Coating

+-------------------+------------+------------+----------+------------+
| Drying            | Minimum    |            |          |            |
|                   | Bake-Out   |            |          |            |
| Process           | Time       |            |          |            |
|                   | (hours)^1^ |            |          |            |
+-------------------+------------+------------+----------+------------+
|                   | +66°C      | +90°C      | +100°C   | +125°C     |
|                   | (+151°F)   | (+194°F)   | (+212°F) | (+257°F)   |
+-------------------+------------+------------+----------+------------+
| Recirculating     | 6          | 4          | 2        | 1.5 ^3^    |
| Oven              |            |            |          |            |
+-------------------+------------+------------+----------+------------+
| Vacuum Oven ^2^   | 2.5        | 2          | 1.5      | 1 ^3^      |
+-------------------+------------+------------+----------+------------+
| Notes:            |            |            |          |            |
|                   |            |            |          |            |
| 1\. Times         |            |            |          |            |
| specified are     |            |            |          |            |
| recommendations.  |            |            |          |            |
| Actual drying     |            |            |          |            |
| time may be       |            |            |          |            |
| affected by board |            |            |          |            |
| assembly type,    |            |            |          |            |
| component         |            |            |          |            |
| technology (PTH / |            |            |          |            |
| SMT / COB, etc.), |            |            |          |            |
| PWA population    |            |            |          |            |
| density, layer    |            |            |          |            |
| count,            |            |            |          |            |
| ground/power      |            |            |          |            |
| plane(s), PWB     |            |            |          |            |
| thickness, via    |            |            |          |            |
| aspect ratio,     |            |            |          |            |
| cleaning method,  |            |            |          |            |
| cleanliness       |            |            |          |            |
| verification      |            |            |          |            |
| method, or other  |            |            |          |            |
| conditions.       |            |            |          |            |
|                   |            |            |          |            |
| 2\. Vacuum Oven   |            |            |          |            |
|                   |            |            |          |            |
| a\. Chamber       |            |            |          |            |
| pressure: 3 torr  |            |            |          |            |
| / 3 mm mercury    |            |            |          |            |
| (Hg).             |            |            |          |            |
|                   |            |            |          |            |
| b\. All gaskets,  |            |            |          |            |
| seals, or other   |            |            |          |            |
| non-metallic      |            |            |          |            |
| products in       |            |            |          |            |
| vacuum ovens      |            |            |          |            |
| shall be verified |            |            |          |            |
| to be of          |            |            |          |            |
| sulfur-free       |            |            |          |            |
| compounds         |            |            |          |            |
| (Requirement).    |            |            |          |            |
|                   |            |            |          |            |
| 3\. Long-term (≥  |            |            |          |            |
| 24 hrs            |            |            |          |            |
| cumulative)       |            |            |          |            |
| bake-out at       |            |            |          |            |
| +125°C (+257°F)   |            |            |          |            |
| is prohibited,    |            |            |          |            |
| unless specified  |            |            |          |            |
| by engineering    |            |            |          |            |
| documentation     |            |            |          |            |
| (Requirement).    |            |            |          |            |
| Elevated          |            |            |          |            |
| temperature       |            |            |          |            |
| bake-out may      |            |            |          |            |
| degrade the       |            |            |          |            |
| laminate and      |            |            |          |            |
| components.       |            |            |          |            |
|                   |            |            |          |            |
| 4\. Thermal ramp  |            |            |          |            |
| rates shall not   |            |            |          |            |
| exceed the        |            |            |          |            |
| following, unless |            |            |          |            |
| specified by      |            |            |          |            |
| engineering       |            |            |          |            |
| documentation:    |            |            |          |            |
|                   |            |            |          |            |
| a\. Ramp-up: +4°C |            |            |          |            |
| / sec. (+7°F /    |            |            |          |            |
| sec.)             |            |            |          |            |
| (*Requirement*)   |            |            |          |            |
|                   |            |            |          |            |
| b\. Ramp-down:    |            |            |          |            |
| -6°C / sec.       |            |            |          |            |
| (-10°F / sec.)    |            |            |          |            |
| (*Requirement*)   |            |            |          |            |
|                   |            |            |          |            |
| 5\. A dry         |            |            |          |            |
| nitrogen          |            |            |          |            |
| blanket/purge is  |            |            |          |            |
| recommended to    |            |            |          |            |
| limit the         |            |            |          |            |
| formation of      |            |            |          |            |
| oxidation on      |            |            |          |            |
| solderable        |            |            |          |            |
| surfaces and to   |            |            |          |            |
| accelerate        |            |            |          |            |
| drying. Bake-out  |            |            |          |            |
| at temperatures   |            |            |          |            |
| in excess of      |            |            |          |            |
| +90°C (+194°F)    |            |            |          |            |
| should not exceed |            |            |          |            |
| 48 hours          |            |            |          |            |
| cumulative,       |            |            |          |            |
| unless specified  |            |            |          |            |
| by engineering    |            |            |          |            |
| documentation.    |            |            |          |            |
+-------------------+------------+------------+----------+------------+

8.3.2 Re-Priming Requirements. Most primers are effective only for a
specified period of time with well-protected storage. If, after priming,
subsequent conformal coating has not been applied within the
manufacturer's recommended elapsed time, re-priming is mandatory
(Requirement).

CAUTION: SOME SURFACE PRIMERS WILL DAMAGE CERTAIN TYPES OF MATERIALS.
REFER TO MANUFACTURERS' SPECIFICATIONS FOR THE SPECIFIC TYPE OF SURFACE
PRIMER RECOMMENDED FOR USE.

## Material Preparation

8.4.1 Preparation

8.4.1.1 Polymeric materials shall be mixed and prepared according to the
manufacturer's instructions or the appropriate process document
(*Requirement)*.

8.4.1.2 It shall be verified, prior to usage, that materials have not
exceeded their shelf life (*Requirement)*.

8.4.2 Single-Component Materials. Materials that are supplied as a
single part may require stirring because of settling of fillers or other
ingredients in the system. Stirring shall be carefully conducted to
minimize entrapped air (*Requirement)*. High-solid materials or
high-viscosity materials may be deaerated to remove entrapped air. Be
aware of the possibility of losing the volatile ingredients during the
deaeration process.

8.4.3 Multicomponent Materials.

8.4.3.1 Multicomponent materials shall be thoroughly mixed until the
mixture is smooth and homogeneous and shall be used within the working
life limit (*Requirement)*.

8.4.3.2 Mixing shall be carefully conducted to minimize entrapped air
(*Requirement)*. High-solid materials or high-viscosity materials may be
deaerated to remove entrapped air. Be aware of the possibility of losing
the volatile ingredients during the deaeration process.

8.4.4 Fillers. Fillers shall be free of moisture (*Requirement)*. A bake
of at least 4 hours at 100^O^C ± 10^O^C (212ºC ± 18ºC) is suitable for
demoisturizing fillers.

8.4.5 Mixing. Mixing shall be carefully conducted to minimize entrapped
air (*Requirement)*. High-solid materials or high-viscosity materials
may be deaerated to remove trapped air. Be aware of the possibility of
losing the volatile ingredients, if any, in the deaeration process.

8.4.6 Mix Record.

8.4.6.1 A record of each mix batch date and procedure shall be
maintained (*Requirement)*. The mix record shall, as a minimum, include:

a\. Hardware traceability identifier (*Requirement)*

b\. Materials used (including manufacturer, part number, traceability
code, expiration date) (*Requirement)*

c\. The mix ratio (*Requirement)*

d\. Ambient conditions (temperature, humidity) (*Requirement)*

e\. Time mixed (*Requirement)*

f\. Working life (*Requirement)*

g\. Date (*Requirement)*

h\. Operator (*Requirement)*

i\. Quality assurance inspector (*Requirement)*

j\. Test specimen acceptance test results (*Requirement)*

k\. Manufacturer datasheet range for hardness (*Requirement)*

l\. Any special allowances (*Requirement)*.

8.4.6.2 The mix record shall be traceable to the test specimen by serial
number or other unique identifier as they may be stored separately
(*Requirement)*.

8.4.7 Spray Applications.

8.4.7.1 In spray applications, viscosity of conformal coatings shall be
closely observed and controlled by adding solvents as necessary to
preserve the best sprayable viscosity (*Requirement)*.

8.4.7.2 Solvent addition shall not be used to extend the working life of
the material (*Requirement)*.

8.4.8 Containers.

8.4.8.1 In all mixing operations, nonabsorbent plastic, glass, or metal
containers and stirrers shall be used (*Requirement)*.

8.4.8.2 Containers with seams and crevices that will trap unmixed
materials shall not be used (*Requirement)*.

8.4.8.3 The stirrer and container combination shall not introduce
contamination to the mix (i.e., from metal stirrers scraping the inside
of the container, from coatings dissolving from the inside of the
container, or from containers supplied with powdered surfaces)
(*Requirement)*.

8.4.9 Material Condition.

8.4.9.1 Materials shall not be used that exhibit any evidence of
excessive crystallization, surface skinning, or gelling (*Requirement)*.

8.4.9.2 The manufacturer's recommendations shall be followed regarding
crystallization and residue on the bottom of the container
(*Requirement)*.

8.4.10 Silicones.

8.4.10.1 All silicone operations shall be segregated from other material
operations (*Requirement)*.

8.4.10.2 Equipment and workspace used for measuring viscosity, mixing,
curing, and applying silicone materials shall not be used for preparing
or applying other materials (See 6.4) (*Requirement)*.

8.4.11 Working Life. The working life (pot life) of the material shall
begin immediately after mixing (*Requirement)*.

## Test Specimen

8.5.1 A test specimen shall be prepared and maintained for each mixed
batch (*Requirement)*.

8.5.2 The test specimen shall be prepared just prior to or at the same
time, and under the same conditions as the PWA, and be of a size that is
compatible with the test equipment and methods required (*Requirement)*.

8.5.3 The dwell time required to fully cure the test specimen may be
different than that used for the PWA if it is material that is being
used for a conformal coating or bonding application. This test specimen
shall be tested in accordance with ASTM 2240 and shall meet the
manufacturer's specified hardness range (*Requirement)*.

8.5.4 Acceptance of the test specimen shall be indicated on the mix
record (*Requirement)*.

8.5.5 Preparation and test of the test specimen may be performed prior
to its use on the final assembly or may be done in parallel with use of
the material on the final assembly. The former is preferred in order to
avoid risk associated with non-compliant material. Hardness testing is
not a requirement for conformal coating materials.

8.5.6 The test specimen shall be identified and stored under controlled
conditions of paragraph 6.3.1 (*Requirement)*.

8.5.7 Test specimens shall be maintained for the period specified by the
contract or in-house project requirements (*Requirement)*.

8.5.8 A test specimen is not required for vacuum deposited coating
materials. Cure verification for vacuum deposited coating materials
shall be done using the conformal coating test specimen (see paragraph
8.6) (*Requirement)*.

## Conformal Coating Specimens

8.6.1 A conformal coating specimen shall be coated concurrently with the
regular PWA for the purposes of assessing coating cure and/or thickness
(*Requirement)*.

8.6.2 The conformal coating specimen shall be used for tests and
analyses to avoid damage or destruction of the production boards
(*Requirement)*.

8.6.3 Each conformal coating specimen shall be traceable to its PWA.

# STAKING

## Requirements

9.1.1 Application Sequence. Staking shall be performed prior to
conformal coating unless it is specifically stated otherwise on the
engineering documentation (*Requirement)*.

9.1.2 Application.

9.1.2.1 Staking material shall be applied to the parts and areas
specified by the approved engineering documentation (*Requirement)*.
Spatulas and syringes, with or without pressure-control pneumatic
dispensers, may be used to apply the material.

9.1.2.2 Staking material shall adhere to all surfaces to be joined
(*Requirement)*.

9.1.2.3 Some typical staking methods are shown in Figures 9-1 through
9-13. The dimensions in Figures 9-1 through 9-13 are default
requirements in the absence of requirements in the engineering
documentation.

9.1.2.4 Staking material shall not be allowed to bridge between the
bottom of ceramic-bodied DIPs or surface mounted parts and the PWB
(*Requirement)*.

9.1.3 Staking Concerns. When staking, the following shall be assured:

a\. The staking compound does not negate stress relief of parts and
enclose joints, part leads, or mechanically compromise the reliability
of the hardware (*Requirement)*.

b\. Staking material is free from contamination (*Requirement)*.

c\. Glass-bodied parts are covered with resilient material prior to
staking with rigid material, such as epoxy (*Requirement)*.

d\. Fastener thread lubricant, if used, is controlled so that it does
not inhibit adhesion of the staking (*Requirement)*.

e\. Staking material does not enter the inside of mounting holes or
cover vent holes (*Requirement)*.

9.1.4 Mandatory Staking.

9.1.4.1 All required staking shall be detailed on the engineering
documentation (*Requirement)*.

9.1.4.2 Jumper wires in excess of 2.54 cm (1 inch) and axial leaded
tantalum capacitors of all case sizes shall be staked.

9.1.4.3 If parts are identified to be staked but staking location or
staking dimensions are not specified on the engineering documentation,
the following shall be used as default criteria:

a\. Axial leaded component, sleeveless (See Fig. 9-1):

i\. Fillet location: between the board and the length of the body
(*Requirement)*

ii\. Fillet length ≥ 50% of the body length (*Requirement)*

iii\. Fillet height ≥ 25% and ≤ 50% of the body diameter (*Requirement)*

iv\. The top of the component is visible for its entire length
(*Requirement)*.

b\. Axial leaded component, sleeved (See Fig. 9-2):

i\. Fillet location: between the board and end faces of the body
(*Requirement)*

ii\. Fillet height ≥ 25% and ≤ 50% of the body diameter, fillet does not
enclose the lead, negate stress relief, or contact the lead seal
(*Requirement)*.

c\. Jumper wires (See Fig. 8):

i\. Fillet location: at intervals of 2.54 cm (1 inch) maximum and at
every change of direction beyond the radius of curvature for a radius
bend that is shorter than 2.54 cm (1 inch) (*Requirement)*.

ii\. Be in contact around the full circumference of the wire and in
contact with the board (*Requirement)*.

d\. TO-type packages (See Fig. 9-5):

i\. At least three fillets, spaced approximately evenly around the
periphery of the component (*Requirement)*.

ii\. Fillet height: ≥25%, extension over the top of the part is
controlled by clearance requirements at the next higher level of
assembly (*Requirement)*.

iii\. Slight flow under the part is allowed however staking shall not
contact lead seals or the solder joint (*Requirement)*.

e\. Radial-leaded square or rectangular packages (See Figs. 9-3, 9-4,
9-6)

i\. Staking shall be used at each corner (*Requirement)*.

ii\. Fillet height: ≥ 25%, extension over the top of the part is
controlled by clearance requirements at the next higher level of
assembly (*Requirement)*.

iii\. Slight flow under the part is allowed however staking shall not
contact lead seals or the solder joint (*Requirement)*.

iv\. Surface mount area array packages require engineering analysis and
design instructions to address all necessary polymeric applications and
acceptance criteria (*Requirement)*.

f\. Radial-leaded component whose longest dimension is its height

i\. Fillet required on both sides, fillet height: ≥ 50% to 100%, fillet
width: ≥ 50% (*Requirement)*

ii\. Slight flow under the part is allowed however staking shall not
contact lead seals or the solder joint (*Requirement)*.

iii\. When in an array of between two and four devices:

\(1\) Staking material shall cover the entire width of the part on the
top and ≥ 50% the width on the end parts (*Requirement)*.

\(2\) The top inner surfaces shall be bonded to each other for at least
50% of the components' width (*Requirement)*.

iv\. When in an array of greater than four devices, both outer side
surfaces of every other part shall contain a fillet to the board ≥50% to
100% of the height of the part (*Requirement)*. (See Fig. 9-4).

g\. Wire bundles. (See Figs. 9-7, 9-8) Width of staking stripe shall be
a minimum of 1x the diameter of the bundle (*Requirement)*.

9.1.5 Curing.

9.1.5.1 Staking material shall be cured in accordance with the
manufacturer's recommended cure schedule or as specified in the
engineering documentation (*Requirement)*.

9.1.5.2 Staking material shall be tack-free when cured (*Requirement)*.

![](media/image2.png){width="4.5152777777777775in" height="2.975in"}

Fillet Length: ≥50%L to 100%L

Fillet Height: ≥25%d to 50%d

Top of component is visible for its entire length.

[]{#__RefHeading___Toc192295523 .anchor}Figure 9‑1: Typical Staking for
Horizontally-Mounted Sleeveless Cylindrical Part

![](media/image3.wmf){width="3.9381944444444446in"
height="3.138888888888889in"}

Staking is in contact with both end faces of the component.

Fillet Height: ≥25%d to 50%d and does not enclose the lead, negate
stress relief, or contact the lead seal.

[]{#__RefHeading___Toc192295524 .anchor}Figure 9‑2: Typical Staking for
Horizontally-Mounted Sleeved Cylindrical Parts

![](media/image4.png){width="3.8944444444444444in"
height="3.1194444444444445in"}

Fillet Height: ≥50% H to 100% H

Fillet Width: ≥50% W

Slight flow underneath component, but fillets do not contact lead seals
or solder termination.

[]{#__RefHeading___Toc192295525 .anchor}Figure 9‑3: Typical Staking of a
Single Vertically-Mounted Rectangular Part

![](media/image5.jpeg){width="5.146527777777778in"
height="2.8222222222222224in"}

Two outside ends -- Fillet Height: ≥50% H to 100% H

End Fillet : ≥50% W

Inner surfaces: Fillet is in contact with both surfaces for 100% of
component

[]{#__RefHeading___Toc192295526 .anchor}Figure 9‑4: Typical Staking for
an Array of Vertically-Mounted Rectangular Parts

![](media/image6.jpeg){width="5.53125in" height="3.2243055555555555in"}

At least three fillets spaced approximately evenly around periphery of
the component.

Fillet Height: ≥25% to 100% of the component body height

Slight flow underneath component, but fillets do not contact lead seals
or solder termination

[]{#__RefHeading___Toc192295527 .anchor}Figure 9‑5: Staking for Radial
Lead Components

![](media/image7.jpeg){width="5.770833333333333in"
height="2.1944444444444446in"}

Fillets on all four corners.

Fillet Height: ≥25% to 100% of the component body height

Slight flow underneath component, but fillets do not contact lead seals
or solder termination

[]{#__RefHeading___Toc192295528 .anchor}Figure 9‑6: Staking for Radial
Multi-lead Rectangular Components

![](media/image8.wmf){width="4.304166666666666in"
height="4.853472222222222in"}

[]{#__RefHeading___Toc192295529 .anchor}Figure 9‑7: Wire Bundle Staking

![](media/image9.jpeg){width="4.895833333333333in"
height="1.6743055555555555in"}

[]{#__RefHeading___Toc192295530 .anchor}Figure 9‑8: Single Wire Staking

![](media/image10.wmf){width="6.3381944444444445in" height="5.9in"}

[]{#__RefHeading___Toc192295531 .anchor}Figure 9‑9: Toroid Staking

![](media/image11.wmf){width="6.497222222222222in" height="5.63125in"}

[]{#__RefHeading___Toc192295532 .anchor}Figure 9‑10: Vibration Isolation
Staking

## Fastener Staking

9.2.1 General Requirements. The requirements in this section apply only
to fasteners on PWAs and are not applicable to structural applications.

9.2.1.1 The staking material used for fastener locking or torque
striping shall have good adhesion and no evidence of separation or
delamination from the bolt, screw, or washer/nut and the adjacent
surfaces (*Requirement)*.

9.2.1.2 There shall be no contaminants, voids, or air bubbles larger
than 0.635 mm (0.025inch) in diameter (*Requirement)*.

9.2.1.3 There shall be no material spillage or residue on adjacent
surfaces (*Requirement)*.

9.2.2. Fastener Staking Application Requirements

9.2.2.1 Staking is applied to the head of the fastener unless otherwise
directed by the engineering documentation (*Requirement)*.

9.2.2.2 When the engineering documentation specifies that polymeric
material be added to the screw threads, a QA witness shall confirm
proper application (*Requirement)*.

9.2.2.3 There shall be no evidence that the staking material has been
fractured or disturbed at any time after the staking work was completed
(*Requirement)*.

9.2.2.4 If a nut is part of the fastener combination, the nut shall be
spot staked to the bolt and the assembly in one or two places such that
25 percent to 50 percent of the circumference of the nut is covered.
Staking of the bolt head is optional (*Requirement)*.

9.2.2.5 The staking material shall not enter the internal drive (impede
removal of the bolt or screw). (See Figure 9-11) (*Requirement)*

9.2.2.6 If a nut is not used, bolt heads and screw heads shall have 25
percent to 50 percent of the heads' circumference covered with staking
(*Requirement)*.

![](media/image12.wmf){width="1.2098425196850393in"
height="2.040944881889764in"}![](media/image13.wmf){width="1.2437007874015749in"
height="2.039763779527559in"}![](media/image14.wmf){width="1.3220472440944881in"
height="2.1251968503937007in"}

[]{#__RefHeading___Toc192295533 .anchor}Figure 9‑11: Locking of Screws
and Bolts with Nuts

[]{#__RefHeading___Toc192295534 .anchor}Figure 9‑12: Thread Locking of
Blind Screw

9.2.3. Fastener Thread Locking

9.2.3.1 Fastener thread locking shall be inspected during the process
(*Requirement)*.

9.2.3.2 If the application includes a blind hole, a vent hole shall be
provided for polymer squeeze-out. (See Figure 9-12) (*Requirement)*

## Torque Striping

(See Figure 9-13)

9.3.1 Torque Striping Application Requirements

9.3.1.1 When used, torque striping shall be applied from the center of
the screw or bolt head to at least 3.2 mm (0.126 inch) onto the
substrate (*Requirement)*.

9.3.1.2 There shall be no evidence that the torque striping material has
been fractured or tampered with at any time after the work is completed
(*Requirement).*

9.3.1.3 Torque striping material shall not be removed without the
expressed approval by the Project or the Quality Engineer
(*Requirement)*.

[]{#__RefHeading___Toc192295535 .anchor}Figure 9‑13: Torque Striping
Methods

# CONFORMAL COATING

## Purpose

Conformal coatings are intended to provide electrical insulation and
environmental protection thus minimizing the performance degradation to
electronic PWAs by humidity, handling, debris, and contamination.
Conformal coating materials may include solvents (diluents), fillers,
and catalysts and/or accelerators, in addition to the basic resin.
Conformal coating is applied by spraying, brushing, dipping, or vacuum
deposition methods and then allowed to cure to provide a uniform,
continuous coating over the surface of the PWA or electronic assembly.
Vacuum deposition methods involve processes, equipment, and materials
that are departures from those applicable to the other application
methods. Staking shall be performed prior to conformal coating unless it
is specifically stated otherwise on the engineering documentation
(*Requirement)*.

##  Conformal Coating Application

10.2.1 The PWAs shall be cleaned and demoisturized within 8 hours before
conformal coating (*Requirement)*.

10.2.2 Demoisturizing shall be defined on the engineering documentation
(*Requirement)*. Demoisturizing may be accomplished by an oven bake or
by a vacuum bake as described in Table 8-1.

10.2.3 The time in and out of the oven or chamber and the temperature
shall be recorded (*Requirement)*.

10.2.4 Conformal coating shall be applied using a method that will yield
the intended coverage without excessive filleting or runs
(*Requirement)*. Common coating application methods include spraying,
brushing, dipping, or a combination thereof. Chemical Vapor Deposition
(CVD) is the process used for paraxylene.

a\. Spraying.

\(i\) The conformal coatings shall be sprayed onto the PWA using clean
dry gas at a pressure sufficient to provide proper atomization
(*Requirement)*.

\(ii\) One pass shall be sprayed across the entire surface of the PWA
holding the spray gun at an angle of approximately 45° to the PWA
(*Requirement)*.

\(iii\) The PWA shall be rotated 90° after each pass, and spraying
repeated, so that all four directions are sprayed. See Figure 10-1
(*Requirement)*.

b\. Brushing.

\(i\) The material shall be evenly applied without forming excessive
fillets and thick areas (*Requirement)*.

\(ii\) Particular attention shall be paid to undersides of parts and
lead wires (*Requirement)*.

\(iii\) The brush selected shall provide adequate control for
appropriate coverage, be cleaned in a non-reactive solvent, and be
thoroughly dried before use (*Requirement)*.

c\. Dipping.

\(i\) The entire PWA shall be dipped (*Requirement)*. The extraction
rate ensures uniform thickness.

\(ii\) The conformal coated PWA shall be allowed to drain until the
conformal coating stops running and minimum part filleting is achieved
(*Requirement)*.

d\. Vacuum Deposition.

\(i\) Paraxylene conformal coating shall be applied using a special
vacuum deposition chamber (*Requirement)*.

\(ii\) The conformal coating shall be thin, uniform, and fillet free
(*Requirement)*.

![](media/image15.png){width="6.407638888888889in"
height="2.363888888888889in"}

[]{#__RefHeading___Toc192295536 .anchor}Figure 10‑14: Spray Application

10.2.5 Thickness Measurements. Thickness measurements shall be applied
to the final cured thickness on conformal coating specimens
(*Requirement)*. An in-process wet film thickness measurement may be
used so that the final cured thickness meets the values in Table 10-1.

a\. Excessive Coating Removal. Excessive coating shall be removed prior
to cure (*Requirement)*.

b\. Thickness requirement for brush coatings. The variances of brushed
coating thicknesses may be outside of the limits given in Table 10-1.
See engineering documentation for thickness requirements for brushed
coatings.

[]{#__RefHeading___Toc190058047 .anchor}Table 10‑4: Conformal Coating
Thickness

+-----------------------------------+-----------------------------------+
| Type of Coating                   | Cured Coating \[mm (inch)\]       |
+-----------------------------------+-----------------------------------+
| ACRYLIC                           | 0.025 -- 0.127 (0.001 to 0.005)   |
|                                   |                                   |
| URETHANE                          | 0.076 -- 0.127 (0.003 to 0.005)   |
|                                   |                                   |
| EPOXY                             | 0.025 -- 0.127 (0.001 to 0.005)   |
|                                   |                                   |
| SILICONE                          | 0.051 -- 0.203 (0.002 to 0.008)   |
|                                   |                                   |
| PARAXYLENE                        | 0.013 -- 0.051 (0.0005 to 0.002)  |
+-----------------------------------+-----------------------------------+

10.2.6 Pre-Cure Examination. Immediately after material application, the
uncured conformal coating shall be examined for:

a\. Bubbles and Air Entrapments. Prior to cure, bubbles and air
entrapments shall be broken using locally qualified methods such as
piercing with a sharp probe or by vacuum methods (*Requirement)*.

b\. Bridging. Conformal coating material shall not be allowed to bridge
between the bottom of a leaded surface mount device and the PWB, or
between the part lead and the PWB, thereby negating stress relief
(*Requirement)*.

10.2.7 Post Cure Examination. After the cure cycle, the conformally
coated PWA shall be examined to assure that the following conditions are
met. See Figure 10-2 through Figure 10-5 for additional requirements.

a\. Conformal coating is uniform in color, thickness, and texture,
tack-free, and shows proper adhesion to all coated surfaces
(*Requirement)*.

b\. Conformal coating covers all areas as specified on the engineering
documentation, has a smooth continuous surface, and follows the contours
of the PWA (*Requirement)*. Minor pull back from sharp points and edges
is permissible unless otherwise specified on engineering documentation.

c\. Conformal coating is free from contamination (*Requirement)*.

d\. Terminals are conformal coating encapsulated, including the
insulation gap of the wire, unless there is a solder ball type
connection (as in a high voltage connection) (*Requirement)*. This is
normally applied with a brush after the initial conformal coating
application.

e\. Conformal coating may bridge between adjacent part leads providing
stress reliefs are not negated.

f\. Conformal coating does not exhibit discoloration (due to such things
as excessive curing oven temperature or contamination) (*Requirement)*.

10.2.8 When fluorescent conformal coating materials are used, coverage
and location shall be verified by Ultraviolet (UV) light illumination.

##  Curing

10.3.1 Cure Schedule. The conformal coating material shall be cured in
accordance with a specified cure schedule that is compatible with the
thermal limitations of the hardware and results in a tack-free finish
(*Requirement)*.

10.3.2 Multiple Conformal Coatings. When multiple conformal coatings of
the same material are employed, each layer may be partially cured before
the next layer is applied.

10.3.3 Curing Silicones. Ovens used for curing silicones shall not be
used for curing other materials (*Requirement)*.

10.3.4 Handling and Storage. After application of the polymeric
material, particularly when the material is still wet and tacky (during
curing cycle), hardware shall be handled and stored in a manner that
minimizes exposure to contamination or handling damage (*Requirement)*.

## Cleanup

After the conformal coating process has been completed, the PWAs shall
be cleaned to remove any maskant, loose debris, or material that may
damage or degrade its performance (*Requirement)*.

## Touchup/Rework

10.5.1 Conformally coated assemblies shall be touched up to correct
coating coverage deficiencies (*Requirement)*.

10.5.2 Touched up areas shall meet the minimum thickness requirement of
Table 10-1, but may exceed the maximum thickness limit (*Requirement)*.

10.5.3 Removal and replacement of conformal coating is considered rework
and the procedures shall be documented (*Requirement)*.

+-----------------------------------+-----------------------------------+
| ![](media/image16.                | PREFERRED                         |
| jpeg){width="2.935416666666667in" |                                   |
| height="1.9in"}                   | Completed uniform coverage with   |
|                                   | no visual bubbles.                |
+-----------------------------------+-----------------------------------+
| ![](media/image17.                | ACCEPTABLE                        |
| wmf){width="2.8756944444444446in" |                                   |
| height="1.8666666666666667in"}    | Small bubbles, but they do not    |
|                                   | bridge between non-common         |
|                                   | conductors, expose a bare         |
|                                   | conductor surface, or exceed      |
|                                   | 0.76mm (0.03 inch) in any         |
|                                   | dimension.                        |
+-----------------------------------+-----------------------------------+
| ![](media/image18.j               | UNACCEPTABLE                      |
| peg){width="2.8979166666666667in" |                                   |
| height="1.261111111111111in"}     | Excessive bubbling                |
+-----------------------------------+-----------------------------------+

[]{#__RefHeading___Toc192295537 .anchor}Figure 10‑15: Conformal Coating
-- Bubbles

+----------------------------------------+-----------------------------+
| ![](media/imag                         | PREFERRED                   |
| e19.jpeg){width="3.2784722222222222in" |                             |
| height="2.026388888888889in"}          | No defects.                 |
+----------------------------------------+-----------------------------+
| ![](media/imag                         | ACCEPTABLE                  |
| e20.jpeg){width="3.2784722222222222in" |                             |
| height="2.751388888888889in"}          | Scratch does not expose any |
|                                        | conductive area.            |
+----------------------------------------+-----------------------------+
| ![](media/imag                         | UNACCEPTABLE                |
| e21.jpeg){width="3.3854166666666665in" |                             |
| height="1.9902777777777778in"}         | Scratch exposes conductive  |
|                                        | areas.                      |
+----------------------------------------+-----------------------------+

[]{#__RefHeading___Toc192295538 .anchor}Figure 10‑16: Conformal Coating
-- Scratches

+-----------------------------------+----------------------------------+
| ![](media/image22.j               | PREFERRED                        |
| peg){width="2.7777777777777777in" |                                  |
| height="2.161111111111111in"}     | Uniform color, texture, and      |
|                                   | thickness with apparent good     |
|                                   | adhesion on parts and board      |
|                                   | surface. The coating should show |
|                                   | uniform fluorescence under a     |
|                                   |                                  |
|                                   | UV light.                        |
+-----------------------------------+----------------------------------+
| ![](media/image23.                | ACCEPTABLE                       |
| jpeg){width="2.777083333333333in" |                                  |
| height="1.5631944444444446in"}    | Some evidence of variation in    |
|                                   | coating thickness. Minor lifting |
|                                   | on nonconductive areas.          |
+-----------------------------------+----------------------------------+
| ![](media/image24.j               | UNACCEPTABLE                     |
| peg){width="2.8958333333333335in" |                                  |
| height="1.7875in"}                | Excessive lifting and peeling    |
|                                   | indicating improper surface      |
|                                   | cleaning or excessive thickness. |
|                                   | Any lifting on conductive areas  |
|                                   | is nonconforming.                |
+-----------------------------------+----------------------------------+

[]{#__RefHeading___Toc192295539 .anchor}Figure 10‑17: Conformal
Coating - Lifting and Peeling

+------------------------------------------+---------------------------+
| ![](media/im                             | ACCEPTABLE                |
| age25.jpeg){width="3.6444444444444444in" |                           |
| height="1.8965277777777778in"}           | Not to exceed 5 percent   |
|                                          | of PWB surface area.      |
| Conformal Coating -- Runs                |                           |
|                                          | [Runs]{.underline}        |
+------------------------------------------+---------------------------+
| ![](media/i                              | ACCEPTABLE                |
| mage26.jpeg){width="3.296527777777778in" |                           |
| height="2.560416666666667in"}            | Not to exceed 5 percent   |
|                                          | of PWB surface area.      |
| Conformal Coating -- Fish Eyes           |                           |
|                                          | [Fish Eyes]{.underline}   |
+------------------------------------------+---------------------------+
| Conformal Coating --                     | UNACCEPTABLE              |
| Dewetting![](media/im                    |                           |
| age27.jpeg){width="3.3777777777777778in" | Loss of adhesion.         |
| height="1.8159722222222223in"}           |                           |
+------------------------------------------+---------------------------+

[]{#__RefHeading___Toc192295540 .anchor}Figure 10‑5: Conformal Coating
-- Coverage Defects

# BONDING

## General

Bonding provides a method for joining surfaces of parts or materials
using a polymer rather than fasteners.

## Bonding

11.2.1 Surface Preparation. Surfaces being bonded shall be cleaned and
prepared in such a manner as to achieve an acceptable bond between the
surface and the adhesive (*Requirement)*. When cleaning and priming
surfaces, as required, masking may be needed to prevent contamination of
adjacent surfaces.

11.2.2 Requirements.

a\. Markings shall be clearly visible after completion of bonding
processes unless otherwise allowed by the engineering documentation
(i.e., dead-bugged parts) (*Requirement)*.

b\. The bonding material shall adhere to all surfaces to be joined
(*Requirement)*.

c\. For thermistors, PRT, and similar components, at least one lead
shall not be embedded in the bonding material (*Requirement)*.

\(i\) The leads of these types of components shall be staked in
accordance with the wire run rules in section 9.1.4.3.c above
(*Requirement)*.

d\. Squeeze-out shall be visible on all sides unless sheet adhesive is
used (*Requirement)*. Squeeze-out should be kept to a minimum while
providing enough to confirm via visual inspection.

e\. For thermal joints, bond line control and coverage shall be per the
engineering documentation and verified by engineering prior to use
(*Requirement)*.

f\. Figure 11-1 shows some examples of acceptable and unacceptable
bonding.

11.2.3 Order of Operations. Bonding shall be performed before conformal
coating (*Requirement)*.

+------------------------------------------------+---------------------+
| ![](me                                         | ACCEPTABLE          |
| dia/image28.jpeg){width="3.7881944444444446in" |                     |
| height="2.661111111111111in"}                  | Markings shall be   |
|                                                | clearly visible.    |
|                                                |                     |
|                                                | For thermistors,    |
|                                                | platinum resistance |
|                                                | thermometers (PRT), |
|                                                | and similar         |
|                                                | components, at      |
|                                                | least one lead      |
|                                                | shall be free of    |
|                                                | the bonding         |
|                                                | material.           |
+------------------------------------------------+---------------------+
| ![](me                                         | UNACCEPTABLE        |
| dia/image29.jpeg){width="3.7756944444444445in" |                     |
| height="2.310416666666667in"}                  | Excess bonding      |
|                                                | material applied    |
+------------------------------------------------+---------------------+
| ![](me                                         | UNACCEPTABLE        |
| dia/image30.jpeg){width="3.8680555555555554in" |                     |
| height="2.0381944444444446in"}                 | Excess bonding      |
|                                                | material applied,   |
|                                                | squeeze-out negates |
|                                                | stress relief.      |
+------------------------------------------------+---------------------+

[]{#__RefHeading___Toc192295541 .anchor}Figure 11‑18: Component
Bonding - Excess Bonding Material

#  ENCAPSULATION

## General

The purpose of encapsulation is to protect the component or assembly
against damage and deterioration from electrical, thermal, mechanical,
and space environment stresses under service conditions.

12.1.1 Vacuum Degassing.

12.1.1.1 Encapsulation material shall be vacuum degassed before
application (*Requirement)*.

12.1.1.2 Engineering documentation shall specify when vacuum-degassing
is also required after application or if it is not appropriate
(*Requirement)*.

## Pre-cure Examination

12.2.1 The item to be encapsulated shall be free of contamination or
residual solvents (*Requirement)*.

12.2.2 Masking should be used to minimize material adhesion to the
exterior surfaces of the assembly.

12.2.3 When required, underfill of components prior to potting shall be
defined in the engineering documentation (*Requirement)*.

12.2.4 For high voltage applications, bubbles and/or pinholes shall not
be greater than 0.0254 mm (0.001 in) (*Requirement)*.

## Post-cure Examination

12.3.1 The encapsulation material shall be free from contamination
(*Requirement)*.

12.3.2 The encapsulation material shall fill the required areas
completely and shall adhere to all surfaces as intended (*Requirement)*.

12.3.3 Bubbles or pinholes shall be less than 0.635 mm (0.025 inch)
diameter (*Requirement)*.

12.3.4 Bubbles or a series of bubbles shall not form a continuous path
between two electrically conductive elements (*Requirement)*.

12.3.5 For high voltage applications, bubbles and/or pinholes shall not
be greater than 0.0254 mm (0.001 in) (*Requirement)*.

12.3.6 Potting material shall not be present on the exterior surfaces of
the encapsulation mold. (Small amount of spillage is allowed if it does
not interfere with mounting or markings) (*Requirement)*.

12.3.7 The encapsulation material shall be free of fracture lines and
cracks (*Requirement)*.

12.3.8 For connectors, the encapsulation material has concave fillets to
the encapsulated wires (*Requirement)*.

12.3.9 Pins and sockets shall be free of encapsulating material
(*Requirement)*.

+---------------------------------------+------------------------------+
| ![](media/image                       | ACCEPTABLE                   |
| 31.jpeg){width="3.0145833333333334in" |                              |
| height="2.25in"}                      | Wire Encapsulation           |
+---------------------------------------+------------------------------+
| ![](media/image                       | ACCEPTABLE                   |
| 32.jpeg){width="2.8944444444444444in" |                              |
| height="2.7395833333333335in"}        | Cable Encapsulation          |
+---------------------------------------+------------------------------+
| ![](media/image                       | UNACCEPTABLE                 |
| 33.jpeg){width="2.7958333333333334in" |                              |
| height="1.9944444444444445in"}        | Large void bridging          |
|                                       | conductors,                  |
|                                       |                              |
|                                       | Improper filling of          |
|                                       | embedding mold.              |
+---------------------------------------+------------------------------+

[]{#__RefHeading___Toc192295542 .anchor}Figure 12‑19: Encapsulating
Wires at Connector

+--------------------------------------------+-------------------------+
| ![](media                                  | ACCEPTABLE              |
| /image34.png){width="2.7895833333333333in" |                         |
| height="1.4895833333333333in"}             | Bubbles/Cavities        |
|                                            |                         |
|                                            | \<0.635mm\              |
|                                            | (\<0.025 inch diameter) |
+--------------------------------------------+-------------------------+
| ![](media                                  | UNACCEPTABLE            |
| /image35.png){width="2.5381944444444446in" |                         |
| height="1.354861111111111in"}              | Lack of adhesion        |
+--------------------------------------------+-------------------------+
| ![](media/image36.png){width="2.6625in"    | ACCEPTABLE              |
| height="1.4215277777777777in"}             |                         |
|                                            | Spillage                |
|                                            |                         |
|                                            | (A thin film is         |
|                                            | acceptable provided     |
|                                            | there is not an         |
|                                            | interference problem.)  |
+--------------------------------------------+-------------------------+
| ![](media/image37.png){width="2.6625in"    | UNACCEPTABLE            |
| height="1.4215277777777777in"}             |                         |
|                                            | Spillage                |
+--------------------------------------------+-------------------------+

[]{#__RefHeading___Toc192295543 .anchor}Figure 12‑20: Potting Concerns

## Potting Connectors used with Shielded Cable

12.4.1 When conductive epoxy is used in place of a connector back shell,
the epoxy shall provide electric conductivity between the connector
shell mounting and the cable shield (*Requirement)*.

12.4.2 All shielding wire end tips shall be captured by the encapsulant
to prevent loose wires from causing electrical shorts (*Requirement)*.

## Cleanup

Encapsulated assemblies shall be cleaned to remove any masking or
material that may damage or degrade their performance (*Requirement)*.

## Examples

The figures 12-1 & 12-2 represent some examples of acceptable and
unacceptable encapsulation.

#  QUALITY ASSURANCE

## General

13.1.1 Workmanship. Workmanship shall be of a level of quality adequate
to assure that the processed products meet the performance requirements
of the engineering documentation and the criteria delineated herein
(*Requirement)*.

13.1.2 Inspection.

13.1.2.1 Inspection for acceptability shall be performed on all uses of
staking, conformal coating, bonding and encapsulation on PWAs and
electronic assemblies to the requirements specified in this Standard
(*Requirement)*.

13.1.2.2 Parts and conductors shall not be physically disturbed to aid
inspection (*Requirement)*.

13.1.3 Quality Assurance. The following functions shall be performed:

a\. Verify that all tests, inspections, and measurements specified by
this standard have been performed (*Requirement)*.

b\. Verify that all personnel who stake, coat, bond, encapsulate, or
inspect hardware in accordance with this document have been trained and
certified as specified in Chapter 5 (*Requirement)*.

c\. Conduct in-process surveillance of all assembly operations to verify
that all processes and procedures implementing the requirements of this
document are current, approved, adequate, and being accurately utilized
(*Requirement)*.

d\. Verify that no damage exists on parts and PWBs prior to their being
staked, bonded, conformally coated, or encapsulated (*Requirement)*.

e\. Verify that the facility cleanliness, environmental conditions, and
lighting requirements of Chapter 6 are being met (*Requirement)*.

## Documentation Verification

Quality assurance personnel shall verify that all required documentation
is current and approved. The documentation shall include:

13.2.1 Records

a\. Results of the visual examination as per paragraph 5.2
(*Requirement)*.

b\. Evidence of operator and inspector certification as per paragraph
5.3 (*Requirement)*.

c\. Material purchase data as per paragraphs 6.6.3.a and b
(*Requirement)*.

d\. Mix record as per paragraph 8.4.6 (*Requirement)*.

e\. Test Specimen per paragraph 8.5 (*Requirement)*.

f\. Conformal coating specimen per paragraph 8.6 (*Requirement)*.

g\. Demoisturizing as per paragraph 10.2 (*Requirement)*.

13.2.2. Procedures

a\. Staking or conformal coating program as per paragraph 4.2
(*Requirement)*.

b\. Training and certification program as per paragraph 5.1
(*Requirement)*.

c\. Tooling and equipment operating procedures as per paragraph 6.5.l.e
(*Requirement)*.

d\. Calibration system as per paragraph 6.5.2 (*Requirement)*.

e\. In-process storage and handling procedures as per paragraph 6.8
(*Requirement)*.

f\. Cleaning procedures as per paragraph 7.1 (*Requirement)*.

## Documentation Authorization

Quality assurance personnel shall verify that the following
documentation has been approved by the procuring NASA Center prior to
implementation:

a\. Special engineering requirements as per paragraph 1.3
(*Requirement)*.

b\. Special processes, materials, or parts as per paragraph 4.1.3
(*Requirement)*.

c\. Special documents as per paragraph 4.1.3 (*Requirement)*.

d\. Departures from requirements as per paragraph 1.4 (*Requirement)*.

e\. Repairs as per paragraph 4.3 (*Requirement)*.

f\. Process documentation for special tools as per paragraph 6.5.3
(*Requirement)*.

g\. Staking and coating materials as per paragraph 6.6 (*Requirement)*.

h\. Special cleanliness test methods as per paragraph 7.2.1.c
(*Requirement)*.

## Verification of Tools, Equipment, and Materials

13.4.1 Tools and equipment. Tools and equipment shall be verified for
conformance to the applicable requirements found in paragraph 6.5
(*Requirement)*.

13.4.2 Materials.

13.4.2.1 Materials shall conform to the requirements of paragraph 4.5
(*Requirement)*.

13.4.2.2 Controls shall be implemented to assure that only approved and
conforming materials are used (*Requirement)*.

13.4.2.3 Materials not conforming or not required for the operations
involved shall be removed from the work areas or tagged non-usable
(*Requirement)*.

## General Inspection Methods for Polymeric Applications

13.5.1 Magnification Aids.

13.5.1.1 Requirements shall be verified by visual inspection using 1X to
l0X power magnification (*Requirement)*.

13.5.1.2 Inspection optics shall conform to the requirements of
paragraph 6.7 (*Requirement)*. Higher magnification may be used, as
necessary, to inspect suspected anomalies or defects.

13.5.2 Tackiness and Adhesion.

13.5.2.1 Gentle finger pressure or a plastic probe shall be used to
inspect for tackiness and adhesion (Requirement).

13.5.2.2 Lint-free gloves or finger cots shall be worn when finger
pressure is used (Requirement).

13.5.3 Hardness. When applicable, hardness shall be measured in
accordance with ASTM-D-2240 (Requirement).

## Acceptance/Rejection Criteria for Staking

13.6.1 Documentation. All acceptance and rejection criteria for staking
shall be clearly defined in the application processing document(s)
otherwise the criteria herein shall be the default (*Requirement)*.

13.6.2 Acceptance Criteria. Staked PWAs shall exhibit, as a minimum, the
following workmanship characteristics in order to be judged acceptable
(Reference Figures 9-1 through 9-9 for pictorial representations of some
of the requirements below):

a\. The staking material shall adhere to the intended surfaces as per
paragraph 4.5.1.c (*Requirement)*.

b\. Staking material meets the hardness requirement of paragraph 8.5.3
(*Requirement)*.

c\. Visual evidence shall indicate that the staking material was applied
prior to conformal coating per paragraph 9.1.1 (*Requirement)*.

d\. Staking material shall not be allowed to bridge between the bottom
of ceramic-bodied DIP's or surface mounted parts and the PWB per
paragraph 9.1.2 (*Requirement)*.

e\. The staking compound shall not negate stress relief of parts or
enclose joints or part leads per paragraph 9.1.3.a (*Requirement)*.

f\. The staking material shall be free from contamination as per
paragraph 9.1.3.b (*Requirement)*.

g\. Glass bodied parts shall be covered with resilient material prior to
staking with rigid material per paragraph 9.1.3.c (*Requirement)*.

h\. All axial lead solid slug tantalum capacitors shall be staked as per
paragraph 9.1.4 (*Requirement)*.

i\. When required to stake sleeveless axial leaded components: fillet is
between the board and the length of the body, fillet length ≥ 50 percent
of the body length, fillet height ≥ 25 percent and ≤ 50 percent of the
body diameter, and the top of the component is visible for its entire
length per paragraph 9.1.4.a (*Requirement)*.

j\. When required to stake sleeved axial leaded components: fillet is
between the board and the end faces of the body, fillet height ≥ 25
percent and ≤ 50 percent of the body diameter, fillet does not enclose
the lead, negate stress relief or contact the lead seal per paragraph
9.1.4.b (*Requirement)*.

k\. Jumper wires shall be staked a minimum of every 2.54 cm (1 inch)
maximum and at every change of direction beyond the radius of curvature
for a radius-bend that is shorter than 2.54 cm (1 inch) with staking in
contact around the full circumference of the wire and in contact with
the board per paragraph 9.1.4.c (*Requirement)*.

l\. When required to stake TO-type packages: at least three fillets
spaced approximately evenly around the periphery of the component,
fillet height: ≥25 percent, slight flow under the part is allowed
however staking shall not contact lead seals or the solder joint per
paragraph 9.1.4.d (*Requirement)*.

m\. When required to stake radial-leaded square or rectangular packages:
staking shall be used at each corner, fillet height: ≥ 25 percent,
slight flow under the part is allowed however staking shall not contact
lead seals or the solder joint per paragraph 9.1.4.e (*Requirement)*.

n\. When required to stake radial-leaded component whose longest
dimension is its height: fillet required on both sides, fillet height
≥50 percent to 100 percent, fillet width ≥ 50 percent, slight flow under
the part is allowed however staking shall not contact lead seals or the
solder joint per paragraph 9.1.4.f (*Requirement)*.

o\. When in an array of between two and four devices, fillets shall be
in contact between each inside surface of adjacent devices for ≥50
percent to 100 percent of the component height (*Requirement)*.

p\. When in an array of greater than four devices, in addition to
13.6.2.o, both sides of the outer surfaces of every other part shall
contain a fillet to the board ≥50 percent to 100 percent of the height
of the part per paragraph 9.1.4.f.iv.(*Requirement)*

q\. The staking material shall be tack-free when cured as per paragraph
9.1.5 (*Requirement)*.

13.6.3 Rejection Criteria. The following are some characteristics of
unsatisfactory conditions, any of which is cause for rejection
(*Requirement)*.

a\. Staking material used after shelf life expiration as per paragraph
6.6.l.b.

b\. Staking material bridges between the PWB and the bottom of the DIPs
or flatpacks per paragraph 9.1.2.

c\. Staking material fills the stress relief areas per paragraph
9.1.3.a.

d\. Staking material encloses the part lead as per paragraph 9.1.3.a.

e\. Rigid staking has been applied directly to glass bodied parts per
paragraph 9.1.3.c.

f\. Fastener lubricant inhibits the adhesion of staking per paragraph
9.1.3.d.

g\. Staking material is found inside of mounting holes or covering vent
holes or via's per paragraph 9.1.3.f.

## Acceptance/Rejection Criteria for Fastener Staking and Torque Striping

13.7.1 Documentation. All acceptance and rejection criteria for staking
shall be clearly defined in the application processing document(s)
(*Requirement)*. Reference Figures 9-11 through 9-13 for typical,
acceptable fastener staking.

13.7.2 Acceptance Criteria for Fastener Staking. Staked fasteners shall
exhibit, as a minimum, the following workmanship characteristics in
order to be judged acceptable:

a\. Fastener staking material adheres to the intended surfaces per
paragraph 4.5.1.c. and 9.2.1.b (*Requirement)*.

b\. Fastener staking material meets the hardness requirement of 8.5.3
(*Requirement)*.

c\. Fastener staking material contains no contaminants, voids, or air
bubbles per paragraph 9.2.1.2 (*Requirement)*.

d\. The nut part of a fastener combination (when used) is spot staked to
the bolt and to the assembly in one or two locations, with total
coverage of 25 percent to 50 percent of the circumference of the nut per
paragraph 9.2.2.4 (*Requirement)*.

e\. If a nut is not used, bolt heads and screw heads have 25 percent to
50 percent of the heads' circumference covered with staking per
paragraph 9.2.2.6 (*Requirement)*.

13.7.3 Rejection Criteria for Fastener Staking. The following are some
of the characteristics of unsatisfactory conditions; any of which shall
be a cause for rejection (*Requirement)*.

a\. The nut part of a fastener is staked less than 25 percent of the
circumference and/or does not contact both the bolt and the assembly
surface per paragraph 9.2.2.4.

b\. If a nut is not used, bolt heads and screw heads have less than 25
percent of the heads' circumference covered per paragraph 9.2.2.6.

c\. Evidence that the fastener staking material has been fractured or
tampered with at any time after the thread locking work was completed
per paragraph 9.2.2.3.

d\. Resin spillage or residue on adjacent substrate surfaces per
paragraph 9.2.1.d.

e\. The staking material has entered a bolt or screw's internal drive
(impede removal of the bolt or screw) when a nut is used per paragraph
9.2.2.6.

f\. Thread lock was applied to a blind threaded hole, without a vent
hole provided for polymer squeeze-out per paragraph 9.2.3.2.

13.7.4 Acceptance Criteria for Torque Striping.

a\. Torque striping material shall adhere to the intended surfaces per
paragraph 4.5.1.c (*Requirement)*.

b\. Torque striping material shall meet the hardness requirement of
8.5.3 (*Requirement)*

c\. Torque striping is applied from the center of bolt to at least
3.2 mm (0.126 inch) onto the substrate per paragraph 9.3.1.1
(*Requirement)*.

d\. Evidence that the torque striping material has been fractured or
tampered with at any time after the thread locking work was completed
per paragraph 9.3.1.2 (*Requirement)*.

13.7.5 Rejection Criteria for Torque Striping. Torque striping shall be
rejected if any of the following are formed:

a\. No evidence of torque striping on fasteners designated to be torqued
on engineering documentation (*Requirement)*.

b\. Torque striping shows evidence of having been disturbed per
paragraph 9.3.1.2 (*Requirement)*.

c\. Resin spillage or residue on adjacent substrate surfaces
(*Requirement)*.

## Inspection Methods for Conformal Coating

13.8.1 UV-Light Inspection. When fluorescent conformal coating materials
are used, coverage and location shall be determined by UV-light
examination per paragraph 10.2.6 (*Requirement)*.

13.8.2 Conformal Coating Thickness Inspection. Conformal coating
thickness shall be determined using a wet film thickness gauge,
micrometer, or other tool on flat surfaces of the PWA or on the
conformal coating specimens per paragraphs 10.2.5 and 8.6
(*Requirement)*.

## Acceptance/Rejection Criteria for Conformal Coating

13.9.1 Documentation. All acceptance and rejection criteria for
conformal coating shall be clearly defined in the application processing
document(s) (*Requirement)*. Reference Figure 10-2 through Figure 10-5
for conformal coating acceptance and rejection criteria.

13.9.2 Acceptance Criteria. Conformally coated PWAs shall exhibit, as a
minimum, the following workmanship characteristics to be acceptable:

a\. PWAs were cleaned and demoisturized within 8 hours before conformal
coating per paragraph 8.1.1 (*Requirement)*.

b\. Unless otherwise specified by the approved engineering
documentation, the conformal coating, when measured in flat unencumbered
areas on the conformal coating specimen, shall have a thickness
appropriate for the conformal coating material being used as per
paragraph 10.2.5 (*Requirement)*.

c\. Conformal coating shall be uniform in color and texture per
paragraph 10.2.7.a (*Requirement)*.

d\. Conformal coating shall be tack-free when cured per paragraph
10.2.7.a (*Requirement)*.

e\. Conformal coating shall adhere to all coated surfaces per paragraph
10.2.7.a (*Requirement)*.

f\. Conformal coating shall have a smooth continuous surface and follow
the contours of the PWA as paragraph 10.2.7.b (*Requirement)*.

g\. PWAs were cleaned to remove any maskant per paragraph 10.4
(*Requirement)*.

h\. Conformal coating shall be uniform in thickness as specified in
Table 10-1 or on engineering documentation except in touched-up areas as
per paragraph 10.5 (*Requirement)*.

i\. Conformal coating shall cover all areas as specified on the
engineering documentation (*Requirement)*. Pull back from sharp points
and edges shall be permitted unless otherwise specified as per paragraph
10.2.7.b (*Requirement)*.

j\. Conformal coating shall be free of contamination as per paragraph
10.2.7.5c (*Requirement)*.

k\. Each terminal shall be encapsulated with conformal coating to
include the insulation gap of the wire as per paragraph 10.2.7.d
(*Requirement)*.

l\. Conformal coating material that bridges between adjacent part leads
is acceptable as per paragraph 10.2.7.e (*Requirement)*.

13.9.3 Rejection Criteria. The following are some characteristics of
unsatisfactory conditions, any of which is cause for rejection
(*Requirement)*:

a\. Conformal coating material used after shelf life expiration as per
paragraph 6.6.1.b.

b\. Conformal coating bridges stress relief areas thereby negating
stress relief as per paragraph 10.2.6.b.

c\. Conformal coating bridges between the PWB and the bottom of DIP's
and flatpacks as per paragraph 10.2.6.b.

d\. Conformal coating exhibits tackiness or soft spots as per paragraph
10.2.7.a.

e\. Pinholes, blistering, scratches, whitish spots (measling),
wrinkling, or cracking as per paragraph 10.2.7.a and paragraph 10.2.7.b.

f\. Any signs of contamination (e.g., flux, loose particles, or foreign
material) as per paragraph 10.2.7.c.

g\. Discolored conformal coating as per paragraph 10.2.7.f.

h\. Bubbles or bare spots bridging two electrically conductive elements
as per Figure 10.2.

i\. Bubbles larger than 0.76 mm (0.030 inch) in any dimension as per
Figure 10.2.

j\. Conformal coating exhibits lifting or peeling as per Figure 10.4.

k\. Conformal coating exhibits excess runs, fish eyes, or peeling as per
Figure 10.5.

## Acceptance/Rejection Criteria for Bonding

13.10.1 Documentation. All other acceptance and rejection criteria for
bonding shall be clearly defined in the application processing
document(s) (*Requirement)*. Reference Figure 11-1 for acceptable and
rejected bonding features.

13.10.2 Acceptance Criteria. PWAs and electronics assemblies containing
bonded items shall exhibit, as a minimum, the following workmanship
characteristics to be acceptable:

a\. The bonding resin witness sample meets the hardness requirement of
8.5.3 (*Requirement)*.

b\. The adhesive material shows evidence of squeeze-out around all sides
of the part mounting base per paragraph 11.2.2.d (*Requirement)*.

c\. The adhesive material has good adhesion and shows no evidence of
separation from the substrate surfaces per paragraph 11.2.2.b
(*Requirement)*.

d\. Bond line control is per the engineering documentation per paragraph
11.2.2.e (*Requirement)*.

e\. Bonding is done prior to conformal coating per paragraph 11.2.3
(*Requirement)*.

13.10.3 Rejection Criteria. Bending shall be rejected if any of the
following characteristics are found (*Requirement)*:

a\. Part markings are not visible, unless allowed by engineering
instructions per paragraph 11.2.2.a.

b\. Both leads of PRT, thermistors, and similar parts are fully captured
per paragraph 11.2.2.c.

c\. Adhesive material residue or spills on top of the part or the
adjacent substrate surfaces, after completion of the work. Excessive
squeeze-out around the part per paragraph 11.2.2.d.

## Acceptance/Rejection Criteria for Encapsulation

13.11.1 Documentation. All acceptance and rejection criteria for
encapsulated assemblies shall be clearly defined in the application
processing document(s) (*Requirement)*. Reference figures 12-1 and 12-2
for typical, acceptable encapsulation features.

13.11.2 Acceptance Criteria. Encapsulated assemblies shall exhibit, as a
minimum, the following workmanship characteristics in order to be judged
acceptable:

a\. The encapsulation material adheres to the intended surfaces per
paragraph 12.3.2 (*Requirement)*.

b\. The encapsulation polymer shall meet the hardness requirement of
8.5.3 (*Requirement)*.

c\. As defined in the engineering documentation, underfill has been
installed prior to encapsulation per paragraph 12.2.3 (*Requirement)*.

d\. The encapsulation material fills the required areas completely per
paragraph 12.3.2 (*Requirement)*.

e\. The encapsulation material is free from fracture lines or cracks per
paragraph 12.3.7 (*Requirement)*.

13.11.3 Rejection Criteria. Encapsulation shall be rejected if any of
the following characteristics are found (*Requirement)*:

a\. Incomplete fill of the specified areas per paragraph 12.3.2.

b\. Bubbles greater than 0.635mm (0.025 in) diameter or that form a
continuous path between two electrically conductive elements per
paragraphs 12.3.3 and 12.3.4.

c\. For high voltage applications, bubbles and/or pinholes are not be
greater than 0.0254 mm (0.001 in). 12.3.5.

d\. No material on the exterior surfaces of the encapsulation cup which
interferes with markings or mounting holes or can damage or degrade
performance per paragraph 12.3.6.

13.11.4 Connector encapsulation Acceptance/Rejection Criteria. In
addition to the above encapsulation criteria the following acceptance
criteria shall be applied to encapsulated connectors:

a\. Connector pins/sockets are clean with no trace of encapsulant per
12.3.6 (*Requirement)*.

b\. Encapsulation material has concave fillets to the encapsulated wires
per paragraph 12.3.8 (*Requirement)*.

c\. Good adhesion to back of connector per paragraph 12.3.2
(*Requirement)*.

d\. When conductive epoxy is used in place of a connector back shell,
the epoxy shall provide electric conductivity between the connector
shell mounting and the cable shield per paragraph 12.4.1
(*Requirement)*.

e\. All shielding wire end tips are within the encapsulant to prevent
loose wires from causing electrical shorts per 12.4.2 (*Requirement)*.

[]{#__RefHeading___Toc190679932 .anchor}APPENDIX A. CONFORMAL COATING
PROBLEMS

The following are the major problems encountered in the conformal
coating process:

[]{#__RefHeading___Toc190679933 .anchor}A.1 Conformal Coating Thickness

Conformal coating thickness can be critical to the proper function of a
PWA. If a coating is too thin, proper coverage is impossible; if a
coating is too thick, it may create excessive stresses on solder joints
and components (particularly glass-bodied components). Controlling
coating thickness is of special importance with rigid coating materials
(e.g., epoxies and some of the urethanes) because the residual stresses
associated with an excessively thick application of these materials are
much greater than with flexible coating materials (such as silicones and
some urethanes).

The thickness of a conformal coating can best be controlled by
controlling the material viscosity during application. Where permitted,
diluent solvents can be used to control viscosity. A multiple-coating
process can also be used to attain more uniform thickness. Excessive
filleting of adjacent components, caused by surface tension, may
necessitate use of a brush to remove the excess.

Using a wet film gauge after each coating pass in a multiple-coating
process helps the operator stay within the required post-cure thickness,
that is when the number of passes and wet gauge values have been
calibrated and documented in the processing documents with results of
cured samples.

[]{#__RefHeading___Toc190679934 .anchor}A.2 Coverage -- Points and Edges

Liquid coatings, because of gravity and their surface energy, tend to
pull away from sharp points and edges which are often formed in
conductors needing the most coverage. Inadequately protected conductors
exposed to atmospheric humidity or condensing moisture can easily
develop circuitry malfunctions.

This problem can be alleviated by using a multiple-coat process with
some drying between coat applications or by using an initial coat with a
filler that will reduce the tendency of the coating to pull away from
points and edges better. Vacuum deposition of paraxylylene is the best
method for covering points and edges.

Using more than one type of coating method (e.g., brush method followed
by spray method) can help accomplish acceptable coverage around
difficult-to-cover parts such as transformers, components near a
stiffener, components mounted to heat sinks, and closely spaced
components which limit line-of-sight spray applications.

[]{#__RefHeading___Toc190679935 .anchor}A.3 Bubbles

Bubbles normally originate from air trapped underneath components and at
solder joints. When bubbles bridge uncommon conductors, entrapped
moisture or other contaminants may reduce insulation resistance or cause
shorts and possible arcing.

Bubbling may be controlled by various means. The angle at which an
assembly is dried, cured, or dipped is important in preventing bubble
formation. The best angle for spraying conformal coating is usually 45°
to the PWA. The drying and cure schedule can also affect bubble
formation. Sometimes air cure is needed to permit solvent evaporation;
sometimes immediate thermal cure is more desirable because of lower
material viscosity caused by higher temperature. Spray coating, being
more thinly applied, is not as susceptible to bubbling caused by solvent
and air entrapment as are dip coating and brush coating. For thicker
coating applications, degassing in a vacuum chamber will remove
entrapped air.