**Safety Assessment Document**

**FOR THE CMS DETECTOR**

**MUON ALIGNMENT SYSTEMS**

Prepared by:

D. Eartly (Endcap Muon )

(LINK System)

(Barrel System)

November 9, 2001

###  TABLE OF CONTENTS

1\. Introduction

1.  Purpose

2.  CMS Muon Alignment Project

2\. Summary and Conclusions

3\. Description of the Alignment Subsystems

3.1 Endcap Muon Subsystem

3.1.1 Equipment Description

3.1.2 System Critical Elements

3.1.3 System Operations

3.1.4. System Hazards

3.2 Barrel Muon Subsystem

3.2.1 Equipment Description

3.2.2 System Critical Elements

3.2.3 System Operations

3.2.4. System Hazards

3.3 LINK Transfer Subsystem

3.3.1 Equipment Description

3.3.2 System Critical Elements

3.3.3 System Operations

3.3.4. System Hazards

4\. Safety Analysis

4.1 Introduction

4.2 General Hazards (Magnetic, Mechanical, Conventional, Fire, ODH)

4.3 Endcap Muon Subsystem

1.  Electrical Systems

    1.  Low Voltage Supplies, Distribution, Fusing

    2.  Signal Cable configuration

    3.  Grounding and Earth Shields

    4.  Materials

4.3.2 Laser Hazards

2.  Radiation Hazards

####  TABLE OF CONTENTS (Con't)

3.  Barrel Muon Subsystem

4.4.1 Electrical Systems

1.  Low Voltage Distribution, Fusing

2.  Signal Cable configuration

3.  Grounding and Earth Shields

4.  Camera Systems

5.  Materials

4.4.2 Radiation Hazards

4.  LINK Transfer Subsystem

4.5.1 Electrical Systems

1.  Low Voltage Distribution, Fusing

2.  Signal Cable configuration

3.  Grounding and Earth Shields

4.  Materials

4.5.2 Laser Hazards

4.5.3 Radiation Hazards

5\. Quality Assurance

1.  Program Description

2.  Program Objectives

3.  Design Reviews

4.  Safety Reviews

5.  Testing Procedures

6\. Conduct of Operations

> 6.1 Organization of Operations
>
> 6.2 Safety Training

3.  Subsystems Tests and Checks

> 6.4 Configuration Change Control

6.5 Emergency Plans

7\. Handling, Storage, Disposal of Replaced-Repaired Elements

8\. Figure List

9\. Tables

10\. References

#####  **APPLICABLE CMS MUON ALIGNMENT SYSTEM SAFETY CODES**

CERN Safety **Codes**, *Instructions*, Notes to Address

**A5** Safety of Apparatus for Experiments

**C1** Electrical Safety Code + IS28 on electrical dangers

**F** Radiation Protection Manual (maintenance, replacement)

*IS3* Transport of Radioactive Material (maintenance, replacement,
repair)

*IS5* Emergency Stops (key laser run control, fault trips)

*IS7* Individual Protective Equipment (eyewear etc)

*IS22* Safe Laser use

*IS23* Electrical Cable Criteria

*IS24* Electrical Installations

*IS33* Voltage classification of Electrical Installation

*IS36* Magnetic Field Exposure

*IS41* Plastics

NS9 Protection against RF-Microwave Radiation

NS16 Transport of Radioactive Materials

**1) INTRODUCTION**

1.1 PURPOSE

This Safety Assessment Document (SAD) for the CMS Muon Alignment System
has been prepared to ensure that environmental, health and safety issues
are identified and properly addressed in the design and proposed
operation of the CMS Muon Alignment System. By documenting the hazards
in this system and showing how these hazards are to be addressed in
compliance with CERN Safety Codes, Instructions, Notes, etc., the System
will be a low risk facility.

1.2 The CMS Muon Alignment Project

The original conceptual description for the system is given in the CMS
Muon Project

Technical Design Report, Section 7 (CERN/LHCC 97-32). The system is
composed

of three interconnected subsystems; Barrel, Link, Endcap. The
configuration details

and elements of the Link connection to the Tracker and the Endcap Link
Lines (now called Transfer Lines) have changed. Also the optical
position measurement sensors

in both of these subsystems has changed. The Link uses a
Beam-splitter-CCD array

sensor while the Endcap is based on DCOPs (an open picture frame array
of four

linear CCDs intercepting a crossed line laser beam).

> **2) Summary and Conclusions**

The unusual hazard posed by the operation of this system in the Link and
Endcap

subsystems is a multiplicity of laser beams of varying hazard levels and
residual

radiation exposure in servicing Link elements in the inner detector
regions. These

hazards are controlled by CERN codes and standards. Consequently, by
demonstrating conformance to these standards even under accident
conditions; potential impacts

to on-site personnel is minimized.

> **3) Description of the Muon Alignment Subsystems**

1.  The Endcap Muon Subsystem

    1.  Equipment Description

The primary sensor of the subsystem is an optical laser beam relative
position measuring

CCD device (DCOPS). A window frame of four linear CCDs measure the
intercept of crossed laser lines at two points for each line (1). Each
sensor has a local readout board with a digital signal processor that
can define the intercept positions of the laser lines

in each CCD. The low power laser diode modules for the reference beams
are in the visible spectrum. There are six optical Transfer lines that
cross CMS at the outer boundaries of the Endcap muon systems under the
service and electronics structures

and under the MB4 barrel drift tube chambers. Measurement and transfer
of CMS coordinates are made at six locations (Transfer plates) at each
Cathode Strip chamber (CSC) layer. The other optical Straight line
monitors (sensors and lasers) are located within the CSC layer gaps
between YE iron discs. In addition to the optical beams and sensors, a
number of electromechanical and optical analog sensors are utilized in
the system. They provide Z transfer along the optical Transfer lines and
R transfer to the rings of CSCs. These include:

### Z Transfer System (Mechanical tubes, linear potentiometers, laser distance (gap) sensor)

Z4MW40 Laser gap sensor; measuring end of a tube gap to MAB surface (gap
\~45 mm)

LCP8-10 potentiometer on ME1Transfer Plate; measuring the gap - opposite
end of tube

LCP8-10 potentiometers on ME2 Transfer Plate; measuring the gaps to ends
of a tube

AD592 Temperature sensors on the tube, Transfer Plate, ME2/2 CSC panel
strip, etc.

AD592 Temperature sensors on the tubes

## [Transfer Plates (Connect coordinates of Transfer line and CSC layer SLM systems)]{.underline}

Applied Geomechanics 900 dual axis inclinometer

AD592 Temperature sensors on the Transfer Plates

### R Transfer to CSCs (Connect Transfer plates to outer CSCs to inner CSCs)

LPX50 wire extension potentiometer; Transfer Plate to ME2/2, ME3/2 outer
CSCs

LPX50 wire extension potentiometer; ME2/2, ME3/2 to ME2/1, ME3/1 inner
CSCs

AD592 Temperature sensors on the ME2/2, 3/2 and ME2/1, 3/1 CSC panels

The sensors and distributed electronics are connected through a halogen
free cable network to a few data acquisition nodes in the service and
electronics structures around the YE iron discs (2). The DCOPS system
(13 VDC) operates on a single low voltage in fused, low current bussing.
The ANALOG system (13 VDC) operates on a single low voltage in fused,
low current bussing. The LASER system (5 VDC) operates on a single low
voltage in fused, low current individual laser wiring network. Operation
of the system is from the underground control room.

2.  System Critical Elements

The safety critical elements of the subsystem are the network of lasers.
There are six

distributed Transfer lasers (ME4, -4 layer) in each CMS Endcap plus six
more at SLM

endpoints (outer iron boundaries) in eachCSC layer (ME1, 2, 3,
-1,-2,-3). These fourty eight lasers are individually turned on/off
through a switching network under computer (operator/program) control.
The laser power and switch network can be interlocked

off when appropriate. Laser operation is pulsed infrequently for a short
duration to make specific optical measurements. Typically the lasers
will operate only when the detector is closed and inaccessible. Some
exposed operation is planned only during initial survey of CSC layer
assembly or Endcap maintenance. Such activity will be coordinated with
other

groups who would be impacted.

3.  System Operations

Typically, after initial test, study and tracking periods, the system
will be dormant except

during brief measurement cycles (\~ 1-2 minutes) every ½-1 hour. This
cycling will run

by program initiation and control using a UNIX computer clock. The
program includes

checks on the sensor data stream and data values to insure that the
system is operating

properly. Voltages are monitored throughout the system and lasers are
confirmed as

turned off using background spectrum measurements in the optical
sensors.

4.  System Hazards

The system nominally operates only when the detector is inaccessible.
The lasers and low voltage can be interlocked off during personnel
access. The potential risk to laser light exposure would only occur
during test and maintenance periods. The laser light would be generally
blocked and limited by apertures except potentially when the detector
system is open and separated. The laser diode modules for the reference
beams are [visible (red)]{.underline}

(670 nm), [low power Class 3A]{.underline}; which by IS 22 require
warnings when in operation. The laser beams expand into large cross
lines (low power density) and operate in pulsed mode (only on during
short measurement cycle). They are effectively masked by apertures and
blocking plates. The system also uses aperture tubes where possible.

Laser beams at endpoints are stopped by covers/shields so they do not
project past

the active measurement regions or into personnel access space.

All sensors and electronics operate at low voltage on grounded
structures and electronics enclosures. The DCOPS system has fused
Interface and readout boards with temperature sensors. Analog sensors
are fused through their local Interface boards in grounded electronics
enclosures. The system utilizes non magnetic and approved plastic
materials

and halogen free cabling; except for a small volume of standard G10
circuit boards.

4)  **Safety Analysis**

4.1 Introduction

This section discusses hazards of the CMS muon alignment system and
safety assessment

evaluations for these hazards. The following hazards are excluded from
this system: flammable gas, high voltage, oxygen deficiency, and toxic
materials. An overview of

hazards and applicable standards is given in Table 4.1.1 below.

  --------- ---------------------------- --------------- -------------------
            **Table 4.1.1**                              

  Section   System Hazard                Hazard Class    Codes and Standards

  4.2.1     AC Power Distribution        Routine         C1, IEC, NFC15-100

  4.2.2     Low Voltage - Medium Current Low Hazard      C1, IEC, IS33

  4.2.3     Signal Cable System          Routine         C1, IEC, IS23

  4.2.4     Fire Hazards                 Low Hazard      

  4.2.5     Radiation                    Low Hazard      F

  4.2.6     Magnetic                     Low Hazard      IS36

  4.2.7     Laser                        Medium Hazard   IS22

  4.2.8     Conventional                 Routine         

  4.2.9     Plastics                     Routine         IS41
  --------- ---------------------------- --------------- -------------------

4.2 General Hazards

Certain hazards exist because of the CMS enclosures, solenoid magnet,
access and service structure configurations, radiation, activation,
equipment of other systems of

the detector, etc. These hazards, warnings, and required safety training
for them is the domain of the GLIMOS and are not addressed here.

4.3 Endcap Muon Alignment Subsystem

An outline of potential hazards in elements of the subsystem is given in
Table 4.3.1 below:

+--------------------+-----------+---------------------+------+------+
| **Table 4.3. 1**   |           |                     |      |      |
+--------------------+-----------+---------------------+------+------+
| **Element**        | **Mec     | **Conventional      | **Fi | *    |
|                    | hanical** | Electrical**        | re** | *Las |
|                    |           |                     |      | er** |
+--------------------+-----------+---------------------+------+------+
| Geometry,          | n/a       | present             | n/a  | n/a  |
| Simulation,        |           |                     |      |      |
|                    |           |                     |      |      |
| Survey,            |           |                     |      |      |
| Reconstruction     |           |                     |      |      |
+--------------------+-----------+---------------------+------+------+
| DCOPS sensors      | n/a       | present             | n/a  | n/a  |
+--------------------+-----------+---------------------+------+------+
| Analog sensors     | n/a       | n/a                 | n/a  | n/a  |
+--------------------+-----------+---------------------+------+------+
| Laser diode        | n/a       | n/a                 | n/a  | pre  |
| modules            |           |                     |      | sent |
+--------------------+-----------+---------------------+------+------+
| Electronics        | n/a       | present             | n/a  | n/a  |
+--------------------+-----------+---------------------+------+------+
| Power Supplies     | n/a       | present             | pre  | n/a  |
|                    |           |                     | sent |      |
+--------------------+-----------+---------------------+------+------+
| Signal cables      | n/a       | present             | pre  | n/a  |
|                    |           |                     | sent |      |
+--------------------+-----------+---------------------+------+------+
| Power cables       | n/a       | present             | pre  | n/a  |
|                    |           |                     | sent |      |
+--------------------+-----------+---------------------+------+------+
| DAQ system         | n/a       | present             | n/a  | n/a  |
+--------------------+-----------+---------------------+------+------+
| Installation       | present   | present             | n/a  | n/a  |
+--------------------+-----------+---------------------+------+------+
| Commissioning      | n/a       | present             | n/a  | pre  |
|                    |           |                     |      | sent |
+--------------------+-----------+---------------------+------+------+

4.3.1 Electrical Systems

4.3.1.1 Low Voltage Supplies, Distribution, Fusing

Low voltage modules (13 VDC, 5VDC) will be located in LV power module
boxes

for the EMU VME crates near these crate clusters on each YE iron disc.
Typically,

alignment power modules are at the 9 o'clock position near the DAQ
system as

shown in Figure 4.3.1.1.1. To limit current in the perimeter LV
distribution cabling

to each Transfer Plate/SLM Interface (six stations), each CSC layer
splits into two branches as shown in Figure 4.3.1.1.2. This limits the
current to 2.2 A in a DCOPS periphery first link of a daisy chain branch
to three stations. The same scheme for

Analog sensors limits the current to 0.5 A in an Analog periphery first
link of a daisy

chain branch to three stations. Each station is fused (resetting)
through the local

DCOPS Interface board at 1.25 A max for the SLM string of six DCOPS
sensors

and 0.375 A for the SLM analog sensors. There will be less than a 10
degree Centigrade temperature rise in any cable at the maximum fused
current. Each DCOPS sensor readout board itself is also fused (0.35 A).
With a double insulated cable (DI), it qualifies as a protected extra
low voltage (P.E.L.V) per IS33. The insulation is halogen free per IS23
and samples will be given to TIS for testing and approval. At each
station, the LV is daisy chained through a half SLM of DCOPS sensors
(current in first jump 0.72 A)\* in a double insulated multi conductor
cable integrated onto the CSC surface electronics system. At each
Interface card, the local distribution is again fused. The distribution
is shown in Figures 4.3.1.1.3, 4.3.1.1.4. The 5 Vdc to each laser (0.06
A) is again distributed (independent pairs) around the perimeter in a
double insulated cable (DI). Conductor, cable, fusing, and current
specifications are given in Table 4.3.1.1.1 below.

  ------------------------ ----------- ------- -------- ------------- ---------
  **Table 4.3.1.1.1**                                                 

  Cable                    Conductor   Fused   Length   Current (max) Voltage

  DCOPs periphery LV       14 ga DI    4 A     8 m      2.19 A        13 Vdc

  Analog periphery LV      14 ga DI    1 A     8 m      0.48 A        13 Vdc

  DCOPS SLM Intf (I max)\* 24 ga DI    1.25 A  0.15 m   0.72 A        13 Vdc

  DCOPS SLM 3-4 (Lmax)     24 ga DI    1.25 A  3.5 m    0.36 A        13 Vdc

  Analog SLM Intf (Imax)   24 ga DI    0.38 A  4 m      0.011A R1     11 Vdc

  Analog SLM sensor (Lmax) 24 ga DI    0.38 A  5m       0.003 A T1    11 Vdc

  Laser periphery LV       24 ga DI    0.1 A   24 m     0.06 A        5 Vdc
  ------------------------ ----------- ------- -------- ------------- ---------

\* First two short jumps between readout boards are inside a ground
shield box

4.3.1.2 Signal Cable Configuration

For DAQ, the DCOPS sensor system for each CSC layer is a chain of six
half SLMs as shown in Figure 4.3.1.2.1. For DAQ, the Analog sensor
system for each CSC layer is a six parallel half SLM sensor groups
multiplexed into ADC acquisition units. Each half SLM is connected
through DCOPS and Analog Interface cards at the periphery of each YE
iron. The cables divide into two groups, periphery (between Interface
stations to DAQ system located in a rack on the YE service gallery) and
SLM branch. In all cases they are double insulated halogen free multi
conductor cables. The SLM cables are integrated into the CSC surface
electronics system. A single round shielded cable daisy chains between
DCOPS sensors. Analog sensors have independent CAT4, RJ12 cable
connections to the interface card. DCOPS sensors connect to the local
readout electronics via a short flat plenum shielded halogen free multi
conductor cable. The periphery cable configuration for a CSC layer is
shown in Figure 4.3.1.2.2 and at a station is shown in Figure 4.3.1.2.3.
A simpler configuration of cabling for Endcap sensor readout on external
MABs on the Barrel rings MB2, -2 is shown in Figure 4.3.1.2.4. This
corresponds to a two branch/station configuration. Periphery cables are
given in

Table 4.3.1.2.1 below. SLM branch cables are given in Table 4.3.1.2.2
below.

MAB cables are given in Table 4.3.1.2.3 below.

  ---------------- --- --------------------- ----- ----- -------- ------------
  Periphery            **Table 4.3.1.2.1**                        

  Cable                Configuration         Ins   Num   Length   Shape

  Serial DAQ-JTAG  A   4pr 28 ga STR, F/B    DI    1     4 m      Round, 7 mm
                       shield                                     

  DCOPS power      B   14 ga, 2 cond STR,    DI    6     8 m      Round, 6 mm
                       jacket                                     

  Analog power     B   14 ga, 2 cond STR,    DI    6     8 m      Round, 6 mm
                       jacket                                     

  DCOPS Intf 422   H   8pr 28 ga STR,F/B     DI    5     8 m      Round, 10mm
                       shield                                     

  Analog signal    C   10 pr, 24 ga STR,     DI    2     8 m      Round, 10mm
                       jacket                                     

  Analog signal    C   10 pr, 24 ga STR,     DI    2     16 m     Round, 10mm
                       jacket                                     

  Analog signal    C   10 pr, 24 ga STR,     DI    2     24 m     Round, 10mm
                       jacket                                     

  Laser power      E   3 pr 24 ga, jacket,   DI    6     8 m      Round, 5 mm
                       RJ12                                       

  T signal         E   3 pr 24 ga, jacket,   DI    2     8 m      Round, 5 mm
                       RJ12                                       

  T signal         E   3 pr 24 ga, jacket,   DI    2     16 m     Round, 5 mm
                       RJ12                                       

  T signal         E   3 pr 24 ga, jacket,   DI    2     24 m     Round, 5 mm
                       RJ12                                       
  ---------------- --- --------------------- ----- ----- -------- ------------

  ---------------- --- ---------------------- ----- ----- -------- ------------
  SLM Branch           **Table 4.3.1.2.2**                         

  Cable                Configuration          Ins   Num   Length   Shape

  DCOPS analog     J   20c 28ga STR, F shield DI    6     0.5 m    Flat, 26 mm

  DCOPS LVDS Int   I   20c 28ga STR\*               2     0.15 m   Flat, 24 mm

  DCOPS LVDS Ex    F   10pr 28ga STR, F/B     DI    1     0.5 m    Round,10mm
                       shield                                      

  DCOPS LVDS Ex    F   10pr 28ga STR, F/B     DI    1     3.5 m    Round,10mm
                       shield                                      

  DCOPS LVDS Ex    F   10pr 28ga STR, F/B     DI    1     1.0 m    Round,10mm
                       shield                                      

  DCOPS LVDS Ex    F   10pr 28ga STR, F/B     DI    1     2.0 m    Round,10mm
                       shield                                      

  Analog signal    D   3pr 24 ga S, jacket    DI    5     1.0 m    Round, 5mm
                       TrP,R1                                      

  Analog signal    D   3pr 24 ga S, jacket    DI    2     1.5 m    Round, 5mm
                       R2,T3                                       

  Analog signal    D   3pr 24 ga S, jacket    DI    2     4.0 m    Round, 5mm
                       R1,T2                                       
  ---------------- --- ---------------------- ----- ----- -------- ------------

> \*First two short jumps between readout boards are inside a ground
> shield box

  ---------------- --- ---------------------- ----- ----- -------- ------------
  MAB System           **Table 4.3.1.2.3**                         

  Cable                Configuration          Ins   Num   Length   Shape

  DCOPS analog     J   20c 28ga STR, F shield DI    6     0.5 m    Flat, 26 mm

  DCOPS LVDS Int   I   20c 28ga STR\*               2     0.15 m   Flat, 24 mm

  DCOPS LVDS Ex    F   10pr 28ga STR, F/B     DI    4     8 m      Round,10mm
                       shield                                      

  DCOPS power      B   14 ga, 2 cond STR,     DI    1     8 m      Round, 6 mm
                       jacket                                      

  DCOPS power      B   14 ga, 2 cond STR,     DI    1     2 m      Round, 6 mm
                       jacket                                      

  DCOPS Intf 422   H   8pr 28 ga STR,F/B      DI    1     8 m      Round,10mm
                       shield                                      

  Serial DAQ-JTAG  A   4pr 28 ga STR, F/B     DI    1     4 m      Round, 7 mm
                       shield                                      
  ---------------- --- ---------------------- ----- ----- -------- ------------

The halogen free cables satisfy IS23, IS33 as Protected Extra Low
Voltage (P.E.L.V).

3.  Grounding and Earth Shields

All of the Interface and Readout boards are housed in aluminum grounded
enclosures

with slide on removable covers. The whole assembly (cover + electronics)
or boards

can be easily removed from their mounts without removing/installing any
fasteners.

The grounding configuration is illustrated in Figure 4.3.1.3.1. All
electronics/cabling provides power and signal ground returns. Ground
connection of the cables, boards,

and covers is made locally at the mounting points with a slide on
terminal connection.

4.  Materials Configuration

Most of the material in the system is aluminum and other metals (copper,
brass, stainless steel). A small amount of LEXAN is used in CCD mounts
in DCOPS sensors and MAB

Sensor mounting plates (for weight). Cable insulations are halogen free
thermoplastics. Electronics boards (\~0.005 m3 G10 ) have a small volume
of standard connector plastics. Table 4.3.1.4.1 outlines the major
materials used in the Endcap subsystem.

  ------------------------------- ----------------- ---------- -----------
  **Table 4.3.1.4.1**                                          

  Item                            Material          Number     Volume

  Transfer Plates and supports    Aluminum          36         

  CSC sensor mounts               Aluminum          216        

  DCOPS sensor boxes              Aluminum          216        

  DCOPS readout earth shield      Aluminum          144        

  Transfer laser mounts           Aluminum          12         

  Interface board earth shield    Aluminum          38         

  Cable insulation                Thermoplastic                

  PC boards                       G10               300        0.005 m3
  ------------------------------- ----------------- ---------- -----------

1.  Laser Hazards

As stated earlier, the system nominally operates only when the detector
is inaccessible. The lasers and low voltage can be interlocked off
during personnel access. All lasers

will be marked with warning/identification labels and logged/listed with
CERN TIS.

The potential risk to laser light exposure would only occur during test
and maintenance periods when the detector system (CSC layers) is open
and separated. The laser light would be generally blocked and limited by
apertures, masks, and aperture tubes. The laser diode modules for the
reference beams are [visible (red)]{.underline} (670 nm), [low power
Class 3A]{.underline}; which by IS 22 require warnings when in
operation. The laser beams expand into large cross lines (low power
density). Even in testing, they operate in pulsed mode (only on during
short measurement cycle). For SLM laser beams, the active measurement
regions are just above the surface electronics of the CSCs (27 mm), stop
at the outer boundaries of the YE iron, and do not project into
personnel access space. Nominally, no one can put their line of sight
into the active regions. For Transfer line laser beams, the active
measurement regions are just above the outer YE surface interleaved in
cable ways and services and under the MB4 Drift Chambers. These active
regions are accessible only

if the YE discs or Endcap-Barrel systems are separated. Under these
conditions, any of these beams would only be operated (rarely) in
repairs of elements in a given line. This operation would occur only
when other groups are not working in the affected areas. All

operations would include warning lights and postings in accord with
IS22.

4.3.2 Radiation Hazards

The Endcap subsystem does not require the use of any radioactive sources
for test or calibration. The only radiation hazard results from
activation of elements. This will be dominated by cables and circuit
boards. Any elements (sensors, circuit boards, mounts) removed from the
activated detector will be scanned, tagged, and handled in accordance
with the CERN Safety Code F Chapter 4, Section 3.

3.  Barrel Muon Subystem

4.  LINK Transfer Subsystem

```{=html}
<!-- -->
```
5)  **Quality Assurance**

5.1 Program Description

Each Alignment subsystem has developed a Quality Control and Assurance
plan

appropriate to the construction, testing, calibration, tracking, and
implementation

of elements specific to that system. These plans are described in the
corresponding

Quality Control Manuals.

5.2 Program Objectives

Subsystem QAQC plans are directed at providing systems with the required
reliability and performance. In addition to Quality Control in the
production of the subsystems,

these manuals include Quality Control during Installation and
Commissioning plus

Quality Assurance during subsystem Operation and Maintenance.

5.3 Design Reviews

The CMS Muon Alignment group regularly conducts a number of workshops to
review

and evaluate the developments (designs, testing, hardware) in each
subsystem. This process insures a co-ordinated system. In addition, the
designs are integrated with

the detector systems. Barrel and Endcap subsystems are fully integrated
with the

chambers and electronics. At appropriate times, the group requests a CMS

EDR for specific parts of the system.

> 5.4 Safety Reviews

As the CMS Muon Alignment system goes into production and Installation
in 2002, 2003 it will initiate/participate in CMS/ TIS safety reviews,
especially regarding laser, electrical, and Radiation Safety issues.

> 5.5 Testing Procedures

Preliminary documentation on specific system testing and certification
procedures

during production, installation, commissioning, operation, and
maintenance is given

in the QAQC documents of the subsystems. In preparation for installation
(2003,2004),

commissioning (2003,2004), operation (2004+), and maintenance; detailed
Muon alignment system plans will be developed as part of the total WEB
posted CMS Installation, Commissioning, and Operations plans. This will
be part of a co-ordinated Muon subsystem plan.

> **6) Conduct of Operations**

6.1 Organization of Operations

The CMS Muon alignment system will be included in the CMS Operations
Pages.

6.2 Safety Training

Personnel working in the CMS Muon alignment system will have special
training on

laser hazards. In addition, safety trainings required for system
installation, operation,

and maintenance will be established by the CMS Operations safety
training pages.

6.3 Subsystem Tests and Checks

The operating DAQ of the Muon alignment system monitors the data stream,
voltage

conditions, etc. and will generate specific alarms in failure modes. The
alignment

group will provide a document (WEB) that defines specific actions to be
taken in

response to the alarms by CMS operations.

6.4 Configuration Change Control

Production configuration drawings and documents will be submitted to
EDMS.

Any modifications to the system configuration are subject to the change
control

process of CMS.

6.5 Emergency Plans

As part of the alarms action document, emergency stop and shutdown
procedures

for the system will be included.

> **7) Handling, Storage, Disposal of Replaced-Repaired Elements**

Any elements (sensors, circuit boards, mounts) removed from the
activated detector will be scanned, tagged, and handled in accordance
with the CERN Safety Code F Chapter 4, Section 3 (control of radioactive
materials and sources). Any repair or re-calibration of items will be
done at CERN in a controlled area (3.2, 3.3, 3.4, 3.5, 3.7). If an item
is to be discarded, procedures of subsection 3.6 will be followed.

> **8) Figure List**
>
> **9) Tables**
>
> **10) References**