\[DATE\]

PROPOSED

JPL

INSTITUTIONAL

PARTS PROGRAM REQUIREMENTS

**[(DRAFT)]{.underline}**

###### *JPL*

###### 

###### 

###### 

###### 

###### 

###### 

###### 

###### Parts Program Requirements

![](media/image1.pct){width="1.3965277777777778in"
height="0.40694444444444444in"}

**Jet Propulsion Laboratory**

California Institute of Technology

Pasadena, California

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####### CHANGE INCORPORATION LOG

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**[Approvals:]{.underline}**

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[\_\_\_\_\_\_\_\_\_\_]{.underline}
**\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_**

##### Sammy Kayali 

**Manager, Electronic Parts Engineering**

TABLE OF CONTENTS

**1.0 INTRODUCTION 6**

**1.1 Purpose 6**

**2.0 APPLICABLE DOCUMENTS 6**

**3.0 REQUIREMENTS 7**

**3.1 Mission requirements and environments 7**

**3.2 Management Requirements 7**

**3.2.1 System Contractors 7**

**3.3 Monthly Reviews 8**

**3.4 Parts Review Board 8**

**4.0 PARTS SELECTION AND STANDARDIZATION REQUIREMENTS 8**

**4.1 Standard Parts 8**

**4.2 Non-Standard Parts 8**

**4.2.1 Die Requirements 9**

**4.3 Application Specific Integrated Circuit (ASIC) Requirements 9**

**4.3.1 Digital ASIC Test Requirements 9**

**4.3.2 Mixed-signal ASIC Test Requirements 10**

**4.4 Hybrid Microcircuit Requirements 10**

**4.5 Non-Compliant Parts 11**

**4.5.1 Waivers 11**

**4.6 Parts List Review 11**

**4.6.1 As built Parts List 12**

**4.7 Radiation Effects 12**

**4.7.1 Radiation Lot Acceptance testing (RLAT) 12**

**4.7.2. Dose Rates 13**

**4.7.3 Total Ionizing Dose (TID) Level 13**

**4.7.4 Displacement Damage 13**

**4.7.5 Single Event Effects (SEE) 13**

**4.7.5.1 Single Event Upset (SEU) 13**

**4.7.5.2 Single Event Latchup (SEL) 13**

**4.7.5.3 Single Event Gate Rupture (SEGR) 14**

**4.7.5.4 Single Event Burnout (SEB) 14**

**4.7.5.5 Single Event Transient (SET) 14**

**5.0 PARTS ACQUISITION 14**

**5.1 Use of Residual (Heritage) Parts Inventory 14**

**5.2 Parts Procurement 14**

**5.2.1 Traceability 14**

**5.2.1.1 Single Wafer Lot traceability 15**

**5.2.2 Parts Data Requirements and Data Retention 15**

**5.2.3 Screening and Additional Test Requirements 15**

**5.2.4 Post-Programming Burn-In for Programmable Devices 16**

**5.2.5 Destructive Physical Analysis (DPA) 16**

**5.2.6 Customer Source Inspection 16**

**6.0 ELECTRONIC PARTS APPLICATION AND DERATING 16**

**6.1 Parts Derating 16**

**6.2 Handling / Storage / Electrostatic Discharge (ESD) Control
Requirements 16**

**6.3 NASA and Government Industry Data Exchange Program (GIDEP) Alerts
16**

**6.4 Failure Analysis 17**

**7.0 SURPLUS PARTS 17**

**8.0 ACRONYM LIST 17**

**ATTACHMENT I 19**

APPENDIX
I.....................................................................................................................................23

##   {#section-8 .unnumbered}

## 1.0 INTRODUCTION 

## 

# **1.1 Purpose**

This document defines the Electrical, Electronic, and Electromechanical
(EEE) parts program requirements for the \[PROJECT NAME\] project.

##### 

# **Scope**

# The EEE parts program requirements specified herein shall apply to each organization, both internal and external to JPL, supplying EEE parts used in flight hardware for the \[PROJECT NAME\] project. Throughout this document, the term "EEE parts" refers to the flight EEE parts intended for use in flight hardware. 

# **APPLICABLE DOCUMENTS**

# 

# 

# 

# 

##### The following documents of the issue in effect on date of invitation for bids, or request for proposal, or product manufacture, form a part of this document to the extent specified herein. In case of conflict, this document shall take precedence. 

##### JPL Documents 

JPL D-XXXXX \[PROJECT NAME\] Mission Assurance Requirements Document

JPL D-XXXXX \[PROJECT NAME\] Environmental Requirements Document

JPL D-16389 Guidelines for Insuring Known-Good-Die (KGD) in JPL Space
Flight Hardware

JPL D-1348 Standard for Electrostatic Discharge (ESD) Controls

JPL D-8545 JPL Derating Guidelines

JPL D-15032 Procedure -- Category A and B Waivers.

### JPL Adopted Documents

(International Space Station Documents)

SSQ 25000 Destructive Physical Analysis (DPA) Requirements

SSQ 25001 EEE Parts Upgrade Screening Requirements

##### 

##### NASA and Military Documents

NPSL NASA (EEE) Parts Selection List

MIL-PRF-123 General Specification for Capacitors, Fixed, Ceramic
Dielectric

MIL-STD-883 Test Methods and Procedures for Microelectronics

MIL-PRF-19500 General Specification for Semiconductor Devices

QPL-19500 Qualified Products List of Products Qualified under
MIL-PRF-19500, General Specification for Semiconductor Devices

MIL-PRF-38534 General Specification for Hybrid Microcircuits

QML-38534 Qualified Manufacturers List for Hybrid Microcircuits

MIL-PRF-38535 General Specification for Manufacturing Microcircuits

QML-38535 Qualified Manufacturers List of Microcircuits

MIL-PRF-39010 General Specification for Coil, RF, Fixed, Molded

MIL-STD-981 Design, Manufacturing and Quality Standards for
Electromagnetic

Devices for Space Applications

MIL-O-55310 General Specification for Crystal Controlled Oscillator

### Other

**International Space Station Documents**

SSP 30312 EEE and Mechanical Parts Management and Implementation Plan

# **3.0 REQUIREMENTS** 

# **3.1 Mission Requirements and Environments**

The mission and environmental requirements are summarized below.
Detailed requirements are specified in JPL D- XXXXX \" \[PROJECT NAME\]
Environmental Requirements Document\".

**Destinations(Orbit)** - Destinations

**Distance(Altitude**) - Distance from Earth in AUs(or Altitude)

**Expected Life** - Minimum of \[XXX\] months on-orbit for electronics
supporting science return, and minimum of \[XX} years on-orbit for
electronics supporting telemetry. Typical life expectancy of \[XX\]
years on-orbit .

**Radiation** - Total Ionizing Dose (TID) \> \[XXX\] krads or shielding
analysis shall be required (e.g. TID requirement is based on assumption
of \[XX\] years on JEM/EF, radiation design margin (RDM) = Factor of
\[X\], and 100 mils Al equivalent shielding)

> \- SEL LET threshold \< \[XXX\] MeV-cm2/mg, assume no operation during
> solar flare \[Note: Charged particle fluence is decreasing rapidly for
> particles with an effective Linear Energy Transfer (LET) \> \[XXX\]
> MeV-cm2/mg\]

**Thermal (Assembly)** - Non-operating temperature: -\[XX\] ° to \[XX\]
°C

**Electronics Operating Temperature** - -\[XX\] ° to \[XX\] °C

**Vibration** - Random: \[XX\]G~rms~ overall acceptance

> \- Sinusoidal: \[XX\]g (XX-XXHz) & \[XX\]g (\[XX\]-\[XXX\]Hz); launch
> direction
>
> \- Shock -- \[XXX\]g (\[XXXX\]-\[XXXX\]Hz)

# **3.2 Management Requirements** 

The JPL \[PROJECT NAME\] EEE Parts Program Manager (PPM) shall manage
the \[PROJECT NAME\] EEE parts program. All EEE parts used on the
project shall be reviewed and approved by the PPM. Suppliers of flight
hardware with EEE parts shall provide the PPM with a parts program plan
describing their implementation of the requirements specified herein.
The plan shall, at a minimum, include the supplier\'s approach and
schedule and shall be approved by the PPM for compliance to requirements
prior to the supplier initiating their parts program. Each supplier and
their management shall assure that the necessary support is allocated
for the implementation of their parts program plan.

# **3.2.1 System Contractors**

System contractors and their subcontractors shall be subjected to all
requirements of this document unless exempted according to the
provisions of Section 4 herein. These requirements also apply to any
design agency, internal or external to JPL, which furnishes flight
equipment to the \[PROJECT NAME\]. Each organization utilizing a
subcontractor shall contractually require the establishment of an
electronic parts program consistent with the requirements of this
document and to define the implementation plan of that program in an
Electronic Parts Program Plan (EPPP) or other formal document, which
will be reviewed and approved by the PPM.

##### 3.3 Monthly Reviews 

The PPM will provide a summary review of the parts program on a monthly
basis to the project and to Section 514 Management. The monthly review
summary shall include part selection, changes made to the parts lists,
procurement status, status on EEE related waivers, status on applicable
Alerts and resolution, problem descriptions and resolutions. Action
items shall be documented, tracked and reported as part of the monthly
status.

Organizations responsible for managing electronic parts programs at JPL
partners, system and subsystem contractors, shall provide monthly parts
program status to the project office and the PPM, during the last week
of every calendar month.

# **3.4 Waivers** 

Deviations from parts program requirements shall be resolved in
accordance with the project's established waiver process. JPL internal
process is defined in JPL D-16566, which is consistent with JPL D-15032
Procedure -- Category A and B Waivers. Partners and Subcontractor's
waiver or deviation request process will be reviewed by the PPM and
approved by the project.

##### 4.0 PARTS SELECTION AND STANDARDIZATION REQUIREMENTS

Only parts of acceptable quality, reliability, and radiation compliant
parts, as demonstrated through test and/or analysis that meet or exceed
the mission performance and reliability requirements, shall be selected
for use. Each supplier of flight electronics and EEE parts shall ensure
that part selections are appropriate for specific assembly requirements
and are consistent with the overall parts program requirements.

##### 4.1 Standard Parts 

For the \[PROJECT NAME\] project, standard parts are defined as those
that meet or exceed the following reliability standards:

1)  NPSL (NASA Parts Selection List) Level-1

2)  MIL-PRF-38534 Class K, QML-38534 with exceptions per paragraph 4.4

3)  MIL-PRF-38535 Class V, QML-38535 with exceptions per paragraph 4.4

4)  MIL-PRF-19500 JANS, QPL-19500

5)  MIL-PRF-19500, JANTXV, QPL-19500 with upscreening per Appendix I

6)  MIL-O-55310, Class S for all Crystal Controlled Oscillators

7)  NPSL Level-2 active microcircuits, JANTXV diodes and transistors
    with PIND, DPA and radiographics upscreening

8)  NPSL (NASA Parts Selection List) Level-2, passive devices

##### 4.2 Non-Standard Parts 

Parts not meeting the minimum quality and reliability criteria of
standard parts in 4.1 are defined as non-standard parts. Unique, custom
parts and commercial microcircuits(COTS, PEMS, etc) are considered
non-standard. Non-standard parts of verified acceptability may be
procured only after approval by the PPM. In order to obtain approval for
use, JPL approved NSPAR form (Attachment I) shall be used. NSPARs shall
be submitted with full supporting data including reliability test
data/analysis, radiation test data/analysis, procurement SCDs and
screening specifications that comply with the Minimum Parts Requirements
of Appendix A and any other pertinent data to lend support to the
approval of the part.

Parts procurement should not take place until the NSPAR has been
approved by the PPM. All non-standard parts shall be upgraded/screened
in accordance with paragraph 5.2.3 herein.

##### 

# **4.2.1 Die Requirements**

# All die used in flight hardware must be from a Class B wafer lot or better. Die must either meet [Guidelines for Insuring Known-Good-Die (KGD) in JPL Space Flight Hardware,]{.underline} JPL D-16389, Level B requirements, Section 13.0 "KGD Minimum Requirements for JPL Level S and JPL Level B" or meet the Class K requirements of MIL-PRF-38534D. 

# Microcircuits and semiconductor dice from a QML/QPL certified manufacturer's "Wafer Bank" do not require life test; devices not from a QML/QPL certified manufacturing facility require a \[XXXX\] device hours life test.

# 

#  

##### 4.3 Application Specific Integrated Circuit (ASIC) Requirements 

All ASIC devices shall be in conformance with MIL-PRF-38535. All ASIC
developments for the project shall have Preliminary Design Reviews,
Critical Design Reviews, Manufacturing Readiness Review, and Monthly
Management Reviews to monitor technical, budget, and schedule progress.
The Parts Program Manager and Parts Specialists shall participate in all
reviews.

The design reviews will address as a minimum, derating requirements,
element evaluation and quality levels, radiation effects evaluation,
verification of controlled engineering materials, processes, thermal and
other design analysis as applicable to mission requirements. All phases
of ASIC design and manufacturing require PPM approval.

# **4.3.1 Digital ASIC Test Requirements**

Digital logic circuitry in ASICs (including microprocessor,
microcontroller and all custom designs) shall be tested to at least
\[XX\]% stuck-at fault coverage as is defined by MIL-STD-883, Method
5012. Quiescent current (all vector IDDQ method) tests shall be based on
a set of vectors that will toggle \[XXX\]% of the nodes. Additional
tests shall be conducted that include:

1)  Operating speed (or maximum testable speed) functional test to
    verify all functions of the design

2)  DC and AC parametric test vectors.

# **4.3.2 Mixed-signal ASIC Test Requirements**

For mixed-signal ASICs, the digital portions shall be tested as above.
The analog portions shall be SPICE modeled and tests performed to
measure the correspondence of the actual part to the SPICE models. The
ASIC designer and the part manufacturer will jointly specify these
tests.

##### 4.4 Hybrid Microcircuit Requirements 

Hybrid devices shall be in conformance with requirements of Class K
reliability level of MIL-PRF-38534 except Class B die may be used with a
22 piece element evaluation sample size. Pre-cap visual inspection and
document review(e.g. element evaluation, burn-in data and rework
travellers) prior to seal is required for all hybrids. All projects
requiring hybrid microcircuits shall have Preliminary Design Reviews,
Critical Design Reviews, Manufacturing Readiness Review, and Monthly
Management Reviews to monitor technical, budget, and schedule progress.
The Parts Program Manager and Parts Specialists shall participate in all
reviews. The design reviews will address, as a minimum; derating
requirements, element evaluation and quality levels, radiation effects
evaluation, verification and control of materials, processes, thermal
and other design analysis as applicable to mission requirements.

To ensure high yields in small lot production runs, all substrates for
use in hybrids or MCMs, shall have the following additional testing
beyond the requirements of MIL-PRF-38534D:\
100% Screening Requirements including samples used for qualification:

+----------------+--------+---------------------------------+--------+
| Test           | Method | Condition                       | Qu     |
|                |        |                                 | antity |
+----------------+--------+---------------------------------+--------+
| Temperature    | 1010   | E, 10 cycles@-65^0^C to         | 100%   |
| Cycling        |        | 300^0^C.                        |        |
+----------------+--------+---------------------------------+--------+
| Electrical     |        |                                 | 100%   |
| testing        |        |                                 |        |
+----------------+--------+---------------------------------+--------+
| \*Acoustic     | JEDEC  | All internal features meet      | 100%   |
| Microscopy     |        | specified substrate design      |        |
|                | S      | requirements                    |        |
|                | td-035 |                                 |        |
+----------------+--------+---------------------------------+--------+
| Radiographic   | 2012   | All internal features meet      | 100%   |
|                |        | specified substrate design      |        |
|                |        | requirements                    |        |
+----------------+--------+---------------------------------+--------+

> \*Most Acoustic Microscopy techniques require a medium, such as
> de-ionized water, to propagate the sound waves that surrounds the
> substrate. If moisture is a concern, perform this test as a
> qualification.

Qualification Requirements on at least a sample of 2 substrates:

  ----------------- --------- --------------------------------- ----------
  Test              Method    Condition                         Quantity

  Cross-section\*                                               2(0)

  High temperature                                              2(0)
  aging with                                                    
  additional                                                    
  adhesion testing                                              
  ----------------- --------- --------------------------------- ----------

\*Perform sufficient cross-sections and inspect under high magnification
to verify all internal features meet specified substrate design
requirements

In addition, in-process inspection points that ensure adequate yield per
project needs shall be called out in the travelers and inspected by JPL
QA.

##### 

##### 4.5 Non-Compliant Parts 

Whenever a standard or non-standard part fails to comply with the
requirements established herein, a deviation or non-conformance report
(NCMR) shall be generated. NCMR must be resolved or a waiver must be
processed and approved for parts in this category.

# 

##### 4.6 Parts List Review 

All contractors and partners delivering flight hardware shall submit EEE
parts lists to PPM at JPL for review and approval. A written review by
the JPL's Electronic Parts Engineering Office (Office 514 Component
Specialists and Radiation Effects Group Specialists) with parts pedigree
risk rating, will be performed on a complete part list of all project
electronic assemblies. The PPM will evaluate the results of the review.

All organizations, including system and subsystem contractors,
responsible for electronic hardware, shall provide monthly electronic
parts engineering status (including all changes to parts lists) to the
JPL Parts Program Manager. The JPL Parts Program Manager will conduct a
Monthly Management Review (MMR) which includes all changes to the
electronic hardware.

The parts lists submitted for review shall include as a minimum, flight
part number, generic part number, part description (e.g., ceramic
capacitor, or quad nor gate), value/tolerance/rating, part manufacturer,
and quantity used.

Parts Lists shall be provided in Microsoft Excel 97 format for easy
electronic filing and communications.

Part selections should be reviewed by the PPM as early in the design
phase as possible, and as often as the parts lists are revised. Parts
list reviews, at least three months or ninety (90) days prior to PDR and
CDR is highly recommended for inclusion into the presentation packages.

Parts approval takes place in three stages.

1)  "Parts Approval for Procurement" is defined as:

    a.  all radiation requirements per paragraph 3.1 have been
        demonstrated or waived by the Radiation specialists and the part
        reliability conforms to the minimum reliability standards of
        paragraph 4.1 or

    b.  a NSPAR has been written and approved.

2)  "Parts Approval for Manufacture" is defined as a part that the
    selected vendor has agreed to manufacture per the SCD or
    manufacturer's data sheet for a cost and schedule that is acceptable
    to the project.

3)  "Parts Approval for Flight Use" is defined as flight parts that have
    been delivered to the procuring agency and all RLAT, screening and
    qualification data has been reviewed and approved by the appropriate
    parts specialist.

# **4.6.1 As-Built Parts List**

An as-built parts list shall be released prior to hardware integration
and test. In addition to the information required in the preliminary
parts lists, the as-built parts list shall include for each different
part the actual part marking, part number, manufacturer, lot date code,
serial number (for serialized parts), wafer and wafer lot numbers (when
required), parts test lot numbers (where applicable), procurement
specification number, traceability number (when assigned by the
cognizant parts organization), the serial number and part number of the
next assembly level into which the part is installed (e.g., board or
module), and the reference designator of the location where each part is
used on the next assembly level. The as-built parts list shall be
supplied to the PPM in Microsoft Excel 97 electronic format.

##### 4.7 Radiation Effects

All parts shall be reviewed, evaluated and where necessary tested for
characterization, against the system radiation requirements. These
requirements may consist of tolerance to Total Ionizing Dose (TID)
and/or single event effects (SEE), such as single event upset (SEU),
single event burnout (SEB), single event gate rupture (SEGR), or single
event latch-up (SEL) as defined in paragraph 3.1.

##### 

##### 4.7.1 Radiation Lot Acceptance Testing (RLAT) 

Device types that are shown to be marginal by a TID characterization
test or analysis, if still requested for use in flight equipment, shall
be subjected to RLAT. The RLAT specifications and requirements shall be
reviewed and approved by the project cognizant engineer(s), PPM and
Radiation Engineering Group prior to start of testing. Radiation related
testing and evaluations shall be done in accordance with MIL-STD-883,
Method 1019.4.

##### 4.7.2. Dose Rates 

All linear bipolar ICs shall be tested both at 50 rad(Si)/s and 0.005
rad(Si)/s to three times (3x) the expected TID environment (without
RDM). An alternate form of this dose rate testing may be used if
approved by the PPM. Enhanced low dose rate (ELDR) effects shall be
evaluated and results reported to PPM to assure that parametric
degradation due to ELDR have been accounted for worst case analysis. All
other types of IC's and discrete transistors shall be tested at 50
rad(Si)/s and 0.005 rad(Si)/s to three times (3x) the expected TID
environment (without RDM).

##### 4.7.3 Total Ionizing Dose (TID) Level 

All flight parts are expected to operate within post-irradiation
specification limits following exposure to twice (2x) the expected total
dose environment specified in paragraph 3.1. The TID radiation
environment includes all radiation components, X-rays, gamma rays,
protons, electrons, neutrons and heavy ions.

##### 4.7.4 Displacement Damage 

All devices shall be evaluated for displacement damage sensitivity based
on mission requirements and part technology. Potentially susceptible
parts include, but are not limited to, optical devices, photo-detectors,
charge-coupled devices, optocouplers, LEDs, laser diodes and precision
bipolar linear devices. Those parts that are deemed to be potentially
susceptible will be tested to the mission's proton and electron fluence
levels. For parts found to be susceptible that must be used in flight
equipment, a waiver shall be initiated and submitted to the Parts
Program Manager for disposition.

##### 4.7.5 Single Event Effects (SEE)

####  {#section-22 .unnumbered}

#### **4.7.5.1 Single Event Upset (SEU)** {#single-event-upset-seu .unnumbered}

All microcircuits containing bistable elements (e.g. flip-flops,
counters, RAMs, microprocessors, etc.) shall be characterized so that an
upset rate calculation can be performed. A sufficient number of data
points (a minimum of three) shall be taken to determine the curve of
device cross section versus LET (to saturation or to an LET of 75
MeV-cm2/mg, whichever comes first).

The requirements for parts SEU acceptability are:

-   No upsets during SEU testing to above specifications , or

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-   Verification of device bit error rate of 10^-10^ per day or better
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-   Calculation of a device\'s upset rate shall be equal to or less than
    the required circuit upset rate (if available).

####  {#section-23 .unnumbered}

#### **4.7.5.2 Single Event Latchup (SEL)** {#single-event-latchup-sel .unnumbered}

All devices (including those with epitaxial layers) shall be subject to
latchup evaluation. All parts shall exhibit no latchup with an LET of
\[XX\] MeV-cm2/mg.

####  {#section-24 .unnumbered}

#### **4.7.5.3 Single Event Gate Rupture (SEGR)** {#single-event-gate-rupture-segr .unnumbered}

All power MOSFETs operated in the off-mode may be susceptible to, and
shall be evaluated for, single event gate rupture (SEGR) at the lowest
application V~GS~. The survival voltage (V~DS~) shall be established
from the SEE test requirements in paragraph 3.1. The application voltage
shall be derated to 75% of the established survival voltage.

####  {#section-25 .unnumbered}

#### **4.7.5.4 Single Event Burnout (SEB)** {#single-event-burnout-seb .unnumbered}

Test requirements for single event burnout are similar to those for SEGR
except that the drain current (or collector current for bipolar
transistor) must be measured to determine if burnout occurs. The
application voltage shall be derated to 75% of the established survival
voltage.

**4.7.5.5 Single Event Transient (SET)**

####### All linear, mixed-signal, optocoupler and GaAs devices shall be evaluated in the circuit application for susceptibility to SETs with heavy ions based on the standard Galactic Cosmic Radiation (GCR) model.

##### 5.0 PARTS ACQUISITION 

##### 5.1 Use of Residual (Heritage) Parts Inventory 

Residual EEE parts from previous projects or procurements may have a
high probability of meeting the new project part requirements. Parts in
this category shall have been maintained in controlled storage per the
procuring agency's QA requirements and have the original screening data
or acceptance information available for re-evaluation and comparison to
the new project requirements. All such parts shall be reviewed and
approved by the project PPM prior to any stores transfer or use by the
project.

##### 5.2 Parts Procurement 

Parts for flight equipment shall be procured directly from the approved
part manufacturers or when traceability to the manufacturer can be
established, procured from an authorized distributor. Parts shall not be
purchased until all the requirements specified herein have been met
and/or authorized by the PPM. Non-flight parts may be procured only for
non-flight applications.

Any additional testing, inspection, or additional evaluation of procured
parts shall be performed to JPL approved specifications and only at JPL
approved test facilities or laboratories.

Purchase orders and/or purchase requisitions shall not contain
exceptions to referenced specifications or requirements unless approved
via the NSPAR.

##### 5.2.1 Traceability 

All flight parts purchased shall be traceable to a specific
manufacturer, part number, and lot number or lot date code. In addition,
parts requiring serial numbers will have traceability to test data
associated with the same lot.

##### 5.2.1.1 Single Wafer Lot Traceability

Radiation hardness testing shall be performed on a sample of parts from
the same single wafer lot. The minimum sample size is as indicated in
Figure 2; more devices may be required depending on mission
requirements, device type and technology.

  -------------- ------------------------- ------------------- ----------------------- -------------------- ----------------------- ------------------------
                                           [Sample             [Bipolar]{.underline}   [CMOS]{.underline}   [Optical]{.underline}   [Comments]{.underline}
                                           Size]{.underline}                                                                        

  Total Ionizing                                                                                                                    
  Dose(TID)                                                                                                                         

                 High Dose Rate(plus       10                  x                       x                                            
                 anneal)                                                                                                            

                 Accelerated Temp Moderate 5                   x                                                                    Gives indication if
                 Dose Rate Testing                                                                                                  enhanced low dose
                                                                                                                                    problems exist; does not
                                                                                                                                    quantify failure dose at
                                                                                                                                    space rate

                 Enhanced Low Dose         10                  x                                                                    Only performed if test
                 Rate(ELDR) Testing                                                                                                 above indicates an ELDR
                                                                                                                                    problem. NOTE: lengthy
                                                                                                                                    test; need to allow for
                                                                                                                                    sufficient schedule

                                                                                                                                    

  Single Event                                                                                                                      
  Effects(SEE)                                                                                                                      
  Testing                                                                                                                           

                 Destructive Tests                                                                                                  

                 -Single Event             5                                           x                                            Measure LET threshold
                 Latchup(SEL)                                                                                                       and characterize
                                                                                                                                    saturation cross-section

                 -Single Event Gate        15                                          x                                            Mostly power MOSFETS and
                 Rupture(SEGR)                                                                                                      some scaled CMOS

                 Non-destructive                                                                                                    

                 -Single Event Upset(SEU)  3                                           x                                            

                 -Single Event Functional  3                                           x                                            Sample size varies with
                 Interrupt(SEFI)                                                                                                    rad hardness; 1Mrad -
                                                                                                                                    20Krad, Control
                                                                                                                                    registers within DSPs,
                                                                                                                                    microprocessors,
                                                                                                                                    memories, etc

                 -Single Event             3                   x                                            x                       Linear Devices,
                 Transient(SET)                                                                                                     Optocouplers & Optical
                                                                                                                                    detectors

                                                                                                                                    

  Displacement                                                 5                       x                                            x
  Damage                                                                                                                            
  -------------- ------------------------- ------------------- ----------------------- -------------------- ----------------------- ------------------------

####### Figure 2. Radiation Hardness Testing Minimum Sample Size

##### 5.2.2 Parts Data Requirements and Data Retention 

All test and evaluation data must be submitted to the PPM for review and
approval (electronic format is preferred). The manufacturer's or
vendor's certificate of conformance for each electronic part lot shall
be obtained by the procuring activity and retained for a period of
launch plus three years. The parametric data shall be traceable to each
serialized part. All variables and attributes data generated in
compliance with the specification shall be delivered to the procuring
activity. The data shall be reviewed by the procuring activity for
technical acceptability and completeness. The read and record data may
be required when the project needs to establish worst case circuit
analysis parametric data points. This shall be included in the parts
procurement as requested by the project.

##### 5.2.3 Screening and Additional Test Requirements

All non-standard parts in applications that require NPSL (NASA Parts
Selection List) Level-1 reliability shall be upgraded/screened in
accordance with either SSQ 25001. Otherwise, use the flow in the Minimum
Parts Requirements in Appendix A.

##### 5.2.4 Post-Programming Burn-In for Programmable Devices 

For \"one time\" programmable devices (i.e. PROMs and FPGAs) a post
programming 96-hour burn‑in (PPBI) at 125°+0°-3°C, followed by DC
parametric (at all three temperatures, -55°, 25° and 125°C) and all
functional testing is required. The procuring activity and/or the agency
performing the testing shall furnish test specifications, including
burn-in circuit to the PPM at JPL for review and approval.

##### 5.2.5 Destructive Physical Analysis (DPA) 

DPAs shall be performed on a representative sample size of each
manufacturing lot date code of all nonstandard packaged parts (including
MCM's and hybrids). MIL-C-39010 inductors/transformers shall be
sectioned to examine the adequacy of the termination.

DPAs shall be performed at a JPL approved laboratory using SSQ25000. The
results of the DPA shall be evaluated by JPL and the lot shall be
accepted or rejected based on the criteria of the specification.

##### 5.2.6 Customer Source Inspection(CSI) 

Pre-seal visual inspection shall be performed on all packaged flight
ASICs, hybrid microcircuits, MCMs, crystal oscillators, and nonstandard
relays by the procuring agency. All flight die will be inspected and a
sample of 10 will be inspected under a microscope, x200 magnification,
by the procuring agency's QA prior to shipping. Only gel packs will be
used for storing and shipping flight die; waffle packs are not allowed
due to potential die damage.

##### 6.0 ELECTRONIC PARTS APPLICATION AND DERATING 

##### 6.1 Parts Derating 

Each part used in flight equipment shall be applied in a manner such
that the temperatures experienced and electrical stresses produced when
it is operating do not exceed the derating criteria defined in
JPL-D-8545.

##### 6.2 Handling / Storage / Electrostatic Discharge (ESD) Control Requirements 

ESD damage or degradation may occur in static-sensitive electronic parts
during handling of the parts from procurement through incoming
inspection, testing, screening, storing and final assembly/test. To
protect static-sensitive parts from ESD, handling of parts shall be
controlled by the requirements of JPL D-1348, or equivalent.

##### 6.3 NASA and Government Industry Data Exchange Program (GIDEP) Alerts 

All hardware-delivering design agencies, both internal and external to
JPL, shall establish and implement a system to review GIDEP Alerts, take
appropriate action, and notify their respective GIDEP Alert coordinators
of significant parts problems that may warrant issuance of new Alerts.

Design agencies which do not presently receive Alerts directly should
request distribution from the Defense Supply Center Columbus (DSCC),
GIDEP Operations Center or the JPL Alert Coodinator. The design agency
is responsible for reviewing all Alerts, and for immediately reporting
corrective action for applicable Alerts (i.e. for parts used in the
hardware) to the project and appropriate Alert Coordinator.

The design agency shall present a report at the CDR, and another at the
Pre-Ship Review, that lists all of the Alerts which are pertinent to the
parts used in the flight design, the possible impact should the part
fail, and the actions proposed and those taken. It is the responsibility
of the design agency to avoid the use of defective parts in flight
equipment.

##### 6.4 Failure Analysis 

Failure analysis is required for all part failures that occur subsequent
to screening. The Parts Program Manager shall be notified in writing
within 3 days of any failure occurrence. The only exceptions are parts
damaged by human error (e.g., improper installation). Analysis shall be
carried to the point that lot dependency of the failure mode can be
determined. Failure analysis reports shall be written to document the
analysis approach, the determined failure mode and mechanism (i.e.,
cause) responsible for the failure, and the corrective actions required
to prevent recurrence of the failure. If a lot dependency is found, the
PPM will disposition the parts using a non-conformance report (NCMR).

##### 7.0 SURPLUS PARTS 

All unused flight EEE parts shall be returned to JPL Flight Stores.
These parts shall be subjected to receiving inspection processes before
they are re-certified to be flight-worthy by quality assurance and
Office 514.

**8.0 ACRONYM LIST**

The following is a list of the acronyms and their meanings used in this
document:

[Acronym]{.underline} [Meaning]{.underline}

#  ASIC Application Specific Integrated Circuit

CSI Customer Source Inspection

DPA Destructive Physical Analysis

DSCC Defense Supply Center Corporation

ESD Electrostatic Discharge

EEE Electrical, Electronic, and Electromechanical

EPPP Electronic Parts Program Plan

ESD Electrostatic Discharge

FPGA Field Programmable Gate Arrays

GIDEP Government Industry Data Exchange Program

LET Linear Energy Transfer

MCM Multi-Chip Module

MeV Mega (Million) Electron Volts

NCMR Non-Conformance Report

NSPAR Non-Standard Parts Approval Request

PAPL Program Authorized Parts List

PEM Plastic Encapsulated Microcircuits

PEPE Provide Electronic Parts Engineering processes

used by JPL Electronic Parts Engineering, Section 514

PIND Particle Impact Noise Detection testing

PPE Parts Program Engineer

PPM Parts Program Manager

PPR Parts Program Requirements

PRB Parts Review Board

PPBI Post Programming Burn-In

PPM Parts Program Manager

PROM Programmable Read Only Memories

RLAT Radiation Lot Acceptance Test

SCD Source Control Document

SEB Single Event Burnout

SEE Single Event Effect

SEGR Single Event Gate Rupture

SEL Single Event Latch-up

SET Single Event Transient

SEU Single Event Upset

TID Total Ionizing Dose

**ATTACHMENT I**

**NONSTANDARD PART APPROVAL REQUEST (NSPAR)**

+------------------------------------+-------+----+--------------------+
| CONTRACT NUMBER:                   | NSPAR |    |                    |
|                                    | NU    |    |                    |
|                                    | MBER: |    |                    |
|                                    |       |    |                    |
|                                    | REV.  |    |                    |
|                                    |       |    |                    |
+------------------------------------+-------+----+--------------------+
| PROJECT NAME:                      | GE    |    |                    |
|                                    | NERIC |    |                    |
|                                    | PART  |    |                    |
|                                    | NU    |    |                    |
|                                    | MBER: |    |                    |
|                                    |       |    |                    |
+------------------------------------+-------+----+--------------------+
| CONTRACTOR:                        |       |    |                    |
+------------------------------------+-------+----+--------------------+
| SUBCONTRACTOR:                     |       |    |                    |
+------------------------------------+-------+----+--------------------+
| SYSTEMS & COMPONENT: Refer to next |       |    |                    |
| level assembly "Where used List"   |       |    |                    |
+------------------------------------+-------+----+--------------------+
| PART NAME:                         |       | GI |                    |
|                                    |       | DE |                    |
|                                    |       | P/ |                    |
|                                    |       | IN |                    |
|                                    |       | DU |                    |
|                                    |       | ST |                    |
|                                    |       | RY |                    |
|                                    |       | A  |                    |
|                                    |       | LE |                    |
|                                    |       | RT |                    |
+------------------------------------+-------+----+--------------------+
| PART NUMBER:                       |       |    |                    |
|                                    |       | Y  |                    |
|                                    |       | ES |                    |
|                                    |       | N  |                    |
|                                    |       | UM |                    |
|                                    |       | BE |                    |
|                                    |       | R: |                    |
|                                    |       |    |                    |
|                                    |       |    |                    |
|                                    |       |    |                    |
|                                    |       |    |                    |
|                                    |       | NO |                    |
+------------------------------------+-------+----+--------------------+
| MANUFACTURER:       CAGE CODE:     |       |    |                    |
|                                    |       |    |                    |
+------------------------------------+-------+----+--------------------+
| PROCUREMENT SPEC.       REV.:      |       |    |                    |
|                                    |       |    |                    |
+------------------------------------+-------+----+--------------------+
| SCREENING SPEC:       REV.:        |       |    |                    |
+------------------------------------+-------+----+--------------------+
| **RATIONAL FOR USE OF NONSTANDARD  |       |    |                    |
| PART**:                            |       |    |                    |
|                                    |       |    |                    |
| 1.                                 |       |    |                    |
|                                    |       |    |                    |
| 2.                                 |       |    |                    |
+------------------------------------+-------+----+--------------------+
| **BASIS FOR ACCEPTANCE**:          |       |    |                    |
|                                    |       |    |                    |
| 1.                                 |       |    |                    |
|                                    |       |    |                    |
| 2.                                 |       |    |                    |
|                                    |       |    |                    |
| 3.                                 |       |    |                    |
|                                    |       |    |                    |
| 4.                                 |       |    |                    |
+------------------------------------+-------+----+--------------------+
| **CONTRACTOR CERTIFICATION:**      |       |    |                    |
|                                    |       |    |                    |
| PREPARED BY: (User / Requester )   |       |    |                    |
| Title (Design Engineer, others as  |       |    |                    |
| applicable) Date                   |       |    |                    |
+------------------------------------+-------+----+--------------------+
| **CUSTOMER APPROVALS:**            |       |    |                    |
+------------------------------------+-------+----+--------------------+
| APPROVED BY:                       |       |    | Date               |
|                                    |       |    |                    |
| > Title (JPL PPM)                  |       |    |                    |
+------------------------------------+-------+----+--------------------+
| APPROVED BY:                       |       |    | Date               |
|                                    |       |    |                    |
| > Title (JPL Project Office)       |       |    |                    |
+------------------------------------+-------+----+--------------------+

**GUIDENCE FOR ENTERING INFORMATION ON THE NSPAR FORM**

Parts Program Requirements document define standard and nonstandard
parts for a project. Approval must be obtained before the use of a
nonstandard part. The vehicle to request the approval and use of a
nonstandard part is the NSPAR form as defined by the Parts Program
Requirements (PPR) document

Requester must provide all the required information/data as follows:

Line 1 - Enter the contract number assigned by JPL. Enter a unique NSPAR
number and revision letter for tracking purposes. Revise NSPAR as
necessary and update the Rev status

Line 2 - Enter the project name. Enter the generic (Off-the-shelf) part
number

Line 3 - Enter the name of the company (the contractor's name)

Line 4 - Enter the name of the subcontractor, as applicable

Line 5 - Enter the name and number of the system, subsystem and assembly
where the part is being used

Line 6 - Enter the name/description of the part. (Transistor, MOSFET;
IC, Microprocessor, etc.)

Line 7 - Enter the flight part number or the part number to be procured.
Check off appropriate box for the "Alert" search completed and if any
alert is applicable or not.

Line 8 - Enter the name of the part manufacturer, and manufacturers CAGE
code number (QPL source is not a manufacturer, must provide the name of
the QPL/QML manufacturer)

Line 9 - Enter the procurement specification number and revision letter
if the part is being procured to an SCD. Enclose a copy of this
specification when the NSPAR is submitted for approval.

Line 10- Enter the screening specification number and revision letter if
the part is procured against one number and than being up-screened or
re-screened before put in bonded stores for flight. Enclose a copy of
this specification when the NSPAR is submitted for approval

Line 11- Provide rationale for the use of nonstandard part. (E.g., No
other standard part is available, schedule or cost prohibitive, etc).
Add supplemental pages if needed

Line 12- Explain and provide technical reasons why this part should be
acceptable, how the part will meet mission and application requirements
including radiation hardness, and what is being done additionally to
make it acceptable. Add supplemental pages if needed. Provide any
supporting data, analysis, qualification reports and others.

Line 13- Contractor/Agency certifies by signature and date that the
information provided in this NSPAR is truthful and correct and that once
approved, the contractor shall meet as a minimum all of their
obligations and requirements as stated in this form.

Any deviations or changes made by the contractor must be documented and
on this form and resubmitted for approval.

Line 14- This part of the form is for JPL use only. The project
signature authority shall be as defined by

the project manager

**APPENDIX I**

[JPL Minimum Parts Requirements]{.underline}

The following represents the JPL Minimum Parts Requirements. Parts that
fail to meet this requirement will require a waiver. All parts not
meeting the parts standards of paragraph 3.1 requiring NSPARS will be
subjected to the testing described herein.

It is becoming harder to procure space-qualified electronic parts due to
the relative low profitability of low volume, high reliability devices
as compared to large volume, commercial devices. In addition, higher
performing, higher density state-of-the-art devices that are mission
enabling are only available, many times, commercially. It has become
apparent that projects must have a set of screening and qualification
requirements to allow them to use commercial devices in space
applications that, although not as reliable as space-qualified devices,
can meet project needs.

It is important to understand that upscreening commercial devices
carries much more risk than procuring pre-qualified and pre-screened
devices. Vendors that agree to provide Level 1 or Level 2 parts are
contractually responsible to begin a new lot of parts if the first lot
does not pass qualification testing or does not yield sufficient amounts
that successfully pass screening. [The project assumes the risk if a lot
does not pass qualification testing or does not yield sufficient amounts
that successfully pass screening when upscreening commercial
devices]{.underline}. Commercial parts typically are only visually
inspected before and after packaging and have electrical parameters
tested at room temperature. Since Commercial-Off-The-Shelf(COTS) parts
can come from different wafers fabricated on different lines in
different countries, pre-qualification of a sample of parts does not
guarantee successful upscreening of another group of parts procured at a
future time. It is essential that when a commercial device is chosen
that testing be performed in an expedited manner to reduce risk of
unsuccessful upscreening of devices.

The parts reliability level can be characterized as Class B+ tailored to
mission requirements. Additional screening required for microcircuits,
transistors and diodes is PIND, DPA and radiographics and additional
qualification testing required is vapor content for non-hermetic devices
and life test to an equivalent of 2 times (2x) mission life per MIL-
STD-883.

Due to the different mechanical stress testing that are appropriate for
different package types, the requirements are divided by package type:
Plastic Encapsulated Microcircuits (PEMs), hermetic devices and
non-hermetic devices. Within each package type, there are three types of
testing: pre-qualification testing, qualification testing and screening
tests as described in the flow of Figure A1.

Pre-qualification testing, as described in Figure A2 & A3, is required
for new part types with little pedigree or flight history; this can be
waived by the specialist for parts with known flight history.
Pre-qualification testing is intended to be performed on a sample of
commercial, non-flight parts before committing to procuring flight
parts.

Qualification testing, as described in Figure A3, A4 & A5, is required
of all parts types on a sample of the flight parts. Sample sizes are
greater than in pre-qualification testing because the tests are
qualifying the whole lot of flight parts. The order in which the tests
are shown in the flow of Figure A2 is important and is intended for
commercial devices; the first four tests are qualification tests and
must be passed successfully before proceeding to screening the flight
parts. The life test can be performed on the same parts that were used
for burn-in to accumulate the equivalent of twice the mission life.

Screening requirements, as described in Figure A4, A5 & A6 are tailored
to mission requirements. Temperature extremes are 10^0^C beyond mission
operating temperatures. Burn-in is tailored to manufacturer's recommends
maximum operating temperature since the device is typically designed for
0^0^C to 70^0^C. The life test requires accumulation of an equivalent of
twice the mission life.

Figure A1. Minimum Parts Requirements Test Flow

  ------ ------------ -------------- -------------------- --------- ---------------------- --------
  Step   Test         Required       Reject Criteria      Sample    Purpose                Qual/
                                     (rejects reviewed by Size                             Screen
                                     specialist)                                           

  1      Radiation    Test to        Failure to meet data 5(0) +    Ensure parts do not    Qual
                      project        sheet parametrics or control   fail and characterize  
                      requirements   mission application            for parametric         
                                     per radiation                  variation at maximum   
                                     specified, whichever           project radiation      
                                     is worse.                      requirements           

  2      Outgassing   TML\<1%;       Test to ASTM E595.93 2(0)      Ensure outgassing does Qual
                      CVCM\<1%;                                     not exceed project     
                      WVR\<30%                                      requirements           

  3      Humidity     85C/85RH or    Test to JEDEC        5(0)      Ensure parts do not    Qual
                      other test     Std-22-B TM-A101               fail and characterize  
                                                                    for parametric         
                                                                    variation at maximum   
                                                                    project requirements   

  3      Temp Cycle   Data sheet     100 cycles over      5(0)      Determine robustness   Qual
                      min/max temps  manufacturer\'s                of materials and       
                      or Tmin-10C,   guaranteed                     processes to temp      
                      Tmax+10C,      temperature extremes           extremes               
                      whichever      or application                                        
                      greater        temperature range                                     
                                     plus 10deg C margin,                                  
                                     whichever greater.                                    

  4      DPA          SEM / Cross    Any abnormal         5(0)      Assess basic wafer &   Qual
                      section of     processing                     package construction & 
                      steps, vias,   especially with                fabrication processes  
                      contacts.      metalization.                                         
                                     Thinning, voids,                                      
                                     notches, or apparent                                  
                                     aberrations will be                                   
                                     recorded.                                             
  ------ ------------ -------------- -------------------- --------- ---------------------- --------

Figure A2. Pre-Qualification Requirements for PEMs & non-Hermetic
Devices

  ------ ----------- -------------- -------------------- -------- ---------------------- --------
  Step   Test        Required       Reject Criteria      Sample   Purpose                Qual/
                                    (rejects reviewed by Size                            Screen
                                    specialist)                                          

  1      Radiation   Test to        Failure to meet data 5(0)     Ensure parts do not    Qual
                     project        sheet parametrics or          fail and characterize  
                     requirements   mission application           for parametric         
                                    per radiation                 variation at maximum   
                                    specified, whichever          project radiation      
                                    is worse                      requirements for TID,  
                                                                  SEE & ELDR             

  2      Humidity    85C/85RH or    Test to JEDEC        5(0)     Ensure parts do not    Qual
                     other test     Std-22-B TM-A101              fail and characterize  
                                                                  for parametric         
                                                                  variation at maximum   
                                                                  project                
                                                                  requirements(Sample of 
                                                                  22(0) assumes 10%      
                                                                  LTPD)                  

  3      DPA         SEM / Cross    Any abnormal         5(0)     Assess basic wafer &   Qual
                     section of     processing                    package construction & 
                     steps, via,    especially with               fabrication            
                     contacts.      metalization.                 processes(Sample of    
                                    Thinning, voids,              22(0) assumes 10%      
                                    notches, or apparent          LTPD)                  
                                    aberrations will be                                  
                                    recorded.                                            
  ------ ----------- -------------- -------------------- -------- ---------------------- --------

Figure A3. Pre-Qualification Requirements for Hermetic Devices

  ------ --------------- --------------- --------------------- --------- --------------------- --------
  Step   Test            Required        Reject Criteria       Sample    Purpose               Qual/
                                         (rejects reviewed by  Size                            Screen
                                         specialist)                                           

  1      Radiation       Test to project Failure to meet data  Per para  Ensure parts do not   Qual
                         requirements    sheet parametrics or  5.2.1.1   fail and characterize 
                                         mission application             for parametric        
                                         per radiation                   variation at maximum  
                                         specified, whichever            project radiation     
                                         is worse.                       requirements for TID, 
                                                                         SEE & ELDR            

  2      Outgassing      TML\<1%;        Test to ASTM E595.93  2(0)      Ensure outgassing     Qual
                         CVCM\<1%;                                       does not exceed       
                         WVR\<30%                                        project requirements  

  3      Humidity        85C/85RH or     Test to JEDEC         22(0)     Ensure parts do not   Qual
                         other test      Std-22-B TM-A101                fail and characterize 
                                                                         for parametric        
                                                                         variation at maximum  
                                                                         project               
                                                                         requirements(Sample   
                                                                         of 22(0) assumes 10%  
                                                                         LTPD)                 

  3      Temp Cycle      Data sheet      100 cycles over       22(0)     Determine robustness  Qual
                         min/max temps   manufacturer\'s                 of materials and      
                         or Tmin-10C,    guaranteed                      processes to temp     
                         Tmax+10C,       temperature extremes            extremes(Sample of    
                         whichever       or application                  22(0) assumes 10%     
                         greater         temperature range               LTPD)                 
                                         plus 10deg C margin,                                  
                                         whichever greater.                                    

  4      DPA             SEM / Cross     Any abnormal          22(0)     Assess basic wafer &  Qual
                         section of      processing especially           package construction  
                         steps,via,      with metalization.              & fabrication         
                         contacts.       Thinning, voids,                processes(Sample of   
                                         notches, or apparent            22(0) assumes 10%     
                                         aberrations will be             LTPD)                 
                                         recorded.                                             

  5      Serialization   Serialization   N/A                   N + NL +  Serialize to perform  Screen
                                                               NS        delta burn-in         
                                                                         measurements          

  6      Electricals     Test to data    Over manufacturer\'s  N + NL +  Establish baseline    Screen
                         sheet           guaranteed            NS        electrical            
                         parameters at   temperature extremes            performance meets     
                         +25C and data   or application                  spec                  
                         sheet min/max   temperature range                                     
                         temps or        plus 10deg C margin,                                  
                         Tmin-10C,       whichever greater.                                    
                         Tmax+10C,                                                             
                         whichever                                                             
                         greater.                                                              

  7      Temp Cycle      Data sheet      10 cycles over        N + NL +  Determine robustness  Screen
                         min/max temps   manufacturer\'s       NS        of materials and      
                         or Tmin-10C,    guaranteed                      processes to temp     
                         Tmax+10C,       temperature extremes            extremes              
                         whichever       or application                                        
                         greater         temperature range                                     
                                         plus 10deg C margin,                                  
                                         whichever greater.                                    

  8      X-Ray           Depending on    Photographs will be   N + NL +  Detect workmanship    Screen
                         part            reviewed by the       NS        flaws as well as      
                         technology;     Specialist                      effects of temp       
                         Mil-Std-883                                     cycling on devices    
                         method 2012 two                                                       
                         views                                                                 

  9      C-SAM           C-mode Scanning Delamination, voids,  N + NL +  Inspect for           Screen
                         Acoustic        or cracks: \> 10% of  NS        delamination and or   
                         Microscopy      area. Rejects will be           cracks and die        
                                         identified and                  surface, die attach,  
                                         recorded. Photographs           die pad integrity     
                                         will be reviewed by                                   
                                         the Specialist.                                       

  10     Electricals     Test to data    Pre-burn-in baseline  N + NL +  Measure change to     Screen
                         sheet @ 25C                           NS        electrical            
                                                                         performance due to    
                                                                         previous screens      

  11     Burn-In         Equivalent 1000 Burn-in temperature   N + NL +  Eliminate Infant      Screen
                         Operating Hours device dependent;     NS        Mortality. Commercial 
                         accelerated by  determined by                   parts max temp to     
                         temperature     specialist. If                  70C; burn-in \@125C   
                         using Ea=0.3eV  failures occur,                 may not be            
                                         subject to another              appropriate; requires 
                                         equiv 1000 op hrs.              lower burn-in         
                                                                         temperature. If       
                                                                         failures occur during 
                                                                         first burn-in trial,  
                                                                         need to subject parts 
                                                                         to a second burn-in   
                                                                         to ensure infant      
                                                                         mortality eliminated. 

  12     Electricals     Data sheet      Post-burn-in          N + NL    Measure change to     Screen
                         min/max temps   measurements required           electrical            
                         or Tmin-10C,    for delta                       performance due to    
                         Tmax+10C,       calculations and                burn-in to detect     
                         whichever       worst case parameter            gross changes in      
                         greater         variation. Delta                electrical            
                                         criteria determined             performance and       
                                         by specialist.                  establish parts       
                                                                         parameter variation   
                                                                         for worst case        
                                                                         analysis              

  13     Life Test       Equivalent 2 x  Use parts that        NL(from   Demonstrate adequate  Qual
                         Mission Life    already passed        parts     life of devices       
                         using Ea=1.0eV  burn-in at burn-in    passing                         
                                         temperature for       step 8)                         
                                         duration to yield                                     
                                         equivalent of two                                     
                                         mission lives.                                        

  14     End Point       Test to data    Over manufacturer\'s  NL        Ensure life test      Qual
         Electricals     sheet           guaranteed                      parts meet            
                         parameters at   temperature extremes            manufacturer spec     
                         +25C and data   or application                                        
                         sheet min/max   temperature range                                     
                         temps or        plus 10deg C margin,                                  
                         Tmin-10C,       whichever greater.                                    
                         Tmax+10C,                                                             
                         whichever                                                             
                         greater.                                                              
  ------ --------------- --------------- --------------------- --------- --------------------- --------

Figure A4. Qualification & Screening Requirements for PEMS

> N= number devices required for flight units plus spares Tmax= maximum
> application temperature
>
> NL= number of devices required for life tests Tmin= minimum
> application temperature
>
> NS= number of devices predicted to not pass screens ML= mission life

  ------ --------------- ----------------- --------------------- --------- ------------------ --------
  Step   Test            Required          Reject Criteria       Sample    Purpose            Qual/
                                           (rejects reviewed by  Size                         Screen
                                           specialist)                                        

  1      Radiation       Test to project   Failure to meet data  Per para  Ensure parts do    Qual
                         requirements      sheet parametrics or  5.2.1.1   not fail and       
                                           mission application             characterize for   
                                           per radiation                   parametric         
                                           specified, whichever            variation at       
                                           is worse                        maximum project    
                                                                           radiation          
                                                                           requirements for   
                                                                           TID, SEE & ELDR    

  2      Temp Cycle      Data sheet        100 cycles over       22(0)     Determine          Qual
                         min/max temps or  manufacturer\'s                 robustness of      
                         Tmin-10C,         guaranteed                      materials and      
                         Tmax+10C,         temperature extremes            processes to temp  
                         whichever greater or application                  extremes(Sample of 
                                           temperature range               22(0) assumes 10%  
                                           plus 10deg C margin,            LTPD)              
                                           whichever greater                                  

  3      DPA             DPA to SSQ25000   Any abnormal          22(0)     Assess basic wafer Qual
                                           processing especially           & package          
                                           with metalization.              construction &     
                                           Thinning, voids,                fabrication        
                                           notches, or apparent            processes(Sample   
                                           aberrations will be             of 22(0) assumes   
                                           recorded.                       10% LTPD)          

  4      Serialization   Serialization     N/A                   N + NL +  Serialize to       Screen
                                                                 NS        perform delta      
                                                                           burn-in            
                                                                           measurements       

  5      Temp Cycle      Data sheet        10 cycles over        N + NL +  Determine          Screen
                         min/max temps or  manufacturer\'s       NS        robustness of      
                         Tmin-10C,         guaranteed                      materials and      
                         Tmax+10C,         temperature extremes            processes to temp  
                         whichever greater or application                  extremes           
                                           temperature range                                  
                                           plus 10deg C margin,                               
                                           whichever greater                                  

  6      Constant        Mil-Std-883,      Pass/fail PIND        N + NL +  Indicate           Screen
         Acceleration    M2001             testing               NS        structural or      
                                                                           mechanical         
                                                                           weaknesses not     
                                                                           detected in shock  
                                                                           or vibration; may  
                                                                           be used to         
                                                                           determine          
                                                                           mechanical limits  
                                                                           of package,        
                                                                           internal           
                                                                           metallization and  
                                                                           lead system, die   
                                                                           or substrate       
                                                                           attachment.        

  7      PIND            Non-destructive   Detection of loose    N + NL +  Non-destructive    Screen
                         means of          particles             NS        means of detecting 
                         detecting loose                                   loose particles    
                         particles                                                            

  8      X-Ray           Depending on part Photographs will be   N + NL +  Detect workmanship Screen
                         technology;       reviewed by the       NS        flaws as well as   
                         Mil-Std-883       Specialist                      effects of temp    
                         method 2012 two                                   cycling on devices 
                         views                                                                

  9      Electricals     Test to data      Pre-burn-in baseline  N + NL +  Measure change to  Screen
                         sheet @ 25C                             NS        electrical         
                                                                           performance due to 
                                                                           previous screens   

  10     Burn-In         Equivalent 1000   Burn-in temperature   N + NL +  Eliminate Infant   Screen
                         Operating Hours   device dependent;     NS        Mortality.         
                         accelerated by    determined by                   Commercial parts   
                         temperature using specialist. If                  max temp to 70C;   
                         Ea=0.3eV          failures occur,                 burn-in \@125C may 
                                           subject to another              not be             
                                           equivalent 1000                 appropriate;       
                                           operating hrs                   requires lower     
                                                                           burn-in            
                                                                           temperature. If    
                                                                           failures occur     
                                                                           during first       
                                                                           burn-in trial,     
                                                                           need to subject    
                                                                           parts to a second  
                                                                           burn-in to ensure  
                                                                           infant mortality   
                                                                           eliminated.        

  11     Electricals     Data sheet        Post-burn-in          N + NL    Measure change to  Screen
                         min/max temps or  measurements required           electrical         
                         Tmin-10C,         for delta                       performance due to 
                         Tmax+10C,         calculations and                burn-in            
                         whichever greater worst case parameter                               
                                           variation. Delta                                   
                                           criteria determined                                
                                           by specialist.                                     

  12     Seal            Fine & Gross      per MIL-STD-883E,     N + NL    Ensure hermiticity Screen
                                           Method 1014                     of devices         

  13     Life Test       Equivalent 2 x    Use parts that        NL(from   Demonstrate        Qual
                         Mission Life      already passed        parts     adequate life of   
                         using Ea=1.0eV    burn-in at burn-in    passing   devices            
                                           temperature for       step 8)                      
                                           duration to yield                                  
                                           equivalent of two                                  
                                           mission lives                                      

  14     End Point       Test to data      Over manufacturer\'s  NL        Ensure life test   Qual
         Electricals     sheet parameters  guaranteed                      parts meet         
                         at +25C and data  temperature extremes            manufacturer spec  
                         sheet min/max     or application                                     
                         temps or          temperature range                                  
                         Tmin-10C,         plus 10deg C margin,                               
                         Tmax+10C,         whichever greater                                  
                         whichever greater                                                    
  ------ --------------- ----------------- --------------------- --------- ------------------ --------

Figure A5. Qualification & Screening Requirements for Hermetic Packages
(Ceramic, Glass & Metal)

> N= number devices required for flight units plus spares Tmax= maximum
> application temperature
>
> NL= number of devices required for life tests Tmin= minimum
> application temperature
>
> NS= number of devices predicted to not pass screens ML= mission life

+---+-----+----------+--------------------+----+------------------+---+
| S | T   | Required | Reject Criteria    | Sa | Purpose          | Q |
| t | est |          | (rejects reviewed  | mp |                  | u |
| e |     |          | by specialist)     | le |                  | a |
| p |     |          |                    | Si |                  | l |
|   |     |          |                    | ze |                  | / |
|   |     |          |                    |    |                  |   |
|   |     |          |                    |    |                  | S |
|   |     |          |                    |    |                  | c |
|   |     |          |                    |    |                  | r |
|   |     |          |                    |    |                  | e |
|   |     |          |                    |    |                  | e |
|   |     |          |                    |    |                  | n |
+---+-----+----------+--------------------+----+------------------+---+
| 1 | Rad | Test to  | Failure to meet    | P  | Ensure parts do  | Q |
|   | iat | project  | data sheet         | er | not fail and     | u |
|   | ion | requ     | parametrics or     | pa | characterize for | a |
|   |     | irements | mission            | ra | parametric       | l |
|   |     |          | application per    | 5  | variation at     |   |
|   |     |          | radiation          | .2 | maximum project  |   |
|   |     |          | specified,         | .1 | radiation        |   |
|   |     |          | whichever is worse | .1 | requirements for |   |
|   |     |          |                    |    | TID, SEE & ELDR  |   |
+---+-----+----------+--------------------+----+------------------+---+
| 2 | O   | TML\<1%; | Test to ASTM       | 2( | Ensure           | Q |
|   | utg | C        | E595.93            | 0) | outgassing does  | u |
|   | ass | VCM\<1%; |                    |    | not exceed       | a |
|   | ing | WVR\<30% |                    |    | project          | l |
|   |     |          |                    |    | requirements     |   |
+---+-----+----------+--------------------+----+------------------+---+
| 3 | Hu  | 85C/85RH | Test to JEDEC      | 2  | Ensure parts do  | Q |
|   | mid | or other | Std-22-B TM-A101   | 2( | not fail and     | u |
|   | ity | test     |                    | 0) | characterize for | a |
|   |     |          |                    |    | parametric       | l |
|   |     |          |                    |    | variation at     |   |
|   |     |          |                    |    | maximum project  |   |
|   |     |          |                    |    | req              |   |
|   |     |          |                    |    | uirements(Sample |   |
|   |     |          |                    |    | of 22(0) assumes |   |
|   |     |          |                    |    | 10% LTPD)        |   |
+---+-----+----------+--------------------+----+------------------+---+
| 4 | DPA | SEM /    | Any abnormal       | 2  | Assess basic     | Q |
|   |     | Cross    | processing         | 2( | wafer & package  | u |
|   |     | section  | especially with    | 0) | construction &   | a |
|   |     | of       | metalization.      |    | fabrication      | l |
|   |     | steps,   | Thinning, voids,   |    | processes(Sample |   |
|   |     | via,     | notches, or        |    | of 22(0) assumes |   |
|   |     | c        | apparent           |    | 10% LTPD)        |   |
|   |     | ontacts. | aberrations will   |    |                  |   |
|   |     |          | be recorded.       |    |                  |   |
+---+-----+----------+--------------------+----+------------------+---+
| 5 | S   | Seria    | N/A                | N  | Serialize to     | S |
|   | eri | lization |                    |  + | perform delta    | c |
|   | ali |          |                    | NL | burn-in          | r |
|   | zat |          |                    |  + | measurements     | e |
|   | ion |          |                    | NS |                  | e |
|   |     |          |                    |    |                  | n |
+---+-----+----------+--------------------+----+------------------+---+
| 6 | T   | Data     | 10 cycles over     | N  | Determine        | S |
|   | emp | sheet    | manufacturer\'s    |  + | robustness of    | c |
|   | Cy  | min/max  | guaranteed         | NL | materials and    | r |
|   | cle | temps or | temperature        |  + | processes to     | e |
|   |     | T        | extremes or        | NS | temp extremes    | e |
|   |     | min-10C, | application        |    |                  | n |
|   |     | T        | temperature range  |    |                  |   |
|   |     | max+10C, | plus 10deg C       |    |                  |   |
|   |     | w        | margin, whichever  |    |                  |   |
|   |     | hichever | greater            |    |                  |   |
|   |     | greater  |                    |    |                  |   |
+---+-----+----------+--------------------+----+------------------+---+
| 7 | Co  | Mil-     | Pass/fail PIND     | N  | Indicate         | S |
|   | nst | Std-883, | testing            |  + | structural or    | c |
|   | ant | M2001    |                    | NL | mechanical       | r |
|   | Acc |          |                    |  + | weaknesses not   | e |
|   | ele |          |                    | NS | detected in      | e |
|   | rat |          |                    |    | shock or         | n |
|   | ion |          |                    |    | vibration; may   |   |
|   |     |          |                    |    | be used to       |   |
|   |     |          |                    |    | determine        |   |
|   |     |          |                    |    | mechanical       |   |
|   |     |          |                    |    | limits of        |   |
|   |     |          |                    |    | package,         |   |
|   |     |          |                    |    | internal         |   |
|   |     |          |                    |    | metallization    |   |
|   |     |          |                    |    | and lead system, |   |
|   |     |          |                    |    | die or substrate |   |
|   |     |          |                    |    | attachment.      |   |
+---+-----+----------+--------------------+----+------------------+---+
| 8 | P   | Non-des  | Detection of loose | N  | Non-destructive  | S |
|   | IND | tructive | particles          |  + | means of         | c |
|   |     | means of |                    | NL | detecting loose  | r |
|   |     | d        |                    |  + | particles        | e |
|   |     | etecting |                    | NS |                  | e |
|   |     | loose    |                    |    |                  | n |
|   |     | p        |                    |    |                  |   |
|   |     | articles |                    |    |                  |   |
+---+-----+----------+--------------------+----+------------------+---+
| 9 | X-  | D        | Photographs will   | N  | Detect           | S |
|   | Ray | epending | be reviewed by the |  + | workmanship      | c |
|   |     | on part  | Specialist         | NL | flaws as well as | r |
|   |     | tec      |                    |  + | effects of temp  | e |
|   |     | hnology; |                    | NS | cycling on       | e |
|   |     | Mil      |                    |    | devices          | n |
|   |     | -Std-883 |                    |    |                  |   |
|   |     | method   |                    |    |                  |   |
|   |     | 2012 two |                    |    |                  |   |
|   |     | views    |                    |    |                  |   |
+---+-----+----------+--------------------+----+------------------+---+
| 1 | El  | Test to  | Pre-burn-in        | N  | Measure change   | S |
| 0 | ect | data     | baseline           |  + | to electrical    | c |
|   | ric | sheet @  |                    | NL | performance due  | r |
|   | als | 25C      |                    |  + | to previous      | e |
|   |     |          |                    | NS | screens          | e |
|   |     |          |                    |    |                  | n |
+---+-----+----------+--------------------+----+------------------+---+
| 1 | B   | Eq       | Burn-in            | N  | Eliminate Infant | S |
| 1 | urn | uivalent | temperature device |  + | Mortality.       | c |
|   | -In | 1000     | dependent;         | NL | Commercial parts | r |
|   |     | O        | determined by      |  + | max temp to 70C; | e |
|   |     | perating | specialist. If     | NS | burn-in \@125C   | e |
|   |     | Hours    | failures occur,    |    | may not be       | n |
|   |     | acc      | subject to another |    | appropriate;     |   |
|   |     | elerated | equivalent 1000    |    | requires lower   |   |
|   |     | by       | operating hours    |    | burn-in          |   |
|   |     | tem      |                    |    | temperature. If  |   |
|   |     | perature |                    |    | failures occur   |   |
|   |     | using    |                    |    | during first     |   |
|   |     | Ea=0.3eV |                    |    | burn-in trial,   |   |
|   |     |          |                    |    | need to subject  |   |
|   |     |          |                    |    | parts to a       |   |
|   |     |          |                    |    | second burn-in   |   |
|   |     |          |                    |    | to ensure infant |   |
|   |     |          |                    |    | mortality        |   |
|   |     |          |                    |    | eliminated.      |   |
+---+-----+----------+--------------------+----+------------------+---+
| 1 | El  | Data     | Post-burn-in       | N  | Measure change   | S |
| 2 | ect | sheet    | measurements       |  + | to electrical    | c |
|   | ric | min/max  | required for delta | NL | performance due  | r |
|   | als | temps or | calculations and   |    | to burn-in       | e |
|   |     | T        | worst case         |    |                  | e |
|   |     | min-10C, | parameter          |    |                  | n |
|   |     | T        | variation. Delta   |    |                  |   |
|   |     | max+10C, | criteria           |    |                  |   |
|   |     | w        | determined by      |    |                  |   |
|   |     | hichever | specialist.        |    |                  |   |
|   |     | greater  |                    |    |                  |   |
+---+-----+----------+--------------------+----+------------------+---+
| 1 | L   | Eq       | Use parts that     | N  | Demonstrate      | Q |
| 3 | ife | uivalent | already passed     | L( | adequate life of | u |
|   | T   | 2 x      | burn-in at burn-in | fr | devices          | a |
|   | est | Mission  | temperature for    | om |                  | l |
|   |     | Life     | duration to yield  | p  |                  |   |
|   |     | using    | equivalent of two  | ar |                  |   |
|   |     | Ea=1.0eV | mission lives      | ts |                  |   |
|   |     |          |                    | p  |                  |   |
|   |     |          |                    | as |                  |   |
|   |     |          |                    | si |                  |   |
|   |     |          |                    | ng |                  |   |
|   |     |          |                    | st |                  |   |
|   |     |          |                    | ep |                  |   |
|   |     |          |                    | 8) |                  |   |
+---+-----+----------+--------------------+----+------------------+---+
| 1 | End | Test to  | Over               | NL | Ensure life test | Q |
| 4 | Po  | data     | manufacturer\'s    |    | parts meet       | u |
|   | int | sheet    | guaranteed         |    | manufacturer     | a |
|   | El  | pa       | temperature        |    | spec             | l |
|   | ect | rameters | extremes or        |    |                  |   |
|   | ric | at +25C  | application        |    |                  |   |
|   | als | and data | temperature range  |    |                  |   |
|   |     | sheet    | plus 10deg C       |    |                  |   |
|   |     | min/max  | margin, whichever  |    |                  |   |
|   |     | temps or | greater            |    |                  |   |
|   |     | T        |                    |    |                  |   |
|   |     | min-10C, |                    |    |                  |   |
|   |     | T        |                    |    |                  |   |
|   |     | max+10C, |                    |    |                  |   |
|   |     | w        |                    |    |                  |   |
|   |     | hichever |                    |    |                  |   |
|   |     | greater  |                    |    |                  |   |
+---+-----+----------+--------------------+----+------------------+---+

Figure A6. Qualification & Screening Requirements for non-Hermetic
Devices

> N= number devices required for flight units plus spares Tmax= maximum
> application temperature
>
> NL= number of devices required for life tests Tmin= minimum
> application temperature
>
> NS= number of devices predicted to not pass screens ML= mission life