\*\*\* DRAFT \*\*\*

BTeV Work Breakdown Structure (WBS)

February 23, 2000

(Latest revision March 9, 2000; changed areas in green)

**Index**

1.1 Vertex Magnet and Beam Pipe 1

1.2 Pixel Detector 2

1.3 RICH Detector 6

1.4 EM Calorimeter Detector 10

1.5 Muon Detector 13

1.6 Forward Tracker Straw Detector 16

1.7 Forward Tracker Silicon Microstrip Detector 20

1.8 Luminosity Monitoring System 23

1.9 Level 1 and Global Trigger Systems 24

1.10 Data Acquisition Electronics and Links 27

1.11 Level 2/3 Online Processor Array 30

1.12 Analysis and Simulation Facilities 31

1.13 Controls/Monitoring & Timing System 33

1.14 Control Room Electronics & Equipment Infrastructure 35

1.15 Control, Monitoring and Event Readout (Data Acquisition) Software
37

1.16 Algorithm and Other Software and Integration 38

1.17 Test Stands and Test Equipment 43

1.18 IC Characterization and Production Testing System 45

1.19 System Installation, Integration Testing and Commissioning 46

1.20 BTeV Project Management 47

Questions and Comments by Editor 49

1.  BTeV Project

    1.  **Vertex Magnet and Beam Pipe**

        1.  Magnet Acquisition

            1.  Magnet Disassembly

                1.  Fixture Procurement

                    1.  Coil Handling Fixture

                    2.  Diagonal Braces

                    3.  Lifting Lugs

                2.  Rigging

            2.  Transport to C0

                1.  Coil Transport

                2.  Iron Block Transport

        2.  Magnet Modification and Assembly

            1.  Parts Procurement

                1.  Pole Insert

                    1.  Soft Iron Acquisition

                    2.  Pole Fabrication

                2.  Magnet Moving Carriage

                    1.  Heavy Duty Rollers

                    2.  Support Girders

                    3.  Fabrication

            2.  Magnet Reassembly

                1.  Fixture Procurement

                2.  Rigging and Welding

        3.  Magnet Transportation to and Installation and Testing at C0

            1.  LCW Water System

                1.  Hoses and Headers

                2.  Controls

            2.  Magnet Power

                1.  Power Supplies and Controls

                2.  High Current Buss Work

            3.  Transport to Detector Hall

                1.  Labor

                2.  Survey

        4.  Magnet Measurement

            1.  Ziptrack

            2.  Electronics

            3.  Survey

        5.  Beam Pipes

            1.  Tracking Detector Thin Walled Beam Pipe

            2.  Rich and Muon Beam Pipe

        6.  ES&H

            1.  Mechanical, Gas and Cryogenics

            2.  Electrical

            3.  Environmental

            4.  Radiation Safety

            5.  Training

        7.  Vertex Magnet and Beam Pipe Project Management

            1.  Project Coordination

            2.  Project Reviews

            3.  ES&H Reviews

            4.  Travel

    2.  **Pixel Detector**

        1.  Sensors

            1.  Detector

                1.  Development and Prototypes

                2.  Production

            2.  Bump Bonds

                1.  Development and Prototypes

                2.  Production

        2.  Front-End Electronics

            1.  Pixel FPIX ICs

                1.  Development and Prototypes

                    1.  Design and Simulations

                    2.  Design and Simulations Reviews with Developers
                        and Users

                    3.  Pixel FPIX IC Prototypes (make sure there are
                        several iterations {e.g., five})

                    4.  Prototype Testing by Developers (probe station;
                        mostly functionality {DC} testing)

                    5.  Prototype Testing by Users (including radiation,
                        vacuum, etc. studies)

                2.  Production

                    1.  Production Reviews with Developers and Users

                    2.  Production Pixel FPIX ICs

                    3.  Production Testing by Developers

                    4.  Production Testing by Users (people time for
                        this is usually grossly underestimated)

            2.  Serializer/Transmitter ICs (development, etc. in WBS
                1.10)

                1.  Development and Prototypes

                    1.  Design and Simulations Reviews with Developers
                        and Users

                    2.  Prototype Testing by Users (including radiation,
                        vacuum, etc. studies)

                2.  Production

                    1.  Production Reviews with Developers and Users

                    2.  Production Serializer/Transmitter ICs

                    3.  Production Testing by Users (people time and
                        needed special test \'gear\' for this are
                        usually both grossly underestimated)

#### Pixel Control/Monitoring & Timing ICs (development, etc. in WBS 1.13; includes phase-locked loop)

3.  Development and Prototypes

    1.  Design and Simulations Reviews with Developers and Users

    2.  Control/Monitoring & Timing IC Prototypes (make sure there are
        several iterations {e.g., three to four}; prototype IC costs are
        shared with WBS 1.7)

    3.  Prototype Testing by Users (including radiation, vacuum, etc.
        studies)

4.  Production

    1.  Production Reviews with Developers and Users

    2.  Production Control/Monitoring & Timing ICs

    3.  Production Testing by Users (people time and needed special test
        \'gear\' for this are usually both grossly underestimated)

#### Pixel Control/Monitoring & Timing and Data Readout Opto-Electronics

##### Pin-Diode and VCSEL Opto-Electronics and Substrate (development, etc. in WBS 1.10)

##### Development and Prototypes 

###### *Design Reviews with Developers*

###### *Prototype Testing by Users (including radiation, vacuum, etc. studies)*

##### Production

#### *Production Reviews with Developers*

#### *Production Control/Monitoring & Timing and Data Readout Opto-Electronics*

#### *Production Testing by Users (people time and needed special test \'gear\' for this are usually both underestimated)*

#### Pixel Multi-Chip Modules

##### Development and Prototypes 

###### Radiation Studies

##### Production

### Power, Monitoring and Protection

##### High Voltage Power

##### Development and Prototypes 

##### Production

##### Low Voltage Power

##### Development and Prototypes 

##### Production

#### RF Shielding (needs review and/or revisions by Simon Kwan and Chris White)

##### Development and Prototypes 

##### Production

#### Monitoring (needs review and/or revisions by Simon Kwan)

##### Development and Prototypes 

###### Temperature

###### Radiation

###### Voltage

###### Current

##### Production

###### Temperature

###### Radiation

###### Voltage

###### Current

#### Cables and Connectors

##### Development and Prototypes 

###### Copper

###### Fiber Optics

###### Radiation and Vacuum Studies

##### Production

###### Copper

###### Fiber Optics

### Mechanical and Other Systems

#### Material Testing

##### Development and Prototypes 

###### Radiation and Vacuum

####### *Carbon*

####### *Piping and Hose*

####### *Glues* 

####### *Cables* 

####### *Connectors*

###### Mechanical Properties

####### *Carbon*

####### *Glues* 

#### Pixel Half Plane Integration

##### Development and Prototypes 

###### Radiation and Vacuum Studies

##### Production

#### Pixel Plane Frame

##### Development and Prototypes 

###### Half-Plane Frame

###### Cooling Connections

###### Assembly Fixture

####### *Mechanics*

####### *Measurement* 

##### Production

#### Detector Mechanical Supports and Precision Movement

##### Half plane Motion System

###### Development and Prototypes 

####### *Mechanics*

####### *Monitor* 

###### Production

####### *Mechanics*

####### *Monitor*

##### Detector Alignment System

###### Development and Prototypes

####### *Mechanics*

####### *Monitor*

###### Production

####### *Mechanics*

####### *Monitor*

#### Primary Vacuum

##### Development and Prototypes

###### Detector Cylinder

###### End Windows

###### Magnet Mount

###### Feed-Throughs

####### *Fiber Optic*

####### *Water*

####### *Power*

###### Vacuum Outgassing Studies

####### *Glues*

####### *Carbon material*

####### *Cabling*

####### *Other Materials*

##### Production

###### Feed-Throughs

####### *Fiber Optic*

####### *Water*

####### *Power* 

#### Secondary Vacuum

##### Development and Prototypes 

#### Fluid System

##### Development

###### Chillers

###### Pumps

###### Filters

###### Monitor

#### Other Systems

##### Detector Handling Fixtures

##### Vacuum Pipe Fixtures

### Test Beam Studies (needs review and/or revisions by Simon Kwan)

3.  Test Beam Detectors

#### Test Beam Electronics

#### Test Beam Mechanics

##### Roman Pot

##### Current Roman Pot

##### New Roman Port (3% System)

### Travel

### ES&H

### Hardware and Software Specific To The Development and Testing Of The Pixel System

### Hardware

### FPIX IC Probe Station Adapter

### Pixel-Specific Adapters to BTeV Standard Test Stands

### Other Test Stands

4.  Software

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3.  ES&H

    1.  Sensors, Mechanical, Gas and Cryogenics

    2.  Electrical and Electronics

        1.  High Voltage Power

        2.  Low Voltage Power

        3.  Front-End Electronics

    3.  Environmental (including vacuum)

    4.  Radiation Safety

    5.  Training

### Transportation to and Installation and Testing at C0

6.  Transport to C0

7.  Install in Magnet

8.  Survey

9.  Test Pixel System

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4.  Pixel Detector Project Management

    1.  Project Coordination

    2.  Project Reviews

    3.  ES&H Reviews

    4.  Travel

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3.  **RICH Detector**

    1.  Sensors and Interconnections To Front-End Electronics

        1.  Photon Detector Arrays

            1.  Photon Detector Acquisition

                1.  Evaluation of Commercial Devices

                2.  Development and Prototypes

                3.  Production

            2.   "Base" HV Distribution PCB

                1.  Development and Prototypes

                2.  Production

            3.  Lens System

                1.  Development and Prototypes

                2.  Production

            4.  Photon Detector Test Station(s)

            5.  Photon Detector Mechanical Support Structure

                1.  Development and Prototypes

                2.  Production

            6.  Pulser System

                1.  Development and Prototypes

                2.  Production

        2.  Cabling To Front-End Electronics

        3.  Other Cabling and Connectors

    2.  Front-End Electronics

        1.  RICH Amplifier/Shaper/Discriminator (ASD) ICs

            1.  Development and Prototypes

                1.  Design and Simulations

                2.  RICH ASD IC Prototypes (make sure there are several
                    iterations {e.g., three to four})

                3.  Prototype Testing by Developers (probe station;
                    mostly functionality {DC} testing)

                4.  Prototype Testing by Users

            2.  Production

                1.  Production RICH ASD ICs

                2.  Production Testing by Developers

                3.  Production Testing by Users (people time for this is
                    usually grossly underestimated)

        2.  Amplifier/Shaper/Discriminator (ASD) Printed Circuit Boards

            1.  Development and Prototypes

            2.  Production

        3.  Control/Monitoring & Timing and Data Readout Electronics

#### BTeV-Standard Control/Monitoring & Timing and Data Readout (TMC^2^) FPGA (development, etc. in WBS 1.10)

1.  Development and Prototypes

    1.  *Firmware Specific To The RICH Detector*

    2.  *Design and Simulations Reviews with Developers*

    3.  *Prototype Testing by Users*

2.  Production

    1.  *Production Reviews with Developers*

    2.  *Production RICH TMC^2^ FPGAs*

    3.  *Production Testing by Users (people time and needed special
        test \'gear\' for this are usually both underestimated)*

#### Auxiliary Electronics (includes things like level translators, differential receivers, phase-locked loop, etc.)

3.  Development and Prototypes

    1.  *Design Reviews with Developers*

    2.  *Prototype Testing by Users*

4.  Production

#### Control/Monitoring & Timing and Data Readout Data Serializer/Transmitter and Opto-Electronics

##### Data Serializer/Transmitter and Pin-Diode and VCSEL Opto-Electronics and Substrate (development, etc. in WBS 1.10)

##### Development and Prototypes 

###### *Design Reviews with Developers*

###### *Prototype Testing by Users (including radiation, vacuum, etc. studies)*

##### Production

#### *Production Reviews with Developers*

#### *Production Control/Monitoring & Timing and Data Readout Data Serializer/Transmitter and Opto-Electronics*

#### *Production Testing by Users (people time and needed special test \'gear\' for this are usually both underestimated)*

4.  Front-End Boards (FEBs)

    1.  Development and Prototypes

    2.  Production

### Power, Monitoring, Cooling and Protection

5.  High Voltage Power

    1.  HV Supply Acquisition

        1.  Development and Prototypes

        2.  Production

    2.  HV Cables and Connectors

        1.  Development and Prototypes

        2.  Production

6.  Low Voltage Power

7.  Electronics Cooling and Protection

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3.  Mechanical and Other Systems

    1.  Front End Electronics Supports

        1.  Development and Prototypes

        2.  Production

    2.  Gas Radiator System

        1.  Gas Acquisition

            1.  Development and Prototypes

            2.  Production

        2.  Gas Circulation and Control System

            1.  Development and Prototypes

            2.  Production

        3.  Gas Monitoring System

            1.  Development and Prototypes

            2.  Production

    3.  Silica Aerogel Radiators

        1.  Aerogel Acquisition

            1.  Development and Prototypes

            2.  Production

        2.  Aerogel Test Station

        3.  Aerogel Mounting and Support Structure

            1.  Development and Prototypes

            2.  Production

        4.  Aerogel Monitoring System

    4.  Mirror Arrays

        1.  Mirror Acquisition

            1.  Development and Prototypes

            2.  Production

        2.  Mirror Test Station

        3.  Mirror Mounting and Support Structure

            1.  Development and Prototypes

            2.  Production

        4.  Mirror Alignment and Monitoring System

            1.  Development and Prototypes

            2.  Production

    5.  Gas Vessels

        1.  Material Acquisition

        2.  Machining and Fabrication

            1.  Development and Prototypes

            2.  Production

    6.  Other Supporting Systems

        1.  Detector Alignment

        2.  Other Monitoring

### Test Beam Studies

7.  Test Beam Detectors

#### Test Beam Electronics

#### Data Acquisition

#### Monitoring

#### Test Beam Mechanics

### Test Beam Box and Setup

### Travel

### ES&H

### Hardware and Software Specific To The Development and Testing Of The RICH System

### Hardware

### ASD Probe Station Adapter

### RICH-Specific Adapters to BTeV Standard Test Stands

### Other Test Stands

8.  Software

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4.  ES&H

    1.  Sensors, Mechanical, Gas and Cryogenics

        1.  Photo Detector Arrays

        2.  Gas Radiator

        3.  Silica Aerogel Radiators

        4.  Mirror Arrays

        5.  Gas Vessels

        6.  Pulser System

        7.  Gas Monitoring System

    2.  Electrical and Electronics

        1.  High Voltage Power

        2.  Low Voltage Power

        3.  Front-End Electronics

    3.  Environmental

    4.  Radiation Safety

    5.  Training

### Transportation to and Installation and Testing at C0

6.  Photon Detector Arrays

7.  Gas Radiator System

8.  Silica Aerogel Radiators

9.  Mirror Arrays

10. Gas Vessels

11. Pulser System

12. Gas Monitoring System

13. High Voltage Power

14. Low Voltage Power

15. Front-End Electronics

16. Surveying

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5.  RICH Detector Project Management

    1.  Project Coordination

    2.  Project Reviews

    3.  ES&H Reviews

    4.  Travel

    5.  Consulting

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4.  **EM Calorimeter Detector**

    1.  Sensors and Interconnections To Front-End Electronics

        1.  PbWO~4~ Crystals

            1.  Development and Prototypes

            2.  Production

                1.  Wrapping

                2.  Testing

        2.  Phototubes

            1.  Test Beam Studies With Sample Phototubes

            2.  Production

            3.  Testing

            4.  Ribbon Coax Data Cables From PMTs To PMT Digitizer

        3.  Phototube Bases

            1.  Development and Prototypes

            2.  Production

        4.  PMT/Crystal Gluing

            1.  Fixtures

            2.  Install test light (is there a light pulser being used
                to on-line test the PMT\'s?)

            3.  Testing

    2.  Front-End Electronics

        1.  QIE Charge-To-Voltage ICs

            1.  Development and Prototypes

                1.  Design and Simulations

                2.  EM Calorimeter QIE IC Prototypes (make sure there
                    are several iterations {e.g., three to four})

                3.  Prototype Testing by Developers (probe station;
                    mostly functionality {DC} testing)

                4.  Prototype Testing by Users

            2.  Production

                1.  Production EM Calorimeter QIE ICs

                2.  Production Testing by Developers

                3.  Production Testing by Users (people time for this is
                    usually grossly underestimated)

        2.  8 to 10-Bit Flash ADC ICs

            1.  Development and Prototypes

                1.  Design and Simulations

                2.  EM Calorimeter Flash ADC IC Prototypes (make sure
                    there are several iterations {e.g., three to four};
                    ... or is this a commercial IC?)

                3.  Prototype Testing by Developers (probe station;
                    mostly functionality {DC} testing)

                4.  Prototype Testing by Users

            2.  Production

                1.  Production EM Calorimeter Flash ADC ICs

                2.  Production Testing by Developers

                3.  Production Testing by Users (people time for this is
                    usually grossly underestimated)

        3.  Control/Monitoring & Timing and Data Readout Electronics

#### BTeV-Standard Control/Monitoring & Timing and Data Readout (TMC^2^) FPGA (development, etc. in WBS 1.10)

1.  Development and Prototypes

    1.  *Firmware Specific To The EM Calorimeter Detector*

    2.  *Design and Simulations Reviews with Developers*

    3.  *Prototype Testing by Users*

2.  Production

    1.  *Production Reviews with Developers*

    2.  *Production EM Calorimeter TMC^2^ FPGAs*

    3.  *Production Testing by Users (people time and needed special
        test \'gear\' for this are usually both underestimated)*

#### Auxiliary Electronics (includes things like level translators, differential receivers, phase-locked loop, etc.)

3.  Development and Prototypes

    1.  Design Reviews with Developers

    2.  Prototype Testing by Users

4.  Production

#### Control/Monitoring & Timing and Data Readout Data Serializer/Transmitter and Opto-Electronics

##### Pin-Diode and VCSEL Data Serializer/Transmitter and Opto-Electronics and Substrate (development, etc. in WBS 1.10)

##### Development and Prototypes 

###### *Design Reviews with Developers*

###### *Prototype Testing by Users (including radiation, vacuum, etc. studies)*

##### Production

#### *Production Reviews with Developers*

#### *Production Control/Monitoring & Timing and Data Readout Data Serializer/Transmitter and Opto-Electronics*

#### *Production Testing by Users (people time and needed special test \'gear\' for this are usually both underestimated)*

4.  Front-End Boards (FEBs)

    1.  Development and Prototypes

    2.  Production

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3.  Power, Monitoring and Protection

    1.  High Voltage Power

        1.  Computerized Subracks

            1.  Development and Prototypes

            2.  Production

        2.  Supply Modules

            1.  Development and Prototypes

            2.  Production

        3.  High Voltage PMT Cables and Connectors

            1.  Development and Prototypes

            2.  Production

    2.  Low Voltage Power

        1.  Development and Prototypes

        2.  Production

    3.  PMT Digitizer Chassis Power Supply

        1.  Development and Prototypes

        2.  Production

    4.  PMT Digitizer Chassis Fans

        1.  Development and Prototypes

        2.  Production

    5.  Embedded Voltage and Current Monitors

        1.  Development and Prototypes

        2.  Production

    6.  Electronics Cooling and Protection

4.  Mechanical and Other Systems

    1.  Front End Electronics Supports

        1.  Development and Prototypes

        2.  Production

    2.  Crystal Support Structure

        1.  Development and Prototypes

        2.  Production

    3.  Temperature Control System

        1.  Development and Prototypes

        2.  Production

### Test Beam Studies (needs review and/or revisions by Sheldon Stone)

4.  Test Beam Detectors

#### Test Beam Electronics

#### Test Beam Mechanics

### Travel

### ES&H

### Hardware and Software Specific To The Development and Testing Of The EM Calorimeter System

### Hardware

### QIE IC Probe Station Adapter

### EM Calorimeter-Specific Adapters to BTeV Standard Test Stands

### Other Test Stands

5.  Software

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5.  ES&H

    1.  Sensors, Mechanical, Gas and Cryogenics

    2.  Electrical and Electronics

        1.  High Voltage Power

        2.  Low Voltage Power

        3.  Front-End Electronics

    3.  Environmental

    4.  Radiation Safety

    5.  Training

### Transportation to and Installation and Testing at C0

6.  EM Calorimeter Detector Project Management

    1.  Project Coordination

    2.  Project Reviews

    3.  ES&H Reviews

    4.  Travel

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5.  **Muon Detector**

    1.  Sensors and Interconnections To Front-End Electronics

        1.  Proportional Tubes

            1.  Development and Prototypes

            2.  Production

        2.  Gas Manifolds

            1.  Development and Prototypes

            2.  Production

        3.  Planks

            1.  Development and Prototypes

            2.  Production

        4.  Octants

            1.  Development and Prototypes

            2.  Production

        5.  Cabling To Front-End Electronics

        6.  Other Cabling and Connectors

    2.  Front-End Electronics

        1.  ASDQ ICs

            1.  Development and Prototypes

            2.  Production

        2.  DAC ICs

            1.  Development and Prototypes

            2.  Production

        3.  ADC ICs

            1.  Development and Prototypes

            2.  Production

        4.  High Voltage DC/DC Converters

            1.  Development and Prototypes

            2.  Production

        5.  Control/Monitoring & Timing and Data Readout Electronics

#### BTeV-Standard Control/Monitoring & Timing and Data Readout (TMC^2^) FPGA (development, etc. in WBS 1.10)

1.  Development and Prototypes

    1.  *Firmware Specific To The Muon Detector*

    2.  *Design and Simulations Reviews with Developers*

    3.  *Prototype Testing by Users*

2.  Production

    1.  *Production Reviews with Developers*

    2.  *Production Muon TMC^2^ FPGAs*

    3.  *Production Testing by Users (people time and needed special
        test \'gear\' for this are usually both underestimated)*

#### Auxiliary Electronics (includes things like level translators, differential receivers, phase-locked loop, etc.)

3.  Development and Prototypes

    1.  *Design Reviews with Developers*

    2.  *Prototype Testing by Users*

4.  Production

#### Control/Monitoring & Timing and Data Readout Data Serializer/Transmitter and Opto-Electronics

##### Pin-Diode and VCSEL Data Serializer/Transmitter and Opto-Electronics and Substrate (development, etc. in WBS 1.10)

##### Development and Prototypes 

###### *Design Reviews with Developers*

###### *Prototype Testing by Users (including radiation, vacuum, etc. studies)*

##### Production

#### *Production Reviews with Developers*

#### *Production Control/Monitoring & Timing and Data Readout Data Serializer/Transmitter and Opto-Electronics*

#### *Production Testing by Users (people time and needed special test \'gear\' for this are usually both underestimated)*

6.  32-Channel Front-End Boards (FEBs)

    1.  Development and Prototypes

    2.  Production

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3.  Power, Cooling and Electronics Protection

    1.  High Voltage

        1.  Computerized Subracks

            1.  Development and Prototypes

            2.  Production

        2.  Supply Modules

            1.  Development and Prototypes

            2.  Production

        3.  High Voltage Proportional Tube Cables and Connectors

            1.  Development and Prototypes

            2.  Production

    2.  Low Voltage

        1.  Development and Prototypes

        2.  Production

    3.  Cooling

        1.  Development and Prototypes

        2.  Production

    4.  Electronics Cooling and Protection

        1.  Development and Prototypes

        2.  Production

4.  Mechanical and Other Systems

    1.  Front End Electronics Supports

        1.  Development and Prototypes

        2.  Production

    2.  Detector Slice Mechanical Supports

        1.  Slice 1 Supports

            1.  Prototype and Development

            2.  Production

            3.  Mounting structure

                1.  Development and Prototypes

                2.  Production

        2.  Slice 2 Supports

            1.  Development and Prototypes

            2.  Production

            3.  Mounting structure

                1.  Development and Prototypes

                2.  Production

        3.  Slice 3 Supports

            1.  Development and Prototypes

            2.  Production

            3.  Mounting structure

                1.  Prototype and Development

                2.  Production

        4.  Manifold Covers

            1.  Development and Prototypes

            2.  Production

        5.  Front-End Cable Routing

    3.  Gas System

        1.  Mixing System

            1.  Development and Prototypes

            2.  Production

        2.  Monitoring System

            1.  Development and Prototypes

            2.  Production

    4.  Removable Half Detector Structure

        1.  Development and Prototypes

        2.  Production

5.  Test Beam Studies

    1.  Test Beam Detectors

    2.  Test Beam Electronics

    3.  Test Beam Mechanics

    4.  Travel

### ES&H

### Hardware and Software Specific To The Development and Testing Of The Muon System

### Hardware

### ASD IC Probe Station Adapter

### Muon-Specific Adapters to BTeV Standard Test Stands

### Other Test Stands

5.  Software

    1.  Muon Monitoring Software

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6.  ES&H

    1.  Sensors, Mechanical, Gas and Cryogenics

    2.  Electrical and Electronics

        1.  High Voltage Power

        2.  Low Voltage Power

        3.  Front-End Electronics

    3.  Environmental

    4.  Radiation Safety

    5.  Training

### Transportation to and Installation and Testing at C0

6.  Mount Detectors in Toroids

7.  Surveying

8.  Install Cables

9.  Testing after Transport and Installation

    1.  Full channel verification

    2.  Plane testing

    3.  Cosmic Run

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7.  Muon Calorimeter Detector Project Management

    1.  Project Coordination

    2.  Project Reviews

    3.  ES&H Reviews

    4.  Travel

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6.  **Forward Tracker Straw Detector**

    1.  Detectors and Interconnections

        1.  Design, Prototype and Development

            1.  Integration of Straws and Strips

                1.  Mechanics

                    1.  \"Hole\" In Straws - Mechanical Integrity Issues

                    2.  Mounting of Strips

                    3.  Repair Methodology Development

                    4.  Movement and Reposition for Pixel Access

                2.  Electronics

                    1.  Power Delivery

                    2.  Signal Wiring

                    3.  Straw/Strip Cross-Talk

                3.  Testing

                    1.  Overlap Checking

                    2.  Software Coordination with Strips

            2.  Straw Sensor

                1.  Wire Stringing

                    1.  Cleaning and Storage Of Tubes

                    2.  Stringing Technique Development

                    3.  Tension Measurement and Control

                2.  Sealing and Leak Testing

                3.  Jigs for Production

            3.  Module Prototype

                1.  Test Module

                    1.  Electronics Integration

                    2.  Gas Tests

                    3.  Track Position Accuracy Tests

                2.  Jigs For Production

                3.  Software Prototype for Production Testing

        2.  Detector Production

            1.  Straw Sensor Production

                1.  4mm Straw Procurement

                2.  Sense Wire Procurement

                3.  Wire Guide Procurement

                4.  Wire Joint Parts Fabrication

                5.  Wire Stringing

                6.  Wire Tension and Continuity Check

                7.  Leak Testing

            2.  Module Production

                1.  Frame Fabrication

                2.  Inner Manifold Fabrication

                3.  Frame Assembly

                4.  Assembly Of Straws into Frames

                5.  End Straw Electronics Assembly

                6.  Module Electronics Assembly

                7.  Electronics Powering and Checkout

                8.  Strip (1.7) Integration into Straw Frame

    2.  Front-End Electronics

        1.  ASD ICs

            1.  Development and Prototypes

                1.  Design and Simulations

                2.  Design and Simulations Reviews with Developers and
                    Users

                3.  ASIC IC Prototypes (make sure there are several
                    iterations {e.g., five})

                4.  Prototype Testing by Developers (probe station;
                    mostly functionality {DC} testing)

                5.  Prototype Testing by Users (including radiation,
                    vacuum, etc. studies)

            2.  Production

                1.  Production Reviews with Developers and Users

                2.  Production ASD ASIC ICs

                3.  Production Testing by Developers

                4.  Production Testing by Users (people time for this is
                    usually grossly underestimated)

        2.  TDC ICs

            1.  Development and Prototypes

                1.  Design and Simulations

                2.  Design and Simulations Reviews with Developers and
                    Users

                3.  TDC IC Prototypes (make sure there are several
                    iterations {e.g., five})

                4.  Prototype Testing by Developers (probe station;
                    mostly functionality {DC} testing)

                5.  Prototype Testing by Users (including radiation,
                    vacuum, etc. studies)

            2.  Production

                1.  Production Reviews with Developers and Users

                2.  Production TDC ICs

                3.  Production Testing by Developers

                4.  Production Testing by Users (people time for this is
                    usually grossly underestimated)

        3.  Control/Monitoring & Timing and Data Readout Electronics

#### BTeV-Standard Control/Monitoring & Timing and Data Readout (TMC^2^) FPGA (development, etc. in WBS 1.10)

1.  Development and Prototypes

    1.  *Firmware Specific To The Straw Tracker Detector*

    2.  *Design and Simulations Reviews with Developers*

    3.  *Prototype Testing by Users*

2.  Production

    1.  *Production Reviews with Developers*

    2.  *Production Straw Tracker (TMC^2^) FPGAs*

    3.  *Production Testing by Users (people time and needed special
        test \'gear\' for this are usually both underestimated)*

#### Auxiliary Electronics (includes things like level translators, differential receivers, phase-locked loop, etc.)

3.  Development and Prototypes

    1.  *Design Reviews with Developers*

    2.  *Prototype Testing by Users*

4.  Production

#### Control/Monitoring & Timing and Data Readout Data Serializer/Transmitter and Opto-Electronics

##### Pin-Diode and VCSEL Data Serializer/Transmitter and Opto-Electronics and Substrate (development, etc. in WBS 1.10)

##### Development and Prototypes 

###### *Design Reviews with Developers*

###### *Prototype Testing by Users (including radiation, vacuum, etc. studies)*

##### Production

#### *Production Reviews with Developers*

#### *Production Control/Monitoring & Timing and Data Readout Data Serializer/Transmitter and Opto-Electronics*

#### *Production Testing by Users (people time and needed special test \'gear\' for this are usually both underestimated)*

4.  Front-End Boards (FEBs)

    1.  Development and Prototypes

    2.  Production

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3.  Power, Monitoring and Protection

    1.  On-Detector DC Power

        1.  Development and Prototypes

        2.  Production

    2.  High Voltage Supply and Distribution

        1.  Development and Prototypes

        2.  Production

    3.  Control Voltage Supply and Distribution

        1.  Development and Prototypes

        2.  Production

    4.  Gas Purity and Gas Gain Measurement Station

        1.  Development and Prototypes

        2.  Production

4.  Mechanical

    1.  Moving, Lifting, Positioning and Alignment Fixtures

        1.  Development and Prototypes

        2.  Production

    2.  Support Stands and Rails

        1.  Development and Prototypes

        2.  Production

    3.  Ties, Connections, Stops and Other Small Parts

        1.  Development and Prototypes

        2.  Production

    4.  Gas Supply and Distribution Systems

        1.  Development and Prototypes

        2.  Production

    5.  Precision Alignment System

        1.  Development and Prototypes

        2.  Production

5.  Test Beam Studies

    1.  Portable Test Beam DA Computers and Interface

    2.  Portable Electronics System

    3.  Portable Gas System

    4.  Mechanical Supports

    5.  Travel

### ES&H

6.  Hardware & Software Specific To The Development & Testing Of The
    Straw Tracker System

### Hardware

### ASD IC Probe Station Adapter

### TDC IC Probe Station Adapter

### Straw Tracker-Specific Adapters to BTeV Standard Test Stands

### Other Test Stands

1.  Software

    1.  Straw Tracker Monitoring Software

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7.  ES&H

    1.  Sensors, Mechanical, Gas and Cryogenics

    2.  Electrical and Electronics

        1.  High Voltage Power

        2.  Low Voltage Power

        3.  Front-End Electronics

    3.  Environmental

    4.  Radiation Safety

    5.  Training

### Transportation to and Installation and Testing at C0

6.  Mount Modules into Plane Assemblies (on frame)

7.  Surveying

8.  Install Cables

9.  Testing after Transport and Installation

    1.  Full channel verification

    2.  Plane testing

    3.  Cosmic Run

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8.  Forward Tracker Straw Detector Project Management

    1.  Project Coordination

    2.  Project Reviews

    3.  ES&H Reviews

    4.  Travel

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7.  **Forward Tracker Silicon Microstrip Detector**

    1.  Sensors and Interconnections To Front-End Electronics

        1.  Silicon Microstrip Detectors

            1.  Development and Prototypes

            2.  Production

        2.  Mounting, Bonding and Protection of Detectors

            1.  Development and Prototypes

            2.  Production

        3.  Integration with Straws (see details in WBS 1.6.1.1.1)

    2.  Front-End Electronics

        1.  Silicon Preamplifier and Programmable Discriminator ICs

            1.  Development and Prototypes

                1.  Design and Simulations

                2.  BTeV Silicon IC Prototypes (make sure there are
                    several iterations {e.g., five})

                3.  Prototype Testing by Developers (probe station;
                    mostly functionality {DC} testing)

                4.  Prototype Testing by Users (including radiation,
                    vacuum, etc. studies)

            2.  Production

                1.  Production BTeV Silicon ICs

                2.  Production Testing by Developers

                3.  Production Testing by Users (people time for this is
                    usually grossly underestimated)

        2.  Serializer/Transmitter ICs (development, etc. in WBS 1.10)

            1.  Development and Prototypes

                1.  Design and Simulations Reviews with Developers

                2.  Prototype Testing by Users (including radiation,
                    vacuum, etc. studies)

            2.  Production

                1.  Production Reviews with Developers

                2.  Production Serializer/Transmitter ICs

                3.  Production Testing by Users (people time and needed
                    special test \'gear\' for this are usually both
                    grossly underestimated)

#### Silicon Microstrip Control/Monitoring & Timing ICs (development, etc. in WBS 1.13; includes phase-locked loop)

3.  Development and Prototypes

    1.  Design and Simulations Reviews with Developers

    2.  Control/Monitoring & Timing IC Prototypes (make sure there are
        several iterations {e.g., three to four}; prototype IC costs are
        shared with WBS 1.2)

    3.  Prototype Testing by Users (including radiation, vacuum, etc.
        studies)

4.  Production

    1.  Production Reviews with Developers

    2.  Production Control/Monitoring & Timing ICs

    3.  Production Testing by Users (people time and needed special test
        \'gear\' for this are usually both grossly underestimated)

#### Silicon Microstrip Control/Monitoring & Timing and Data Readout Opto-Electronics

##### Pin-Diode and VCSEL Opto-Electronics and Substrate (development, etc. in WBS 1.10)

##### Development and Prototypes 

###### *Design Reviews with Developers*

###### *Prototype Testing by Users (including radiation, vacuum, etc. studies)*

##### Production

#### *Production Reviews with Developers*

#### *Production Control/Monitoring & Timing and Data Readout Opto-Electronics*

#### *Production Testing by Users (people time and needed special test \'gear\' for this are usually both underestimated)*

#### Silicon Microstrip Multi-Chip Modules

##### Development and Prototypes 

###### Radiation Studies

##### Production

3.  Power, Cooling and Electronics Protection

    1.  High Voltage

        1.  Silicon Bias Supplies

            1.  Development and Prototypes

            2.  Production

    2.  Low Voltage

        1.  Electronics Supplies

            1.  Development and Prototypes

            2.  Production

    3.  Electronics Cooling and Protection

        1.  Development and Prototypes

        2.  Production

4.  Mechanical and Other Systems

    1.  Front End Electronics and Plane Mounting with Integrated Cooling
        System

        1.  Development and Prototypes

        2.  Production

    2.  Station Assembly Support

        1.  Development and Prototypes

        2.  Integration into the Straw Modules

        3.  Production

    3.  Cable routing / raceway

        1.  Development and Prototypes

        2.  Production

    4.  Nitrogen Gas System

        1.  Development and Prototypes

        2.  Production

        3.  Nitrogen Flow Monitoring System

            1.  Development and Prototypes

            2.  Production

    5.  Temperature Monitoring System

        1.  Development and Prototypes

        2.  Production

5.  Test Beam Studies

    1.  Test Beam Detectors

    2.  Test Beam Electronics

    3.  Test Beam Mechanics

    4.  Travel

### ES&H

### Hardware and Software Specific To The Development and Testing Of The Silicon Microstrip System

### Hardware

### BTeV Silicon IC Probe Station Adapter

### Silicon Microstrip-Specific Adapters to BTeV Standard Test Stands

### Other Test Stands

5.  Software

    1.  Silicon Microstrip Monitoring Software

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6.  ES&H

    1.  Sensors, Mechanical, Gas and Cryogenics

    2.  Electrical and Electronics

        1.  High Voltage Power

        2.  Low Voltage Power

        3.  Front-End Electronics

    3.  Environmental

    4.  Radiation Safety

    5.  Training

### Transportation to and Installation and Testing at C0

6.  Mount Planes into Station Assemblies (this may change depending on
    the way the Strips are integrated with the Straw Modules)

7.  Mount Station Assemblies to Station Assembly Supports

8.  Surveying

9.  Install Cables

10. Mount Nitrogen Gas System Components

11. Testing After Transport and Installation

    1.  Full channel verification

    2.  Plane testing

    3.  Cosmic Run

12. Mount Planes into Station Assemblies (possibly needs rework)

    1.  Mount Station Assemblies to Station Assembly Supports

    2.  Install Cables

    3.  Mount Nitrogen Gas System Components

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7.  Silicon Microstrip Calorimeter Detector Project Management

    1.  Project Coordination

    2.  Project Reviews

    3.  ES&H Reviews

    4.  Travel

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8.  **Luminosity Monitoring System**

    1.  Sensors, Other Measuring Devices & Cabling To Electronics

        1.  Roman Pots

            1.  Vacuum Parts

            2.  Silicon Mounting and Moving Mechanism

            3.  Technician Labor

        2.  Silicon Detectors

            1.  Silicon Microstrip Detector

            2.  Silicon Detector Backplane

            3.  Assembly and testing labor

        3.  Cabling To Electronics

    2.  Electronics

        1.  Front-End Electronics

        2.  Data Links

### Power, Cooling and Electronics Protection

### High Voltage

### Low Voltage

### Electronics Cooling and Protection

### Mechanical and Other Systems

3.  Test Beam Studies

    1.  Test Beam Detectors

    2.  Test Beam Electronics

    3.  Test Beam Mechanics

    4.  Travel

### ES&H

### Hardware and Software Specific To The Development and Testing Of The Luminosity Monitoring System

### Hardware

### Luminosity Monitoring Specific Adapters to BTeV Standard Test Stands

### Other Test Stands

5.  Software

    1.  Luminosity Monitoring Software

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4.  ES&H

    1.  Electrical and Electronics

    2.  Environmental

    3.  Radiation Safety

    4.  Training

### Transportation to and Installation and Testing at C0

5.  Luminosity Monitoring Project Management

    1.  Project Coordination

    2.  Project Reviews

    3.  ES&H Reviews

    4.  Travel

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9.  **Level 1 and Global Trigger Systems**

    1.  Pixel Trigger System

        1.  Pixel Trigger Prototype

        2.  Pixel Trigger Production

            1.  FPGA Tracker Subsystem

                1.  SQ_Processor: Station-Quadrant Processor Board

                    1.  Pixel Processor

                        1.  *Links from pixel detector*

                        2.  *PP_FPGA: Pixel processor FPGA*

                        3.  *Monitor and Control Endpoint*

                        4.  *Lookup Table RAM*

                        5.  *Buffer RAM*

                    2.  Tracker FPGA(s)

                    3.  Monitor and Control Endpoint

                    4.  L1_Buffer: Level 1 Buffer

                    5.  Board and Connectors (SQ board)

                2.  SQ_Backplane: 8x8 Switched Backplane

                    1.  Switch FPGAs

                    2.  Monitor and Control Node

                    3.  Board and Connectors (SQ Backplane)

                3.  Quad_Link Card

                    1.  Links to Farms

                    2.  Board and Connectors (Link Card)

                4.  Links Between Backplanes

                5.  Power and Enclosure (SQ Backplane)

            2.  Track Farm

                1.  Farm Processor Box

                    1.  Farm_Backplane: 4x4 Switched Backplane

                        1.  *Switch FPGA*

                        2.  *Monitor and Control Node*

                        3.  *Merge FPGA*

                        4.  *Monitor and Control Endpoint*

                        5.  *Board and Connectors (Backplane)*

                    2.  Link Card: 4 in 1 out

                        1.  *Link Receivers*

                        2.  *Link Transmitters*

                        3.  *Board and Connectors (Link Card)*

                    3.  Processor Card: 16-64 Processors

                        1.  *Buffer_Manager FPGA*

                        2.  *Monitor and Control Endpoint*

                        3.  *Monitor and Control Node*

                        4.  *DSP Daughter Card*

                            1.  *DSP Processor IC*

                            2.  *Interface FPGA*

                            3.  *Monitor and Control Endpoint*

                            4.  *Board and Connector (DSP Daughter
                                Card)*

                        5.  *Board and Connectors (Processor Card)*

                    4.  Power and Enclosure (Processor Farm)

            3.  Vertex Farm

                1.  Farm Processor Box

        3.  Packaging, Power, Cooling and Electronics Protection

            1.  Development & Prototypes

            2.  Production

### Hardware and Software Specific To The Development and Testing Of The Pixel Trigger System

### Hardware

3.  Software

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4.  ES&H

    1.  Electrical and Electronics

    2.  Environmental

    3.  Training

### Transportation to and Installation and Testing at C0

5.  Pixel Trigger System Project Management

    1.  Project Coordination

    2.  Project Reviews

    3.  ES&H Reviews

    4.  Travel

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2.  Muon Trigger System

    1.  Track Finder

        1.  Input Buffer

            1.  Development and Prototypes

            2.  Production

        2.  Point Finder

            1.  Out-of-Time Reject

                1.  Development and Prototypes

                2.  Production

            2.  Multiple Hit Resolver

                1.  Development and Prototypes

                2.  Production

        3.  Point List Buffer

            1.  Development and Prototypes

            2.  Production

        4.  Segment Finder

            1.  Momentum Check

                1.  Development and Prototypes

                2.  Production

            2.  Sector Crossing Logic

                1.  Development and Prototypes

                2.  Production

        5.  Vertex projection

            1.  Muon Counter

                1.  Development and Prototypes

                2.  Production

            2.  Trigger Flag to Global Trigger

                1.  Development and Prototypes

                2.  Production

        6.  Output List Buffer

            1.  Development and Prototypes

            2.  Production

    2.  Muon Trigger Backplane

        1.  Development and Prototypes

        2.  Production

    3.  Packaging, Power, Cooling and Electronics Protection

        1.  Development and Prototypes

        2.  Production

### Hardware and Software Specific To The Development and Testing Of The Muon Trigger System

### Hardware

3.  Software

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4.  ES&H

    1.  Electrical and Electronics

    2.  Environmental

    3.  Training

### Transportation to and Installation and Testing at C0

5.  Muon Trigger System Project Management

    1.  Project Coordination

    2.  Project Reviews

    3.  ES&H Reviews

    4.  Travel

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3.  Global Trigger

    1.  Farm Processor Box

    2.  Link_Merger Card: 10 to 4 Merge

        1.  Link Receivers

        2.  Link Transmitters

        3.  Merge FPGA

        4.  Board and Connectors (Link Card)

    3.  Packaging, Power, Cooling and Electronics Protection

        1.  Development & Prototypes

        2.  Production

### Hardware and Software Specific To The Development and Testing Of The Global Trigger System

### Hardware

3.  Software

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4.  ES&H

    1.  Electrical and Electronics

    2.  Environmental

    3.  Training

### Transportation to and Installation and Testing at C0

5.  Global Trigger System Project Management

    1.  Project Coordination

    2.  Project Reviews

    3.  ES&H Reviews

    4.  Travel

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10. **Data Acquisition Electronics and Links**

    1.  Data Acquisition Electronics

        1.  Data Concentrators and Translators

        2.  Level 1 (Switch Input) Buffers

            1.  Development and Prototypes

                1.  FPGA ICs

                2.  Fiber Receivers and Transmitters

                3.  Memory ICs

                4.  Microcontroller

                5.  Control Link Interface

                6.  PC Board

            2.  Production

                1.  FPGA ICs

                2.  Fiber Receivers and Transmitters

                3.  Memory ICs

                4.  Microcontroller

                5.  Control Link Interface

                6.  PC Board

        3.  Event Building Switch

            1.  Development and Prototypes

                1.  FPGA ICs

                2.  Fiber Receivers and Transmitters

                3.  Microcontroller

                4.  PC Board

            2.  Production

                1.  FPGA ICs

                2.  Fiber Receivers and Transmitters

                3.  Microcontroller

                4.  PC Board

        4.  Event Data Flow Controller

            1.  Development and Prototypes

                1.  FPGA ICs

                2.  Fiber Receivers and Transmitters

                3.  Memory ICs

                4.  Microcontroller

                5.  Control Link Interface

                6.  PC Board

            2.  Production

                1.  FPGA ICs

                2.  Fiber Receivers and Transmitters

                3.  Memory ICs

                4.  Microcontroller

                5.  Control Link Interface

                6.  PC Board

        5.  Level 2/3 (Switch Output) Buffers

            1.  Development and Prototypes

                1.  FPGA ICs

                2.  Fiber Receivers and Transmitters

                3.  Memory ICs

                4.  Microcontroller

                5.  Output Link Interfaces

                6.  PC Board

            2.  Production

                1.  FPGA ICs

                2.  Fiber Receivers and Transmitters

                3.  Memory ICs

                4.  Microcontroller

                5.  Output Link Interfaces

                6.  PC Board

        6.  BTeV-Standard Control/Monitoring & Timing and Data Readout
            Data Combiner (TMC^2^) FPGA-Based Electronics

            1.  Development and Prototypes

                1.  *Design and Simulations*

                    1.  *BTeV-Standard Firmware for Data Readout*

                    2.  *BTeV-Standard Firmware for Control/Monitoring &
                        Timing*

                2.  *Design Reviews*

                3.  *Data Combiner FPGA Prototypes*

                4.  *Prototype Data Combiner FPGA Testing*

            2.  Production

                1.  *Production Reviews*

                2.  *Production Testing (people time for this is usually
                    underestimated)*

        7.  Serializer/Transmitter ICs (Peter Denes' radiation-hard ICs)

            1.  Development and Prototypes

                1.  *Design Reviews*

                2.  *Serializer/Transmitter IC Prototypes (make sure
                    there are several more iterations {e.g., three to
                    four})*

                3.  *Serializer/Transmitter IC Prototype Testing (probe
                    station; mostly functionality {DC} testing followed
                    by some radiation, vacuum, etc. studies {most of
                    this testing done by users)*

            2.  Production

                1.  *Production Reviews*

                2.  *Production Serializer/Transmitter IC Testing
                    (people time for this is usually grossly
                    underestimated)*

    2.  Data & Other Links

        1.  Data Link Research and Development

            1.  Data Link Components

            2.  Data Link Test Boards

            3.  Optical Link Test Equipment

        2.  Front-End Electronics To Level 1 Buffers Data Links

            1.  Development and Prototypes

                1.  *Fiber Optic Cables*

            2.  Production

                1.  *Fiber Optic Cables*

                2.  *Fiber Optic Flexible Conduit*

        3.  Data Acquisition Network Links

            1.  Development and Prototypes

                1.  *Fiber Optic Cables*

            2.  Production

                1.  *Fiber Optic Cables*

        4.  Level 2/3 Buffers To The Level 2/3 Online Processor Array
            Data Links

            1.  Development and Prototypes

                1.  *Link Cables (Copper)*

            2.  Production

                1.  *Link Cables (Copper)*

        5.  Data Acquisition to Level 1 Trigger System Links

            1.  Development and Prototypes

            2.  Production

#### Control/Monitoring & Timing and Data Readout Opto-Electronics: Pin-Diode and VCSEL Opto-Electronics and Substrate

##### Development and Prototypes 

###### *Packaging and Alignment Design with Manufacturer*

###### *Design Reviews with Manufacturer and/or Users*

1.  *Procurement of Prototypes*

###### *Prototype Testing with Users (including radiation, vacuum, etc. studies)*

##### Production

2.  *Production Reviews with Manufacturer and/or Users*

3.  *Production Procurement Order Generation & Oversight*

4.  *Production Testing by Developers*

5.  *Production Testing with Users (people time for this are usually
    underestimated)*

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6.  Optical Distribution Box

    1.  Development & Prototype

    2.  Production

7.  Optical Link Infrastructure

    1.  Ribbon Optical Fiber Splicer and Fuser

    2.  Single Optical Fiber Splicer and Fuser

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3.  Packaging, Power, Cooling and Electronics Protection

    1.  Development & Prototypes

    2.  Production

### Hardware and Software Specific To The Development and Testing Of The Data Acquisition Electronics and Links

### Hardware

### Data Combiner IC Probe Station Adapter

### Serializer/Transmitter IC Probe Station Adapter

3.  Software

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4.  ES&H

    1.  Electrical and Electronics

    2.  Environmental

    3.  Training

### Transportation to and Installation and Testing at C0

4.  Module Installation

5.  Cable Installation and Termination

6.  In-Situ System Operational Tests

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5.  Data Acquisition Electronics and Links Project Management

    1.  Project Coordination

    2.  Project Reviews

    3.  ES&H Reviews

    4.  Travel

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11. **Level 2/3 Online Processor Array**

    1.  Event Building and Physics Reconstruction Facility

        1.  Processing CPU Nodes

        2.  Local Staging Disks

        3.  Software Infrastructure

        4.  Event Building Software

        5.  Physics Reconstruction Software

        6.  Hardware Infrastructure

        7.  Networking

    2.  Data Integrity Monitoring Facility

        1.  Consumer Processing CPU nodes

        2.  Local staging Disks

        3.  Software Infrastructure

        4.  Consumer Software

        5.  Analysis Software

        6.  Hardware Infrastructure

        7.  Networking

    3.  Links to Level 1 Data Structures

        1.  Hardware Infrastructure

        2.  Software Infrastructure

    4.  Links to Offline Reconstruction Farm

        1.  Data Export Facility

        2.  Specific Networking

    5.  Links to Archive Facility

        1.  Data Export facility

        2.  Specific Networking

    6.  Processor Array System Monitoring

        1.  Hardware Infrastructure

        2.  Software

    7.  Links to Data Acquisition Run Control

        1.  Networking

        2.  Software Databases, Licenses, Etc.

    8.  Backup Facility

    9.  ES&H

        1.  Electrical and Electronics

        2.  Environmental

        3.  Training

    10. Transportation to and Installation and Testing at C0

    11. Level 2/3 Online Processor Array Project Management

        1.  Project Coordination

        2.  Project Reviews

        3.  ES&H Reviews

        4.  Travel

12. **Analysis and Simulation Facilities**

    1.  Reconstruction computing

        1.  Reconstruction CPUs

        2.  Hosts/Servers/Data Import

        3.  Disk for Staging, Temporary Storage, Etc

        4.  Tape Drives (if required)

        5.  Networking Within Farms and to Related/Cooperating
            Facilities

        6.  Infrastructure \-- Racks, Cooling, Power, Etc.

    2.  Simulation Computing

        1.  Simulation CPUs

        2.  Hosts/Servers for Simulation

        3.  Disk for Staging, Temporary Storage, Etc

        4.  Tape Drives (if required)

        5.  Networking Within Simulation Farms and to
            Related/Cooperating Facilities

        6.  Infrastructure \-- Racks, Cooling, Power, Etc

    3.  Analysis Facility

        1.  Host/Server Systems

        2.  Data Import Facility

            1.  Servers/ Data Movers

            2.  Staging Disk

            3.  Network Connnections to Related/Cooperating Facilities

        3.  Disk For Analysis

            1.  IO Staging Disk

            2.  Disk to Support Secondary Production (Splitting,
                Stripping, Etc.)

            3.  Project Disk

            4.  User Disk

            5.  System and Miscellaneous

        4.  Farm Systems for Analysis

            1.  Analysis CPU Nodes

            2.  Staging Disk

            3.  Network Connections To Related/Cooperating Facilities

        5.  Data Export Facility (via Networks)

            1.  Servers/Data Movers

            2.  Staging Disk

            3.  Network Connections to Related/Cooperating Facilities

        6.  Serial Media Copy and Distribution

            1.  Servers/Data Movers

            2.  Staging Disk

            3.  Network Connections to Related/Cooperating Facilities

            4.  Drives to Support Serial Media

        7.  Infrastructure \-- Racks, Cooling, Power, Etc.

    4.  Data Archive Facility

        1.  Robotic Mass Storage System

            1.  Automated Tape Library

            2.  Associated Tape Drives

            3.  Data Movers

            4.  Recording Media

            5.  Network Connections to Related/Cooperating Facilities

        2.  Input System From Experiment to Reconstruction Farms Or
            Archive

            1.  Tape Drives (if required)

            2.  Data Movers

            3.  Staging Disk (if required)

        3.  Infrastructure \-- Racks, Cooling, Power, Etc.

    5.  Networking

        1.  Networking Between Experiment Primary and Satellite Sites on
            the Fermilab Campus and Feynman Center

        2.  Networking Between BTeV Servers and Systems Within Feynman
            and Other Computing Division Systems not Already Covered

        3.  Connections to Wide Area and Offsite Networks

    6.  Facilities to Support Collaborative Analysis

        1.  Videoconference Room With Packet and Circuit Based Video
            Capability and Local Equipment for Quality Conferencing

        2.  Information Servers

            1.  Web Server

            2.  Documentation Repository

    7.  Desktop Systems

        1.  Analysis Center for Visitors

        2.  Support For Fermilab Physicists and Staff Collaborators in
            Residence

    8.  Monitoring and Problem Response

        1.  Hardware To Monitor and Optimize Performance of Local and
            Wide Area Facilities

    9.  Software Licenses in Support of Operations

        1.  Licenses Required in Support of Installed Facilities

        2.  Licenses Acquired in Support of Data Analysis and Simulation
            Activities

            1.  Batch System

            2.  Databases Systems for Production and Data Management

            3.  Monitoring, Tuning, and Diagnostic Software

    10. ES&H

        1.  Electrical and Electronics

        2.  Environmental

        3.  Training

    11. Transportation to and Installation and Testing

    12. Offline Analysis and Simulation Facilities Project Management

        1.  Project Coordination

        2.  Project Reviews

        3.  ES&H Reviews

        4.  Travel

13. **Controls/Monitoring & Timing System**

    1.  Accelerator Timing Generator

        1.  Timing R & D

            1.  Phase Locked Loop

            2.  Fiber Optic Link Accuracy & Jitter

            3.  Copper Link Accuracy & Jitter

        2.  Accelerator Timing System Interface

            1.  Cables From/To Accelerator Timing Signals

            2.  Circuit Board

                1.  Development & Prototypes

                2.  Production

    2.  Control/Monitor Host & Timing Interface

        1.  Host Computer (Windows PC)

        2.  Host Controller Control/Monitoring & Timing Fanout

            1.  Development and Prototypes

                1.  Control/Monitoring Circuitry

                2.  Timing Circuitry

                3.  Interface To Fermilab\'s Fire Alarm System

                4.  Fast Error Circuitry

                5.  Link Interfaces

            2.  Production

    3.  Control/Monitoring & Timing Hub (also used at front-end as
        interface to alarms & limits monitoring and controlling points)

        1.  Development & Prototypes

            1.  Control/Monitoring Circuitry

            2.  Timing Circuitry

            3.  Alarms & Limits Circuitry & Cabling

            4.  Alarms & Limits Interface To Fermilab\'s Fire Alarm
                System

            5.  Fast Error Circuitry

            6.  Link Interfaces

        2.  Production

    4.  Control/Monitoring, Timing & Fast Error Links

        1.  Control/Timing & Monitoring Links

            1.  Development & Prototypes

            2.  Production

        2.  Fast Error Links

            1.  Development & Prototypes

            2.  Production

        3.  Fast Error Interface To Data Acquisition System Data Flow
            Controller

            1.  Development & Prototypes

            2.  Production

    5.  Packaging, Power, Cooling & Protection

        1.  Development & Prototypes

        2.  Production

    6.  Control/Monitoring & Timing ICs for the Pixel and Forward
        Tracker Silicon Microstrip Detectors

        1.  Development and Prototypes

            1.  Design and Simulations

            2.  Design and Simulations Reviews with Users

            3.  Prototype Testing by Developers (probe station; mostly
                functionality {DC} testing)

            4.  Prototype Testing with Users (including radiation,
                vacuum, etc. studies)

        2.  Production

            1.  Production Reviews with Users

            2.  Production Testing by Developers

            3.  Production Testing by Users (people time for this is
                usually grossly underestimated)

    7.  Hardware & Software Specific to the Development & Testing of the
        Control/Monitoring & Timing System

        1.  Development & Test Hardware

### Control/Monitoring & Timing IC Probe Station Adapter

1.  Adapters To BTeV-Standard Test Stands

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2.  Development & Test Software

    1.  Control/Monitoring Software

    2.  Fast Timing Software

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8.  E S & H

    1.  Electrical & Electronics

    2.  Environmental

    3.  Radiation Safety

    4.  Training

9.  Transportation to and Installation & Testing at C0

10. Controls/Monitor & Timing Project Management

    1.  Project Coordination

    2.  Project Reviews

    3.  ES&H Reviews

    4.  Travel

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14. **Control Room Electronics & Equipment Infrastructure**

    1.  Control Room Electronics

        1.  Accelerator Monitoring Interface

            1.  Accelerator I/O Crate(s)

            2.  Accelerator I/O Modules

            3.  Accelerator Timing Signals

            4.  TV Monitors

        2.  Experiment Control Computing

            1.  Data Acquisition Control Interface Computer

            2.  Experimenter Interface Consoles Computer

            3.  Software and Licenses

            4.  Backup Media and Storage Systems

        3.  Networks And Consoles

            1.  Interface To Network Backbone

                1.  Router

                2.  Firewall

            2.  Local Area Network (Ethernet)

                1.  Network Cabling

                2.  Mini-Hubs

            3.  Consoles and Infrastructure

                1.  Racks

                2.  PC-Driven Monitors & Consoles

                3.  Keyboards, Mice, Monitors and Cabling

    2.  Control Room Infrastructure

        1.  Raised Computer Room Floor Modifications

        2.  Overhead Cable Trays

        3.  Relay Racks, Rack Cooling and Protection

            1.  Relay Racks

            2.  Rack Cooling System

            3.  Rack Power Monitors

            4.  Rack Safety Monitors

            5.  Rack Operator Status/Alarm Notification System

        4.  AC Power Distribution (120 VAC & 240 VAC 3-Phase)
            Modifications

            1.  240V 3Φ Power

            2.  Main Circuit Breaker Box

            3.  AC Power Distribution Inside The Control Room

            4.  AC Power Line Monitors and Indicators

            5.  UPS Systems

        5.  Miscellaneous Personnel Infrastructure

            1.  ES&H Items

                1.  *MSDS Safety Display*

                2.  *MSDS Contents*

                3.  *Safety Lighting*

                4.  *Radiation Badge Rack & Badges*

                5.  *Lockout/Tagout Supplies*

                6.  *Supply Of Yellow Safety Warning Cones*

            2.  Miscellaneous Items

                1.  *Telephones and Intercom System*

                2.  *Intercom System*

                3.  *Whiteboards*

                4.  *Pagers*

                5.  *Garbage Cans & Recycling Bins*

                6.  *Coat Rack*

                7.  *Glass Room Dividers*

                8.  *Clocks*

                9.  *Blinds for Windows*

                10. *Color Printers and Printer Stands*

                11. *Copiers and FAX Machines*

            3.  Repair Equipment

                1.  *Tools and Toolboxes*

                2.  *Test Equipment*

                3.  *Repair Supplies*

                    1.  *Wire*

                    2.  *ICs*

                    3.  *Passive Component Selection*

                    4.  *Spare Boards*

            4.  Furniture

                1.  *Workbenches*

                2.  *Tables and Chairs*

                3.  *File Cabinets*

                4.  *Full Size Cabinets*

                5.  *Bookshelves*

                6.  *Microwave and Table*

                7.  *Food Refrigerator*

                8.  *Water Cooler and Bottled Water Service*

                9.  *Miscellaneous Other Furniture*

    3.  ES&H

        1.  Electrical and Electronics

        2.  Environmental

        3.  Radiation Safety

        4.  Training

    4.  Transportation to and Installation and Testing at C0

    5.  Control Room Electronics Project Management

        1.  Project Coordination

        2.  Project Reviews

        3.  ES&H Reviews

        4.  Travel

15. **Control, Monitoring and Event Readout (Data Acquisition)
    Software**

    1.  Run and Data Acquisition System Software

        1.  Host Computers and Peripherals

        2.  Run Control

        3.  Data Flow Monitoring

        4.  Error Logging

        5.  Configuration Databases

        6.  Information Services

        7.  Process Management

        8.  Resource Manager

        9.  Partition Manager

        10. Test Manager

        11. Diagnostics

        12. Integrated Graphical User Interface

        13. Online Bookkeeper

    2.  Test Stand Software

        1.  Frameworks

        2.  Operating Systems Licenses

        3.  Training and User Support

    3.  Slow Controls

        1.  Specification

        2.  Hardware - Computers and Networks

        3.  Licenses

        4.  Evaluation and Selection

        5.  Installation

        6.  BTeV interfaces and experiment specific applications

        7.  Training and User Support

    4.  ES&H

        1.  Environmental

        2.  Training

    5.  Testing at C0

    6.  Control, Monitoring & Event Readout Software Project Management

        1.  Project Coordination

        2.  Project Reviews

        3.  ES&H Reviews

        4.  Travel

16. **Algorithm and Other Software and Integration**

    1.  Algorithm and Design Studies

        1.  Charged Particle tracking.

            1.  Pattern Recognition

                1.  Level 1 - Pixel

                2.  Level 2 - Pixel

                3.  Level 2 - Forward Silicon and Straw

                4.  Level 1 - Muon

            2.  Accurate Kalman Fits

            3.  Level 2/3 Refits Fits

            4.  Alignments

        2.  Neutral Clusters

            1.  Resolution.

            2.  Making Probabilities

            3.  Pattern Recognition

        3.  Cerenkov.

            1.  Resolution

            2.  Pattern Recognition

        4.  Vertexing.

            1.  Charged Particle Only

            2.  Charged Particle and Neutrals

        5.  Final State Feasibility Studies

            1.  B-Sector : CKM Angle Beta

                1.  Psi - K0 (to filled in, specific {negotiable!!})

            2.  B-Sector : Lifetime and Mixing

            3.  B-Sector : CKM Angle Alpha

            4.  Charm-Sector

            5.  Others

    2.  System Development, Implementation and Test.

        1.  Simulation.

            1.  BTeV-MCFast

                1.  Implementation

                2.  Support and Documentation

                3.  Geometry Updates

                4.  Training and User Interface

            2.  BTeV-Geant

                1.  Prototyping, \"Small Geant\"

                2.  Implementation and Testing

                3.  Support and Documentation

                4.  Geometry Updates.

                5.  Training and User Interface

            3.  BTeV-Geant4

                1.  Test of Applicability of Geant4

                2.  Prototyping

                3.  Implementation

                4.  Tests, Benchmarking G3-G4

                5.  Support and Documentation

                6.  Geometry Updates.

                7.  Training and User Interface

        2.  Level 1 Trigger.

            1.  Serial, high Level Processor Implementation

                1.  Prototype and Studies

                2.  Implementation

                3.  Bench-Marking on Simulated Data

                4.  Bench-Marking on Real Data.

            2.  Operating Systems for DSPs, FPGAs, Etc.

                1.  Protoyping

                2.  Implementation (hardware-specific)

            3.  Reconstruction Code for DSPs, FPGA, Etc.

                1.  Protoyping

                2.  Timing and Performance, Bench Studies

                3.  Implementation

                4.  Performance Studies, Physics Data

            4.  Diagnostics and Monitoring

                1.  Specification

                2.  Protoyping

                3.  Implementation

                4.  Training and User Interface

        3.  Level 2 Trigger.

            1.  Pixel Tracking and Refit

                1.  Prototype

                2.  Implementation.

            2.  Forward Silicon Hit Matching, Pat. Rec. and Refit

                1.  Prototype

                2.  Implementation.

            3.  Straw Tube Hit Matching Pat. Rec. and Refit

                1.  Prototype

                2.  Implementation.

            4.  Muon

                1.  Prototype

                2.  Implementation.

            5.  Global Vertexing and Selection

                1.  Prototype

                2.  Implementation.

            6.  Global Performance and Checks

                1.  Specifications

                2.  Implementation

            7.  Diagnostics and Monitoring

                1.  Specifications

                2.  Prototype

                3.  Implementation.

                4.  Training and User Interface

        4.  Level 3 Trigger

            1.  Tracking Checks and Refit

                1.  Prototype

                2.  Implementation

            2.  Charged Particle I.D, Cerenkov

                1.  Prototype

                2.  Implementation

            3.  Electrons I.D, Cerenkov + EM Calorimetry

                1.  Prototype

                2.  Implementation

            4.  Muon Refits

                1.  Prototype

                2.  Implementation

            5.  K-Short Reconstruction

                1.  Prototype

                2.  Implementation

            6.  Neutral Cluster Reconstruction

                1.  Prototype

                2.  Implementation

            7.  Final State Filtering

                1.  Implementation

            8.  Global Performance and Checks

            9.  Diagnostics and Monitoring

                1.  Specification

                2.  Prototype

                3.  Implementation

                4.  Training and User Interface

        5.  Charged Particle Aligner.

            1.  Magnetic Field Map

                1.  Measurement Analysis

                2.  Interface to Kalman Fitters

            2.  Level 2 track Selection

                1.  Prototype

                2.  Implementation

            3.  Iterative Refits

                1.  Prototype

                2.  Implementation

            4.  DataBase Interfaces

                1.  To Level 1 Constants

                2.  To Level 2/3

            5.  Diagnostics and Monitoring

                1.  Prototype

                2.  Implementation

                3.  Training and User Interface

        6.  Neutral Calibration.

            1.  Level 3 Cluster/event Selection

                1.  Prototype

                2.  Implementation

            2.  Pulser Data Analysis

                1.  Prototype

                2.  Implementation

            3.  Checks and Adjustments

                1.  Prototype

                2.  Implementation

            4.  Database Interface

                1.  Prototype

                2.  Implementation

            5.  Diagnostics and Monitoring

                1.  Prototype

                2.  Implementation

                3.  Training and User Interface

        7.  Offline Filtering and Reconstruction

            1.  Pattern Recognition Checks

            2.  Tracking Refits

            3.  K0 Refits

            4.  Vertex Refits

            5.  Particle I.D. Checks

            6.  Final State Classification

            7.  Skimming and I/O

            8.  User Interfaces

        8.  Analysis

    3.  Tools

        1.  Compiler, Linkers, Debuggers and Quality Assurance

            1.  Liscenses

            2.  Selection and Migration Plans

            3.  Installation

            4.  User Support

        2.  I/O Sub-Systems

            1.  MCFIO Support

            2.  Evaluation of Other Systems

            3.  Possible Migration

        3.  Databases

            1.  Specification

            2.  Liscenses

            3.  Evaluation and Selection

            4.  Installation

            5.  Physical Design and Capacity Planning

            6.  Logical Design and Schema Implementation

            7.  Administration, Monitoring and Backups

            8.  Training and User Support

        4.  Histogrammers and Data Browsers

            1.  Evaluation of Other Systems

            2.  Possible Migration

        5.  Event Displays

            1.  Specification

            2.  Evaluation and Selection

            3.  Prototyping

            4.  Implementation

            5.  Training and User Support

        6.  Cluster Management

            1.  System Specification and Design

            2.  System Installation and Update

            3.  Configuration Management

            4.  Monitoring and Quality Control

            5.  Partition Management

        7.  Parallel Application Software Control

            1.  Specification.

            2.  Selection.

            3.  BTeV Interfaces for Offline

            4.  BTeV Interfaces for Online

        8.  Batch & Scripts

            1.  Monte-Carlo Production.

            2.  Offline Skimming Production.

        9.  Documentation System and Web Interfaces.

            1.  LaTex, Word, Web Support.

        10. Backups

            1.  Specification.

            2.  Hardware (serial media, disks etc.)

            3.  Licences

            4.  Evaluation and Selection.

            5.  Installation.

            6.  Training

        11. Data Handling

            1.  Storage Management Software

            2.  Data Delivery and Access Software

    4.  Software Code Management.

        1.  Software Management

            1.  Hardware to Support Central Services

            2.  CVS library management.

            3.  Build or \"Make\" Utilities (SRT tools)

            4.  Code & Library Distribution.

            5.  Bug Reporting.

            6.  Documentation Management

            7.  Code Porting to Specific Platforms

            8.  Data Set Management.

            9.  Verification/Validation Utilities

            10. Operational System Support

            11. Procedures

            12. High Availability Support Infrastructure

            13. Service Level Definition and Documentation

            14. System Security Support

    5.  ES&H

        1.  Electrical and Electronics

        2.  Environmental

        3.  Training

    6.  Installation and Testing at C0

    7.  Other Software Project Management

        1.  Project Coordination

        2.  Project Reviews

        3.  ES&H Reviews

        4.  Travel

17. **Test Stands and Test Equipment**

    1.  BTeV-Standard Test Stand Hardware

        1.  Computers

            1.  Standard PCs

            2.  Industrial PCs

            3.  Other Workstations

        2.  Test Adapter Cards

            1.  PCI-Based Interface Cards

                1.  Daughter Cards

            2.  Interlocks Cards

            3.  Expansion Chassis and Interface Cards

        3.  Cables

        4.  Test Stand Setup, Testing and Distribution

    2.  Test Equipment

        1.  Logic Analyzers

            1.  Logic Analyzer Mainframes

            2.  102-Channel Logic Analyzers

                1.  *Termination Adapters and Accessories*

            3.  Digital Oscilloscopes

            4.  Pattern Generators

                1.  *Stimulus and Response Pods and Accessories*

            5.  Monitor

            6.  Color Printers

            7.  Instrument Carts

        2.  Oscilloscopes

            1.  Four-Channel Digital Oscilloscopes

                1.  *Active Probes and Accessories*

                2.  *Optical-to-Electrical Converters*

            2.  Instrument Cart

            3.  Color Printer

        3.  Spectrum Analyzer

        4.  Noise & Common Mode Voltage Generator

        5.  Protocol Checker

        6.  Optical Cable Test Equipment

            1.  Optical Source

            2.  Optical Power Meter

        7.  Signal Generator

        8.  Digital Multimeter

        9.  Bench Power Supplies

            1.  *High Voltage Supply*

            2.  *Low Voltage Supply*

        10. JTAG Circuit Test Software

    3.  1.17.3 Board Testing

        1.  Test Stand Design and Assembly

        2.  Design for Testability Reviews with Designers

        3.  Characterization Testing

            1.  Software Development and Prototyping

            2.  Software Release and Maintenance

        4.  1.17.3.4 Production Functional Testing

            1.  Software Development and Prototyping

            2.  Software Release and Maintenance

    4.  ES&H

        1.  Electrical and Electronics

        2.  Environmental

        3.  Radiation Safety

        4.  Training

    5.  Test Stands and Test Equipment Project Management

        1.  Project Coordination

        2.  Project Reviews

        3.  ES&H Reviews

        4.  Travel

18. **IC Characterization and Production Testing System**

    1.  Semi-Automatic Probe Station

    2.  Probes

        1.  Commercial Multi-Channel Probes

        2.  Special-Function, Real-Time Probes

            1.  Development and Prototypes

            2.  Production

    3.  Test System Equipment and Cables

        1.  HP8110A Hewlett-Packard Pulse Generator

        2.  \(2\) PS2521 TEK Power Supplies

        3.  CPPM Power Supply Rack

        4.  \(2\) DG2020A Pattern Generators

        5.  HP16500 Logic State Analyzer

        6.  GPIB Card (NI AT/TNT) and Cables

        7.  High-Speed Oscilloscope.

    4.  Test System Software

        1.  IC Specification Template Software

        2.  LabView

        3.  Other Test and Analysis Software

    5.  Packaged IC Testing

        1.  Adapter Board

        2.  Test Stand Design and Assembly

        3.  Characterization Testing

            1.  Software Development and Prototyping

            2.  Software Release and Maintenance

        4.  Production Functional Testing

            1.  Software Development and Prototyping

            2.  Software Release and Maintenance

    6.  ES&H

        1.  Electrical and Electronics

        2.  Environmental

        3.  Radiation Safety

        4.  Training

    7.  Transportation to and Installation and Testing

    8.  BTeV-Standard Test Stands Project Management

        1.  Project Coordination

        2.  Project Reviews

        3.  ES&H Reviews

        4.  Travel

19. **System Installation, Integration Testing and Commissioning**

    1.  System Installation

        1.  Detector and Counting Room Cable Trays

        2.  Cable Installation

            1.  On and Near-Detector

            2.  Detector to Counting Room

            3.  Counting Room

        3.  Relay Rack and Subrack Installation, Powering & Cooling

        4.  Other Installation

    2.  Procedure Specifications

        1.  Run Startup & Stop & Partitioning

        2.  Halt/Reset/Run & Error Recovery

    3.  Commission Control, Timing, and Monitoring System (with internal
        accelerator clock)

    4.  Establish Simplest Data Readout Path (download test patterns
        into Level 1 Buffers; readout into computer)

    5.  Integrate Accelerator Clock with BTeV Control/Monitoring and
        Timing System

    6.  Establish Front-End Timing (using simple readout path and low
        luminosity)

        1.  Pixel

        2.  RICH

        3.  EM Calorimeter

        4.  Muon

        5.  Straws

        6.  Strips

    7.  Multiple Front-End Systems -- System Integration without
        Triggers and Event Builder

    8.  Level 1 Trigger Testing

        1.  Pixel Trigger

        2.  Muon Trigger

        3.  Integration and Testing of Pixel Trigger with Global Trigger

        4.  Integration and Testing of Muon Trigger with Global Trigger

    9.  Partial Data Acquisition System Testing -- Level 1 Buffers To
        Level 2/3 Processor Array

    10. Integration Of Front-End Systems and Their Triggers

    11. Full Front-End, Trigger and Data Acquisition System Integration
        Testing and Commissioning

    12. Establish and Test System Startup Procedure, End of Run
        Procedure and Error Handling Procedures

        1.  Induced Errors and System Recovery Testing

            1.  System by System

            2.  Total System

    13. Establish Detector Alignment Procedures (each system and system
        to system)

        1.  Pixel

            1.  Precision Movement Subsystem

        2.  RICH

        3.  EM Calorimeter

        4.  Muon

        5.  Straws

        6.  Strips

    14. Establish Detector Calibration Procedures

        1.  Pixel

        2.  RICH

        3.  EM Calorimeter

        4.  Muon

        5.  Straws

        6.  Strips

    15. ES&H

        1.  Compliance-Testing and Verification

            1.  Electrical and Electronics

                1.  Low-Voltage Interlocks

                2.  High-Voltage Interlocks

                3.  Cooling Interlocks

                4.  Level 2 System ES&H Compliance-Testing and
                    Verification

                5.  Other Systems

            2.  Environmental

                1.  Low-Voltage Interlocks

                2.  High-Voltage Interlocks

                3.  Cooling Interlocks

                4.  Level 2 System ES&H Compliance-Testing and
                    Verification

                5.  Other Systems

            3.  Radiation Safety

                1.  Low-Voltage Interlocks

                2.  High-Voltage Interlocks

                3.  Cooling Interlocks

                4.  Level 2 System ES&H Compliance-Testing and
                    Verification

                5.  Other Systems

        2.  Training

    16. System Installation, Integration Testing and Commissioning
        Project Management

        1.  Project Coordination

        2.  Project Reviews

        3.  ES&H Reviews

        4.  Travel

20. **BTeV Project Management**

    1.  BTeV Project Office

        1.  Preparation and Equipping of Office Space

            1.  Furniture

            2.  Office Equipment (copiers,faxes,phones,etc)

            3.  Desktop PCs and Laptops

            4.  Videoconferencing Equipment

        2.  Salaries and Support for BTeV Project Office staff Including
            Project Manager, Deputy Project Manager, Budget Officer,
            Administrative Assistance, and Clerical Support

            1.  Travel

            2.  Supplies and Services

            3.  Communications

            4.  Software Licenses for Staff (not including project
                management tools, see 1.20.5)

    2.  Support for Project Management Activities of BTeV Physicists not
        Included in Subprojects (this is applies mainly to the
        spokespeople who will be required to carry out various travel
        and liaison activities for the project)

    3.  Support for External Reviews and Consultants

        1.  Travel and Support for External Reviews

        2.  Support for Management Consultants

        3.  Support for Consultants

    4.  Support for Documentation, Reports, Report Preparation, etc.

    5.  Project Management Software Tools

        1.  Licenses for Project Management Tools

        2.  Consultants to Develop, Adapt or Configure Project
            Management Tools

        3.  Training and Support of Project Management Tools

    6.  ES&H

        1.  Electrical and Electronics

        2.  Environmental

        3.  Training

    7.  Oversight of BTeV ES&H

        1.  Mechanical (including gas and cryogens)

        2.  Electrical and Electronics

        3.  Environmental

        4.  Radiation Safety

        5.  Training

**Modifications, Comments and Questions Made By Editor**

######## February 22, 2000 {#february-22-2000 .unnumbered}

1.  General Comments

    1.  WBS elements in blue and italics most probably do not need to be
        such in the BTeV Proposal but only need to be mentioned in the
        WBS Dictionary and/or supporting material

    2.  Red indicates important notes, notes of clarification or
        elements needing clarification and/or expansion

    3.  Please submit your WBS using the Word \'Bullets and Numbering\'
        option

2.  BTeV

    1.  Vertex Magnet and Beam Pipe

        a.  Modifications

            i.  Added ES&H WBS

            ii. Added Vertex Magnet and Beam Pipe Project Management WBS

            iii. Changed to upper case several places

            iv. Changed \'Magnet Installation to \'Magnet Installation
                and Testing at C0\' for consistency across BTeV

        b.  Questions

            i.  Is any \'Test Beam Studies\' WBS elements needed?

            ii. Where are WBS elements for \'Beam Pipe Installation and
                Testing\' at C0?

    2.  Pixel Detector

        a.  Modifications

            i.  Substantial modifications to Front-End Electronics for
                consistency across BTeV and completeness

            ii. Added \'and vacuum\' in two or three places to
                \'radiation\' studies\'

            iii. Combined test hardware and software into \'Hardware and
                 Software Specific To The Development and Testing Of The
                 Pixel System\' section for consistency across BTeV

            iv. To \'ES&H\' and \' Pixel Detector Project Management\'
                for consistency across BTeV

            v.  Changed title \'Integration, Installation and
                Commissioning at C0\' to Installation and Testing at C0.
                Integration (with other WBS Level 2 systems) and
                Commissioning are in WBS 1.19 - System Integration
                Testing and Commissioning

            vi. Added \'Test Beam Detectors\' to \'Test Beam Studies\'
                for consistency across BTeV

            vii. Added WBS element 'ES&H' to 'Test Beam Studies'

        b.  Comments

            i.  Cooling and fluid (leakage, effects of vacuum, etc.)
                tests are significant items and probably need specific
                WBS items; cooling in general is not emphasized
                sufficiently

            ii. Should a Pixel Detector 'spare' be costed? !!!!

    3.  RICH Detector

        a.  Modifications

            i.  Put first section into \'Sensors and Interconnections To
                Front-End Electronics\' form for consistency across BTeV

            ii. Added a 'Evaluation of Commercial Devices' WBS element

            iii. Added cabling to Front-End electronics WBS and \' Other
                 Cabling and Connectors\'

            iv. Added WBS element 'ES&H' to 'Test Beam Studies'

            v.  Changed \'Development\' to \'Development and
                Prototypes\' for consistency across BTeV

            vi. Included \'Safety\' WBS from first section in ES&H WBS
                for consistency across BTeV

            vii. In Front-End Electronics:

                 A.  Changed ASD for consistency across BTeV

                 B.  Expanded FEB Infrastructure; this needs further
                     expansion (what are major components {e.g.,
                     mechanical structures, power, cooling, etc.})

                 C.  Removed \' Front-End Electronics Cables and
                     Connectors\' as it goes in \' Cabling To Front-End
                     Electronics\' now ... for consistency across BTeV
                     ... although I might not now be including such
                     cables as high-voltage cables; all
                     control/monitoring/timing and data cables leaving
                     FEB are in WBS 1.10 (Data Acquisition Electronics
                     and Links).

                 D.  \' Front-End Electronics Test Station\' and
                     \'Safety\' go elsewhere for consistency across BTeV

                 E.  Moved \'FEB Infrastructure\', renamed it \' Front
                     End Electronics Supports\' and put it into
                     \'Mechanical and Other Systems\' for consistency
                     across BTeV

            viii. Moved \'Safety\' out of various sections as it goes
                  into \'ES&H\' for consistency across BTeV

            ix. Made several other minor changes in format, etc. for
                consistency across BTeV including making a \' Mechanical
                and Other Systems\' section and a \' Power, Monitoring
                and Protection\' section; put things in these sections
                and moved/changed \'Other Power\' to \' Power,
                Monitoring and Protection\' section changing \'Other
                Power\' to \'Low Voltage System\'; please check

            x.  Put \' Power, Monitoring and Protection\' before
                \'Mechanical and Other Systems\' for consistency across
                BTeV

            xi. Restructured \'Beam Test\' into \'Test Beam Studies\'
                for consistency across BTeV

            xii. Added a \' Hardware and Software Specific To The
                 Development and Testing Of The RICH System\' WBS
                 element(s) instead of the \' Front-End Electronics Test
                 Station\' WBS element for consistency across BTeV

            xiii. Tried to make \'ES&H\' entries consistent with \'
                  Integration, Installation and Commissioning at C0\'
                  entries and WBS elements above these sections

            xiv. Changed title \'Integration, Installation and
                 Commissioning at C0\' to Installation and Testing at
                 C0. Integration (with other WBS Level 2 systems) and
                 Commissioning are in WBS 1.19 - System Integration
                 Testing and Commissioning.

            xv. Added \'Test Beam Detectors\' to \'Test Beam Studies\'
                for consistency across BTeV

            xvi. Added \'Electronics Cooling and Protection\' or changed
                 \'Electronics Protection\' to \'Electronics Cooling and
                 Protection. Is this elsewhere?

        b.  Comments

            i.  Didn\'t notice much on monitoring and protection; these
                need WBS items in \'Power, Monitoring and Protection\'
                section

        c.  Questions

            i.  Does the \'Pulser System\' WBS belong in another WBS
                item (e.g., Mechanics and Other Systems)?

            ii. Why is the ASD PCB not on the FEB?

            iii. How many types of FEBs? When RICH was to be implemented
                 with MAPMTs, the baseline had 16 and 64-channel FEBs.
                 To substantially reduce FEB and link counts and use
                 cable bandwidth, we proposed larger-channel FEBs (e.g.,
                 256-channel for both 16 and 64-channel MAPMT FEBs.

    4.  EM Calorimeter Detector

        a.  Modifications

            i.  Added sub WBS elements to QIE ICs and 8 to 10-Bit Flash
                ADC ICs for consistency across BTeV

            ii. Put 'Wrapping' and 'Testing' as sub items.

            iii. Added items to Front-End Electronics for consistency
                 across BTeV and completeness

            iv. Moved \'FEB Infrastructure\', renamed it \' Front End
                Electronics Supports\' and put it into \'Mechanical and
                Other Systems\' for consistency across BTeV

            v.  Added WBS element 'ES&H' to 'Test Beam Studies'

            vi. Miscellaneous minor changes for consistency across BTeV
                and completeness

            vii. Changed title \'Integration, Installation and
                 Commissioning at C0\' to Installation and Testing at
                 C0. Integration (with other WBS Level 2 systems) and
                 Commissioning are in WBS 1.19 - System Integration
                 Testing and Commissioning.

            viii. Added \'Test Beam Detectors\' to \'Test Beam Studies\'
                  for consistency across BTeV

            ix. Added \'Electronics Cooling and Protection\' or changed
                \'Electronics Protection\' to \'Electronics Cooling and
                Protection. Is this elsewhere?

        b.  Questions

            i.  Is the \'8 to 10-Bit Flash ADC ICs\' a development or a
                use of commercial ICs?; its WBS was restructured
                assuming the former.

            ii. Shouldn\'t \'Test Beam Studies With Sample Phototubes\'
                be in \'Test Beam Studies\' WBS element?

        c.  Comments

            i.  It would be nice if the FADC could be integrated into
                the QIE IC

            ii. It seems as though other mechanics are not yet included

    5.  Muon Detector

        a.  Modifications

            i.  Added \'Cabling To Front-End Electronics\' and \'Other
                Cabling and Connectors\' to \'Sensors and
                Interconnections To Front-End Electronics\' for
                consistency across BTeV

            ii. Replaced 1.5.2.5 and 1.5.2.6 with expanded versions for
                consistency across BTeV and completeness

            iii. Changed cooling WBS element names slightly

            iv. Added WBS element 'ES&H' to 'Test Beam Studies'

            v.  Modified 1.5.6 slightly for consistency across BTeV

            vi. Changed title \'Integration, Installation and
                Commissioning at C0\' to Installation and Testing at C0.
                Integration (with other WBS Level 2 systems) and
                Commissioning are in WBS 1.19 - System Integration
                Testing and Commissioning.

            vii. Made \'Muon Calorimeter Detector Project Management\'
                 consistent with that across BTeV

            viii. Added \'Test Beam Detectors\' to \'Test Beam Studies\'
                  for consistency across BTeV

            ix. Added \'Electronics Cooling and Protection\' or changed
                \'Electronics Protection\' to \'Electronics Cooling and
                Protection. Is this elsewhere?

    6.  Forward Tracker Straw Detector

    7.  Forward Tracker Silicon Microstrip Detector

        a.  Modifications

            i.  Expanded \'Preamplifier and Programmable Discriminator
                ICs\' for consistency across BTeV with ICs needing
                development

            ii. Expanded \'Data Concentrator ICs\' for consistency
                across BTeV with ICs needing development

            iii. Added WBS element 'ES&H' to 'Test Beam Studies'

            iv. Expanded \'Serializer/Transmitter ICs\', etc. for
                consistency across BTeV and completeness.

            v.  In \'Front-End Electronics\', added \'Silicon Microstrip
                Multi-Chip Modules\' because I saw nothing equivalent to
                that in other front-end systems that puts the ICs, etc.
                together into \'modules\' or \'front-end boards\'.

            vi. Changed \'Development and Prototypes\' to \'Development
                and Prototypes\' several places for consistency across
                BTeV

            vii. Slightly modified 1.7.6 through 1.7.9 for consistency
                 across BTeV

            viii. Changed title \'Integration, Installation and
                  Commissioning at C0\' to Installation and Testing at
                  C0. Integration (with other WBS Level 2 systems) and
                  Commissioning are in WBS 1.19 - System Integration
                  Testing and Commissioning.

            ix. Added \'Electronics Cooling and Protection\' or changed
                \'Electronics Protection\' to \'Electronics Cooling and
                Protection. Is this elsewhere?

        b.  Questions

            i.  Under WBS 1.7.1, does there need to be WBS elements like
                \' Cabling To Front-End Electronics\' and \'Other
                Cabling and Connectors\' as in other front-end systems?

            ii. Can we avoid the development, etc. of a Data
                Concentrator IC for this system by having the system
                read out like being done for the Pixel system? Let\'s
                cost the system now as if there was a Silicon Microstrip
                Data Concentrator IC.

    8.  Luminosity Monitoring System

        a.  Modifications

            i.  Made many as information submitted was not complete

            ii. Added WBS element 'ES&H' to 'Test Beam Studies'

        b.  Comments

            i.  Need to expand this WBS substantially for completeness
                and to make it consistent with other BTeV WBSs

    9.  Level 1 and Global Trigger Systems

        a.  Modifications

            i.  Capitalized title words

            ii. Tried to start to make is more complete and consistent
                with other BTeV WBSs

        b.  Comments

            i.  Need to expand this WBS substantially for completeness
                and to make it consistent with other BTeV WBSs

            ii. Need to do Muon Trigger WBS

    10. Data Acquisition Electronics and Links

        a.  Modifications

            i.  Changed 'Prototype and Development' to 'Development and
                Prototypes'

            ii. Reviewed some minor changes with Mark Bowden

            iii. Added 'Serializer/Transmitter ICs' development, etc.
                 WBS

            iv. Removed Control and Status links as they belong in WBS
                1.13

    11. Level 2/3 Processor Array

        a.  Modifications

            i.  Capitalized some words in headings

        b.  Comments

            i.  Overlap with both Offline and Software WBSs; needs
                review and coordination

    12. Offline Analysis and Simulation Facilities

        a.  Comments

            i.  Check for overlaps with Software and Level 2/3 Processor
                Array

    13. Control/Monitoring and Timing System

        a.  Modifications

            i.  Removed Alarms and Limits chassis

            ii. Added C/M and T IC development for Pixels and Strips

    14. Control Room Electronics and Equipment Infrastructure

        a.  Modifications

            i.  Changed \'Accelerator Interface\' name to \'Accelerator
                Monitoring Interface\' to distinguish it from the timing
                signal interface in WBS 1.13

            ii. Capitalized title words

            iii. Made slight wording and/or format changes for clarity,
                 etc.

    15. System Installation and Miscellaneous Infrastructure

        a.  Entered this Level 2 WBS for the first time

    16. Software

        a.  Modifications

            i.  Made slight changes for clarity, etc.

        b.  Comments

            i.  Missing (or may be missing)

                A.  System software shell for the entire BTeV experiment
                    including data acquisition, control/monitoring,
                    triggers, fast timing, front-ends, etc.

                B.  Software to specifically control, monitor and (if
                    appropriate) readout other Level 2 systems

                C.  Test/development software shell for the entire BTeV
                    experiment

                D.  Software to incorporate/modify then incorporate
                    engineers\' and technicians\' test software into the
                    system software

                E.  Test/development software specific to, for example,
                    a front-end system and written by the front-end
                    people or others goes into the front-end system.

                F.  Etc.

        c.  Questions

            i.  Does any Offline \'shell\' software go into this WBS?

    17. Test Stands and Test Equipment

        a.  Modifications

            i.  Made slight wording and/or format changes for clarity,
                etc.

    18. IC Characterization and Production Testing System

        a.  Entered this Level 2 WBS for the first time

    19. Integration Testing and Commissioning

        a.  Modifications

            i.  Made slight wording and/or format changes for clarity,
                etc.

    20. BTeV Project Management

        a.  Modifications

            i.  Made slight changes for clarity, etc.