in an LGA package, and support DDR3 memory up to DDR3-1600. The memory controller on desktop parts will work with one or 2 DIMMs per channel, which translates to the maximum supported memory size 32 GB. Haswell mobile CPUs will utilize 4+3+2, 4+2+2 and 2+2+2 options. The processors with GT3 GPUs will only be manufactured in a BGA package, which means that it won't be possible to upgrade CPUs in notebooks with GT3 graphics, and it won't be possible to upgrade notebooks with GT1/GT2 graphics to GT3 level. Processors with GT2 GPUs will be made both in BGA and PGA packages. All mobile SKUs will support 1 DDR3/DDR3L DIMM per memory channel, with data rates up to 1600 MHz. Quad-core mobile chips will also support 2 DDR3-1333 DIMMs per channel. The maximum memory size with 1 DIMM and 2 DIMMs per channel will be 16 GB and 32 GB respectively. Ultra Light and Thin (ULT) CPUs, that integrate Lynx Point chipset on the package, will use 2+3+2 and 2+2+1 package types. Combined TDP of integrated CPU cores, GPU and the chipset on these parts is only 15 Watt, therefore it is logical that the number of cores was limited to two. ULT microprocessors will be produced in a BGA package, and work with DDR3L/low power DDR3 memory with data rates up to 1600 MHz. Memory controller will support only one DIMM per memory channel, for that reason less expensive ULT products with single memory channel will be limited to 8